Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on December 12th, 2024
Samsung Electronics Co., Ltd.: 133 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L29/423 (10), H01L23/00 (9), H01L29/06 (9), H01L23/528 (8), H01L29/66 (8) H01L27/11807 (2), G06F8/447 (2), H01L29/78696 (2), H01L29/785 (2), H04W74/0816 (2)
With keywords such as: device, pattern, including, substrate, semiconductor, region, layer, configured, direction, and based in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Seulkee LEE of Suwon-si (KR) for samsung electronics co., ltd., Hwan Chang of Suwon-si (KR) for samsung electronics co., ltd., Kumchul Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47J36/32, A23L5/10, G01J5/00, G01J5/03
CPC Code(s): A47J36/321
Abstract: a cooking apparatus includes: a thermal imaging camera; a display; a memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction to: acquire, using the thermal imaging camera, an image of a cooking space provided in one area of the cooking apparatus, wherein a cooking subject is located in the image of the cooking space, and the image of the cooking space may include at least one area of the cooking space that is divided into a plurality of sub-areas, identify, based on the acquired image, temperatures of each sub-area of the at least one area of the cooking space, and control the display to provide information on a state of a cooking operation of the cooking apparatus to a user based on the identified temperatures of each sub-area of the at least one area of the cooking space.
Inventor(s): Sinae KIM of Suwon-si (KR) for samsung electronics co., ltd., Kihwan KWON of Suwon-si (KR) for samsung electronics co., ltd., Youngho KO of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokki SONG of Suwon-si (KR) for samsung electronics co., ltd., Sewoong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L11/40
CPC Code(s): A47L11/4091
Abstract: provided is a station configured to retrieve a used pad detached from a robot cleaner and supply a new pad to be attached to the robot cleaner, the station including a station body, a pad replacement unit provided at the station body to load the used pad detached from the robot cleaner, a pad storage having a received pad container configured to store the used pad and a pad supply container configured to store the new pad, and a pad transfer unit configured to sequentially press the used pad and the new pad, wherein the pad supply container is arranged above a movement path of the pad transfer unit, and the received pad container is arranged below the movement path of the pad transfer unit.
Inventor(s): Byungjune Choi of Gunpo-si (KR) for samsung electronics co., ltd., Se-Gon Roh of Suwon-si (KR) for samsung electronics co., ltd., Youn Baek Lee of Yongin-si (KR) for samsung electronics co., ltd., Jeonghun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyun Do Choi of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61F2/60, A61F5/01, A61H1/02, A61H3/00
CPC Code(s): A61F2/605
Abstract: a sliding assembly may include a supporting frame having a proximal end and a distal end, a sliding frame partially inserted to the supporting frame, and a supporting member disposed between the supporting frame and the sliding frame to prevent the supporting frame from directly contacting the sliding frame, wherein the sliding frame is configured to move relative to the supporting frame.
Inventor(s): Changlim CHOI of Suwon-si (KR) for samsung electronics co., ltd., Changhoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunjin BAE of Suwon-si (KR) for samsung electronics co., ltd., Siyoul CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A63B71/00, A63B71/06
CPC Code(s): A63B24/0006
Abstract: an electronic device includes: one or more motion sensors; a memory; and at least one processor connected to the memory and the at least one motion sensor and configured to: calculate a vector on the basis of a sensor value received from the one or more motion sensors; identify changes in time of the x-axis angle and the y-axis angle of the vector over a period of time; detect a start time and an end time of a designated movement based the changes in the x-axis angle and the y-axis angle of the vector over the period of time; and produce exercise information based on the start time and the end time.
Inventor(s): Sungmo LEE of Suwon-si (KR) for samsung electronics co., ltd., Junhyun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F33/48, D06F33/40, D06F37/30, D06F103/26, D06F105/46
CPC Code(s): D06F33/48
Abstract: a washing machine includes: a drum configured to be rotatable inside a tub; a motor including a stator and a rotor, and configured to rotate the drum; an inverter circuit connected to the motor; and at least one processor configured to compensate for a q-axis current command value of the motor based on an m-order harmonic component (m is a natural number) and a position of the rotor, and control the inverter circuit to drive the motor based on the compensated q-axis current command value, the m-order harmonic component being filtered by a bandpass filter from a speed error value of the rotor.
20240410105. DRYER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunghyun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Youngjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Myungwon JEON of Suwon-si (KR) for samsung electronics co., ltd., Jaeik CHA of Suwon-si (KR) for samsung electronics co., ltd., Hankyu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/20, D06F105/34
CPC Code(s): D06F58/20
Abstract: a dryer includes: a main body which includes a front panel with an opening, an inlet and a base forming a bottom surface; a drum; and a heat exchanger accessible through the opening. the base includes a bottom portion on which the heat exchanger is seated and a front wall portion vertical to the bottom portion. the base includes a cover configured to open and close the opening, a filter unit, and a ground electrode on the front wall portion. the filter unit includes a fixer member coupleable to the front wall portion such that while the fixer member at a first position the filter unit is prevented from being separated, and while the fixer member is moved to a second position the filter unit is separable from the front wall portion. the fixer member is electrically connected to the ground electrode at the first position.
Inventor(s): Sung HAN of Suwon-si (KR) for samsung electronics co., ltd., Duckjin SUNG of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoon KANG of Suwon-si (KR) for samsung electronics co., ltd., Kwanwoo HONG of Suwon-si (KR) for samsung electronics co., ltd., Minsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunggee HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F04D29/40, F04D29/66
CPC Code(s): F04D29/403
Abstract: a fan module and a range hood including same. the range hood includes a housing having an inlet through which air flows, and a fan module arrangeable within the housing to draw in air through the inlet of the housing, wherein the fan module includes a fan configured to guide the air drawn in, a motor to provide a driving force to rotate the blowing fan, a case arrangeable adjacent to the motor, an anti-vibration member in contact with the motor to prevent vibration of the motor from being transmitted to the case while the motor provides the driving force to the fan and the case is arranged adjacent to the motor, and a fixer positioned between the anti-vibration member and at least one of the case or the motor to prevent movement between the anti-vibration member and at least one of the case or the motor.
20240410591. DRAWER APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyoseon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Byounghoon MOON of Suwon-si (KR) for samsung electronics co., ltd., Jiwon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sunghoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C15/18, F24C15/34
CPC Code(s): F24C15/18
Abstract: a drawer apparatus may include a drawer casing, a drawer configured to be inserted into the drawer casing and to be withdrawn from the drawer casing, the drawer including a drawer body having an internal space to accommodate a cooking material, and a front panel coupled to a front of the drawer body, and a heater in the drawer casing to heat the internal space and the cooking material, wherein the front panel may include a first panel forming a front surface, a second panel behind the first panel, and a connecting member coupled to the first panel and to the second panel, wherein the connecting member contacts the first panel so that the first panel and the connecting member together form a double layer structure between the internal space and the front surface to prevent heat generated by the heater from conducting to the front surface.
Inventor(s): Jun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Seokkyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Taewoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kilsoo SON of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Ohkun CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F11/64, F24F11/65, F24F110/10
CPC Code(s): F24F11/64
Abstract: disclosed is an air conditioning device. the air conditioning device comprises: a communication interface including a circuit; a temperature sensor; a compressor; and at least one processor, comprising processing circuitry, individually and/or collectively, configured to control the operation of the compressor based on a set temperature value set in the air conditioning device, a first temperature value acquired by the temperature sensor, and a second temperature value received from the air sensor device through the communication interface. at least one processor, individually and/or collectively, may be configured to: identify the difference between the first temperature value and the second temperature value, and, based on the identified difference being at least a threshold value, control the operation of the compressor based on the set temperature value and the first temperature value.
Inventor(s): Soodol PARK of Suwon-si (KR) for samsung electronics co., ltd., Sihyeon RYU of Suwon-si (KR) for samsung electronics co., ltd., Duhwa JUNG of Suwon-si (KR) for samsung electronics co., ltd., Taejun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25B41/20, F04B49/025, F04B49/035, F04C28/06, F04C28/26, F25B1/04, F25B31/02, F25B41/40, F25B49/02
CPC Code(s): F25B41/20
Abstract: a refrigeration cycle device includes a compressor. the compressor includes a casing, a driving unit disposed in the casing, a compression unit coupled to the driving unit and configured to compress a refrigerant, and a valve configured to control a flow of the refrigerant in the casing. the valve includes a valve chamber including a main flow path in which the refrigerant is to flow, the main flow path including a refrigerant inlet and a refrigerant outlet. the valve also includes a floating body disposed in the valve chamber to open or close the main flow path, and a bypass flow path formed in the valve chamber and which is to be opened or closed by the floating body. when the driving unit is stopped and the bypass flow path is opened by the floating body, the refrigerant is to be detoured to the bypass flow path.
20240410641. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Inwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Byoungmok KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonseok YANG of Suwon-si (KR) for samsung electronics co., ltd., Seongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Chomin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02, E05F1/12, F25D23/06
CPC Code(s): F25D23/028
Abstract: a refrigerator including a main body with a storage room inside; a door to open and close the storage room; a lever device on the door and including a case, a rotatable lever coupled to the case, and a spring inside the case; a cam on the main body and including a cam face with first and second contact surfaces with an inflection point therebetween. while the door is being rotated to close the storage room, an end of the lever is moved along the first contact surface and the lever is rotated in a first direction compressing the spring, the end of the lever then contacts the inflection point, and the end of the lever is then moved along the second contact surface and the lever is rotated in a second direction while an accumulated elastic force in the spring is transmitted to the door in the closing direction.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd., Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S5/02
CPC Code(s): G01S5/0236
Abstract: the present disclosure relates to a communication technique for converging iot technology with a 5g communication system for supporting a higher data transmission rate beyond a 4g system, and a system therefor. the present disclosure may be applied to an intelligent service (for example, a smart home, a smart building, a smart city, a smart car or connected car, health care, digital education, retail business, a security and safety-related service, etc.) on the basis of 5g communication technology and iot-related technology. the present disclosure discloses a method and a device, in which, in a wireless communication system, when a location server provides assistance information for measuring location information to a reference signal target terminal which has been set by the location server, the assistance information is provided by having specific time and region information linked thereto, and the terminal obtains the location information by measuring using the assistance information.
Inventor(s): Dongjae SHIN of Seoul (KR) for samsung electronics co., ltd., Hyunilo Byun of Seongnam-si (KR) for samsung electronics co., ltd., Changgyun Shin of Suwon-si (KR) for samsung electronics co., ltd., Bongyong Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S17/42, G01S7/4865, G01S17/26, G01S17/931
CPC Code(s): G01S17/42
Abstract: a light detection and ranging (lidar) apparatus capable of extracting speed information and distance information of objects in front thereof is provided. the lidar apparatus includes: a continuous wave light source configured to generate continuous wave light; a beam steering device configured to emit the continuous wave light to an object for a first time and stop emitting the continuous wave light to the object for a second time; a receiver configured to receive the continuous wave light that is reflected from the object to form a reception signal; and a signal processor configured to obtain distance information and speed information about the object based on the reception signal.
Inventor(s): Bogeun Cho of Suwon-si (KR) for samsung electronics co., ltd., Changdon Kee of Seoul (KR) for samsung electronics co., ltd., Jongheon Kim of Seoul (KR) for samsung electronics co., ltd., Bugyeom Kim of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G01S19/23, G01S19/07, H04B17/21
CPC Code(s): G01S19/235
Abstract: a method of calibrating a global navigation satellite system (gnss) antenna includes obtaining gnss measurement data corresponding to a plurality of directions that correspond to a plurality of respective postures of the electronic device, generating integration data by combining the gnss measurement data corresponding to the plurality of directions, and performing calibration of the gnss antenna based on the integration data.
Inventor(s): Seokho YUN of Seoul (KR) for samsung electronics co., ltd., Sookyoung Roh of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/10, G02B27/12, H01L27/146, H04N9/01, H04N25/13
CPC Code(s): G02B27/1013
Abstract: provided is an image sensor including a sensor substrate including a first pixel configured to sense light of a first wavelength, and a second pixel configured to sense light of a second wavelength, and a color separating lens array configured to concentrate the light of the first wavelength on the first pixel, and the light of the second wavelength on the second pixel, the color separating lens array including a first pixel-corresponding area corresponding to the first pixel, and a second pixel-corresponding area corresponding to the second pixel, wherein a first phase difference between the light of the first wavelength that has traveled through a center of the first pixel-corresponding area and a center of the second pixel-corresponding area is different than a second phase difference between the light of the second wavelength that has traveled through the center of the first pixel-corresponding area and the center of the second pixel-corresponding area.
Inventor(s): Yunhee KIM of Seoul (KR) for samsung electronics co., ltd., Hwi KIM of Sejong-Si (KR) for samsung electronics co., ltd., Sehwan NA of Sejong-si (KR) for samsung electronics co., ltd., Hoon SONG of Yongin-si (KR) for samsung electronics co., ltd., Hongseok LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/13363, G02B27/01, G02F1/1335, G02F1/1337, G02F1/1343, G02F1/1368, G02F1/139, G03H1/22
CPC Code(s): G02F1/133633
Abstract: a complex light modulator including a first polarization plate, a second polarization plate provided, an amplitude modulator provided between the first polarization plate and the second polarization plate, a phase modulator provided between the amplitude modulator and the second polarization plate, and color filters provided between the amplitude modulator and the phase modulator.
Inventor(s): Sung Gap Im of Daejeon (KR) for samsung electronics co., ltd., Seonkyu Shin of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon Ahn of Suwon-si (KR) for samsung electronics co., ltd., Hanhum Park of Suwon-si (KR) for samsung electronics co., ltd., Minkyung Cho of Suwon-si (KR) for samsung electronics co., ltd., Chungryeol Lee of Daejeon (KR) for samsung electronics co., ltd., Seungmin Lee of Daejeon (KR) for samsung electronics co., ltd., Changhyeon Lee of Daejeon (KR) for samsung electronics co., ltd., Sukwon Jang of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/11, G03F7/031, G03F7/16, H01L21/027, H01L21/308
CPC Code(s): G03F7/11
Abstract: a photolithograph method is provided. the photolithograph method may include forming a photoresist pattern on a substrate and conformally forming a liner layer on the photoresist pattern, wherein the forming of the liner layer includes a deposition process of reacting an initiator and a monomer with each other, the monomer includes multiple bonds between carbon atoms, the initiator includes a material that forms a radical by thermal decomposition, a copolymer is formed by an initiating reaction between the radical and the monomer, and the liner layer includes the copolymer.
Inventor(s): Dae Geun YOON of Suwon-si (KR) for samsung electronics co., ltd., Sung Hyup Kim of Suwon-si (KR) for samsung electronics co., ltd., In Jae Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00, H01L21/67, H01L21/68, H01L21/683
CPC Code(s): G03F7/70933
Abstract: a semiconductor manufacturing apparatus includes a wafer stage, a wafer table including main body supported by the wafer stage and a protrusion protruding from a sidewall of the main body in a first direction, a position module on an upper surface of the wafer table and configured to move in the first direction and a second direction intersecting the first direction, an electrostatic chuck on an upper surface of the position module, a first cable connected to the position module, the first cable extending in the first direction and configured to move the position module in the first direction, a second cable between a bottom surface of the protrusion and a lower wall of the wafer stage, the second cable extending in the second direction and configured to move the position module in the second direction, and a cable connecting member connecting the first cable and the second cable.
Inventor(s): Hyunseok NAM of Suwon-si (KR) for samsung electronics co., ltd., Daehan YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05F1/575, G05F1/571, G05F1/62
CPC Code(s): G05F1/575
Abstract: a power management integrated circuit and a method of operating the power management integrated circuit are disclosed. the power management integrated includes an upper regulator circuit that receives a system voltage as an input and outputs a first output voltage; a lower regulator circuit having the first output voltage as an input; and a kelvin switch circuit connected between the upper regulator circuit and the lower regulator circuit. the kelvin switch circuit includes a plurality of switches that connect any one of a plurality of upper regulators included in the upper regulator circuit to any one of a plurality of lower regulators included in the lower regulator circuit.
Inventor(s): Hyuntaek WOO of Suwon-si (KR) for samsung electronics co., ltd., Jinmo KANG of Suwon-si (KR) for samsung electronics co., ltd., Beomsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Gunhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Daiwoong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/04886, G06T7/70, G06V40/10
CPC Code(s): G06F3/011
Abstract: an electronic device that is an augmented reality (ar) device is provided. the electronic device includes sensor circuitry configured to recognize a user's finger. memory storing one or more computer programs, and one or more processors communicatively coupled to the sensor circuitry and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to, after a result of recognizing the user's finger is received from the sensor circuitry, determine whether there is accuracy correction data of coordinates of the user's finger, when there is the accuracy correction data of the coordinates of the user's finger, correct an accuracy of the coordinates of the user's finger, when there is no accuracy correction data of the coordinates of the user's finger, recognize the user's finger in an image obtained by the sensor circuitry and calculate the coordinates of the user's finger in the ar environment based on data of the user's finger, and correct the coordinates of the user's finger in the ar environment.
Inventor(s): Heekyung MOON of Suwon-si (KR) for samsung electronics co., ltd., Haeree NA of Suwon-si (KR) for samsung electronics co., ltd., Wanje PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd., Junhee CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0481, G06F9/451
CPC Code(s): G06F3/0481
Abstract: an electronic device is provided. the electronic device includes a communication circuit, a display, memory storing one or more computer programs, one or more processors communicatively coupled to the communication circuit, the display, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to display, in a task bar area of the display, a row of a first set of objects indicating a plurality of applications executable by the electronic device, detect, through the communication circuit, an external electronic device in proximity to the electronic device, based on detecting the external electronic device, connect with the external electronic device through communication, identify an application which is executable by the external electronic device, display, in the task bar area of the display, a second object indicating the application which is executable by the external electronic device, receive an input relating to the second object, and based on the input, transmit information related to the application corresponding to the second object to the external electronic device through the communication circuit.
Inventor(s): Junpyo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482, G06F3/04845, G09G3/22
CPC Code(s): G06F3/0482
Abstract: an electronic apparatus including a display; a memory configured to store at least one instruction; and at least one processor connected to the display and the memory, and configured to execute the at least one instruction to: control the display to display a user interface (ui) screen including a plurality of graphical user interface (gui) items and a focus indicator positioned on a focused gui item from among the plurality of gui items; control the display to provide ui feedback on the focus indicator based on a user input to the ui screen being not identified for greater than or equal to a critical time period; and control the display to stepwise change the ui feedback on the focus indicator as a time in which the user input is not identified continues
Inventor(s): Jooyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Moonsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Jihyung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0487, G06F1/16
CPC Code(s): G06F3/0487
Abstract: disclosed are an electronic device for controlling attributes of one-handed mode screen on the basis of a grip shape and a method for controlling same. an electronic device according to an embodiment of the present document may be configured to display, on a flexible display, a one-handed mode screen which is reduced and displayed according to a predetermined ratio so as to correspond to a first screen, detect, while the one-handed mode screen is displayed, that a first housing is moved, and determine, on the basis of the detection of the movement of the first housing, the direction of expansion of the one-handed mode screen depending on whether a grip of a portion of a user's body on the top portion of the first housing is sensed by a first grip sensor, among grip sensors, which is disposed on the edge of the first housing.
Inventor(s): Anand SUBRAMANIAN of San Jose CA (US) for samsung electronics co., ltd., Oscar PREM PINTO of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F15/173
CPC Code(s): G06F3/0611
Abstract: a system is disclosed. the system may include a computer system, which may include a processor that may execute instructions of an application that accesses an object using an object command, and a memory storing the instructions of the application. the computer system may also include a conversion module to convert the object command to a key-value (kv) command. finally, the system may include a storage device storing data for the object and processing the object using the kv command.
Inventor(s): Jongcheol Kim of Suwon-si (KR) for samsung electronics co., ltd., Kiheung Kim of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Oh of Suwon-si (KR) for samsung electronics co., ltd., Kyungho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0632
Abstract: a semiconductor memory device includes a memory cell array, a row hammer management circuit and a refresh control circuit. the row hammer management circuit automatically stores random count data in count cells of each of a plurality of memory cell rows during a power-up sequence of the semiconductor memory device and determines counted values by counting a number of times of access associated with each of the plurality of memory cell rows in response to an active command from an external memory controller and stores the counted values in the count cells of each of the plurality of memory cell rows as count data. the refresh control circuit receives a hammer address and performs a hammer refresh operation on one or more of the plurality of memory cell rows that are physically adjacent to a memory cell row that corresponds to the hammer address.
Inventor(s): Zongwang Li of Dublin CA (US) for samsung electronics co., ltd., Tong Zhang of Mountain View CA (US) for samsung electronics co., ltd., Rekha Pitchumani of Oak Hill VA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: provided is a method for data storage, the method including receiving a first request at a storage device, the first request being associated with a first protocol that is a memory protocol, converting address information associated with the first request to logical block address (lba) information, determining, by the storage device, a first group of contiguous physical block addresses associated with the first request and associated with a first application, based on a data placement configuration of the storage device, and performing a first memory operation at the first group, based on the first request.
Inventor(s): Sungjae BAE of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jamin GOO of Suwon-si (KR) for samsung electronics co., ltd., Hyelin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hanseung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jinhwan HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F3/0485
CPC Code(s): G06F3/14
Abstract: an electronic device is provided. the electronic device includes a touch display, memory storing one or more computer programs, and one or more processors communicatively coupled to the touch display and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to display, in a first area in the touch display, a first image corresponding to the first thumbnail image corresponding to a first object among a plurality of objects, in response to a first user input to the first thumbnail image, display, in a second area in the touch display, a plurality of thumbnail images corresponding to the first object, in response to a second user input to the first thumbnail image, and display a second image corresponding to the second object among the plurality of objects at a position where the first image of the first area is displayed and continuously display the plurality of thumbnail images corresponding to the first object in the second area, in response to a third user input to the second thumbnail image.
Inventor(s): Penghui WEI of Xi’an (CN) for samsung electronics co., ltd., Gang SUN of Xi’an (CN) for samsung electronics co., ltd., Jiao WU of Xi’an (CN) for samsung electronics co., ltd., Hyeonuk SIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/523
CPC Code(s): G06F7/523
Abstract: a precision allocation method and device based on a neural network processor are provided. the precision allocation method includes allocating a weight of a neural network to a multiplier column of a neural network processor, determining a lower tolerance for the multiplier column, and selecting a first data type for the multiplier column from a plurality of data types based on the lower tolerance, wherein each of the plurality of data types corresponds to a different precision level, and performing, by the neural network processor, a multiplication operation based on the weight and the first data type.
Inventor(s): Bongjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Gyeongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hanwoong JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F8/41, G06F11/30
CPC Code(s): G06F8/447
Abstract: an operating method of an electronic device includes: generating, based on a hardware representation of a target device, a mapping by mapping hardware components represented in the hardware representation of the target device to one or more hardware-component traits and to one or more drivers; and generating, based on the hardware representation, topology information representing a connection relationship and dependency between the hardware components of the target device represented in the hardware representation, wherein the hardware representation includes representations of the hardware components tagged with the one or more hardware-component traits and representations of the one or more drivers and a hierarchical structure between the hardware components.
Inventor(s): Gyeongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Bongjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hanwoong JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F8/41
CPC Code(s): G06F8/447
Abstract: an electronic device includes a deep learning compiler configured to receive a hardware representation corresponding to a target system comprising a hierarchical structure, extract a plurality of hierarchies from the target system based on the received hardware representation, and perform iterative compilation on the plurality of extracted hierarchies.
Inventor(s): Anirban SAHA of Bangalore (IN) for samsung electronics co., ltd., Surendra SINGH of Bangalore (IN) for samsung electronics co., ltd., Tushar VRIND of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06F9/30, G06F9/38, G06F9/46
CPC Code(s): G06F9/30047
Abstract: disclosed herein is a method for providing a fair access to a spinlock to one or more cores in a multicore system. the method includes setting, a spinlock variable by the first core of the one or more cores. the setting of the spinlock variable corresponds to changing a cache state of the spinlock variable in a cache of the first core to modified. further, the method includes setting a secondary variable by the second core of the one or more cores. the setting of the secondary variable corresponds to changing a cache state of the secondary variable in a cache of the second core to modified. furthermore, the method includes releasing, by the first core, the spinlock after performing one or more operations on the critical section of data. furthermore, the method includes updating, by the first core, the invalid secondary variable.
Inventor(s): Jae-Eon JO of Suwon-si (KR) for samsung electronics co., ltd., Rohyoung MYUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/38, G06F9/50
CPC Code(s): G06F9/3885
Abstract: a process-implemented method includes: based on obtaining a job description on an application, determining a wall clock time of the application according to processes of a corresponding candidate count for each of a plurality of candidate counts; determining parallelization efficiency for each of the candidate counts based on the determined wall clock time and a wall clock time of the application according to a single process; and executing the application with processes of a target count selected based on the determined parallelization efficiency among the plurality of candidate counts.
Inventor(s): Jinkyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/48
CPC Code(s): G06F9/4887
Abstract: an electronic device includes: one or more first processors configured to: determine features of a plurality of nodes corresponding to a plurality of tasks comprised in a task set, based on a period and an execution time of each of the plurality of tasks; determine one or more edges between the plurality of nodes corresponding to a relationship between the plurality of tasks; and generate a graph corresponding to the task set based on the features of the plurality of nodes and the one or more edges between the plurality of nodes, wherein the plurality of tasks is executed according to a deadline set for each of the plurality of tasks in one or more second processors to which the plurality of tasks is assigned.
Inventor(s): Fengtao XIE of Xi'an (CN) for samsung electronics co., ltd., Tian LIU of Xi'an (CN) for samsung electronics co., ltd., Yueyang LI of Xi'an (CN) for samsung electronics co., ltd., Biao XING of Xi'an (CN) for samsung electronics co., ltd., Byungwoo BANG of Suwon-si (KR) for samsung electronics co., ltd., Junyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F11/14
CPC Code(s): G06F9/5016
Abstract: a device for managing a virtual memory is disclosed. the device includes: a host processor configured to, in response to a memory request from an accelerator, allocate to the accelerator, from among virtual address spaces, a virtual address of first virtual address subspaces reserved for the accelerator; and a host processor allocation device configured to, in response to a memory request from a host processor, allocate to the host processor, from among the virtual address spaces, a virtual address of second virtual address subspaces that are exclusive of the first virtual address subspaces.
20240411599. CPU TIGHT-COUPLED ACCELERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Zhi-Gang Liu of Westford MA (US) for samsung electronics co., ltd., Jun Woo Jang of Santa Clara CA (US) for samsung electronics co., ltd., Sehwan Lee of Seongnam-si (KR) for samsung electronics co., ltd., Dongkyun Kim of Fremont CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F9/48
CPC Code(s): G06F9/5027
Abstract: an integrated circuit includes: a central processing unit (cpu) core; an accelerator; and an acceleration instruction queue connected to the cpu core and the accelerator. the cpu core is to: fetch and decode one or more instructions from among an instruction sequence in a programmed order; determine an instruction from among the one or more instructions containing an acceleration workload encoded therein; and queue the instruction containing the acceleration workload encoded therein in the acceleration instruction queue.
Inventor(s): Kyungkeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Bumjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/07
CPC Code(s): G06F11/0793
Abstract: a method of operating an electronic device is provided. the electronic device includes a host device and a first storage device. the host device includes a processor and a baseboard management controller and the first storage device includes a first storage controller and a first micro controller. the method includes: performing a first monitoring operation to obtain first status information, by a baseboard management controller; determining whether a first abnormal situation occurs, based on the first status information, by the baseboard management controller; providing a first warning message to a first micro controller through a first communication interface based on determining that the first abnormal situation occurs, by the baseboard management controller, wherein the first communication interface is a direct communication interface between the baseboard management controller and the first micro controller; and performing a first preventive action based on the first warning message, by the first micro controller.
Inventor(s): DONGHO LEE of Suwon-si (KR) for samsung electronics co., ltd., SEWOONG LEE of Suwon-si (KR) for samsung electronics co., ltd., YOUN-SOO CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F11/07
CPC Code(s): G06F11/1016
Abstract: a storage device including: a flash memory including a selected word line and an adjacent word line adjacent to the selected word line; and a memory controller configured to provide a select read voltage to the selected word line and a pass voltage to the adjacent word line during a read operation, the pass voltage being higher than the select read voltage, and wherein the memory controller is further configured to determine whether the selected word line is a hot spot read word line based on a deterioration level of the adjacent word line, and perform a word line reclaim operation for the adjacent word line when the selected word line is the hot spot read word line.
Inventor(s): Nirjhar Mukherjee of Pittsburgh PA (US) for samsung electronics co., ltd., Yangwook Kang of San Jose CA (US) for samsung electronics co., ltd., Changho Choi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/34, G06F11/30
CPC Code(s): G06F11/3419
Abstract: systems and methods for determining performance of a computation storage device are disclosed. a program that is configured to be executed by a computational storage device may be identified. an action may be performed with respect to the program, and a first performance value may be computed based on performing the action with respect to the program. data may be retrieved from a non-volatile storage medium, and a second performance value may be computed based on retrieving the data from the non-volatile storage medium. a total performance of the computational storage device may be computed based on the first performance value and the second performance value.
Inventor(s): Matthew Bryson of Los Gatos CA (US) for samsung electronics co., ltd., Naga Sanjana Bikonda of San Jose CA (US) for samsung electronics co., ltd., Wenjie Liu of San Jose CA (US) for samsung electronics co., ltd., Vishwanath Maram of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/02
Abstract: systems and methods for reprovisioning a storage device are disclosed. the storage device comprises a storage medium having a first storage capacity and a second storage capacity; and a processor coupled to the storage medium. the processor may be configured to identify a trigger condition. based on identifying the trigger condition, the processor may be configured to: identify the first storage capacity and the second storage capacity; identify a first amount; modify the first storage capacity based on the first amount; and modify the second storage capacity based on the first amount.
Inventor(s): Janghyuk AN of Suwon-si (KR) for samsung electronics co., ltd., Yong In LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F12/1009
CPC Code(s): G06F12/023
Abstract: a compute express link (cxl) memory device includes: memory cell groups configured to store data; one or more sensors configured to measure degradation factors of the memory cell groups; and a control component configured to: receive a memory allocation request from a host device connected to the cxl memory device using cxl; and perform memory allocation of the memory cell groups for the host device based on degradation states of the memory cell groups according to the degradation factors of the memory cell groups.
Inventor(s): Jang Dae KIM of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/10
CPC Code(s): G06F12/10
Abstract: a memory device includes a first address mapper and a first memory macro connected to the first address mapper. the first address mapper is configured to determine if an input address falls within a first address range mapped to the first memory macro, in response to determining that the input address falls within the first address range mapped to the first memory macro, access the first memory macro with an address on an address bus of the first memory macro mapped from the input address, and in response to determining that the input address does not fall within the first address range mapped to the first memory macro, prevent access to the first memory macro and set the address bus of the first memory macro to a value that depends on whether the input address is lower or higher than the first address range.
Inventor(s): Chanho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/33, G06F30/327
CPC Code(s): G06F30/33
Abstract: a method of manufacturing a semiconductor device includes generating a target check code by performing target code generation computation on a target rom code; generating first netlist data and first layout data of a semiconductor device including a mask rom storing the target rom code; inserting the target check code into the first netlist data; performing layout-versus-schematic (lvs) verification of the first netlist data and the first layout data, resulting in verified first netlist data; generating a final check code by performing the target code generation computation on a final rom code of the mask rom; determining whether the target check code stored in the first netlist data for which the lvs verification has been completed matches the final check code; and performing a mask tape-out operation (mto) of the first layout data when the target check code matches the final check code.
Inventor(s): Chansol HWANG of Suwon-si (KR) for samsung electronics co., ltd., Wonseop SONG of Suwon-si (KR) for samsung electronics co., ltd., Dongwon JANG of Suwon-si (KR) for samsung electronics co., ltd., Young Hun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Dokwan OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/04, G06N3/084
CPC Code(s): G06N3/04
Abstract: a binary neural network apparatus including a binarized last layer is provided. according to an embodiment of the present disclosure, the binary neural network apparatus includes: a binary neural network including a first layer, one or more second layers, and a third layer, wherein the one or more second layers are provided between the first layer and the third layer, and the third layer has binary input and binary weights and is configured to output a binarized bit sequence; and a non-binary converter configured to convert the binarized bit sequence into non-binary data and output the non-binary data.
Inventor(s): Meejeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jihun OH of Suwon-si (KR) for samsung electronics co., ltd., Youngrae CHO of Suwon-si (KR) for samsung electronics co., ltd., Jonghun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0495, G06N3/0464
CPC Code(s): G06N3/0495
Abstract: a data processing method for neural network quantization, includes: obtaining a quantized weight by quantizing a weight of a neural network; obtaining a quantization error that is a difference between the weight and the quantized weight; obtaining input data with respect to the neural network; obtaining a first convolution result by performing convolution on the quantized weight and the input data; obtaining a second convolution result by performing convolution on the quantization error and the input data; obtaining a scaled second convolution result by scaling the second convolution result based on bit shifting; and obtaining output data by using the first convolution result and the scaled second convolution result.
Inventor(s): Mengting HE of Suwon-si (KR) for samsung electronics co., ltd., Tao ZHANG of Suwon-si (KR) for samsung electronics co., ltd., Bo WEI of Suwon-si (KR) for samsung electronics co., ltd., Jing LUO of Suwon-si (KR) for samsung electronics co., ltd., Xiaoyu HUANG of Suwon-si (KR) for samsung electronics co., ltd., Mengfei TONG of Suwon-si (KR) for samsung electronics co., ltd., Feng ZHU of Suwon-si (KR) for samsung electronics co., ltd., Hojae LEE of Suwon-si (KR) for samsung electronics co., ltd., Lihao LUO of Suwon-si (KR) for samsung electronics co., ltd., Yifei YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06Q10/0631, G06Q50/04
CPC Code(s): G06Q10/06316
Abstract: a flexible job shop scheduling method includes: obtaining a shop scheduling state including at least one of a sequential order dependency relationship between job tasks being processed, a sequential order dependency relationship between operation steps in each job task of the job tasks, a processing/being processed relationship between the job tasks and machines, or mutual constraint relationships between the machines; representing the shop scheduling state as a state hypergraph; extracting a hypergraph-based job feature from the state hypergraph using a hypergraph neural network; and determining an action configured to change the shop scheduling state, wherein the action is determined according to the hypergraph-based job feature using a policy network.
Inventor(s): Hyunseung LEE of Suwon-si (KR) for samsung electronics co., ltd., Donghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngsu MOON of Suwon-si (KR) for samsung electronics co., ltd., Seungho PARK of Suwon-si (KR) for samsung electronics co., ltd., Younghoon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/4046, G06F18/21, G06N3/045, G06N3/08
CPC Code(s): G06T3/4046
Abstract: an electronic apparatus is disclosed. the electronic apparatus includes a memory configured to store a plurality of neural network models, and a processor connected to the memory and control the electronic apparatus in which the processor is configured to obtain a weight map based on an object area included in an input image, and obtain a plurality of images by inputting the input image to each of the plurality of neural network models, and obtain an output image by weighting the plurality of images based on the weight map, and each of the plurality of neural network models is a model trained to upscale an image.
Inventor(s): Mengmeng BAI of Beijing (CN) for samsung electronics co., ltd., Huiling Chang of Beijing (CN) for samsung electronics co., ltd., Zhuoxin Gan of Beijing (CN) for samsung electronics co., ltd., Jaekeun Na of Suwon-si (KR) for samsung electronics co., ltd., Changwei Wang of Beijing (CN) for samsung electronics co., ltd., Li Zuo of Beijing (CN) for samsung electronics co., ltd., Wei Wen of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T5/50, G06T7/73, G06V10/74
CPC Code(s): G06T5/60
Abstract: a method performed by an electronic device, includes acquiring a first image comprising at least a first region and a second region and a target object to be moved in the first image from the second region to the first region; and performing target object removal processing on the first image using a first artificial intelligence (ai) network based on guidance information related to at least one of first region and the second region, wherein the second region is a region of the target object in the first image in which the target object is located prior to the removal processing.
Inventor(s): Zhong Li of Aliso Viejo CA (US) for samsung electronics co., ltd., Yoon kyung Kim of Lake Forest CA (US) for samsung electronics co., ltd., Hunsop Hong of Irvine CA (US) for samsung electronics co., ltd., Seongnam Oh of Irvine CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06V30/14, G06V30/146, G06V30/148, G06V30/18
CPC Code(s): G06T5/73
Abstract: one embodiment provides a method comprising receiving content for presentation on a display, and obtaining a plurality of image patches from the content. each image patch is segmented from a bottom and horizontal-center portion of a sub-sampled grayscale image of a frame of the content. the method further comprises applying a searching algorithm to the plurality of image patches to detect a region of interest of moving text in the content. the searching algorithm utilizes a first set of features and a second set of features to detect the region of interest with respect to a vertical axis and a horizontal axis of the display, respectively. the method further comprises correcting one or more visual artifacts in the region of interest, where the one or more visual artifacts include broken text.
20240412350. OPTICAL METROLOGY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minsu Jo of Suwon-si (KR) for samsung electronics co., ltd., Hankyoul Moon of Suwon-si (KR) for samsung electronics co., ltd., Gawoon Bang of Suwon-si (KR) for samsung electronics co., ltd., Woohyeon So of Suwon-si (KR) for samsung electronics co., ltd., Jongsun An of Suwon-si (KR) for samsung electronics co., ltd., Jooyoun Kang of Suwon-si (KR) for samsung electronics co., ltd., Kwangsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Karam Lee of Suwon-si (KR) for samsung electronics co., ltd., Kwangsung Lee of Suwon-si (KR) for samsung electronics co., ltd., Sewon Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T5/50, G06T5/60, G06T5/80, G06T7/586, G06V10/143, G06V10/60, G06V10/77, G06V10/82
CPC Code(s): G06T7/001
Abstract: an optical metrology device includes a lighting unit configured to simultaneously illuminate first illumination light at a first angle of incidence having a difference more than a critical angle from a measurement angle, and second illumination light having a wavelength, different from a wavelength of the first illumination light, at a second angle of incidence having a difference of equal to or less than the critical angle from the measurement angle, onto a surface of a substrate; an optical system configured to collect reflected light from the surface of the substrate according to the first illumination light and the second illumination light; and a multichannel camera configured to generate an original image in which a dark field image and a bright field image of the surface of the substrate are integrated, based on the reflected light collected by the optical system.
Inventor(s): Seunghoon JEE of Suwon-si (KR) for samsung electronics co., ltd., Young Hun Sung of Suwon-si (KR) for samsung electronics co., ltd., Dokwan Oh of Suwon-si (KR) for samsung electronics co., ltd., Paul Oh of Suwon-si (KR) for samsung electronics co., ltd., Junhee Lee of Suwon-si (KR) for samsung electronics co., ltd., Dongwon Jang of Suwon-si (KR) for samsung electronics co., ltd., Chansol Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/246, G06T7/70
CPC Code(s): G06T7/246
Abstract: an image processing apparatus for performing motion estimation is provided. the image processing apparatus includes at least one processor configured to implement: a position estimation module configured to estimate an initial search position by providing a first frame and a second frame of a video as input to a neural network that is trained to output the initial search position; and a motion estimation module configured to perform motion estimation based on the initial search position.
Inventor(s): Junghee Cho of Suwon-si (KR) for samsung electronics co., ltd., Yunje Cho of Suwon-si (KR) for samsung electronics co., ltd., Kwangrak Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonghyeok Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/73, G06T7/00, G06T7/246, G06T7/60, H01J37/09, H01J37/10, H01J37/153, H01J37/22, H01L21/68
CPC Code(s): G06T7/73
Abstract: a semiconductor manufacturing device includes an electron beam source emitting; a plurality of condenser lenses disposed between a stage on which an object including structures is seated and the electron beam source; an objective lens disposed between the plurality of condenser lenses and the stage; an aperture disposed between the plurality of condenser lenses; and a controller configured to acquire a plurality of original images according to a working distance between the objective lens and the object, acquire a pattern image indicating the structures from the plurality of original images, a plurality of kernel images indicating distribution of an electron beam on the object, and a plurality of position vectors indicating a relative position of the structures in the plurality of kernel images, and adjust a position of the aperture based on a motion vector indicating movement of the plurality of position vectors according to the working distance.
Inventor(s): Sanghun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungoh KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Donghwan SEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Byeongyong AHN of Gyeonggi-do (KR) for samsung electronics co., ltd., Dasom LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06T17/05, G06F3/01, G06F3/14, G06T7/50, G06T7/70, G06V10/25
CPC Code(s): G06T17/05
Abstract: an electronic device and method are disclosed. the electronic device includes a first and second camera, display, memory and processor. the processor implements the method, including acquiring image data of an external environment via the first camera, detecting a plurality of objects included in the image data, identifying a first object corresponding to the detected gaze among the detected plurality of objects, configuring a first precision for spatial mapping of the identified first object and a second precision of at least one other object from among the detected plurality of objects, wherein the first precision is higher than the second precision, executing 3d spatial mapping on the image data using the first precision for the identified first object and the second precision for the at least one other object, and displaying a 3d space generated based on the image data and the spatial mapping.
Inventor(s): Sumit Jha of Irvine CA (US) for samsung electronics co., ltd., Tien C. Bau of Irvine CA (US) for samsung electronics co., ltd.
IPC Code(s): G06V40/16, G06V10/70
CPC Code(s): G06V40/161
Abstract: a method for using a machine learning model having a base model and multiple branch models includes obtaining an image containing a face and processing the image using the base model to generate intermediate data. the method also includes processing the intermediate data using a first of the branch models to perform a first image processing task, where the first image processing task is associated with analyzing the image containing the face. the method further includes processing the intermediate data using a second of the branch models to perform a second image processing task different from the first image processing task, where the second image processing task is associated with analyzing the image containing the face. the base model and the first branch model are trained using a first dataset, and the base model and the second branch model are trained using a second dataset different from the first dataset.
Inventor(s): Jinwook Lee of Suwon-si (KR) for samsung electronics co., ltd., Sang-Hwa Jin of Suwon-si (KR) for samsung electronics co., ltd., Seungcheol Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G07C5/00, B60R16/033, G07C5/08, H02J7/00
CPC Code(s): G07C5/008
Abstract: the present disclosure relates to electronic devices. an example electronic device installed in a vehicle includes a communication interface and a data retention circuit that communicates through the communication interface. the data retention circuit estimates a temperature of a storage device based on information about an outside temperature received through the communication interface and a preset temperature offset, and determines a data management period of the storage device in an off state based on the estimated temperature of the storage device and a data retention parameter.
Inventor(s): Jonghae KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunggwan WOO of Suwon-si (KR) for samsung electronics co., ltd., Sungho AHN of Suwon-si (KR) for samsung electronics co., ltd., Jihyung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seongdae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09F9/30, G06F1/16, H04M1/02
CPC Code(s): G09F9/301
Abstract: a flexible display device comprises: a display panel including a flat region, a deformed region, and a boundary region between the flat region and the deformed region; a support member including a first support plate facing the flat region and the boundary region and a second support plate facing the boundary region and the deformed region; and at least one protective layer disposed between the support member and the display panel and including a gap in a region corresponding to the boundary region, wherein the second support plate may overlap with a portion of the first support plate, the gap, and a coupling portion when the display panel is viewed from above. other electronic devices are provided.
Inventor(s): Luca REMAGGI of Middlesex (GB) for samsung electronics co., ltd., Albert Saà-Garriga of Middlesex (GB) for samsung electronics co., ltd., Luther Power of Middlesex (GB) for samsung electronics co., ltd., Kranthi Yanamandra of Middlesex (GB) for samsung electronics co., ltd., Prashant Sharma of Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): G10L17/04
CPC Code(s): G10L17/04
Abstract: broadly speaking, embodiments of the present techniques provide a method for personalising a trained speaker verification machine learning, ml, model for a specific user, on-device (i.e. on the end user device which is going to be used to run the personalised ml model). advantageously, the present techniques improve the personalisation of the ml model on-device without requiring large volumes of data to be stored on the device.
Inventor(s): Jueon Kim of Suwon-si (KR) for samsung electronics co., ltd., Taehyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Donghyun Yoon of Suwon-si (KR) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Park of Suwon-si (KR) for samsung electronics co., ltd., Youngdon Choi of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10, G11C7/22
CPC Code(s): G11C7/1039
Abstract: a receiver includes a decoding circuit configured to convert a data signal into first and second signals having a time difference therebetween, which is a function of at least one parameter, and output decoded data based on the first signal and the second signal. a calibration circuit is provided, which is configured to calibrate a value of the at least one parameter based on one of the first signal and the second signal, and a reference timing signal, and provide a calibration signal including the calibrated value to the decoding circuit. the reference timing signal may have a reference timing that sets a ratio between a first probability and a second probability as an integer ratio.
Inventor(s): CHANHEE PARK of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., HYUNCHUL HWANG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10
CPC Code(s): G11C7/222
Abstract: a multi-bit cell includes a plurality of memory cells arranged in an m�n array m rows and n columns, a plurality of first clock lines, a plurality of second clock, and a plurality of data lines. each of the first clock lines is commonly connected to the memory cells of a corresponding one of the n columns. each of the second clock lines is commonly connected to the memory cells of a corresponding one of the n columns. each of the data lines is commonly connected to the memory cells of a corresponding one of the m rows, where m and n are natural numbers.
Inventor(s): Kiryong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungmyung Kang of Suwon-si (KR) for samsung electronics co., ltd., Inhak Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaesung Choi of Suwon-si (KR) for samsung electronics co., ltd., Jeonseung Kang of Suwon-si (KR) for samsung electronics co., ltd., Duhwi Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoung Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4074, G11C11/4072, G11C11/4096
CPC Code(s): G11C11/4074
Abstract: an embedded memory device includes a retention voltage supply circuit outputting a retention voltage in response to a retention activation signal, and a plurality of array voltage supply circuits outputting corresponding array voltages to corresponding bit cells. the plurality of array voltage supply circuits respectively include an array switch providing the retention voltage as a corresponding array voltage in response to the retention activation signal, a power switch providing a power supply voltage as the corresponding array voltage in response to a power gate activation signal, and an auxiliary circuit compensating the corresponding array voltage during a write operation or a read operation.
Inventor(s): Jongwook PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/408
CPC Code(s): G11C11/4085
Abstract: an embodiment provides a semiconductor memory device including a first word line extending along a first direction; a sub-word line driver including a first circuit and a second circuit that are connected to the first word line and are spaced apart from each other along the first direction, wherein the first circuit is configured to drive the first word line with a first voltage, and the second circuit is configured to drive the first word line with a second voltage that is different from the first voltage; and a memory cell connected to the first word line between the first circuit and the second circuit.
Inventor(s): Taewan Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunkook Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/26, G11C16/04, G11C16/24, G11C16/30
CPC Code(s): G11C16/26
Abstract: the present disclosure relates to methods of operating non-volatile memory devices. an example read operation method of a non-volatile memory device includes applying a first read voltage, generated from a voltage generator, to a selected wordline, performing a first sensing node develop operation associated with the first read voltage, and performing a first sensing operation associated with the first read voltage. while the first sensing node develop operation is performed, the voltage generator generates a second read voltage based on the selected wordline being disconnected from the voltage generator and thereby being floated.
20240412943. SUBSTRATE INSPECTION METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinwoo Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Bumjoo Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jong Cheon Sun of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Suyoung Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Hyeongcheol Lee of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/26, H01J37/28
CPC Code(s): H01J37/265
Abstract: a substrate inspection method includes reducing a surface potential of a substrate; and increasing a difference of the surface potential of the substrate, where reducing the surface potential of the substrate includes: controlling a scanning electron microscope to irradiate an electron beam to the substrate for a first irradiation time; and after a first standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the first irradiation time, where increasing the difference of the surface potential of the substrate includes: controlling the scanning electron microscope to irradiate the electron beam to the substrate for a second irradiation time; and after a second standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the second irradiation time, and where the first irradiation time is less than the second irradiation time.
Inventor(s): Jeongil MUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/3065
CPC Code(s): H01J37/32862
Abstract: provided is a method of manufacturing a semiconductor device. the method comprises loading a substrate having a first diameter onto a substrate support within a plasma chamber, performing a plasma process on the substrate, unloading the substrate from the plasma chamber, loading a dummy substrate having a second diameter smaller than the first diameter onto the substrate support, and performing a plasma cleaning process on the dummy substrate to remove foreign substance in the plasma chamber.
Inventor(s): Jawon KO of Suwon-si (KR) for samsung electronics co., ltd., Jongwha LEE of Suwon-si (KR) for samsung electronics co., ltd., Taijo JEON of Suwon-si (KR) for samsung electronics co., ltd., Yunsong JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jaesup LEE of Suwon-si (KR) for samsung electronics co., ltd., Solhee IN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32981
Abstract: a sensor device includes a first substrate, a second substrate on the first substrate, a plurality of detection units between the first substrate and the second substrate and configured to collect detection information from plasma formed in a space above the second substrate, a controller configured to generate characteristic data representing characteristics of the plasma based on the detection information collected by the plurality of detection units, and a power supply unit including a radio frequency (rf) energy harvester configured to produce power for operation of at least one of the plurality of detection units and the controller from rf power used to form the plasma.
Inventor(s): Ansook Sul of Hwaseong-si (KR) for samsung electronics co., ltd., Sungyong Park of Suwon-si (KR) for samsung electronics co., ltd., Sejin Park of Hwaseong-si (KR) for samsung electronics co., ltd., Donok Choi of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, B08B3/12, B08B7/00, H01L21/02, H01L21/687
CPC Code(s): H01L21/67034
Abstract: a substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.
Inventor(s): Sangchul YEO of Suwon-si (KR) for samsung electronics co., ltd., Doyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewon YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, G03F1/36, G06T7/00, G06T7/11
CPC Code(s): H01L22/24
Abstract: provided is a pattern inspection method including obtaining an image of a substrate on which a pattern is formed, extracting a contour based on the image, detecting positions of a target pattern based on the contour, generating pattern inspection data by performing a curve-fitting on the detected positions of the target pattern, and analyzing the pattern based on the pattern inspection data, wherein the curve-fitting is performed by using at least one of a sigmoid function, a hyperbolic tangent function, and a fermi-dirac function, and wherein the pattern inspection data includes a width in a first direction, a height in a second direction, and a pattern slope of the target pattern.
Inventor(s): Yeongbeom KO of Suwon-si (KR) for samsung electronics co., ltd., Seokgeun Ahn of Suwon-si (KR) for samsung electronics co., ltd., Juhyeon Oh of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Gwangjae Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/13, H01L23/00, H01L23/498, H01L25/065, H10B80/00
CPC Code(s): H01L23/13
Abstract: a semiconductor package includes a buffer die, a plurality of core die blocks sequentially stacked on the buffer die, and a molding member on the buffer die and covering outer surfaces of the plurality of core die blocks. each of the plurality of core die blocks includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip and a first gap filling portion, a third semiconductor chip disposed on the second semiconductor chip and a second gap filling portion, and a fourth semiconductor chip disposed on the third semiconductor chip.
Inventor(s): Hwanjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Jae Choon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunggu KANG of Suwon-si (KR) for samsung electronics co., ltd., Taehwan KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/31, H01L23/498, H01L23/538, H01L25/10
CPC Code(s): H01L23/367
Abstract: a stacked semiconductor package includes: a first semiconductor package that includes a first region and a second region and includes a semiconductor chip including a first element at the first region and a second element at the second region; a second semiconductor package on the first region of the first semiconductor package; and a member for heat dissipation at the second region of the first semiconductor package and overlapping at least a portion of the second element in a vertical direction perpendicular to an in-plane direction of the first semiconductor package.
20240413053. HEAT RADIATION DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngjoon Koh of Suwon-si (KR) for samsung electronics co., ltd., Jae Choon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/427, H01L23/00
CPC Code(s): H01L23/427
Abstract: disclosed are heat radiation devices and semiconductor apparatuses including the same. the semiconductor apparatus comprises a substrate, a plurality of semiconductor devices on the substrate and arranged in a first direction as a horizontal direction, and a heat radiation device on the plurality of semiconductor devices. the heat radiation device provides a plurality of vapor chambers. the plurality of vapor chambers are spaced apart from each other in the first direction and are not connected to each other.
Inventor(s): Jihyun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L23/00, H01L25/18, H10B80/00
CPC Code(s): H01L23/49822
Abstract: a semiconductor substrate includes: a plurality of first pad patterns; a first insulating layer covering side surfaces of the plurality of first pad patterns, and having first openings that expose at least portions of the plurality of first pad patterns; a plurality of redistribution wirings provided on the first insulating layer, and electrically connected to the plurality of first pad patterns through the first openings of the first insulating layer; a second insulating layer covering the plurality of redistribution wirings, and having second openings that expose at least portions of the plurality of redistribution wirings; a plurality of second pad patterns provided on the second insulating layer, and electrically connected to the plurality of redistribution wirings through the second openings of the second insulating layer; and a plurality of heat transfer patterns provided on the plurality of first pad patterns and not covered by the first insulating layer.
Inventor(s): Narae SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jeong-Kyu HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00
CPC Code(s): H01L23/49838
Abstract: provided is a semiconductor package including a film substrate including a sprocket hole, a semiconductor chip on the film substrate, interconnection lines connected to the semiconductor chip, a dummy pattern between the sprocket hole and the semiconductor chip, and a cutting pattern between the semiconductor chip and the dummy pattern, wherein the cutting pattern is spaced apart from the interconnection lines and the dummy pattern in a first direction.
Inventor(s): Samki Kim of Suwon-si (KR) for samsung electronics co., ltd., Nambin Kim of Suwon-si (KR) for samsung electronics co., ltd., Taehun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L25/065, H01L29/78, H10B41/27, H10B43/27, H10B80/00
CPC Code(s): H01L23/528
Abstract: the present disclosure relates to semiconductor devices, in which a semiconductor device includes: a plate layer, gate electrodes stacked and spaced apart from each other on the plate layer in a first direction, the gate electrodes including first gate electrodes and second gate electrodes on the first gate electrodes; a horizontal insulating layer between the first gate electrodes and the second gate electrode; first channel structures extending through the first gate electrodes in the first direction; second channel structures extending through the second gate electrodes in the first direction and electrically connected to the first channel structures, respectively; contact plugs extending through the horizontal insulating layer in the first direction and connected to the gate electrodes, respectively; dummy vertical structures extending through the horizontal insulating layer in the first direction and around the contact plugs, and a cell region insulating layer covering upper surfaces of the dummy vertical structures.
20240413081. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sun Jung Lee of Suwon-si (KR) for samsung electronics co., ltd., Sang Hoon Ahn of Suwon-si (KR) for samsung electronics co., ltd., Dong Gon Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jeong Won Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L23/532
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a via pattern in a first interlayer insulating film, and a wiring pattern that extends in a first direction and is on the first interlayer insulating film and the via pattern. the wiring pattern includes a lower wiring line and an upper wiring line on the lower wiring line, where the lower wiring line and the upper wiring line are stacked in a second direction, where the lower wiring line is between the via pattern and the upper wiring line and is on an upper surface of the via pattern, where a first portion of the lower wiring line is on the upper surface of the via pattern and has a first thickness, and where a second portion of the lower wiring line is on an upper surface of the first interlayer insulating film and has a second thickness.
20240413086. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JINBUM KIM of Suwon-si (KR) for samsung electronics co., ltd., GUIFU YANG of Suwon-si (KR) for samsung electronics co., ltd., Suk Yang of Suwon-si (KR) for samsung electronics co., ltd., SANGMOON LEE of Suwon-si (KR) for samsung electronics co., ltd., SUNGUK JANG of Suwon-si (KR) for samsung electronics co., ltd., SUNG-HWAN JANG of Suwon-si (KR) for samsung electronics co., ltd., Wonhee Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L29/06, H01L29/08, H01L29/40, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L23/5286
Abstract: provided is a semiconductor device including a lower pattern layer including a first semiconductor material; a first conductivity-type doped pattern layer disposed on the lower pattern layer and including a semiconductor material doped with a first conductivity-type impurity; a source/drain pattern disposed on the first conductivity-type doped pattern layer and including a semiconductor material doped with a second conductivity-type impurity different from the first conductivity-type impurity; a channel pattern including semiconductor patterns connected between the source/drain patterns, stacked apart from each other, and including a second semiconductor material different from the first semiconductor material; and a gate pattern disposed on the first conductivity-type doped pattern layer and between the source/drain patterns, and surrounding the channel pattern.
Inventor(s): OKGYEONG PARK of Suwon-si (KR) for samsung electronics co., ltd., MYUNGSAM KANG of Suwon-si (KR) for samsung electronics co., ltd., CHIL WOO KWON of Suwon-si (KR) for samsung electronics co., ltd., HYEJIN KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L25/065, H10B80/00
CPC Code(s): H01L23/562
Abstract: a semiconductor package including a package substrate, a chip structure on the package substrate, a peripheral structure disposed on the package substrate and disposed around the chip structure, and a stiffener structure disposed at an edge of the package substrate and surrounding the peripheral structure and the chip structure. the stiffener structure includes a first stiffener and a second stiffener that are sequentially stacked, the second stiffener includes a material different from a material of the first stiffener, and the second stiffener has a second width wider than a first width of the first stiffener and vertically overlaps the peripheral structure.
Inventor(s): Sang Cheon PARK of Suwon-si (KR) for samsung electronics co., ltd., Ji-Seok HONG of Suwon-si (KR) for samsung electronics co., ltd., Un-Byoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Ku Young KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/528, H01L25/18, H10B80/00
CPC Code(s): H01L24/02
Abstract: there is provided a semiconductor device with improved product reliability. the semiconductor device includes a substrate, a structure on the substrate and including multilayer metal patterns and multilayer insulating layers, and a pad layer on the structure and including a plurality of bonding pads, wherein a plurality of uppermost patterns at an uppermost layer among the multilayer metal patterns include electrode patterns for transferring signals and alleviation patterns that do not transfer the signals, a first ratio of the alleviation patterns within a first reference shape at a first distance from an edge of the structure is greater than a second ratio of the alleviation patterns within a second reference shape at a second distance from the edge of the structure, and the first distance is greater than the second distance.
20240413125. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seho You of Suwon-si (KR) for samsung electronics co., ltd., Sangcheon Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, G02B6/42, H01L23/00, H01L23/498, H01L23/538, H01L25/07
CPC Code(s): H01L25/0657
Abstract: provided is a semiconductor package including a package substrate, a connection substrate mounted on the package substrate, and including a first conductive connection structure, a first integrated circuit device mounted on the package substrate, and a second integrated circuit device disposed on the connection substrate and the first integrated circuit device, and including a first portion overlapping the first integrated circuit device and a second portion overlapping the connection substrate, wherein one of the first integrated circuit device and the second integrated circuit device includes a photonic integrated circuit device to which an optical fiber is attached, and the other of the first integrated circuit device and the second integrated circuit device includes an electronic integrated circuit device, and wherein the second integrated circuit device is electrically connected to the package substrate via the first conductive connection structure of the connection substrate.
Inventor(s): Wonsik CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byungchul KIM of Suwon-si (KR) for samsung electronics co., ltd., Yoonsuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungryong HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/075, H01L21/683
CPC Code(s): H01L25/0753
Abstract: a transfer substrate for a light emitting diode is provided. the transfer substrate includes a substrate, a laser ablation layer provided to the substrate, and an adhesive layer provided on the laser ablation layer and attached with a plurality of light emitting diodes, and the laser ablation layer and the adhesive layer may be divided into a plurality of portions corresponding to the plurality of light emitting diodes.
20240413144. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangcheon PARK of Hwaseong-si (KR) for samsung electronics co., ltd., Youngmin Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L23/48, H01L23/522, H01L23/544
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes: a first semiconductor chip including a plurality of front surface pads disposed on a first active surface of a first semiconductor substrate, at least one penetrating electrode penetrating at least a portion of the first semiconductor substrate and connected to the front surface pads, a first rear surface cover layer disposed on a first inactive surface of the first semiconductor substrate, a first rear surface dummy conductive layer penetrating a portion of the first rear surface cover layer; a second semiconductor chip including a second front surface cover layer disposed on a second active surface of a second semiconductor substrate, and a second front surface dummy conductive layer penetrating a portion of the second front surface cover layer; and at least one first bonded pad penetrating the first rear surface cover layer and the second front surface cover layer.
20240413151. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungho DO of Hwaseong-si (KR) for samsung electronics co., ltd., Sanghoon Baek of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L23/50, H01L23/522, H01L27/06, H01L29/66, H01L29/78
CPC Code(s): H01L27/0886
Abstract: a semiconductor device is provided. the semiconductor device includes a substrate including a first dummy region and a second dummy region spaced apart from the first dummy region; a device isolation layer filling a trench between the first dummy region and the second dummy region; a first dummy electrode provided on the first dummy region; a second dummy electrode provided on the second dummy region; a power line extending from the first dummy region to the second dummy region, the power line including an expanded portion provided on the device isolation layer, a width of the expanded portion being larger than a line width of a remaining portion of the power line; a power delivery network provided on a bottom surface of the substrate; and a through via extending through the substrate and the device isolation layer, and electrically connecting the power delivery network to the expanded portion. the through via and the expanded portion vertically overlap.
20240413158. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SUNGMIN KIM of Suwon-si (KR) for samsung electronics co., ltd., DAEWON HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/02, H01L21/8238, H01L23/522, H01L23/528, H01L29/06, H01L29/08, H01L29/423
CPC Code(s): H01L27/0924
Abstract: a semiconductor device includes an active pattern including a channel region. the channel region is disposed between first and second source/drain patterns that are spaced apart from each other in a first direction. the channel region is configured to connect the first and second source/drain patterns to each other. a gate electrode is disposed on a bottom surface of the active pattern and is disposed between the first and second source/drain patterns. an upper interconnection line is disposed on a top surface of the active pattern opposite to the bottom surface of the active pattern and is connected to the first source/drain pattern.
Inventor(s): Jintae KIM of Clifton Park NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/118
CPC Code(s): H01L27/11807
Abstract: a semiconductor device includes: a plurality of cells including 1cells arranged in a 1row of a layout of the semiconductor device; and a 1backside power rail and a 2backside power rail disposed below the 1cells, extended in a 1direction, and arranged in a 2direction intersecting the 1direction, wherein the 1backside power has a 1width, and the 2backside power rail has a 2width which is different from the 1width.
20240413161. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ho-Jun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyeonwoo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/118
CPC Code(s): H01L27/11807
Abstract: a semiconductor device may include a substrate including an active pattern, a device isolation layer defining the active pattern, a channel pattern on the active pattern, a gate electrode on the channel pattern, and a first isolation pattern and a second isolation pattern penetrating the gate electrode. the first isolation pattern may be extended into the device isolation layer, and the second isolation pattern may be provided to penetrate the gate electrode and the device isolation layer and may be extended into an upper portion of the substrate. a level of a bottom surface of the second isolation pattern may be lower than a level of a bottom surface of the device isolation layer.
Inventor(s): Changkeun Lee of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H01L21/768, H01L23/48
CPC Code(s): H01L27/14605
Abstract: disclosed are image sensors and methods of fabricating the same. the image sensor includes a semiconductor substrate including a pixel zone and a pad zone and having a first surface and a second surface opposing each other, a first pad separation pattern on the pad zone and extending from the first surface of the semiconductor substrate toward the second surface of the semiconductor substrate, a second pad separation pattern extending from the second surface toward the first surface of the semiconductor substrate on the pad zone the second pad and in contact with the first pad separation pattern, and a pixel separation pattern on the pixel zone and extending from the second surface of the semiconductor substrate toward the first surface of the semiconductor substrate.
20240413182. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngrae Kim of Suwon-si (KR) for samsung electronics co., ltd., Sachoun Park of Suwon-si (KR) for samsung electronics co., ltd., Daeuk Jung of Suwon-si (KR) for samsung electronics co., ltd., Jeongjin Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14627
Abstract: an image sensor includes: a first substrate including: a first side, a second side, a pixel array region, and an edge region; and a micro lens array on the second side, which includes micro lenses. each of the micro lenses includes a first lens layer and a second lens layer on the first lens layer. a second mean curvature radius of the second lens layer is smaller than a first mean curvature radius of the first lens layer. a first eccentric degree of the second lens layer on an edge of the pixel array region is greater than a second eccentric degree of the second lens layer at a center of the pixel array region.
20240413183. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Haeyong ` PARK of YONGIN-SI (KR) for samsung electronics co., ltd., Sungsoo CHOI of SEONGNAM-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H10K39/32
CPC Code(s): H01L27/1463
Abstract: an image sensor includes a substrate having a plurality of pixel regions and a deep device isolation pattern disposed in the substrate between the pixel regions. the pixel regions include first, second, third, and fourth pixel regions, which are adjacent to each other in first and second directions. the deep device isolation pattern includes first portions interposed between the first and second pixel regions and between the third and fourth pixel regions and spaced apart from each other in the second direction, and second portions interposed between the first and third pixel regions and between the second and fourth pixel regions and spaced apart from each other in the first direction. the first pixel region includes a first extended active pattern, which is extended to the second pixel region in the first direction and is disposed between the first portions of the deep device isolation pattern.
20240413203. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chang Min YOE of Suwon-si (KR) for samsung electronics co., ltd., Ji Wang KO of Suwon-si (KR) for samsung electronics co., ltd., Jae Hong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho HONG of Suwon-si (KR) for samsung electronics co., ltd., Dong Min KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jeong Min CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device includes a substrate. an active pattern is on the substrate and extends in a first horizontal direction. first to third nanosheets are sequentially stacked on the active pattern and are spaced apart from each other in a vertical direction. a gate electrode is on the active pattern and extends in a second horizontal direction. the gate electrode surrounds each of the first to third nanosheets. a source/drain region is on the active pattern on at least one side of the gate electrode. an interlayer insulating layer covers the source/drain region. a source/drain contact penetrates the interlayer insulating layer in the vertical direction and is connected to the source/drain region. at least a portion of the interlayer insulating layer is disposed between sidewalls of the source/drain contact and the source/drain region in the first horizontal direction and overlaps sidewalls of the third nanosheet along the first horizontal direction.
20240413204. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeewoong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hidenobu Fukutome of Suson-si (KR) for samsung electronics co., ltd., Jinkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Yunsuk Nam of Suwon-si (KR) for samsung electronics co., ltd., Dongyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device includes: insulating patterns spaced apart from each other in a first direction and in a second direction that intersects the first direction; a substrate insulating layer on first side surfaces of the insulating patterns; a device isolation layer on second side surfaces of the insulating patterns; channel layers on the insulating patterns and spaced apart from each other in a vertical direction that is perpendicular to an upper surface of the device isolation layer; gate structures vertically overlapping the insulating patterns, surrounding each of the channel layers, and extending in the second direction; source/drain regions provided outside the gate structures; and backside contact structures electrically connected to the source/drain regions and provided below the source/drain regions, wherein the insulating patterns include protrusions protruding in the vertical direction from an upper surface of the device isolation layer, and, in a region in which the insulating patterns vertically overlap the gate structures, a vertical distance between a lower surface of a lowermost channel layer among the channel layers and an upper surface of the protrusions is greater than a vertical distance between the channel layers.
Inventor(s): Yong Jun Nam of Suwon-si (KR) for samsung electronics co., ltd., Jin Bum Kim of Suwon-si (KR) for samsung electronics co., ltd., Sang Moon Lee of Suwon-si (KR) for samsung electronics co., ltd., Gyeom Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyo Jin Kim of Suwon-si (KR) for samsung electronics co., ltd., Tae Hyung Lee of Suwon-si (KR) for samsung electronics co., ltd., In Geon Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L29/0847
Abstract: a semiconductor device includes: a substrate, an active pattern extending in a first horizontal direction on the substrate, a plurality of nanosheets spaced apart from each other and stacked in a vertical direction on the active pattern, a gate electrode extending in a second horizontal direction different from the first horizontal direction on the active pattern, the gate electrode surrounding the plurality of nanosheets, a source/drain region disposed on at least one side of the gate electrode on the active pattern, the source/drain region including a first layer doped with a metal, and a second layer disposed on the first layer, and an inner spacer disposed between the gate electrode and the first layer, between each of the plurality of nanosheets, the inner spacer in contact with the first layer, the inner spacer including a metal oxide formed by oxidizing the same material as the metal.
Inventor(s): Keumseok PARK of Singerlands NY (US) for samsung electronics co., ltd., Wonhyuk Hong of Clifton Park NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/8234, H01L27/088, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/4175
Abstract: provided is a semiconductor device and a method of manufacturing the semiconductor device. the semiconductor device includes: a 1source/drain region connected to a 1channel structure; a 2source/drain region, above the 1source/drain region, connected to a 2channel structure above the 1channel structure; a backside contact structure on a bottom surface of the 1source/drain region; and a backside isolation structure surrounding the backside contact structure, wherein the bottom surface of the 1source/drain region is at a level below a top surface of the backside isolation structure.
20240413216. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Doohyun Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Heonjong Shin of Yongin-si (KR) for samsung electronics co., ltd., Seon-Bae Kim of Hwaseong-si (KR) for samsung electronics co., ltd., Minchan Gwak of Hwaseong-si (KR) for samsung electronics co., ltd., Jinyoung Park of Hwaseong-si (KR) for samsung electronics co., ltd., Hyunho Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L27/092, H01L29/06, H01L29/423, H01L29/786
CPC Code(s): H01L29/41775
Abstract: a semiconductor device may include an active pattern on a substrate, a source/drain pattern on the active pattern, a channel pattern connected to the source/drain pattern, a gate electrode on the channel pattern, an active contact on the source/drain pattern, a first lower interconnection line on the gate electrode, and a second lower interconnection line on the active contact and at the same level as the first lower interconnection line. the gate electrode may include an electrode body portion and an electrode protruding portion, wherein the electrode protruding portion protrudes from a top surface of the electrode body portion and is in contact with the first lower interconnection line thereon. the active contact may include a contact body portion and a contact protruding portion, wherein the contact protruding portion protrudes from a top surface of the contact body portion and is in contact with the second lower interconnection line thereon.
20240413232. HIGH PERFORMANCE FETS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mehdi Saremi of Danville CA (US) for samsung electronics co., ltd., Aravindh Kumar of Mountain View CA (US) for samsung electronics co., ltd., Rebecca Park of Mountain View CA (US) for samsung electronics co., ltd., Muhammed Ahosan Ul Karim of San Jose CA (US) for samsung electronics co., ltd., Ming He of San Jose CA (US) for samsung electronics co., ltd., Harsono Simka of Saratoga CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/775, H01L21/02, H01L21/3065, H01L29/06, H01L29/423, H01L29/66, H01L29/786
CPC Code(s): H01L29/775
Abstract: according to one or more embodiments of the present disclosure, a semiconductor device is described. the semiconductor device may include a substrate, a channel portion on the substrate between a source region and a drain region, and a gate on the channel. the channel portion may include a first portion extending in a first direction and at least one second portion protruding from the first portion in a second direction crossing the first portion.
Inventor(s): In Namgung of Suwon-si (KR) for samsung electronics co., ltd., Hwasung Rhee of Suwon-si (KR) for samsung electronics co., ltd., Youngshil Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyokyeom Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonil Cha of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L23/00
CPC Code(s): H01L29/785
Abstract: a semiconductor device includes a substrate having a first region and a second region surrounding the first region, an integrated circuit structure disposed on the first region, and a seal ring structure disposed on the second region, wherein the integrated circuit structure includes a first active fin extending on the first region in a <110> crystal direction of the substrate, a first epitaxial pattern disposed on one region of the first active fin, and a first contact structure connected to the first epitaxial pattern, and the seal ring structure includes a second active fin extending on the second region in a <100> crystal direction of the substrate, a second epitaxial pattern disposed on the second active fin and including the same material as that of the first epitaxial pattern, and a second contact structure connected to the second epitaxial pattern.
Inventor(s): Jaemun KIM of Seoul (KR) for samsung electronics co., ltd., Dahye KIM of Seoul (KR) for samsung electronics co., ltd., Jinbum KIM of Seoul (KR) for samsung electronics co., ltd., Gyeom KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Dohee KIM of Seoul (KR) for samsung electronics co., ltd., Dongwoo KIM of Incheon (KR) for samsung electronics co., ltd., Seunghun LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L21/8234, H01L29/04, H01L29/417, H01L29/66
CPC Code(s): H01L29/785
Abstract: a semiconductor device includes a substrate including a fin-type active region, the fin-type active region extending in a first direction; a plurality of channel layers on the fin-type active region, the plurality of channel layers including an uppermost channel layer, a lowermost channel layer, and an intermediate channel layer isolated from direct contact with each other in a direction perpendicular to an upper surface of the substrate; a gate electrode surrounding the plurality of channel layers and extending in a second direction intersecting the first direction; a gate insulating film between the plurality of channel layers and the gate electrode; and source/drain regions electrically connected to the plurality of channel layers. in a cross section taken in the second direction, the uppermost channel layer has a width greater than a width of the intermediate channel layer.
Inventor(s): Kyen-Hee LEE of Suwon-si (KR) for samsung electronics co., ltd., Jin Myoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L29/423, H01L29/66, H01L29/778
CPC Code(s): H01L29/78696
Abstract: a semiconductor device including a substrate including a first region and a second region, a first active pattern extending in a first direction on the first region, a second active pattern extending in the first direction on the second region, a wall structure extending in the first direction between the first region and the second region and separating the first active pattern and the second active pattern from each other, a first gate structure intersecting the first active pattern on the first region, a first two-dimensional (2d) channel layer including a first transition metal dichalcogenide between the first active pattern and the first gate structure, a second gate structure intersecting the second active pattern on the second region, and a second 2d channel layer including a second transition metal dichalcogenide between the second active pattern and the second gate structure may be provided.
20240413252. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungmin SONG of Hwaseong-si (KR) for samsung electronics co., ltd., Taeyong KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeoung MA of Seongnam-si (KR) for samsung electronics co., ltd., Namhyun LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L21/02, H01L21/8238, H01L27/092, H01L29/06, H01L29/417, H01L29/423, H01L29/66
CPC Code(s): H01L29/78696
Abstract: a semiconductor device including a substrate including a division region extending in a first direction, first and second active patterns on the substrate with the division region interposed therebetween, the first and the second active patterns being spaced apart from each other in a second direction perpendicular to the first direction, gate electrodes extending in the first direction and crossing the first and second active patterns, a first channel pattern on the first active pattern, and a second channel pattern on the second active pattern may be provided. the smallest width of the first active pattern may be smaller than the smallest width of the second active pattern, in the first direction. an end portion of the first channel pattern adjacent to the division region may include a protruding portion extending in the first direction, and the protruding portion may have a triangle shape in a plan view.
20240413521. ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon SEO of Suwon-si (KR) for samsung electronics co., ltd., Dohyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/48
CPC Code(s): H01Q1/243
Abstract: an electronic device includes a housing including a first housing part and a second housing part, a wireless communication circuit, and a display. the first housing part includes a first non-conductive portion disposed between a first edge and a second edge, a first conductive portion disposed between the first edge and the first non-conductive portion, and a second conductive portion disposed between the second edge and the first non-conductive portion. the second conductive portion is used for communication with an external electronic device.
Inventor(s): Kyoungil DO of Suwon-si (KR) for samsung electronics co., ltd., Chanhee JEON of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02H9/04, H01L27/02, H03K17/60, H03K17/687
CPC Code(s): H02H9/046
Abstract: a device includes: a first silicon-controlled rectifier comprising a first pnp bipolar junction transistor (bjt) and a first npn bjt in which bases and collectors are cross-coupled; and a field effect transistor (fet) configured to, based on an electrostatic discharge occurring between an anode of the first silicon-controlled rectifier and a cathode of the first silicon-controlled rectifier, trigger the first silicon-controlled rectifier. an emitter of the first pnp bjt corresponds to a plurality of first p+ regions being spaced apart from each other in a first direction. the fet is connected to the first silicon-controlled rectifier through at least one first n+ region disposed between the plurality of first p+ regions.
Inventor(s): Jueon Kim of Suwon-si (KR) for samsung electronics co., ltd., Taehyoung Kim of Singapore (SG) for samsung electronics co., ltd., Donghyun Yoon of Singapore (SG) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Park of Suwon-si (KR) for samsung electronics co., ltd., Youngdon Choi of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/50
CPC Code(s): H03M1/50
Abstract: a voltage-to-time converter (vtc) includes: a first inverter electrically connected between a first node, to which a clock signal is applied, and a second node, a first buffer electrically connected to the second node and to output a first output signal, a second inverter electrically connected between a third node, to which the clock signal is applied, and a fourth node, a second buffer electrically connected to the fourth node to output a second output signal, a first linearization circuit configured to receive a first input signal and electrically connected between the first node and the second node, and a second linearization circuit configured to receive a second input signal and electrically connected between the third node and the fourth node.
Inventor(s): Seunghwan YOON of Suwon-si (KR) for samsung electronics co., ltd., Dongsik SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dongjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Danbi JEON of Suwon-si (KR) for samsung electronics co., ltd., Jongwook ZEONG of Suwon-si (KR) for samsung electronics co., ltd., Dabin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Bonmin KOO of Suwon-si (KR) for samsung electronics co., ltd., Jonghwa KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihye KIM of Suwon-si (KR) for samsung electronics co., ltd., Haegweon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H03H9/02, H03H9/10, H03H9/54, H04B7/0404, H04B7/0413
CPC Code(s): H04B1/04
Abstract: the present disclosure relates to an electronic device for radiating an output signal in a wireless communication system. in one embodiment, the electronic device includes: a power amplifier configure to receive an input signal; a splitter connected to the power amplifier, which a plurality of branches; a plurality of filters connected to the plurality of branches of the splitter; and a plurality of antenna elements connected to the plurality of filters. the plurality of antenna elements radiates the output signal that is a portion of the input signal received by the power amplifier.
Inventor(s): Aliazam ABBASFAR of Santa Clara CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L1/00
CPC Code(s): H04L1/0061
Abstract: a system and a method are disclosed for encoding data including receiving at least one block of data; encoding the at least one block of data by generating a two-dimensional (2d) table having a plurality of rows and a plurality of columns, wherein one or more bits included in the at least one block is formed as a first row included in the plurality of rows, an odd parity bit is appended to each of the plurality of rows, and an error correction code is formed for each of the plurality of columns; and transmitting the encoded at least one block of data row by row over a serial link.
Inventor(s): Federico PENNA of San Diego CA (US) for samsung electronics co., ltd., Hyuk Joon KWON of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L25/02
CPC Code(s): H04L25/0232
Abstract: methods and apparatuses are provided in which frequency domain (fd) interpolation is performed on wideband reference signal (rs) resource elements (res) to generate channel estimates on corresponding rs symbols. denoising may be performed on the channel estimates in a time domain (td) or a delay-doppler domain (dd). learning-based channel estimation (lce) is applied on the channel estimates using a neural network (nn) to generate refined channel estimates on the corresponding rs symbols. time domain (td) interpolation is performed on the refined channel estimates to produce a channel estimate across symbols.
Inventor(s): Jueon Kim of Suwon-Si (KR) for samsung electronics co., ltd., Taehyoung Kim of Singapore (SG) for samsung electronics co., ltd., Donghyun Yoon of Singapore (SG) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Park of Suwon-si (KR) for samsung electronics co., ltd., Youngdon Choi of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/49, H04L7/033, H04L25/03
CPC Code(s): H04L25/4917
Abstract: a receiver includes a voltage-to-time converter configured to sequentially output a first converted signal and a second converted signal based on a first signal, a second signal, and a time difference; a first time comparator configured to determine a first bit value based on a first first-arrival signal (fas) and output first data including the first bit value; a delay time generator configured to select a non-target signal and a target signal based on the first bit value and from among the first converted signal and the second converted signal; and a second time comparator configured to determine a second bit value based on a second fas and output second data including the second bit value.
Inventor(s): Joon Ho CHO of Pohang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04L5/00
CPC Code(s): H04L27/2636
Abstract: provided are a dft-spread ofdm transmitter and transmission method and a dft-spread ofdm receiver and reception method capable of receiving the transmitted signal with a frequency domain spectrum shaping vector designed to easily trade off papr for spectral efficiency without inter-symbol interference, the dft-spread ofdm transmitter including a phase shifter for generating a pi/2 pam symbol vector by phase-shifting a symbol vector including m pam symbols, a dft spreader for generating a dft-spread pi/2 pam symbol vector by spreading the pi/2 pam symbol vector using an m-point dft matrix, a frequency domain spectrum shaper for generating a frequency domain spectrum shaped pi/2 pam symbol vector by multiplying each element of the dft-spread pi/2 pam symbol vector by each element of a first shaping vector including one or more zero (0) elements, and a sub-carrier allocator for allocating a non-zero element in the frequency domain spectrum shaped pi/2 pam symbol vector to a sub-carrier in an allocated frequency range
Inventor(s): Sooyeon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jongkeun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, F16C11/04, H05K5/02
CPC Code(s): H04M1/0216
Abstract: an electronic device according to an embodiment includes a housing including a first housing and a second housing, a display, and a hinge structure. the hinge structure includes a fixed member, a first rotary member, a second rotary member, a first arm member, a second arm member, a first coupling member including one portion coupled to the first housing and another portion coupled to the first arm member so as to be linearly movable, a second coupling member including one portion coupled to the second housing and another portion coupled to the second arm member so as to slide, a first elastic member disposed between the first coupling member and the first arm member, and a second elastic member disposed between the second coupling member and the second arm member. besides, it may be permissible to prepare various other embodiments speculated through the specification.
Inventor(s): Gyeongtae PARK of Suwon-si (KR) for samsung electronics co., ltd., Moonjeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Wankyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangeun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F3/04817, G06F3/0488, G09G3/00, H04M1/72469, H04M1/72484
CPC Code(s): H04M1/0235
Abstract: an electronic device according to various embodiments of the present disclosure may comprise: a wireless communication module including wireless communication circuitry; a first housing; a second housing coupled to the first housing to be able to slide; a flexible display comprising a first display area visible when the second housing is in a slide-in state with regard to the first housing, and a second display area visible when the second housing is in a slide-out state with regard to the first housing; a memory; and at least one processor, comprising processing circuitry, operatively connected to the wireless communication module, the flexible display, and the memory. at least one processor, individually and/or collectively, may be configured to control the electronic device to: display a first application in the first display area based on the second housing being in a slide-in state with regard to the first housing, display, at a first location in the first display area, a notification received from an external electronic device using the wireless communication module, generate a state change icon at a second location in the first display area based on reception of the notification, switch the second housing from the slide-in state to the slide-out state based on the state change icon being touched, and display a second application corresponding to the notification in the second display area.
Inventor(s): Sukdong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F3/04842
CPC Code(s): H04M1/0268
Abstract: disclosed is an electronic device including a first housing, a driving circuit provided within the first housing, a second housing provided to be movable with respect to the first housing and overlapping at least a portion of the first housing, and a flexible display at least partially mounted on a surface of the second housing and at least partially exposed to an outside of the electronic device. a portion of the flexible display is inserted into the first housing or exposed from the first housing according to a driving of the driving motor. the electronic device displays at least one image in a first area of the flexible display, and the at least one image includes a second area in which content of the at least one image is displayed, and a third area represented in a first color.
Inventor(s): Minkuk Kim of Gyeonggi-do (KR) for samsung electronics co., ltd., Soobum Lee of Gyeonggi-do (KR) for samsung electronics co., ltd., Baekeun Cho of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H05K5/03, H05K9/00
CPC Code(s): H04M1/0277
Abstract: an electronic device is disclosed. the electronic device may comprise: a housing, a circuit board disposed inside the housing, a first electric element disposed on the circuit board, and a shielding member fixed to the circuit board by an adhesive material. the shielding member may have a shielding space formed therein and include a plate and a sidewall extending from a circumference of the plate towards the circuit board. the sidewall may include an inside surface facing the shielding space, an outside surface opposite to the inside surface, and a bottom surface facing the circuit board. the sidewall includes at least one protrusion extending toward the circuit board. the at least one protrusion may include at least one recess formed through the side wall on the bottom surface. at least part of the adhesive material may be received in the at least one recess.
Inventor(s): Shi-Yun CHO of Seoul (KR) for samsung electronics co., ltd., Ji-Hyun JUNG of Seongnam-si (KR) for samsung electronics co., ltd., Ho-Jin LEE of Suwon-si (KR) for samsung electronics co., ltd., Young-Min LEE of Yongin-si (KR) for samsung electronics co., ltd., Ho-Seong SEO of Suwon-si (KR) for samsung electronics co., ltd., Youn-Ho CHOI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/724, G06F1/16, G06F3/0488, H04B1/3827
CPC Code(s): H04M1/724
Abstract: a watch phone and a method for handling an incoming call using the watch phone are provided. in the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. a single mode selection key selects one of the watch mode and the idle mode. a controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.
Inventor(s): Seung Jun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Su Ji KIM of Suwon-si (KR) for samsung electronics co., ltd., Young Hun SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/186, H04N19/103, H04N19/119, H04N19/177, H04N19/42
CPC Code(s): H04N19/186
Abstract: an apparatus for implicit neural video representation is provided. the apparatus for implicit neural video representation includes: a first neural network configured to output pixel-to-pixel matching information up to a keyframe by using space-time coordinates of a video as input; and a second neural network configured to output red-green-blue (rgb) data by using the space-time coordinates and the output pixel-to-pixel matching information as input.
Inventor(s): Karim AHMED of San Jose CA (US) for samsung electronics co., ltd., Yi WEI of Sunnyvale CA (US) for samsung electronics co., ltd., Vasili RAMANISHKA of Mountain View CA (US) for samsung electronics co., ltd., Yilin SHEN of San Jose CA (US) for samsung electronics co., ltd., Hongxia JIN of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04N23/84, G06T3/4015, G06T5/60, G06T5/70
CPC Code(s): H04N23/843
Abstract: provided is a u-shaped network for image restoration. the u-shaped network is lightweight based on a transformer block and is suitable to be deployed on-device, such as in a smartphone. the u-shaped network uses the transformer block to implement encoder, decoder and bottleneck functions. decoders are connected to respective encoders using skip connections based on element-wise addition, which avoids dimension expansion of concatenation. the transformer block uses a configuration of scaling and pool mixing to process input image data without the need for self-attention computations which permits reduction in memory, reduction in latency, reduction in computational demand, all while maintaining good output image quality.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/06, H04L1/1812, H04W28/06, H04W76/11
CPC Code(s): H04W4/06
Abstract: a method performed by a user equipment (ue) in a wireless communication system is provided. the method comprises receiving configuration information on a multicast broadcast service (mbs), and receiving, based on the configuration information, mbs data in a radio resource control (rrc)_connected mode. the mbs data is transmitted to plurality of ues including the ue for multicast transmission, or to the ue for unicast transmission. a hybrid automatic repeat and request (harq) retransmission is applied to a transmission of the mbs data.
Inventor(s): Donghyun JE of Suwon-si (KR) for samsung electronics co., ltd., Dongmyung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/126, H04W8/18
CPC Code(s): H04W12/126
Abstract: the disclosure relates to a 6g communication system for accomplishing a high data transmission speed and an ultra-low latency after 4g and 5g communication systems. according to an embodiment, a method performed by a first node in a communication system may be provided. the method may include: obtaining vulnerability-related information related to the communication system; receiving a first message including a request for a security-related service from a second node; and providing a second message including the security-related service, based on the vulnerability-related information, after receiving the request for the security-related service.
20240414578. CSI REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L5/00
CPC Code(s): H04W24/10
Abstract: apparatuses and methods for channel state information (csi) reporting. a method performed by a user equipment (ue) includes receiving a configuration about a channel state information (csi) report; based on the configuration, determining a first set of l vectors, each with a length dependent on p, and for each layer l=1, . . . , v, a set of coefficients {c}; and transmitting the csi report including at least one first vector indicator indicating the first set of l vectors and at least one coefficient indicator indicating the set of coefficients {c}. the configuration includes information about (i) k>1 non-zero power (nzp) csi reference signal (csi-rs) resources and (ii) a codebooktype. the codebooktype indicates a codebook associated with pcsi-rs ports aggregated across the k nzp csi-rs resources. v is a number of layers, l≥1, and p>32.
Inventor(s): Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W48/20, H04L1/1607, H04L1/1829, H04W72/0446, H04W72/23
CPC Code(s): H04W48/20
Abstract: methods and apparatuses for cell selection for uplink transmission. a method for operating a user equipment includes receiving: a bitmap mapping to a number of slots on a primary cell. the mapping repeats periodically over the number of slots. the bitmap indicates the primary cell or a secondary cell. the method further includes receiving information for first parameters associated with transmission of a physical uplink control channel (pucch) on the primary cell and information for second parameters associated with transmission of a pucch on the secondary cell. the method further includes determining, based on the bitmap, a first cell to transmit a first pucch in a slot of the first cell and transmitting the first pucch in the slot on the first cell.
Inventor(s): Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04B1/7163, H04W64/00
CPC Code(s): H04W60/04
Abstract: the present disclosure provides a method for controlling a non-uwb apparatus by using a uwb. a method of a first uwb apparatus, of the present disclosure, may comprise the steps of: registering a non-uwb apparatus on the basis of a uwb ranging between the first uwb apparatus and a second uwb apparatus; and recognizing the registered non-uwb apparatus on the basis of a pointing direction of the first uwb apparatus.
Inventor(s): Deokhui LEE of Suwon-si (KR) for samsung electronics co., ltd., Daeun KO of Suwon-si (KR) for samsung electronics co., ltd., Dongmyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Kitaek LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L5/00, H04W72/231, H04W76/20
CPC Code(s): H04W72/1268
Abstract: this disclosure relates to a 6g communication system for achieving high data transmission rates and ultra-low latency beyond 4g and 5g communication systems. the disclosure provides a method performed by a terminal in a wireless communication system or an apparatus related thereto, the method including receiving first information about at least one resource pattern associated with resource allocation of an uplink reference signal (rs) from a base station, receiving second information indicating one resource pattern among the at least one resource pattern from the base station, identifying a physical uplink shared channel (pusch) resource based on the first information and the second information, and transmitting an uplink signal to a base station based on the identified pusch resource.
Inventor(s): Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L1/1812, H04L5/00, H04W72/0446, H04W72/1273
CPC Code(s): H04W72/23
Abstract: methods and apparatuses for determining acknowledgment information reports. a method for operating a user equipment includes receiving first physical downlink control channels (pdcchs) providing first downlink control information (dci) formats associated with a first set of radio network temporary identifiers (rntis), and second pdcchs providing second dci formats associated with a second set of rntis. the method further includes determining first hybrid automatic request acknowledgement (harq-ack) information associated with the first dci formats, second harq-ack information associated with the second dci formats, and a physical uplink control channel (pucch) resource indicated by a last dci format from the first dci formats. the method further includes transmitting a pucch using the pucch resource. the pucch includes the first harq-ack information and the second harq-ack information.
Inventor(s): Changsung LEE of Suwon-si (KR) for samsung electronics co., ltd., Suhwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungsuk BAIK of Suwon-si (KR) for samsung electronics co., ltd., Sooeun SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaehong YI of Suwon-si (KR) for samsung electronics co., ltd., Hyeondeok JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/231, H04W24/02, H04W52/02, H04W76/28
CPC Code(s): H04W72/231
Abstract: the disclosure relates to an efficient method and device for ai-based low-power communication in a wireless communication system. according to an embodiment, a method for performing pdcch monitoring by a ue in a wireless communication system comprises receiving, by the ue, from a base station, modification-related information about a first threshold previously set in the ue, as compared with output information about an artificial intelligence (ai) model trained to determine whether to perform the pdcch monitoring and determining, by the ue, whether to perform the pdcch monitoring by comparing the output information about the ai model with a second threshold adjusted by increasing or decreasing the first threshold to save power consumption in the ue, based on the modification-related information.
Inventor(s): Cheolkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeongho YEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/25, H04L5/00, H04W72/044
CPC Code(s): H04W72/25
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure relates to a method by which a first terminal performs positioning through a sidelink in a wireless communication system, comprising the steps of: allocating a resource for transmitting a first sidelink positioning signal; transmitting the first sidelink positioning signal on the basis of the allocated resource; receiving, from at least one second terminal, a second sidelink positioning signal including a transmission/reception signal time difference of the at least one second terminal; measuring a transmission/reception signal time difference of the first terminal on the basis of the second sidelink positioning signal; and measuring terminal positioning on the basis of the transmission/reception signal time difference of the first terminal and the transmission/reception signal time difference of the second terminal, wherein the first sidelink positioning signal can include a first sidelink positioning reference signal (s-prs), and the second sidelink positioning signal can include a second s-prs.
Inventor(s): Qiongjie Lin of Sunnyvale CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/00
CPC Code(s): H04W74/006
Abstract: methods and apparatuses for switching of physical downlink control channel (pdcch) monitoring capabilities in a wireless communication system. a method for operating a user equipment includes receiving information to skip reception of a number of pdcchs over a number of slots; determining an instruction to receive first pdcchs in first slots from the number of slots based on a transmission of a physical uplink control channel (pucch) that provides a positive scheduling request (sr) in a first slot that is before the first slots, or skip the reception of the number of pdcchs in the number of slots based on an absence of transmission of the pucch in the first slot; and based on the instruction, receiving the first pdcchs in the first slots or skipping the reception of the first pdcchs in the number of slots.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/0816, H04W8/22, H04W74/04
CPC Code(s): H04W74/0816
Abstract: a first access point (ap) in a wireless network generates an invitation frame to solicit participation in a multi-ap coordination. the invitation frame includes one or more coordination information to share with one or more second aps. the first ap transmits the invitation frame to the one or more second aps. the first ap receives a response frame from the one or more second aps. the first ap forms a multi-ap coordination set including at least one second ap based on the response frame.
Inventor(s): Jonghun Han of Gwacheon-si (KR) for samsung electronics co., ltd., Chulho Chung of Yongin-si (KR) for samsung electronics co., ltd., Myeongjin Kim of Seongnam-si (KR) for samsung electronics co., ltd., Eunsung Jeon of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0816, H04B17/10, H04W16/14, H04W52/24, H04W72/0446
CPC Code(s): H04W74/0816
Abstract: the present disclosure provides a wireless communication method. the wireless communication method may be performed by a first apparatus and may include acquiring a transmit opportunity (txop) for transmitting a first physical layer protocol data unit (ppdu) with a first transmission power, limiting a second transmission power of a second apparatus for sharing the txop with the second apparatus, and transmitting the first ppdu to a third apparatus with the transmission power in the shared txop.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W36/36, H04W76/27
CPC Code(s): H04W74/0833
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to embodiments of the present disclosure, a method and apparatus for quickly activating cells in a next-generation mobile communication system may be provided.
Inventor(s): Jongkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeho KANG of Suwon-si (KR) for samsung electronics co., ltd., Jongyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwook BAIK of Suwon-si (KR) for samsung electronics co., ltd., Sukjin YUN of Suwon-si (KR) for samsung electronics co., ltd., Haewoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Soobin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yonghwa HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, F16C11/04
CPC Code(s): H05K5/0226
Abstract: a foldable electronic device is provided. the foldable electronic device includes a first housing, a second housing, a hinge module rotatably coupling the first housing and the second housing about a folding axis, and a flexible display. the hinge module includes a first rotating member, a first arm member configured to rotate about an axis different from the first axis and the second axis in response to rotation about the first axis, a first connecting member configured to connect the first rotating member and the first arm member, and a first wing plate positioned to cover at least a portion of the first rotating member and the first arm member and configured to rotate according to a folding operation of the foldable electronic device.
Inventor(s): Heebo SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K5/06
CPC Code(s): H05K5/0247
Abstract: an electronic device includes first and second housings, first and second display areas disposed on the first and second housings, respectively, and a folding area disposed between the first and second display areas and at least one flexible printed circuit board including at least one fixed plate disposed on one surface thereof. the at least one flexible printed circuit board extends from the first housing to the second housing. at least one of the first and second housings includes a support plate supporting at least a portion of either of the first and second display areas, and in which at least one through hole is formed. a guide member is disposed in the through hole with a wiring hole. at least a portion of the flexible printed circuit board may pass through the wiring hole. the fixed plate may be disposed on an inner wall of the wiring hole.
20240414908. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jee Woong Kim of Suwon-si, (KR) for samsung electronics co., ltd., Kyung Hee Cho of Suwon-si, (KR) for samsung electronics co., ltd.
IPC Code(s): H10B10/00
CPC Code(s): H10B10/125
Abstract: a semiconductor device includes a first lower active pattern and a second lower active pattern, a first upper active pattern and a second upper active pattern, a first gate electrode that overlaps the first lower active pattern and the first upper active pattern, a second gate electrode spaced apart from the first gate electrode, a third gate electrode spaced apart from the first gate electrode, a fourth gate electrode spaced apart from the third gate electrode, a first lower source/drain contact that is electrically connected to the first lower active pattern, a first upper source/drain contact that is electrically connected to the second upper active pattern, a lower shared contact in the lower region, and an upper shared contact in the upper region.
20240414909. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sohyun Park of Suwon-si (KR) for samsung electronics co., ltd., Inwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jihun Lee of Suwon-si (KR) for samsung electronics co., ltd., Seongtak Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L21/768, H01L23/528
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes an active pattern on a substrate; a gate structure extending through an upper portion of the active pattern; a bit line structure on a central portion of the active pattern; a lower contact plug on each of opposite end portions of the active pattern; and an upper contact plug structure on the lower contact plug. the upper contact plug structure includes a first upper contact plug and a second upper contact plug on the first upper contact plug. the second upper contact plug contacts the first upper contact plug. the first upper contact plug includes a first metal pattern and a barrier pattern covering a lower surface and a sidewall of the first metal pattern. an upper surface of the bit line structure contacts a lower surface of the second upper contact plug and does not contact the barrier pattern.
Inventor(s): Yoonjo Hwang of Gimpo-si (KR) for samsung electronics co., ltd., Jiyoung Kim of Seoul (KR) for samsung electronics co., ltd., Jungtae Sung of Seoul (KR) for samsung electronics co., ltd., Junyoung Choi of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/27, G11C5/02, H01L23/522, H01L23/528, H10B43/27
CPC Code(s): H10B41/27
Abstract: a semiconductor device includes a first substrate structure including a first substrate, circuit devices, first interconnection lines, bonding metal layers on upper surfaces of the first interconnection lines, and a first bonding insulating layer on the upper surfaces of the first interconnection lines and on lateral surfaces of the bonding metal layers, and a second substrate structure on the first substrate structure, and including a second substrate, gate electrodes, channel structures, second interconnection lines, bonding vias connected to the second interconnection lines and the bonding metal layers and having a lateral surface that is inclined such that widths of the bonding vias increase approaching the first substrate structure, and a second bonding insulating layer in contact with at least lower portions of the bonding vias. the bonding metal layers include dummy bonding metal layers not connected to the bonding vias and that contacts the second bonding insulating layer.
Inventor(s): Hyunuk Jeon of Suwon-si (KR) for samsung electronics co., ltd., Dong Young Kim of Suwon-si (KR) for samsung electronics co., ltd., Byeongheon Min of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/40
CPC Code(s): H10B43/27
Abstract: disclosed are three-dimensional semiconductor memory devices and electronic systems. the three-dimensional semiconductor memory device comprises stack structures that include interlayer dielectric layers and gate electrodes that are alternately stacked on a substrate, vertical channel structures that penetrate the stack structures, and a separation structure that runs in a first direction across between the stack structures. the separation structure includes a first portion that extends in a vertical direction from the substrate, and a second portion on the first portion and including a material different from a material of the first portion. a top surface of the second portion is at a level the same as that of top surfaces of the vertical channel structures.
Inventor(s): Kohji KANAMORI of Seongnam-si (KR) for samsung electronics co., ltd., Shinhwan KANG of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/50, H10B41/10, H10B41/27, H10B41/41, H10B41/50, H10B43/10, H10B43/27, H10B43/40
CPC Code(s): H10B43/50
Abstract: a semiconductor device includes a substrate; a stack structure on the substrate and including an alternating stack of interlayer insulating layers and gate electrodes; first and second separation regions each extending through the stack structure and extending in a first direction; a first upper separation region between the first and second separation regions and extending through a portion of the stack structure; a plurality of channel structures between the first and second separation regions and extending through the stack structure; and a plurality of first vertical structures each extending through a particular one of the first and second separation regions. each of the first and second separation regions has a first width in a second direction that is perpendicular to the first direction. each first vertical structure has a second width in the second direction, the second width being greater than the first width.
Inventor(s): Seunghee Lee of Suwon-si (KR) for samsung electronics co., ltd., Jin-Seong Park of Seoul (KR) for samsung electronics co., ltd., Jihyun Kho of Suwon-si (KR) for samsung electronics co., ltd., Dong-Gyu Kim of Seoul (KR) for samsung electronics co., ltd., Yurim Kim of Suwon-si (KR) for samsung electronics co., ltd., Yong-Suk Tak of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/20, H01L21/28, H01L23/528, H01L29/51, H01L29/66, H01L29/78, H10B51/10, H10B51/20, H10B53/10
CPC Code(s): H10B53/20
Abstract: a semiconductor device has, in a gate insulating layer, in an xps spectrum of o s obtained by an x-ray photoelectron spectroscopy (xps) using a monochromatic aluminum k� (1486.6 ev) source, a ratio (%) of an al—o peak observed in a binding energy of about 530.3 ev to about 531.6 ev to all peaks of greater than or equal to about 80%.
Inventor(s): Wooyoung YANG of Suwon-si (KR) for samsung electronics co., ltd., Bonwon KOO of Suwon-si (KR) for samsung electronics co., ltd., Chungman KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangmin PARK of Seoul (KR) for samsung electronics co., ltd., Hajun SUNG of Hwaseong-si (KR) for samsung electronics co., ltd., Dongho AHN of Hwaseong-si (KR) for samsung electronics co., ltd., Changseung LEE of Yongin-si (KR) for samsung electronics co., ltd., Minwoo CHOI of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00, G11C13/00, H10B61/00, H10N50/01, H10N50/80, H10N70/00, H10N70/20
CPC Code(s): H10B63/24
Abstract: a chalcogen compound layer exhibiting ovonic threshold switching characteristics, a switching device, a semiconductor device, and/or a semiconductor apparatus including the same are provided. the switching device and/or the semiconductor device may include two or more chalcogen compound layers having different energy band gaps. alternatively, the switching device and/or semiconductor device may include a chalcogen compound layer having a concentration gradient of an element of boron (b), aluminum (al), scandium (sc), manganese (mn), strontium (sr), and/or indium (in) in a thickness direction thereof. the switching device and/or a semiconductor device may exhibit stable switching characteristics while having a low off-current value (leakage current value).
Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd.
- A47J36/32
- A23L5/10
- G01J5/00
- G01J5/03
- CPC A47J36/321
- Samsung electronics co., ltd.
- A47L11/40
- CPC A47L11/4091
- A61F2/60
- A61F5/01
- A61H1/02
- A61H3/00
- CPC A61F2/605
- A63B24/00
- A63B71/00
- A63B71/06
- CPC A63B24/0006
- D06F33/48
- D06F33/40
- D06F37/30
- D06F103/26
- D06F105/46
- CPC D06F33/48
- D06F58/20
- D06F105/34
- CPC D06F58/20
- F04D29/40
- F04D29/66
- CPC F04D29/403
- F24C15/18
- F24C15/34
- CPC F24C15/18
- F24F11/64
- F24F11/65
- F24F110/10
- CPC F24F11/64
- F25B41/20
- F04B49/025
- F04B49/035
- F04C28/06
- F04C28/26
- F25B1/04
- F25B31/02
- F25B41/40
- F25B49/02
- CPC F25B41/20
- F25D23/02
- E05F1/12
- F25D23/06
- CPC F25D23/028
- G01S5/02
- CPC G01S5/0236
- G01S17/42
- G01S7/4865
- G01S17/26
- G01S17/931
- CPC G01S17/42
- G01S19/23
- G01S19/07
- H04B17/21
- CPC G01S19/235
- G02B27/10
- G02B27/12
- H01L27/146
- H04N9/01
- H04N25/13
- CPC G02B27/1013
- G02F1/13363
- G02B27/01
- G02F1/1335
- G02F1/1337
- G02F1/1343
- G02F1/1368
- G02F1/139
- G03H1/22
- CPC G02F1/133633
- G03F7/11
- G03F7/031
- G03F7/16
- H01L21/027
- H01L21/308
- CPC G03F7/11
- G03F7/00
- H01L21/67
- H01L21/68
- H01L21/683
- CPC G03F7/70933
- G05F1/575
- G05F1/571
- G05F1/62
- CPC G05F1/575
- G06F3/01
- G06F3/04886
- G06T7/70
- G06V40/10
- CPC G06F3/011
- G06F3/0481
- G06F9/451
- CPC G06F3/0481
- G06F3/0482
- G06F3/04845
- G09G3/22
- CPC G06F3/0482
- G06F3/0487
- G06F1/16
- CPC G06F3/0487
- G06F3/06
- G06F15/173
- CPC G06F3/0611
- CPC G06F3/0632
- CPC G06F3/0655
- G06F3/14
- G06F3/0485
- CPC G06F3/14
- G06F7/523
- CPC G06F7/523
- G06F8/41
- G06F11/30
- CPC G06F8/447
- G06F9/30
- G06F9/38
- G06F9/46
- CPC G06F9/30047
- G06F9/50
- CPC G06F9/3885
- G06F9/48
- CPC G06F9/4887
- G06F11/14
- CPC G06F9/5016
- CPC G06F9/5027
- G06F11/07
- CPC G06F11/0793
- G06F11/10
- CPC G06F11/1016
- G06F11/34
- CPC G06F11/3419
- G06F12/02
- CPC G06F12/02
- G06F12/1009
- CPC G06F12/023
- G06F12/10
- CPC G06F12/10
- G06F30/33
- G06F30/327
- CPC G06F30/33
- G06N3/04
- G06N3/084
- CPC G06N3/04
- G06N3/0495
- G06N3/0464
- CPC G06N3/0495
- G06Q10/0631
- G06Q50/04
- CPC G06Q10/06316
- G06T3/4046
- G06F18/21
- G06N3/045
- G06N3/08
- CPC G06T3/4046
- G06T5/60
- G06T5/50
- G06T7/73
- G06V10/74
- CPC G06T5/60
- G06T5/00
- G06V30/14
- G06V30/146
- G06V30/148
- G06V30/18
- CPC G06T5/73
- G06T7/00
- G06T5/80
- G06T7/586
- G06V10/143
- G06V10/60
- G06V10/77
- G06V10/82
- CPC G06T7/001
- G06T7/246
- CPC G06T7/246
- G06T7/60
- H01J37/09
- H01J37/10
- H01J37/153
- H01J37/22
- CPC G06T7/73
- G06T17/05
- G06T7/50
- G06V10/25
- CPC G06T17/05
- G06V40/16
- G06V10/70
- CPC G06V40/161
- G07C5/00
- B60R16/033
- G07C5/08
- H02J7/00
- CPC G07C5/008
- G09F9/30
- H04M1/02
- CPC G09F9/301
- G10L17/04
- CPC G10L17/04
- G11C7/10
- G11C7/22
- CPC G11C7/1039
- CPC G11C7/222
- G11C11/4074
- G11C11/4072
- G11C11/4096
- CPC G11C11/4074
- G11C11/408
- CPC G11C11/4085
- G11C16/26
- G11C16/04
- G11C16/24
- G11C16/30
- CPC G11C16/26
- H01J37/26
- H01J37/28
- CPC H01J37/265
- H01J37/32
- H01L21/3065
- CPC H01J37/32862
- CPC H01J37/32981
- B08B3/12
- B08B7/00
- H01L21/02
- H01L21/687
- CPC H01L21/67034
- H01L21/66
- G03F1/36
- G06T7/11
- CPC H01L22/24
- H01L23/13
- H01L23/00
- H01L23/498
- H01L25/065
- H10B80/00
- CPC H01L23/13
- H01L23/367
- H01L23/31
- H01L23/538
- H01L25/10
- CPC H01L23/367
- H01L23/427
- CPC H01L23/427
- H01L21/48
- H01L25/18
- CPC H01L23/49822
- CPC H01L23/49838
- H01L23/528
- H01L29/78
- H10B41/27
- H10B43/27
- CPC H01L23/528
- H01L23/522
- H01L23/532
- CPC H01L23/5283
- H01L29/06
- H01L29/08
- H01L29/40
- H01L29/417
- H01L29/423
- H01L29/66
- H01L29/775
- CPC H01L23/5286
- CPC H01L23/562
- CPC H01L24/02
- G02B6/42
- H01L25/07
- CPC H01L25/0657
- H01L25/075
- CPC H01L25/0753
- H01L23/48
- H01L23/544
- CPC H01L25/18
- H01L27/088
- H01L23/50
- H01L27/06
- CPC H01L27/0886
- H01L27/092
- H01L21/8238
- CPC H01L27/0924
- H01L27/118
- CPC H01L27/11807
- H01L21/768
- CPC H01L27/14605
- CPC H01L27/14627
- H10K39/32
- CPC H01L27/1463
- H01L29/786
- CPC H01L29/0673
- CPC H01L29/0847
- H01L21/8234
- CPC H01L29/4175
- CPC H01L29/41775
- CPC H01L29/775
- CPC H01L29/785
- H01L29/04
- H01L29/778
- CPC H01L29/78696
- H01Q1/24
- H01Q1/48
- CPC H01Q1/243
- H02H9/04
- H01L27/02
- H03K17/60
- H03K17/687
- CPC H02H9/046
- H03M1/50
- CPC H03M1/50
- H04B1/04
- H03H9/02
- H03H9/10
- H03H9/54
- H04B7/0404
- H04B7/0413
- CPC H04B1/04
- H04L1/00
- CPC H04L1/0061
- H04L25/02
- CPC H04L25/0232
- H04L25/49
- H04L7/033
- H04L25/03
- CPC H04L25/4917
- H04L27/26
- H04L5/00
- CPC H04L27/2636
- F16C11/04
- H05K5/02
- CPC H04M1/0216
- G06F3/04817
- G06F3/0488
- G09G3/00
- H04M1/72469
- H04M1/72484
- CPC H04M1/0235
- G06F3/04842
- CPC H04M1/0268
- H05K5/03
- H05K9/00
- CPC H04M1/0277
- H04M1/724
- H04B1/3827
- CPC H04M1/724
- H04N19/186
- H04N19/103
- H04N19/119
- H04N19/177
- H04N19/42
- CPC H04N19/186
- H04N23/84
- G06T3/4015
- G06T5/70
- CPC H04N23/843
- H04W4/06
- H04L1/1812
- H04W28/06
- H04W76/11
- CPC H04W4/06
- H04W12/126
- H04W8/18
- CPC H04W12/126
- H04W24/10
- CPC H04W24/10
- H04W48/20
- H04L1/1607
- H04L1/1829
- H04W72/0446
- H04W72/23
- CPC H04W48/20
- H04W60/04
- H04B1/7163
- H04W64/00
- CPC H04W60/04
- H04W72/1268
- H04W72/231
- H04W76/20
- CPC H04W72/1268
- H04W72/1273
- CPC H04W72/23
- H04W24/02
- H04W52/02
- H04W76/28
- CPC H04W72/231
- H04W72/25
- H04W72/044
- CPC H04W72/25
- H04W74/00
- CPC H04W74/006
- H04W74/0816
- H04W8/22
- H04W74/04
- CPC H04W74/0816
- H04B17/10
- H04W16/14
- H04W52/24
- H04W74/0833
- H04W36/36
- H04W76/27
- CPC H04W74/0833
- CPC H05K5/0226
- H05K5/06
- CPC H05K5/0247
- H10B10/00
- CPC H10B10/125
- H10B12/00
- CPC H10B12/482
- G11C5/02
- CPC H10B41/27
- H10B43/40
- CPC H10B43/27
- H10B43/50
- H10B41/10
- H10B41/41
- H10B41/50
- H10B43/10
- CPC H10B43/50
- H10B53/20
- H01L21/28
- H01L29/51
- H10B51/10
- H10B51/20
- H10B53/10
- CPC H10B53/20
- H10B63/00
- G11C13/00
- H10B61/00
- H10N50/01
- H10N50/80
- H10N70/00
- H10N70/20
- CPC H10B63/24
