Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on August 8th, 2024
Samsung Electronics Co., Ltd.: 148 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (12), H01L29/06 (8), H01L25/065 (8), H01L23/498 (7), H01L29/775 (7) H10B80/00 (3), H01L23/49838 (3), H01L23/5286 (2), H04W64/00 (2), G06F12/0246 (2)
With keywords such as: device, layer, configured, pattern, including, structure, substrate, signal, semiconductor, and based in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Yejin Choi of Suwon-si (KR) for samsung electronics co., ltd., Donghoon Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/015
CPC Code(s): B24B37/015
Abstract: a substrate polishing apparatus includes a platen having a surface configured polish through relative movement between the platen and a semiconductor substrate, a slurry supply configured to supply slurry to the platen, wherein the slurry flows to a location between the semiconductor substrate and the platen, a substrate holder configured to grip and fix the semiconductor substrate to be in contact with the platen such that the platen contacts the surface of the semiconductor substrate to be polished, a temperature controller having a thermal conductive body that is configured to contact the surface of the platen to transfer heat between the thermal conductive body and the platen to control the temperature of the platen, and a first cleaner having an ultrasonic transducer and at least one probe, the ultrasonic transducer configured to generate ultrasonic waves and the probe configured to transmit the ultrasonic waves to an outer surface of the thermal conductive body.
Inventor(s): Hyunsuk SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yongkwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Ginam KIM of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): C02F11/10, C02F11/12, C02F103/00
CPC Code(s): C02F11/10
Abstract: a sludge treatment apparatus includes a dryer which dries first sludges and discharges second sludges which are dried first sludges, a burner which burns the second sludges, and a serial pipe connected to the burner. the dryer has air inlets through which air is introduced into the dryer, and the serial pipe is disposed adjacent to the dryer.
Inventor(s): Jongsung PARK of Suwon-si (KR) for samsung electronics co., ltd., Mingyu JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Jungsoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Sungmin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K5/08, F25D23/06
CPC Code(s): C09K5/08
Abstract: the invention disclosed in the present specification relates to urethane that has insulation performance improved by lowering the thermal conductivity of urethane, and to a refrigerator having same applied thereto. the urethane having improved insulation performance comprising a plurality of closed cells containing internal gas generated from foaming; a plurality of open cells connected to outside air; and cell walls arranged between a closed cell among the plurality of closed cells and an open cell among the plurality of open cells or between the plurality of closed cells to connect the closed cells and the open cells, or the plurality of closed cells; and have a thermal conductivity (�) 17 to 18.5 mw/m�k.
Inventor(s): Heesuk WOO of Suwon-si (KR) for samsung electronics co., ltd., Kyusang AHN of Iksan-si (KR) for samsung electronics co., ltd., Jung-Min OH of Suwon-si (KR) for samsung electronics co., ltd., Jiwon KIM of Iksan-si (KR) for samsung electronics co., ltd., Jinkyu ROH of Iksan-si (KR) for samsung electronics co., ltd., Hyojoong YOON of Iksan-si (KR) for samsung electronics co., ltd., Sang Won BAE of Suwon-si (KR) for samsung electronics co., ltd., Kyungmo SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K13/08, H01L21/306
CPC Code(s): C09K13/08
Abstract: the present disclosure relates to an etchant composition for etching silicon and silicon germanium, and/or a preparation method of a pattern using the etchant composition. the etchant composition may include an oxidizing agent, a fluorine-based compound, a surfactant represented by chemical formula 1 or 2, and water. the etchant composition may include the surfactant in an amount of 5% to 40% by weight based on 100% by weight of the etchant composition.
Inventor(s): Myunggeun SHIM of Suwon-si (KR) for samsung electronics co., ltd., Kwansuk YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C12C13/10, C12G3/02
CPC Code(s): C12C13/10
Abstract: a device for producing fermented liquor includes: a main body, including: a control board; a carbon dioxide container connection; and a container, including: an outer container; a container cap, wherein the device is configured to: close a gas discharge port based on a pressure in the container reaching a first pressure; measure a first time for the pressure to become a second pressure, and store the first time; open the gas discharge port; close the gas discharge port based on the pressure becoming the first pressure, and measure a second time for the pressure to become the second pressure; and repeatedly, based on the second time being smaller than the first time: open the gas discharge port; close the gas discharge port based on the pressure becoming the first pressure; and measure the second time for the pressure to become the second pressure.
Inventor(s): Jihyun WOO of Suwon-si (KR) for samsung electronics co., ltd., Minji KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyeoncheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Eunsuk BANG of Suwon-si (KR) for samsung electronics co., ltd., Hooijoong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F33/37, D06F33/36, D06F33/38, D06F33/47, D06F34/22, D06F103/04, D06F103/08, D06F103/12, D06F103/20, D06F103/68, D06F105/42, D06F105/52, D06F105/62, G05B13/02
CPC Code(s): D06F33/37
Abstract: a washing machine is provided. the washing machine includes a drum, a detergent supply unit for supplying detergent to the drum, a turbidity sensor for detecting the turbidity of water inside the drum, memory storing one or more computer programs, and one or more processors communicatively coupled to the drum, the detergent supply unit, the turbidity sensor, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the washing machine to control the detergent supply unit to supply the detergent to the drum in case that a washing cycle starts, detect the water turbidity by using the turbidity sensor in case that a predetermined time period elapses after the washing cycle starts, obtain result information by comparing the detected water turbidity with a critical value, and store the obtained result information in the memory.
20240263378. WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yonggyun YIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangmin CHUN of Suwon-si (KR) for samsung electronics co., ltd., Bongjin KO of Suwon-si (KR) for samsung electronics co., ltd., Byeongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Byengbae PARK of Suwon-si (KR) for samsung electronics co., ltd., Doyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/02
CPC Code(s): D06F39/02
Abstract: a washing machine comprises: a housing; a tub in the housing; and a detergent box configured to move in a withdrawal and an insertion direction relative to the housing and including a detergent storage space to store therein a detergent to be supplied to the tub; a first elastic member, and a second elastic member, wherein the first and second elastic members are configured so that, when the detergent box is moved into the housing in the insertion direction, the first and second elastic members press the detergent box in the insertion direction away from a first position and a second position, respectively, the second position being spaced rearward of the first position in the housing, and when the detergent box is moved out of the housing in the withdrawal direction, the first and the second elastic members press the detergent box in the insertion direction.
20240263808. WINDOW-TYPE AIR-CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Munsub KIM of Suwon-si (KR) for samsung electronics co., ltd., Duhan JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sungtae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/027, F24F1/031, F24F1/26
CPC Code(s): F24F1/027
Abstract: a window-type air-conditioner installable on a window frame, and including an outdoor module including a compressor to compress a coolant, an outdoor heat exchanger to generate heat exchange between outdoor air and the coolant, and an outdoor housing accommodating the compressor and the outdoor heat exchanger; an indoor module including an indoor heat exchanger to generate heat exchange between indoor air and the coolant, and an indoor housing spaced apart from the outdoor housing, and accommodating the indoor heat exchanger; a coolant pipe along which the coolant moves between the outdoor and indoor modules; and a pipe cover accommodating the coolant pipe, and connecting the indoor and outdoor modules.
20240263808. WINDOW-TYPE AIR-CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Munsub KIM of Suwon-si (KR) for samsung electronics co., ltd., Duhan JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sungtae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/027, F24F1/031, F24F1/26
CPC Code(s): F24F1/027
Abstract: the coolant pipe has a spiral shape that is expandable and compressible, and the pipe cover structure is expandable and compressible, to adjust an interval between the outdoor and indoor modules to correspond to a thickness of the window frame.
Inventor(s): Dongwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaiyoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Joonseon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F8/167, F24F8/192
CPC Code(s): F24F8/167
Abstract: an air purifier includes a reactor in a tubular shape defining a hollow region extending in a first direction, a first electrode unit extending in the first direction and arranged in the hollow region, a second electrode unit arranged to surround the first electrode unit and separated from the first electrode unit with a certain space therebetween, a power source unit which applies a certain voltage between the first electrode unit and the second electrode unit to generate plasma between the first electrode unit and the second electrode unit, a support arranged between the first electrode unit and the second electrode unit, where a plurality of through-holes extending in the first direction is defined through the support, and a catalyst coated on a surface of the support defining the plurality of through-holes.
Inventor(s): MOONKI KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F13/28, F24F13/10, G03F7/00
CPC Code(s): F24F13/28
Abstract: a cooling system includes an air supply unit, and a filter unit providing an air intake path and an air exhaust path. the filter unit includes a first filter part including a first filter and providing a first panel slot, a second filter part including a second filter and providing a second panel slot, and a blocking panel. the blocking panel is located in one of the first and second panel slots.
Inventor(s): Yeontae Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinhee Park of Suwon-si (KR) for samsung electronics co., ltd., Joengseok Kim of Daejeon (KR) for samsung electronics co., ltd., Jinseop Lee of Daejeon (KR) for samsung electronics co., ltd., Bongkyun Jin of Daejeon (KR) for samsung electronics co., ltd., Eunju Park of Suwon-si (KR) for samsung electronics co., ltd., Eungsun Lee of Daejeon (KR) for samsung electronics co., ltd., Hyekyoung Moon of Suwon-si (KR) for samsung electronics co., ltd., Hyangbong Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunyul Park of Daejeon (KR) for samsung electronics co., ltd., Seoungkyo Yoo of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G01N35/10, G01N33/18, G01N35/08
CPC Code(s): G01N35/1095
Abstract: provided is a contaminant analysis apparatus including a pretreatment sampler configured to collect and filter an effluent discharged through a discharge pipe to provide an analysis target sample, a sample introduction unit configured to receive the analysis target sample from the pretreatment sampler, a sample injection unit configured to selectively supply the analysis target sample supplied from the sample introduction unit, a sample analysis unit including an integrated analyzer configured to analyze ion components and heavy metal components of the analysis target sample which is supplied from the sample injection unit, and an analysis controller configured to control the sample introduction unit, the sample injection unit, and the sample analysis unit, wherein the sample introduction unit includes a first sample introduction unit including two or more first sample introduction unit syringe pumps and a second sample introduction unit including one or more second sample introduction unit syringe pumps.
Inventor(s): Namjun CHO of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyewon JO of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoseok NA of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/35, G01S13/32
CPC Code(s): G01S7/352
Abstract: according to an embodiment, an electronic device comprises: a first antenna; a second antenna; a first signal generator configured to generate a first chirp signal; a second signal generator configured to generate a second chirp signal by adding an offset to the first chirp signal; and a processor operatively connected with the first signal generator and the second signal generator, wherein the processor is configured to: control the first signal generator to transmit the first chirp signal through the first antenna; control to receive a reception signal through a second antenna in association with the first chirp signal transmitted through the first antenna; control to mix the second chirp signal with the reception signal to generate a third signal; and control to filter the third signal.
Inventor(s): Inoh HWANG of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/58, G01S7/481, G01S13/34, G01S13/931, G01S13/933, G01S13/937, G01S17/58
CPC Code(s): G01S13/583
Abstract: a radar apparatus includes a transmitter configured to transmit electromagnetic waves; a receiver configured to receive electromagnetic waves that are reflected; and a processor configured to extract a relative velocity, with respect to the radar apparatus, of at least one front object based on the electromagnetic waves received by the receiver, wherein the processor is further configured to locally adjust respective resolutions of scanning front regions based on the relative velocity of the at least one front object.
Inventor(s): Seok Geun Ahn of Suwon-si (KR) for samsung electronics co., ltd., Haseob Seong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B6/42
CPC Code(s): G02B6/428
Abstract: disclosed is a silicon photonics package including an interposer including embedded optical components; a light source element optically connected to the optical components; a first semiconductor chip on a top surface of the interposer; a first redistribution layer on a bottom surface of the interposer; a second semiconductor chip on the first redistribution layer; a second redistribution layer on the first redistribution layer and being electrically connected to the first redistribution layer; conductive metal posts provided between the first and second redistribution layers; a mold material filling a space between the first and second redistribution layers; and a solder bump array on a bottom surface of the second redistribution layer. the top surface of the interposer includes an exposure area to which an optical fiber array is directly attached, in which an optical signal is directly transmitted between the optical components and the optical fiber array through the exposure area.
Inventor(s): Yun Song JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jun Hyuk CHANG of Suwon-si (KR) for samsung electronics co., ltd., Sang Yong YU of Suwon-si (KR) for samsung electronics co., ltd., Sang Min KIM of Suwon-si (KR) for samsung electronics co., ltd., Jae Sung BYUN of Suwon-si (KR) for samsung electronics co., ltd., Hyun Woo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/66, G03F7/00
CPC Code(s): G03F1/66
Abstract: a mask case includes a lower case including a first side surface and a second side surface opposite each other, a first rail on the first side surface, and a second rail on the second side surface, an upper case separable from the lower case, and includes third and fourth side surfaces corresponding to the first and second side surfaces, a third rail on the third side, and a fourth rail on the fourth side, a first sliding lock member slidable along the first and third rails, and a second sliding lock member slidable along the second and fourth rails, first and second holes for coupling first and second pins of first and second locking open and close devices are in the first and second sliding lock members, and the first and second sliding lock members are slid by the first and second locking open and close devices.
20240264605. ROBOT AND ROBOT CONTROL METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hankyeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungbeom HAN of Suwon-si (KR) for samsung electronics co., ltd., Kyongsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongmin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sangwuk CHAE of Suwon-si (KR) for samsung electronics co., ltd., Heewon CHAE of Suwon-si (KR) for samsung electronics co., ltd., Junu HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/229, G05D1/243
CPC Code(s): G05D1/2295
Abstract: a robot includes: a light and detection ranging (“lidar”) sensor; a driving module; a memory configured to store first map data corresponding to a first traveling space; and at least one processor configured to: acquire sensing data through the lidar sensor at a traveling start position of the robot, control the driving module to move the robot in a state in which a position corresponding to the traveling start position of the robot is not identified on the first map data based on the acquired sensing data, acquire second map data based on the sensing data acquired through the lidar sensor while the robot is moving, identify whether a second traveling space corresponding to the second map data matches the first traveling space based on probability information included in the first map data and position information on one or more objects included in the second map data, and identify the traveling start position of the robot on the first map data based on the traveling start position of the robot on the second map data and the position information on the one or more objects in a state in which it is identified that the second traveling space matches the first traveling space.
Inventor(s): Duckhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Woojong YOO of Suwon-si (KR) for samsung electronics co., ltd., Junesuk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/698
CPC Code(s): G05D1/6985
Abstract: a robot includes: a communication interface, a memory, and a processor configured to: transmit identification information and state information of the robot to an external server; based on receiving, from the external server, first information including identification information, type information and state information of at least one other robot, store the first information in the memory, based on identifying that an error occurred in communication with the external server, determine whether the robot is to operate as a master robot by comparing the type information and the state information of the at least one other device with type information and first state information of the robot; based on the robot operating as the master robot, plan a movement route of the at least one other robot based on task information of the at least one other robot, and transmit he planned movement route to the at least one other robot.
Inventor(s): Boeun JANG of Suwon-si (KR) for samsung electronics co., ltd., Sangho PARK of Suwon-si (KR) for samsung electronics co., ltd., Buyeong KWAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, F25D11/00, F25D23/02, F25D27/00
CPC Code(s): G06F3/0412
Abstract: a refrigerator including a main body configured with a storage compartment; a door configured to be rotatable to open and close the storage compartment; a touch interface on the door, and configured to sense a touch of a user, and a door opening device configured to rotate the door to open the storage compartment when the touch interface senses the touch of the user, wherein the touch interface includes an indicator configured to emit light out of the touch interface to assist a user to locate the touch interface.
Inventor(s): Seunggeun SONG of Suwon-si (KR) for samsung electronics co., ltd., Dukhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangho LIM of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongchae PARK of Suwon-si (KR) for samsung electronics co., ltd., Seonghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yeunwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0481, G06F1/16
CPC Code(s): G06F3/0481
Abstract: a method and device for controlling a screen displayed on a display of an electronic device are provided. aspects include displaying, on a first region of the display, a host window corresponding to an application run on the electronic device. aspects also include displaying the first dependent window on a second region of the display corresponding to the first region based at least in part on a call of a first dependent window among dependent windows that are dependent on the host window. aspects further include stacking and displaying, on the second region, a second dependent window among the dependent windows based at least in part on an event occurring in the first dependent window. aspects further include initializing window display on the second region based at least in part on an event occurring in the host window.
Inventor(s): JONGWON LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: a storage device according to an embodiment includes: a first memory that receives and stores a plurality of data packets including first tokens and data chunks corresponding to a plurality of storage devices from the plurality of storage devices; a direct memory access (dma) engine that performs integrity verification using the first tokens of the plurality of data packets and generates a recovered data chunk using the data chunks of the plurality of data packets; and a second memory that stores the recovered data chunk.
Inventor(s): Wan-Soo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sang Hoon YOO of Suwon-si (KR) for samsung electronics co., ltd., Young Sun YOUN of Suwon-si (KR) for samsung electronics co., ltd., Young Ick CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: a storage device and an operating method of a storage controller are provided. the storage device comprises a non-volatile memory device, each including a plurality of physical blocks, the physical block includes a plurality of sub-blocks and a storage controller including a free block list and a victim selectable block list for the plurality of physical blocks. the storage controller configured to check full reusable physical blocks in the free block list and select a head of the checked block when there are not enough free blocks for storing data in response to a write request received from a host. the storage controller further configured to perform a garbage collection based on the victim selectable block list and to transmit an address of the physical block subjected to the garbage collection to the non-volatile memory device together with the write request.
20240264772. OPERATION METHOD OF STORAGE DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SANG YOUNG YE of Suwon-si (KR) for samsung electronics co., ltd., SEONGHOON WOO of Suwon-si (KR) for samsung electronics co., ltd., HAEJONG JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: an operation method of a storage device connected to a host may include fetching one or more first commands from a first submission queue of the host by performing a first command fetch operation, processing one or more remaining commands other than the last command of the one or more first commands when a last command among the one or more first is a first fused commands, fetching one or more second commands from a second submission queue of the host by performing a second command fetch operation, processing the one or more second commands, and fetching at least two third commands from the first submission queue of the host by performing a third command fetch operation. the at least two third commands may include the first fused command and a second fused command corresponding to the first fused command.
Inventor(s): Hyunwoo SIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunpil KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongwoo AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F9/30
CPC Code(s): G06F9/4812
Abstract: a processor includes a register file, a context controller that, in response to a target interrupt occurring, is configured to determine, a target register that stores new data acquired through each of commands for executing an interrupt service routine (isr) among the plurality of registers, a write buffer configured to transmit pre-data stored in the target register to a memory, and a flag register configured to store set data including set values indicating whether the new data is stored in each of the registers. the context controller is configured to determine whether to transfer the pre-data to the memory through the write buffer based on the set data.
Inventor(s): Wooram YANG of Suwon-si (KR) for samsung electronics co., ltd., Yeongon CHO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F9/38
CPC Code(s): G06F9/4881
Abstract: a memory device includes: a device controller configured to generate a sub-processing instruction based on a host processing instruction received from a host; and a processing engine configured to perform an operation based on the generated sub-processing instruction.
Inventor(s): Sanghoon YOO of Suwon-si (KR) for samsung electronics co., ltd., Wan-Soo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hee Yeon TAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0246
Abstract: a memory storage device is provided. the memory storage device includes: a memory device including a plurality of blocks, the plurality of blocks including a first block which includes a plurality of sub-blocks; and a memory controller configured to, based on use amount differences among the plurality of sub-blocks being greater than a threshold value, increase a use amount of a low use sub-block that has a small use amount from among the plurality of sub-blocks of the first block. the plurality of sub-blocks of the respective blocks are stacked in a direction perpendicular to a substrate of the memory device.
Inventor(s): Jungho PARK of Suwon-si (KR) for samsung electronics co., ltd., Insu kim of Suwon-si (KR) for samsung electronics co., ltd., Beomkyu Shin of Suwon-si (KR) for samsung electronics co., ltd., Jaeyong Jeong of Dueon-di (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F12/0882, G06F13/16
CPC Code(s): G06F12/0246
Abstract: in some embodiments, the memory system for communicating with a host includes a non-volatile memory device storing first mapping information, a volatile memory device storing second mapping information, and a memory controller. the first mapping information indicates a relationship between a logical address and a portion of a first physical address. the first physical address indicates a location where user data is stored. the second mapping information indicates a second relationship between the logical address and a second physical address that corresponds to a remaining portion of the first physical address. the memory controller is configured to obtain a target logical address that has been received from the host, and determine, based on the second mapping information, a target second physical address mapped to the target logical address. the non-volatile memory device is configured to obtain a target first physical address by using the first mapping information.
20240264935. METHOD AND DEVICE FOR DATA STORAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yuqi Zhang of Suwon-si (KR) for samsung electronics co., ltd., Yanlong Yang of Suwon-si (KR) for samsung electronics co., ltd., Lei Geng of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F16/11, G06F16/22
CPC Code(s): G06F12/0253
Abstract: a method for data storage includes determining an expected expiration time of a new data file based on attribute information of the new data file and recorded attribute information of data files, in response to creation of the new data file in a level of a log-structured merge tree (lsm-tree). additionally, a block set corresponding to the expected expiration time is allocated for the new data file in a storage device. the recorded attribute information of the data files indicates a level where each of the data files is located, key information of each of the data files, and lifetime information of each of the data files. the data files that have been created comprise unexpired data files or both unexpired data files, and expired data files that expired within a preset period before creation time of the new data file.
Inventor(s): Jaehwan LEE of Fremont CA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/182, G06F3/06, G06F16/185, G06F16/27
CPC Code(s): G06F16/1844
Abstract: according to one general aspect, a system may include a plurality of data nodes. each data node may include either or both of a first storage medium and a second storage medium that is slower than the first storage medium. each data node may be configured to store a piece data in either the first storage medium or the second storage medium. the system may be configured to store a plurality of copies of an active piece of data within two or more data nodes. a fast copy of the active piece of data may be stored by a first storage medium of a first data node. one or more slow copies of the active piece of data may be stored by respective second storage mediums of one or more respective other data nodes.
Inventor(s): Sungwe CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/392, G06F30/398, G06F111/04, H01L27/02
CPC Code(s): G06F30/392
Abstract: a method of designing a layout of a semiconductor device, includes: preparing a standard cell library including information on standard cells; determining a layout of a common pattern region in consideration of a local layout effect based on the standard cell library; adding the common pattern region having a cell height that is identical to a cell height of each of the standard cells to opposite sides of one or more of the standard cells; and arranging the standard cells to share the common pattern region between at least one pair of adjacent ones of the standard cells.
Inventor(s): YONGDEOK KIM of Hwaseong-si (KR) for samsung electronics co., ltd., MUNJUN SEO of Seoul (KR) for samsung electronics co., ltd., Bonghyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/3953, G03F1/36, G06F30/392, G06F30/398
CPC Code(s): G06F30/3953
Abstract: disclosed are a semiconductor device and a method of fabricating the same. the semiconductor device includes an area-oriented region and a performance-oriented region, standard cells disposed on each of the area-oriented region and the performance-oriented region, and a routing metal layer on the standard cells. the routing metal layer includes first routing lines on the area-oriented region and second routing lines on the performance-oriented region. the smallest line width of the first routing lines is a first width, the smallest line width of the second routing lines is a second width greater than the first width, a pitch between the first routing lines is a first pitch, and a pitch between the second routing lines is a second pitch greater than the first pitch.
Inventor(s): Sangkwon NA of Suwon-si (KR) for samsung electronics co., ltd., Wooseok KANG of Suwon-si (KR) for samsung electronics co., ltd., Minho KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/4046, G06N3/04, G06N3/08, G06T9/00
CPC Code(s): G06T3/4046
Abstract: an example electronic device may include a memory configured to include at least one instruction; and a processor configured to be connected to the memory to control the electronic device, and obtain an output image by upscaling an input image using an artificial intelligence model trained to upscale an image, wherein the processor is configured to control the electronic device to: obtain parameter information of the artificial intelligence model based on pre-processing related information performed on the input image, and upscale the input image using the artificial intelligence model corresponding to the obtained parameter information.
Inventor(s): Wookhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Ilhyun CHO of Suwon-si (KR) for samsung electronics co., ltd., Jayoon KOO of Suwon-si (KR) for samsung electronics co., ltd., Namuk KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/4046, G06T3/4053
CPC Code(s): G06T3/4046
Abstract: an artificial intelligence (ai) upscaling apparatus for upscaling a low-resolution image to a high-resolution image includes: a memory storing one or more instructions; and a processor configured to execute the one or more instructions stored in the memory, wherein the processor is configured to: obtain a second image corresponding to a first image, which is downscaled from an original image by an ai downscaling apparatus by using a first deep neural network (dnn); and obtain a third image by upscaling the second image by using a second dnn corresponding to the first dnn, and wherein the second dnn is trained to minimize a difference between a first restored image, which results from applying no pixel movement to an original training image, and second restored images, which result from downscaling, upscaling, and subsequently retranslating one or more translation images obtained by applying pixel movement to the original training image.
Inventor(s): Sanga YOO of Suwon-si (KR) for samsung electronics co., ltd., Giyoung SHIN of Suwon-si (KR) for samsung electronics co., ltd., Eunbin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/60, G02B27/01, G06F3/01, G06V10/25, G06V40/20
CPC Code(s): G06T11/60
Abstract: a wearable device is disclosed. the wearable device may comprise at least one camera, a display, a memory configured to store instructions, and a processor. the processor, when the instructions are executed, under the condition that the brightness of an environment around the wearable device is equal to or greater than a reference brightness, and that multimedia content to be displayed within a display area of the display includes at least one area having a designated color, may be configured to obtain an image of a part of the environment in which inverted is the color of the part of the environment corresponding to a position where the multimedia content is to be displayed. the processor may be configured to display the multimedia content superimposed on the obtained image when the instructions are executed.
Inventor(s): Wooyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Chanhee YOON of Suwon-si (KR) for samsung electronics co., ltd., Donghwan SEO of Suwon-si (KR) for samsung electronics co., ltd., Jungeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Chanmin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T13/40, G06F3/0482, G06F3/04845, G06F3/04883, H04L65/401, H04N23/63
CPC Code(s): G06T13/40
Abstract: an electronic device is provided. the electronic device includes a processor operably connected to a camera and configured to display a preview image containing an emoji for a user on the touch screen display based on the motion of the subject recognized by the camera, such that the motion of the subject is applied to the emoji, receive a first user input to perform a function associated with the emoji while the preview image is being displayed, display a user interface including the emoji on the touch screen display in response to the first user input, receive a second user input associated with a motion of the emoji included in the user interface, and apply a motion specified according to the second user input to the emoji in response to the second user input and then display the emoji on the touch screen display.
Inventor(s): Jiwon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Taehyuk KWON of Suwon-si (KR) for samsung electronics co., ltd., Deokho KIM of Suwon-si (KR) for samsung electronics co., ltd., Hwangpil PARK of Suwon-si (KR) for samsung electronics co., ltd., Gunill LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/01, G06F3/0346, G06V40/20
CPC Code(s): G06T19/006
Abstract: provided are an augmented reality (ar) device for improving the accuracy of position information of a joint of a hand obtained through vision-based hand tracking technology by using a sensor measurement value obtained from an external device, and an operating method thereof. according to an embodiment of the disclosure, the ar device may update a three-dimensional position coordinate value of a joint of a hand by correcting a three-dimensional position coordinate value of the joint of the hand obtained from a plurality of image frames obtained through a camera by using a measurement value of an inertial measurement unit (imu) sensor obtained from a wearable device.
Inventor(s): Deokho KIM of Suwon-si (KR) for samsung electronics co., ltd., Hwangpil Park of Suwon-si (KR) for samsung electronics co., ltd., Taehyuk Kwon of Suwon-si (KR) for samsung electronics co., ltd., Gunill Lee of Suwon-si (KR) for samsung electronics co., ltd., Jiwon Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/774, G06F3/01, G06T13/40, G06T15/20, G06T19/20, G06V40/20
CPC Code(s): G06V10/774
Abstract: an electronic device for obtaining image data representing a hand gesture, the electronic device includes: a memory to store a default joint value of a preset joint, among joint values for a plurality of joints constituting a hand pose; and a processor configured to: obtain the default joint value from the memory, determine whether to generate a joint value, generate random joint values of joints other than the preset joint, obtain a pose vector corresponding to a key image frame by using the obtained default joint value and the generated random joint values, obtain a plurality of pose vectors by performing interpolation by using the obtained pose vector, and obtain a plurality of image frames representing the hand gesture by rendering a three-dimensional character image by using the plurality of obtained pose vectors.
Inventor(s): Changjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungyong MIN of Suwon-si (KR) for samsung electronics co., ltd., Kyungwoon JANG of Suwon-si (KR) for samsung electronics co., ltd., Changkyu CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Daesuck HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, H01L25/075, H01L33/38, H01L33/62
CPC Code(s): G09G3/006
Abstract: an electroluminescence inspection apparatus includes a first substrate; a plurality of electrodes provided at a first surface of the first substrate; a driving circuit provided at a second surface of the first substrate opposite of the first surface and configured to apply a current to a plurality of light emitting diodes provided at a second substrate through the plurality of electrodes; and a plurality of wirings configured to electrically connect the plurality of electrodes with the driving circuit. at least one electrode of the plurality of electrodes includes a plurality of protrusions configured to contact the plurality of light emitting diodes of the second substrate.
Inventor(s): Jeongmoon BYUN of Suwon-si (KR) for samsung electronics co., ltd., Hansoo SEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/12, G02B27/01, G09G5/00
CPC Code(s): G09G5/12
Abstract: a display device includes a memory, a timing controller including a scaler, and a processor, wherein the processor is configured to generate, via the scaler, a first sync signal based on an input timing of at least one piece of background image data, generate, via the scaler, a second sync signal based on an input timing of at least one piece of region of interest (roi) image data, transmit, to the scaler, the at least one piece of background image data output from the memory during a first period according to the first sync signal, and transmit, to the scaler, the at least one piece of roi image data output from the memory during a second period according to the second sync signal.
Inventor(s): Nam-yeong KWON of Anyang-si (KR) for samsung electronics co., ltd., Hee-seob RYU of Hwaseong-si (KR) for samsung electronics co., ltd., Kyung-mi PARK of Suwon-si (KR) for samsung electronics co., ltd., Chan-sik BOK of Incheon (KR) for samsung electronics co., ltd., Chan-hee CHOI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/08, G10L17/22
CPC Code(s): G10L15/22
Abstract: an electronic device and a voice recognition method thereof are provided. a voice recognition method of an electronic device includes receiving trigger voice, storing a characteristic of the trigger voice for voice verification by analyzing the trigger voice. when a user issues a voice command, determining whether the user voice command comprises the characteristic belonging to the trigger voice, and performing function of the electronic device corresponding to the user voice command based on the determination. accordingly, users may easily use the voice recognition function of the electronic device.
Inventor(s): Seungyoon HEO of Suwon-si (KR) for samsung electronics co., ltd., Choonho KIM of Suwon-si (KR) for samsung electronics co., ltd., Gangyoul KIM of Suwon-si (KR) for samsung electronics co., ltd., Chaerim BANG of Suwon-si (KR) for samsung electronics co., ltd., Sunghwa WOO of Suwon-si (KR) for samsung electronics co., ltd., Sangsu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L21/0232, G10L21/0208, G10L21/0216, G10L21/0364, G10L25/21, H04M1/60, H04M9/00
CPC Code(s): G10L21/0232
Abstract: an electronic device according to various embodiments of the disclosure may include: a communication module, comprising communication circuitry, configured to perform wireless communication with a network, at least one microphone configured to collect a sound signal, at least one speaker configured to output the sound signal, and at least one processor, comprising processing circuitry, operatively connected to the at least one microphone and the at least one speaker. at least one processor, individually and/or collectively, may be configured to: perform a call connection with an external electronic device through a network using the communication module, process a first sound signal corresponding to a sound signal input from the external electronic device and received through the network, and output the processed first sound signal through the at least one speaker, detect the first sound signal output through the at least one speaker, through the microphone to generate a second sound signal. at least one processor, individually and/or collectively, may compare an energy level of a frequency band equal to or below a reference frequency in the first sound signal with an energy level of a frequency band equal to or below the reference frequency in the second sound signal, and based on a result of the comparison, determine spatial information corresponding to a space in which the electronic device is located.
Inventor(s): Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C8/18
CPC Code(s): G11C8/18
Abstract: provided are a memory device and a method for command start point (csp) synchronization. the memory device includes: a control logic circuit configured to receive command address (ca) signals and control an operation of the memory device; a clock circuit configured receive a clock signal and divide the clock signal to generate first to fourth phase clock signals that are respectively synchronized with first to fourth rising edges of the ca signals indicating a command start point (csp) command, wherein the first to fourth rising edges of the ca signals constitute a command window; and a ca parity circuit configured to perform a command address parity (capar) checking operation on the csp command, wherein the capar checking operation includes a plurality of operations respectively corresponding to rolling windows in which the command window is delayed by one clock cycle of the clock signal.
Inventor(s): Seunggeol NAM of Suwon-si (KR) for samsung electronics co., ltd., Jinseong HEO of Seoul (KR) for samsung electronics co., ltd., Taehwan MOON of Suwon-si (KR) for samsung electronics co., ltd., Hagyoul BAE of Hanam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C15/04
CPC Code(s): G11C15/046
Abstract: disclosed are a non-volatile content addressable memory device having a simple cell configuration and/or an operating method thereof. the non-volatile content addressable memory device includes a plurality of unit cells, wherein each of the plurality of unit cells consists of or includes a first ferroelectric transistor and a second ferroelectric transistor the first and second ferroelectric transistors are of different types such as different electrical types from each other. the first and second ferroelectric transistors may be connected in series or in parallel to each other. the first and second ferroelectric transistors may share one word line and one match line. the first and second ferroelectric transistors may share one search line. one of the first and second ferroelectric transistors may be connected to a search line and the other one may be connected to a bar search line. the first and second ferroelectric transistors may share one match line.
Inventor(s): Jongryul KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongsung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/30, G11C16/04, G11C16/24
CPC Code(s): G11C16/30
Abstract: a flash memory device including a cell string including memory cells, a page buffer connected to the cell string and a bit line and configured to sense data stored in a selected memory cell by pre-charging a sensing node connected to the bit line, the page buffer including a latch including a latch node and an inverted latch node, a sampling switch circuit configured to perform a trip voltage sampling operation by electrically connecting the latch node and the sensing node according to a sampling control signal, and a pull-down nmos transistor configured to define a trip voltage provided to the latch node based on a sensing result of the data stored in the selected memory cell, and a voltage regulator configured to adjust the trip voltage by providing a source voltage to the pull-down nmos transistor of the page buffer, may be provided.
Inventor(s): Hyunseok KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12, G06F3/06
CPC Code(s): G11C29/12
Abstract: a memory repair circuit of a memory module including a plurality of memory packages, the memory repair circuit including: a test circuit configured to test the plurality of memory packages to obtain fail information in each of the plurality of memory packages; and a redundancy analysis circuit configured to: obtain a redundant address count in each of the plurality of memory packages, determine a repair order of the plurality of memory packages based on the fail information and the redundant address count, and perform a virtual repair on the plurality of memory packages in the repair order to determine an address to be repaired in each of the plurality of memory packages.
Inventor(s): JAEWON JEONG of Suwon-si (KR) for samsung electronics co., ltd., KYEONGTEA BANG of Suwon-si (KR) for samsung electronics co., ltd., SEUNGBO SHIM of Suwon-si (KR) for samsung electronics co., ltd., NAOHIKO OKUNISHI of Suwon-si (KR) for samsung electronics co., ltd., KIHWAN JANG of Suwon-si (KR) for samsung electronics co., ltd., KYUNG-SUN KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/3211
Abstract: a substrate processing apparatus including a process chamber providing a process space and a plasma generator on the process chamber. the plasma generator may include an inner antenna ring; an outer antenna ring outside of spaced apart from the inner antenna ring, and a floating ring between the inner antenna ring and the outer antenna ring. the floating ring may be electrically isolated from the inner antenna ring and the outer antenna ring.
20240266148. SEMICONDUCTOR MANUFACTURING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Min Su LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeon Tae KIM of Suwon-si (KR) for samsung electronics co., ltd., Yon Joo KANG of Suwon-si (KR) for samsung electronics co., ltd., Yi Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Won Ki LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeon Jin JEON of Suwon-si (KR) for samsung electronics co., ltd., Hyeong Un JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, C23C16/455, C23C16/50
CPC Code(s): H01J37/3244
Abstract: a semiconductor manufacturing device comprising a support unit in a chamber. a showerhead disposed between first and second plasma regions. first and second gas supply units injecting first and second process gases, respectively, into the second plasma region through the showerhead. the showerhead includes plasma penetration portions passing a portion of the plasma generated in the first plasma region therethrough. first gas flow paths injecting the first process gas into a first zone of the showerhead. second gas flow paths injecting the second process gas into a second zone of the showerhead that surrounds the first zone. first and second cavities connected to the first and second gas flow paths, respectively. the first and second cavities diffusing the first and second process gases, respectively. first and second gas spraying holes connected to the first and second cavities, respectively, and facing the second plasma region.
Inventor(s): Donghwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Kanguk Kim of Suwon-si (KR) for samsung electronics co., ltd., Seokhyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Wonchul Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/027, H01L21/308, H10B12/00
CPC Code(s): H01L21/0276
Abstract: a method of forming a pattern includes forming an etch target layer over a substrate including a first area and a second area, forming a hardmask structure over the etch target layer, forming a photoresist pattern including a first photoresist pattern including an engraved pattern located in the first area and a second photoresist pattern including an embossed pattern located in the second area, forming an upper hardmask pattern including a plurality of openings, forming a reversible hardmask pattern filling the plurality of openings in the first area, and forming a feature pattern including a first pattern located in the first area and a second pattern located in the second area, wherein the first pattern includes a plurality of island patterns and a dam structure planarly surrounding the plurality of island patterns.
Inventor(s): OKSEON YOON of Suwon-si (KR) for samsung electronics co., ltd., KISEOK KIM of Suwon-si (KR) for samsung electronics co., ltd., JIHYE SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/48
CPC Code(s): H01L21/4853
Abstract: a method of fabricating a semiconductor package may include providing a substrate, forming a seed layer to cover a top surface of the substrate, sequentially stacking a sacrificial layer and a photoimageable layer on the seed layer, forming a penetration hole to penetrate the photoimageable layer and the sacrificial layer and expose the seed layer, forming a conductive post in the penetration hole, performing a first process to remove at least a portion of the sacrificial layer, performing a second process to remove the photoimageable layer, and patterning or removing the seed layer.
Inventor(s): Byunghan KO of Suwon-si (KR) for samsung electronics co., ltd., Doil Kong of Suwon-si (KR) for samsung electronics co., ltd., Hu Zhao of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/373, H01L23/00, H01L23/31, H01L23/498, H01L23/538, H01L25/10, H10B80/00
CPC Code(s): H01L23/3736
Abstract: the present disclosure provides semiconductor packages including dummy packages. in some embodiments, the semiconductor package includes a solid-state drive (ssd) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. the at least one dummy package is electrically coupled with the printed circuit board. the at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.
Inventor(s): Sangmoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinbum Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L29/06, H01L29/08, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/481
Abstract: the present disclosure provides semiconductor devices including a field effect transistor (fet) and methods of fabricating the same. in some embodiments, a semiconductor device includes a substrate, a lower power line buried in a lower portion of the substrate, a source/drain pattern on the substrate, and a backside contact that penetrates the substrate and electrically couples the lower power line to the source/drain pattern. the backside contact includes an epitaxial pattern coupled to a lower portion of the source/drain pattern, a contact plug coupled to the lower power line, and a metal-semiconductor compound layer between the epitaxial pattern and the contact plug. the epitaxial pattern includes a top surface that protrudes toward the source/drain pattern.
20240266257. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungmin LIM of Suwon-si (KR) for samsung electronics co., ltd., Jinnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongmin BAEK of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/481
Abstract: a semiconductor device includes a substrate having a front surface including an active region and a rear surface opposite to the front surface. an active pattern is on the active region. a gate structure extends in a second direction on the active region. source/drain regions are disposed on the active pattern on both sides of the gate structure. a front interconnection structure is disposed on the gate structure and the source/drain regions. a rear interconnection structure is disposed on the rear surface of the substrate. a target region defined by the source/drain regions and the active pattern includes a non-oxidizing material at a first concentration. the non-oxidizing material is injected during a high-pressure heat treatment process. a rear interconnection region defined by the substrate, the rear through-structure, and the rear interconnection structure includes the non-oxidizing material at a second concentration higher than the first concentration.
Inventor(s): SANG-UK KIM of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a semiconductor package includes: a package substrate; a first re-distribution layer disposed on the package substrate; a second re-distribution layer disposed between the package substrate and the first re-distribution layer; a connection substrate interposed between the first re-distribution layer and the second re-distribution layer, wherein a connection hole penetrates the connection substrate; a first semiconductor chip mounted on a first surface of the first re-distribution layer; a first connection chip mounted on a second surface, opposite to the first surface, of the first re-distribution layer and disposed in the connection hole; a second connection chip mounted on a first surface of the second re-distribution layer and disposed in the connection hole; and a first lower semiconductor chip mounted on a second surface, opposite to the first surface, of the second re-distribution layer.
20240266269. SEMICONDUCTOR PACKAGE DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): GYUJIN CHOI of Asan-si (KR) for samsung electronics co., ltd., JAE-EAN LEE of Suwon-si (KR) for samsung electronics co., ltd., CHANGEUN JOO of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/10
CPC Code(s): H01L23/49822
Abstract: disclosed is a semiconductor package device comprising a semiconductor chip including first and second chip pads on an active surface of the semiconductor chip, and a redistribution substrate on the first and second chip pads. the redistribution substrate includes first and second redistribution patterns sequentially stacked on the active surface. the first redistribution pattern includes a first via part and a first via pad part vertically overlapping the first via part. the second redistribution pattern includes a second via part and a second via pad part vertically overlapping the second via part. the first via part contacts the first chip pad. the second via part contacts the second chip pad. a length of the second via part is greater than that of the first via part.
20240266271. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eun Ho CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065, H05K1/11
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a package substrate, an interposer on the package substrate and including first upper pads, the first upper pads including a first set of upper pads and a second set of upper pads, a first semiconductor chip on the interposer and comprising first lower pads respectively connected to the first set of upper pads, a plurality of first pins on a first top surface of the first semiconductor chip and substantially uniformly spaced apart by a first distance, and a plurality of second pins on the first top surface of the first semiconductor chip and substantially uniformly spaced apart by a second distance that is different from the first distance, where the first top surface of the first semiconductor chip includes a first region and a second region that does not overlap the first region.
Inventor(s): Janghee BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/48, H01L25/00, H01L25/065
CPC Code(s): H01L23/49838
Abstract: provided is a method of manufacturing an interposer, the method including providing a design of the interposer, and manufacturing the interposer based the design of the interposer, wherein the interposer includes bump pads contacting external connection bumps and spaced apart from each other at a distance greater than a pad interval, wherein the providing the design of the interposer includes generating a library including information about library pads having different dimensions, and determining a layout of the bump pads corresponding to each of the pad regions, wherein the layout of the bump pads corresponding to each of the pad regions is determined by selecting a library pad from among the library pads having a target dimension based on the pad interval and a pitch distance of target points in each of the pad regions, and placing the selected library pad at the target points in each of the pad regions.
Inventor(s): Jinmo Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jitaek Oh of Suwon-si (KR) for samsung electronics co., ltd., Hyoungjoon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48
CPC Code(s): H01L23/49838
Abstract: a strip substrate comprises a dielectric layer comprising a unit region and a saw line region, a saw line pattern on the saw line region, a conductive dummy pattern extending from the saw line pattern and toward the unit region, and power/ground patterns on the unit region. the power/ground pattern includes a first lateral surface that extends in a first direction and is proximate to the saw line pattern, a second lateral surface that extends in a second direction and is proximate to the conductive dummy pattern, and a third lateral surface that connects the first lateral surface and the second lateral surface.
Inventor(s): Somin Cheon of Suwon-si (KR) for samsung electronics co., ltd., Chulhae Park of Suwon-si (KR) for samsung electronics co., ltd., Alexander Schmidt of Suwon-si (KR) for samsung electronics co., ltd., Kyungmi Yeom of Suwon-si (KR) for samsung electronics co., ltd., Changuk Oh of Suwon-si (KR) for samsung electronics co., ltd., Kyungtaek Cho of Suwon-si (KR) for samsung electronics co., ltd., Eunsong Jee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528
CPC Code(s): H01L23/528
Abstract: a pattern structure includes a plurality of first patterns and a plurality of second patterns on a substrate. each of the plurality of first patterns extend in a first direction and are spaced apart from each other in a second direction, i.e., the first direction and the second direction are substantially parallel to an upper surface of the substrate and perpendicular to each other. each of the plurality of second patterns extend in the first direction and are spaced apart from each other in the second direction. the plurality of first patterns are aligned with each other in the second direction at a first end, and the plurality of second patterns are aligned with each other in the second direction at a second end that is opposite to the first end in the first direction. the plurality of second patterns are aligned with and spaced apart from the plurality of first patterns, respectively, in the first direction to form a plurality of spaces. each of the plurality of spaces is located between a first pattern of the plurality of first patterns and a second pattern of the plurality of second patterns that is aligned with the first pattern in the first direction. additionally, each pair of adjacent spaces from the plurality of spaces comprises a first space and a second space that is separated from the first space in the first direction.
20240266287. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Daewon HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/28, H01L29/51, H01L29/78, H10B51/10, H10B51/20
CPC Code(s): H01L23/5283
Abstract: a semiconductor device may include first conductive lines spaced apart from each other in a first direction on a substrate, second conductive lines spaced apart from the first conductive lines in a second direction, a gate electrode between the first and second conductive lines and extending in the first direction, a first selection gate electrode between the first conductive lines and the gate electrode and extending in the first direction, a plurality of channel patterns surrounding a side surface of the gate electrode and spaced apart from each other in the first direction, a plurality of first selection channel patterns surrounding a side surface of the first selection gate electrode and a ferroelectric pattern between the gate electrode and each of the channel patterns. the first selection channel patterns may be spaced apart from each other in the first direction and connected to the channel patterns, respectively.
Inventor(s): Jin Bum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L29/06, H01L29/40, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L23/5286
Abstract: a semiconductor device is provided. the semiconductor device includes: a substrate including a first side and a second side opposite to the first side; an active pattern that is on the first side and extends in a first direction; an etch stop layer that extends along the first side of the substrate and does not extend along side faces of the active pattern; a field insulating film that is on the first side and covers at least a part of the side faces of the active pattern; a gate structure that extends in a second direction intersecting the first direction on the active pattern and the field insulating film; a through contact that extends in a third direction intersecting the first direction and the second direction and penetrates the field insulating film and the etch stop layer; a buried pattern connected to the through contact, inside the substrate; and a backside wiring structure that is on the second side and electrically connected to the buried pattern.
Inventor(s): Byounggon Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L27/088, H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/5286
Abstract: an integrated circuit includes a substrate and a plurality of standard cells on the substrate. a standard cell of the plurality of standard cells includes a backside wiring pattern arranged on a lower portion of the substrate and including at least an internal connection node of the standard cell and a plurality of gate lines arranged on an upper portion of the substrate and extending in a first horizontal direction. at least one of the plurality of gate lines functions as an input pin of the standard cell.
Inventor(s): Eunyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Wei GUO of Huizhou City (CN) for samsung electronics co., ltd., Wulin HE of Huizhou City (CN) for samsung electronics co., ltd., Buseo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Wonwoong CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/532, H01L21/3205, H01L21/3213, H01L21/768, H01L23/528
CPC Code(s): H01L23/53219
Abstract: a material including an alloy including aluminum of 99% by weight to 99.8% by weight, copper of 0.1% by weight to 0.5% by weight, and scandium of 0.1% by weight to 0.5% by weight, a metal line in a semiconductor device including the material, and a method for forming the metal line in the semiconductor device may be provided.
20240266305. SEMICONDUCTOR MODULE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jong-Hyun SEOK of Suwon-si (KR) for samsung electronics co., ltd., Dan-Kyu KANG of Suwon-si (KR) for samsung electronics co., ltd., Hwanwook PARK of Suwon-si (KR) for samsung electronics co., ltd., Kang-Gyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeonghyeon CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/60, H01L23/13, H01L23/498, H01L25/065
CPC Code(s): H01L23/60
Abstract: a semiconductor module includes a board including a chip area and a tab area sequentially arranged in a first direction, a semiconductor chip provided on the chip area, a plurality of signal tabs provided on the tab area, and at least one anti-static portion having conductivity, provided in the tab area, and spaced apart from the plurality of signal tabs, where the plurality of signal tabs and the at least one anti-static portion are sequentially arranged in the first direction and the at least one anti-static portion is disposed on a line extending from at least one of the plurality of signal tabs in the first direction.
Inventor(s): Junghyun Roh of Suwon-si (KR) for samsung electronics co., ltd., Wangsun Lim of Suwon-si (KR) for samsung electronics co., ltd., Manhee Han of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoung Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/56
CPC Code(s): H01L24/03
Abstract: provided is a method of fabricating a semiconductor package, the method including forming a passivation layer and a first protective layer covering a semiconductor substrate and conductive pad above a first surface of the semiconductor substrate, removing a portion of the passivation layer and a portion of the first protective layer to expose the conductive pad, forming a second protective layer covering the conductive pad on the first protective layer, grinding a second surface opposite the first surface of the semiconductor substrate, dicing the semiconductor substrate, and removing the second protective layer to expose the conductive pad, wherein the second protective layer does not expose the conductive pad during the grinding and during the dicing.
20240266308. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyungeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/522, H01L23/528, H10B12/00
CPC Code(s): H01L24/06
Abstract: a semiconductor device includes a lower substrate, a lower dielectric structure on the lower substrate, a transistor between the lower substrate and the lower dielectric structure, a lower bonding pad in the lower dielectric structure, an upper dielectric structure on the lower dielectric structure, an upper substrate on the upper dielectric structure, a memory cell structure between the upper substrate and the upper dielectric structure, and an upper bonding pad in the upper dielectric structure. a top surface of the lower bonding pad is in contact with a bottom surface of the upper bonding pad. the lower bonding pad and the upper bonding pad overlap the memory cell structure.
20240266309. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeonggi Jin of Suwon-si (KR) for samsung electronics co., ltd., Solji Song of Suwon-si (KR) for samsung electronics co., ltd., Taehwa Jeong of Suwon-si (KR) for samsung electronics co., ltd., Jinho Chun of Suwon-si (KR) for samsung electronics co., ltd., Juil Choi of Suwon-si (KR) for samsung electronics co., ltd., Atsushi Fujisaki of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/522
CPC Code(s): H01L24/14
Abstract: a semiconductor package including a semiconductor chip, a redistribution layer structure disposed under the semiconductor chip, a bump pad disposed under the redistribution layer structure and having an upper structure of a first width and a lower structure of a second width less than the first width, a metal seed layer disposed along a lower surface of the upper structure and a side surface of the lower structure, an insulating layer surrounding the redistribution layer structure and the bump pad, and a bump structure disposed under the bump pad. a first undercut is disposed at one end of the metal seed layer that contacts the upper structure, and a second undercut is disposed at an other end of the metal seed layer that contacts the lower
Inventor(s): Taeyeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Ilyoung Han of Suwon-si (KR) for samsung electronics co., ltd., Hoechul Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/74
Abstract: a substrate bonding method and apparatus are described. the substrate bonding apparatus is used to bond a first substrate to a second substrate. the bonding apparatus includes a first bonding chuck configured to hold the first substrate on a first surface of the first bonding chuck; a second bonding chuck configured to hold the second substrate on a second surface of the second bonding chuck, the second surface facing the first surface of the first bonding chuck; a seal arranged between the first bonding chuck and the second bonding chuck and adjacent to at least one edge of the first substrate and at least one edge of the second substrate; and a process gas supply device configured to supply a process gas to a bonding space surrounded by the seal.
Inventor(s): Seungmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Changbeom Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungho Do of Suwon-si (KR) for samsung electronics co., ltd., Wookyu Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L27/092, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L27/0207
Abstract: an integrated circuit includes a power rail extending in a first direction and configured to receive a supply voltage, a gate line below the power rail and extending in a second direction that intersects the first direction, a source/drain region adjacent to the gate line in the first direction and configured to receive the supply voltage from the power rail, a frontside wiring layer above the power rail, connected to the power rail, and configured to transmit the supply voltage to the power rail, and a backside wiring layer below the power rail, connected to the power rail, and configured to transmit the supply voltage to the power rail.
20240266350. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L27/0922
Abstract: a semiconductor device includes a lower structure; a barrier layer on the lower structure; and an upper structure on the barrier layer, wherein the lower structure includes lower source/drain regions; lower active layers spaced apart from each other, between the lower source/drain regions; and a lower gate structure and including portions below each of the lower active layers, wherein the upper structure includes upper source/drain regions and vertically overlapping the lower source/drain regions; upper active layers spaced apart from each other, between the upper source/drain regions, and vertically overlapping the lower active layers; and an upper gate structure, including portions on each of the upper active layers, and vertically overlapping the lower gate structure, and wherein the uppermost lower active layer of the lower active layers and the lowermost upper active layer of the upper active layers are in contact with the barrier layer.
20240266352. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): AHREUM KIM of Hwaseong-si (KR) for samsung electronics co., ltd., SUNGHOON KIM of Seongnam-si (KR) for samsung electronics co., ltd., DAESEOK BYEON of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/8238, H01L25/065, H01L27/02
CPC Code(s): H01L27/0922
Abstract: a semiconductor device includes a substrate, an n-well area formed in the substrate, a first p-channel metal oxide semiconductor (pmos) transistor having active regions formed in the n-well area, and a first n-channel metal oxide semiconductor (nmos) transistor having active regions formed in the substrate. the first nmos transistor includes a first n-type active region overlapping each of the substrate and the n-well area, when viewed from above a plane parallel to a top surface of the substrate.
Inventor(s): Jonghyeon NOH of Suwon-si (KR) for samsung electronics co., ltd., Kook Tae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jingyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Byeongtaek BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor includes a substrate including a plurality of pixel regions, a first surface, and a second surface that is opposite to the first surface, and a deep device isolation pattern penetrating the substrate and between the plurality of pixel regions, the deep device isolation pattern including a first filling pattern adjacent to the second surface, a second filling pattern on the first filling pattern and adjacent to the first surface, a semiconductor pattern between the first filling pattern and the substrate, an oxidized semiconductor pattern on the semiconductor pattern and between the substrate and the second filling pattern, and a side insulating pattern between the semiconductor pattern and the substrate, where the semiconductor pattern directly contacts the oxidized semiconductor pattern.
Inventor(s): Kiho KONG of Suwon-si (KR) for samsung electronics co., ltd., Junhee Choi of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/15, G09G3/32, H01L33/00, H01L33/38, H01L33/62
CPC Code(s): H01L27/156
Abstract: a micro light emitting display apparatus and a method of manufacturing the micro light emitting display apparatus are disclosed. the micro light emitting display apparatus includes a micro light emitting element, a driving transistor connected to the micro light emitting element, a switching transistor connected to the driving transistor, and a first opening is provided to expose a source region or a drain region of the switching transistor, and a gate electrode of the driving transistor is provided in the first opening and in contact with the source region or the drain region of the switching transistor.
Inventor(s): Kwang-Young LEE of Seongnam-si (KR) for samsung electronics co., ltd., Jin Wook LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L21/768, H01L21/8234, H01L29/417, H01L29/66, H01L29/78
CPC Code(s): H01L29/0669
Abstract: a semiconductor device includes a source/drain pattern disposed on a substrate and a source/drain contact connected to the source/drain pattern. the source/drain contact includes a lower contact structure extending in a first direction and an upper contact structure protruding from the lower contact structure. the upper contact structure includes a first sidewall and a second sidewall facing away from each other in the first direction. the first sidewall of the upper contact structure includes a plurality of first sub-sidewalls, and each of the first sub-sidewalls includes a concave surface.
Inventor(s): Taegon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihye YI of Suwon-si (KR) for samsung electronics co., ltd., Yonghee PARK of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/15, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/155
Abstract: provided is a semiconductor device, including a substrate, a first active pattern on the substrate, a first channel pattern on the first active pattern, the first channel pattern including a first semiconductor pattern and a second semiconductor pattern on the first semiconductor pattern, a first source/drain pattern connected to the first channel pattern, and a gate electrode on the first channel pattern, wherein each of the first semiconductor pattern and the second semiconductor pattern includes a plurality of semiconductor layers, and at least one superlattice layer between adjacent semiconductor layers among the plurality of semiconductor layers, wherein the at least one superlattice layer included in the first semiconductor pattern has a first length, wherein the at least one superlattice layer included in the second semiconductor pattern has a second length, and wherein the first length is greater than the second length.
20240266408. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L27/088
CPC Code(s): H01L29/41741
Abstract: a semiconductor device includes a device isolation part on a substrate and defining active regions that are two-dimensionally disposed in first and second directions, the active regions each extending in the first direction; first and second word lines crossing the active regions in the second direction and adjacent to each other in the first direction; a first impurity region in the active region between the first and second word lines; a second impurity region in the active region at one side of the first word line and spaced apart from the first impurity region; a first conductive pad in contact with the first impurity region; a second conductive pad in contact with the second impurity region; a bit line on the first conductive pad and extending in the first direction; a storage node contact structure on the second conductive pad; and a landing pad on the storage node contact structure.
Inventor(s): Sanghyun JO of Seoul (KR) for samsung electronics co., ltd., Jinseong HEO of Suwon-si (KR) for samsung electronics co., ltd., Hyangsook LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangwook KIM of Osan-si (KR) for samsung electronics co., ltd., Yunseong LEE of Osan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/51, H01L21/02
CPC Code(s): H01L29/517
Abstract: disclosed herein is a thin film structure, including a first conductive layer on a dielectric layer including a plurality of layers. each of the plurality of layers includes a dopant layer containing a dopant a and a hfolayer to form a compound of hfao(0<x<1, z is a real number). an uppermost layer of the plurality of layers is thickest among the plurality of layers. the first conductive layer contacts the uppermost layer.
20240266445. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinseong HEO of Seoul (KR) for samsung electronics co., ltd., Taehwan MOON of Suwon-si (KR) for samsung electronics co., ltd., Hagyoul BAE of Hanam-si (KR) for samsung electronics co., ltd., Seunggeol NAM of Suwon-si (KR) for samsung electronics co., ltd., Sangwook KIM of Seongnam-si (KR) for samsung electronics co., ltd., Kwanghee LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/86, H10B69/00, H10K10/50, H10K19/00
CPC Code(s): H01L29/86
Abstract: a semiconductor apparatus includes a plurality of semiconductor devices. the semiconductor devices each include a ferroelectric layer, a conductive metal oxide layer, and a semiconductor layer, between two electrodes. the conductive metal oxide layer may be between the ferroelectric layer and the semiconductor layer. the ferroelectric layer, the conductive metal oxide layer, and the semiconductor layer may all include a metal oxide. the conductive metal oxide layer may include one or more materials selected from the group consisting of an indium oxide, a zinc oxide, a tin oxide, and any combination thereof.
Inventor(s): Joohun HAN of Hwaseong-si (KR) for samsung electronics co., ltd., Junhee Choi of Seongnam-si (KR) for samsung electronics co., ltd., Nakhyun Kim of Yongin-si (KR) for samsung electronics co., ltd., Dongho Kim of Seoul (KR) for samsung electronics co., ltd., Jinjoo Park of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/14, H01L27/15, H01L33/00, H01L33/30
CPC Code(s): H01L33/145
Abstract: a nanorod light emitting device, a method of manufacturing the same, and a display apparatus including the nanorod light emitting device are provided. the nanorod light emitting device includes a first semiconductor layer doped with a first conductivity type, a light emitting layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the light emitting layer and doped with a second conductivity type that is electrically opposite to the first conductivity type, wherein a distance between a lower surface of the first semiconductor layer and an upper surface of the second semiconductor layer is in a range of about 2 �m to about 10 �m, wherein a difference between a diameter of the upper surface of the second semiconductor layer and the lower surface of the first semiconductor layer is 10% or less of a diameter of the upper surface of the second semiconductor layer.
Inventor(s): Joohun HAN of Suwon-si (KR) for samsung electronics co., ltd., Junhee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kiho KONG of Suwon-si (KR) for samsung electronics co., ltd., Joosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyochul KIM of Suwon-si (KR) for samsung electronics co., ltd., Eunsung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/24, H01L25/075, H01L33/00, H01L33/10, H01L33/22, H01L33/32, H01L33/44
CPC Code(s): H01L33/24
Abstract: provided is a nanorod light-emitting device having improved luminous efficiency by reducing surface defects. the nanorod light-emitting device includes a semiconductor light-emitting structure having a nanorod shape, a surface activation layer provided on a sidewall of the semiconductor light-emitting structure, and an epitaxial passivation layer provided on the surface activation layer.
20240266474. SEMICONDUCTOR LIGHT EMITTING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taehun KIM of Suwon-si (KR) for samsung electronics co., ltd., Gyeongseon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hanul YOO of Suwon-si (KR) for samsung electronics co., ltd., Suyeol LEE of Suwon-si (KR) for samsung electronics co., ltd., Taesung JANG of Suwon-si (KR) for samsung electronics co., ltd., Dooho JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/40, H01L33/32
CPC Code(s): H01L33/405
Abstract: a semiconductor light emitting device includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer arranged on the first conductivity type semiconductor layer, an active layer, an electrode layer formed on a top surface of the second conductivity type semiconductor layer, a reflective layer formed on a part of a top surface of the electrode layer, a bonding pad formed on a top surface of the reflective layer, an insulating layer formed on another part of the top surface of the electrode layer, and an insulating spacer conformally formed along a surface of the substrate. the reflective layer includes a material that is not etched by an aqueous solution including one of tetramethyl ammonium hydroxide (tmah), koh, naoh, and nhoh and the bonding pad has a shell shape including a part of which the width gradually decreases as the part distances from the reflective layer.
20240266716. ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngsub KIM of Suwon-si (KR) for samsung electronics co., ltd., Juneseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwanghyun BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jungyub LEE of Suwon-si (KR) for samsung electronics co., ltd., Dohyuk HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/22, H01Q9/16, H01Q21/06
CPC Code(s): H01Q1/246
Abstract: a radio unit (ru) module may include: a first substrate comprising a first surface and a second surface opposite to the first surface; a radio frequency integrated circuit (rfic); a second substrate comprising a plurality of layers that comprises a plurality of second layers that comprises at least one first layer; a plurality of antenna elements comprising a first antenna element and a second antenna element; and a plurality of conductivity members comprising a conductivity member. the rfic may be coupled to the first surface of the first substrate. the second substrate may be coupled to the second surface of the first substrate. the plurality of antenna elements may be disposed on the at least one first layer of the second substrate. the plurality of conductivity members may be disposed across the plurality of second layers of the second substrate.
Inventor(s): Yongsik NAM of Suwon-si (KR) for samsung electronics co., ltd., Taehyun WOO of Suwon-si (KR) for samsung electronics co., ltd., Youngjoong YOON of Seoul (KR) for samsung electronics co., ltd., Donghyun KIM of Seoul (KR) for samsung electronics co., ltd., Chanyeong PARK of Seoul (KR) for samsung electronics co., ltd., Myeounghyeoun DO of Suwon-si (KR) for samsung electronics co., ltd., Taegyeong HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q7/00, H01Q1/22, H01Q1/27, H01Q5/25
CPC Code(s): H01Q7/00
Abstract: a wearable electronic device is provided. the wearable electronic device includes a housing, a printed circuit board disposed inside the housing and including wireless communication circuitry and a ground part, and an antenna disposed inside the housing and electrically connected to the wireless communication circuitry, wherein the antenna includes a conductive pattern, a feeding member electrically connected to the wireless communication circuitry through a feeding point and configured to electrically connect a first point of the conductive pattern and a first point of the ground part, a short-circuit member configured to electrically connect a second point of the conductive pattern and a second point of the ground part, and a capacitive loading member disposed between the feeding member and the short-circuit member having a first part operatively coupled to a third point of the conductive pattern and a second part electrically connected to a third point of the ground part.
Inventor(s): Jehun JONG of Suwon-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Sumin YUN of Suwon-si (KR) for samsung electronics co., ltd., Woomin JANG of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q9/04, H01Q1/24, H01Q3/30
CPC Code(s): H01Q9/0407
Abstract: an electronic device is provided. the electronic device includes a housing, a display panel arranged so as to be visible from the outside through at least a portion of the housing in the inner space of the housing, a dielectric sheet disposed between the display panel and the housing and at least partially including a ground region, at least one mesh pattern disposed to be at least partially electrically connected to the ground region and formed in a patch shape using a plurality of conductive lines, and a wireless communication circuit configured to transmit or receive a wireless signal in a designated frequency band through the at least one mesh pattern, wherein a slot is formed to have a length in a first direction in at least a portion of the at least one mesh pattern or at least a portion of the ground area, and the at least one mesh pattern may be electrically connected to the wireless communication circuit through at least one power supply line disposed across the ground region and at least one slot along a second direction crossing the first direction.
Inventor(s): Taeksun KWON of Suwon-si (KR) for samsung electronics co., ltd., Chanju PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungi JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jungwoo SEO of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongjin JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q9/04, H01Q21/00, H01Q21/06
CPC Code(s): H01Q9/0414
Abstract: a stacked patch antenna includes an upper ground plate including a first upper hole, a first feed pad provided on the upper ground plate, a first feed line extending from the first feed pad along a first direction, a lower antenna patch provided on the first feed pad, an upper antenna patch provided on the lower antenna patch, a first upper pad provided in the first upper hole, and a first upper stub protruding from a side surface of the first upper pad.
Inventor(s): Jiwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungyong JOO of Suwon-si (KR) for samsung electronics co., ltd., Junhyun WON of Suwon-si (KR) for samsung electronics co., ltd., Taejun YOU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M1/42, H02M1/00
CPC Code(s): H02M1/4208
Abstract: an electronic apparatus includes a power factor correction (pfc) circuit including an inductor and a switch serially connected to the inductor, and a control circuit. the control circuit, based on an amount of current flowing in the pfc circuit being less than or equal to a threshold current, operates the pfc circuit in a standby mode, and based on an output voltage of the pfc circuit being less than a threshold output voltage corresponding to the standby mode, adjusts the output voltage to correspond to a reference voltage by applying a signal for on-off control of the switch in the pfc circuit to the switch. the control circuit identifies an on-off frequency of the switch based on a reference current level for limiting a peak current of the inductor included in the pfc circuit in the standby mode, and applies the signal to the switch based on the on-off frequency.
Inventor(s): INHWAN CHO of SUWON-SI (KR) for samsung electronics co., ltd., MYUNG-JIN LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H03F3/217, H03F3/45
CPC Code(s): H03F3/2171
Abstract: an audio amplifier includes a loop filter configured to receive a differential input signal pair, a pulse-width modulation (pwm) signal generator configured to generate pwm signals, corresponding to the differential input signal pair, based on signals received from the loop filter, a driver configured to generate an output signal pair based on the pwm signals, a feedback circuit configured to feed back the output signal pair to the loop filter, and a common mode compensation circuit configured to compensate for a fluctuation in a common mode voltage of the fed-back output signal pair. the common mode compensation circuit generates a compensation voltage for each of a plurality of levels of the common mode voltage, and provides the generated compensation voltage to the loop filter.
Inventor(s): Jihyun Park of Suwon-si (KR) for samsung electronics co., ltd., Bilal Ahmad Janjua of Suwon-si (KR) for samsung electronics co., ltd., Chiweon Yoon of Suwon-si (KR) for samsung electronics co., ltd., Jungyu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/011, G05F1/46, G05F3/26, H03K3/0233
CPC Code(s): H03K3/011
Abstract: a method of generating clock signals includes: receiving a bandgap reference voltage from a bandgap reference circuit; generating a first current having a first curvature characteristic based on the bandgap reference voltage; generating a second current having a second curvature characteristic based on the bandgap reference voltage; generating a first complementary to absolute temperature (ctat) current by adding the first current to the second current; receiving a temperature-variable voltage and a temperature-fixed voltage from a voltage generator; generating an offset current based on the temperature-variable voltage and the temperature-fixed voltage; generating a reference current by adding the first ctat current to the offset current; and generating the clock signals by alternately discharging a first capacitor and a second capacitor based on the reference current, and charging the first capacitor and the second capacitor based on a power voltage.
Inventor(s): Chanyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jaehyouk CHOI of Daejeon (KR) for samsung electronics co., ltd., Junhyeok YANG of Suwon-si (KR) for samsung electronics co., ltd., Suneui PARK of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): H03K5/00, H03K3/03, H03K5/14, H03K19/20
CPC Code(s): H03K5/00006
Abstract: a frequency multiplier includes a first ring oscillator, a second ring oscillator that is turned on complementarily to the first ring oscillator, a combining circuit that combines a first output signal of the first ring oscillator and a second output signal of the second ring oscillator to generate a final output signal, and a calibration circuit that corrects a discontinuous pulse included in the final output signal based on feedback of the final output signal.
Inventor(s): Kwonjong LEE of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghyo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Minyoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyosang JU of Suwon-si (KR) for samsung electronics co., ltd., Jisang PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M13/13, H03M13/09, H03M13/29, H03M13/45
CPC Code(s): H03M13/13
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. an encoding method using a polar code in a wireless communication system, according to an embodiment of the present disclosure, may comprise: generating first cyclic redundancy check (crc) bits for a plurality of information bits to be transmitted, by the number of second bits that is less than the number of first bits determined so as to add a crc code with respect to the plurality of information bits; for vulnerable bits from among the plurality of information bits to be transmitted, generating second crc bits as many as bits corresponding to a difference between the number of first bits and the number of second bits; generating first encoded bits in which the information bits, the first crc bits, and the second crc bits are concatenated; and polar-encoding the first encoded bits.
Inventor(s): Dongil YANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Yohan MOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoseok NA of Gyeonggi-do (KR) for samsung electronics co., ltd., Jonghun YOO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H04B7/185
CPC Code(s): H04B1/006
Abstract: according to certain embodiments of the disclosure, a communication circuit of an electronic device, comprises: a plurality of antennas; an antenna switch configured to match a radio frequency (rf) signal of a designated frequency band with at least one antenna of the plurality of antennas; a first amplifier configured to amplify the rf signal in the designated frequency band, thereby resulting in a first amplified signal; a first antenna switch connected to the first amplifier; a first filter configured to allow the first amplified signal in the designated frequency band, the first filter connected to the antenna switch, wherein the first antenna switch is configured to selectively form a first connection path to the antenna switch via the first filter or a second connection path to the antenna switch bypassing the first filter; a second amplifier configured to amplify the radio frequency (rf) signal in the designated frequency band, thereby resulting in a second amplified signal; a second antenna switch connected to the second amplifier; a second filter configured to allow the rf signal in the designated frequency band, the second filter connected to the antenna switch, wherein the second antenna switch is configured to selectively form a third connection path to the antenna switch via the second filter or a fourth connection path to the antenna switch bypassing the first filter; and a processor configured to control the first antenna switch to form the second connection path and the second antenna switch to form the fourth connection path during communication with a satellite.
Inventor(s): Sunggun CHO of Gyeonggi-do (KR) for samsung electronics co., ltd., Jongkeun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Wonhee CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaehee KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Hwamok PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Minyee AN of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongik LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/3888, G06F1/16, H04B1/38, H04M1/02, H05K1/18
CPC Code(s): H04B1/3888
Abstract: disclosed is an electronic device includes a flexible circuit board passing via a first through-hole included in a first housing and a second through-hole included in a second housing, a first support bracket disposed to support the flexible circuit board while covering the first through-hole, a second support bracket disposed to support the flexible circuit board while covering the second through-hole, a first waterproof member disposed to face a partial area of the first through-hole from the first support bracket and inserted into the partial area of the first through-hole, a second waterproof member inserted into the remaining areas of the first through-hole, a third waterproof member disposed to face a partial area of the second through-hole from the second support bracket and inserted into the partial area of the second through-hole, a fourth waterproof member inserted into the remaining areas of the second through-hole.
Inventor(s): Namjun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/69
CPC Code(s): H04B1/69
Abstract: according to various embodiments, an electronic device may comprise a communication processor; an intermediate frequency integrated circuit (ific) to convert a baseband signal received from the communication processor into an intermediate frequency (if) signal; a radio frequency integrated circuit (rfic) convert the received if signal into a first radio frequency (rf) signal; an ultra-wideband (uwb) integrated circuit (ic) generating a uwb signal corresponding to a first frequency; at least one uwb antenna to transmit/receive the uwb signal corresponding to the first frequency; and at least one first switch connected between the uwb ic and the uwb antenna. the at least one first switch may be controlled so that the uwb signal corresponding to the first frequency, generated by the uwb ic, is transmitted to the rfic in a state in which a communication operation, for a signal transmitted/received from the communication processor, by the rfic is inactivated.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L1/00, H04W76/20
CPC Code(s): H04B7/0626
Abstract: a system and a method are provided for enhanced beam management framework for spatial and power domain adaptation in nes. a method performed by a terminal in a wireless communication system includes receiving, from a base station, control information preconfiguring the terminal with a set of csi-rs resources, wherein each csi-rs resource in the set of csi-rs resources is uniquely mapped to a powercontroloffsetss value; receiving a set of csi-rs signals; performing a measurement of each of the csi-rs signals of the set; and transmitting a csi report including the measurements of each of the csi-rs signals in the set.
Inventor(s): Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Bin YU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W8/22, H04W24/02, H04W80/02
CPC Code(s): H04B7/0626
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method comprises receiving, from a base station, configuration information on a channel state information (csi) report, wherein the configuration information includes information on one or more sub-configurations for the csi report, receiving, from the base station, a medium access control (mac) control element (ce) for activating at least one sub-configuration among the one or more sub-configurations and transmitting, to the base station, the csi report for the at least one sub-configuration based on the mac ce.
Inventor(s): Prasenjit CHAKRABORTY of Bangalore (IN) for samsung electronics co., ltd., Naveen KOLATI of Bangalore (IN) for samsung electronics co., ltd., Ravi SURANA of Bangalore (IN) for samsung electronics co., ltd., Siva Prasad GUNDUR of Bangalore (IN) for samsung electronics co., ltd., Srinidhi N of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04B7/185, G06T13/20, G06T13/40, G10L15/26, H04L65/1108
CPC Code(s): H04B7/18513
Abstract: a method for providing, by an electronic device, seamless connectivity in a call is provided. the method comprises transmitting satellite communication capability information and converter capability information to one or more other electronic devices; receiving the satellite communication capability information and the converter capability information from the one or more other electronic devices; establishing a call with the one or more other electronic devices using a non-satellite communication network; and transferring the call from the non-satellite communication network to a satellite communication network using the satellite communication capability information and the converter capability information of the electronic device and of the one or more other electronic devices, based on determining that state of the non-satellite communication network is not sufficient for continuing the call.
Inventor(s): Yungeun NAM of Suwon-si (KR) for samsung electronics co., ltd., Hobin SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyogyuem RHEW of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongshin SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B17/29, H04B17/19
CPC Code(s): H04B17/297
Abstract: a transceiver according to an aspect of the inventive concepts may include a transmitter, a first receiver pad configured to receive a first external voltage, a second receiver pad configured to receive a second external voltage, a receiver configured to generate a test target signal based on the first external voltage and the second external voltage, and a digital logic configured to perform a loopback test on a reception path of a data signal by transmitting the data signal and receiving the test target signal.
Inventor(s): Myeongjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Chulho Chung of Suwon-si (KR) for samsung electronics co., ltd., Eunsung Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W84/12
CPC Code(s): H04L5/0044
Abstract: provided is a method of operating a first apparatus in a wireless local area network (wlan) system, the method including receiving a multiple access point (map) network frame from a second apparatus, identifying a null data packet (ndp) transmission method for map sounding from the map network frame, and transmitting a first ndp to a third apparatus in association with transmission of a second ndp from the second apparatus to the third apparatus within an ndp transmission period based on an identified ndp transmission scheme.
Inventor(s): Kyunghwan MIN of Suwon-si (KR) for samsung electronics co., ltd., Sangho KIM of Suwon-si (KR) for samsung electronics co., ltd., Soomin LEE of Suwon-si (KR) for samsung electronics co., ltd., Sodam JU of Suwon-si (KR) for samsung electronics co., ltd., Jahoon JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L7/033, H04L7/00
CPC Code(s): H04L7/0337
Abstract: provided is a method of correcting a clock, the method including receiving a first clock, a second clock, a third clock, and a fourth clock, correcting each of a second rising edge of the second clock, a third rising edge of the third clock, and a fourth rising edge of the fourth clock based on a first rising edge of the first clock, and correcting each of a first falling edge of the first clock, a second falling edge of the second clock, a third falling edge of the third clock, and a fourth falling edge of the fourth clock based on a first rising edge of the first clock.
Inventor(s): Thejeswara Reddy POCHA of Bangalore (IN) for samsung electronics co., ltd., Tushar VRIND of Bangalore (IN) for samsung electronics co., ltd., Venkata Raju INDUKURI of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L9/08, H04L9/30
CPC Code(s): H04L9/0891
Abstract: a method of a decryptor including receiving, from an encryptor of an electronic device, a core dump that has been encrypted with a symmetric key generated by the encryptor, and core dump metadata, extracting crash metadata from the core dump metadata, transmitting the crash metadata to a remote key server for regenerating the symmetric key, obtaining, from the remote key server, a regenerated symmetric key based the crash metadata, and decrypting the core dump based on the regenerated symmetric key and the crash metadata.
Inventor(s): Sewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Woo NOH of Suwon-si (KR) for samsung electronics co., ltd., Yeongae YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/32, H04L9/08
CPC Code(s): H04L9/3268
Abstract: a method for verifying firmware includes verifying a firmware certificate of the firmware using a first public key, verifying validity of a second public key included in the firmware certificate in response to successful verification of the firmware certificate, verifying the firmware using the second public key in response to successful verification of validity of the second public key, and in response to successful verification of validity of the firmware, installing the firmware in memory of an electronic device to operate hardware of the electronic device according to the firmware.
Inventor(s): Federico PENNA of San Diego CA (US) for samsung electronics co., ltd., Hongbing CHENG of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L25/02
CPC Code(s): H04L25/0236
Abstract: a system and a method are disclosed for performing data-aided channel tracking for a subcarrier, including obtaining a reference channel estimate (ce) at a first time instance using a reference signal; determining, based on the obtained reference ce and based on received data symbols, a data-aided ce at a second time instance that is subsequent to the first time instance; and sequentially determining one or more additional data-aided ces, for one or more time instances subsequent to the second time instance, based on a data-aided ce obtained at a previous time instance and based on the received data symbols.
Inventor(s): Kyungrok LEE of Suwon-si (KR) for samsung electronics co., ltd., Hongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongsang YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/022
Abstract: an electronic device is provided. the electronic device includes a housing comprising a first housing and a second housing, a display including a first display area connected to the first housing, a second display area connected to the second housing, and a folding area located between the first display area and the second display area, a hinge connected to the first housing and the second housing, and a display support connected to the hinge and being configured to rotate based on a rotation of the hinge. the display support comprises a gear assembly connected to the hinge, a case structure including a first area, a second area, and a third area, the first area being connected to the gear assembly, the second area extending from the first area in a first direction and including a first support surface configured to face the folding area in an unfolded state of the electronic device, the third area extending from the first area in a second direction different from the first direction and including a second support surface configured to face the folding area in a folded state of the electronic device, and a deformable member disposed on the third area and being configured to contact the folding area.
Inventor(s): Jaehong JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Gyeongtae KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Yongseok LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinman KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Souksu JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyeyeong CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiwoo LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G03B17/56, H04N23/51
CPC Code(s): H04M1/0264
Abstract: an electronic device is disclosed herein. the device includes a housing including a first opening formed in a surface thereof, a camera at least partially disposed in the housing, such that a lens of the camera is aligned with the first opening, a camera bracket including a flange structure disposed in the housing and spaced apart from the surface of the housing at a predetermined interval, a protruding structure extending from the flange structure into a space defined between the camera and an inner wall of the first opening to surround at least part of the camera, wherein the flange structure includes a first through-hole, and the protruding structure includes a recess, and wherein the protruding structure and the inner wall of the first opening form a microphone hole in communication with the recess and part of the first opening, an adhesive member disposed between the flange structure and an inner surface of the housing, the adhesive member including a passage, wherein one side of the passage is connected to the recess, and an opposite side of the passage is connected to the first through-hole, and a microphone element disposed in the housing and aligned with the first through-hole.
Inventor(s): Juntaek KONG of Suwon-si (KR) for samsung electronics co., ltd., Seungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jongseong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N1/60, G06T7/10, G06T7/90, G06V10/56
CPC Code(s): H04N1/6066
Abstract: an image processing device includes a memory device that stores a color conversion module, and one or more processors that access the memory device and execute the color conversion module to calculate a color gamut of an input image and perform color conversion of the input image by applying different color conversion matrices according to the color gamut.
Inventor(s): Chulmok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31, G06F3/04847
CPC Code(s): H04N9/3188
Abstract: a projector includes: a user interface; an image emitter; a communicator; and at least one processor operatively connected with the user interface, the image emitter, and the communicator, wherein the at least one processor is configured to: generate a first edge blending screen and control the image emitter to output a projection image of the first edge blending screen, based on receiving a request to output a graphic user interface (gui) while the image emitter outputs the first edge blending screen, update a layout of the first edge blending screen, wherein the updated layout may include a first display area including the gui and a second display area including a first blending image, and wherein the first display area does not overlap the second display area, and control the image emitter to output a projection image of the first edge blending screen including the updated layout.
Inventor(s): Yowon Jeong of Suwon-si (KR) for samsung electronics co., ltd., Byeungwoo Jeon of Suwon-si (KR) for samsung electronics co., ltd., Jeeyoon Park of Suwon-si (KR) for samsung electronics co., ltd., Motong Xu of Suwon-si (KR) for samsung electronics co., ltd., Jeehwan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/124
CPC Code(s): H04N19/124
Abstract: an encoder and a video processing system including the encoder are provided. the encoder may include a quantization operation selection circuit configured to generate first data by performing a first quantization operation based on input data including image data of a frequency domain, to generate a feature value based on the first data, and to generate a control signal for selecting a second quantization operation or a rate-distortion optimized quantization (rdoq) operation based on a machine learning model trained based on training data that includes the feature value. additionally, the encoder may include a quantizer configured to perform the second quantization operation or the rdoq operation based on the control signal and to generate output data (e.g., after performing the second quantization operation or the rdoq operation).
Inventor(s): Hee-ran LEE of Suwon-si (KR) for samsung electronics co., ltd., Hee-seob RYU of Hwaseong-si (KR) for samsung electronics co., ltd., Sung-wook CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sung-pil HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/422, G06F3/16, G10L15/22, G10L15/26, H04N21/431, H04N21/439, H04N21/462, H04N21/472, H04N21/482, H04N21/643, H04N21/658
CPC Code(s): H04N21/42203
Abstract: a display apparatus, including a microphone configured to receive a voice signal and a controller configured to generate a resulting screen corresponding to the voice signal different from a first displayed screen and according to a status of the content of the first displayed screen; to display the resulting screen on the display. accordingly, the display apparatus provides a different resulting screen according to a status of the display apparatus.
Inventor(s): Ki-moon KWON of Incheon (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/431, G08C17/02, H03J1/00, H04N21/422, H04N21/482
CPC Code(s): H04N21/4312
Abstract: a remote controller includes a touch screen, a communicator, and a processor. the processor controls control a first user interface to be displayed on the touch screen, identifies a signal which is received through the communicator while the first user interface is displayed on the touch screen, and controls a second user interface to be displayed on the touch screen based on the received signal. the second user interface performs a function which is different from that of the first user interface.
Inventor(s): Jongin LEE of Suwon-si (KR) for samsung electronics co., ltd., Sehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwansik YANG of Suwon-si (KR) for samsung electronics co., ltd., Kilsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/466, G06F3/14, G06V10/82, G06V30/19, G06V30/42, H04N21/4363, H04N21/443
CPC Code(s): H04N21/4666
Abstract: according to various embodiments, a display device and an operation method thereof are disclosed. the disclosed display device includes: a display, an input/output interface comprising circuitry, a communication interface comprising communication circuitry, a memory in which one or more instructions are stored, and at least one processor, comprising processing circuitry, individually and/or collectively, configured to execute the one or more instructions stored in the memory to cause the display device to: display an image screen received from an electronic device connected to the display device, determine whether execution of content starts by analyzing the displayed image screen using a first neural network model, call a second neural network model based on determining that the execution of the content starts, obtain attribute information of the content by analyzing the image screen of the content using the second neural network model, and control an execution environment of the content based on the obtained attribute information.
Inventor(s): Hyunje CHO of Gyeonggi-do (KR) for samsung electronics co., ltd., Kichul NAMGUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Yoobong CHUN of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunggeun JOO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/57, G06F21/31, H04N23/51
CPC Code(s): H04N23/57
Abstract: an electronic device according to various embodiments of the present invention comprises: a housing; at least one camera disposed inside the housing; at least one door unit disposed between the housing and a lens of the at least one camera and a driving unit configured to slide the door unit such that the lens of the at least one camera can open/close, wherein the driving unit can comprise a linear actuator moving linearly according to an application of voltage. other embodiments in addition to the various embodiments of the present invention are possible.
Inventor(s): Raj Narayana GADDE of Bengaluru (IN) for samsung electronics co., ltd., Sarvesh of Bangaluru (IN) for samsung electronics co., ltd., Yathish Reddy of Bangaluru (IN) for samsung electronics co., ltd., Addanki Sankara Rao of Bengaluru (IN) for samsung electronics co., ltd., Pravin Ramachandran Nair of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04N23/68, H04N5/262, H04N23/65, H04N23/81
CPC Code(s): H04N23/683
Abstract: a method may comprise detecting at least one motion of the electronic device while capturing a plurality of media frames, determining a type of the at least one motion of the electronic device while capturing the plurality of media frames, determining a variation in the type of the at least one motion of the electronic device over a pre-determined period of time, selecting at least one stabilization procedure from a plurality of stabilization procedures and a frame fusion procedure from a plurality of frame fusion procedures based on the type of the at least one motion of the electronic device and the variation in the type of the at least one motion of the electronic device, and stabilizing, after the capturing of the plurality of media frames, the plurality of media frames based on the at least one selected stabilization procedure and the selected frame fusion procedure.
Inventor(s): Wooyong LEE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangkyu PARK of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Daehyun SUNG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jonghoon WON of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/90, G06F1/16, H04N23/57
CPC Code(s): H04N23/90
Abstract: according to various embodiments of the present disclosure, an electronic device comprises: a display including a light transmitting area and a drawing area surrounding the light transmitting area; a first camera disposed below the light transmitting area when looking at the light transmitting area from above the display; a processor operatively coupled to the display and the first camera; and a memory operatively coupled to the processor. the processor may be configured to store an application in the memory and draw a pattern on the drawing area on the basis of an execution state of the application. various other embodiments are also possible.
Inventor(s): Kiwook HAN of Suwon-si (KR) for samsung electronics co., ltd., Sungjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Chulhan KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/10, H02J7/00
CPC Code(s): H04R1/1025
Abstract: an example electronic device includes a temperature sensor, a battery, a communication circuit, a connecting terminal, a processor, and a memory. the memory stores instructions which, when executed, cause the processor to control the electronic device to determine whether the connecting terminal is electrically connected with the external electronic device, measure a first temperature around the electronic device, receive first battery state information from the external electronic device, based on the measured first temperature being greater than a specified temperature, determine a first charging state of the battery of the external electronic device, and transmit a first signal for controlling the charging state of the battery of the external electronic device to be less than a first specified level, based on determining that the first charging state of the battery of the external electronic device is greater than or equal to the first specified level.
Inventor(s): Hanki KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Haekwang PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04S3/00, G06F3/16, H04R5/02, H04R5/04
CPC Code(s): H04S3/008
Abstract: disclosed are a transmission device, a reception device, and a control method. the transmission device comprises: a communication interface comprising circuitry and at least one processor, comprising processing circuitry, wherein at least one processor, individually and/or collectively, is configured to: from among audio signals of a plurality of channels including a left channel, a sub-left channel, a right channel, a sub-right channel, and a woofer channel, separates the audio signals of the sub-left channel and the sub-right channel into a high-pass audio signal and a low-pass audio signal, respectively, on the basis of a frequency band; mixes the high-pass audio signal of the sub-left channel and the high-pass audio signal of the sub-right channel with the audio signal of the woofer channel; mixes the low-pass audio signal of the sub-left channel with the audio signal of the left channel; mixes the low-pass audio signal of the sub-right channel with the audio signal of the right channel; and control the communication interface to transmit the audio signals of the mixed woofer channel, the mixed left channel, and the mixed right channel to the reception device.
Inventor(s): Sunil Bharitkar of Stevenson Ranch CA (US) for samsung electronics co., ltd., Ricardo Thaddeus Páez Amaro of Puebla (MX) for samsung electronics co., ltd., Carlos Tejeda Ocampo of Tuxtla Gutierrez (MX) for samsung electronics co., ltd., Luis Madrid Herrera of Chihuahua (MX) for samsung electronics co., ltd.
IPC Code(s): H04S7/00, H04S3/00
CPC Code(s): H04S7/307
Abstract: one embodiment provides a computer-implemented method that includes determining directional sounds from a content mix using a machine learning unmixing model. the directional sounds are panned in an upmixed signal. signal-dependent upmixing gains for specific frequency bins are computed on a frame-basis using a machine learning model for the upmixed signal. dedicated voice clarity gains are computed using a hearing impairment model for multiple hearing-impaired profiles for achieving dialog enhancement. the signal dependent upmixing gains and voice clarity gains are transmitted as metadata with a downmixed signal representing the content mix.
Inventor(s): Min-Ho KANG of Suwon-si (KR) for samsung electronics co., ltd., Jinhyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Ye-Ji YOON of Suwon-si (KR) for samsung electronics co., ltd., Jun-Hak LIM of Suwon-si (KR) for samsung electronics co., ltd., Wontae CHAE of Suwon-si (KR) for samsung electronics co., ltd., Jongmu CHOI of Gunpo-si (KR) for samsung electronics co., ltd., Bokun CHOI of Seoul (KR) for samsung electronics co., ltd., Doo-Suk KANG of Suwon-si (KR) for samsung electronics co., ltd., Sun-Kee LEE of Seongnam-si (KR) for samsung electronics co., ltd., Moonsoo KIM of Seoul (KR) for samsung electronics co., ltd., Eun Jung HYUN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/065, G06Q20/32, G06Q20/38, G06Q20/40, H04W12/069, H04W48/02
CPC Code(s): H04W12/065
Abstract: various example embodiments of the disclosure relate to an electronic device and a wireless communication connection control method thereof. the method may include: receiving and storing at least one first account information stored in at least one server from a first electronic device; broadcasting a beacon signal including an indicator indicating that a wifi access is granted based at least in part on account information related to the server; receiving at least one second account information from a neighboring electronic device which has received the beacon signal; determining whether the second account information is related to the first account information, based at least in part on data to be exchanged with the server; and upon determining that the second account information is related to the first account information, granting the neighboring electronic device an access to the access point in order to use the internet, without having to request for credential information from the neighboring electronic device.
Inventor(s): Donggun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Soenghun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L5/00, H04W52/02, H04W72/0453, H04W76/27
CPC Code(s): H04W24/10
Abstract: a method performed by a user equipment (ue) in a wireless communication system includes receiving, from a base station, a first activation/deactivation medium access control (mac) control element (ce), the first activation/deactivation mac ce including a first field for indicating an activation/deactivation status of a secondary cell (scell), wherein, in case that the first field is set to 1 and the scell is in an activated state or a deactivated state, the scell is activated, wherein, in case that the first field is set to 1 and the scell is in a dormant state, the first field is ignored, and wherein, in case that the first field is set to 0, the scell is deactivated.
Inventor(s): Jinho CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongmyung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Younggyoun MOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungsoo JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunwoo CHO of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiyoung CHA of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/06
CPC Code(s): H04W28/06
Abstract: the present disclosure relates to: a communication technique merging iot technology with a 5g communication system for supporting a data transmission rate higher than that of a 4g system; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail, security- and safety-related services, and the like) on the basis of 5g communication technology and iot-related technology. the present disclosure provides a method for introducing a service based interface (sbi) even to a base station in a wireless communication system.
Inventor(s): Aneesh Narendra DESHMUKH of Bangalore (IN) for samsung electronics co., ltd., Nayan OSTWAL of Bangalore (IN) for samsung electronics co., ltd., Neha SHARMA of Bangalore (IN) for samsung electronics co., ltd., Mahantesh KOTHIWALE of Bangalore (IN) for samsung electronics co., ltd., Anshuman NIGAM of Bangalore (IN) for samsung electronics co., ltd., Mayank SONU of Bangalore (IN) for samsung electronics co., ltd., Jiyoung CHA of Suwon-si (KR) for samsung electronics co., ltd., Dongmyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/06
CPC Code(s): H04W28/065
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a method for handling segmentation in a converged layer 2 (l2) communication network is provided. the method includes assigning, by a converged l2 of a transmitter, a l2 sequence number (sn) to a protocol data unit (pdu). the l2 sn includes at least one of a last segment indication (lsi) indicating a presence of a last service data units (sdu) of the complete pdu, a length indicator exist (lie) indicating a presence of a length indicator (li) after a l2 header, or a si indicating a segmentation status or stage of the complete pdu, receiving, by a medium access control (mac) layer of the transmitter, a grant opportunity or a transmission opportunity for transferring the pdu available at the converged l2, and sending the pdu to a lower layer of the transmitter for transmission to a receiver with or without segmentation based on the grant or a transmission opportunity.
Inventor(s): Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Xiaoning MA of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04W24/10, H04W36/08
CPC Code(s): H04W36/305
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides a method for supporting self-configuration and self-optimization in a wireless communication system.
Inventor(s): Jiyoung CHA of Suwon-si (KR) for samsung electronics co., ltd., Sunhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongmyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W28/02, H04W76/11
CPC Code(s): H04W48/16
Abstract: the disclosure relates to 5th generation (5g) or 6th generation (6g) communication systems. a method performed by a first network entity in a wireless communication system is provided. the method includes receiving a request for supporting a computing service for an operation of an application executed in a user equipment (ue) and status information of the ue from the ue, transmitting requirement information related to the request for supporting the computing service and a request for discovering a computing server to a network repository function (nrf), receiving information on a second network entity connected to a computing server from the nrf, receiving status information of the computing server from the second network entity, determining a computing server and a computing configuration for supporting the operation of the application, transmitting a data network access identifier (dnai) of the computing server and information on the computing configuration.
Inventor(s): Hyoungjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Junsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Minho YANG of Suwon-si (KR) for samsung electronics co., ltd., Taeyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Euichang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Chaeman LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04B7/06, H04B17/318, H04W52/52, H04W56/00, H04W76/28
CPC Code(s): H04W52/0235
Abstract: an electronic device and a method of operating the same are provided. the electronic device includes an antenna module, a first communication module configured to transmit and receive a signal to and from a base station through the antenna module, memory storing one or more computer programs, and one or more processors communicatively coupled to the first communication module, the antenna module, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to identify a reception timing of a wake up signal based on wake up signal configuration information received from the base station, select one of transmission beams of the base station and one of reception beams of the electronic device as a beam pair, measure a reception strength of the selected transmission beam of the beam pair using the selected reception beam of the beam pair in a synchronization signal block (ssb) burst period before the reception timing arrives, stabilize a synchronization loop including at least one radio frequency (rf) element through an ssb of the selected transmission beam of the beam pair, detect the wake up signal transmitted from the base station at the reception timing, and determine whether to perform a beam searching operation based on the measured reception strength and a reception strength of the wake up signal.
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04W24/10, H04W74/0833, H04W80/02
CPC Code(s): H04W56/0015
Abstract: a method performed by a first node in a wireless communication system is provided. the method includes receiving, from a base station, a configuration message including layer 1/layer 2 (l1/l2) triggered mobility (ltm) candidate information associated with a ltm candidate cell, wherein the ltm candidate information includes first information on an early uplink (ul) synchronization procedure; performing the early ul synchronization procedure with the ltm candidate cell based on the ltm candidate information; performing a l1 measurement on the ltm candidate cell; and transmitting, to the base station, a report message for the l1 measurement.
Inventor(s): Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd., Youngkyo BAEK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W60/00, H04W48/08
CPC Code(s): H04W60/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide a method for selecting correct smf for snpn onboarding of a ue () by a nrf apparatus (). the method includes receiving a nf profile from a smf apparatus of a plurality of smf apparatuses (and ). further, the method includes receiving a discovery message for smf supporting the snpn onboarding service and at least one of dnn service and s-nssai service from an amf apparatus (). further, the method includes selecting the at least one apparatus of the plurality of smf apparatuses (and ) supporting the snpn onboarding service and at least one of the dnn service and the s-nssai service based on the nf profile received from each smf sever of the plurality of smf apparatuses (and ). further, the method includes sending the at least one selected smf apparatus to the amf apparatus ().
Inventor(s): Yaser Mohamed Mostafa Kamal FOUAD of San Diego CA (US) for samsung electronics co., ltd., Yuhan ZHOU of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00, H04W72/25
CPC Code(s): H04W64/00
Abstract: a method and a device are provided in which a request for positioning assistance is received from a ue in a dedicated field of sidelink (sl) control information (sci). a request for assistance in selecting resources for sl-positioning reference signal (prs) transmission is transmitted to the ue. a set of one or more preferred or non-preferred resources for sl-prs transmission is received from the ue. resources for the sl-prs transmission are selected based on at least the set of one or more preferred or non-preferred resources.
Inventor(s): Yuhan ZHOU of San Diego CA (US) for samsung electronics co., ltd., Yaser FOUAD of San Diego CA (US) for samsung electronics co., ltd., Philippe SARTORI of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00, H04W72/23
CPC Code(s): H04W64/00
Abstract: a system and a method are disclosed for transmission of 5g side link positioning reference signals (sl-prs) while in 5g side link mode 2 (for example, v2x). using a shared resource pool and no data transmission, a ue determines three parameters (time, frequency, and prs index) for transmission of a prs using a comb structure. using a dedicated resource pool with data transmission, the ue populates a time frequency grid for slot transmission so that prs does not conflict with demodulation reference signals (dmrs).
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/00, H04W24/08, H04W56/00, H04W72/0446, H04W72/23, H04W76/28
CPC Code(s): H04W68/005
Abstract: a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot) are provided. the t disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the disclosure provides a method and an apparatus for determining paging occasions (po).
Inventor(s): Sundo KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwonjong LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04L5/00, H04W72/232
CPC Code(s): H04W72/0446
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure relates to a method and device for efficiently configuring/allocating resources in a wireless communication system supporting a plurality of multiplexing schemes. a method for configuring fd resources by a base station in a wireless communication system supporting a plurality of multiplexing schemes includes transmitting configuration information including a number of contiguous slots with at least one physical resource block (prb) configurable in a frequency domain and information about a start slot among the contiguous slots, and transmitting information indicating at least one resource to be allocated to a ue based on the configuration information.
Inventor(s): Gibum KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwonjong LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangwon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0453, G01S7/00, H04W72/11
CPC Code(s): H04W72/0453
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate than 4g communication systems such as lte systems. a method by a base station in a wireless communication system may comprise transmitting, to a user equipment (ue), sensing configuration information for a sensing operation; transmitting a first sensing signal for the sensing operation based on the sensing configuration information; and receiving a second sensing signal reflected from a target based on the sensing configuration information and obtaining sensing data based on the second sensing signal, wherein the sensing configuration information includes resource allocation information for the sensing operation.
Inventor(s): Jaeyeon SHIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyungjun CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyemin CHOE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04L1/00, H04W72/0453, H04W72/232
CPC Code(s): H04W72/1273
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a 5g or pre-5g communication system provided to support a higher data transmission rate than a 4g communication system such as lte. a pdsch scheduling method in a wireless communication system includes interpreting scheduling information with reference to information associated with an uplink subband, when a ue receives a pdsch from a base station, by interpreting the size of a scheduled prb and a bandwidth part size which are appropriate for full-duplex communication. a method of determining a prg grid and a prb bundling size which are appropriate for full-duplex communication when a ue receives a pdsch from a base station includes receiving, from a bs, subband frequency information related to 95frequency domain resource allocation for an ul subband, receiving, from the bs, dc related to frequency domain resource allocation for a pdsch, identifying a prg including at least one prb for the pdsch based on the subband frequency information and the dci, and receiving, from the bs, the pdsch based on the prg.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04L5/14, H04W72/0446
CPC Code(s): H04W72/232
Abstract: methods and apparatuses for physical downlink control channel (pdcch) monitoring adaptation. a method for a user equipment (ue) includes receiving first and second sets of parameters for reception of first and second pdcchs associated with first and second subsets of slots, respectively, on a cell and receiving a first pdcch from the first pdcchs that provides a downlink control information (dci) format. the dci format indicates skipping receptions of the second pdcchs for a time duration. the method further includes skipping, based on the field, receptions of the second pdcchs at a first occasion that is after reception of the first pdcch and before an end of the time duration. the second subset of slots includes resources indicated for simultaneous transmission and reception and the first subset of slots does not.
Inventor(s): Alexei Vladimirovich DAVYDOV of Saratov (RU) for samsung electronics co., ltd., Dmitry Sergeyevich DIKAREV of Saratov (RU) for samsung electronics co., ltd., Gregory Aleksandrovich ERMOLAEV of Saratov (RU) for samsung electronics co., ltd., Gregory Vladimirovich MOROZOV of Saratov (RU) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04L5/00, H04W74/00
CPC Code(s): H04W74/0833
Abstract: the disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a communication method performed by a user equipment (ue) during a network communication procedure is provided. the communication method includes transmitting a random access preamble, receiving a modified random access response (rar) comprising a sounding reference signal (srs) request field whose value indicates whether the ue should transmit the srs, when the srs request field value indicates that the ue should transmit the srs, transmitting the srs, and receiving one or multiple subsequent downlink (dl) transmissions with adaptive spatial signal processing performed on the basis of a channel state information (csi) acquired on the basis of measurements of the srs.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Seungbeom JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W8/22
CPC Code(s): H04W74/0875
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, configuration information for an application layer measurement reporting; generating, based on the configuration information, a medium access control (mac) protocol data unit (pdu) including a mac service data unit (sdu) for an application layer measurement report message; in case that an uplink (ul) grant for the mac pdu is associated with a shared spectrum, determining a channel access priority class (capc) of the mac pdu based on a capc for a logical channel (lch) of signaling radio bearer 4 (srb4); and transmitting, to the base station, the mac pdu after a channel access procedure based on the capc of the mac pdu.
Inventor(s): Gupil CHEONG of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyungseoung YOO of Suwon-si (KR) for samsung electronics co., ltd., Juyeon JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/10
CPC Code(s): H04W76/10
Abstract: a first electronic device may include a communication circuit and at least one processor. the at least one processor may be configured to: establish a ble communication link with a second electronic device; on the basis of the ble communication link, identify a physical layer transmission scheme (phy) change policy indicating a change in the phy, the phy being used in a cis link for an audio service between the first electronic device and the second electronic device; initiate the cis link according to the phy change policy; determine a phy for a first time interval of the cis link, as a first phy on the basis of the phy change policy; transmit a first audio packet generated using the first phy to the second electronic device in the first time interval through the cis link; determine a phy for a second time interval of the cis link, as a second phy on the basis of the phy change policy; and transmit a second audio packet generated using the second phy to the second electronic device in the second time interval through the cis link.
Inventor(s): Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/15
CPC Code(s): H04W76/15
Abstract: the present disclosure relates to a method performed by a user equipment (ue) connected to a base station including at least one distributed unit (du) in a wireless communication system, the method including obtaining uplink data, and receiving downlink data from the base station or transmitting uplink data to the base station via at least one cell corresponding to the at least one du.
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/28
CPC Code(s): H04W76/28
Abstract: methods and apparatuses for configuration and activation of cell discontinuous transmission (dtx) and cell discontinuous reception (drx). a method performed by a user equipment (ue) includes receiving first information related to a set of parameters associated with cell dtx or drx on a cell, second information related to an indication for activation or deactivation of the cell dtx or drx, and the indication for activation or deactivation of the cell dtx or drx. the indication is provided by a downlink control information (dci) format or a radio resource control (rrc) message. the method further includes determining one of an active period and a non-active period of the cell dtx or drx based on the indication for activation or deactivation of cell dtx or drx, respectively, and receiving or transmitting channels or signals on the cell based on the determined active and non-active periods of the cell dtx or drx, respectively.
Inventor(s): Sungeun JO of Suwon-si (KR) for samsung electronics co., ltd., Byungwoo BANG of Suwon-si (KR) for samsung electronics co., ltd., Junyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Wooseok CHANG of Suwon-si (KR) for samsung electronics co., ltd., Hun Seong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20
CPC Code(s): H05K7/20281
Abstract: an immersion cooling system including an electronic device including a plurality of boards, the electronic device being configured in the immersive cooling system to be immersed in refrigerant that a reservoir is configured to accommodate, a pump array including a plurality of pumps disposed inside the reservoir, each pump of the plurality of pumps configured to individually generate a flow of the refrigerant by performing a discharging of the refrigerant, and a controller, the controller being configured to individually control an operation of each pump of the plurality of pumps, determine a board of the plurality of boards that requires cooling, identify a pump corresponding to the determined board among the plurality of pumps, and increase a flow quantity of the refrigerant discharged from the identified pump.
20240268098. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongsik KONG of Suwon-si (KR) for samsung electronics co., ltd., Jihye KWON of Suwon-si (KR) for samsung electronics co., ltd., Junbum LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungho JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/66, H01L29/78
CPC Code(s): H10B12/315
Abstract: a semiconductor device includes a first active pattern protruding from a substrate; a gate structure including a gate insulation layer and a gate pattern laterally stacked on a first sidewall of the first active pattern, the gate pattern facing the first sidewall of the first active pattern and extending a first direction parallel to an upper surface of the substrate; and first conductive patterns contacting the gate insulation layer and protruding from a sidewall of the gate structure. the first conductive patterns may be disposed to face second and third sidewalls in the first direction of the first active pattern, and first conductive patterns may be spaced apart from the first active pattern.
Inventor(s): SangJae PARK of Suwon-si (KR) for samsung electronics co., ltd., Seung-Bo KO of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung KIM of Suwon-si (KR) for samsung electronics co., ltd., Taejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Chan-Sic YOON of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Myeong-Dong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hongjun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes first and second active patterns extending in a first direction and being adjacent to each other in a second direction, the first and second active patterns, each of which includes first and second edges spaced apart from each other in the first direction, a first storage node pad and a first storage node contact sequentially provided on the first edge of the first active pattern, a second storage node pad and a second storage node contact sequentially provided on the second edge of the second active pattern, and a fence pattern between the first and the second storage node contacts. bottom and top surfaces of the first storage node contact are located at first and second levels, respectively. in a third direction, a width of the fence pattern at the first level is less than a width of the fence pattern at the second level.
Inventor(s): Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Seung-Bo KO of Suwon-si (KR) for samsung electronics co., ltd., Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung KIM of Suwon-si (KR) for samsung electronics co., ltd., SangJae PARK of Suwon-si (KR) for samsung electronics co., ltd., Taejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Chan-Sic YOON of Suwon-si (KR) for samsung electronics co., ltd., Myeong-Dong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hongjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Minju KANG of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: a semiconductor device includes first and second active patterns extending in a first direction and arranged in a second direction intersecting the first direction, each of the first and second active patterns including first and second edge portions spaced apart from each other in the first direction, a first storage node pad and a first storage node contact sequentially provided on the first edge portion of the first active pattern, and a second storage node pad and a second storage node contact sequentially provided on the second edge portion of the second active pattern. each of the first and second storage node contacts includes a metal material.
20240268103. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: a semiconductor device includes a first active pattern protruding from a substrate and extending in a first direction parallel to an upper surface of the substrate; first and second recesses crossing the first active pattern in a second direction perpendicular to the first direction; a first gate structure in the first recess, and including a first gate oxide layer, a first gate pattern and a first capping pattern; a second gate structure in the second recess, and including a second gate oxide layer, a second gate pattern and a second capping pattern; a first metal liner pattern surrounding a portion of a sidewall of the first active pattern, and directly contacting a sidewall of the first gate pattern; and a second metal liner pattern surrounding a portion of the sidewall of the first active pattern, and directly contacting a sidewall of the second gate pattern.
Inventor(s): Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho JANG of Suwon-si (KR) for samsung electronics co., ltd., Jiseok KWON of Suwon-si (KR) for samsung electronics co., ltd., Haein JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seungho HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes: a substrate including a cell region and a peripheral circuit region; an active region; a cell word line extending across the active region in a first horizontal direction within the cell region; a cell bit line extending in a second horizontal crossing the first horizontal direction in the cell region; a peripheral circuit gate structure extending in the second horizontal direction on the substrate; a peripheral circuit spacer structure disposed on a sidewall of the peripheral circuit gate structure; a peripheral circuit etch stop layer disposed on the substrate, and separated from the peripheral circuit gate structure and the peripheral circuit spacer structure; and a peripheral circuit contact connected to the substrate by penetrating the peripheral circuit etch stop layer. the peripheral circuit etch stop layer has an end portion positioned between the peripheral circuit contact and the peripheral circuit spacer structure.
20240268110. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yoo-Cheol Shin of Suwon-si (KR) for samsung electronics co., ltd., Young-Woo Park of Suwon-si (KR) for samsung electronics co., ltd., Jae-Duk Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/20, H01L29/66, H01L29/788, H01L29/792, H10B41/20, H10B41/27, H10B41/40, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): H10B43/20
Abstract: a semiconductor device includes a peripheral circuit region on a substrate, a polysilicon layer on the peripheral circuit region, a memory cell array region on the polysilicon layer and overlapping the peripheral circuit region, the peripheral circuit region being under the memory cell array region, an upper interconnection layer on the memory cell array region, and a vertical contact through the memory cell array region and the polysilicon layer, the vertical contact connecting the upper interconnection layer to the peripheral circuit region.
Inventor(s): Sanghun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyung Taek CHO of Suwon-si (KR) for samsung electronics co., ltd., Donghyuck JANG of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/40
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a circuit region, a peripheral circuit structure on a first substrate; a cell region on the circuit region, a cell array region and connection region, the cell region including a second substrate; gate stacking structure on the second substrate, a lower structure, upper structures including gate electrodes; a channel structure penetrating the gate stacking structure; a gate contact penetrating the gate stacking structure electrically connected to the circuit region, and to a connection gate electrode insulated from a gate electrode by an insulating pattern between the gate electrode and the gate contact; a boundary insulating pattern partially formed in a boundary gate electrode among the gate electrodes of the lower structure adjacent to a boundary portion between the upper and lower structure surrounding the gate contact to maintain an electrical connection path of the boundary gate electrode and having a different structure from the insulating pattern.
Inventor(s): Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Hanjin LIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/30, H10B53/40
CPC Code(s): H10B53/30
Abstract: a semiconductor device includes gate structure, bit line structure, contact plug structure, stack structure, and capacitor. the gate structure is disposed on first substrate. the bit line structure is disposed on the gate structure. the contact plug structure is disposed on the first substrate and spaced apart from the bit line structure. the stack structure is disposed on the bit line structure and the contact plug structure, and may include insulation layers and plate electrodes alternately stacked in a vertical direction substantially perpendicular to an upper surface of the first substrate. the capacitor includes a second electrode extending through the stack structure and contacting the contact plug structure. a ferroelectric pattern is disposed on a sidewall of the second electrode. first electrodes are disposed on a sidewall of the ferroelectric pattern, contact sidewalls of the plate electrodes, respectively, and are spaced apart from each other in the vertical direction.
20240268129. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokhan PARK of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jay-Bok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyungeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: disclosed are semiconductor devices and their fabrication methods. the semiconductor device comprises a lower substrate, a lower dielectric structure on the lower substrate, a memory cell structure between the lower substrate and the lower dielectric structure, a lower bonding pad in the lower dielectric structure, an upper dielectric structure on the lower dielectric structure, an upper substrate on the upper dielectric structure, a transistor between the upper substrate and the upper dielectric structure, and an upper bonding pad in the upper dielectric structure. a top surface of the lower bonding pad is in contact with a bottom surface of the upper bonding pad. the lower bonding pad and the upper bonding pad overlap the memory cell structure.
20240268130. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyungeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: disclosed are semiconductor devices and their fabrication methods. the semiconductor device includes a lower bonding structure that includes a lower substrate, a lower dielectric structure on the lower substrate, and a transistor between the lower substrate and the lower dielectric structure, an upper bonding structure that includes an upper dielectric structure on the lower dielectric structure, an upper substrate on the upper dielectric structure, and a memory cell structure between the upper substrate and the upper dielectric structure, a connection structure on the upper bonding structure, and a first through via that electrically connects the transistor to the memory cell structure. the transistor overlaps the memory cell structure. the first through via penetrates the upper substrate and the upper dielectric structure.
Inventor(s): Taehong KWON of Suwon-si (KR) for samsung electronics co., ltd., Daeseok BYEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, G11C16/30, H01L23/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: a memory device, including a first chip including a memory cell array; and a second chip bonded to the first chip and including a voltage generator configured to generate a voltage which is supplied to the memory cell array, wherein the second chip comprises a bonding pad connected to the voltage generator and bonded to an external charge pump.
Inventor(s): Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Taekjung Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyungjun Kim of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si (KR) for samsung electronics co., ltd., Youngki Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/12, H10K50/15, H10K50/16, H10K50/17, H10K50/18
CPC Code(s): H10K50/12
Abstract: a light-emitting device and an electronic apparatus including the same. the light-emitting device includes a first electrode, a second electrode facing the first electrode, and an interlayer arranged between the first electrode and the second electrode, the interlayer includes a first emission layer and a second emission layer, the first emission layer includes a first host and a first dopant capable of emitting a first light, the first host includes m1 hosts, m1 is an integer of 1 or more, and when m1 is 2 or more, two or more hosts are present in the first emission layer and are different from the other, the second emission layer includes a second host and a second dopant capable of emitting a second light, the second host includes m2 hosts, m2 is an integer of 1 or more, and when m2 is 2 or more, two or more hosts are present in the second emission layer and are different from the other, the first dopant includes a first transition metal, the second dopant includes a second transition metal different from the first transition metal, and expression 1 and expression 2 are satisfied and provided in the present specification.
Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- Samsung Electronics Co., Ltd.
- B24B37/015
- CPC B24B37/015
- Samsung electronics co., ltd.
- C02F11/10
- C02F11/12
- C02F103/00
- CPC C02F11/10
- C09K5/08
- F25D23/06
- CPC C09K5/08
- C09K13/08
- H01L21/306
- CPC C09K13/08
- C12C13/10
- C12G3/02
- CPC C12C13/10
- D06F33/37
- D06F33/36
- D06F33/38
- D06F33/47
- D06F34/22
- D06F103/04
- D06F103/08
- D06F103/12
- D06F103/20
- D06F103/68
- D06F105/42
- D06F105/52
- D06F105/62
- G05B13/02
- CPC D06F33/37
- D06F39/02
- CPC D06F39/02
- F24F1/027
- F24F1/031
- F24F1/26
- CPC F24F1/027
- F24F8/167
- F24F8/192
- CPC F24F8/167
- F24F13/28
- F24F13/10
- G03F7/00
- CPC F24F13/28
- G01N35/10
- G01N33/18
- G01N35/08
- CPC G01N35/1095
- G01S7/35
- G01S13/32
- CPC G01S7/352
- G01S13/58
- G01S7/481
- G01S13/34
- G01S13/931
- G01S13/933
- G01S13/937
- G01S17/58
- CPC G01S13/583
- G02B6/42
- CPC G02B6/428
- G03F1/66
- CPC G03F1/66
- G05D1/229
- G05D1/243
- CPC G05D1/2295
- G05D1/698
- CPC G05D1/6985
- G06F3/041
- F25D11/00
- F25D23/02
- F25D27/00
- CPC G06F3/0412
- G06F3/0481
- G06F1/16
- CPC G06F3/0481
- G06F3/06
- CPC G06F3/0619
- CPC G06F3/0655
- CPC G06F3/0659
- G06F9/48
- G06F9/30
- CPC G06F9/4812
- G06F9/38
- CPC G06F9/4881
- G06F12/02
- CPC G06F12/0246
- G06F12/0882
- G06F13/16
- G06F16/11
- G06F16/22
- CPC G06F12/0253
- G06F16/182
- G06F16/185
- G06F16/27
- CPC G06F16/1844
- G06F30/392
- G06F30/398
- G06F111/04
- H01L27/02
- CPC G06F30/392
- G06F30/3953
- G03F1/36
- CPC G06F30/3953
- G06T3/4046
- G06N3/04
- G06N3/08
- G06T9/00
- CPC G06T3/4046
- G06T3/4053
- G06T11/60
- G02B27/01
- G06F3/01
- G06V10/25
- G06V40/20
- CPC G06T11/60
- G06T13/40
- G06F3/0482
- G06F3/04845
- G06F3/04883
- H04L65/401
- H04N23/63
- CPC G06T13/40
- G06T19/00
- G06F3/0346
- CPC G06T19/006
- G06V10/774
- G06T15/20
- G06T19/20
- CPC G06V10/774
- G09G3/00
- H01L25/075
- H01L33/38
- H01L33/62
- CPC G09G3/006
- G09G5/12
- G09G5/00
- CPC G09G5/12
- G10L15/22
- G10L15/08
- G10L17/22
- CPC G10L15/22
- G10L21/0232
- G10L21/0208
- G10L21/0216
- G10L21/0364
- G10L25/21
- H04M1/60
- H04M9/00
- CPC G10L21/0232
- G11C8/18
- CPC G11C8/18
- G11C15/04
- CPC G11C15/046
- G11C16/30
- G11C16/04
- G11C16/24
- CPC G11C16/30
- G11C29/12
- CPC G11C29/12
- H01J37/32
- CPC H01J37/3211
- C23C16/455
- C23C16/50
- CPC H01J37/3244
- H01L21/027
- H01L21/308
- H10B12/00
- CPC H01L21/0276
- H01L21/48
- CPC H01L21/4853
- H01L23/373
- H01L23/00
- H01L23/31
- H01L23/498
- H01L23/538
- H01L25/10
- H10B80/00
- CPC H01L23/3736
- H01L23/48
- H01L29/06
- H01L29/08
- H01L29/417
- H01L29/423
- H01L29/775
- H01L29/786
- CPC H01L23/481
- H01L25/065
- CPC H01L23/49822
- H05K1/11
- CPC H01L23/49838
- H01L25/00
- H01L23/528
- CPC H01L23/528
- H01L21/28
- H01L29/51
- H01L29/78
- H10B51/10
- H10B51/20
- CPC H01L23/5283
- H01L29/40
- H01L29/66
- CPC H01L23/5286
- H01L27/088
- H01L23/532
- H01L21/3205
- H01L21/3213
- H01L21/768
- CPC H01L23/53219
- H01L23/60
- H01L23/13
- CPC H01L23/60
- H01L21/56
- CPC H01L24/03
- H01L23/522
- CPC H01L24/06
- CPC H01L24/14
- CPC H01L24/74
- H01L27/092
- CPC H01L27/0207
- H01L21/822
- H01L21/8238
- CPC H01L27/0922
- H01L27/146
- CPC H01L27/1463
- H01L27/15
- G09G3/32
- H01L33/00
- CPC H01L27/156
- H01L21/8234
- CPC H01L29/0669
- H01L29/15
- CPC H01L29/155
- CPC H01L29/41741
- H01L21/02
- CPC H01L29/517
- H01L29/86
- H10B69/00
- H10K10/50
- H10K19/00
- CPC H01L29/86
- H01L33/14
- H01L33/30
- CPC H01L33/145
- H01L33/24
- H01L33/10
- H01L33/22
- H01L33/32
- H01L33/44
- CPC H01L33/24
- H01L33/40
- CPC H01L33/405
- H01Q1/24
- H01Q1/22
- H01Q9/16
- H01Q21/06
- CPC H01Q1/246
- H01Q7/00
- H01Q1/27
- H01Q5/25
- CPC H01Q7/00
- H01Q9/04
- H01Q3/30
- CPC H01Q9/0407
- H01Q21/00
- CPC H01Q9/0414
- H02M1/42
- H02M1/00
- CPC H02M1/4208
- H03F3/217
- H03F3/45
- CPC H03F3/2171
- H03K3/011
- G05F1/46
- G05F3/26
- H03K3/0233
- CPC H03K3/011
- H03K5/00
- H03K3/03
- H03K5/14
- H03K19/20
- CPC H03K5/00006
- H03M13/13
- H03M13/09
- H03M13/29
- H03M13/45
- CPC H03M13/13
- H04B1/00
- H04B7/185
- CPC H04B1/006
- H04B1/3888
- H04B1/38
- H04M1/02
- H05K1/18
- CPC H04B1/3888
- H04B1/69
- CPC H04B1/69
- H04B7/06
- H04L1/00
- H04W76/20
- CPC H04B7/0626
- H04W8/22
- H04W24/02
- H04W80/02
- G06T13/20
- G10L15/26
- H04L65/1108
- CPC H04B7/18513
- H04B17/29
- H04B17/19
- CPC H04B17/297
- H04L5/00
- H04W84/12
- CPC H04L5/0044
- H04L7/033
- H04L7/00
- CPC H04L7/0337
- H04L9/08
- H04L9/30
- CPC H04L9/0891
- H04L9/32
- CPC H04L9/3268
- H04L25/02
- CPC H04L25/0236
- CPC H04M1/022
- G03B17/56
- H04N23/51
- CPC H04M1/0264
- H04N1/60
- G06T7/10
- G06T7/90
- G06V10/56
- CPC H04N1/6066
- H04N9/31
- G06F3/04847
- CPC H04N9/3188
- H04N19/124
- CPC H04N19/124
- H04N21/422
- G06F3/16
- H04N21/431
- H04N21/439
- H04N21/462
- H04N21/472
- H04N21/482
- H04N21/643
- H04N21/658
- CPC H04N21/42203
- G08C17/02
- H03J1/00
- CPC H04N21/4312
- H04N21/466
- G06F3/14
- G06V10/82
- G06V30/19
- G06V30/42
- H04N21/4363
- H04N21/443
- CPC H04N21/4666
- H04N23/57
- G06F21/31
- CPC H04N23/57
- H04N23/68
- H04N5/262
- H04N23/65
- H04N23/81
- CPC H04N23/683
- H04N23/90
- CPC H04N23/90
- H04R1/10
- H02J7/00
- CPC H04R1/1025
- H04S3/00
- H04R5/02
- H04R5/04
- CPC H04S3/008
- H04S7/00
- CPC H04S7/307
- H04W12/065
- G06Q20/32
- G06Q20/38
- G06Q20/40
- H04W12/069
- H04W48/02
- CPC H04W12/065
- H04W24/10
- H04W52/02
- H04W72/0453
- H04W76/27
- CPC H04W24/10
- H04W28/06
- CPC H04W28/06
- CPC H04W28/065
- H04W36/30
- H04W36/08
- CPC H04W36/305
- H04W48/16
- H04W28/02
- H04W76/11
- CPC H04W48/16
- H04B17/318
- H04W52/52
- H04W56/00
- H04W76/28
- CPC H04W52/0235
- H04W74/0833
- CPC H04W56/0015
- H04W60/00
- H04W48/08
- CPC H04W60/00
- H04W64/00
- H04W72/25
- CPC H04W64/00
- H04W72/23
- H04W68/00
- H04W24/08
- H04W72/0446
- CPC H04W68/005
- H04W72/232
- CPC H04W72/0446
- G01S7/00
- H04W72/11
- CPC H04W72/0453
- H04W72/1273
- CPC H04W72/1273
- H04L5/14
- CPC H04W72/232
- H04W74/08
- H04W74/00
- CPC H04W74/0833
- CPC H04W74/0875
- H04W76/10
- CPC H04W76/10
- H04W76/15
- CPC H04W76/15
- CPC H04W76/28
- H05K7/20
- CPC H05K7/20281
- CPC H10B12/315
- CPC H10B12/482
- CPC H10B12/485
- CPC H10B12/50
- H10B43/20
- H01L29/788
- H01L29/792
- H10B41/20
- H10B41/27
- H10B41/40
- H10B43/27
- H10B43/35
- H10B43/40
- CPC H10B43/20
- CPC H10B43/27
- H10B53/30
- H10B53/40
- CPC H10B53/30
- H01L25/18
- CPC H10B80/00
- H10K50/12
- H10K50/15
- H10K50/16
- H10K50/17
- H10K50/18
- CPC H10K50/12
