Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
Patent Applications by Samsung Electronics Co., Ltd. on August 22nd, 2024
Samsung Electronics Co., Ltd.: 165 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L29/423 (11), H04L5/00 (9), H01L29/06 (9), H10B43/27 (7), H01L29/786 (7) H04N19/105 (3), H04W24/10 (3), H04W72/0446 (2), H10B80/00 (2), H01L25/0657 (2)
With keywords such as: device, configured, including, surface, based, region, information, substrate, data, and layer in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Chungsoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyungmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Sujin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunggon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, H02J7/00, H02J7/04, H02J50/12, H02J50/20, H02J50/80, H04B10/50, H04B10/69
CPC Code(s): A61B5/0017
Abstract: an electronic device is provided comprising: a biometric sensor, including at least one light emitting diode (led) and at least one light receiving unit, for acquiring biometric information by means of the at least one light emitting device and the at least one light receiving unit; a power receiving circuit configured to receive a wireless power signal from an external electronic device; and a processor operatively coupled to the biometric sensor and the power receiving circuit. the processor may be configured to receive a designated wireless power signal from the external electronic device by using the power receiving circuit and to perform optical communication with the external electronic device by using the biosensor when the designated wireless power signal is received. other various embodiments identified from the specification are also possible.
Inventor(s): Seongho CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyogil KIM of Suwon-si (KR) for samsung electronics co., ltd., Minhee HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/0205, A61B5/11, A61B5/145
CPC Code(s): A61B5/486
Abstract: an electronic device may include a blood glucose sensor configured to generate a blood glucose value by measuring a blood glucose level of a user, at least one processor, and memory storing instructions that, when executed by the at least one processor individually and/or collectively, cause the electronic device to generate logs for the blood glucose value of the user obtained through the blood glucose sensor, determine a target event based on a target blood glucose value of the user obtained through the blood glucose sensor and the logs, and output a message suggesting a target behavior for the target event.
Inventor(s): Dongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehun HYEON of Suwon-si (KR) for samsung electronics co., ltd., Sungwan KOO of Suwon-si (KR) for samsung electronics co., ltd., Kiwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hwangjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyongtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungcheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Geogeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jiyoon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61H3/00, A61H1/02
CPC Code(s): A61H3/00
Abstract: an electronic device may: set a target heart rate for a user wearing a wearable device (e.g., walking assist device); receive information of the user's current heart rate; determine, on the basis of the current heart rate and the target heart rate, target exercise load such that the user's heart rate can correspond to the target heart rate; and control the wearable device such that the target exercise load is provided to the user. various other embodiments may also be possible.
Inventor(s): Kyungrock KIM of Suwon-si (KR) for samsung electronics co., ltd., Sukhoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Keehong SEO of Suwon-si (KR) for samsung electronics co., ltd., Jungsik HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B21/00, A63B24/00
CPC Code(s): A63B21/00069
Abstract: a wearable device may include a driving module configured to generate and output a torque, a communication module configured to perform communication with an electronic device, a sensor configured to generate angle data by measuring a joint angle of the user, and at least one processor configured to receive selection information including an exercise selected by the user from the electronic device through the communication module, generate angular velocity data based on the generated angle data, determine a parameter related to a pattern in which the torque is output based on the received selection information, determine control information for generating the torque based on the generated angle data, the generated angular velocity data, and the determined parameter, and control the driving module to generate the torque based on the determined control information.
Inventor(s): Song Yi BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jae Hyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hwan Soo HEO of Suwon-si (KR) for samsung electronics co., ltd., Dae Wee KONG of Suwon-si (KR) for samsung electronics co., ltd., Sang Ho ROH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01D53/00, B01D53/34, B01D53/46, B01D53/76
CPC Code(s): B01D53/007
Abstract: a carbon byproduct removal module includes: a vaporizer configured to produce vapor including oxygen atoms; a carrier gas supplier connected to the vaporizer and configured to supply carrier gas to the vaporizer, wherein the carrier gas carries the vapor to a uv-ray irradiator; and the uv-ray irradiator configured to emit ultraviolet rays to the vapor, wherein a first end of the uv-ray irradiator is connected to a first end of the vaporizer, wherein a second end of the uv-ray irradiator is attached to an exhaust module connected to a chamber in which a semiconductor manufacturing process is performed.
Inventor(s): Hwiyoung Jeong of Suwon-si (KR) for samsung electronics co., ltd., Byoungho Kwon of Suwon-si (KR) for samsung electronics co., ltd., Dongchan Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B53/017, B24B37/04, H01L21/306
CPC Code(s): B24B53/017
Abstract: the inventive concept provides a chemical mechanical polishing apparatus including a polishing pad providing a flat main surface to which a slurry liquid having polishing particles is supplied and a conditioning disk on the main surface of the polishing pad. the conditioning disk can include a plurality of diamond particles that are positioned on a surface of the conditioning disk facing the main surface of the polishing pad, and wherein the plurality of diamond particles are terminated with specific elements on surfaces thereof, and a polarity of a zeta potential on the surface of the diamond particles is the same as that of a zeta potential on the polishing particles of the slurry liquid.
20240278437. SUBSTRATE PROCESSING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeon Dong SONG of Suwon-si (KR) for samsung electronics co., ltd., Jun Young MOON of Suwon-si (KR) for samsung electronics co., ltd., Sang Woo PARK of Suwon-si (KR) for samsung electronics co., ltd., Un Ki JEONG of Suwon-si (KR) for samsung electronics co., ltd., Ji Ho UH of Suwon-si (KR) for samsung electronics co., ltd., Hyun Soo CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J13/08, B25J9/02, B25J9/16, B25J11/00
CPC Code(s): B25J13/089
Abstract: a substrate processing apparatus includes a body which includes an upper face and side faces, and extends in a first direction, a plurality of robot arms which are installed on the upper face of the body, extend in the first direction, are spaced apart from each other in a second direction perpendicular to the upper face of the body, and are able to grip a wafer, and an alignment jig (jig) which is installed on the upper face and side faces of the body, and senses positions of the plurality of robot arms, wherein the alignment jig includes, a horizontal frame disposed on the upper face of the body, a vertical frame disposed on the side faces of the body, and a displacement sensor installed on the horizontal frame and the vertical frame to sense coordinates of upper faces of the plurality of robot arms and side faces of the plurality of robot arms, the displacement sensor includes a first sensor and a second sensor which are spaced apart from side faces of the plurality of robot arms in a third direction perpendicular to the first and second directions and spaced apart from each other in the first direction, and an upper face of the displacement sensor is disposed at a vertical level higher than vertical levels of the upper faces of each of the plurality of robot arms.
Inventor(s): Seunghan LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungcheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B60W60/00, B60W30/06
CPC Code(s): B60W60/001
Abstract: an autonomous driving system including: a first system on chip (soc) configured to control an autonomous driving function of a vehicle and including a first safe parking module configured to control parking of the vehicle according to first failure information; and a second soc configured to be driven at a higher operating performance than an operating performance of the first soc, configured to control the autonomous driving function of the vehicle, and including a second safe parking module configured to control the parking according to second failure information provided, wherein the first soc or the second soc is configured to be selectively driven according to level information corresponding to an autonomous driving level, and, based on a failure occurring in the first soc, the second safe parking module is further configured to control the parking or stopping of the vehicle in response to receiving the second failure information.
Inventor(s): Hyun Joo JEON of Suwon-si (KR) for samsung electronics co., ltd., Jin Hyuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kyu Sang LEE of Suwon-si (KR) for samsung electronics co., ltd., Myung Ki SONG of Suwon-si (KR) for samsung electronics co., ltd., Ji Ho UH of Suwon-si (KR) for samsung electronics co., ltd., Kong Woo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyun Soo CHUN of Suwon-si (KR) for samsung electronics co., ltd., Beom Soo HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65G47/90
CPC Code(s): B65G47/90
Abstract: a wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (lm) guide movable up and down, a second belt unit on the first surface of the plate and including a second lm guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first lm guide and the second lm guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.
Inventor(s): Jung-Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Gi Duck KWEON of Suwon-si (KR) for samsung electronics co., ltd., Dae Ki KIM of Suwon-si (KR) for samsung electronics co., ltd., Hang Kyu SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyun Tae YANG of Suwon-si (KR) for samsung electronics co., ltd., Byoung Kwon YEO of Suwon-si (KR) for samsung electronics co., ltd., Byeong Ho WOO of Suwon-si (KR) for samsung electronics co., ltd., Jae Sung YU of Suwon-si (KR) for samsung electronics co., ltd., Jung Bae CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/44, C23C16/455
CPC Code(s): C23C16/4405
Abstract: provided are a process chamber cleaning apparatus and method in which the inside of a process chamber may be cleaned without damaging to an inner wall or a component of the process chamber. the process chamber cleaning apparatus comprising: a chamber housing; a substrate support installed inside the chamber housing, supporting a plurality of semiconductor substrates; a gas supply providing process gases; a first gas injector installed inside the chamber housing, connected to the gas supply, injecting etch gas, which is one of the process gases, into the chamber housing; and a controller controlling operations of the gas supply and the first gas injector, wherein the first gas injector injects the etch gas in a direction twisted at a predetermined angle from a central direction of the chamber housing.
20240279808. GAS SUPPLY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Songyi BAEK of Suwon-si (KR) for samsung electronics co., ltd., Hyungwoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/455, C23C16/44, C23C16/448, C23C16/52
CPC Code(s): C23C16/45561
Abstract: a gas supply system includes a manifold for supplying gases for processing the substrate to a process chamber; a cleaning gas supply line supplying a cleaning gas to the manifold; a first inert gas supply line supplying a first inert gas to the cleaning gas supply line; a first opening/closing valve opening and closing the cleaning gas supply line; a reaction gas supply line supplying a reaction gas to the manifold; a source gas supply line provided with a vaporizer and supplying the source gas to the manifold; a second inert gas supply line supplying a second inert gas to the manifold and branching out to a carrier gas supply line connected to the vaporizer and a curtain gas supply line bypassing the vaporizer; a second opening/closing valve selectively opening or closing the carrier gas supply line and the curtain gas supply line; and a controller.
20240280212. DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taehun KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Jisoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Chulyong Cho of Suwon-si (KR) for samsung electronics co., ltd., Gyoosang Choi of Suwon-si (KR) for samsung electronics co., ltd., Soonseok Seo of Suwon-si (KR) for samsung electronics co., ltd., Bokyung Seong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F16M11/12, F16M11/22
CPC Code(s): F16M11/126
Abstract: a display apparatus includes: a display module including a display panel and a display case supporting the display panel and including a locking portion; and a support device supporting a rear of the display module and configured to enable pivot rotation of the display module, wherein the support device includes: a support arm configured to be rotatably coupled to a support object and enable the display module to move between a first position and a second position at a lower height than the first position, and a locking member inserted into the locking portion and configured to lock the pivot rotation of the display module when the display module is in the second position.
Inventor(s): Byul NAMKOONG of Suwon-si (KR) for samsung electronics co., ltd., Kyounghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C7/08, F24C15/00, F24C15/04
CPC Code(s): F24C7/08
Abstract: a cooking apparatus including: a cooking chamber configured to accommodate an object; a sensor module configured to measure a plurality of cooking state determination factors of the object during cooking of the object in the cooking chamber; a display; and a controller configured to perform control to: obtain cooking state probability data for each cooking stage of a plurality of cooking stages of the object from the measured plurality of cooking state determination factors, and output, via the display, information about a cooking state of the object corresponding to a highest cooking state probability of the obtained cooking state probability data.
20240280273. CEILING-TYPE AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunggeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Moonsun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Wonhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Jangjung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/0063, F24F1/0022, F24F13/08, F24F13/20
CPC Code(s): F24F1/0063
Abstract: disclosed herein is a ceiling-type air conditioner including: a cabinet mountable on a ceiling, a centrifugal fan disposed within the cabinet, a heat exchanger disposed on a radially outer side of the centrifugal fan and configured to exchange heat with air discharged from the centrifugal fan, and a holder adjacent to the heat exchanger and disposed between the heat exchanger and the centrifugal fan and configured to support the heat exchanger, wherein the holder includes a body extending vertically along an inside of the heat exchanger, an air guide protruding from the body toward the centrifugal fan side and configured to guide airflow discharged from the centrifugal fan, and a cover protruding from the body toward the heat exchanger configured to cover between the body and the heat exchanger.
Inventor(s): Daechul HAN of Suwon-si (KR) for samsung electronics co., ltd., Youngjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoju MOON of Suwon-si (KR) for samsung electronics co., ltd., Beomseok SEO of Suwon-si (KR) for samsung electronics co., ltd., Leegyu SON of Suwon-si (KR) for samsung electronics co., ltd., Seungcheon YU of Suwon-si (KR) for samsung electronics co., ltd., Sungjin IN of Suwon-si (KR) for samsung electronics co., ltd., Youngjun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Dongsu HA of Suwon-si (KR) for samsung electronics co., ltd., Manki HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F11/86, F24F11/63
CPC Code(s): F24F11/86
Abstract: an example air conditioner may include a compressor configured to compress a refrigerant; an indoor heat exchanger configured to perform heat exchange between the refrigerant and indoor air; a temperature sensor configured to measure an indoor temperature and an indoor heat exchanger temperature; an input device configured to receive a target temperature and target humidity from a user; and at least one processor configured to determine an adjustment value of an operating frequency of the compressor based on a temperature difference between the target temperature and the indoor temperature, and change the determined adjustment value of the operating frequency based on the target humidity and the indoor heat exchanger temperature.
Inventor(s): Kwanyeol LEE of Suwon-si (KR) for samsung electronics co., ltd., Yonghan KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongsu SON of Suwon-si (KR) for samsung electronics co., ltd., Jin JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25B39/02, F25B13/00, F25B49/02
CPC Code(s): F25B39/02
Abstract: disclosed herein is a refrigerator. the refrigerator includes a storage compartment, an evaporator configured to cool the air in the storage compartment, a first heater provided in the vicinity of the evaporator, a tray provided to accommodate water, a refrigerant pipe provided in contact with the tray and configured to cool the tray, a second heater provided in the vicinity of the refrigerant pipe, a compressor configured to supply a compressed refrigerant to at least one of the evaporator or the refrigerant pipe, and a processor configured to start an operation of the second heater after starting an operation of the first heater, and configured to start an operation of the compressor after stopping the operation of the first heater and the second heater. accordingly, it is possible to prevent ice from being agglomerated caused by the defrosting operation.
20240280314. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungcheul PARK of Suwon-si (KR) for samsung electronics co., ltd., Yonghyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/06
CPC Code(s): F25D23/065
Abstract: a refrigerator includes an inner case having a storage compartment therein, an outer case coupled to an outer side of the inner case, and an insulation filled between the inner case and the outer case. the inner case includes an insulation contact surface in contact with the insulation, and the insulation contact surface having a contact area with the insulation larger than other areas of the inner case thereby increasing an adhesion to the insulation.
20240280315. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngkyun JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/06, F25D23/02
CPC Code(s): F25D23/067
Abstract: a refrigerator according to an embodiment of the disclosure includes a first refrigerator, a second refrigerator stackable on an upper side of the first refrigerator and including a caster disposed on a rear lower side thereof, and a support module disposed between the first refrigerator and the second refrigerator to allow the second refrigerator to be stacked on an upper side of the first refrigerator, wherein the support module includes a main plate coupled to an upper wall of the first refrigerator, a leg disposed on a front side of the main plate to support a front lower side of the second refrigerator, a guide plate coupled to a rear side of the main plate, and a guide lever vertically movably coupled to the guide plate so as to support the caster to move vertically.
Inventor(s): Juan LIU of Nanjing (CN) for samsung electronics co., ltd., Hyuncheol Park of Suwon-si (KR) for samsung electronics co., ltd., Dowan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jie Chen of Nanjing (CN) for samsung electronics co., ltd., Longhai Wu of Nanjing (CN) for samsung electronics co., ltd.
IPC Code(s): G01C21/00, G06T11/60
CPC Code(s): G01C21/383
Abstract: a method for mapping indoor includes: generating, based on a standard house plan of a target house, vectorized house structure data for the target house using a deep neural network; acquiring a first radar map by scanning a travelable space of a first region with a radar, the first region containing at least one room of the target house; and performing image matching-fusion processing based on the first radar map and the house structure data to obtain a house display plan of the target house.
20240280435. OPTICAL MEASUREMENT APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung Ryeol LEE of Suwon-si (KR) for samsung electronics co., ltd., Ye Eun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jin Woo AHN of Suwon-si (KR) for samsung electronics co., ltd., Seung Woo LEE of Suwon-si (KR) for samsung electronics co., ltd., Tae Joong KIM of Suwon-si (KR) for samsung electronics co., ltd., Myung Jun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01M11/02
CPC Code(s): G01M11/0257
Abstract: provided is an optical measurement apparatus. the optical measurement apparatus includes a light source; an objective lens; a reflector configured to change an optical path of light emitted from the light source such that the light is directed toward the objective lens; a detector configured to detect a pupil image; a first adjuster configured to rotate the light source around the reflector; and a second adjuster configured to rotate the reflector.
Inventor(s): Jae Hong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungwon PARK of Seoul (KR) for samsung electronics co., ltd., Min-Ho KANG of Seoul (KR) for samsung electronics co., ltd., Minyoung LEE of Seoul (KR) for samsung electronics co., ltd., Hyeong Seok JANG of Suwon-si (KR) for samsung electronics co., ltd., Won Jong JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jin Ha KIM of Suwon-si (KR) for samsung electronics co., ltd., Kak NAMKOONG of Suwon-si (KR) for samsung electronics co., ltd., Hyung Jun YOUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N23/06, B81B1/00, B81C1/00, G01N33/483
CPC Code(s): G01N23/06
Abstract: the present disclosure provides methods and apparatuses for biomaterial detection sensors. in some embodiments, a biomaterial detection sensor includes a membrane including a plurality of wells. each of the plurality of wells is configured to encapsulate a biomaterial contained in a sample solution. a surface of the membrane is selectively modified into at least one of a hydrophilic surface and a hydrophobic surface. in some embodiments, a method of manufacturing a biomaterial detection sensor includes depositing a first membrane and a second membrane on respective surfaces of a wafer, forming a window by etching the first membrane and the first surface of the wafer, forming a plurality of wells on the second membrane, modifying a surface of the second membrane into at least one of a hydrophilic surface and a hydrophobic surface; and transferring a two-dimensional graphene oxide material onto a bottom of each of the plurality of wells.
Inventor(s): Yongjune LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaehoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangkyun IM of Suwon-si (KR) for samsung electronics co., ltd., Kilsoo JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B26/02, G09G3/20
CPC Code(s): G02B26/02
Abstract: a display apparatus includes a transparent display panel including pixel devices; a first optical shutter part provided at a first side of the pixel devices and a second optical shutter part provided at a second side of the pixel devices opposite from the first side; and at least one processor configured to: control the transparent display panel to alternately display a first image and a second image at a pre-set output frequency, control the first optical shutter part and the second optical shutter part to be in an open state or a closed state based on the pre-set output frequency, control the second optical shutter part to be in the closed state while the first optical shutter part is in the open state, and control the second optical shutter part to be in the open state while the first optical shutter part is in the closed state.
Inventor(s): Seungyong SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jungmo KANG of Suwon-si (KR) for samsung electronics co., ltd., Changhoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongmin JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1335
CPC Code(s): G02F1/133612
Abstract: a display apparatus includes a liquid crystal panel; and a light source apparatus. the light source apparatus includes a substrate comprising a first side directed to the liquid crystal panel; at least one dimming block disposed on the first side of the substrate and each comprising at least one light source; at least one driving device disposed on the first side of the substrate and each configured to drive the at least one dimming block; and at least one signal line disposed on the substrate. the at least one signal line includes: a timing line configured to transmit a timing signal to the at least one driving device, a data line configured to transmit a data signal to the at least one driving device, or a power line configured to transmit a power signal to the at least one driving device.
20240280887. ELECTRONIC APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonjun BAEK of Suwon-si (KR) for samsung electronics co., ltd., Hyungchul KIM of Suwon-si (KR) for samsung electronics co., ltd., Jean HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03B21/14, G03B21/00
CPC Code(s): G03B21/145
Abstract: an example electronic apparatus may include a main body having an upper surface at which a projection lens is disposed and a side surface at which a nut is disposed; a support including a base plate and a support member having a first end connected to the base plate and a second end facing the side surface of the main body; and a hinge module configured to rotatably connect the main body to the support member, wherein the hinge module includes a first hinge member having a first end fixed to the side surface of the main body and a second end at which a first teethed part is formed and a second hinge member having a first end fixed to the support member and a second end at which a second teethed part configured to engage with the first teethed part is formed.
Inventor(s): Sunpyo Lee of Suwon-si (KR) for samsung electronics co., ltd., Minchang Kim of Suwon-si (KR) for samsung electronics co., ltd., Yoontaek Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/24
CPC Code(s): G03F1/24
Abstract: the present disclosure describes an extreme ultra-violet (euv) mask having improved reliability and durability and a manufacturing method thereof. the extreme ultra-violet mask includes a substrate, a reflective multilayer disposed on the substrate and comprising a plurality of each of two types of material layers alternately stacked on each other, and an absorption layer disposed on the reflective multilayer, wherein the absorption layer comprises a central transfer region and a non-transfer region, wherein an opening through the non-transfer region of the absorption layer forms a defect avoidance pattern that exposes a beam calibration point of the reflective multilayer.
Inventor(s): Sunpyo Lee of Suwon si (KR) for samsung electronics co., ltd., Minchang Kim of Suwon si (KR) for samsung electronics co., ltd., Yoontaek Han of Suwon si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/24
CPC Code(s): G03F1/24
Abstract: provided are an extreme ultraviolet (euv) mask having enhanced reliability and durability and a method of manufacturing the same. the euv mask includes a substrate having a rectangular shape, a reflective multilayer positioned on the substrate and having dozens of alternating layers of two different materials, in which an edge slope area or a vertical end is formed at an outer edge portion of the reflective multilayer, and an absorption layer positioned on at least a portion of the reflective multilayer. the euv mask may have a defect avoidance pattern which opens the edge slope area or the vertical end.
Inventor(s): Heejun Lee of Suwon-si (KR) for samsung electronics co., ltd., Wooyong Cho of Suwon-si (KR) for samsung electronics co., ltd., Bayram Yenikaya of Suwon-si (KR) for samsung electronics co., ltd., Joobyoung Kim of Suwon (KR) for samsung electronics co., ltd., Useong Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36, G03F1/84
CPC Code(s): G03F1/36
Abstract: provided are an optical proximity correction (opc) method capable of addressing the limitations of patterning and improving the reliability of patterning, and a mask manufacturing method using the opc method. in the opc method, a rectangular mask layout for a target pattern is created, the edge of the rectangular mask layout is dissected into segments, a first shape variable point is created, and a second shape variable point is created by shifting the first shape variable point on a rounded target pattern. thereafter, a curvilinear mask layout is created based on the second shape variable point, a contour is extracted based on the curvilinear mask layout, an edge placement error (epe) is determined, and the operations are repeated according to a predetermined criterion, thereby realizing a mask layout with minimal epes.
Inventor(s): Jinnam YEEM of Suwon-si (KR) for samsung electronics co., ltd., Hoin LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongkyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangchul YANG of Suwon-si (KR) for samsung electronics co., ltd., Byung-Hyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/70, H01L21/027
CPC Code(s): G03F1/70
Abstract: a method of fabricating a semiconductor device may include forming a target pattern on a first wafer by performing a first exposure process, measuring a misalignment value of the target pattern, calculating a block misalignment value and a pattern misalignment value based on the misalignment value, calculating a block correction value based on the block misalignment value and calculating a pattern correction value based on the pattern misalignment value, and performing a second exposure process on a second wafer, based on the block correction value and the pattern correction value.
Inventor(s): SANGJINE PARK of Suwon-si (KR) for samsung electronics co., ltd., Ji Hwan PARK of Suwon-si (KR) for samsung electronics co., ltd., KUNTACK LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/16, H01L21/67
CPC Code(s): G03F7/168
Abstract: disclosed are substrate processing baffle, substrate processing apparatuses, and substrate processing methods. the substrate processing baffle comprises a plate body having a central axis extending in a first direction, an upper body on the plate body, and partition members extending in a second direction intersecting the first direction. the plate body includes a fine passage that connects a top surface of the plate body to a bottom surface of the plate body, and a coupling hole downwardly recessed from the top surface of the plate body. the partition members are spaced apart from each other in a third direction that intersects each of the first direction and the second direction. the partition members are lower than the coupling hole.
Inventor(s): Jung Dohyun of SUWON-SI (KR) for samsung electronics co., ltd., Youngduk Suh of SUWON-SI (KR) for samsung electronics co., ltd., Sungwook Kang of SUWON-SI (KR) for samsung electronics co., ltd., Sanggon Shin of SUWON-SI (KR) for samsung electronics co., ltd., Seunghee Lee of SUWON-SI (KR) for samsung electronics co., ltd., Jinwook Jung of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70925
Abstract: an apparatus for cleaning an euv light creation chamber may include a cleaning module, a first movement module and a second movement module. the first movement module may support the cleaning module in the euv light creation chamber along a first direction. the second movement module may support the first movement module on a surface of the euv light creation chamber at a position along a second direction perpendicular to the first direction.
Inventor(s): Kwonho SON of Gyeonggi-do (KR) for samsung electronics co., ltd., Sangyoup SEOK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G04G17/08, G04G17/02, H04R1/02
CPC Code(s): G04G17/08
Abstract: an electronic device according to various embodiments of the present invention may comprise: a housing comprising a first plate comprising an inner surface defining a part of a space inside the housing and an outer surface forming a part of the exterior of the housing, and a side member formed integrally with the edge of the inner surface and formed substantially perpendicular to the inner surface so as to form a recess together with the inner surface, the side member comprising an opening; a speaker structure arranged adjacent to the opening inside the recess, the speaker structure comprising a first surface comprising a speaker vibration plate facing the opening, and a second surface facing away from the first surface; an engaging member mounted substantially perpendicularly to the inner surface so as to fix the speaker structure to the housing; and a fixing member fixed to the housing so as to contact at least a part of the second surface and arranged so as to pressurize the second surface. the electronic device described above may be varied according to embodiments.
Inventor(s): Youngjae KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Woosung CHUN of Gyeonggi-do (KR) for samsung electronics co., ltd., Changkwan YANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwanghee RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunju HONG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1677
Abstract: an electronic device is disclosed, including: a first housing, a second housing, a folding housing that pivotably connects the first housing and second housing, a flexible display spanning the first, second and folding housings, a printed circuit board (pcb), a first camera module at least partly visible through a surface of the second housing, a first magnet disposed in the first housing, a second magnet disposed in the second housing, and a hall sensor disposed on the pcb, the hall sensor configured to detect magnetic flux caused by motion of the first and/or second magnet in folding and unfolding of the electronic device so as facilitate determination of a configuration state of the electronic device.
Inventor(s): Hyunje CHO of Suwon-si (KR) for samsung electronics co., ltd., Il KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kichul NAMGUNG of Suwon-si (KR) for samsung electronics co., ltd., Mijeong SONG of Suwon-si (KR) for samsung electronics co., ltd., Jiwoo LEE of Suwon-si (JP) for samsung electronics co., ltd., Gun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/02, G06F3/023
CPC Code(s): G06F3/016
Abstract: an electronic may include: a housing; a plurality of keys positioned in the housing and each including a key cap configured to move along a stroke direction during a stroke; a first haptic actuator configured to generate vibration during a stroke of at least one key among the plurality of keys; and a haptic plate configured to vibrate by the first haptic actuator and configured to vibrate a key cap of at least one stroked key among the plurality of keys.
Inventor(s): Minuk KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungho AHN of Gyeonggi-do (KR) for samsung electronics co., ltd., Bowon JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jihyung JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Joungmin CHO of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungdae CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangtai KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Donghyun YEOM of Gyeonggi-do (KR) for samsung electronics co., ltd., Changryong HEO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F1/16, G06F3/044
CPC Code(s): G06F3/0418
Abstract: a method and an electronic device are provided for compensating for changed touch sensitivity of a touch panel of the electronic device. it is detected whether a rollable display of the electronic device is expanded. it is detected whether the touch sensitivity of the touch panel of the rollable display is changed, in case that the rollable display is expanded. a rolling direction and a length of extension of the rollable display is changed, in case that the touch sensitivity is changed. it is detected whether a resistance of an expansion area of the rollable display is changed. the touch sensitivity of the touch panel is compensated for, in case that the resistance is changed.
Inventor(s): Jinkyo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Dongkyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Eunhae PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunsun CHAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04815, G06F3/01, G06F3/04817, G06F3/04842, G06F3/04845
CPC Code(s): G06F3/04815
Abstract: a wearable electronic device and a method performed thereby are provided. the wearable electronic device includes a display, a memory, a camera, and one or more processors. the memory store one or more computer programs including computer-executable instructions that, when executed by the one or more processors, cause the wearable electronic device to display a user-selectable icon for an execution of an application in a three-dimensional (3d) virtual space, wherein the user-selectable icon includes a first graphical object representing a virtual window and a second graphical object representing the application, and the second graphical object is selectable through the first graphical, while the user-selectable icon is displayed in the 3d virtual space, detect a movement of a user's finger, and based on detecting the movement of the user's finger to select the second graphical object in a depth direction of the virtual window of the first graphical object, display an execution screen of the application.
Inventor(s): Jinkyo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Dongkyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Eunhae PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunsun CHAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04845, G06F3/04817, G06F3/0488
CPC Code(s): G06F3/04845
Abstract: disclosed are an electronic device changing a configuration of a screen according to resizing at least one icon and a method for controlling the same. an electronic device according to an embodiment of the disclosure may comprise: a touchscreen display and at least one processor comprising processing circuitry. at least one processor, individually and/or collectively, may be configured to cause the electronic device to: display, on the touchscreen display, a first screen including a plurality of visual objects, obtain a first input to at least one visual object among the visual objects, through the touchscreen display, and shrink and display other visual objects among the plurality of visual objects while enlarging the at least one visual object, through the touchscreen display, based on obtaining the first input.
Inventor(s): Vinod DAGA of Santa Clara CA (US) for samsung electronics co., ltd., Angel Benedicto AVILES, JR. of San Jose CA (US) for samsung electronics co., ltd., Shwetha Handral SRIDHARA of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0652
Abstract: a system and method for system and method for managing sorted keys in a persistent memory system. in some embodiments, the method includes adding a key to a sorted set of keys. the adding may include: identifying a bin, in a key map, corresponding to the key; and adding the key to a subset of keys associated with the bin, the subset of keys being stored in persistent memory.
20240281193. SERVER AND CONTROL METHOD THEREFOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Doyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyup LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangwon HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/147, G09G3/36
CPC Code(s): G06F3/147
Abstract: a server includes: a communication interface; and at least one processor configured to: receive, from a plurality of display devices, image quality setting values of each display device, sensing values of a surrounding environment obtained from each display device, and information on an image quality mode of each display device, identify, based on the received image quality setting values and the sensing values, an optimal image quality setting value for each sensing value, identify, based on the received information on the image quality mode, a display device in which the image quality mode is set in a pre-set mode from among the plurality of display devices, and transmit, to the identified display device and based on the optimal image quality setting value for each sensing value, an optimal image quality setting value corresponding to sensing values of the surrounding environment sensed by the identified display device.
Inventor(s): Sigyoung KOO of Suwon-si (KR) for samsung electronics co., ltd., Donghyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/4401, G06F21/44, H04L9/30, H04L9/32
CPC Code(s): G06F9/4401
Abstract: provided is a method of operating an automotive image sensor, the method including performing a reset operation to set an initialization register corresponding to operation information of the automotive image sensor, receiving a device authentication request from an electronic control unit after performing the reset operation, performing an authentication operation with the electronic control unit based on the device authentication request, obtaining first image data while performing the authentication operation, transmitting the first image data to the electronic control unit while performing the authentication operation, obtaining second image data after the authentication operation is completed, generating a tag for the second image data, and transmitting the second image data and the tag to the electronic control unit.
Inventor(s): Qirui Yang of San Diego CA (US) for samsung electronics co., ltd., Bridget Davis of San Diego CA (US) for samsung electronics co., ltd., Devasena Inupakutika of Rockville MD (US) for samsung electronics co., ltd., Peter Chen of San Diego CA (US) for samsung electronics co., ltd., Thomas Rainey of San Diego CA (US) for samsung electronics co., ltd., Terence Wong of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/455
CPC Code(s): G06F9/45558
Abstract: systems and methods for managing a storage device are disclosed. a first amount of a first storage device is associated to a first client. a first request associated with first data is detected, and a second request associated with the first data is also detected. a log for the first request and the second request is maintained for the first client. a trigger condition is identified, and based on identifying the trigger condition, a value is computed based on the log. a second amount of the first storage device is determined based on the value, and the second amount is associated to the first client.
Inventor(s): Myungkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Seongmuk Kang of Suwon-si (KR) for samsung electronics co., ltd., Jiho Kim of Suwon-si (KR) for samsung electronics co., ltd., Kijun Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyomin Sohn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10
CPC Code(s): G06F11/1044
Abstract: a memory controller including a processor and configured to control a memory module including a plurality of data chips and at least one parity chip includes an error correction code (ecc) engine, the ecc engine including an ecc decoder to correct q symbols errors in a codeword set read from the memory module, q is a maximum natural number equal to or less than p and p is a natural number equal to or greater than four. the ecc decoder is configured to generate a syndrome including first through p-th syndrome symbols based on the read codeword set by using a parity check matrix and to perform a first ecc decoding to correct a single symbol error in the read codeword set based on the first syndrome symbol and a selected syndrome symbol corresponding to one of the second through p-th syndrome symbols.
Inventor(s): Lokesh Nagappa JALIMINCHE of Santa Cruz CA (US) for samsung electronics co., ltd., Yangwook KANG of San Jose CA (US) for samsung electronics co., ltd., Changho CHOI of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/34, G06F11/36
CPC Code(s): G06F11/3409
Abstract: a system and method for identifying kernels suitable for computational storage. in some embodiments, the method includes: identifying a kernel of a computation as a candidate for execution in a computational storage circuit; and evaluating the kernel as a candidate for execution in the computational storage circuit, the identifying including estimating a working set size of the kernel, and the evaluating including estimating an expected performance of the kernel in the computational storage circuit.
Inventor(s): Jin Jung of Suwon-si (KR) for samsung electronics co., ltd., Younghyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Kwon of Suwon-si (KR) for samsung electronics co., ltd., Kyungsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinin So of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/42
CPC Code(s): G06F13/4282
Abstract: a computing system includes an interconnect device, a plurality of memory devices electrically coupled to communicate with the interconnect device, a plurality of host devices electrically coupled to communicate with the interconnect device and configured to generate requests for access to the plurality of memory devices via the interconnect device, and a plurality of congestion monitors. these congestion monitors are configured to generate congestion information by monitoring a congestion degree of signal transfers with respect to at least one of the plurality of memory devices and the interconnect device in real time. the computing system is also configured to control at least one of: a memory region allocation of the plurality of host devices to the plurality of memory devices, and a signal transfer path inside the interconnect device, based on the congestion information.
Inventor(s): Rama Mythili VADALI of Vista CA (US) for samsung electronics co., ltd., Oleg Sergeyevich KHORUZHIY of La Jolla CA (US) for samsung electronics co., ltd., Maiyuran WIJAY of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F18/2415, G06F18/2431, G06T3/40, G06T5/20
CPC Code(s): G06F18/2415
Abstract: a system and method for confidence aided upsampling of categorical maps. in some embodiments, the method includes: determining a category of a first pixel of an image, the first pixel having a plurality of neighboring pixels, each of the neighboring pixels having a category; and processing the image based on the determined category. the determining may include: calculating a confidence weighted metric for each of the neighboring pixels, the confidence weighted metric being based on a maximum confidence value among each of the neighboring pixels; and determining the category of the first pixel based on the confidence weighted metric of each of the neighboring pixels and based on the category of one of the neighboring pixels.
Inventor(s): Sihyoung LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Beomsu KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunjung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Soowan KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaehyun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Insun SONG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunseok LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Jihwan CHOE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F40/58, G06F40/263, G06V10/10, G06V20/20, G06V20/62, G06V30/148, H04N5/14
CPC Code(s): G06F40/58
Abstract: certain embodiments of the disclosure relate to an apparatus and a method for translating a text included in an image by using an external electronic device in an electronic device. one method comprises displaying a picture comprising an object bearing text at a location within the picture on a display, extracting the text, generating another text from the extracted text, and automatically overlaying the another text on the object in another picture comprising the object at another location within the another picture on the display.
Inventor(s): Winston Chen of Winchester MA (US) for samsung electronics co., ltd., Laszlo Gombos of Winchester MA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/0895
CPC Code(s): G06N3/0895
Abstract: a method includes obtaining, using at least one processing device of an electronic device, information associated with a webpage presented to a user. the method also includes providing, using the at least one processing device, the information to an on-device machine learning model of the electronic device. the method further includes generating, using the on-device machine learning model, a prompt for a large language model based on the information. the prompt includes an action from a set of candidate actions that the large language model is able to perform and at least some of the information. the method also includes providing, using the at least one processing device, the prompt as input to the large language model and receiving, using the at least one processing device, a response from the large language model. in addition, the method includes presenting, using the at least one processing device, the response to the user.
Inventor(s): Raz Zvi Nossek of Tel-Aviv (IL) for samsung electronics co., ltd., Yuval Becker of Tel-Aviv (IL) for samsung electronics co., ltd., Tomer Peleg of Tel-Aviv (IL) for samsung electronics co., ltd., Stas Dubinchik of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06T5/50
CPC Code(s): G06T3/4015
Abstract: image processing systems and image processing techniques leveraging neural networks (e.g., convolutional neural networks (cnns)) for image restoration tasks (e.g., for demosaicing tasks) are described. in certain aspects, mixture of experts (moe) techniques may be employed, where multiple different expert networks are used to divide a problem space (e.g., image reconstruction tasks) into homogenous regions. for example, each moe module may reconstruct a certain problem in an image, and a gating component may activate certain moe modules to provide a reconstructed image. in some aspects, training and optimization techniques are described for each expert of the moe architecture, to increase individual performance (e.g., a sub-task for each expert of an image processing system may be imposed in a residual manner, a gating function may be trained, etc.). accordingly, image processing systems may leverage moe architectures to support a large number of neural network parameters for improved image reconstruction applications.
Inventor(s): Sang Kyeong HAN of Suwon-si (KR) for samsung electronics co., ltd., In Mo JANG of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Jun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hee Jae PARK of Suwon-si (KR) for samsung electronics co., ltd., Soon Wook HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G05D1/648, G06V20/58, H04N23/695, H04N23/90
CPC Code(s): G06T7/0002
Abstract: a mobile robot includes a telescopic lift mounted on the outside of a main body of the mobile robot, the telescopic lift being extendable in a height direction; a first sensor package installed at an upper end of the telescopic lift; and a second sensor package installed at the upper end of the telescopic lift. the mobile robot is configured to collect information regarding an inspection target, which is installed at a high-altitude location on a particular floor level of a semiconductor fabrication plant, using the second sensor package, prevent the collision of the telescopic lift or the first sensor package of the mobile robot with the inspection target and/or stop the telescopic lift when the second sensor package collides with an object at the high-altitude location or with the inspection target, and conduct an unmanned inspection of the inspection target, including autonomously driving.
Inventor(s): Bosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinsuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Junsik JEONG of Suwon-si (KR) for samsung electronics co., ltd., Haksoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyuntaek WOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06T15/00
CPC Code(s): G06T19/006
Abstract: one or more of at least one processor of a wearable device is configured to obtain an external image indicating at least a part of real environment around the wearable device using a camera, while displaying a three-dimensional image through a display. one or more of the at least one processor is configured to store the external image in a first command buffer distinct from a display buffer corresponding to the display in a memory. one or more of the at least one processor is configured to adjust an order among the first command buffer, the second command buffer and the third command buffer, using depth information corresponding to the first command buffer, a second command buffer corresponding to the three-dimensional image, and a third command buffer corresponding to a virtual object. this disclosure may be related to a metaverse service to enhance interconnectivity between a real object and a virtual object. for example, the metaverse service may be provided through a network based on fifth generation (5g) and/or sixth generation (6g).
Inventor(s): Jongseok SEO of Seoul (KR) for samsung electronics co., ltd., Hyunku LEE of Suwon-si (KR) for samsung electronics co., ltd., Heejae JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/147, G06F18/243, G06T5/70, G06T7/20, G06T7/70, G06V10/22, G06V10/25, H04N23/667, H04N23/80
CPC Code(s): G06V10/147
Abstract: a vision sensor includes a pixel array comprising pixels arranged in a matrix, an event detection circuit, an event rate controller, and an interface circuit. each pixel is configured to generate an electrical signal in response to detecting a change in incident light intensity. the event detection circuit detects whether a change in incident light intensity has occurred at any pixels, based on processing electrical signals received from one or more pixels, and generates one or more event signals corresponding to one or more pixels at which a change in intensity of incident light is determined to have occurred. the event rate controller selects a selection of one or more event signals corresponding to a region of interest on the pixel array as one or more output event signals. the interface circuit communicates with an external processor to transmit the one or more output event signals to the external processor.
Inventor(s): Junghyun YOON of Suwon-si (KR) for samsung electronics co., ltd., Sungjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Seungjun JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32, G09G3/3258
CPC Code(s): G09G3/32
Abstract: an display apparatus includes: a display panel; and a controller configured to: process source data, received from an external device, to control the display panel to display an image on a screen of the display panel, the source data including the image, identify a first aspect ratio of the screen of the display panel and a second aspect ratio of the image, based on the first aspect ratio being different from the second aspect ratio, determine, within the screen of the display panel, an image area where the image is displayed and a black area where the image is not displayed, and move the image area periodically or substantially periodically along a direction in which the black area is located within the screen of the display panel.
Inventor(s): Sejong KIM of Suwon-si (KR) for samsung electronics co., ltd., Changrae LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3208
CPC Code(s): G09G3/3208
Abstract: an electronic device includes memory storing instructions. the electronic device includes at least one processor comprising processing circuitry. the electronic device includes a display panel including a plurality of pixels. the instructions, when executed by the at least one processor individually and/or collectively, cause the electronic device to: display, through the display panel, a screen for a low-power state including at least one visual object; identify an event for displaying a visual object in the screen while displaying the screen; identify an on-pixel ratio (opr) of the visual object in response to the event; and based on changing a first value representing an attribute of the visual object to a second value lower than the first value in response to the opr being higher than a reference opr, display, through the display panel, the screen including the visual object.
Inventor(s): Youngdo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongsik KANG of Suwon-si (KR) for samsung electronics co., ltd., Gyudong EOM of Suwon-si (KR) for samsung electronics co., ltd., Dongheon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Namhyeon JEON of Suwon-si (KR) for samsung electronics co., ltd., Woonbo YEO of Suwon-si (KR) for samsung electronics co., ltd., Dongseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3225, G06V40/13
CPC Code(s): G09G3/3225
Abstract: an electronic apparatus and/or method which may improve the performance of a sensor module. an electronic apparatus may include: a display panel; a fingerprint sensor arranged to overlap at least part of the display panel; and a processor operatively connected to the display panel and the fingerprint sensor, wherein the processor may: execute a fingerprint authentication function using the fingerprint sensor; identify an amoled off ratio (aor) and luminance setting value of the display panel on the basis of the fingerprint authentication function being executed; linearly adjust the aor according to a section to which the luminance setting value belongs or set the aor to a designated minimum value; and perform fingerprint authentication by using the fingerprint sensor while the aor is maintained at the minimum value. the present disclosure may further include various other embodiments.
Inventor(s): Yongim LEE of Suwon-si (KR) for samsung electronics co., ltd., Yonghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Junkwan PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3275
CPC Code(s): G09G3/3275
Abstract: a source driver is provided. the source driver includes: a switch circuit with first switches, which are respectively connected between a first charge sharing line and data lines; and a charge sharing controller configured to: receive pieces of first pixel data, which respectively correspond to the data lines, and pieces of second pixel data, which respectively correspond to the of first pixel data; output a charge sharing signal having an active level to a first group of switches among the first switches respectively connected to first data lines from among the lines, based on the pieces of first pixel data and the pieces of second pixel data corresponding to the first data lines being different from each other in at least two upper bits thereof.
Inventor(s): Jeock Lee of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Taiyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Yonghoon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/34, H04R1/10
CPC Code(s): G09G3/3406
Abstract: an electronic device includes: at least one memory storing instructions; at least one sensor; a display; a communication circuitry; and at least one processor operatively connected to the at least one memory, the at least one sensor, the display, and the communication circuitry, wherein the at least one processor is configured to execute the instructions to: receive a touch input contacted on the display; identify that a variance of a posture of the electronic device is lower than a threshold value; transmit, to one earbud through the communication circuitry, a signal to request second data about a posture of the at least one earbud; receive the second data; obtain a reference angle; identify a difference between third data about the posture of the electronic device, display a screen, through the display, with a first brightness or display the screen with a second brightness different from the first brightness.
Inventor(s): Sanghak SHIN of Seoul (KR) for samsung electronics co., ltd., Woongdai KANG of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C5/14, G11C8/10, G11C8/18
CPC Code(s): G11C5/148
Abstract: a semiconductor memory device includes a first power supply unit configured to, in a normal mode of a high frequency operation, supply a first power from a first global power rail to a third global power rail and a fourth global power rail in a normal mode, and, in a standby mode of a high frequency option, supply the first power to the third global power rail and not supply the first power to the fourth global power rail, and, in a normal mode of a low frequency operation, supply a second power of a second global power rail to the third global power rail and the fourth global power rail, and, in a standby mode of a low frequency operation, supply the second power to the third global power rail and not supply the second power to the fourth global power rail.
Inventor(s): Youngcheon KWON of Hwaseong-si (KR) for samsung electronics co., ltd., Jemin Ryu of Seoul (KR) for samsung electronics co., ltd., Jaeyoun Youn of Suwon-si (KR) for samsung electronics co., ltd., Haesuk Lee of Seongnam-si (KR) for samsung electronics co., ltd., Jihyun Choi of Daegu (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10
CPC Code(s): G11C7/222
Abstract: a method of operating a memory device including row pins and column pins includes receiving a first active command through the row pins during 1.5 cycles of a clock signal, receiving a first read command or a first write command through the column pins during 1 cycle of the clock signal, receiving a first precharge command through the row pins during a 0.5 cycle of the clock signal corresponding to a rising edge of the clock signal, receiving a second active command through the row pins during the 1.5 cycles of the clock signal, receiving a second read command or a second write command through the column pins during the 1 cycle of the clock signal, and receiving a second precharge command through the row pins during the 0.5 cycle of the clock signal corresponding to a falling edge of the clock signal.
Inventor(s): Taemin Choi of Seoul (KR) for samsung electronics co., ltd., Taehyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Seongook Jung of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/419, G11C11/418
CPC Code(s): G11C11/419
Abstract: a memory device accessed by circuits operating based on a first supply voltage. the memory device includes a cell array electrically connected to a plurality of word lines and a plurality of bit lines; a row driver configured to select one word line of the plurality of word lines based on a row address; a precharge circuit configured to precharge the plurality of bit lines based on the first supply voltage; a column driver configured to select at least one bit line of the plurality of bit lines based on a column address; and a read circuit configured to read data stored in the cell array through the at least one bit line. the cell array, the row driver, the column driver, and the read circuit operate based on a second supply voltage, which is higher than the first supply voltage.
Inventor(s): Chaehyeon LIM of Suwon-si (KR) for samsung electronics co., ltd., Woojae JANG of Suwon-si (KR) for samsung electronics co., ltd., Sejun PARK of Suwon-si (KR) for samsung electronics co., ltd., Yujeong SEO of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C16/04, G11C16/32
CPC Code(s): G11C16/08
Abstract: provided is an operating method of a nonvolatile memory device including a plurality of cell strings, each cell string of the plurality of cell strings including a plurality of memory cells, connected between a bit line and a common source line, and vertical holes penetrating a plurality of word lines stacked in a direction perpendicular to a substrate, the operating method including applying a word line voltage to the plurality of word lines, classifying the plurality of word lines into a plurality of regions, each region of the plurality of regions including at least one of the word lines, and recovering voltages of the plurality of word lines by recovering voltages of word lines arranged in a central region among the plurality of regions before recovering voltages of word lines in other regions of the plurality of regions.
Inventor(s): Anil Kavala of Suwon-si (KR) for samsung electronics co., ltd., Youngmin Jo of Suwon-si (KR) for samsung electronics co., ltd., Jungjune Park of Suwon-si (KR) for samsung electronics co., ltd., Chiweon Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C16/04
CPC Code(s): G11C16/08
Abstract: a memory system includes a memory device having a plurality of non-volatile memories, a buffer chip connected with each of the plurality of non-volatile memories, and a memory controller connected with the buffer chip and configured to provide a data strobe signal and a data signal to the buffer chip. the buffer chip includes a first loop coupled to a sampler circuit and configured to perform first monitoring on the data strobe signal and first duty correction on the data strobe signal based on the first monitoring, and a second loop coupled to a multiplexer and configured to, responsive to the first duty correction, perform second monitoring on the data strobe signal and second duty correction on the data strobe signal based on the second monitoring. the buffer chip is configured to store first and second duty correction information for at least one of the plurality of non-volatile memories.
Inventor(s): Yohan LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk YU of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/16, G11C16/04, G11C16/10, G11C16/26
CPC Code(s): G11C16/16
Abstract: a memory device including: a memory cell array including a plurality of memory blocks; a voltage generator configured to generate an erase voltage and row line voltages to be provided to a target block of the plurality of memory blocks on which an erase operation is to be performed; and a control logic circuit configured to control the memory cell array and the voltage generator, wherein, during the erase operation, after a precharge voltage is applied to a plurality of string select lines connected to the target block, the control logic circuit is further configured to provide the erase voltage to a plurality of bit lines connected to the plurality of string select lines, wherein the plurality of string select lines includes a first string select line and a second string select line, wherein a first distance between the first string select line and ends of a plurality of word lines connected to the target block is less than a second distance between the second string select line and the ends of the plurality of word lines, and wherein a first threshold voltage of a first transistor connected to the first string select line is higher than a second threshold voltage of a second transistor connected to the second string select line.
20240282387. MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunhyang PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sehwan PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/24, G11C16/04, G11C16/08, G11C16/26
CPC Code(s): G11C16/24
Abstract: a memory device includes a cell region in which a plurality of memory cells are arranged and a peripheral circuit region in which a row decoder is connected to the plurality of memory cells through a plurality of wordlines, a plurality of page buffers connected to the plurality of memory cells through a plurality of bitlines, and a control logic controlling the row decoder and the plurality of page buffers are arranged. the row decoder inputs a plurality of read voltages having different levels to a selected wordline among the plurality of wordlines in sequence. each of the plurality of page buffers includes a sensing node connected to one of the plurality of bitlines. voltages of the sensing nodes included in the page buffers of a portion of the plurality of page buffers decrease differently while each of the plurality of read voltages is input to the selected wordline.
Inventor(s): JUNGPIL LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12, G11C5/06, G11C16/04, G11C16/08, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): G11C29/1201
Abstract: disclosed is a memory device which includes a memory chip that includes a memory cell array connected to word lines and bit lines, a test circuit connected to the word lines and the bit lines, and a first bonding metal pattern connected to the word lines and the bit lines, and a peripheral circuit chip that includes a peripheral circuit and a second bonding metal pattern. the test circuit performs a test process on the memory cell array, and the memory chip and the peripheral circuit chip are connected in a bonding method for electrically connecting the first bonding metal pattern and the second bonding metal pattern.
Inventor(s): Yeoseon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Donghoon KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/16, H01J37/08, H01J37/18
CPC Code(s): H01J37/16
Abstract: a focused ion beam apparatus may include an ion beam emitter for emitting an ion beam, a focused ion beam chamber into which ion gas may be introduced, a sample stage in the focused ion beam chamber to support a wafer sample, and an air bag in the focused ion beam chamber. the airbag may be positioned to not interfere with the sample stage.
Inventor(s): JINUK PARK of Suwon-si (KR) for samsung electronics co., ltd., EUIJIN PARK of Suwon-si (KR) for samsung electronics co., ltd., DONGYUP CHOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32935
Abstract: disclosed is a substrate processing apparatus, which includes a power supply unit, a process chamber configured to receive power from the power supply unit, a cable unit connected between the power supply unit and the process chamber, and an impedance matching unit connected between the cable unit and the power supply unit and that matches an impedance of the power supply unit with an impedance of the process chamber and the cable unit, and the cable unit includes a cable that connects the power supply unit to the process chamber, an impedance measuring unit that measures an impedance of the entirety of the cable unit, and an impedance adjusting unit that adjusts the impedance of the entirety of the cable unit.
Inventor(s): Jaehee Jung of Suwon-si (KR) for samsung electronics co., ltd., Seik Jang of Suwon-si (KR) for samsung electronics co., ltd., Jaeseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyungkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungjin Baek of Suwon-si (KR) for samsung electronics co., ltd., Changsun Yeo of Suwon-si (KR) for samsung electronics co., ltd., Kwangjin Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jinhwan Jeong of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong Jung of Suwon-si (KR) for samsung electronics co., ltd., Wonchul Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, C23C16/04, C23C16/40, C23C16/458, C23C16/50, H01J37/32, H01L21/3213
CPC Code(s): H01L21/0228
Abstract: a method for processing a substrate including: loading a plurality of first substrates and a plurality of second substrates on which mask patterns are formed into a process chamber; supplying a first pretreatment gas into the process chamber; surface processing the plurality of first substrates using first plasma generated from the first pretreatment gas; supplying a second pretreatment gas into the process chamber; surface processing the plurality of first substrates and the plurality of second substrates using second plasma generated from the second pretreatment gas; supplying precursors to be adsorbed onto each of the plurality of first substrates and the plurality of second substrates into the process chamber; supplying a reactive gas into the process chamber; and depositing a thin film covering the mask patterns on each of the plurality of first substrates and the plurality of second substrates using third plasma generated from the reactive gas and the precursors.
Inventor(s): Hyungju RYU of Suwon-si (KR) for samsung electronics co., ltd., Sangjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Yigwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongsu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/027, G03F7/00, H01L21/304
CPC Code(s): H01L21/0274
Abstract: a method of manufacturing a semiconductor device includes bonding a first semiconductor substrate on a second semiconductor substrate; performing a first physical parameter measurement on a first surface of the first semiconductor substrate to obtain first displacement data; polishing the first surface of the first semiconductor substrate after the first displacement data is obtained; performing a second physical parameter measurement on the polished first surface of the first semiconductor substrate to obtain second displacement data; and forming circuit patterns on the polished first surface of the first semiconductor substrate based on the second displacement data.
Inventor(s): Chanyeong Jeong of Suwon-si (KR) for samsung electronics co., ltd., Hoseop Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunggil Kang of Suwon-si (KR) for samsung electronics co., ltd., Dongkyu Shin of Suwon-si (KR) for samsung electronics co., ltd., Sangjin An of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/324, H01J37/32, H01L21/311, H01L21/67
CPC Code(s): H01L21/324
Abstract: a wafer processing method includes supplying a first process gas into a wafer processing apparatus, lowering a temperature of the wafer, generating plasma using the first process gas, supplying a second process gas and mixing the second process gas with the plasma, performing a plasma process on the wafer using the plasma and the second process gas, and performing an annealing process on the wafer on which the plasma process has been performed. the lowering of the temperature of the wafer includes increasing an internal pressure of the wafer processing apparatus.
Inventor(s): Jinho Yoo of Suwon-si (KR) for samsung electronics co., ltd., Sughyung Kwon of Suwon-si (KR) for samsung electronics co., ltd., Nackhoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngkwang Myoung of Suwon-si (KR) for samsung electronics co., ltd., Sanghun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/311
CPC Code(s): H01L21/6708
Abstract: a liquid chemical recycle system includes a liquid chemical supply tank, a processing tank, a recovery line, a recycle tank, and a circulation line, wherein the processing tank includes a third bowl, a second bowl, and a first bowl.
Inventor(s): Sunwoo PARK of Seoul (KR) for samsung electronics co., ltd., Minwoo RHEE of Suwon-si (KR) for samsung electronics co., ltd., Sujie KANG of Suwon-si (KR) for samsung electronics co., ltd., Bumki MOON of Suwon-si (KR) for samsung electronics co., ltd., Seungdon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyeongbin LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/66
CPC Code(s): H01L21/6715
Abstract: a method of manufacturing a semiconductor device includes: performing a first semiconductor process on a semiconductor wafer including a front side and a back side opposing the front side; loading the semiconductor wafer into a semiconductor processing apparatus including a support, a spraying apparatus, and a warpage measuring apparatus, wherein the semiconductor wafer is supported by the support, wherein the spraying apparatus is disposed below the semiconductor wafer, and the warpage measuring apparatus is an apparatus configured to measure warpage of the semiconductor wafer; forming a warpage compensation pattern on the back side of the semiconductor wafer using the spraying apparatus until a warpage measurement value of the semiconductor wafer is within a predetermined range, while measuring warpage of the semiconductor wafer using the warpage measuring apparatus; and unloading, from the semiconductor processing apparatus, the semiconductor wafer on which the warpage compensation pattern is formed.
Inventor(s): Kyu Ok LEE of Seongnam-si (KR) for samsung electronics co., ltd., Ji Yong KIM of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/677, H01L21/68
CPC Code(s): H01L21/67259
Abstract: the present invention relates to a position determination apparatus for a robot detection laser sensor system in front-opening unified pods (foups), including: an external server; and a wafer processing device for performing processing for wafers and transmitting integration management data to the external server, wherein the wafer processing device may include: the foups configured to accommodate the wafers therein; loadports to which the foups are detachably coupled; processing chambers in which the processing for the wafers are performed; and an equipment front end module (efem) disposed between the processing chambers and the loadports and having an end-effector adapted to get the wafers out of the foups into the processing chambers or put the wafers finished in processing in the processing chambers into the foups.
Inventor(s): Kwang Sik KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683
CPC Code(s): H01L21/6833
Abstract: there is provided an edge covering having a structure capable of effectively removing polymer. the edge covering includes a lower ring including a first hole, and an upper ring which is installed on the lower ring and includes a second hole that overlaps the first hole, wherein an edge ring is seated on an upper surface of the lower ring, and the upper ring includes a first side wall that faces the second hole and forms a first angle with the upper surface of the lower ring, the first angle being an acute angle.
Inventor(s): Myung Yang of Niskayuna NY (US) for samsung electronics co., ltd., Wonhyuk Hong of Clifton Park NY (US) for samsung electronics co., ltd., Myunghoon Jung of Clifton Park NY (US) for samsung electronics co., ltd., Jongjin Lee of Clifton Park NY (US) for samsung electronics co., ltd., Jaejik Baek of Watervliet NY (US) for samsung electronics co., ltd., Kang-ill Seo of Albany NY (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L21/8234, H01L27/088, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L23/481
Abstract: a semiconductor device includes: at least one transistor comprising source/drain regions and 1gate structure; a contact isolation layer below the 1gate structure; and a backside contact plug connected to at least one of the 1source/drain regions, wherein the backside contact plug is formed below the 1source/drain region and extended to a region below the 1gate structure, and isolated from the 1gate structure by the contact isolation layer.
Inventor(s): BONGWEE YU of Suwon-si (KR) for samsung electronics co., ltd., KYOUNG -MIN LEE of Suwon-si (KR) for samsung electronics co., ltd., KYUNGSOO LEE of Suwon-si (KR) for samsung electronics co., ltd., JUNHO HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/528, H01L25/10, H10B80/00
CPC Code(s): H01L23/481
Abstract: a semiconductor device includes: a package substrate; a first die on the package substrate and including a hard macro and through silicon vias; and a second die on the first die, wherein the first die includes a first region, which does not include the hard macro, and a second region including a macro-region that includes the hard macro, wherein the through silicon vias of the first region are arranged in a first direction with a first distance and in a second direction with a second distance, wherein the through silicon vias of the second region are arranged in the first direction with a first pitch, and in the second direction with a second pitch, wherein the macro-region is interposed between the through silicon vias arranged in the first direction, wherein the first pitch is greater than the first distance, and wherein the second pitch is less than the second distance.
Inventor(s): In-Hyuk Choi of Seoul (KR) for samsung electronics co., ltd., Wonchul Lee of Seongnam-si (KR) for samsung electronics co., ltd., Joonhyoung Yang of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L29/06
CPC Code(s): H01L23/528
Abstract: a semiconductor device includes; a semiconductor substrate including a first region and a second region, a first interlayer insulating layer on the second region, a capping layer disposed on the first interlayer insulating layer, an upper surface of the capping layer includes a first trench, conductive patterns spaced apart on the capping layer, side surfaces of the conductive patterns are aligned with inner side surfaces of the first trench, and a peripheral separation pattern disposed in the first trench to cover the side surfaces of the conductive patterns. the peripheral separation pattern has a first thickness on the side surfaces of the conductive patterns and a second thickness greater than or equal to the first thickness on a lower surface.
20240282705. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong Ha SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jae Ick SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H10B41/10, H10B41/27, H10B41/40, H10B43/10, H10B43/27, H10B43/40
CPC Code(s): H01L23/5283
Abstract: a semiconductor memory device comprising a cell region on a cell substrate, and a peripheral circuit region on a peripheral circuit board connected to the cell region in a bonding manner is provided. wherein the cell region comprises a plurality of gate electrodes sequentially stacked on a first side of the cell substrate, a first bypass cell contact plug extended in a vertical direction in an extended region connected to the first gate electrode, a normal cell contact plug extended in the vertical direction in the extended region and connected to the second gate electrode, a first metal wiring electrically connected to the first bypass cell contact plug and a second metal wiring on the first metal wiring and electrically connected to the first metal wiring, wherein the second metal wiring is connected with the fourth metal wiring through a first bypass path including a plurality of bonding metal pairs.
20240282706. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myeonghoon HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, G11C16/04, H01L23/522, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): H01L23/5283
Abstract: a semiconductor device may include a lower substrate; an active region on the lower substrate; a common source plate spaced apart from an upper surface of the lower substrate in a vertical direction, and the common source plate overlapping the upper surface of the lower substrate; a discharge structure directly connecting the common source plate and the active region in the vertical direction, and the discharge structure having a wall shape extending in a first direction parallel to the upper surface of the lower substrate; and a cell array structure on the common source plate. a length of the discharge structure in the first direction may be greater than a width of the discharge structure in a second direction parallel to the upper surface of the lower substrate and perpendicular to the first direction.
Inventor(s): Jongryeol YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/285, H01L21/8238, H01L27/092, H01L29/06, H01L29/08, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L23/5286
Abstract: a semiconductor device may include a substrate, a lower power line buried in a lower portion of the substrate, a source/drain pattern on the substrate, an interlayer insulating layer on the source/drain pattern, and a back-side contact penetrating the substrate and electrically connecting the lower power line to the source/drain pattern. the back-side contact may penetrate the source/drain pattern and may include a first surface in contact with the interlayer insulating layer.
20240282750. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SEOKBEOM YONG of Suwon-si (KR) for samsung electronics co., ltd., Kyungsuk Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/48
CPC Code(s): H01L25/0657
Abstract: a semiconductor package including a package substrate; an upper chip on the package substrate; a passive element chip between the upper chip and the package substrate; and a lower chip between the passive element chip and the package substrate, wherein the passive element chip includes a through electrode connected to the lower chip; and a plurality of passive elements on the through electrode, and the upper surface of the passive element chip is in contact with the lower surface of the upper chip.
Inventor(s): Eunji KIM of Seoul (KR) for samsung electronics co., ltd., Seungwoo PAEK of Yongin-si (KR) for samsung electronics co., ltd., Byungkyu KIM of Seoul (KR) for samsung electronics co., ltd., Sangjun PARK of Yongin-si (KR) for samsung electronics co., ltd., Sungdong CHO of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/498, H01L23/522, H01L23/528, H01L23/532, H01L23/538, H01L29/423, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): H01L25/0657
Abstract: a device including a first structure and a second structure is provided. the device includes a substrate, a peripheral circuit and first junction pads on the substrate; a first insulating structure surrounding side surfaces of the first junction pads; second junction pads contacting the first junction pads; a second insulating structure on the first insulating structure; a passivation layer on the second insulating structure; an upper insulating structure between the passivation layer and the second insulating structure; a barrier capping layer between the upper insulating structure and the passivation layer; conductive patterns spaced apart from each other in the upper insulating structure; a first pattern structure between the upper insulating structure and the second insulating structure; a stack structure between the second insulating structure and the first pattern structure, and including gate layers; and a vertical structure passing through the stack structure and including a data storage structure and a channel layer.
20240282763. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): In-Wook OH of Suwon-si (KR) for samsung electronics co., ltd., Byungyun KANG of Anyang-si (KR) for samsung electronics co., ltd., Donghyun KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hyungjune KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaebong JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L21/8238, H01L23/48, H01L23/528, H01L27/092, H01L29/06, H01L29/08, H01L29/423, H01L29/78, H01L29/786
CPC Code(s): H01L27/0207
Abstract: disclosed is a semiconductor device comprising a substrate that includes a cell region and a dummy region, a first metal layer on the substrate and including a dummy line on the dummy region, a power delivery network on a bottom surface of the substrate, and a first through via that penetrates the substrate and extends from the power delivery network toward the dummy line. the first through via is electrically connected to the dummy line. the power delivery network includes a plurality of lower lines and a pad line below the lower lines. the pad line is electrically connected through the lower lines to the first through via.
Inventor(s): Hyukhoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Chanhee JEON of Suwon-si (KR) for samsung electronics co., ltd., Kyoungil DO of Suwon-si (KR) for samsung electronics co., ltd., Mijin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H02H9/04
CPC Code(s): H01L27/0259
Abstract: provided is a device including a first well having a first conductivity type, a first gate electrode on the first well, a first region and a second region each having a second conductivity type on the first well with the first gate electrode disposed therebetween, a third region having the second conductivity type on the first well, and a fourth region having the first conductivity type on the first well. the first gate electrode and the first region are electrically connected to a first node, and the third region is electrically connected to a second node.
20240282773. INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seokhyeon Yoon of Seoul (KR) for samsung electronics co., ltd., Junyoung Park of Hwaseong-si (KR) for samsung electronics co., ltd., Woocheol Shin of Seoul (KR) for samsung electronics co., ltd., Seunghun Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/12, H01L29/06, H01L29/08, H01L29/786
CPC Code(s): H01L27/1203
Abstract: an integrated circuit device includes: a semiconductor on insulator (soi) substrate layer including a base substrate layer, an insulating substrate layer, and a cover substrate layer; a semiconductor substrate layer; a plurality of first fin-type active areas and a plurality of second fin-type active areas each defined by a plurality of trenches, and extending in a first horizontal direction, in above the soi substrate layer and the semiconductor substrate layer, respectively; a plurality of nanosheet stacked structures comprising nanosheets extending in parallel with each other and spaced apart from upper surfaces of the plurality of first fin-type active areas and the plurality of second fin-type active areas; a plurality of first source/drain regions extending into the soi substrate layer; and a plurality of second source/drain regions extending into the semiconductor substrate layer. lower surfaces of the first and second source/drain regions may not be coplanar with each other.
Inventor(s): Yeongseok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeokjong LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyunghoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14614
Abstract: provided are an integrated circuit having a structure advantageous to scaling by eliminating a dummy region of a semiconductor device and an image sensor including the integrated circuit. the integrated circuit may comprise at least one cell, a planar transistor, and a vertical transistor. the at least one cell may comprise a first active region and a second active region adjacent to each other, at least one first active fin on the first active region and extending in a first direction, at least one second active fin on the second active region and extending in the first direction, and an active gate line vertically overlapping the first active region and the second active region and extending in a second direction perpendicular to the first direction.
20240282790. IMAGE SENSOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong Hoon KANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14618
Abstract: an image sensor package includes: a solder resist layer wrapping a redistribution layer and a connection pad; a mold layer on the solder resist layer and including an inner wall and an opposing outer wall, the inner wall defining a sensor array region; a logic chip on the solder resist layer and in the sensor array region, and contacting the mold layer; an image sensor chip on the logic chip and in the sensor array region, and contacting the mold layer; a transparent substrate spaced apart from the image sensor chip in a first direction; and an adhesive layer disposed between the transparent substrate and the mold layer. the mold layer includes a third face and a fourth face opposite to each other and connecting the inner wall and the outer wall. the fourth face of the mold layer does not overlap the image sensor chip in the first direction.
20240282792. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JAE-KWAN SEO of Suwon-si (KR) for samsung electronics co., ltd., YOUNGCHAN MO of Suwon-si (KR) for samsung electronics co., ltd., SORI PARK of Suwon-si (KR) for samsung electronics co., ltd., JINSU PARK of Suwon-si (KR) for samsung electronics co., ltd., HYEMI LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/13, H04N25/703
CPC Code(s): H01L27/14621
Abstract: an image sensor includes: a substrate including a pixel region and an optical black region, the optical black region including a dummy pixel region adjacent to the pixel region; a first color filter array on the pixel region; and a second color filter array on the dummy pixel region, wherein the substrate has a first surface, each of the first color filter array and the second color filter array is on the first surface of the substrate, and the second color filter array includes: a first filter that is transparent to a first ray; and a second filter that is transparent to a second ray.
20240282795. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungho CHA of Suwon-si (KR) for samsung electronics co., ltd., Kundong KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongkoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Suhyun JO of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B3/00
CPC Code(s): H01L27/14627
Abstract: an image sensor including a pixel array in which a plurality of pixels are arranged, and a nano-condensing lens array including a plurality of condensing areas respectively corresponding to the plurality of pixels. each of the plurality of condensing areas includes at least one nanostructure that condenses light on a corresponding pixel among the plurality of pixels, and the at least one nanostructure is arranged in each of the plurality of condensing areas such that a condensing capability of the at least one nanostructure included in each of the plurality of condensing areas varies according to a distance from a center of the nano-condensing lens array to each of the plurality of condensing areas.
Inventor(s): JUNGHO PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: the present disclosure relates to an image sensor and a method of manufacturing thereof, and the image sensor may include: a substrate including a first surface and a second surface opposite the first surface with a thickness therebetween, a plurality of unit pixels including a photoelectric conversion layer within the substrate, a pixel isolation pattern that extends from the second surface of the substrate to the first surface of the substrate within the substrate between the plurality of unit pixels, and a surface insulating film that has flat upper and lower surfaces and is disposed on the plurality of unit pixels of the substrate and the pixel isolation pattern, wherein the pixel isolation pattern includes a first pixel isolation filling film including a first material, a first void, a second pixel isolation filling film including a second material, and a second void, the second pixel isolation filling film extends from the second surface to the first surface, the second void is between the second pixel isolation filling film and the first surface, and the first material and the second material are different from each other.
Inventor(s): Takekazu Shinohara of Suwon-si (KR) for samsung electronics co., ltd., Heetak Han of Suwon-si (KR) for samsung electronics co., ltd., Masato Fujita of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H01L21/223, H01L21/762, H01L21/768
CPC Code(s): H01L27/14683
Abstract: provided are an image sensor and a method of manufacturing the image sensor. the method includes forming a pixel isolation trench in a semiconductor substrate to extend from a first surface of the semiconductor substrate to the inside of the semiconductor substrate, forming a sacrificial layer on an inner wall of the pixel isolation trench, implanting a p-type impurity from a surface of the sacrificial layer into the sacrificial layer and the semiconductor substrate by a plasma doping process, a first concentration of the p-type impurity at the surface of the sacrificial layer being greater than a second concentration of the p-type impurity at a sidewall of the pixel isolation trench, removing the sacrificial layer, and forming a pixel isolation structure by forming an insulating liner and a conductive layer sequentially on the inner wall of the pixel isolation trench.
Inventor(s): Sungwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/15, H01L27/12, H01L33/00, H01L33/62
CPC Code(s): H01L27/156
Abstract: a set of light-emitting diodes may include: a first light-emitting diode may include a light-emitting surface and a pair of electrodes provided on an opposite surface of the light-emitting surface; and a second light-emitting diode may include a light-emitting surface and a pair of electrodes, the second light-emitting diode being connected to one side of the first light-emitting diode by a connection part. a thickness of the connection part may be less than a thickness of the first light-emitting diode and a thickness of the second light-emitting diode.
Inventor(s): Youngwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., KYOUNGWOO LEE of Suwon-si (KR) for samsung electronics co., ltd., MINCHAN GWAK of Suwon-si (KR) for samsung electronics co., ltd., Gukhee Kim of Suwon-si (KR) for samsung electronics co., ltd., SANGCHEOL NA of Suwon-si (KR) for samsung electronics co., ltd., Anthony Dongick Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: an embodiment provides a semiconductor device including a semiconductor substrate having first and second surfaces opposite each other, a channel pattern disposed on the first surface of the semiconductor substrate; source/drain patterns disposed on the first surface of the semiconductor substrate and disposed at both sides of the channel pattern; first and second etch stop films disposed on the first surface of the semiconductor substrate; a contact electrode electrically connected to the source/drain patterns; a lower wire structure disposed on the second surface of the semiconductor substrate; and a through via that passes through the semiconductor substrate, the first etch stop film, and the second etch stop film to connect the contact electrode and the lower wire structure, wherein the through via includes a first portion contacting the contact electrode and a second portion contacting the first portion and disposed between the first portion and the lower wire structure.
20240282829. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Young Woo Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Woo Lee of Suwon-si (KR) for samsung electronics co., ltd., Min Chan Gwak of Suwon-si (KR) for samsung electronics co., ltd., Guk Hee Kim of Suwon-si (KR) for samsung electronics co., ltd., Sang Cheol Na of Suwon-si (KR) for samsung electronics co., ltd., Anthony Dongick Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/48, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: a semiconductor device includes a substrate that has first and second surfaces opposite to each other in a first direction, a first fin-type pattern that protrudes in the first direction from the first surface of the substrate and extends in a second direction, a first source/drain pattern on the first fin-type pattern, a first source/drain contact on the first source/drain pattern, a contact connection via that extends in the first direction and is electrically connected to the first source/drain contact, a buried conductive pattern that is in the substrate, is electrically connected to the contact connection via, and has first and second surfaces opposite to each other in the first direction, the first surface of the buried conductive pattern facing the first source/drain contact, and first buried insulating liners that extend along sidewalls and along the first surface of the buried conductive pattern.
20240282830. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gyeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangmoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/4175
Abstract: a semiconductor device includes a substrate insulating layer; a gate structure extending in one direction on the substrate insulating layer; a source/drain region outside of the gate structure; and a backside contact plug below the source/drain region to have a second central axis offset from a first central axis of the source/drain region in a horizontal direction, and connected to the source/drain region, wherein the source/drain region includes a first epitaxial layer including a non-silicon element in a first concentration, and a second epitaxial layer on the first epitaxial layer and including a non-silicon element in a second concentration, higher than the first concentration, and at least a portion of an upper surface of the backside contact plug is in contact with the second epitaxial layer.
Inventor(s): Sanghoon UHM of Suwon-si (KR) for samsung electronics co., ltd., Min Hee CHO of Suwon-si (KR) for samsung electronics co., ltd., Wonsok LEE of Suwon-si (KR) for samsung electronics co., ltd., Wooje JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/51, H10B12/00
CPC Code(s): H01L29/42364
Abstract: a semiconductor device may include a bit line on the substrate, a channel pattern on the bit line and extending in a direction perpendicular to the bit line, a word line intersecting the bit line and spaced apart from the channel pattern, a gate insulating pattern between the channel pattern and the word line, an insulating pattern on the word line, and a landing pad connected to the channel pattern. the gate insulating pattern may include a first gate insulating pattern and a second gate insulating pattern having a first dielectric constant and a second dielectric constant, respectively. the second gate insulating pattern may be between the first gate insulating pattern and the word line. the first and second dielectric constants may be different. a first width of the first gate insulating pattern may be different from a second width of the second gate insulating pattern.
Inventor(s): Juyoun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyung Jong Lee of Osan-si (KR) for samsung electronics co., ltd., Seulgi Yun of Hwaseong-si (KR) for samsung electronics co., ltd., Seki Hong of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L27/092
CPC Code(s): H01L29/42372
Abstract: a semiconductor device includes a first active pattern on a substrate. the first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. a gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. the first gate spacer includes a first spacer and a second spacer. a top surface of the first spacer is lower than a top surface of the second spacer. a first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. the first blocking pattern is interposed between the gate contact and the second spacer.
Inventor(s): Juyoun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyung Jong Lee of Osan-si (KR) for samsung electronics co., ltd., Seulgi Yun of Hwaseong-si (KR) for samsung electronics co., ltd., Seki Hong of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L27/092
CPC Code(s): H01L29/42372
Abstract: a semiconductor device includes a first active pattern on a substrate. the first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. a gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. the first gate spacer includes a first spacer and a second spacer. a top surface of the first spacer is lower than a top surface of the second spacer. a first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. the first blocking pattern is interposed between the gate contact and the second spacer.
Inventor(s): Dongkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungil Park of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Park of Suwon-si (KR) for samsung electronics co., ltd., Jinwook Yang of Suwon-si (KR) for samsung electronics co., ltd., Jinchan Yun of Suwon-si (KR) for samsung electronics co., ltd., Cheoljin Yun of Suwon-si (KR) for samsung electronics co., ltd., Daewon Ha of Suwon-si (KR) for samsung electronics co., ltd., Kyuman Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L21/8238, H01L27/06, H01L27/088, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L29/78696
Abstract: an integrated circuit semiconductor device with three dimensional transistors includes two gate-all-around transistors or multi-bridge channel field effect transistors may be vertically stacked to reduce unit area. the two stacked transistors may be separated by an isolation insulating layer. the two stacked transistors may be positioned on two opposite sides of the isolation insulating layer, with the structure of the two stacked transistors positioned in an opposite manner. according to embodiments of the present disclosure, metal wiring layers may be connected to the two stacked transistors at their far ends, away from the isolation insulating layer. a method for manufacturing an integrated circuit semiconductor device according to the present disclosure is described. accordingly, aspects described herein may result in reduced unit area and easy manufacture of metal wiring layer connected to the transistors.
Inventor(s): Zhuo CHEN of Shenzhen (CN) for samsung electronics co., ltd.
IPC Code(s): H01P7/10, H01P3/16
CPC Code(s): H01P7/105
Abstract: a dielectric waveguide resonator includes: a dielectric resonant cavity including a dielectric body and a metal plating layer wrapping an outer surface of the dielectric body; and a metal interface provided in the dielectric body and connected to the metal plating layer, where the metal interface intersects a direction of an intrinsic electric field of the dielectric resonant cavity. the dielectric waveguide resonator includes a blind hole recessed inwards from a surface of the dielectric body, where a bottom surface of the blind hole includes the metal interface, and where an axial direction of the blind hole corresponds with the direction of the intrinsic electric field of the dielectric resonant cavity.
Inventor(s): Mincheol SEO of Suwon-si (KR) for samsung electronics co., ltd., Donghun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiho KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghyup LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyihyun JANG of Suwon-si (KR) for samsung electronics co., ltd., Huiwon CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q9/04
CPC Code(s): H01Q1/243
Abstract: an electronic device is provided. the electronic device includes a housing including a side member, a support member, a display, an antenna module including one or more patch antennas, a printed circuit board (pcb), a wireless communication circuit disposed on the pcb, a first conductive member, a first connector, a second connector, and a protrusion extending from the first end of the first conductive member toward an interior of the housing, and electrically connected to the first conductive member. the antenna module is disposed at locations corresponding to a first opening defined by the first conductive member, the support member, the first connector, and the second connector, and a second opening defined by the first conductive member, the support member, the first connector, and the protrusion, and the wireless communication circuit is electrically connected to the protrusion and the antenna module.
Inventor(s): Yongsang YUN of Suwon-si (KR) for samsung electronics co., ltd., Seongjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Gunbae LIM of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q9/04, H01Q1/42, H01Q21/06
CPC Code(s): H01Q9/045
Abstract: according to various embodiments of the present disclosure, an electronic device may comprise: a housing; a main circuit board disposed in the housing; an antenna module, comprising an antenna, disposed in the housing and including a first surface facing the outside of the electronic device and having a plurality of conductive patterns arranged on the first surface and a second surface facing a different direction from the first surface; a flexible printed circuit board at least a part of which is disposed at the second surface and which electrically connects the main circuit board and the antenna module to each other; and a cable connected to a seating surface formed by the flexible printed circuit board and is electrically connected to the antenna module.
Inventor(s): Munhyun OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01R12/51, H01R43/02, H05K1/02, H05K5/00
CPC Code(s): H01R12/51
Abstract: according to an embodiment, there may be provided an electronic device comprising: a housing including a conductive portion, a board disposed inside the housing, and a metal pad electrically connecting the board and the conductive portion and including a first surface at least partially facing the board and fixed to the board by soldering and a second surface at least partially facing the conductive portion and fixed to the conductive portion by laser welding or ultrasonic welding.
Inventor(s): Oleg PETRAKIVSKYI of Zhytomyr (UA) for samsung electronics co., ltd., Ivan DOROSHENKO of Chernihiv (UA) for samsung electronics co., ltd., Oleksandr BAIEV of Zaporizhzhia (UA) for samsung electronics co., ltd.
IPC Code(s): H02J7/00
CPC Code(s): H02J7/00032
Abstract: a battery apparatus including a plurality of slave battery management systems (bmss) configured to manage battery cells of battery modules, respectively and a master bms configured to manage the plurality of slave bmss, and in response to the master bms broadcasting a first address setting command to the plurality of slave bmss using a first interface, the plurality of slave bmss is configured to enter a target identification mode for identifying an address setting target among the plurality of slave bmss, and in response to the master bms transmitting an identification signal to the plurality of slave bmss using a second interface that is distinguished from the first interface, a first slave bms is identified among the plurality of slave bmss, where the first slave bms is configured to perform an address setting process according to the first address setting command.
Inventor(s): Youngwoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Daeyong HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00, G01R31/52
CPC Code(s): H02J7/0029
Abstract: a charger integrated circuit includes a plurality of power transistors configured to transmit one of a battery voltage, a charging voltage, and a load voltage as an internal power supply voltage based on a voltage selection control signal, a voltage selector configured to, determine a highest voltage among a battery voltage, a charging voltage, and a load voltage, and transmit the voltage selection control signal to the plurality of power transistors based on results of the determination, a short current limiter configured to, output the internal power supply voltage as a chip voltage, and limit a level of a short circuit current corresponding to the chip voltage in response to a current control signal, and a power drop sensor configured to generate the current control signal in response to a voltage level of the chip voltage being lower than a voltage level of a reference voltage.
20240283274. CHARGING INTEGRATED CIRCUITS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungwoo Moon of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo So of Suwon-si (KR) for samsung electronics co., ltd., Daewoong Cho of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan Cho of Suwon-si (KR) for samsung electronics co., ltd., Jungwook Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00
CPC Code(s): H02J7/00712
Abstract: a charging integrated circuit (ic) includes a battery, a switched capacitor ic comprising a second power stage for direct charging, and a switching charger ic comprising a first power stage for switching charging, a power meter configured to obtain information about input/output voltage and current, and a control circuit configured to perform switching charging by controlling the first power stage or perform direct charging through the switched capacitor ic by controlling the second power stage.
Inventor(s): Yongwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Deokjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo CHO of Suwon-si (KR) for samsung electronics co., ltd., Ukho SEO of Suwon-si (KR) for samsung electronics co., ltd., Jaewoong JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02K1/28, B29C45/14, B29K105/20, B29L31/00, D06F23/06, D06F37/30, H02K1/2791, H02K15/12, H02K21/22
CPC Code(s): H02K1/28
Abstract: an embodiment of the present invention relates to a motor assembly in which a rotor comprises: a rotor frame including a bottom surface having a rotating shaft at the center thereof and a side wall extending from the circumference of the bottom surface to surround the rotor in a circumferential direction; a plurality of cores disposed at the side wall along the circumferential direction; a plurality of permanent magnets disposed at the side wall along the circumferential direction and disposed between the plurality of cores, respectively; and an outer ring disposed at an outer surface, which is the opposite to the center of the rotor frame, along the circumferential direction, of the side wall, wherein the outer ring may be disposed apart from the plurality of cores and have the side wall therebetween. various other embodiments may also be possible.
Inventor(s): Yanru TANG of San Diego CA (US) for samsung electronics co., ltd., Hou-Shin CHEN of San Diego CA (US) for samsung electronics co., ltd., Sahana SADAGOPAN of San Diego CA (US) for samsung electronics co., ltd., Bhupinder SACHDEV of San Diego CA (US) for samsung electronics co., ltd., Pranav DAYAL of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H03F1/32, H04L27/36, H04W52/08
CPC Code(s): H03F1/3258
Abstract: methods and devices are provided in which a processor of a user equipment (ue) combines loop-back signals from a plurality of antenna paths of the ue to generate a combined signal. the loop-back signals are based on a signal transmitted over the antenna paths. the processor determines power amplifier (pa) polynomials based on a comparison of the combined signal to the signal transmitted over the antenna paths. the processor generates a single look-up table (lut) for the pa polynomials. the processor applies the single lut to a transmitted signal of the ue to compensate for pa non-linearity
Inventor(s): Youngyoon WOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H04L5/14
CPC Code(s): H04B1/04
Abstract: the disclosure relates to a 5generation (5g) or pre-5g communication system for supporting a data transmission rate higher than that of a 4generation (4g) communication system such as long-term evolution (lte). a method performed by a base station in a wireless communication system is provided. the method includes acquiring, by the base station, a first output signal of digital predistortion (dpd), identifying, by the base station, a distortion section from the starting point of a downlink section after an uplink section has ended in a time division duplex (tdd) configuration, identifying, by the base station, compensation information for a power amplifier of a base station in the distortion section, and providing, by the base station, a signal in which the compensation information is applied to a second output signal of the dpd to the power amplifier.
Inventor(s): Himanshu KUMAR of Bengaluru (IN) for samsung electronics co., ltd., Vivekanandan SREENIVASAN of Bengaluru (IN) for samsung electronics co., ltd., Pavan Kumar PANAKALAPATI of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04B5/20, H04B5/43
CPC Code(s): H04B5/20
Abstract: a method of controlling an electronic device executing near-field communication (nfc) transactions, may include: obtaining a plurality of context parameters related to an nfc transaction to be performed; identifying an optimal radio frequency (rf) configuration from a plurality of rf configurations for executing the nfc transaction by inputting the plurality of context parameters into an artificial intelligence (ai) model; and executing the nfc transaction using the optimal rf configuration. the ai model may be configured to establish correlations of the plurality of context parameters with the plurality of rf configurations.
Inventor(s): Sungchul PARK of Suwon-si (KR) for samsung electronics co., ltd., Boon Loong NG of Santa Clara CA (US) for samsung electronics co., ltd., Suha YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04B7/06, H04B7/08
CPC Code(s): H04B7/0473
Abstract: an electronic device is provided. the electronic device includes a plurality of antennas, communication circuit, and a processor operatively connected to the communication circuit. the processor may be configured to transmit capability information of the electronic device to a base station, transmit channel state information measured based on a reference signal received through the plurality of antennas from the base station, receive antenna control information determined based on at least one of the capability information and the channel state information from the base station, and drive the plurality of antennas by selecting one of a polarization multiple-input multiple-output (mimo) mode and a spatial mimo mode based on the antenna control information.
Inventor(s): Myeongjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Chulho Chung of Suwon-si (KR) for samsung electronics co., ltd., Jinmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Eunsung Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L25/02, H04W84/12
CPC Code(s): H04L5/0035
Abstract: an operating method of a first apparatus in a wireless local area network (wlan) system includes receiving a multiple access point (map) network frame from a second apparatus, identifying, from the map network frame, joint null data packet (ndp) transmission for map sounding and first interleaved subcarriers according to the joint ndp transmission, and based on the joint ndp transmission, transmitting a first ndp to a third apparatus by using the first interleaved subcarriers.
Inventor(s): Mohamed Mokhtar Gaber Moursi AWADIN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L5/14
CPC Code(s): H04L5/0051
Abstract: a system and a method are disclosed for a terminal in a wireless communication system. the method includes monitoring for at least one of a first condition or a second condition, wherein the first condition includes a csi-rs or a pdsch overlapping with an uplink subband in a subband full-duplex operation and becoming non-contiguous in a frequency domain, and wherein the second condition includes different network antenna patterns or power patterns being used in a network energy saving operation for transmission of the csi-rs; and relaxing processing requirements related to at least one of a processing timeline or occupied computational resources, in response to the first condition or the second condition occurring.
Inventor(s): Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd., Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W64/00, H04W76/20
CPC Code(s): H04L5/0051
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. a method performed by a first base station (bs) in a wireless communication system is provided. the method includes transmitting, to a second base station (bs), a retrieve user equipment (ue) context request message for sounding reference signal (srs) configuration, and receiving requested sounding reference signal (srs) transmission characteristics for the srs configuration.
Inventor(s): Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L27/26, H04W72/0453
CPC Code(s): H04L5/0053
Abstract: apparatuses and methods for waveform determination for uplink (ul) transmissions. a method includes receiving first information indicating whether transform precoding is enabled or disabled, second information indicating a presence of a transform precoder indication (tpi) field in a downlink control information (dci) format, third information for a configuration related to a resource allocation associated with transmissions of physical uplink shared channels (puschs) with transform precoding disabled, and a channel providing the dci format that schedules a transmission of a pusch. the method further includes determining whether the transform precoding is enabled based on the tpi field, that the configuration is used when transform precoding is disabled, and that the configuration is not used when transform precoding is enabled. the method further includes transmitting the pusch with transform precoding and without the configuration, when transform precoding is enabled, or without transform precoding and with the configuration, when transform precoding is disabled.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/40
CPC Code(s): H04L5/0092
Abstract: apparatuses and methods for transport block set (tbs) determination in sidelink transmission. a method of a user equipment (ue) includes determining, based on higher layer parameters, a number of candidate starting symbols for a physical sidelink shared channel (pssch) in a slot; determining a number of sidelink symbols within a slot based on the number of candidate starting symbols for the pssch; and determining, based on the number of sidelink symbols, a first number of resource elements (res) allocated for the pssch within a physical resource block. the method further includes determining a number of prbs allocated for the pssch; determining a second number of res allocated for the pssch based on (i) the number of res allocated for the pssch within a prb and (ii) the number of prbs allocated for the pssch; and receiving the pssch based on the second number of res allocated for the pssch.
Inventor(s): Seungri JIN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/23
CPC Code(s): H04L5/0098
Abstract: the present invention relates to a method and device for activating a pdcch reception beam for multiple carriers simultaneously, on the basis of an rrc message comprising a first list and a second list which are lists of serving cells to which update of a tci state is to be simultaneously applied, and a mac ce comprising an identifier of the serving cells, an identifier of a coreset, and an identifier of a tci state.
Inventor(s): Chadi KHIRALLAH of Staines (GB) for samsung electronics co., ltd., Joan PUJOL ROIG of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04L41/16, H04L41/06, H04W24/02
CPC Code(s): H04L41/16
Abstract: the disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system for supporting a higher data transmission rate. a method for supporting artificial intelligence/machine learning (ai/ml) by a first network entity in a wireless communication system is provided. the method includes transmitting, to a second network entity, a data collection request message related to data collection for supporting the ai/ml, and receiving, from the second network entity, a data collection response message based on a successful operation related to the data collection.
Inventor(s): Ramesh Chandra VUPPALA of Bangalore (IN) for samsung electronics co., ltd., Dixit KUMAR of Bangalore (IN) for samsung electronics co., ltd., Donghyun JE of Suwon-si (KR) for samsung electronics co., ltd., Neha SHARMA of Bangalore (IN) for samsung electronics co., ltd., Anshuman NIGAM of Bangalore (IN) for samsung electronics co., ltd., Dongmyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/40, H04L9/08, H04L9/14, H04L9/30
CPC Code(s): H04L63/0428
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a terminal for dynamic data encryption in a communication system is provided. the method includes receiving, from a network entity, a list of network public keys including a plurality of network public keys and corresponding key indexes, generating a pair of keys including a user equipment (ue) public key and a ue private key in response to receiving the list of network public keys, randomly selecting a network public key from the list of network public keys received from the network entity, generating a shared secret key corresponding to the ue by using the randomly selected network public key and the ue private key, and encrypting data to be transferred between the ue and the network entity by using the generated shared secret key corresponding to the ue.
Inventor(s): Euijun KIM of Suwon-si (KR) for samsung electronics co., ltd., Dahye SHIM of Suwon-si (KR) for samsung electronics co., ltd., Donghun SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/7243, H04M1/72415, H04R1/02
CPC Code(s): H04M1/7243
Abstract: a method of adjusting a volume of an audio signal output from an electronic device. in particular, the method of adjusting a volume of an audio signal output from an electronic device includes: obtaining, from an external source, information related to adjustment of the volume of the audio signal which is output from the electronic device; determining, based on the obtained information, whether to adjust the volume of the audio signal output from the electronic device; and adjusting, based on the determining, the volume of the audio signal output from the electronic device.
Inventor(s): Hee KANG of Hwaseong-si (KR) for samsung electronics co., ltd., Young-Jun SONG of Seoul (KR) for samsung electronics co., ltd., Dong-Ki MIN of Seoul (KR) for samsung electronics co., ltd., Jong-Min YOU of Seongnam-si (KR) for samsung electronics co., ltd., Jee-Hong LEE of Seoul (KR) for samsung electronics co., ltd., Seok-Jae KANG of Seoul (KR) for samsung electronics co., ltd., Taek-Sun KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Joon-Hyuk IM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N13/271, H04N13/00, H04N13/239, H04N23/10, H04N23/62, H04N23/80, H04N25/75, H04N25/778
CPC Code(s): H04N13/271
Abstract: an image signal processor includes a register and a disparity correction unit. the register stores disparity data obtained from a pattern image data that an image senor generates, and the image sensor includes a plurality of pixels, and each of the pixel includes at least a first photoelectric conversion element and a second photoelectric conversion element. the image sensor generates the pattern image data in response to a pattern image located at a first distance from the image sensor. the disparity correction unit corrects a disparity distortion of an image data based on the disparity data to generate a result image data, and the image senor generates the image data by capturing an object.
Inventor(s): Geonjung KO of Seoul (KR) for samsung electronics co., ltd., Dongcheol KIM of Suwon-Si (KR) for samsung electronics co., ltd., Juhyung SON of Uiwang-Si (KR) for samsung electronics co., ltd., Jaehong JUNG of Seoul (KR) for samsung electronics co., ltd., Jinsam KWAK of Anyang-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/105, H04N19/132, H04N19/159, H04N19/176, H04N19/46, H04N19/82
CPC Code(s): H04N19/105
Abstract: a video signal processing method includes: a step for deriving an intra prediction mode of a current block; a step for constructing a reference sample around the current block; a step for generating a prediction sample of the current block by using the reference sample on the basis of the intra prediction mode; and a step for restoring the current block on the basis of the prediction sample. the step for generating the prediction sample may include: a step for setting a filter flag value which specifies a filter coefficient of an interpolation filter applied to the reference sample on the basis of the width and height of the current block; and a step for performing filtering on the reference sample by using the interpolation filter having the filter coefficient specified by the filter flag.
Inventor(s): Geonjung KO of Seoul (KR) for samsung electronics co., ltd., Dongcheol KIM of Suwon-Si (KR) for samsung electronics co., ltd., Juhyung SON of Uiwang-Si (KR) for samsung electronics co., ltd., Jaehong JUNG of Seoul (KR) for samsung electronics co., ltd., Jinsam KWAK of Anyang-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/105, H04N19/132, H04N19/159, H04N19/176, H04N19/46, H04N19/82
CPC Code(s): H04N19/105
Abstract: a video signal processing method includes: a step for deriving an intra prediction mode of a current block; a step for constructing a reference sample around the current block; a step for generating a prediction sample of the current block by using the reference sample on the basis of the intra prediction mode; and a step for restoring the current block on the basis of the prediction sample. the step for generating the prediction sample may include: a step for setting a filter flag value which specifies a filter coefficient of an interpolation filter applied to the reference sample on the basis of the width and height of the current block; and a step for performing filtering on the reference sample by using the interpolation filter having the filter coefficient specified by the filter flag.
Inventor(s): Geonjung KO of Seoul (KR) for samsung electronics co., ltd., Dongcheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Juhyung SON of Uiwang-Si (KR) for samsung electronics co., ltd., Jaehong JUNG of Seoul (KR) for samsung electronics co., ltd., Jinsam KWAK of Anyang-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/105, H04N19/132, H04N19/159, H04N19/176, H04N19/46, H04N19/82
CPC Code(s): H04N19/105
Abstract: a video signal processing method includes: a step for deriving an intra prediction mode of a current block; a step for constructing a reference sample around the current block; a step for generating a prediction sample of the current block by using the reference sample on the basis of the intra prediction mode; and a step for restoring the current block on the basis of the prediction sample. the step for generating the prediction sample may include: a step for setting a filter flag value which specifies a filter coefficient of an interpolation filter applied to the reference sample on the basis of the width and height of the current block; and a step for performing filtering on the reference sample by using the interpolation filter having the filter coefficient specified by the filter flag.
Inventor(s): Yangsoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/431, H04N21/44
CPC Code(s): H04N21/4316
Abstract: a method of controlling a display module and an electronic device for performing the method are disclosed. the electronic device may include: at least one processor including processing circuitry, a display module, a memory electrically connected to the at least one processor and configured to store instructions and an application executable by the at least one processor. the at least one processor is configured, when the instructions are executed to: identify video data on a size, a state, and a position of a video object executed by the application, and based on an input not being received in a specified input waiting time, control a screen output on the display module based on the video data.
Inventor(s): Hyeyun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Joonyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Daeho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/68, H04N23/80
CPC Code(s): H04N23/683
Abstract: an electronic device includes a motion sensor, an image signal processor core, an image stabilizer, and an image size controller. the motion sensor generates camera motion data by sensing motion of a camera module that captures an image to generate an original frame image. the image signal processor core generates processed frame image by processing input frame image corresponding to the original frame image. the image stabilizer generates an output frame image by performing electronic image stabilization of the processed frame image. the image size controller estimates a motion level indicating a degree of camera motion of the camera module based on the camera motion data and control a size of the input frame image or a size of the output frame image based on the motion level. the image stabilization is efficiently performed by estimating camera motion and adjusting the image size according to the camera motion.
Inventor(s): Jung Wook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/59, H04N25/46, H04N25/766
CPC Code(s): H04N25/59
Abstract: an image sensing device includes a pixel array including a plurality of unit pixels, and a driving unit configured to drive each unit pixel of the plurality of unit pixels. each unit pixel comprises: a first region including a first photodiode, a first floating diffusion region, and a second floating diffusion region, a second region including a second photodiode and a third floating diffusion region, and a floating diffusion (fd) connecting transistor connected to any one of the first floating diffusion region, the second floating diffusion region or the third floating diffusion region. the driving unit is configured to alternately perform a normal operation of individually operating the plurality of unit pixels, and a binning operation of grouping at least two unit pixels of the plurality of unit pixels and operating the at least two unit pixels simultaneously.
Inventor(s): Sanghee Park of Suwon-si (KR) for samsung electronics co., ltd., Seongjin Choe of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/772, H04N25/633
CPC Code(s): H04N25/772
Abstract: an image sensor device, including a pixel array comprising a plurality of optical black pixels and a plurality of active pixels, wherein the plurality of optical black pixels are configured to be read out during a first time period to generate first data voltages and the plurality of active pixels are configured to be read out during a second time period after the first time period to generate second data voltages; an analog-to-digital converter configured to output first pixel codes based on the first data voltages, and to output second pixel codes based on the second data voltages; an image signal processor configured to output image frame data based on the first pixel codes and the second pixel codes; and a dummy code generator configured to provide dummy codes to the image signal processor during a third time period between a first time point and a second time point, wherein the first time point is before the first time period.
Inventor(s): Kwangbok PARK of Suwon-si (KR) for samsung electronics co., ltd., Duckjo SON of Suwon-si (KR) for samsung electronics co., ltd., Changjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongjoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R3/04, G06F3/16
CPC Code(s): H04R3/04
Abstract: disclosed is an electronic device. the electronic device comprises: a speaker; a memory in which filter information for each of a plurality of volume levels is stored for each of characteristic values of a plurality of speakers; and at least one processor, comprising processing circuitry, individually and/or collectively, configured to: obtain filter information for each of the plurality of volume levels corresponding to the characteristic values of the speaker among stored filter information based on characteristic values of the speaker, set a filter based on filter information corresponding to a volume level of the electronic device among the obtained filter information, perform signal processing on an audio signal using the set filter, and control the speaker to output the processed audio signal.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04L43/0811, H04W74/0816, H04W76/19
CPC Code(s): H04W24/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system including: receiving a configuration associated with beam failure recovery (bfr) including beam failure detection reference signal (bfd-rs) resources, wherein the bfd-rs resources are configured in an unlicensed band; identifying a first number of beam failure instance indications (bfis) based on radio link quality associated with the bfd-rs resources; incrementing a bfi counter by the first number; and decrementing the incremented bfi counter in case that information associated with a second number of periods for the bfd-rs resources is received, wherein at least part of the second number of periods is associated with listen before talk (lbt) failure.
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L5/00
CPC Code(s): H04W24/10
Abstract: methods and apparatuses for channel state information (csi) reporting for multi-transmit receive point (trp) coherent joint transmission (cjt). a method includes receiving a configuration about a csi report. the configuration includes information about (i) ncsi reference signal (csi-rs) resources. the method further includes, based on the configuration, determining information for the csi report based on n csi-rs resources; partitioning the csi report into two parts, a csi part 1 and a csi part 2; and partitioning the csi part 2 into three groups, g0, g1, and g2. the method further includes transmitting the csi part 1 and at least a portion of the csi part 2. the group g1 includes an indicator indicating, for each of n−1 csi-rs resources of the n csi-rs resources, a frequency-domain (fd) offset d∈{0, 1, . . . , no−1} relative to a reference csi-rs resource.
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04B7/06, H04L5/00, H04W72/20
CPC Code(s): H04W24/10
Abstract: methods and apparatuses for channel state information (csi) measurement and reporting with network adaptation. a method for a user equipment (ue) includes receiving first information related to reception of one or more non-zero power csi reference signals (nzp csi-rss) on a cell, second information related to determining a csi report, third information related to indicating a second number csi sub-reports from the first number of csi sub-reports, fourth information related to an uplink (ul) channel for transmitting the csi report, and the one or more nzp csi-rss. the method further includes determining the second number of csi sub-reports and a third number of csi sub-reports from the second number of csi sub-reports based on the fourth information. the method further includes transmitting the ul channel with the csi report including the third number of csi sub-reports.
Inventor(s): Weiping SUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10
CPC Code(s): H04W24/10
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system including: receiving measurement configuration information including information on a predefined event, wherein the predefined event corresponds to a first event and a second event; identifying, based on the information on the predefined event, whether an entering condition for the predefined event is satisfied, wherein the entering condition for the predefined event is satisfied in case that both an entering condition for the first event and an entering condition for the second event are fulfilled; and transmitting measurement report based on the identification.
Inventor(s): Seungri JIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08
CPC Code(s): H04W36/0085
Abstract: the present disclosure relates to a 5th-generation (5g) or 6th-generation (6g) communication system for supporting higher data rates. a user equipment (ue) according to an embodiment of the present disclosure may receive configuration information about channel measurement for supporting an additional cell, perform, based on the configuration information about the channel measurement, channel measurement on at least one additional cell configured for the ue, receive a medium access control (mac) control element (ce) indicating beam switching by the ue, based on a report on the channel measurement, and perform transmission or reception of data by using a beam switched based on the received mac ce.
Inventor(s): Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., June HWANG of Suwon-si (KR) for samsung electronics co., ltd., Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/00
CPC Code(s): H04W36/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for processing a control signal in a wireless communication system of the disclosure may include: receiving a first control signal transmitted from a base station; processing the received first control signal; generating a second signal, based on the processing; and transmitting the generated second control signal to the base station.
Inventor(s): Keonyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Poongup LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/14, H04W36/00, H04W36/18, H04W84/06, H04W88/06
CPC Code(s): H04W36/14
Abstract: an electronic device includes a communication circuit configured to support cellular communication through a terrestrial network and a non-terrestrial network and at least one communication processor, comprising processing circuitry, wherein at least one communication processor, individually and/or collectively, is configured to: determine, based on a frequency of a terrestrial network having a previous connection history before a connection to the non-terrestrial network and/or frequency information of a pre-stored terrestrial network, a frequency of the terrestrial network to be found, perform a search for the terrestrial network in a section in which data is not received, based on a location of the electronic device, and determine whether to release a connection with the non-terrestrial network and make the connection to the terrestrial network according to whether a specified condition is satisfied based on the terrestrial network being found.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/18, H04L1/08, H04L1/1812, H04W36/00, H04W74/0833
CPC Code(s): H04W36/18
Abstract: the present disclosure relates to a communication technique which combines a 5g communication system, for supporting a higher data transmission rate than 4g systems, with iot technology, and a system for same. the present invention may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, smart retailers, security and safety-related services, or the like) based on 5g communication technology and iot-related technology. the present disclosure relates to a method and device for performing an efficient handover, without the suspension of data transmission and reception, upon handover in a next generation mobile communication system.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Chadi KHIRALLAH of Staines (GB) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/14, H04W60/06
CPC Code(s): H04W48/14
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes identifying a reason for an access attempt, and determining, based on the reasons for the access attempt, whether to provide at least one single network slice selection assistance information (s-nssai) related to the access attempt from a non-access stratum (nas) layer to a lower layer.
Inventor(s): Kyungjoo SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W60/00, H04W84/06, H04W88/06
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment, a method by a user equipment (ue) communicating with a satellite radio access network (ran) and a cellular network may comprise transmitting, to an access and mobility management function (amf), a registration request message including information about the ue's supporting capability for each of a first timer for the satellite ran and a second timer for the cellular network, an access cell type, and location information, receiving, from the amf, a registration accept message including supporting information about a network related to the first timer and the second timer and mobility management information, and determining at least one timer to be used by the ue of the first timer and the second timer based on the supporting information about the network and the mobility management information.
Inventor(s): Hwasun YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/24, H04W52/26, H04W52/36
CPC Code(s): H04W52/241
Abstract: the disclosure relates to a 5th generation (5g) or pre-5g communication system for supporting a higher data transfer rate than a 4th generation (4g) communication system such as long term evolution (lte). a method performed by a base station in a wireless communication system is provided. the method includes decreasing a size of a transport block for a data packet when a size of a downlink data packet is less than or equal to a size of a predetermined minimum allocation resource, determining a transmit signal scaling factor for decreasing transmit power of the data packet, and determining the transmit power of the data packet, based on the transmit signal scaling factor.
20240284343. SL POWER CONTROL_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/24
CPC Code(s): H04W52/242
Abstract: methods and apparatuses for sidelink (sl) power control. a user equipment (ue) includes a transceiver configured to receive, from a second ue, a first sidelink (sl) reference signal (rs) and receive, from the second ue, information related to a transmit power for the first sl rs. the ue further includes a processor operably coupled to the transceiver. the processor is configured to calculate a first filtered rs receive power (rsrp) for the first sl rs, calculate a first pathloss for the first sl rs based on a difference between the transmit power and the first filtered rsrp, and determine, based on the first pathloss, a first power for a first sl channel. the transceiver is further configured to transmit, based on a first spatial domain transmission filter, the first sl channel using the first power. the first spatial domain transmission filter is associated with the first sl rs.
Inventor(s): Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02
CPC Code(s): H04W68/02
Abstract: the disclosure provides a method performed by a user equipment (ue) in a wireless communication system. the method includes receiving system information, identifying whether first information on a number of subgroups for ue identity (id) based subgrouping is configured in the system information, and monitoring a paging early indication, wherein in case that the first information is not configured, the paging early indication is monitored based on a subgroup id assigned by a core network (cn).
Inventor(s): Junyung YI of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04L5/14
CPC Code(s): H04W72/0446
Abstract: the present disclosure relates to: a communication technique merging iot technology with a 5g communication system for supporting a data transmission rate higher than that of a 4g system; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, and the like) on the basis of 5g communication technology and iot-related technology. the disclosure provides a method for improving the coverage of an uplink channel for uplink transmission.
Inventor(s): Euichang JUNG of Seoul (KR) for samsung electronics co., ltd., Suha YOON of Yongin-si (KR) for samsung electronics co., ltd., Suyoung PARK of Uiwang-si (KR) for samsung electronics co., ltd., Sunghyuk SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04W72/23
CPC Code(s): H04W72/0446
Abstract: an example communication method in a terminal of a mobile communication system includes receiving, from a base station, first information associated with a resource allocation scheme for a first service and a second service; receiving, from the base station, control information associated with the first service; and receiving, from the base station, data for the first service on the basis of the control information and the first information.
20240284428. SL BEAM INDICATION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Dalin Zhu of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/044, H04L5/00, H04W72/40
CPC Code(s): H04W72/046
Abstract: methods and apparatuses for sidelink (sl) beam indication. a method of operating a user equipment (ue) includes transmitting, to a second ue, a first set of reference signals or receiving, from the second ue, a second set of reference signal. the method further includes identifying a beam indication for transmission to or reception from the second ue; determining, based on the beam indication, a spatial transmission filter or a spatial reception filter; and determining a time t to apply the beam indication. the beam indication is associated with a reference signal from the first set of reference signals or the second set of reference signals. the method further includes transmitting, to the second ue, a first sl channel using the spatial transmission filter starting from the time t or receiving, from the second ue, a second sl channel using the spatial reception filter starting from the time t.
Inventor(s): Di SU of Beijing (CN) for samsung electronics co., ltd., Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Chen QIAN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L1/1829
CPC Code(s): H04W72/23
Abstract: the present invention discloses a method for receiving scheduling information, comprising steps of: receiving downlink control information (dci); and determining, according to a mapping relationship between configured transmission resources used for a physical uplink shared channel (pusch) and scheduling information in the dci, scheduling information corresponding to the pusch in the dci. compared with the prior art, in the present invention, the scheduling information in the dci is determined by the mapping relationship between the configured transmission resources used for transmitting the pusch by a ue and the scheduling information in the dci, so that a base station can schedule all ues for which there is a mapping relationship between pusch configured transmission resources and the scheduling information in dci by sending only one piece of dci. the scheduling overhead is reduced, the resource waste is reduced, and the efficiency of scheduling terminals by a communication system is significantly improved.
Inventor(s): Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04W52/36, H04W72/1268, H04W80/02
CPC Code(s): H04W72/232
Abstract: methods and apparatuses for power information for uplink configurations. a method includes receiving information indicating that a first downlink control information (dci) format scheduling transmission of a physical uplink shared channel (pusch) includes a transform precoding indication (tpi) field and a channel providing a dci format scheduling transmission of a first pusch. the method further includes determining whether the dci format is the first or a second dci format and a power headroom report (phr). when the second dci format, the phr includes a single phr associated with a transform precoding used for the transmission of the first pusch. when the first dci format, the phr includes first and second phrs associated with first and second transform precodings, respectively, for the transmission of the first pusch. the method further includes transmitting the first pusch with the phr using either the first or second transform precoding.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W72/30, H04L27/26, H04W72/0453, H04W72/51
CPC Code(s): H04W72/30
Abstract: embodiments disclosed herein relate to methods and systems for shared processing for simultaneous mbs and unicast reception. the methods disclose enhanced interest indication signaling for simultaneous mbs and unicast reception from one or more networks. the methods include receiving, from a primary cell (pcell) of a serving base station, a system information block (sib) including information on a transmission of a mbs interest indication (mii) message for a mbs broadcast reception on a non-serving cell; in case a mii message setting condition associated with the non-serving cell is satisfied, setting a content of the mii message; and based on the information, transmitting, to the serving base station, the mii message.
20240284511. MULTIPLE TRANSMISSIONS OF A PRACH_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04L1/08, H04W74/00
CPC Code(s): H04W74/0833
Abstract: apparatuses and methods for multiple transmissions of a physical random access channel (prach). a method for includes identifying a set of numbers of repetitions for the prach preamble transmission and a first mapping among values of a prach mask index and a set of groups of prach occasions and receiving a downlink control information (dci) format for a physical downlink control channel (pdcch) order that indicates: a first value for a prach preamble index, a second value for a synchronization signal and physical broadcast channel (ss/pbch) block index, and a third value for the prach mask index. the method further includes determining a number of repetitions from the set of numbers of repetitions and based on the third value and the first mapping, a group of prach occasions and transmitting the prach preamble with the number of repetitions over the group of prach occasions.
Inventor(s): Sivasankar COMARAVELOU of Bengaluru (IN) for samsung electronics co., ltd., Prasad Basavaraj DANDRA of Bengaluru (IN) for samsung electronics co., ltd., Chetan Ramesh GANIG of Bengaluru (IN) for samsung electronics co., ltd., Lalith KUMAR of Bengaluru (IN) for samsung electronics co., ltd., Venkata Anil Kumar KARAMSETTI of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/18, H04W48/02, H04W48/18, H04W60/06, H04W84/04
CPC Code(s): H04W76/18
Abstract: a method implemented in a user equipment (ue) for service recovery in a wireless communication network includes establishing a first radio resource control (rrc) connection with a public land mobile network (plmn) via a first cell corresponding to a network, transmitting, to the network, a protocol data unit (pdu) establishment request for a service from the first cell using the first rrc connection, receiving, from the network in response to the pdu establishment request, a pdu establishment failure message based on at least location information of the ue, performing a local deregistration with the first cell based on the pdu establishment failure message, and establishing a second rrc connection with the plmn via a second cell corresponding to the network.
Inventor(s): Mahmoud WATFA of Staines, Middlesex (GB) for samsung electronics co., ltd., Mehrdad SHARIAT of Staines, Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): H04W76/27, H04W76/23, H04W92/18
CPC Code(s): H04W76/27
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of operating a user equipment, ue, operable to communicate with a telecommunication network, wherein if the ue is in 5gmm-connected mode with rrc inactive indication and the ue wishes to use pc5 resources for communication, then the ue requests a transition to rrc_connected state.
Inventor(s): Vijay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/40, H04W36/08, H04W76/19, H04W76/20, H04W76/30
CPC Code(s): H04W76/40
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method comprises receiving, from a base station, a radio resource control (rrc) release message including multicast broadcast services (mbs) configuration information and multicast control channel (mcch) configuration information, wherein the mbs configuration information includes at least one of a list of neighboring cells, a group-radio network temporary identifier (g-rnti), or an mbs session identity (id), and the mcch configuration information is associated with reception of a mbs multicast in an rrc inactive state and in case that a multicast session that the ue joined is not provided for the rrc inactive state in a current cell, performing an rrc connection resume.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Suyoung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W80/08, H04W28/06, H04W76/27, H04W80/02
CPC Code(s): H04W80/08
Abstract: provided is an operating method of a user equipment (ue) in a wireless communication system, the operating method including: receiving, from a base station, a radio resource control (rrc) message including packet data convergence protocol (pdcp) layer configuration information for each data radio bearer (drb); and when a pdcp entity is configured to be reestablished for each drb and the pdcp layer configuration information includes an indicator indicating to continuously use header compression protocol configuration information, indicating to a lower layer entity that the header compression protocol configuration information is configured to be continuously used.
Inventor(s): Youngmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yeonggyu YOON of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd., Gabseong LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H01F7/02
CPC Code(s): H05K5/0226
Abstract: an electronic device according to an embodiment of the present disclosure may comprise: a housing comprising a first housing and a second housing accommodating at least one part of the first housing and configured to guide sliding movement of the first housing; a display configured to be extended based on the sliding movement of the first housing; and a driving element formed so as to provide a driving force for the sliding movement of the first housing. the driving element may comprise: a shaft structure comprising a shaft and a sliding portion configured to slide relative to the shaft; an arm structure comprising a first arm, rotatably connected to the first housing and the sliding portion, and a second arm rotatably connected to the second housing and the sliding portion; an elastic structure comprising a spring surrounding at least a part of the shaft and configured to provide elasticity to the sliding portion; and a link structure comprising a first link, rotatably connected to the shaft and the first arm, and a second link rotatably connected to the shaft and the second arm.
20240284621. WEARABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chungsoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeongho AHN of Suwon-si (KR) for samsung electronics co., ltd., Bareum PARK of Suwon-si (KR) for samsung electronics co., ltd., Yangji JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K1/02, H05K1/11, H05K5/00
CPC Code(s): H05K5/0273
Abstract: according to an embodiment of the disclosure, an electronic device may include: a housing, a printed circuit board disposed in the housing, the printed circuit board including a wireless communication module comprising communication circuitry, a radio frequency switch, a first electronic component comprising circuitry, and a second electronic component, comprising circuitry, electrically connected to the radio frequency switch, and a shield can disposed on the printed circuit board to cover at least a partial area of the printed circuit board and including multiple pads in contact with the printed circuit board, and an antenna module, comprising at least one antenna, configured to transmit and/or receive signals and/or power between external electronic devices using at least part of the housing and at least part of the shield can, wherein the multiple pads include a first pad electrically connected to the radio frequency switch and a second pad electrically connected to the first electronic component, the multiple pads are configured to be electrically isolated from the printed circuit board, and the radio frequency switch is configured to select one of a first path configured to cause the antenna module to have a first radiation efficiency based on a signal of a first frequency band provided from the wireless communication module being applied to the first path, and a second path configured to cause the antenna module to have a second radiation efficiency different from the first radiation efficiency based on a signal of the first frequency band being applied to the second path, and is connected to the second electrical component.
Inventor(s): Wonsun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/03, C03C15/00, C03C21/00, H04M1/02, H05K5/02
CPC Code(s): H05K5/03
Abstract: a flexible display is provided. the flexible display includes a display panel and a transparent member disposed on the display panel. the transparent member may a first glass portion having a first thickness, and a second glass portion having a second thickness thinner than the first thickness. an upper surface of the second glass portion is recessed in a direction toward the display panel with respect to an upper surface of the first glass portion. a lower surface of the second glass portion is recessed in an opposite direction to the display panel with respect to a lower surface of the first glass portion.
Inventor(s): Minho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Chansic YOON of Suwon-si (KR) for samsung electronics co., ltd., Chulkwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaybok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/34
Abstract: a semiconductor device includes a substrate having a plurality of active regions and defining a plurality of first gate trenches and a plurality of second gate trenches crossing the plurality of active regions and extending in a first horizontal direction, a plurality of gate structures including a plurality of first gate structures within the plurality of first gate trenches and a plurality of second gate structures within the plurality of second gate trenches, a bit line structure crossing the plurality of gate structures and extending in a second horizontal direction that intersects the first horizontal direction, and a contact plug disposed on a side surface of the bit line structure. when viewed in plan view, an area of at least some of the plurality of first gate structures is different from an area of at least some of the plurality of second gate structures.
Inventor(s): Minkyung KANG of Suwon-si (KR) for samsung electronics co., ltd., Seohee PARK of Suwon-si (KR) for samsung electronics co., ltd., Yong-Suk TAK of Suwon-si (KR) for samsung electronics co., ltd., Joonnyung HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: the present disclosure relates to a semiconductor device and a method for manufacturing the same, and the semiconductor device according to an embodiment includes: a substrate including an active region defined by an element isolation layer; a word line crossing the active region; a bit line crossing the active region in a direction different from the word line; a direct contact connecting between the active region and the bit line; a buried contact connected to the active region; and a bit line spacer that is disposed between the bit line and the buried contact and includes carbon. the bit line spacer includes a first region that is adjacent to the bit line and has a first carbon content and a second region that is adjacent to the buried contact and has a second carbon content that is higher than the first carbon content.
Inventor(s): Heejae CHAE of Suwon-si (KR) for samsung electronics co., ltd., Taejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hosang LEE of Suwon-si (KR) for samsung electronics co., ltd., Yun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L21/762, H01L29/49
CPC Code(s): H10B12/488
Abstract: a semiconductor device includes a substrate including a word line trench extending in a first horizontal direction; a gate dielectric layer in the word line trench; a word line extending in the first horizontal direction and in a lower portion of the word line trench on the gate dielectric layer; an insulation capping layer extending in an upper portion of the word line trench on the word line; and a plurality of gate electrodes on the substrate, wherein the word line comprises: a word line lower region extending in the first horizontal direction and including a first gate electrode of the plurality of gate electrodes on the gate dielectric layer; and a word line upper region extending in the first horizontal direction on the word line lower region and including a plurality of second gate electrodes of the plurality of gate electrodes and the first gate electrode.
20240284664. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinyeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungyeon Ryu of Suwon-si (KR) for samsung electronics co., ltd., Hyeonok Jung of Suwon-si (KR) for samsung electronics co., ltd., Sei-Ryung Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes peripheral active patterns on a substrate, first and second peripheral trench regions adjacent the peripheral active patterns, a first isolation liner on inner surfaces of the first and second peripheral trench regions, a second isolation liner on the first isolation liner in the first and second peripheral trench regions, and a device isolation layer on the second isolation liner in the first and second peripheral trench regions. the device isolation layer includes a seam therein in the second peripheral trench region. a width of the first peripheral trench region is greater than a width of the second peripheral trench region at a first height corresponding to top surfaces of the peripheral active patterns with respect to the substrate.
Inventor(s): Jong-kook PARK of Seoul (KR) for samsung electronics co., ltd., Hong-soo KIM of Seongnam-si (KR) for samsung electronics co., ltd., Tae-keun CHO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/27, H10B41/30, H10B41/40, H10B43/27, H10B43/30, H10B43/40
CPC Code(s): H10B41/27
Abstract: a semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region.
20240284673. MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Takuya FUTATSUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Daeseok BYEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/00, H01L23/48, H01L25/065, H10B43/35, H10B43/40, H10B61/00, H10B63/10
CPC Code(s): H10B43/27
Abstract: a memory device is disclosed. the memory device includes a first cell region including first memory strings, a second cell region attached to the first cell region and including second memory strings, and a peripheral circuit region attached to the first cell region and including a peripheral circuit configured to control the first and second memory strings, the first cell region including a low-level bit line electrically connected to the first memory strings, a low-level bonding pad provided between the peripheral circuit region and the first cell region, a low-level connection via connected to the low-level bonding pad, a high-level bonding pad provided between the first and second cell regions, the second cell region including a high-level bit line electrically connected to the second memory strings, and a high-level connection via connected to the high-level bonding pad and being laterally offset from the low-level connection via.
Inventor(s): Kijoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20
CPC Code(s): H10B51/20
Abstract: a semiconductor device including a stack structure including a plurality of gate lines and a plurality of insulating patterns, the plurality of gate lines being apart from each other in a vertical direction, the plurality of insulating patterns being one-by-one between the plurality of gate lines, the stack structure including a vertical hole passing therethrough in the vertical direction, a channel film extending in the vertical direction inside the vertical hole, and a composite domain dielectric film between the channel film and the stack structure, wherein the composite domain dielectric film includes a main domain including a ferroelectric material, the main domain extending in the vertical direction inside the vertical hole, and at least one sub-domain including at least one material selected from an anti-ferroelectric material and a paraelectric material, the at least one sub-domain being in contact with the main domain may be provided.
Inventor(s): Jungmin Seo of Suwon-si (KR) for samsung electronics co., ltd., Manho Lee of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd., Cheonan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: a nonvolatile memory package includes first nonvolatile memory devices configured to be stacked, second nonvolatile memory devices configured to be stacked, and an interface chip connected to an external device through a bonding channel, connected to one of the first nonvolatile memory devices through a first bonding channel, and connected to one of the second nonvolatile memory devices through a second bonding channel, wherein the interface chip includes input/output pads connected to the bonding channel, first input/output pads connected to the first bonding channel, and second input/output pads connected to the second bonding channel, and wherein, for cross-channel shielding, the first input/output pads and the second input/output pads are alternately arranged for each channel.
Inventor(s): Kyeonghoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunho KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaebok BAEK of Suwon-si (KR) for samsung electronics co., ltd., Janggn YUN of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/065, H01L25/18, H10B41/27, H10B43/27
CPC Code(s): H10B80/00
Abstract: provided is an integrated circuit device with increased electrical reliability by forming an ohmic junction between a contact structure and a wiring line by bypassing a common source line such that the common source line, to which a common source line driver is connected, is electrically connected to the contact structure through the wiring line.
Inventor(s): Joonghyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Giwook KANG of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/13, C09K11/06, H10K50/12, H10K85/30, H10K85/40, H10K85/60
CPC Code(s): H10K50/13
Abstract: a light-emitting device including an anode, a cathode, a first emission layer arranged on the anode and including a first phosphorescent emitter, and a second emission layer arranged on the first emission layer and including a first fluorescent emitter and a second phosphorescent emitter.
Inventor(s): Hee Ju SHIN of Suwon-si (KR) for samsung electronics co., ltd., Se Chung OH of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N50/20, H10B61/00, H10N50/01, H10N50/80, H10N50/85
CPC Code(s): H10N50/20
Abstract: a magnetic memory device and a method for fabricating the same are provided. the magnetic memory device includes a pinned layer pattern, a free layer pattern including boron (b), a tunnel barrier layer pattern between the pinned layer pattern and the free layer pattern, an oxide layer pattern spaced apart from the tunnel barrier layer pattern with the free layer pattern therebetween, the oxide layer pattern including a metal borate, and a capping layer pattern spaced apart from the free layer pattern with the oxide layer pattern therebetween, the capping layer pattern including a metal boride, wherein a difference between a boron concentration of the free layer pattern and a boron concentration of the oxide layer pattern is 10 at % or less, and a difference between the boron concentration of the oxide layer pattern and a boron concentration of the capping layer pattern is 10 at % or less.
Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd.
- A61B5/00
- H02J7/00
- H02J7/04
- H02J50/12
- H02J50/20
- H02J50/80
- H04B10/50
- H04B10/69
- CPC A61B5/0017
- Samsung electronics co., ltd.
- A61B5/0205
- A61B5/11
- A61B5/145
- CPC A61B5/486
- A61H3/00
- A61H1/02
- CPC A61H3/00
- A63B21/00
- A63B24/00
- CPC A63B21/00069
- B01D53/00
- B01D53/34
- B01D53/46
- B01D53/76
- CPC B01D53/007
- B24B53/017
- B24B37/04
- H01L21/306
- CPC B24B53/017
- B25J13/08
- B25J9/02
- B25J9/16
- B25J11/00
- CPC B25J13/089
- B60W60/00
- B60W30/06
- CPC B60W60/001
- B65G47/90
- CPC B65G47/90
- C23C16/44
- C23C16/455
- CPC C23C16/4405
- C23C16/448
- C23C16/52
- CPC C23C16/45561
- F16M11/12
- F16M11/22
- CPC F16M11/126
- F24C7/08
- F24C15/00
- F24C15/04
- CPC F24C7/08
- F24F1/0063
- F24F1/0022
- F24F13/08
- F24F13/20
- CPC F24F1/0063
- F24F11/86
- F24F11/63
- CPC F24F11/86
- F25B39/02
- F25B13/00
- F25B49/02
- CPC F25B39/02
- F25D23/06
- CPC F25D23/065
- F25D23/02
- CPC F25D23/067
- G01C21/00
- G06T11/60
- CPC G01C21/383
- G01M11/02
- CPC G01M11/0257
- G01N23/06
- B81B1/00
- B81C1/00
- G01N33/483
- CPC G01N23/06
- G02B26/02
- G09G3/20
- CPC G02B26/02
- G02F1/1335
- CPC G02F1/133612
- G03B21/14
- G03B21/00
- CPC G03B21/145
- G03F1/24
- CPC G03F1/24
- G03F1/36
- G03F1/84
- CPC G03F1/36
- G03F1/70
- H01L21/027
- CPC G03F1/70
- G03F7/16
- H01L21/67
- CPC G03F7/168
- G03F7/00
- CPC G03F7/70925
- G04G17/08
- G04G17/02
- H04R1/02
- CPC G04G17/08
- G06F1/16
- CPC G06F1/1677
- G06F3/01
- G06F3/02
- G06F3/023
- CPC G06F3/016
- G06F3/041
- G06F3/044
- CPC G06F3/0418
- G06F3/04815
- G06F3/04817
- G06F3/04842
- G06F3/04845
- CPC G06F3/04815
- G06F3/0488
- CPC G06F3/04845
- G06F3/06
- CPC G06F3/0652
- G06F3/147
- G09G3/36
- CPC G06F3/147
- G06F9/4401
- G06F21/44
- H04L9/30
- H04L9/32
- CPC G06F9/4401
- G06F9/455
- CPC G06F9/45558
- G06F11/10
- CPC G06F11/1044
- G06F11/34
- G06F11/36
- CPC G06F11/3409
- G06F13/42
- CPC G06F13/4282
- G06F18/2415
- G06F18/2431
- G06T3/40
- G06T5/20
- CPC G06F18/2415
- G06F40/58
- G06F40/263
- G06V10/10
- G06V20/20
- G06V20/62
- G06V30/148
- H04N5/14
- CPC G06F40/58
- G06N3/0895
- CPC G06N3/0895
- G06T5/50
- CPC G06T3/4015
- G06T7/00
- G05D1/648
- G06V20/58
- H04N23/695
- H04N23/90
- CPC G06T7/0002
- G06T19/00
- G06T15/00
- CPC G06T19/006
- G06V10/147
- G06F18/243
- G06T5/70
- G06T7/20
- G06T7/70
- G06V10/22
- G06V10/25
- H04N23/667
- H04N23/80
- CPC G06V10/147
- G09G3/32
- G09G3/3258
- CPC G09G3/32
- G09G3/3208
- CPC G09G3/3208
- G09G3/3225
- G06V40/13
- CPC G09G3/3225
- G09G3/3275
- CPC G09G3/3275
- G09G3/34
- H04R1/10
- CPC G09G3/3406
- G11C5/14
- G11C8/10
- G11C8/18
- CPC G11C5/148
- G11C7/22
- G11C7/10
- CPC G11C7/222
- G11C11/419
- G11C11/418
- CPC G11C11/419
- G11C16/08
- G11C16/04
- G11C16/32
- CPC G11C16/08
- G11C16/16
- G11C16/10
- G11C16/26
- CPC G11C16/16
- G11C16/24
- CPC G11C16/24
- G11C29/12
- G11C5/06
- H10B43/27
- H10B43/35
- H10B43/40
- CPC G11C29/1201
- H01J37/16
- H01J37/08
- H01J37/18
- CPC H01J37/16
- H01J37/32
- CPC H01J37/32935
- H01L21/02
- C23C16/04
- C23C16/40
- C23C16/458
- C23C16/50
- H01L21/3213
- CPC H01L21/0228
- H01L21/304
- CPC H01L21/0274
- H01L21/324
- H01L21/311
- CPC H01L21/324
- CPC H01L21/6708
- H01L21/66
- CPC H01L21/6715
- H01L21/677
- H01L21/68
- CPC H01L21/67259
- H01L21/683
- CPC H01L21/6833
- H01L23/48
- H01L21/8234
- H01L27/088
- H01L29/06
- H01L29/08
- H01L29/423
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H01L23/481
- H01L23/00
- H01L23/528
- H01L25/10
- H10B80/00
- H01L23/522
- CPC H01L23/528
- H10B41/10
- H10B41/27
- H10B41/40
- H10B43/10
- CPC H01L23/5283
- H10B41/35
- H01L21/285
- H01L21/8238
- H01L27/092
- H01L29/417
- CPC H01L23/5286
- H01L25/065
- CPC H01L25/0657
- H01L23/498
- H01L23/532
- H01L23/538
- H01L27/02
- H01L29/78
- CPC H01L27/0207
- H02H9/04
- CPC H01L27/0259
- H01L27/12
- CPC H01L27/1203
- H01L27/146
- CPC H01L27/14614
- CPC H01L27/14618
- H04N25/13
- H04N25/703
- CPC H01L27/14621
- G02B3/00
- CPC H01L27/14627
- CPC H01L27/1463
- H01L21/223
- H01L21/762
- H01L21/768
- CPC H01L27/14683
- H01L27/15
- H01L33/00
- H01L33/62
- CPC H01L27/156
- CPC H01L29/41733
- CPC H01L29/4175
- H01L29/51
- H10B12/00
- CPC H01L29/42364
- CPC H01L29/42372
- H01L27/06
- CPC H01L29/78696
- H01P7/10
- H01P3/16
- CPC H01P7/105
- H01Q1/24
- H01Q9/04
- CPC H01Q1/243
- H01Q1/42
- H01Q21/06
- CPC H01Q9/045
- H01R12/51
- H01R43/02
- H05K1/02
- H05K5/00
- CPC H01R12/51
- CPC H02J7/00032
- G01R31/52
- CPC H02J7/0029
- CPC H02J7/00712
- H02K1/28
- B29C45/14
- B29K105/20
- B29L31/00
- D06F23/06
- D06F37/30
- H02K1/2791
- H02K15/12
- H02K21/22
- CPC H02K1/28
- H03F1/32
- H04L27/36
- H04W52/08
- CPC H03F1/3258
- H04B1/04
- H04L5/14
- CPC H04B1/04
- H04B5/20
- H04B5/43
- CPC H04B5/20
- H04B7/0456
- H04B7/06
- H04B7/08
- CPC H04B7/0473
- H04L5/00
- H04L25/02
- H04W84/12
- CPC H04L5/0035
- CPC H04L5/0051
- H04W64/00
- H04W76/20
- H04L27/26
- H04W72/0453
- CPC H04L5/0053
- H04W72/40
- CPC H04L5/0092
- H04W72/23
- CPC H04L5/0098
- H04L41/16
- H04L41/06
- H04W24/02
- CPC H04L41/16
- H04L9/40
- H04L9/08
- H04L9/14
- CPC H04L63/0428
- H04M1/7243
- H04M1/72415
- CPC H04M1/7243
- H04N13/271
- H04N13/00
- H04N13/239
- H04N23/10
- H04N23/62
- H04N25/75
- H04N25/778
- CPC H04N13/271
- H04N19/105
- H04N19/132
- H04N19/159
- H04N19/176
- H04N19/46
- H04N19/82
- CPC H04N19/105
- H04N21/431
- H04N21/44
- CPC H04N21/4316
- H04N23/68
- CPC H04N23/683
- H04N25/59
- H04N25/46
- H04N25/766
- CPC H04N25/59
- H04N25/772
- H04N25/633
- CPC H04N25/772
- H04R3/04
- G06F3/16
- CPC H04R3/04
- H04W24/08
- H04L43/0811
- H04W74/0816
- H04W76/19
- CPC H04W24/08
- H04W24/10
- CPC H04W24/10
- H04W72/20
- H04W36/00
- H04W36/08
- CPC H04W36/0085
- CPC H04W36/08
- H04W36/14
- H04W36/18
- H04W84/06
- H04W88/06
- CPC H04W36/14
- H04L1/08
- H04L1/1812
- H04W74/0833
- CPC H04W36/18
- H04W48/14
- H04W60/06
- CPC H04W48/14
- H04W48/16
- H04W60/00
- CPC H04W48/16
- H04W52/24
- H04W52/26
- H04W52/36
- CPC H04W52/241
- CPC H04W52/242
- H04W68/02
- CPC H04W68/02
- H04W72/0446
- CPC H04W72/0446
- H04W72/044
- CPC H04W72/046
- H04L1/1829
- CPC H04W72/23
- H04W72/232
- H04W72/1268
- H04W80/02
- CPC H04W72/232
- H04W72/30
- H04W72/51
- CPC H04W72/30
- H04W74/00
- CPC H04W74/0833
- H04W76/18
- H04W48/02
- H04W48/18
- H04W84/04
- CPC H04W76/18
- H04W76/27
- H04W76/23
- H04W92/18
- CPC H04W76/27
- H04W76/40
- H04W76/30
- CPC H04W76/40
- H04W80/08
- H04W28/06
- CPC H04W80/08
- H05K5/02
- H01F7/02
- CPC H05K5/0226
- H05K1/11
- CPC H05K5/0273
- H05K5/03
- C03C15/00
- C03C21/00
- H04M1/02
- CPC H05K5/03
- CPC H10B12/34
- CPC H10B12/482
- H01L29/49
- CPC H10B12/488
- CPC H10B12/50
- H10B41/30
- H10B43/30
- CPC H10B41/27
- H10B61/00
- H10B63/10
- CPC H10B43/27
- H10B51/20
- CPC H10B51/20
- H01L25/00
- H01L25/18
- CPC H10B80/00
- H10K50/13
- C09K11/06
- H10K50/12
- H10K85/30
- H10K85/40
- H10K85/60
- CPC H10K50/13
- H10N50/20
- H10N50/01
- H10N50/80
- H10N50/85
- CPC H10N50/20
