Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on August 15th, 2024
Samsung Electronics Co., Ltd.: 179 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L29/423 (11), H01L23/00 (10), H10B12/00 (9), H01L29/06 (9), H01L23/48 (8) H01L29/41733 (3), G06F3/0659 (3), H10B43/27 (3), H01L25/0657 (3), H10B12/482 (3)
With keywords such as: device, based, layer, including, information, configured, data, signal, substrate, and structure in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Jinwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Juan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A44B11/10
CPC Code(s): A44B11/10
Abstract: a wearing member according to various embodiments of the present disclosure comprises: a strap comprising a first strap and a second strap; and a fastening member comprising a first fastener and a second fastener, wherein the first strap is configured to pass through the first fastener including a first magnet, the second strap is fixed to one end of the second fastener including a second magnet, the first fastener and the second fastener are formed to be stacked and coupled to each other, and on a cross-section with respect to the lengthwise direction of the strap, a normal line with respect to a coupling surface between the first fastening member and the second fastening member may have an angle greater than 90-degree with a tensile direction of the second strap applied to the second fastening member.
Inventor(s): Byoungin LEE of Suwon-si (KR) for samsung electronics co., ltd., Taegwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A46B13/00, A46B13/02, A47L9/04
CPC Code(s): A47L9/2889
Abstract: a cleaner head is provided. the cleaner head includes a brush drum rotatable about a rotation axis, a brush case rotatably supporting the brush drum, and a drive assembly arranged inside the brush drum and configured to provide a rotational force to the brush drum, wherein the drive assembly includes a drive motor, a drive housing that accommodates the drive motor, is arranged between an inner circumferential surface of the brush drum and an outer circumferential surface of the drive motor, and is supported by an end of the brush case, a thermostat that is configured to cut off power supplied to the drive motor according to a temperature, and is arranged to be spaced apart from the drive motor in a direction of the rotation axis, and a heat transfer structure configured to transfer heat from the drive motor to the thermostat.
Inventor(s): Migyeong Gwak of Santa Clara CA (US) for samsung electronics co., ltd., Korosh Vatanparvar of San Jose CA (US) for samsung electronics co., ltd., Li Zhu of Saratoga CA (US) for samsung electronics co., ltd., Michael Chan of Atlanta GA (US) for samsung electronics co., ltd., Nafiul Rashid of San Jose CA (US) for samsung electronics co., ltd., Jungmok Bae of Menlo Park CA (US) for samsung electronics co., ltd., Jilong Kuang of San Jose CA (US) for samsung electronics co., ltd., Jun Gao of Menlo Park CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/113, A61B5/00, A61B5/08, G06V40/16
CPC Code(s): A61B5/113
Abstract: a method includes capturing a video of a person's face using a camera. the method also includes determining a motion-based respiratory rate (rr) and a motion-based respiratory signal based on the video of the person's face. the method further includes determining a remote photoplethysmography (rppg)-based rr and an rppg-based respiratory signal based on the video of the person's face. the method also includes predicting whether the motion-based rr or the rppg-based rr is more likely to be accurate using a trained machine learning model that receives the motion-based respiratory signal and the rppg-based respiratory signal as input. in addition, the method includes presenting one of the motion-based rr or the rppg-based rr based on the prediction.
Inventor(s): Vladislav Valerievich LYCHAGOV of Saratov (RU) for samsung electronics co., ltd., Vladimir Mikhailovich SEMENOV of Malakhovka (RU) for samsung electronics co., ltd., Elena Konstantinovna VOLKOVA of Saratov (RU) for samsung electronics co., ltd., Dmitrii Igorevich CHERNAKOV of Cherepovets (RU) for samsung electronics co., ltd.
IPC Code(s): A61B5/1455, A61B5/00, G16H40/67, G16H50/20
CPC Code(s): A61B5/14551
Abstract: a wearable device and a method for determining a hemoglobin concentration in a user's blood are provided. the method includes irradiating a tissue of a user with radiation of at least two different wavelengths, detecting photoplethysmographic (ppg) signals from the user's tissue in a time domain at the at least two different wavelengths in a reflection mode, transforming the detected ppg signals from the time domain to a frequency domain or a time-frequency domain, describing the transformed ppg signals with respect to harmonics to obtain a set of characteristics, and determining a hemoglobin concentration in the user's blood based on the obtained set of characteristics and an information from a database.
Inventor(s): Chaoyi Kang of Porter Ranch CA (US) for samsung electronics co., ltd., Matthew Corbin Wiggins of San Jose CA (US) for samsung electronics co., ltd., DongHyun Lee of Seoul (KR) for samsung electronics co., ltd., Amol Jayant Pangarkar of Fremont CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/145
CPC Code(s): A61B5/4818
Abstract: while a user is wearing a device during one or more sleep cycles, sensor signals are continuously monitored to detect a plurality of sleep sessions occurring during the one or more sleep cycles. based on the sensor signals, amounts of valid spodata collected for the plurality of sleep sessions are measured. a merged sleep session is generated by combining selected sleep sessions of the plurality of sleep sessions occurring in a same sleep cycle based on a maximum amount of time between the selected sleep sessions and the amounts of valid spodata collected for the selected sleep sessions. an estimated apnea hypopnea index (eahi) is estimated for the one or more sleep sessions including the merged sleep session. an indication of whether the user has sleep apnea is generated based on one or more of the eahis for the one or more sleep cycles.
Inventor(s): Md Mahbubur Rahman of San Jose CA (US) for samsung electronics co., ltd., Tousif Ahmed of San Jose CA (US) for samsung electronics co., ltd., Nafiul Rashid of Irvine CA (US) for samsung electronics co., ltd., Jilong Kuang of San Jose CA (US) for samsung electronics co., ltd., Jun Gao of Menlo Park CA (US) for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A63B23/18, A63B71/06, G16H50/20
CPC Code(s): A63B24/0075
Abstract: a method includes collecting motion data of a user using a head-worn device while the user is performing a breathing exercise. the method also includes, for a window of the motion data, generating breathing depth features based on the motion data. the method further includes determining, using a first machine learning model that receives the breathing depth features as inputs, whether the motion data corresponds to a non-breathing motion. in addition, the method includes, responsive to determining that the motion data corresponds to the non-breathing motion, presenting a first notification to the user to adjust head motion.
20240269798. CONDITIONING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyuntae Lee of Suwon-si (KR) for samsung electronics co., ltd., Domin Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungyong Park of Suwon-si (KR) for samsung electronics co., ltd., Jubong Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaemin Jung of Suwon-si (KR) for samsung electronics co., ltd., Hoseop Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/20
CPC Code(s): B24B37/20
Abstract: a conditioning apparatus includes an arm configured to be rotated by an actuator, a gimbaling part disposed at one end of the arm and disposed such that a lower end thereof protrudes outwardly of the arm and an abrasive disc is installed thereon, a frame unit connected to the gimbaling part, a rotation driving unit connected to the gimbaling part and configured to transfer driving force for rotating the abrasive disc, a load applying unit connected to the frame unit and configured to elevate the frame unit, and a universal joint connecting the gimbaling part to the rotation driving unit, wherein the universal joint separates a center of gravity of the rotation driving unit from a center of gravity of the gimbaling part.
Inventor(s): Cheoggyu HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jinho Choi of Suwon-si (KR) for samsung electronics co., ltd., Jinwoong Kim of Suwong-si (KR) for samsung electronics co., ltd., Jinsoo Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J15/00, B25J9/16
CPC Code(s): B25J15/0028
Abstract: a robot hand including a first gripper and a second gripper and a method of controlling a robot hand are provided. the method includes: recognizing a shape of an object through a camera; changing, based on the recognized shape of the object, a grasping orientation of the first gripper and the second gripper; grasping the object using the first gripper and the second gripper; and rotating the first gripper and the second gripper to change an orientation of the object according to a target position for the object to be seated.
Inventor(s): Seunghan LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungcheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B60W60/00, B60W40/09, B60W50/04, B60W50/10
CPC Code(s): B60W60/001
Abstract: a system on chip (soc), an autonomous driving system including the same, and an operating method thereof is provided. the autonomous driving system includes: a first soc configured to receive, in a manual driving mode of a vehicle, pieces of sensor information from sensors mounted on the vehicle and generate first information indicating manual driving characteristics of a driver by processing the pieces of sensor information and manual operation information generated when the driver operates the vehicle; and a second soc configured to receive the pieces of sensor information, generate, in the manual driving mode, second information including one or more setting values for controlling the vehicle according to an autonomous driving function, and correct in real-time the one or more setting values related to the autonomous driving function by comparing, in the manual driving mode, the first information to the second information.
Inventor(s): Dasom OH of Suwon-si (KR) for samsung electronics co., ltd., Changha LEE of Seoul-si (KR) for samsung electronics co., ltd., Soojin Shim of Suwon-si (KR) for samsung electronics co., ltd., Hyejin LEE of Seoul-si (KR) for samsung electronics co., ltd., Jehun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwon LEE of Seoul-si (KR) for samsung electronics co., ltd.
IPC Code(s): C02F3/34, C02F101/38, C02F103/04
CPC Code(s): C02F3/342
Abstract: an ultra-pure water manufacturing method using catalyst particles includes preparing first treated water by treating urea-containing feed water with urease-immobilized catalyst particles, and removing ionic substances from the first treated water by reverse osmosis, wherein the catalyst particles on which urease is immobilized are prepared by inducing a surface of the support to have an organic functional group thereon by modifying the surface of the support, coating a linker on the surface of the support, and immobilizing urease on the support in a buffer solution having a ph in a range of about 6 to about 8.
Inventor(s): Jeonghyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangyub IE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/455, H01L21/31
CPC Code(s): C23C16/45591
Abstract: a semiconductor manufacturing apparatus may include a substrate boat configured to load a plurality of substrates; a process chamber configured to enclose the substrate boat; and a reaction tube between the substrate boat and the process chamber. the reaction tube may include a gas flowing part configured to allow for a flow of a process gas; a process part defining gas slits and an exhausting hole; and baffles on an inner side surface of the process part, excluding the exhausting hole.
Inventor(s): Hyejoon SEOK of Suwon-si (KR) for samsung electronics co., ltd., Hyungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Minjoon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/18, D06F34/06, D06F34/26, D06F34/30, D06F34/32, D06F58/08, D06F58/26, D06F58/40, D06F103/04, D06F103/08, D06F103/32
CPC Code(s): D06F34/18
Abstract: a clothes dryer may include a drum in which laundry is receivable; a humidity detector to detect a dryness level of the laundry in the drum; and a controller configured to: obtain the dryness level of the laundry in the drum detected by the humidity detector while a first initial drying cycle is performed, determine a weight category of the laundry in the drum from a plurality of weight categories of laundry based on the obtained dryness level, obtain control information based on the determined weight category, and control, according to the obtained control information, a main drying cycle to dry the laundry in the drum after the first initial drying cycle is performed.
Inventor(s): Byeongwon BAE of Suwon-si (KR) for samsung electronics co., ltd., Kyoungtae PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunsuk BANG of Suwon-si (KR) for samsung electronics co., ltd., Changju OH of Suwon-si (KR) for samsung electronics co., ltd., Sangyeol LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/32, D06F33/34, D06F33/36, D06F33/38, D06F33/46, D06F34/04, D06F34/18, D06F101/20, D06F103/04, D06F103/18, D06F105/02, D06F105/46, D06F105/58
CPC Code(s): D06F34/32
Abstract: a method of displaying washing information and a washing machine are provided. the washing machine includes a washing module, a water level sensor configured to detect a water level, a display, memory, and one or more processors communicatively coupled to the washing module, the water level sensor, the display, and the memory, wherein the memory store one or more computer programs including computer-executable instructions that, when executed by the one or more processors, cause the washing machine to control, based on a user input for starting washing, the washing module to introduce water into the washing machine, determine, based on a water level frequency of the water level sensor, an amount of the water introduced into the washing machine, accumulate the determined amount of water as at least one cycle of the washing progresses, display, based on completion of the washing, on the display, the accumulated amount of water as water usage during the washing.
Inventor(s): Dokyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Minjoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seungeun CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Dongho KEUM of Suwon-si (KR) for samsung electronics co., ltd., Hocheol LEE of Suwon-si (KR) for samsung electronics co., ltd., Hankyu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/36, D06F103/32, D06F105/26, D06F105/56, D06F105/58
CPC Code(s): D06F58/36
Abstract: a clothes dryer including a drum; a flow passage to guide air inside of the drum to outside of the drum, and then back inside of the drum; a heat pump system to heat the air to flow back inside of the drum, the heat pump system including a compressor, a condenser, an expansion valve, and an evaporator through which refrigerant circulates; and a controller configured to, in response to receiving a command for an anti-freeze mode operation, control the clothes dryer to perform a heating operation in which the compressor is driven for a first period of time, after the compressor is driven for the first period of time, the compressor is stopped for a second period of time, and the driving of the compressor for the first period of time and the stopping of the compressor for the second period of time is repeated a plurality of times.
20240271354. DRYER AND CONTROL METHOD THEREFOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Geonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Dokyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Minhyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngsu LEE of Suwon-si (KR) for samsung electronics co., ltd., Hocheol LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungeun CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/36, D06F34/18, D06F34/26, D06F34/32, D06F58/08, D06F58/24, D06F103/04, D06F103/08, D06F103/46, D06F103/58, D06F105/30, D06F105/58
CPC Code(s): D06F58/36
Abstract: various embodiments of the present disclosure relate to a dryer that performs an ice removal operation. to this end, provided are: a drum configured to receive a drying item, at least one first sensor configured to detect a presence of the drying item in the drum, a pump chamber configured to store condensate, a drain pump configured to discharge the condensate from the pump chamber, and a controller configured to, when detecting the drying item in the drum based on a signal of the at least one first sensor, limit a number of forced drains of the drain pump to reduce a water level of the pump chamber.
Inventor(s): Hyeonsu HEO of Suwon-si (KR) for samsung electronics co., ltd., Jongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Wooyul KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Chul LEE of Suwon-si (KR) for samsung electronics co., ltd., Cheolwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Gahye SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F8/167, B01D39/20, B01J21/06, B01J23/42, B01J29/40, B01J35/00, B01J35/02, F24F8/108
CPC Code(s): F24F8/167
Abstract: a composite catalyst filter includes a porous filter substrate, and particles of at least one type of catalyst on a surface of the porous filter substrate. the particles of the catalyst include particles of a photocatalyst, and particles of at least one type of adsorbent and oxidation catalyst.
Inventor(s): Youngjun SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01C21/00, G06T7/246, G06T7/73, G06T17/05, G06V10/46, G06V20/10
CPC Code(s): G01C21/3848
Abstract: an electronic device and a method of operating the same are provided. the electronic device includes a camera module, memory storing one or more computer programs, and one or more processors communicatively coupled to the memory and the camera module, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to acquire an image captured by the camera module, acquire a three-dimensional map, based on location information of the electronic device, identify, in the image, a first object corresponding to a celestial body and a second object corresponding to a new terrain feature that is not included in the three-dimensional map, acquire three-dimensional image data of the new terrain feature for updating the three-dimensional map, based on information related to the second object identified based on a location of the first object, and provide a three-dimensional map updated through reflection of the acquired image data.
Inventor(s): Minsu Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungryeol Oh of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Ahn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/956, G01N21/25, G01N21/55, G01N21/88
CPC Code(s): G01N21/956
Abstract: a defect inspection device includes a stage on which a substrate is provided, an objective lens disposed above the stage to project light onto the substrate, a light source configured to emit light onto a main surface of the substrate via the objective lens, a light quantity measurement sensor disposed above the stage and configured to measure an amount of the light that is reflected from a first region of the main surface of the substrate, a light quantity regulator located between the light source and the objective lens and configured to regulate an amount of the light that is emitted from the light source onto the main surface of the substrate.
Inventor(s): KEN OZAWA of Yokohama-shi (JP) for samsung electronics co., ltd., Kenji Suzuki of Yokohama-shi (JP) for samsung electronics co., ltd., Shinji Ueyama of Yokohama-shi (JP) for samsung electronics co., ltd.
IPC Code(s): G01R33/032
CPC Code(s): G01R33/0325
Abstract: a semiconductor manufacturing device includes a detection unit that detects an extinction response of a perpendicular magnetic anisotropy pma film in a sample from a polar kerr effect signal, and a derivation unit that derives an anisotropic magnetic field (hk) of the pma film by extrapolating and fitting the detected extinction response, in magneto-optical kerr effect measurement that uses a plurality of electromagnets that electrically apply magnetic fields to the sample on the stage by convert a perpendicular magnetic field that includes a vertical component normal to an upper surface of a stage, and a horizontal magnetic field parallel to the upper surface of the stage.
Inventor(s): Youngmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungyong SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyukjun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1335, G02F1/13357, H05K1/18
CPC Code(s): G02F1/133612
Abstract: a display apparatus includes a display panel, a printed circuit board defining an upper surface, a lower surface opposite the upper surface, and a through-hole, a plurality of light sources mounted on the upper surface of the printed circuit board and configured to emit light to the display panel, and a connector inserted into the through-hole on the upper surface of the printed circuit board. the connector includes a connector body inserted into the through-hole, and a plurality of connector terminals disposed in proximity to the upper surface of the printed circuit board. the connector terminals are configured to electrically connect the connector body to a portion of the printed circuit board, and may in certain embodiments connect a first portion of the printed circuit board on one side of the connector body to a second portion of the printed circuit board on an opposite of the connector body.
Inventor(s): Hyosang AN of Suwon-si (KR) for samsung electronics co., ltd., Kwangseok BYON of Suwon-si (KR) for samsung electronics co., ltd., Bongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungjin RHO of Suwon-si (KR) for samsung electronics co., ltd., Jaeheung PARK of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon WON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03B13/36, G03B5/00, H01F7/06, H01F7/08
CPC Code(s): G03B13/36
Abstract: a camera is provided. the camera includes a lens assembly aligned along an optical axis, an auto focus (af) carrier for moving along the optical axis together with the lens assembly, and a housing for accommodating the af carrier, a yoke may be fixed to a first outer surface of side surfaces of the af carrier, the yoke includes a first portion having a first length in the optical axis direction and two protrusions which protrude toward the housing from both ends of a first portion, a first magnetic body, a magnet and a second magnetic body may be fixed in order in a direction parallel to the optical axis in a first inner surface facing the first outer surface of the af carrier among the side surfaces of the housing, the magnet may have a first pole on a surface contacting the first magnetic body, and a second pole opposite to the first pole on a surface contacting the second magnetic body, and a second protrusion may face the second magnetic body while a first protrusion of the two protrusions of the yoke faces the first magnetic body.
20240272544. METHOD OF MANUFACTURING A PHOTOMASK_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyoyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sukjong BAE of Suwon-si (KR) for samsung electronics co., ltd., Kangho PARK of Suwon-si (KR) for samsung electronics co., ltd., Yuri KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/70
CPC Code(s): G03F1/70
Abstract: in a method of manufacturing a photomask, a layout of a target pattern to be formed in the photomask may be designed. a modeling of a displacement error of the target pattern may be performed and a displacement error correction map of the target pattern may be generated based on the modeling of the displacement error of the target pattern. an exposure process may be performed on a blank mask in reflection of the displacement error correction map of the target pattern. a developing process and an etching process may be performed on the blank mask to form the photomask.
Inventor(s): Dong-Hyub LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeong-Gil KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyuck SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00, H01L21/66
CPC Code(s): G03F7/70591
Abstract: a monitoring system for manufacturing a semiconductor device comprises a source module, an optical module including a collector collecting and reflecting extreme ultraviolet generated light from the source module, an illumination optical system including a field facet mirror, and a projection optical system transferring the extreme ultraviolet light reflected from a reticle to a substrate. a calculating module calculates a degradation rate of the optical module, and a method comprises respectively generating a reference image profile and an (n)th image profile through the second sensor module by correcting the far field image of the extreme ultraviolet with respect to the intensity of the extreme ultraviolet at a reference time point and an (n)th time point after the reference time point, and calculating the degradation rate of the optical module by using a ratio of the reference image profile and the (n)th image profile by the calculation module.
Inventor(s): Junho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seungbeom PARK of Suwon-si (KR) for samsung electronics co., ltd., Jangwoon SUNG of Suwon-si (KR) for samsung electronics co., ltd., Hojun LEE of Suwon-si (KR) for samsung electronics co., ltd., Wookrae KIM of Suwon-si (KR) for samsung electronics co., ltd., Myungjun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00, G06T7/00
CPC Code(s): G03F7/706839
Abstract: provided is a method of managing a semiconductor processing apparatus, including irradiating, by a light source, a plurality of regions included in a diffuser on a mask stage with extreme ultraviolet (euv) light, reflecting or transmitting, by the diffuser, the euv light, transmitting, by an optical system, the euv light from the diffuser, receiving, by an image sensor, the euv light from the optical system, obtaining, by the image sensor, a plurality of original images corresponding to the plurality of regions, generating, based on an optical prediction model, a plurality of predictive images estimating a diffraction pattern in the image sensor, adjusting an optical prediction model by comparing the plurality of predictive images with the plurality of original images, and generating, based on the optical prediction model, a plurality of wavefront images corresponding to optical characteristics of each of the plurality of mirrors.
Inventor(s): Minhee PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Seongjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangmook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05B15/02, H04N21/442
CPC Code(s): G05B15/02
Abstract: an electronic apparatus includes: at least one processor, comprising processing circuitry, individually and/or collectively, configured to: acquire usage behavior data about a plurality of applications executed in a plurality of external devices and a plurality of functions provided by each external device, from the plurality of external devices through a communication circuit; acquire relevant information indicating one or more functions performed within a period range based on an execution point in time of the application among the plurality of functions, based on the acquired usage behavior data; and perform a recommended operation of the one or more functions corresponding to an application executed in the external device, based on the acquired relevant information.
Inventor(s): Sooyoung JI of Suwon-si (KR) for samsung electronics co., ltd., Heeseok EUN of Suwon-si (KR) for samsung electronics co., ltd., Seunghan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/26
CPC Code(s): G06F1/263
Abstract: an electronic device includes a substrate that includes a plurality of first connectors, at least one second connector, and a plurality of first wires connecting the plurality of first connectors and the at least one second connector, a plurality of storage devices connected to the plurality of first connectors, and at least one battery connected to the second connector, the at least one battery configured to, receive information related to the plurality of storage devices through the plurality of first wires, and supply auxiliary power to the plurality of storage devices based on the received information in response to a detected sudden power off (spo) event.
Inventor(s): HYUNJOON YOO of Suwon-si (KR) for samsung electronics co., ltd., SOO-YOUNG JI of Suwon-si (KR) for samsung electronics co., ltd., HEON JEKAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/28
CPC Code(s): G06F1/28
Abstract: a computational storage device that is configured to be electrically connected to a host, comprising: a power management integrated circuit that is configured to distribute power; a storage that is configured to store data using a first voltage provided from the power management integrated circuit; a computing module that is configured to perform an operation that is allocated by the host using a second voltage provided from the power management integrated circuit; and a performance monitoring module that is configured to monitor a first workload, a first amount of computation, and/or a first power state of the storage and/or is configured to monitor a second workload, a second amount of computation, and/or a second power state of the computing module and is configured to send a request for additional power to the host based on a monitoring result that is generated by the performance monitoring module.
Inventor(s): Hwasung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyosu BYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/044, G06F3/0488
CPC Code(s): G06F3/0418
Abstract: a wireless power transmission apparatus includes a user interface configured to receive a user input through touch sensors, a memory, and a processor. the processor may obtain touch data values corresponding to the touch sensors, respectively. the processor may obtain an average touch data value of the touch sensors, based on the touch data values, determine a variable threshold value with respect to a touch sensor from among the touch sensors, the variable threshold value being obtained by adding, to the average touch data value, a default threshold value corresponding to the touch sensor, and determine whether or not a touch input is generated with respect to the touch sensor, based on a result of comparing a touch data value with respect to the touch sensor with the variable threshold value with respect to the touch sensor.
Inventor(s): Jung Gyu BYUN of Suwon-si (KR) for samsung electronics co., ltd., Woochang Shin of Suwon-si (KR) for samsung electronics co., ltd., Gyeongatae Yu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0607
Abstract: disclosed is a method of a storage system. the method includes: transmitting, by the host, a first query request to a storage device; transmitting, by the storage device, a first query response to the host; identifying, by the host, a number of first allocation units corresponding to a first logical unit set to a first memory type; transmitting, by the host, a second query request including the number of first allocation units to the storage device; and writing, by the storage device, the number of first allocation units in a configuration descriptor. the first capacity adjustment factor corresponds to a product of a first ratio and a capacity adjustment factor integer modifier, the first ratio being between a first capacity of a normal memory type of the storage device and a second capacity of the first memory type.
Inventor(s): Haedong NO of Suwon-si (KR) for samsung electronics co., ltd., Youjin JEON of Suwon-si (KR) for samsung electronics co., ltd., Minjin JO of Suwon-si (KR) for samsung electronics co., ltd., Younsoo CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G11C11/56, G11C16/04, G11C16/26
CPC Code(s): G06F3/0619
Abstract: provided is a method of operating a memory controller for controlling a memory device including a plurality of memory cells, the method including transmitting a valley search command for threshold voltage distribution of the memory cells to the memory device, obtaining a cell count value and a valley voltage level from the memory device, obtaining a determined offset value by searching an offset table based on the cell count value and the valley voltage level, and determining a corrected read voltage level by correcting the valley voltage level based on obtained the offset value, wherein the memory device is controlled so that the memory device performs a read operation through the corrected read voltage level.
Inventor(s): Gyuseok CHOE of SUWON-SI (KR) for samsung electronics co., ltd., Seongheum BAIK of SUWON-SI (KR) for samsung electronics co., ltd., Myungsub SHIN of SUWON-SI (KR) for samsung electronics co., ltd., Youngmin LEE of SUWON-SI (KR) for samsung electronics co., ltd., Seongyong JANG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0631
Abstract: a storage device and an operating method of the same are disclosed. the storage device includes a memory controller and a non-volatile memory, wherein the memory controller is configured to calculate a number of zones, which are spaces allocated to logical addresses, based on a cell area size of first storage areas of the non-volatile memory, and provide the number of zones to a host, is configured to generate multiple zones of a number within the calculated number of zones, and to map a logical address of each zone to a physical address of at least one of the first storage areas, and is configured to, in response to a first write request from the host, write data included in the first write request into first storage areas corresponding to a zone indicated by the first write request.
Inventor(s): ROWEN ALPHONSO PEREIRA of BENGALURU (IN) for samsung electronics co., ltd., CHANDRASHEKHAR MALLIKARJUNA JOSHI of BENGALURU (IN) for samsung electronics co., ltd., SAUGATA DAS PURKAYASTHA of BENGALURU (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0632
Abstract: in a method of organizing data during refresh cycles of a memory device, a read request is sent to a non-volatile flash memory including a plurality of source blocks and a plurality of destination blocks. data of the plurality of source blocks are read upon sending the read request. the frequency of bit error rate (ber) for the data stored in the plurality of source blocks is identified. the data within the plurality of source blocks are grouped and segregated based on the frequency of ber and a threshold value. the plurality of source blocks and the plurality of destination blocks are refreshed by moving the data present in the plurality of source blocks to respective destination blocks based on the segregated data and moving data from the respective destination blocks to other respective destination blocks.
Inventor(s): Daejin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jeong-Woo PARK of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a storage system includes a host device supporting multiple queues and a storage device communicating with the host device. the host device may include first and second cores, first and second queues corresponding to the first and second cores and storing commands, and a host controller that sets a queue id and/or a parallelism demand level for each commands stored in the first and second queues. the storage device may include nonvolatile memories and a storage controller that detects pattern information of commands, received from the host device, based on the queue id and places the commands, received from the host device, in the nonvolatile memories based on the pattern information.
Inventor(s): Yongseob KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KEUM of Suwon-si (KR) for samsung electronics co., ltd., Kyumin PARK of Suwon-si (KR) for samsung electronics co., ltd., Inseo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06N20/00
CPC Code(s): G06F3/0659
Abstract: a storage device may include a first chip and a second chip connected to the first chip and configured to exchange a plurality of data signals with the first chip. the first chip and the second chip may align the plurality of data signals using a training command during a training operation, and the first chip and the second chip may check whether a connection state between data input/output pins of the first chip and data input/output pins of the second chip is poor, by utilizing the training command, during a connection state checking operation.
Inventor(s): Sangwon Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a storage controller including: an internal event monitoring circuit to detect an internal event, the internal event being independently performed in the storage controller; a duration calculation circuit to calculate expected processing times of the internal event based on allocation ratios; a latency mapping table to output expected latencies in processing the internal event for the allocation ratios; and an update circuit to generate and provide multi-latency information to a host, wherein the multi-latency information includes an indicator representing the internal event and the expected processing times and the expected latencies corresponding to the allocation ratios, each allocation ratio representing a ratio of a resource, allocated to process the internal event, to a resource allocated to process a command requested by the host, and the storage controller is configured to allocate resources for processing the command and the internal event, based on an allocation ratio selected by the host.
Inventor(s): Jongin LEE of Suwon-si (KR) for samsung electronics co., ltd., Sehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sukun YOON of Suwon-si (KR) for samsung electronics co., ltd., Hyeeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Kilsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/16, G06F3/0482, H04R29/00
CPC Code(s): G06F3/162
Abstract: an example display apparatus may include a display, a communication interface, a memory storing one or more instructions, and a processor configured to execute the one or more instructions stored in the memory to receive a voice call request; in response to receiving the voice call request, determine whether audio data is being transmitted to an audio input/output apparatus by the communication interface according to a bluetooth communication protocol and, in response to determining that the audio data is being transmitted by the communication interface, identify one or more audio input apparatuses other than the audio input/output apparatus, select a first audio input apparatus from among the one or more identified audio input apparatuses, and activate the selected first audio input apparatus, and control a speech input according to the voice call request so as to be received from the activated first audio input apparatus.
Inventor(s): Jongmin GIM of Pleasanton CA (US) for samsung electronics co., ltd., Changho CHOI of San Jose CA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/07, G06F9/38, G06F9/4401
CPC Code(s): G06F11/073
Abstract: a system and method for fault page handling. in some embodiments, the method includes: querying a memory device for fault pages in the memory device; and receiving a response from the memory device identifying a fault page. the querying of the memory device may include querying the memory device by a device driver; and the querying of the memory device may include querying the memory device using a supplemental command of a cache coherent protocol.
Inventor(s): Sangeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Sumin Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongjun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/20, G06F13/40
CPC Code(s): G06F11/2002
Abstract: an electronic apparatus includes a display; an input interface including a first high-speed multimedia interface (hdmi) port configured to connect to a first source device, and a second hdmi port configured to connect to a second source device; and at least one processor operatively connected with the display and the input interface, wherein a first switching device is provided in a first consumer electronic control (cec) line corresponding to the first hdmi port, and a second switching device is provided in a second cec line corresponding to the second hdmi port, and wherein the at least one processor is configured to: control, based on a malfunction associated with a cec function being identified from the first source device or the second source device, the display to display a user interface (ui) for turning off the cec function, and turn off the cec function by separately controlling at least one of the first switching device or the second switching device based on a user command received through the ui.
Inventor(s): Namyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonman PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/263, G06F11/22
CPC Code(s): G06F11/263
Abstract: a system for verifying a system-on-chip (soc) including a plurality of intellectual property cores (ips) includes a library configured to store a plurality of sequence codes corresponding to the plurality of ips and a plurality of task codes for driving the soc, and processing circuitry configured to, generate at least one test scenario by combining one or more of the sequence codes and one or more of the task codes stored in the library, generate metadata based on the at least one test scenario, the metadata having a specific format, and generate universal verification methodology (uvm) test code based on the metadata.
Inventor(s): Sangho Yi of Suwon-si (KR) for samsung electronics co., ltd., Jihoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Chaehwan Yang of Suwon-si (KR) for samsung electronics co., ltd., Jonghun Jeong of Suwon-si (KR) for samsung electronics co., ltd., Gunbae Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0223
Abstract: a computational storage system according to an aspect of the inventive concept includes a storage device including a storage controller, a buffer memory, and a non-volatile memory, a computing device configured to process data in response to a data processing request received from an external device and to generate first dump data in response to a first dump request received from the external device, and a volatile memory configured to store data used for data processing of the computing device, wherein the storage device is configured to store the first dump data in the nonvolatile memory in response to a storage request of the first dump data using a metadata access protocol received from the computing device.
Inventor(s): Sooyoung JI of Suwon-si (KR) for samsung electronics co., ltd., Heeseok EUN of Suwon-si (KR) for samsung electronics co., ltd., Seunghan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/42
CPC Code(s): G06F13/4282
Abstract: an electronic device includes a processor, an interface bus connected to the processor, and a plurality of compute express link (cxl) devices connected to the interface bus, the plurality of cxl devices including two or more different types of cxl devices. the processor is configured to output a combined program code to the interface bus, the combined program code including a plurality of program codes, each of the plurality of cxl devices are configured to receive the combined program code from the interface bus, and each of the plurality of cxl devices is configured to store one of the plurality of program codes of the combined program code which corresponds to a type of the cxl device, in order to change operation of the cxl device according to the stored one of the plurality of program codes.
Inventor(s): Daejun Park of Suwon-si (KR) for samsung electronics co., ltd., Keoseong Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F16/18, G06F12/02, G06F16/16
CPC Code(s): G06F16/1805
Abstract: a method of operating an electronic device which includes a host device and a storage device. the method includes initiating a first write operation of target data and a first logical block address (lba), generating target identification information of the target data in response to initiating the first write operation, determining that the target identification information is registered at a mapping table of the host device, determining that the first lba is different from a previous lba corresponding to the target identification information in the mapping table, updating the mapping table such that the previous lba is changed to the first lba, providing the storage device with a first request for inheritance of previous lifetime information, and storing, in a history table of the storage device and based on the first request, first lifetime information that inherits the previous lifetime information.
Inventor(s): Sanghyuk KOH of Suwon-si (KR) for samsung electronics co., ltd., Minsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Juyeoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seonkeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaewoong CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Hanchul JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/32, G06F3/0482, G06V40/12, G06V40/16, G06V40/18
CPC Code(s): G06F21/32
Abstract: an electronic device is provided. the electronic device includes a housing, a flexible display, one or more sensors including at least one biometric recognition sensor, memory storing one or more computer programs, and one or more processors communicatively coupled to the flexible display, the one or more sensors and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to receive a first input for recognizing biometric information through the at least one biometric sensor, identify, in response to the first input, whether the first input is an input related to user authentication in a running application, perform, in response to the first input not being an input related to the user authentication in the running application, user authentication related to a state of the electronic device, based on success of the user authentication associated with the state of the electronic device, display, on the flexible display a user interface comprising at least one menu available for an execution request by receiving a second input while the first input is being held, and perform function corresponding to a menu selected using the user interface, based on the receiving of the second input while the first input is being held.
Inventor(s): Eunyoung Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/57, G06F13/28
CPC Code(s): G06F21/575
Abstract: provided are a boot controller and a computing device including the boot controller. after receiving a power-on-reset signal from the computing device, the boot controller verifies the integrity of boot code stored in read only memory (rom) of the computing device by reading the boot code from the rom, and determines a boot mode of the computing device based on results of the verification of the integrity of the boot code stored in the rom.
Inventor(s): Jong Seon NO of Seoul (KR) for samsung electronics co., ltd., Eun Sang LEE of Seoul (KR) for samsung electronics co., ltd., Joon Woo LEE of Seoul (KR) for samsung electronics co., ltd., Young Sik KIM of Gwangju (KR) for samsung electronics co., ltd., Yongjune KIM of Daegu (KR) for samsung electronics co., ltd., Jung Hyun LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/60, G06F7/487, G06F17/15
CPC Code(s): G06F21/602
Abstract: an apparatus with a neural network operation of homomorphic encrypted data includes: one or more processors configured to: generate homomorphic conjugation data of encrypted data based on the encrypted data, wherein the encrypted data corresponds to an output of each of a plurality of layers included in a neural network; and remove noise of the encrypted data based on the encrypted data and the homomorphic conjugation data.
Inventor(s): Minsu KO of Suwon-si (KR) for samsung electronics co., ltd., Jae Kyeom KIM of Seoul (KR) for samsung electronics co., ltd., Gun Hee KIM of Seoul (KR) for samsung electronics co., ltd., Seo Hong PARK of Seoul (KR) for samsung electronics co., ltd., Sungjoo SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/092, G06N3/096
CPC Code(s): G06N3/092
Abstract: a method and device with transferal of reinforcement learning are disclosed. the method includes: approximating an optimal value-function for a task vector using a value approximator trained to output a minimum value-function using a state of an agent and source task vectors; determining an upper bound of the optimal value-function for the task vector; determining a lower bound of the optimal value-function for the task vector; correcting the optimal value-function for the task vector based on the upper bound and the lower bound; and determining an optimal policy for the task vector using the corrected optimal value-function for the task vector.
Inventor(s): Hyeonsu LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungbae KIM of Suwon-si (KR) for samsung electronics co., ltd., Euntaik LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeho KO of Suwon-si (KR) for samsung electronics co., ltd., Hyesoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeyoung MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyewon PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungchan BAE of Suwon-si (KR) for samsung electronics co., ltd., Seungyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yookyung HAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06Q10/1093
CPC Code(s): G06Q10/1093
Abstract: according to various embodiments, an electronic device may comprise a display module, a processor, and a memory operatively connected to the display module and the processor. the memory can store instructions that allow, when executed, in response to reception of at least one piece of content, the processor to identify whether an application corresponding to the at least one piece of content is an information-sharing application, extract schedule-related information based on the received at least one piece of content in response to identifying that the application is the information-sharing application, generate at least one piece of recommendation information based on the extracted schedule-related information in response to execution of a schedule-related application, and display the generated at least one piece of recommendation information through the display module. various other embodiments are possible.
Inventor(s): Jinje PARK of Suwon-si (KR) for samsung electronics co., ltd., Jingu HEO of Suwon-si (KR) for samsung electronics co., ltd., Sung Kwang CHO of Suwon-si (KR) for samsung electronics co., ltd., Dong Kyung NAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/30, G06T3/00, G06T3/40, G06T5/00, G06T7/20, G06T7/50, G06V10/75
CPC Code(s): G06T7/30
Abstract: a method and an electronic device with image registration are provided. the method includes generating a first optical flow between a first partial image and a second partial image, which are captured by respective first and second cameras using an optical flow estimation model; generating disparity information between the first partial image and a third partial image, captured by a third camera, based on depth information of the first partial image generated using the first optical flow; and estimating a second optical flow between the first partial image and the third partial image based on the generated disparity information for generating a registration image.
Inventor(s): Sungryeul RHYU of Suwon-si (KR) for samsung electronics co., ltd., Hyunkoo YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/00, G06F3/0346, H04L43/0864, H04L65/70, H04N7/035
CPC Code(s): G06T11/00
Abstract: the disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting higher data transmission rates. a method by a user equipment (ue) supporting ue estimation-based split rendering is provided. the method includes estimating, at a first time point, a pose of the ue of a second time point indicating a target display time for a first media frame, transmitting the first media frame and first pose information related to the estimated pose to a server, receiving a second media frame, generated by rendering based on the first media frame and the estimated pose, and second pose information associated with the second media frame from the server, and displaying a third media frame at a third time point based on the second media frame and the second pose information.
Inventor(s): Sangil JUNG of Yongin-si (KR) for samsung electronics co., ltd., Seungin PARK of Yongin-si (KR) for samsung electronics co., ltd., Byung In YOO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/80, G06V10/40, G06V10/764, G06V10/77, G06V10/82
CPC Code(s): G06V10/806
Abstract: an object classification method and apparatus are disclosed. the object classification method includes receiving an input image, storing first feature data extracted by a first feature extraction layer of a neural network configured to extract features of the input image, receiving second feature data from a second feature extraction layer which is an upper layer of the first feature extraction layer, generating merged feature data by merging the first feature data and the second feature data, and classifying an object in the input image based on the merged feature data.
Inventor(s): Keunjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Junseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk Park of Suson-si (KR) for samsung electronics co., ltd., Bongki Son of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/40, G06V10/60
CPC Code(s): G06V20/44
Abstract: a vision sensor includes a memory; a pixel array including a plurality of pixels configured to generate an event signal by detecting an event in which an intensity of incident light changes; and an event detection circuit configured to read the event signal from the pixel array and configured to process the event signal, wherein the event detection circuit configured to: store, in the memory, a state map including a first state corresponding to a presence of an event of each of the plurality of pixels, and a second state corresponding to an absence of the event, and correct the event occurring in a selected pixel, based on the state map stored in the memory.
Inventor(s): Bindigan Hariprasanna PAWAN PRASAD of Bangalore (IN) for samsung electronics co., ltd., Green Rosh K S of Bangalore (IN) for samsung electronics co., ltd., Vishakha S R of Bangalore (IN) for samsung electronics co., ltd., Lokesh Rayasandra BOREGOWDA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06V20/40, G06T7/20, G06T7/70, G06V10/74
CPC Code(s): G06V20/48
Abstract: there is provided a method and electronic device for generating high resolution peak action frame. the method includes receiving a low resolution (lr) image stream with high frame speed and a high resolution (hr) image stream with low frame speed and detecting at least one pose of at least one human in the lr image stream. the method further includes obtaining a lr peak action frame in the lr image stream based on the at least one pose and identifying a close hr frame from the hr image stream which is closest to the lr peak action frame. the method further includes fetching the close hr frame from the hr image stream which is closest to the obtained lr peak action frame or generating a hr peak action frame by blending the identified hr frame and the lr peak action frame.
Inventor(s): Seongjoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Myeongjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Harsh AGARWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/70, D06F34/32, G06V10/74, G06V10/82
CPC Code(s): G06V20/70
Abstract: disclosed are an electronic device and a method of controlling the same. an electronic device according to an embodiment of the disclosure includes a camera, a memory configured to store at least one instruction, a display, and at least one processor configured to execute the at least one instruction to acquire a label image of clothing through the camera, generate management information on the clothing using the acquired label image, and control the display to display the generated management information. the at least one processor identifies a plurality of clothing management symbols included in the label image, identifies a misrecognized symbol among the plurality of identified clothing management symbols based on a standard type and a management type of each of the plurality of identified clothing management symbols, and corrects the identified misrecognized symbol based on at least one of a standard type and a management type of another normally recognized symbol.
20240274041. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunyong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jisu KIM of Suwon-si (KR) for samsung electronics co., ltd., Hunsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Boum-Sik KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Chul-Yong CHO of Suwon-si (KR) for samsung electronics co., ltd., Tae-Hun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09F9/30, G06F1/16
CPC Code(s): G09F9/301
Abstract: a display apparatus includes a display module, a support configured to rotate and support the display module, and a mounting device configured to mount a mobile device on the display module. the mobile device is configured to be paired with the display module. the mounting device includes a mounting portion including a mounting groove having a shape corresponding to a frame forming borders of the display module. the mounting portion is coupled to the frame when the frame is inserted into the mounting groove, and an accommodating portion is positioned below the mounting portion, and accommodates the mobile device such that the mobile device is mounted on the display module.
Inventor(s): Kyoungsuk YANG of Suwon-si (KR) for samsung electronics co., ltd., Jinchul CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, H01L27/12
CPC Code(s): G09G3/006
Abstract: a chip-on-film package including: a base film; chip pads including a first signal pad, a second signal pad, first dummy pads, and second dummy pads, wherein the chip pads are connected to a semiconductor chip attached to the base film; and wiring patterns including a first signal pattern connected to the first signal pad, a second signal pattern connected to the second signal pad, a first dummy pattern connected to the first dummy pads, and a second dummy pattern connected to the second dummy pads, wherein the first dummy pads and the second dummy pads are continuously disposed in a first direction, the first dummy pattern is disposed between the first signal pattern and the second dummy pattern, and a distance between the first dummy pattern and the first signal pattern is greater than a distance between the first dummy pattern and the second dummy pattern.
Inventor(s): Jonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Guiwon SEO of Suwon-si (KR) for samsung electronics co., ltd., Chun ZHAO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20, G06T5/90, G06V10/40, G06V10/774
CPC Code(s): G09G3/20
Abstract: a display device including a processor configured to extract first through third feature information corresponding to a first image, each of a plurality of regions included in the first image, and object regions included in the first image, respectively. the processor is configured to obtain a first through third contrast ratio enhancement curves, corresponding to the first image, generated by applying the first feature information to a curve generation network in which first parameter information is set, corresponding to each of the plurality of regions, generated by applying the second feature information to the curve generation network in which second parameter information is set, corresponding to each of the plurality of object regions, generated by applying the third feature information to the curve generation network in which third parameter information is set, generate a second image by applying the first through third contrast ratio enhancement curves to the first image.
Inventor(s): Seungryong HAN of Suwon-si (KR) for samsung electronics co., ltd., Tetsuya Shigeta of Suwon-si (KR) for samsung electronics co., ltd., Gangmo Koo of Suwon-si (KR) for samsung electronics co., ltd., Hwaseok Seong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32
CPC Code(s): G09G3/32
Abstract: a display apparatus includes a display including a plurality of pixels; a memory storing a cross-talk weight for each gradation of adjacent pixels corresponding to a gradation value of a target pixel; and at least one processor configured to: obtain a gradation value of each pixel included in at least one line of pixels among the plurality of pixels, obtain histogram information indicating a number of pixels corresponding to each gradation section based on the obtained gradation value of each pixel in the at least one line of pixels, identify an amount of cross-talk corresponding to a target pixel based on the histogram information and the cross-talk weight for each gradation of adjacent pixels corresponding to a gradation value of the target pixel, and obtain a gradation correction value of the target pixel based on the identified amount of cross-talk.
Inventor(s): Changwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Dokyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungwook HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoung ROH of Suwon-si (KR) for samsung electronics co., ltd., Jonguk YOO of Suwon-si (KR) for samsung electronics co., ltd., Youngmoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/20, G06F3/16, G10L15/08, G10L15/22
CPC Code(s): G10L15/20
Abstract: an electronic device includes a microphone; at least one memory storing a wake-up word detection model; and at least one processor configured to: obtain a sound signal received through the microphone, input the sound signal into the wake-up word detection model, obtain, as an output of the wake-up word detection model, one or more first probability scores corresponding to one or more sections of the sound signal, wherein each first probability score of the one or more first probability scores represents a probability that a corresponding section of the one or more sections of the sound signal corresponds to a wake-up word, identify a first section of the sound signal, among the one or more sections of the sound signal, that corresponds to a first probability score, among the one or more first probability scores, that exceeds a first threshold value, and based on identifying a predetermined acoustic signal in the sound signal, reduce the first threshold value.
Inventor(s): Sang-Ki KANG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jang-Seok SEO of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Kook-Tae CHOI of Seongnam-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Hyun-Woo KANG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jin-Yeol KIM of Seoul (KR) for samsung electronics co., ltd., Chae-Hwan LI of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Kyung-Tae KIM of Hwaseong-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Dong-Ho JANG of Hwaseong-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Min-Kyung HWANG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G06F3/02, G06F3/04886, G06F3/16, G10L15/30
CPC Code(s): G10L15/22
Abstract: an example electronic device includes a housing; a touchscreen display; a microphone; at least one speaker; a button disposed on a portion of the housing or set to be displayed on the touchscreen display; a wireless communication circuit; a processor; and a memory. when a user interface is not displayed on the touchscreen display, the electronic device enables a user to receive a user input through the button, receives user speech through the microphone, and then provides data on the user speech to an external server. an instruction for performing a task is received from the server. when the user interface is displayed on the touchscreen display, the electronic device enables the user to receive the user input through the button, receives user speech through the microphone, and then provides data on the user speech to the external server.
Inventor(s): Hyunwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul YANG of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hangil MOON of Suwon-si (KR) for samsung electronics co., ltd., Jaeha PARK of Suwon-si (KR) for samsung electronics co., ltd., Kali Charan GAJULA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11B27/10, G06F3/16
CPC Code(s): G11B27/10
Abstract: an example electronic device includes a camera, a communication circuit, a memory, and at least one processor. the memory stores instructions that, when executed by the at least one processor, cause the electronic device to obtain image data using the camera, receive audio data recorded by an external electronic device and information on first audio latency from the external electronic device, determine a second audio latency required to process the received audio data by the at least one processor, determine a third audio latency based on the first audio latency and the second audio latency, determine a difference between a preset initial audio latency and the third audio latency, synchronize the audio data with the image data based at least in part on the difference, and generate an image content including the image data and the audio data based at least in part on the synchronization result.
Inventor(s): JI-YEON SHIN of ANYANG-SI (KR) for samsung electronics co., ltd., DAEHOON NA of SEOUL (KR) for samsung electronics co., ltd., JONGHWA KIM of SEOUL (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, H01L25/065, H01L25/10, H01L25/18
CPC Code(s): G11C7/22
Abstract: a memory package includes; a first memory chip including first memory pads, and a buffer chip including first buffer pads respectively connected with the first memory pads and second buffer pads connected with an external device. the buffer chip respectively communicates signals received via the second buffer pads to the first buffer pads in response to a swap enable signal having a disabled state, and the buffer chip swaps signals received via the second buffer pads to generate first swapped signals, and respectively communicates the first swapped signals to the first buffer pads in response to the swap enable signal having an enabled state.
Inventor(s): Cheolhui LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngmin JO of Suwon-si (KR) for samsung electronics co., ltd., Anil KAVALA of Suwon-si (KR) for samsung electronics co., ltd., Jungjune PARK of Suwon-si (KR) for samsung electronics co., ltd., Chiweon YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10, G11C7/14
CPC Code(s): G11C7/222
Abstract: provided is a nonvolatile memory including a receive buffer configured to generate a buffer signal by comparing an input signal with a reference voltage, a reference voltage calibrator configured to generate a calibrated reference voltage code signal based on a reference voltage code signal and the buffer signal, and a reference voltage generator configured to generate a reference voltage corresponding to the calibrated reference voltage code signal. in addition, the read reference voltage calibrator includes a duty cycle monitor configured to generate a monitoring signal by measuring a duty cycle of the buffer signal, an up/down counter configured to generate a count number signal by comparing a reference duty cycle with a measurement duty cycle corresponding to the monitoring signal, and a code calculator configured to generate the calibrated reference voltage code signal based on the count number signal and the reference voltage code signal.
Inventor(s): Yongseok KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk YU of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Jauang YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/12, G11C16/28, G11C16/30
CPC Code(s): G11C16/12
Abstract: the present disclosure provides nonvolatile memory devices including high-voltage switch circuits and methods of controlling the same. in some embodiments, a nonvolatile memory device includes a voltage generator configured to generate a switching source voltage, a plurality of high-voltage switch circuits grouped into a plurality of switching groups and configured to generate a plurality of switch control signals based on the switching source voltage, a conductive path configured to transfer the switching source voltage from the voltage generator to the plurality of high-voltage switch circuits, a plurality of high-voltage switches configured to transfer high voltages based on the plurality of switch control signals, and a control circuit configured to control transition timing of the plurality of switch control signals independently with respect to each of the plurality of switching groups.
Inventor(s): Hyunee LEE of Suwon-si (KR) for samsung electronics co., ltd., Wondong Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/34, G11C16/04, G11C16/08
CPC Code(s): G11C16/3431
Abstract: in some embodiments, the memory device includes a memory cell array including a plurality of memory blocks including a plurality of word lines, a pass transistor circuit including a plurality of pass transistors coupled to the plurality of word lines, a row decoder configured to provide a block selection voltage to first terminals and a driving voltage to second terminals of the plurality of pass transistors, a voltage generator configured to generate the block selection voltage and the driving voltage, and a control circuit configured to control the row decoder and the voltage generator, perform a leakage detection operation on a target memory block of the plurality of memory blocks, set a plurality of first detection word lines of the target memory block to a first voltage level, and set a plurality of second detection word lines of the target memory block to a second voltage level.
Inventor(s): Yumin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Chiweon YOON of Suwon-si (KR) for samsung electronics co., ltd., Eunchan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12, G11C7/04, G11C29/02
CPC Code(s): G11C29/12005
Abstract: a voltage generation circuit includes a current generation circuit, a slope trimming circuit and an offset trimming circuit. the current generation circuit is connected between an input voltage node and an output node that outputs a complementary to absolute temperature (ctat) output voltage that decreases as an operation temperature increases. the current generation circuit generates a reference current flowing through the output node, the reference current having a constant magnitude regardless of the operation temperature. the slope trimming circuit is connected between the output node and an intermediate node. the slope trimming circuit adjusts a slope of the ctat output voltage based on a first trimming code. the offset trimming circuit is connected between the intermediate node and a ground voltage node. the offset trimming circuit configured to adjust an offset voltage of the ctat output voltage based on a second trimming code.
Inventor(s): Jaesik An of Suwon-si (KR) for samsung electronics co., ltd., Dongig Oh of Suwon-si (KR) for samsung electronics co., ltd., Thanh Cuong Nguyen of Suwon-si (KR) for samsung electronics co., ltd., Suntaek Lim of Suwon-si (KR) for samsung electronics co., ltd., Seungmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Inkook Jang of Suwon-si (KR) for samsung electronics co., ltd., Joohyun Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01J37/34
CPC Code(s): H01J37/32926
Abstract: provided is a plasma process simulation method including defining a plasma reaction for a wafer, calculating a reaction parameter of the plasma reaction, and generating a plasma process simulation profile based on a calculated reaction parameter. the reaction parameter are set based on a physical reaction and a chemical reaction.
Inventor(s): Sungho Jang of Suwon-si (KR) for samsung electronics co., ltd., Protopopov Vladimir of Suwon-si (KR) for samsung electronics co., ltd., Dohoon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Sangki Nam of Suwon-si (KR) for samsung electronics co., ltd., Dougyong Sung of Suwon-si (KR) for samsung electronics co., ltd., Sungwon Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32972
Abstract: an apparatus for measuring real-time plasma density includes, at least one plasma density measurement sensor in a process chamber, the at least one plasma density measurement sensor being configured to sense a plasma current between a first electrode and a second electrode when plasma is generated, and to generate an optical signal in response to the plasma current, and an optical signal detector on a side surface of the process chamber, the optical signal detector being configured to detect the optical signal from the at least one plasma density measurement sensor.
Inventor(s): Kwangho LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangki NAM of Suwon-si (KR) for samsung electronics co., ltd., Jitae PARK of Suwon-si (KR) for samsung electronics co., ltd., Seongjin IN of Suwon-si (KR) for samsung electronics co., ltd., Keonhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32972
Abstract: a plasma monitoring system includes a chamber with an internal space configured to perform a plasma process on a semiconductor substrate, the chamber including a view window and a substrate stage, a light transmitter on the view window and including optical fibers configured to obtain a first light generated during the plasma process, a detachable reflection mirror between the view window and the optical fibers, a light generator configured to irradiate a second light onto the reflection mirror through the optical fibers and to irradiate a third light onto the view window through the optical fibers, and a light analyzer configured to obtain a light spectrum from the first light, to correct the light spectrum based on the second light reflected from the reflection mirror, and to correct the light spectrum based on the third light reflected from the view window.
Inventor(s): Minhong YUN of Suwon-si (KR) for samsung electronics co., ltd., Shigenobu MAEDA of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangyoon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, G05B13/02
CPC Code(s): H01L21/67288
Abstract: a semiconductor production system includes: a first chamber that is configured to be set to a first setting value and process wafers; a second chamber that is configured to be set to a second setting value and process the wafers processed in the first chamber; and a fault detection and classification (fdc) modeling module configured to: train a first fdc machine learning model to generate, based on the first setting value and first fdc values sensed with respect to the wafers processed in the first chamber, first predicted fdc values with respect to first virtual wafers in the first chamber; and train a second fdc machine learning model to generate, based on the second setting value and second fdc values sensed with respect to the wafers processed in the second chamber, second predicted fdc values with respect to second virtual wafers in the second chamber.
Inventor(s): HYEON JOON KIM of Suwon-si (KR) for samsung electronics co., ltd., DONGSOO LEE of Suwon-si (KR) for samsung electronics co., ltd., SUNGHYUN KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66
CPC Code(s): H01L22/34
Abstract: a method of operating an electronic device for detecting a defect due to a particle in an equipment generated during a bonding process of a semiconductor chip is disclosed. for example, the method may include obtaining, by the electronic device, profile data including operation information of the equipment from the equipment during the bonding process. additionally, the method may include calculating, by the electronic device, characteristic data of bonded chips (e.g., from the bonding process) by pre-processing the profile data. subsequently, after the bonding process is completed, the method may include selecting, by the electronic device, a coordinate of a defective chip on a substrate as a defect coordinate by comparing result data of a reference chip and peripheral chips based on the characteristic data. in some embodiments, the result data may include respective height value information of the bonded chips.
20240274499. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ae-Nee JANG of Seoul (KR) for samsung electronics co., ltd., In Hyo HWANG of Asan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/373, H01L23/00, H01L23/367, H01L23/498, H01L25/065, H01L25/10
CPC Code(s): H01L23/3735
Abstract: provided is a semiconductor package including a stiffener. the semiconductor package comprises a circuit board, a semiconductor chip on the circuit board, and a stiffener around the semiconductor chip, wherein the stiffener includes a first metal layer, a core layer, and a second metal layer sequentially stacked.
Inventor(s): Hyoukyung CHO of Seoul (KR) for samsung electronics co., ltd., Hojin LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Kwangjin MOON of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L21/762, H01L21/768, H01L25/065, H01L29/06
CPC Code(s): H01L23/481
Abstract: a semiconductor device includes: a semiconductor substrate having opposing first side and second sides; an active region and an isolation region on the first side; a circuit device on the active region; a front side interconnection structure on the first side and including front side interconnection layers disposed on different levels; first and second back side interconnection structures below the second side; a buried structure having a portion disposed in the isolation region and including a conductive line; a first through-electrode structure including a first through-electrode contacting the conductive line and penetrating the semiconductor substrate between the conductive line and the first back side interconnection structure; and a second through-electrode structure including a second through-electrode penetrating the semiconductor substrate between a first front side interconnection layer and the second back side interconnection structure. the first front side interconnection layer is on a level higher than that of the conductive line.
20240274510. STACKED INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jung Ho DO of Hwaseong-si (KR) for samsung electronics co., ltd., Seungyoung LEE of Albany NY (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L27/02, H01L27/088
CPC Code(s): H01L23/481
Abstract: stacked integrated circuit devices may include standard cells including a first standard cell in a first row and a second standard cell in a second row immediately adjacent to the first row. each of the standard cells may include an upper transistor and a lower transistor. the upper transistor may include an upper active region, an upper gate structure, and an upper source/drain region. the lower transistor may include a lower active region, a lower gate structure, and a lower source/drain region. each of the standard cells may also include a power line and a power via electrically connecting the power line to the lower source/drain region. the power via of the first standard cell and the power via of the second standard cell may be aligned with each other along the first direction.
Inventor(s): Inyeal LEE of Seongnam-si (KR) for samsung electronics co., ltd., Dongbeen KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwook KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Juhun PARK of Seoul (KR) for samsung electronics co., ltd., Deokhan BAE of Suwon-si (KR) for samsung electronics co., ltd., Junghoon SEO of Hwaseong-si (KR) for samsung electronics co., ltd., Myungyoon UM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/535, H01L23/00, H01L23/522, H01L27/092, H01L29/06, H01L29/417, H01L29/423, H01L29/78, H01L29/786
CPC Code(s): H01L23/535
Abstract: a circuit chip including a substrate, first and second channel active regions on the substrate, and extending in a first direction, the second channel active regions spaced apart from the first channel regions in a second direction intersecting the first direction, first and second gate electrodes intersecting the second channel active regions, third and fourth gate electrodes intersecting the first channel active regions, and a contact electrode between the first, second, third, and fourth gate electrodes. the contact electrode including a stem section in a vertical direction, and first and second branch sections extending from the stem section and contacting a respective source/drain region on the first and second channel active regions, the first gate electrode and the third gate electrode overlapping in the second direction, and including edge portions having widths decreasing as the first gate electrode and the third gate electrode extend toward facing ends thereof.
Inventor(s): Yukyung Park of Hwaseong-si (KR) for samsung electronics co., ltd., Ungcheon Kim of Cheonan-si (KR) for samsung electronics co., ltd., Wonil Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/48, H01L23/48, H01L23/498, H01L23/544, H01L25/10, H01L25/18
CPC Code(s): H01L24/02
Abstract: an interposer according to an embodiment of the present invention includes a base layer having opposite first and second surfaces, a wiring structure on the first surface of the base layer, an interposer protective layer disposed on the second surface of the base layer and having a pad recess with a lower surface of the interposer protective layer positioned at a first vertical level and a bottom surface of the pad recess positioned at a second vertical level that is higher than the first vertical level, an interposer pad of which a portion fills the pad recess of the interposer protective layer and the remaining portion protrudes from the interposer protective layer, and an interposer through electrode extending through the base layer and the interposer protective layer to the interposer pad, the interposer through electrode electrically connecting the wiring structure to the interposer pad.
Inventor(s): Won CHOI of Suwon-si (KR) for samsung electronics co., ltd., Ji-Yong PARK of Suwon-si (KR) for samsung electronics co., ltd., Bok Sik MYUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/05
Abstract: a semiconductor device may include a substrate, a pad on the substrate and connected to an interconnection pattern in the substrate, and a solder resist layer on the substrate, the solder resist layer having an opening exposing the pad. a top surface of the pad having a center region, and a peripheral region surrounding the center region. the center region of the top surface of the pad may be located at a level different from the peripheral region of the top surface of the pad, and a first width of the pad may be constant regardless of a distance from the substrate.
Inventor(s): Peng ZHANG of Suzhou Industrial Park (CN) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L25/0652
Abstract: a chip packaging method and a chip package based on a panel form are provided. the chip packaging method includes: preparing a plurality of chip package units, each of the plurality of chip package units having a panel form and including a plurality of dies; sequentially stacking the plurality of chip package units on a substrate, and using a thermal compression bonding process to electrically connect the plurality of chip package units to each other and electrically connect the plurality of chip package units and the substrate to each other, to obtain a stack; and cutting the stack to form single packages.
20240274579. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Choongbin Yim of Suwon-si (KR) for samsung electronics co., ltd., Jongkook Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/48, H01L23/498, H01L23/538, H01L25/10, H10B80/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a chip structure including a first stack semiconductor chip, which includes a first sub-chip and a second sub-chip that is bonded to the first sub-chip and is of a different type from the first sub-chip, a first molding layer configured to mold the second sub-chip on the first sub-chip, and a first redistribution structure arranged above the first stack semiconductor chip and the first molding layer, a second redistribution structure arranged under the chip structure and bonded to the chip structure, a bonding wire electrically connecting the second redistribution structure to the first redistribution structure, and a second molding layer configured to seal, on the second redistribution structure, the chip structure and the bonding wire.
20240274581. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dohoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungmin KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H10B80/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a package substrate, and a first semiconductor chip positioned on the package substrate. the first semiconductor chip includes a first inactive layer and a first active layer. the first inactive layer includes a high-density region, and the high-density region of the first inactive layer has a higher density than densities of other regions of the first inactive layer.
20240274582. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): TAE-HO KANG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a plurality of semiconductor chips stacked sequentially. each semiconductor chip includes a substrate including a back surface and a front surface which are opposite to each other, a plurality of first back conductive pads disposed on the back surface, a plurality of second back conductive pads disposed on the back surface, and a redistribution pattern disposed on the back surface and disposed between the plurality of second back conductive pads.
20240274588. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung-kwan Ryu of Seongnam-si (KR) for samsung electronics co., ltd., Yun-seok Choi of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L21/56, H01L23/00, H01L23/31, H01L23/48, H01L23/498
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes a base package substrate, a first semiconductor chip, and a second semiconductor chip. the base package substrate includes a redistribution region where a redistribution layer is provided, a plurality of vertical conductive vias connected to the redistribution layer, and a recess region recessed from an upper surface of the redistribution region. the base package substrate further includes an interposer in the recess region, the interposer comprising a substrate, a plurality of upper pads disposed at an upper surface of the substrate, and plurality of through electrodes respectively connected to the plurality of upper pads to pass through the substrate. the first semiconductor chip and second semiconductor chip, each include a plurality of conductive interconnection terminals respectively connected to the plurality of upper pads and the vertical conductive vias exposed at the upper surface of the redistribution region. the first semiconductor chip and the second semiconductor chip are mounted on the extension region and the interposer and disposed horizontally apart from each other. as seen from a plan view, the interposer is disposed to overlap a portion of each of the first semiconductor chip and the second semiconductor chip.
Inventor(s): Seongmin SON of Suwon-si (KR) for samsung electronics co., ltd., Seokho KIM of Suwon-si (KR) for samsung electronics co., ltd., Sumin PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyuha LEE of Suwon-si (KR) for samsung electronics co., ltd., Joohee JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L23/13, H01L23/58, H01L27/118
CPC Code(s): H01L27/0207
Abstract: a semiconductor device includes a first substrate structure and a second substrate structure stacked on the first substrate structure. the first substrate structure includes a plurality of first bonding pads in a first die region of a first substrate, a first passivation layer on the first substrate and exposing the first bonding pads, and a plurality of first dummy patterns in the first passivation layer in a first scribe region. the second substrate structure includes a plurality of second bonding pads in a second die region of a second substrate, a second passivation layer on the second substrate and exposing the second bonding pads, and a plurality of second dummy patterns in the second passivation layer in a second scribe region. the first bonding pad and the second bonding pad are directly bonded to each other.
Inventor(s): Jinwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hojun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sutae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/06, H01L21/306, H01L23/48, H01L23/522, H01L29/732
CPC Code(s): H01L27/0623
Abstract: the present disclosure relates to an integrated circuit element and a manufacturing method thereof. an integrated circuit element may include a substrate including a first region and a second region, a first element in the first region of the substrate and configured to generate an electric field in a horizontal direction, and a second element in the second region of the substrate and configured to generate an electric field is formed in a vertical direction, wherein a thickness of the second region of the substrate is thicker than a thickness of the first region.
Inventor(s): Seokho YUN of Hwaseong-si (KR) for samsung electronics co., ltd., Sookyoung ROH of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B3/00, G02B5/18, H04N25/70
CPC Code(s): H01L27/14621
Abstract: provided is an image sensor including a sensor substrate including a first photo-sensing cell and a second photo-sensing cell configured to sense light, a spacer layer that is transparent and disposed on the sensor substrate, and a color separating lens array disposed on the spacer layer and including a first region disposed opposite to the first photo-sensing cell in a vertical direction and having a first pattern, and a second region disposed opposite to the second photo-sensing cell in the vertical direction and having a second pattern that is different from the first pattern, and wherein the first pattern is configured to separate, from incident light, a first wavelength light and condense the first wavelength light to the first photo-sensing cell, and the second pattern is configured to separate, from the incident light, a second wavelength light and condense the second wavelength light to the second photo-sensing cell.
20240274629. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kooktae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/63
CPC Code(s): H01L27/14623
Abstract: an image sensor includes a substrate having a pixel separation recess, a plurality of photo-sensing elements arranged in the substrate, and a pixel separation region filling the pixel separation recess, wherein the pixel separation region includes a first insulating layer covering an inner wall of the pixel separation recess, a first conductive layer covering at least a portion of a side surface of the first insulating layer within the pixel separation recess, a second insulating layer covering a portion of a side surface of the first conductive layer within an inner space defined by the first conductive layer, and a second conductive layer filling all of a space not filled by the second insulating layer from among the inner space defined by the first conductive layer, and connected to and in contact with the first conductive layer.
Inventor(s): JIHYUN KWAK of Suwon-si (KR) for samsung electronics co., ltd., HONGKI KIM of Suwon-si (KR) for samsung electronics co., ltd., HYO EUN KIM of Suwon-si (KR) for samsung electronics co., ltd., SANG-HOON SONG of Suwon-si (KR) for samsung electronics co., ltd., SEUNGJAE OH of Suwon-si (KR) for samsung electronics co., ltd., SURIM LEE of Suwon-si (KR) for samsung electronics co., ltd., TAEYON LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14627
Abstract: disclosed is an image sensor which includes a substrate including an active region that includes a plurality of photoelectric conversion pixels and a peripheral region that extends around the active region, a transparent window on the substrate, a wall structure that is on the peripheral region along a periphery of the substrate and seals a space between the substrate and the transparent window, a planarization insulting layer on the active region and a portion of the peripheral region of the substrate, and a plurality of lens patterns on the planarization insulating layer. the planarization insulting layer includes first to third lens regions, and the lens patterns have different shapes and/or are arranged at different intervals on the first to third lens regions.
20240274638. CMOS IMAGE SENSORS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jung Bin YUN of Hwaseong-si (KR) for samsung electronics co., ltd., Kyungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Sung-Ho CHOI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: disclosed is a complementary metal oxide semiconductor (cmos) image sensor. the image sensor comprises a first separation zone in a substrate, the first separation zone defining first and second pixel regions arranged in a first direction, the first separation zone including first parts substantially parallel extending in the first direction, and the substrate including a first active region vertically overlapping one of the first parts and a second active region vertically overlapping another of the first parts. the image sensor further comprises first and second photoelectric conversion devices arranged in the first direction on at least one of the first and second pixel regions in the substrate, and a source follower gate on the first active region of the substrate.
Inventor(s): Jeonggyu SONG of Seongnam-si (KR) for samsung electronics co., ltd., Younsoo KIM of Yongin-si (KR) for samsung electronics co., ltd., Jaeho LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/12, H10B12/00
CPC Code(s): H01L28/40
Abstract: a capacitor includes: a bottom electrode; a top electrode over the bottom electrode; a dielectric film between the bottom electrode and the top electrode; and a doped alofilm between the top electrode and the dielectric film, wherein the doped alofilm includes a first dopant, and an oxide including the same element as the first dopant has a higher dielectric constant than a dielectric constant of alo.
Inventor(s): Sungyoung YOON of Suwon-si (KR) for samsung electronics co., ltd., Jonghwa SHIN of Daejeon (KR) for samsung electronics co., ltd., Minyeul LEE of Daejeon (KR) for samsung electronics co., ltd., Sungyeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Taekjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Meehyun LIM of Suwon-si (KR) for samsung electronics co., ltd., Sungyong LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06
CPC Code(s): H01L29/0657
Abstract: a dielectric structure may include: an insulating layer extending in a first direction; a plurality of conductor layers disposed on a first surface of the insulating layer and spaced apart from each other in the first direction; at least one semiconductor layer disposed on a second surface of the insulating layer, opposite to the first surface, and overlapping each of at least two conductor layers adjacent to each other among the plurality of conductor layers in a second direction intersecting the first direction; a first protective layer covering the plurality of conductor layers on the first surface of the insulating layer; and a second protective layer covering the at least one semiconductor layer on the second surface of the insulating layer.
20240274664. INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungmin JU of Suwon-si (KR) for samsung electronics co., ltd., Chansic YOON of Suwon-si (KR) for samsung electronics co., ltd., Gyuhyun KIL of Suwon-si (KR) for samsung electronics co., ltd., Junghoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Weonhong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H10B12/00
CPC Code(s): H01L29/0847
Abstract: an integrated circuit device includes a gate stack on a substrate, a spacer on first and second sidewalls of the gate stack, a source/drain area in an upper portion of the substrate on first and second sides of the gate stack, a cover semiconductor layer on the source/drain area, an interlayer insulating film on the cover semiconductor layer and surrounding sidewalls of the gate stack, and a contact in a contact hole that penetrates the interlayer insulating film and the cover semiconductor layer, the contact having a bottom portion contacting the cover semiconductor layer and the source/drain area.
Inventor(s): Jongryeol YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/423, H01L29/45, H01L29/66, H01L29/775
CPC Code(s): H01L29/0847
Abstract: a semiconductor device may include a substrate, a channel pattern on the substrate, a source/drain pattern, an interlayer insulating pattern on the source/drain pattern, and an active contact penetrating the interlayer insulating layer and being electrically connected to the source/drain pattern. the channel pattern may include a plurality of semiconductor patterns. the plurality of semiconductor patterns may be vertically stacked and spaced apart from each other. a lowermost one of the plurality of semiconductor patterns may be a first semiconductor pattern. the source/drain pattern may be connected to the plurality of semiconductor patterns. a level of a bottommost surface of the active contact may be lower than a top surface of the first semiconductor pattern.
Inventor(s): Jongjin LEE of Clifton Park NY (US) for samsung electronics co., ltd., Sooyoung PARK of Clifton Park NY (US) for samsung electronics co., ltd., Kang-ill SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/8234, H01L23/48, H01L27/088, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: provided is a semiconductor device including: a channel structure; a 1source/drain region on the channel structure; and an enlarged backside contact structure connected to the 1source/drain region, wherein the enlarged backside contact structure includes a backside contact structure below the 1source/drain region, a 1side via structure at a 1side of the 1source/drain region, and a 1front contact structure above the 1source/drain region, and wherein the backside contact structure is connected to the 1side via structure, which is connected to the front contact structure.
20240274677. INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gunho Jo of Suwon si (KR) for samsung electronics co., ltd., Chulsung Kim of Suwon si (KR) for samsung electronics co., ltd., Bomi Kim of Suwon si (KR) for samsung electronics co., ltd., Heesub Kim of Suwon si (KR) for samsung electronics co., ltd., Eunho Cho of Suwon si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/48, H01L27/092, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: an integrated circuit device includes fin-type active regions protruding from a substrate and extending lengthwise in a first horizontal direction, source/drain regions respectively arranged on the fin-type active regions, a device isolation film covering both sidewalls of each fin-type active region, an insulating structure covering the source/drain regions and the device isolation film, source/drain contacts respectively arranged on and connected to the source/drain regions and apart from each other in a second horizontal direction perpendicular to the first horizontal direction, and a contact isolation insulating film arranged between the source/drain contacts in the second horizontal direction and having a lower surface closer to the substrate than a lower surface of each source/drain contact. at least one of the source/drain contacts includes a first portion extending in a vertical direction toward the substrate along a surface of the contact isolation insulating film.
20240274679. INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongmin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Junmo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyubong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L27/12, H01L29/423, H01L29/45, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: an integrated circuit device may include a fin-type active structure elongated in a first horizontal direction, a nanosheet stack including nanosheets on the fin-type active structure, a gate structure extending between the nanosheets, a source/drain structure on the fin-type active structure at a position adjacent to the gate structure and facing the nanosheet stack in the first horizontal direction, a vertical separation layer including a silicon layer in contact with a silicide separation layer. the silicide separation layer may be between the source/drain structure and each of the nanosheet stack and the gate structure. the silicon separation layer may be between the silicide separation layer and each of the nanosheet stack and the gate structure. the source/drain structure may include a metal. the gate structure may include at least one sub-gate surrounding at least one nanosheet among the plurality of nanosheets on the fin-type active structure.
Inventor(s): HEUNG-SOON LEE of Suwon-si (KR) for samsung electronics co., ltd., YONGHEE PARK of Suwon-si (KR) for samsung electronics co., ltd., DONG-GWAN SHIN of Suwon-si (KR) for samsung electronics co., ltd., SEOKHOON KIM of Suwon-si (KR) for samsung electronics co., ltd., SEUNGKYU KIM of Suwon-si (KR) for samsung electronics co., ltd., HONGSEON YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/06, H01L29/08, H01L29/417, H01L29/775, H01L29/786
CPC Code(s): H01L29/42392
Abstract: a semiconductor device and a method of manufacturing the same are provided. a semiconductor device includes: an active pattern including a lower pattern and a plurality of sheet patterns spaced apart from each other on the lower pattern; a gate structure positioned on the lower pattern and surrounding the sheet patterns; source/drain patterns positioned on both sides of the gate structure, and stacked patterns positioned between the source/drain patterns and the sheet patterns, wherein a stacked pattern includes a first stacked pattern and a second stacked pattern sequentially stacked on a side surface of a sheet pattern, the second stacked pattern including a material different from a material of the first stacked pattern, and a first width of the sheet pattern is smaller than a second width of the gate structure.
20240274686. STACKED INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byungho MOON of Suwon-si (KR) for samsung electronics co., ltd., Inchan HWANG of Suwon-si (KR) for samsung electronics co., ltd., Doyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L21/8234, H01L27/088, H01L29/06, H01L29/08, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/42392
Abstract: a stacked integrated circuit device, including a lower active region, a lower gate pattern surrounding the lower active region, a lower dielectric layer between the lower active region and the lower gate pattern, an intermediate insulating layer on the lower active region, an upper active region on the intermediate insulating layer, an upper gate pattern surrounding the upper active region and covering the lower gate pattern, and an upper dielectric layer between the upper active region and the upper gate pattern, wherein an upper surface of the lower gate pattern is located lower in a vertical direction than an upper surface of the intermediate insulating layer, and the lower gate pattern surrounds at least a portion of a side surface of the intermediate insulating layer.
Inventor(s): Injun HWANG of Hwaseong-si (KR) for samsung electronics co., ltd., Jaejoon OH of Hwaseong-si (KR) for samsung electronics co., ltd., Boram KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Sunkyu HWANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/47, H01L27/095, H01L29/20, H01L29/778
CPC Code(s): H01L29/475
Abstract: a hemt may include a channel layer including a 2deg as a channel carrier, first and second electrodes separated on the channel layer, a first semiconductor layer on the channel layer between the first and second electrodes and having a greater band gap greater than the channel layer, a gate stack on the first semiconductor layer, and a gate electrode in ohmic contact with the gate stack. the gate stack may include a lower layer contacting the first semiconductor layer, a second semiconductor layer providing a schottky barrier on the lower layer, and an upper layer on the second semiconductor layer. the upper layer may be doped with a p-type dopant and may have a lower band gap than the second semiconductor layer.
Inventor(s): Sangwook KIM of Seongnam-si (KR) for samsung electronics co., ltd., Yunseong LEE of Osan-si (KR) for samsung electronics co., ltd., Sanghyun JO of Seoul (KR) for samsung electronics co., ltd., Jinseong HEO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L21/28, H01L21/8234, H01L27/088, H01L29/51, H01L29/66
CPC Code(s): H01L29/78391
Abstract: an integrated circuit includes transistors respectively including channel layers in a substrate, source electrodes and drain electrodes respectively contacting both sides of the channel layers, gate electrodes on the channel layers, and ferroelectrics layers between the channel layers and the gate electrodes. electrical characteristics of the ferroelectrics layers of at least two of the transistors are different. accordingly, threshold voltages of the transistors are different from each other.
Inventor(s): Sungyong MIN of Suwon-so (KR) for samsung electronics co., ltd., Kyungwoon Jang of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Changkyu Chung of Changkyu (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/38, H01L25/16, H01L33/42
CPC Code(s): H01L33/38
Abstract: a display module is provided and includes a driving substrate; first electrodes on the driving substrate, and light-emitting diodes (leds) including: semi-conductor layers; second electrodes respectively corresponding to the first electrodes; protrusions on each of the second electrodes; and metal layers on the protrusions, each of the metal layers connected to one of the second electrodes. the display module further includes a non-conductive film layer between the driving substrate and the leds. the first electrodes and the second electrodes are connected by the metal layers.
20240274757. LIGHT-EMITTING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jiho YOU of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Juwon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sungwoo CHOl of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L33/46
CPC Code(s): H01L33/502
Abstract: a light-emitting device includes: a semiconductor light-emitting structure configured to emit light having a first wavelength; a wavelength conversion layer configured to convert the light which has the first wavelength into light having a second wavelength that is greater than the first wavelength; and a multi-inorganic-film coating layer spaced apart from a light-emitting surface with the wavelength conversion layer therebetween. the multi-inorganic-film coating layer includes a distributed bragg reflector structure in which first and second inorganic films are alternately stacked, and an uppermost inorganic film farthest from the wavelength conversion layer from among the plurality of inorganic films has a greatest thickness in a first direction perpendicular to the light-emitting surface of the semiconductor light-emitting structure. the first refractive index is selected from a range of about 1.1 to about 1.5, and the second refractive index is selected from a range of about 2.0 to about 3.0.
Inventor(s): Sanghyun SOHN of Suwon-si (KR) for samsung electronics co., ltd., Sungjun KOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L25/075, H01L33/32
CPC Code(s): H01L33/505
Abstract: a display module includes a substrate, and a plurality of pixels provided on the substrate, where each of the plurality of pixels includes a self-luminescence layer, a first color conversion layer, a second color conversion layer, and a third color conversion layer provided on the self-luminescence layer, and a first color filter, a second color filter, and a third color filter respectively provided on the first color conversion layer, the second color conversion layer, and the third color conversion layer, where the self-luminescence layer is configured to emit light of a wavelength that is less than or equal to 460 nm and the first color conversion layer includes a first color conversion material including a turquoise quantum dot or a turquoise phosphor.
20240274773. DISPLAY PANEL MANUFACTURING METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungwoon JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H01L23/00, H01L25/075
CPC Code(s): H01L33/62
Abstract: a display panel manufacturing method includes: putting a first substrate into a liquid; putting a plurality of light emitting diodes into the liquid in which the first substrate is put; performing fluidic self-assembly to attach the plurality of light emitting diodes to the first substrate; transferring the plurality of light emitting diodes attached to the first substrate to a second substrate; and thermally compressing the plurality of light emitting diodes transferred to the second substrate onto the second substrate.
Inventor(s): Tari PARK of Suwon-si (KR) for samsung electronics co., ltd., Kiyoun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M10/42, H01M50/105, H01M50/184
CPC Code(s): H01M10/4257
Abstract: an electronic device is provided. the electronic device includes a battery including a double forming cell structure, electrode assemblies including a first electrode tab including a positive terminal and a negative terminal, a pouch which includes a terrace sealing the pouch such that at least a portion of the first electrode tab exposed to outside, and surrounds the electrode assembly on both sides, a first protective circuit module electrically connected to the electrode assembly through the withdrawn first electrode tab and disposed on one side of the terrace with respect to the withdrawal direction of the first electrode tab, a second protective circuit module electrically connected to the electrode assembly and disposed on the other side of the terrace.
Inventor(s): Yeonsik YU of Suwon-si (KR) for samsung electronics co., ltd., Sungjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanguk PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongwan SHIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongnam CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/22
CPC Code(s): H01Q1/22
Abstract: an antenna device according to an embodiment may comprise: a substrate portion; a first via pad configured to provide a power supply signal to a radiation member comprising a radiator; a second via pad configured to provide a ground to the radiation member; the radiation member being connected to the first via pad and the second via pad; and a radiation guide portion formed of a dielectric extending from the substrate portion in a lateral direction of the substrate portion and configured to guide a beam emitted from the radiation member, thereby directing the beam in the lateral direction.
Inventor(s): Sungchul PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/22, H01Q1/24, H01Q15/14
CPC Code(s): H01Q1/2283
Abstract: an inclined antenna assembly and an electronic device including the antenna assembly are provided. the inclined antenna assembly and an electronic device include a communication circuit and a printed circuit board (pcb) including a front face, a back face on which the communication circuit is disposed, and at least one side face having an inclined manner between the front face and the back face. according to various embodiments, the pcb may include one or more antennas formed on a region corresponding to at least one side face.
Inventor(s): Jinheon OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02N2/02, G02B27/64, G03B5/00, G03B13/36, H04N23/50
CPC Code(s): H02N2/025
Abstract: a piezoelectric motor according to one embodiment may include: a vibrating body including an elastic body and a piezoelectric element attached to the elastic body; and a rod coupled to the vibrating body and configured to move on the basis of vibration of the vibrating body. the piezoelectric element may include a first surface and a second surface facing opposite to the first surface of the piezoelectric element and attached to the elastic body. the rod can extend perpendicular to the piezoelectric element. the vibrating body can be configured to generate a bending vibration in the longitudinal direction of the rod on the basis of a voltage applied to the piezoelectric element, and can be configured to define a nodal position during the bending vibration. the elastic body may include a base portion attached to the second surface of the piezoelectric element and a protruding portion protruding from the base portion and formed at a position corresponding to the nodal position of the vibrating body.
Inventor(s): Won Ji PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehee OH of Suwon-si (KR) for samsung electronics co., ltd., Hyungwon KIM of Suwon-si (KR) for samsung electronics co., ltd., WooSeong JANG of Suwon-si (KR) for samsung electronics co., ltd., Taekyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngbin HYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K19/08
CPC Code(s): H03K19/08
Abstract: a logic device includes a substrate; at least one first insulating layer on the substrate; a second insulating layer on the at least one first insulating layer; and a capacitor portion in the at least one first insulating layer and the second insulating layer, wherein the at least one first insulating layer includes a plurality of through-holes, the capacitor portion includes a capacitor structure including a lower electrode, a dielectric film, and an upper electrode, and the capacitor structure continuously extends along the inside of the plurality of through-holes and along an upper surface of the at least one first insulating layer around the plurality of through-holes.
Inventor(s): Jahoon JIN of Suwon-si (KR) for samsung electronics co., ltd., Sangho KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan MIN of Suwon-si (KR) for samsung electronics co., ltd., Soomin LEE of Suwon-si (KR) for samsung electronics co., ltd., Sodam JU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03L7/091, H03L7/081
CPC Code(s): H03L7/091
Abstract: disclosed is a frequency detector. the frequency detector includes a first flip-flop sampling a clock signal based on a data signal to generate a first signal, a second flip-flop sampling a delayed-phase component of the clock signal based on the data signal or sampling the clock signal based on a delayed-phase component of the data signal to generate a second signal, a third flip-flop generating a third signal representing a polarity of a frequency difference between a data rate of the data signal and a frequency of the clock signal based on the first signal and the second signal, and a delay cell generating the delayed-phase component of the clock signal or the delayed-phase component of the data signal. the delayed-phase component has a delay amount set to a value smaller than about 0.25 ui.
Inventor(s): Omar Abdulmonem Mohamed ELSAYED of San Jose CA (US) for samsung electronics co., ltd., Tienyu CHANG of Sunnyvale CA (US) for samsung electronics co., ltd., Fan ZHANG of Los Altos CA (US) for samsung electronics co., ltd., Siuchuang Ivan LU of San Jose CA (US) for samsung electronics co., ltd., Sangwon SON of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B1/525
CPC Code(s): H04B1/525
Abstract: a system and a method are disclosed for reducing local oscillator leakage. in some embodiments, a system includes a circuit, including: a mixer; and a bias control circuit, the mixer having a first local oscillator input, the bias control circuit being configured to control a bias at the first local oscillator input.
Inventor(s): Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04B7/06
CPC Code(s): H04B7/0456
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system, the method comprising: receiving, from a base station, configuration information for a channel state information (csi) report; identifying a precoding matrix indicator (pmi) of at least one code book based on the configuration information; and transmitting, to the base station, the csi report including the pmi, wherein the pmi indicates information related to ue-side vectors and base station-side vectors.
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/0626
Abstract: apparatuses and methods for subset restriction for parameter combination for coherent joint transmission in wireless networks. a method performed by a user equipment includes receiving information about a csi report. the information includes codebook parameters n≥1 combinations of values of {l, . . . , l} from a first table and a value of (p, �) from a second table. {l, . . . , l} is used to determine a number of first set of vectors associated with each of ngroups of ports, nis a number ≥1, � is a parameter used to determine a maximum number of coefficients, and pare parameters used to determine a second set of vectors. the method further includes determining the csi report based on the information and transmitting the csi report. the codebook parameters are configured based on a third table that links the first and second tables.
Inventor(s): Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00
CPC Code(s): H04B7/0626
Abstract: a method performed by a terminal in a wireless communication system is provided. the method includes receiving first configuration information associated with at least one beam identifier, receiving information related to a reference signal resource set, reference signal resources in the reference signal resource set being associated with beam identifiers associated with the first configuration information, the reference signal resource set including a first resource set, and determining a channel state information (csi) parameter or transmitting a csi report, the csi parameter or the csi report being associated with a beam identifier, wherein the csi parameter or the csi report is associated with the reference signal resource set.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00
CPC Code(s): H04B7/06968
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure relates to the operation of a ue and a base station in a wireless communication system and, more specifically, to a method of transmitting or receiving an uplink reference signal in a wireless communication system and an apparatus capable of performing the same. the disclosure also relates to an apparatus and a method for effectively providing services in a mobile communication system.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Jungmin PARK of Hwaseong-si (KR) for samsung electronics co., ltd., Hsien-Ping LIN of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04J11/00, H04W72/23
CPC Code(s): H04J11/0073
Abstract: a system and method for accommodating reduced capability user equipment in a mobile network. the method may include a method for accommodating bandwidth-limited ues in the initial access process, employing an extended system information block #1, or employing, for bandwidth-limited ues, a separate synchronization signal block, a separate initial control resource set, and a separate radio resource control system information block #1.
[[20240275524. SYSTEM AND METHOD FOR PROVIDING DYNAMIC HYBRID AUTOMATIC REPEAT REQUEST (HARQ) CODEBOOK WITH MULTIPLE VALID UNICAST DOWNLINK CONTROL INFORMATION (DCI) PER MONITORING OCCASION INDEX PER SERVING CELL_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Hamid SABER of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L1/1812, H04L1/1607
CPC Code(s): H04L1/1812
Abstract: a method and system for determining a physical uplink control channel (pucch) resource are provided. a last physical downlink control channel (pdcch) in a monitoring occasion (mo) with a largest mo index, from among a plurality of mos, on a serving cell with a largest cell index, from among a plurality of serving cells, is identified based on a search space identifier (id) independent of a control resource set (coreset) index. the pucch resource is determined from the last pdcch.
Inventor(s): Aby KANNEATH ABRAHAM of Bangalore (IN) for samsung electronics co., ltd., Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/231, H04W72/563, H04W88/06
CPC Code(s): H04L5/0035
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments of the disclosure describe a method and a system for configuring multi universal subscriber identity module (musim) gaps for multi-subscriber identity module user equipment (ue) in a communication network. the method comprises receiving (), at a master node associated with a network entity from the multi-sim ue, a gap configuration request. further, the method comprises configuring, by the master node, the multi-sim ue with musim gaps based on the received gap configuration request. further, the method comprises sending, by the master node to a secondary node associated with the network entity, a message indicative of the musim gaps configured for the multi-sim ue, wherein the message includes information related to gap priority of the musim gaps.
Inventor(s): Cheolkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Junyung YI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W64/00
CPC Code(s): H04L5/0051
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. more particularly, disclosed is a method and apparatus for performing resource selection and signal transmission or reception for positioning between ues. according to various embodiments, a method performed by a first user equipment (ue) in a wireless communication system, the method comprising: transmitting, to a second ue, a first sidelink positioning reference signal (sl prs); receiving, from the second ue, a second sl prs; and identifying a sl prs time difference based on the first sl prs and the second sl prs, wherein the sl prs time difference is a difference between a received timing of a sidelink subframe #i associated with the first sl prs and a transmit timing of a sidelink subframe #j associated with the second sl prs, according to an indication via a higher layer signaling.
Inventor(s): Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/044, H04W72/23
CPC Code(s): H04L5/0055
Abstract: enhancing reception reliability for control information or data information includes receiving: a first configuration for a coreset and a second configuration for a second coreset; a first pdcch, in the first coreset or the second coreset, including a first dci format; and a first pdsch, scheduled by the first dci format, including a tb. the method further includes transmitting a first pucch including a first harq-ack codebook and a second pucch including a second harq-ack codebook. harq-ack information, in response to receiving the tb, is included in: the first harq-ack codebook when the first pdcch is received in the first coreset and the second harq-ack codebook when the first pdcch is received in the second coreset.
Inventor(s): SEUNG-HO LEE of SUWON-SI (KR) for samsung electronics co., ltd., MYUNG-SIK CHOI of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/08, G06F21/62
CPC Code(s): H04L9/088
Abstract: an electronic device includes a storage device, including a secure area assigned to a trusted application and a normal area, and a processor configured to generate a user identifier, assigned to the trusted application, based on the trusted application and device information and to manage data requested for the secure area from the trusted application based on the user identifier. the device information includes at least one of information associated with the storage device and information associated with the processor.
Inventor(s): Hojun BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L12/28, G01S13/02, G06F1/3206
CPC Code(s): H04L12/2818
Abstract: a method of controlling a mobile device, including determining, according to an output of a machine learning model based on a sensing value of an acceleration sensor, a state of the mobile device controlling a power of an ultrawide band (uwb) communication module based on the state of the mobile device determined according to the output of the machine learning model, determining, while the controlling controls the power of the uwb communication module to be turned on, a ranging interval based on a magnitude of acceleration of the mobile device, obtaining information associated with a distance between the mobile device and at least one home appliance by performing ranging through uwb communication module according to the ranging interval, and identifying at least one controllable home appliance based on the information associated with the distance.
Inventor(s): Dohun KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyujae JANG of Suwon-si (KR) for samsung electronics co., ltd., Jaemoon CHA of Suwon-si (KR) for samsung electronics co., ltd., Jimin KOO of Suwon-si (KR) for samsung electronics co., ltd., Jaegon GHIM of Suwon-si (KR) for samsung electronics co., ltd., Jungsuk WOO of Suwon-si (KR) for samsung electronics co., ltd., Yeonsang YUN of Suwon-si (KR) for samsung electronics co., ltd., Kwangsu LEE of Suwon-si (KR) for samsung electronics co., ltd., Deokhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangdon LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeonjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun CHANG of Suwon-si (KR) for samsung electronics co., ltd., Sungyoul CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyunkyung JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/02, H04L5/00
CPC Code(s): H04L25/0204
Abstract: disclosed are a transmission power control method and an electronic device for performing the same. the transmission power control method according to various embodiments may comprise: determining whether the magnitude of a reference signal received from a first base station for transmitting and receiving a first signal is greater than or equal to a set magnitude; determining a ratio of a specific absorption rate of the first signal according to a ratio set in the total specific absorption rate margin; and transmitting the first signal on the basis of the ratio of the specific absorption rate of the first signal.
Inventor(s): Sidhant JAIN of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Anoop Perumudi VEEDU of Bangalore (IN) for samsung electronics co., ltd., Arunprasath RAMAMOORTHY of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L41/0803, G16Y10/75, G16Y40/35
CPC Code(s): H04L41/0803
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. methods () and systems for determining an availability status of a first entity associated with a personal internet of things (iot) network (pin) () are described. the method () may comprise determining (), by second entity associated with the pin (), whether a periodic update request is received from the first entity prior to an expiry of a periodic update (pu) timer value. the method () may further comprise determining (), by the second entity, the availability status of the first entity based on the determination whether the periodic update request is received from the first entity.
Inventor(s): Eric YIP of Suwon-si (KR) for samsung electronics co., ltd., Jaeyeon SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L65/80, H04L65/1104, H04L65/60
CPC Code(s): H04L65/80
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment of the disclosure, a method performed by a node (e.g., network entity) in a communication system may be provided. the method may include: transmitting, to a first terminal, a session description protocol (sdp) offer message, wherein the sdp offer message comprises first information including a first identifier for a group of a first plurality of media streams; receiving, from the first terminal, an sdp answer message related to the sdp offer message; and transmitting, to the first terminal, at least one first media stream.
Inventor(s): Hyukjoong KWON of Suwon-si (KR) for samsung electronics co., ltd., Junhyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N5/265
CPC Code(s): H04N5/265
Abstract: a method, performed by a display device, of processing an image, may include: obtaining a video and graphics to be displayed on a display; based on identifying a changed display region in which the video is displayed, creating a first buffer queue for storing the graphics and a second buffer queue for storing the video; determining a first delay for the first buffer queue based on a picture quality processing mode for the video; storing the graphics in the first buffer queue with the first delay; storing the video in the second buffer queue; processing the graphics stored in the first buffer queue to obtain processed graphics; processing the video stored in the second buffer queue, based on the picture quality processing mode for the video to obtain processed video; and mixing the processed graphics with the processed video and outputting a result of the mixing.
Inventor(s): Dung Trung Vo of Costa Mesa CA (US) for samsung electronics co., ltd., Chenguang Liu of Tustin CA (US) for samsung electronics co., ltd., Chang Su of Foothills Ranch CA (US) for samsung electronics co., ltd., McClain C. Nelson of Anaheim CA (US) for samsung electronics co., ltd., Madhu Athreya of Saratoga CA (US) for samsung electronics co., ltd., William Mandel of Moorpark CA (US) for samsung electronics co., ltd., Soojung Hyun of Tustin CA (US) for samsung electronics co., ltd.
IPC Code(s): H04N9/73, G06T5/92, H04N9/64, H04N9/68
CPC Code(s): H04N9/73
Abstract: one embodiment provides a method comprising receiving an input content, and receiving ambient contextual data indicative of one or more ambient lighting conditions of an environment including a display device. the input content has corresponding metadata that at least partially represents a creative intent indicative of how the input content is intended to be viewed. the method further comprises adaptively correcting the input content based on the ambient contextual data to preserve the creative intent, and providing the corrected input content to the display device for presentation. the adaptively correcting comprises applying automatic white balancing to the input content to correct color tone of the input content.
Inventor(s): Geonjung KO of Seoul (KR) for samsung electronics co., ltd., Dongcheol Kim of Suwon-Si (KR) for samsung electronics co., ltd., Juhyung Son of Uiwang-Si (KR) for samsung electronics co., ltd., Jaehong Jung of Seoul (KR) for samsung electronics co., ltd., Jinsam Kwak of Anyang-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/105, H04N19/132, H04N19/159, H04N19/176, H04N19/46, H04N19/82
CPC Code(s): H04N19/105
Abstract: a video signal processing method includes: a step for deriving an intra prediction mode of a current block; a step for constructing a reference sample around the current block; a step for generating a prediction sample of the current block by using the reference sample on the basis of the intra prediction mode; and a step for restoring the current block on the basis of the prediction sample. the step for generating the prediction sample may include: a step for setting a filter flag value which specifies a filter coefficient of an interpolation filter applied to the reference sample on the basis of the width and height of the current block; and a step for performing filtering on the reference sample by using the interpolation filter having the filter coefficient specified by the filter flag.
Inventor(s): Jin-young LEE of Suwon-si (KR) for samsung electronics co., ltd., Seung-soo JEONG of Seoul (KR) for samsung electronics co., ltd., Woong-il CHOI of Osan-si (KR) for samsung electronics co., ltd., Anish TAMSE of Seoul (KR) for samsung electronics co., ltd., Yin-ji PIAO of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/52, H04N19/44
CPC Code(s): H04N19/52
Abstract: a method of decoding a motion vector includes: obtaining information indicating a motion vector resolution (mvr) of a current block from a bitstream; selecting one candidate block from among at least one candidate block, based on the mvr of the current block; and obtaining a motion vector of the current block corresponding to the mvr, by using a motion vector of the determined one candidate block as a prediction motion vector of the current block.
Inventor(s): Giyong Choi of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Kwangpyo Choi of Suwon-si (KR) for samsung electronics co., ltd., Yinji Piao of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/577, H04N19/105, H04N19/139, H04N19/172, H04N19/176, H04N19/52, H04N19/573
CPC Code(s): H04N19/577
Abstract: an image decoding method, including: obtaining a motion vector of at least one temporal neighboring block included in at least one of a first reference picture and a second reference picture; deriving one or more motion vector candidates from the motion vector of the at least one temporal neighboring block, wherein each motion vector candidate of the one or more motion vector candidates includes a first motion vector indicating a block within the first reference picture and a second motion vector indicating a block within the second reference picture; selecting a motion vector candidate for a current interpolation block from among the one or more motion vector candidates; generating the current interpolation block using a first block within the first reference picture indicated by the first motion vector included in the selected motion vector candidate and a second block within the second reference picture indicated by the second motion vector included in the selected motion vector candidate; and reconstructing a current block using the current interpolation block.
Inventor(s): Seungin PARK of Yongin-si (KR) for samsung electronics co., ltd., Jinwoo SON of Seoul (KR) for samsung electronics co., ltd., Changyong SON of Anyang-si (KR) for samsung electronics co., ltd., Byung In YOO of Seoul (KR) for samsung electronics co., ltd., Sangil JUNG of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/61, G06K19/06, G06T7/246, G06V40/16, H04N23/60
CPC Code(s): H04N23/61
Abstract: an image sensor includes: a motion detection circuit configured to detect a motion in image frames; and a micro control unit (mcu) configured to adjust at least a portion of a target frame among the image frames based on whether the motion is detected, and detect whether a target object is present based on the adjusted portion of the target frame.
Inventor(s): Keunjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Junseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk Park of Suwon-si (KR) for samsung electronics co., ltd., Bongki Son of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/47, H04N25/69, H04N25/78
CPC Code(s): H04N25/47
Abstract: a vision sensor is provided. the vision sensor includes: a pixel array including a plurality of pixels, each of the plurality of pixels being configured to generate an event signal based on an event in which intensity of incident light changes; and an event detection circuit including a state register including a first flip-flop and a second flip-flop. the event detection circuit is configured to: based on the event signal, store first data in the first flip-flop, the first data indicating whether flicker has occurred in each of the plurality of pixels, store second data in the second flip-flop, the second data indicating whether the event has occurred in each of the plurality of pixels, and based on a comparison of the first data and the second data, identify and delete a portion of the second data in which the flicker has occurred.
Inventor(s): Younggu JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/53, G01S7/4863, G01S17/894, H04N23/56, H04N25/771, H04N25/78
CPC Code(s): H04N25/53
Abstract: an image sensor for distance measurement and a camera module including the same are provided. the image sensor includes a pixel array including a plurality of unit pixels, a control circuit configured to provide a plurality of photo gate signals to the plurality of unit pixels, respectively, and a readout circuit configured to read out pixel signals from the pixel array on a frame-by-frame basis, wherein the control circuit generates the plurality of photo gate signals such that a pulse width is changed within one frame section.
Inventor(s): Sunil Bharitkar of Stevenson Ranch CA (US) for samsung electronics co., ltd.
IPC Code(s): H04R3/00, G06N3/0464
CPC Code(s): H04R3/00
Abstract: one embodiment provides a method of signal normalization. the method comprises receiving an input content with a corresponding audio signal, and extracting loudness metadata from an audio signal corresponding to the input content. the method further comprises estimating, using a machine learning model, a peak-level amplitude based on the loudness metadata. the peak-level amplitude represents a maximum linear amplitude of the audio signal over an entire duration of the input content. the method further comprises determining a gain based at least on the peak-level amplitude, and applying the gain to the audio signal. the resulting gain-scaled audio signal is provided to one or more speakers coupled to or integrated in an electronic device for audio playback.
Inventor(s): Jaesung PARK of Suwon-si (KR) for samsung electronics co., ltd., Seeyoun KWON of Suwon-si (KR) for samsung electronics co., ltd., Anant BAIJAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R29/00, H04R1/10
CPC Code(s): H04R29/001
Abstract: an electronic device according to various embodiments comprises: an ear tip detachable from the electronic device; a microphone; a speaker; a sensor module comprising at least one sensor configured to sense information of the electronic device; memory storing a leaking sound profile representing the relationship between the magnitude of a signal leaking out of an object on which the electronic device is mounted among signals being output from the electronic device, and the frequency of the signals being output; and at least one processor, comprising processing circuitry, operatively connected with the microphone, the speaker, and the memory. at least one processor, individually and/or collectively, may be configured to: output first signals using the speaker; use the microphone to receive a second signal leaking out of the object on which the electronic device is mounted among the first signals; obtain signal characteristics representing the relationship between a magnitude of the second signal and the frequency of the second signal; determine, based on the information obtained from the sensor module, the leaking sound profile, and the comparison result of the signal characteristics, whether the electronic device is properly mounted and whether the ear tip has been properly selected; provide a mounting guide for the electronic device in response to determining that the electronic device is not properly mounted; and provide an ear tip selection guide in response to determining that the ear tip is not properly mounted.
Inventor(s): Junhyuk SONG of Suwon-si (KR) for samsung electronics co., ltd., Seungwon KANG of Suwon-si (KR) for samsung electronics co., ltd., Youngsung KHO of Suwon-si (KR) for samsung electronics co., ltd., Chulmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Chungkeun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/20, H04L43/0882, H04W8/18
CPC Code(s): H04W8/20
Abstract: the present disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system to support higher data transmission rates after a 4th generation (4g) communication system such as long term evolution (lte). according to embodiments, a method performed by a e2 node is provided. the method comprises receiving, from a near-real time (near-rt) radio access network (ran) intelligent controller (ric), a first message for indicating that load status of the near-rt ric is overloaded, waiting for signaling on e2 interface until receiving a second message indicating that the load status of the near-rt ric is not overloaded, based on the first message, receiving, from the near-rt ric, the second message, and performing the signaling on the e2 interface after receiving the second message.
Inventor(s): Aby Kanneath ABRAHAM of Bangalore (IN) for samsung electronics co., ltd., Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W8/24, H04W8/18, H04W76/38
CPC Code(s): H04W8/24
Abstract: a user equipment (ue) in a wireless communication system is provided. the ue includes a transceiver, memory storing one or more computer programs, and one or more processors communicatively coupled to the transceiver and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the ue to receive, from a base station, a system information block (sib) including a first indication on whether a transmission of a second indication is allowed, identify that a ue capability is restricted for a multi-universal subscriber identity module (musim), and transmit, to the base station, a radio resource control (rrc) message including the second indication indicating a ue temporary capability restriction due to the musim operation.
Inventor(s): Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04L41/16
CPC Code(s): H04W24/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method executed by a user equipment (ue) in a wireless communication system is provided. the method includes monitoring an artificial intelligence (ai) model based on at least one measurement criterion, and transmitting model related information based on the monitoring result, wherein the measurement criterion comprises one or more beam performance related measurement metrics, and wherein the measurement criterion is used to monitor/evaluate performance of the ai model.
Inventor(s): Deepanshu GAUTAM of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04L41/5009, H04W12/08
CPC Code(s): H04W24/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure relates to a system and method for managing exposure governance control information in 3gpp management system. the method includes receiving, from a network entity by an egmf, a create moi request comprising at least one of a consumer identification (id) with respect of each of a registered consumer with the bss and an exposure governance control information corresponding to the consumer id. the method further includes creating by the egmf, based on the received createmoi request, an instance for exposuregovernancecontrol information object class (ioc) comprising a plurality of ioc attributes, wherein the plurality of ioc attributes are related to the exposure governance control information. thereafter, the method further includes sending, by the egmf, a response to the network entity upon successful creation of the instance for exposuregovernancecontrol ioc.
Inventor(s): Yuan-Sheng CHENG of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04B7/06, H04W72/1268, H04W72/232
CPC Code(s): H04W24/10
Abstract: a method and an apparatus are provided in which it is detected that a condition for triggering a layer- (l) measurement report transmission is satisfied based on a layer- (l) measurement. it is determined whether the condition is detected over a first duration based on an l measurement, in response to detecting that the condition is satisfied based on the l measurement, and the measurement report is transmitted in case that the condition is detected over the first duration.
Inventor(s): Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd.s, Hongbo Si of Allen TX (US) for samsung electronics co., ltd.s, Shiyang Leng of Allen TX (US) for samsung electronics co., ltd.s
IPC Code(s): H04W24/10, H04W52/02
CPC Code(s): H04W24/10
Abstract: methods and apparatuses for a measurement control operation with low power signals in a wireless communication system. a method of a ue comprises: receiving first and second signal; performing a measurement operation on the first signal of the serving cell: based on a determination that the measurement result of the first signal meets the first threshold, skipping the measurement operation on the second signal of the serving cell, and based on a determination that the measurement result of the first signal does not meet the first threshold: performing a measurement operation on the second signal of the serving cell, determining whether a measurement result of the second signal meets a second threshold, and based on a determination that the measurement result of the second signal of the serving cell meets the second threshold, skipping a measurement operation on a signal of a neighboring cell.
Inventor(s): Jungshin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongeun SUH of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04L43/04
CPC Code(s): H04W28/0215
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method and device for controlling a wireless communication system to detect information about an application in use by analyzing data from a user terminal. a method performed by an nwdaf includes receiving, from an nef, a first message including a terminal id to request analysis information on a validity of pfd information; transmitting, to the nef, a second message as a response to the first message; transmitting, to the nef, a third message including the terminal id to request the pfd information; and receiving, from the nef, a fourth message including the terminal id and pdr information as a response to the third message.
Inventor(s): Dongeun SUH of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02
CPC Code(s): H04W28/0226
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of notifying associated network entities of a change when an existing slice of pdu sessions is replaced with an alternative slice.
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W28/04, H04W28/06
CPC Code(s): H04W28/0242
Abstract: the disclosure relates to a pre-5th generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th generation (4g) communication system such as long term evolution (lte). a communication method, apparatus, electronic device, and computer-readable storage medium, and relate to the field of wireless communication technology are provided. the method may be executed by the first node, and may include receiving a first message transmitted by a second node, wherein the first message is used by the first node to configure transmission and/or storage of a user data packet. based on the solution provided by the embodiments of the disclosure, it may effectively improve one or more of the following problems: data packet loss, network resource waste, transmission failure and the like that may be caused by the migration of relay nodes in the network.
Inventor(s): June HWANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W76/30
CPC Code(s): H04W36/00837
Abstract: the disclosure relates to fifth generation (5g) or sixth generation (6g) communication systems capable of supporting higher data rates and discloses a method and apparatus that enable the mobile termination (mt) of a network controlled repeater (ncr) to perform repeater control in an idle/inactive situation. the method includes performing, by a forward (fwd) of the ncr node (ncr-fwd), signal forwarding between a terminal and a base station based on first control information received from the base station, receiving, by a mobile termination (mt) of the ncr node (ncr-mt) from the base station, a radio resource control (rrc) release message, performing, by the ncr-mt, cell reselection in an rrc inactive state based on the rrc release message including information on a suspend configuration, and indicating, by the ncr-mt, to the ncr-fwd, to cease the signal forwarding, in case that the ncr-mt reselects a cell other than a last serving cell of the base station.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W24/02, H04W36/00
CPC Code(s): H04W36/08
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides a method and apparatus for updating a configuration of a conditional pscell change.
Inventor(s): Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W36/28, H04W36/00, H04W36/08
CPC Code(s): H04W36/28
Abstract: an access point (ap) device comprises a communication interface; and a processor operably coupled to the communication interface. the processor configured to cause establishing a logical ap mld, wherein a plurality of aps including an ap affiliated with a first physical ap mld and an ap affiliated with a second physical ap mld are affiliated with the logical ap mld.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04W36/36
CPC Code(s): H04W36/30
Abstract: methods and apparatuses for a cell reselection evaluation based on a low-reception-power signal in a wireless communication system. a method of a ue comprises: receiving first configuration information including an identification (id) of at least one cell capable of using low-power (lp) signals and second configuration information including a set of threshold parameters for a cell reselection operation using the lp signals; performing, based on the first configuration information, a measurement operation on the lp signals; and performing, based on the set of threshold parameters and a measurement result of the measurement operation, the cell reselection operation.
Inventor(s): Sangyeob JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/32, H04W36/00
CPC Code(s): H04W36/328
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. the disclosure relates to a method performed by an unscrewed aerial vehicle (uav) terminal in a wireless communication system, including receiving first system information, camping on a first cell supporting a uav based on the first system information, in case that an altitude of the uav terminal is greater than an altitude threshold, receiving, from the first cell, second system information including cell reselection information, determining a cell reselection priority based on a frequency identical to a first frequency of the first cell and the cell reselection information included in the second system information, and performing a measurement based on the cell reselection priority.
Inventor(s): Eric YIP of Suwon-si (KR) for samsung electronics co., ltd., Hyunkoo YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/04, H04L65/65, H04W8/22
CPC Code(s): H04W48/04
Abstract: a method and device for efficiently providing an artificial intelligence/machine learning (ai/ml) media service using ai/ml model split processing in a wireless communication system is provided. the method and device are related to a 5generation (5g) or 6generation (6g) communication system for supporting a higher data transmission rate. the method includes receiving, from a network server providing the ai/ml media service, service access information including at least one of information for media session handling and information for media streaming access, obtaining information on client ai media inferencing capabilities and functions, negotiating with the network server for splitting an ai media inference processing, based on the received service access information and the obtained information on client ai media inferencing capabilities and functions, and receiving, from the network server, either intermediate data or inference output data by ai model split inferencing.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Chadi KHIRALLAH of Staines (GB) for samsung electronics co., ltd., Erik GUTTMAN of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W48/08
CPC Code(s): H04W48/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method and apparatus of a termina. the terminal, in case that a cell is barred to the terminal, receives, from a base station, a message comprising information indicating the cell is barred, wherein the cell is barred to the terminal based on energy information and wherein the terminal is capable of supporting an energy saving operation.
Inventor(s): Nishant of Bangalore (IN) for samsung electronics co., ltd., Amit Anandrao DANGE of Bangalore (IN) for samsung electronics co., ltd., Vivek MURUGAIAN of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Mohammad UMAIR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/20, H04W64/00, H04W84/06
CPC Code(s): H04W48/20
Abstract: a method for cell measurement by a user equipment (ue) in a non-terrestrial network (ntn) communication system is provided. the method includes camping to an ntn cell; receiving at least one parameter from the camped ntn cell; determining a rate of change (roc) of signal strength of the camped ntn cell; determining whether a neighbor cell measurement criterion is met based on the at least one parameter and the roc of the signal strength of the camped ntn cell; and initiating measurement for at least one neighbor cell based on the neighbor cell measurement criterion being met.
Inventor(s): Byounghoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W4/90, H04W68/00
CPC Code(s): H04W52/0229
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to the disclosure, even in case of operating in a network energy saving (nes) mode, when an emergency event occurs, a base station can efficiently transmit an emergency signal to a terminal.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W76/27, H04W76/28
CPC Code(s): H04W52/0235
Abstract: methods and apparatuses for a ue mode switching operation for power saving in a wireless communication system. a method of a ue comprises: receiving, from a bs, configuration information related to mode switching events including a first mode switching event and a second mode switching event; when the first mode switching event occurs, switching an operation mode to a power saving mode from a normal mode by deactivating a mr operation and monitoring a lp-wus; and when the second mode switching event occurs, switching the operation mode to the normal mode from the power saving mode by activating the mr operation.
Inventor(s): Abhishek Sehgal of Frisco TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/24, H04W16/14
CPC Code(s): H04W52/243
Abstract: methods and apparatuses for overlapping basic service set (obss) preamble detection (pd) threshold adaptation. a method of wireless communication performed by a station (sta) comprises: determining whether the sta changed an overlapping basic service set (obss) packet detection (pd) threshold for spatial reuse (sr); obtaining, based on determining that the sta changed the obss pd threshold for sr, feedback information for performance indicators associated with the sta; and updating the obss pd threshold for sr based on the feedback information.
20240276397. SL POSITIONING POWER CONTROL_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/32, H04W52/06, H04W52/24
CPC Code(s): H04W52/325
Abstract: methods and apparatuses for sidelink (sl) positioning power control in a wireless communication system. a method of operating a user equipment (ue) includes determining a power for a sl positioning reference signal (prs) in a transmission occasion i based on p(i)=min (p, p, min (p(i), p(i))). pis a configured maximum output power of the ue. pis related to a priority level of the sl prs and a channel busy ratio (cbr) range for a cbr measured in slot i−n, where n is a congestion control processing time. p(i) is a component for downlink (dl) pathloss based power control for the sl prs. p(i) is a component for sl pathloss based power control for the sl prs. the method further includes transmitting the sl prs in the transmission occasion i with the power p(i).
Inventor(s): Nayoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Minchull Paik of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/40, H04B1/3827, H04W52/30, H04W88/06
CPC Code(s): H04W52/40
Abstract: an electronic device includes a modem supporting a first sim for using a service of a 5g network of a first telecommunications operator and a second sim for using a service of a 5g network of a second telecommunications operator, at least one first antenna, and at least one second antenna. the modem may transmit a first signal to a first base station of the first telecommunications operator through the first sim with a first transmission power by using the at least one first antenna, and while the first signal is transmitted with the first transmission power, transmit a second signal to a second base station of the second telecommunications operator through the second sim with a second transmission power by using the at least one second antenna, such that a sum of the first and second transmission powers is less than or equal to a predetermined maximum power.
Inventor(s): Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04M15/00, H04W28/02, H04W76/20
CPC Code(s): H04W56/0015
Abstract: the present disclosure relates to a communication technique for fusing, with an iot technology, a 5g communication system for supporting a higher data transmission rate than a 4g system, and a system therefor. the present disclosure may be applied to intelligent services, such as smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail, security and safety related services, on the basis of 5g communication technologies and iot-related technologies. disclosed in the present invention is a method for providing time synchronization between wireless terminals to which a 5g system (5gs) is connected or is to be connected, by extending a function of supporting a time sensitive network (tsn) with a 3gpp 5gs.
Inventor(s): Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd., Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00
CPC Code(s): H04W64/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by an location management function (lmf) entity in a wireless communication system, the method comprising: identifying a validity area associated with requested sounding reference signal (srs) configuration information for a user equipment (ue), transmitting, to a first base station, a first message including information on the validity area, and receiving, from the first base station, a second message including srs configuration information associated with the validity area.
Inventor(s): Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Shiyang Leng of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W52/02
CPC Code(s): H04W68/02
Abstract: methods and apparatuses for a paging reception with low power signals in a wireless communication system. a method of a ue comprises: receiving, from a base station (bs), system information (si); identifying, based on the si, time occasions to monitor a low power-wake-up signal (lp-wus) from a plurality of lp-wuss; monitoring, based on the time occasions, the lp-wus associated with a serving cell; determining whether the lp-wus is detected in the time occasions; and monitoring, based on the determination that the lp-wus is detected, at least one of a paging early indicator (pei) and a paging message.
Inventor(s): Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/02, H04W4/40, H04W72/0446, H04W72/0453, H04W76/11, H04W80/02, H04W92/12
CPC Code(s): H04W72/02
Abstract: disclosed are a communication technique for merging, with iot technology, a 5g communication system for supporting a data transmission rate higher than that of a 4g system; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail, security, and safety-related services, and the like) based on 5g communication technology and iot-related technology. an apparatus and a method performed by a first terminal in a sidelink communication system are provided. the method includes establishing a packet data convergence protocol (pdcp) entity for a radio bearer based on a first sidelink pdcp protocol data unit (pdu); and setting state variables of the pdcp entity to an initial value based on the first sidelink pdcp pdu, wherein the state variables include an rx_next indicating a next pdcp pdu and an rx_deliv indicating a pdcp pdu not delivered to an upper layer, wherein the initial value of a sequence number of the rx_next is set based on a sequence number of the first sidelink pdcp pdu for sidelink communication, and wherein the initial value of a sequence number of the rx_deliv is set based on the sequence number of the first sidelink pdcp pdu for the sidelink communication.
20240276491. PDSCH RECEPTION WITH TRP SWITCHING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04W72/232
CPC Code(s): H04W72/1273
Abstract: methods and apparatuses for physical downlink shared channel (pdsch) reception with transmission and reception point (trp) switching. a method performed by a user equipment (ue) includes receiving a threshold to indicate a transmission configuration indication (tci) state selection time and receiving downlink control information (dci) that schedules a first pdsch with a scheduling offset less than or equal to the threshold. the method further includes identifying a value of a frequency range index and determining, based on the value of the frequency range index and a capability, to receive the first pdsch with a first tci state or a second tci state. the first and second tci states are joint or downlink (dl) tci states.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/542, H04L1/1812, H04L5/00, H04W52/24, H04W72/1273
CPC Code(s): H04W72/542
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure discloses a user equipment (ue) and a base station in a wireless communication system and methods performed the user equipment and the base station. a method performed by a user equipment in a wireless communication system may comprise: receiving a first mapping relationship, wherein the first mapping relationship comprises a mapping relationship between first information and a channel quality indicator (cqi) table for identifying a cqi, and the first information is information related to a power control offset (powercontroloffset); receiving first indication information; identifying a cqi table according to the first indication information and the first mapping relationship; and identifying a cqi according to the identified cqi table.
Inventor(s): Seunghyun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Juho LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungsoo JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunghyun CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/00, H04W56/00
CPC Code(s): H04W74/006
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates than 4g systems such as lte. more specifically, disclosed are a method and device pertaining to generating and detecting a random access preamble signal for random access in ultra-high frequency band wireless communication. a terminal according to an embodiment disclosed herein comprises a transmission and reception unit and a control unit, wherein the control unit is configured to: generate a preamble signal; transmit the preamble signal to a base station; and receive a random access response including timing advance (ta) information from the base station in response to the transmission of the preamble signal, wherein the preamble signal may include a first signal portion related to a first sequence, and a second signal portion related to a guard time and a second sequence.
Inventor(s): Lisi LI of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Xiaoning MA of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/10, H04W28/02
CPC Code(s): H04W76/10
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present application relates to methods and devices for session establishments. according to an aspect of the present application, there is disclosed a method performed by a second node in a wireless communication system, which includes: receiving a message for bearer establishment request from a first node; transmitting a message for bearer establishment response to the first node.
Inventor(s): Kihyun SONG of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Jehwan SEO of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Minsup KIM of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Sukhoon YOON of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Jongkeun LEE of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd., Chaeyoung LIM of Suwon-si Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/14, H04Q9/04, H04W4/80, H04W8/00, H04W48/16
CPC Code(s): H04W76/14
Abstract: an example electronic device includes a first communication unit, a second communication unit, and a processor for performing control such that the second communication unit operates in a scan state in which an undirected advertising packet can be received when a preset ir signal is received from a remote control device through the first communication unit, acquiring identification information of a target device from the undirected advertising packet when the undirected advertising packet is received from the remote control device in the scan state, and providing a user interface (ui) for guiding a bluetooth connection with remote control device when the acquired identification information of a target device matches identification information of the electronic device.
Inventor(s): Koustav ROY of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Arijit SEN of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04W80/10
CPC Code(s): H04W76/20
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose a wireless network and methods to maintain a ma pdu session at a nsacf entity. the method includes determining, by a smf entity, that a pdu session is the ma pdu session based on an indication from a ue. further, the method includes indicating, by the smf entity, that the pdu session is the ma pdu session to the nsacf entity in response to determination. the wireless network may maintain the count accurately even though the pdu session is a ma pdu session.
20240276608. INDUCTION-HEATING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taro YOSHIDA of Kanagawa (JP) for samsung electronics co., ltd., Nobuharu NISHIKOORI of Kanagawa (JP) for samsung electronics co., ltd., Yutaka YAGI of Kanagawa (JP) for samsung electronics co., ltd.
IPC Code(s): H05B6/06, H05B1/02, H05B6/44
CPC Code(s): H05B6/065
Abstract: an induction-heating apparatus includes at least two heating coils configured to heat an object to be heated by induction heating, at least two inverter devices connected to the at least two heating coils, respectively, and configured to supply power to the at least two heating coils, respectively, and a controller configured to control the at least two inverter devices. the controller compares driving frequencies, which are frequencies of the power supplied to the at least two heating coils, with each other, and change a driving frequency of a high-frequency coil having a higher driving frequency to a driving frequency of a low-frequency coil having a lower driving frequency. the controller controls an inverter device corresponding to the low-frequency coil in a first control state, and control an inverter device corresponding to the high-frequency coil in a second control state, which is different from the first control state.
Inventor(s): Jinseo Choi of Suwon-si (KR) for samsung electronics co., ltd., Sohyang Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin Jin of Suwon-si (KR) for samsung electronics co., ltd., Sohee Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/0335
Abstract: a semiconductor device includes a substrate having an active region; a gate structure in the substrate, crossing the active region, and extending in a first horizontal direction; bit line structures crossing the gate structure and extending in a second horizontal direction, intersecting the first horizontal direction; a contact plug between the bit line structures; a landing pad structure on the contact plug and including a lower landing pad and an upper landing pad on the lower landing pad, wherein the lower landing pad includes a barrier layer and a metal layer on the barrier layer; and an insulating pattern on the lower landing pad and contacting a side surface of the upper landing pad. the upper landing pad is integrally coupled to the metal layer. a side surface of the insulating pattern includes a concave curved surface toward an adjacent bit line structure among the bit line structures.
20240276703. SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonsok Lee of Suwon-si (KR) for samsung electronics co., ltd., Juho Lee of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Wooje Jung of Suwon-si (KR) for samsung electronics co., ltd., Minhee Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device, which may include a substrate, a lower conductive line on the substrate, an isolation insulating layer on the lower conductive line and including a channel trench, a channel structure inside the channel trench and including a first oxide semiconductor material, an interfacial conductive pattern between the lower conductive line and a lower surface of the channel structure, a gate dielectric layer that covers the channel structure within the channel trench, an upper conductive line on the gate dielectric layer within the channel trench, a conductive contact pattern on the channel structure, an interfacial oxide semiconductor pattern between the channel structure and the conductive contact pattern and including a second oxide semiconductor material, and a capacitor structure including a lower electrode connected to the conductive contact pattern.
Inventor(s): Sinyeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jooseong Yun of Suwon-si (KR) for samsung electronics co., ltd., Jieun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hana Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/06, H01L29/423
CPC Code(s): H10B12/34
Abstract: a semiconductor device includes an active region, an isolation region on a side surface of the active region, a gate trench having a first trench portion crossing the active region and a second trench portion in the isolation region, a first gate portion within the first trench portion and a second gate portion within the second trench portion. the first gate portion and the second gate portion each includes a gate dielectric layer, a gate electrode on the gate dielectric layer, partially filling the gate trench, and having an upper surface disposed on a level lower than an upper end of the active region, and an insulative capping pattern on the gate electrode. the first gate portion includes a lower region, an intermediate region on the lower region, and an upper region on the intermediate region. a maximum width of the intermediate region is greater than a maximum width of the lower region and greater than a maximum width of the upper region.
Inventor(s): Sanghoon UHM of Suwon-si (KR) for samsung electronics co., ltd., Min Hee CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes: a substrate; a bit line above the substrate; a channel pattern on the bit line extending in a direction perpendicular to an upper surface of the bit line; a word line intersecting the bit line and spaced apart from the channel pattern; a gate insulating pattern between the channel pattern and the word line; an insulating pattern on the word line; and a landing pad connected to the channel pattern. the channel pattern includes first, second, and third channel patterns that are sequentially stacked, the first channel pattern is connected to the bit line, the second channel pattern is between the first channel pattern and the third channel pattern, the third channel pattern is connected to the landing pad, the first channel pattern and the third channel pattern include a crystalline oxide semiconductor material, and the second channel pattern includes an amorphous oxide semiconductor material.
20240276711. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yurim Kim of Suwon-si (KR) for samsung electronics co., ltd., Seunghee Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo Jang of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Tak of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: the semiconductor device may include a bit line on a substrate, a gate electrode on the bit line, a gate insulation pattern on a sidewall of the gate electrode, a first channel contacting an upper surface of the bit line and the sidewall of the gate insulation pattern and a contact plug contacting an upper surface of the first channel. the first channel may include a spinel igzo.
Inventor(s): Hongjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Keunnam KIM of Suwon-si (KR) for samsung electronics co., ltd., Kiseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/78
CPC Code(s): H10B12/482
Abstract: a semiconductor device may include a substrate, a bit line structure, first and second gate electrodes spaced apart from each other, and first and second gate dielectric layers. the substrate may include a first upper active region and a second upper active region spaced apart from each other and protruding upwardly from a lower active region, a first vertical active pillar protruding upwardly from the first upper active region, and a second vertical active pillar protruding upwardly from the second upper active region. the bit line structure may be between the first and second upper active regions. the first and second gate electrodes respectively may surround channel regions of the first and second vertical active pillars. first and second gate dielectric layers respectively may be between the first vertical active pillar and the first gate electrode and between the second vertical active pillar and the second gate electrode.
20240276713. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeonil Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Juho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/423, H01L29/788
CPC Code(s): H10B12/485
Abstract: a semiconductor memory device includes a memory cell that extends in a first horizontal direction, a second horizontal direction that intersects the first horizontal direction, and a vertical direction. the memory cell includes a first transistor including a first channel structure, a second transistor including a second channel structure, a charge storage element electrically connected to a first end of the second channel structure and adjacent to the first channel structure a first bit line electrically connected to a first end of the first channel structure and that extends in the second horizontal direction, a selection line electrically connected to a second end of the first channel structure and that extends in the second horizontal direction, a second bit line electrically connected to a second end of the second channel structure and that extends in the second horizontal direction, and a gate line that extends in the vertical direction.
20240276719. VERTICAL MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Heesuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Inhwan BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jongseon AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/35, H10B43/40
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes: a lower circuit pattern disposed on a substrate; a common source plate (csp) disposed on the lower circuit pattern; a channel connection pattern disposed on the csp; a sacrificial layer structure disposed on the csp and spaced apart from the channel connection pattern; a support layer disposed on the channel connection pattern and the sacrificial layer structure; first and second gate electrode structures including gate electrodes stacked on the support layer and spaced apart from each other; a first channel disposed on the csp, wherein the first channel extends through the first gate electrode structure, the support layer and the channel connection pattern; and a contact plug extending through the second gate electrode structure, the support layer, the sacrificial layer structure and the csp, wherein the contact plug is electrically connected to the lower circuit pattern.
20240276720. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kohji KANAMORI of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L29/423, H10B41/10, H10B41/27, H10B43/10
CPC Code(s): H10B43/27
Abstract: a semiconductor memory device includes structures including insulation layers and semiconductor layers alternately stacked in a vertical direction, the structures being spaced apart from one another in a horizontal direction; an interlayer insulation layer between the structures; gate electrodes respectively in gate trenches passing through the interlayer insulation layer in the vertical direction, between the structures, the gate electrodes connected to the semiconductor layers; and vertical insulation layers respectively on sidewalls of the gate trenches, wherein each gate electrode includes first portions overlapping the insulation layers in the horizontal direction and second portions overlapping the semiconductor layers in the horizontal direction, and a first width of each first portion in the horizontal direction is greater than a second width of each second portion in the horizontal direction.
Inventor(s): SUNGBOK LEE of SUWON-SI (KR) for samsung electronics co., ltd., JUNHEE LIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L29/423, H10B41/10, H10B41/27, H10B43/10
CPC Code(s): H10B43/27
Abstract: a vertical memory device includes a memory channel structure disposed on a substrate, a plurality of division layers disposed on the substrate and a gate electrode structure. the memory channel structure extends in a vertical direction substantially perpendicular to an upper surface of the substrate. the division layers contact the memory channel structure, respectively. the gate electrode structure contacts a sidewall of the memory channel structure, which may include a filling pattern, a channel disposed on a sidewall of the filling pattern and a charge storage structure disposed on an outer sidewall of the channel and sidewalls of the division layers, each of which extends through a portion of the charge storage structure and a portion of the channel. each of the charge storage structure and the channel is divided into two parts by the division layers.
Inventor(s): CHANGMIN CHOI of SUWON-SI (KR) for samsung electronics co., ltd., HYUNMIN KIM of SUWON-SI (KR) for samsung electronics co., ltd., JUNTAEK PARK of SUWON-SI (KR) for samsung electronics co., ltd., DONGJIN LEE of SUWON-SI (KR) for samsung electronics co., ltd., RYOONGBIN LEE of SUWON-SI (KR) for samsung electronics co., ltd., JUNHEE LIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B43/27
CPC Code(s): H10B43/40
Abstract: a semiconductor device includes a first substrate, a transistor disposed on the first substrate, and a first interconnection layer connected to the transistor. the first interconnection layer includes a first conductive line, a second conductive line, and a third conductive line, which are spaced apart from each other in a first direction parallel to a top surface of the first substrate. the second conductive line is disposed between the first conductive line and the third conductive line. a top surface of the second conductive line is located at a height higher than top surfaces of the first and third conductive lines with respect to the top surface of the first substrate.
20240276733. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyuncheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Kiheun LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/30, H10B51/20
CPC Code(s): H10B51/30
Abstract: a semiconductor memory device includes a substrate, a semiconductor pattern on the substrate and including a source region having a first conductivity type, a drain region having a second conductivity type, and an intrinsic region between the source region and the drain region, first and second gate electrodes on the intrinsic region, a ferroelectric pattern between the intrinsic region and the first and second gate electrodes, and a gate dielectric pattern between the ferroelectric pattern and the intrinsic region.
Inventor(s): Dong-Seok LEEM of Suwon-si (KR) for samsung electronics co., ltd., Insun PARK of Suwon-si (KR) for samsung electronics co., ltd., Rae Sung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangdong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Ho PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K30/85, H10K30/87, H10K39/32, H10K85/20, H10K85/30, H10K85/60, H10K101/30
CPC Code(s): H10K30/85
Abstract: an infrared photodiode includes an anode, a cathode, a photoelectric conversion layer between the anode and the cathode and including an infrared absorbing material, and a first auxiliary layer between the anode and the photoelectric conversion layer and a second auxiliary layer between the cathode and the photoelectric conversion layer. the first auxiliary layer and the second auxiliary layer each independently include an electron transport material that is configured to facilitate electron introduction, and/or facility electron transport, and/or inhibit hole movement. a sensor may include the infrared photodiode. an electronic device may include the infrared photodiode.
Inventor(s): Jong Soo KIM of Suwon-si (KR) for samsung electronics co., ltd., Giwook KANG of Yongin-si (KR) for samsung electronics co., ltd., Eunsuk KWON of Suwon-si (KR) for samsung electronics co., ltd., Eunhye AN of Yongin-si (KR) for samsung electronics co., ltd., Dongjin JANG of Yongin-si (KR) for samsung electronics co., ltd., Yeon Sook CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Eunjeong CHOI of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D209/86, C07D403/14, C07F7/08, C09K11/06, H10K50/12, H10K85/40, H10K101/00
CPC Code(s): H10K85/6572
Abstract: a composition includes a first compound represented by formula 1 and a second compound including an azine group including at least one nitrogen, a light-emitting device including the composition, and an electronic apparatus including the light-emitting device:
Inventor(s): Jong Soo KIM of Suwon-si (KR) for samsung electronics co., ltd., Giwook KANG of Yongin-si (KR) for samsung electronics co., ltd., Eunsuk KWON of Suwon-si (KR) for samsung electronics co., ltd., Eunhye AN of Yongin-si (KR) for samsung electronics co., ltd., Dongjin JANG of Yongin-si (KR) for samsung electronics co., ltd., Yeon Sook CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Eunjeong CHOI of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D209/86, C07D403/14, C07F7/08, C09K11/06, H10K50/12, H10K85/40, H10K101/00
CPC Code(s): H10K85/6572
Abstract:
Inventor(s): Jong Soo KIM of Suwon-si (KR) for samsung electronics co., ltd., Giwook KANG of Yongin-si (KR) for samsung electronics co., ltd., Eunsuk KWON of Suwon-si (KR) for samsung electronics co., ltd., Eunhye AN of Yongin-si (KR) for samsung electronics co., ltd., Dongjin JANG of Yongin-si (KR) for samsung electronics co., ltd., Yeon Sook CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Eunjeong CHOI of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D209/86, C07D403/14, C07F7/08, C09K11/06, H10K50/12, H10K85/40, H10K101/00
CPC Code(s): H10K85/6572
Abstract: wherein the detailed description of formula 1 is provided herein.
Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd.
- A44B11/10
- CPC A44B11/10
- Samsung electronics co., ltd.
- A47L9/28
- A46B13/00
- A46B13/02
- A47L9/04
- CPC A47L9/2889
- A61B5/113
- A61B5/00
- A61B5/08
- G06V40/16
- CPC A61B5/113
- A61B5/1455
- G16H40/67
- G16H50/20
- CPC A61B5/14551
- A61B5/145
- CPC A61B5/4818
- A63B24/00
- A63B23/18
- A63B71/06
- CPC A63B24/0075
- B24B37/20
- CPC B24B37/20
- B25J15/00
- B25J9/16
- CPC B25J15/0028
- B60W60/00
- B60W40/09
- B60W50/04
- B60W50/10
- CPC B60W60/001
- C02F3/34
- C02F101/38
- C02F103/04
- CPC C02F3/342
- C23C16/455
- H01L21/31
- CPC C23C16/45591
- D06F34/18
- D06F34/06
- D06F34/26
- D06F34/30
- D06F34/32
- D06F58/08
- D06F58/26
- D06F58/40
- D06F103/04
- D06F103/08
- D06F103/32
- CPC D06F34/18
- D06F33/34
- D06F33/36
- D06F33/38
- D06F33/46
- D06F34/04
- D06F101/20
- D06F103/18
- D06F105/02
- D06F105/46
- D06F105/58
- CPC D06F34/32
- D06F58/36
- D06F105/26
- D06F105/56
- CPC D06F58/36
- D06F58/24
- D06F103/46
- D06F103/58
- D06F105/30
- F24F8/167
- B01D39/20
- B01J21/06
- B01J23/42
- B01J29/40
- B01J35/00
- B01J35/02
- F24F8/108
- CPC F24F8/167
- G01C21/00
- G06T7/246
- G06T7/73
- G06T17/05
- G06V10/46
- G06V20/10
- CPC G01C21/3848
- G01N21/956
- G01N21/25
- G01N21/55
- G01N21/88
- CPC G01N21/956
- G01R33/032
- CPC G01R33/0325
- G02F1/1335
- G02F1/13357
- H05K1/18
- CPC G02F1/133612
- G03B13/36
- G03B5/00
- H01F7/06
- H01F7/08
- CPC G03B13/36
- G03F1/70
- CPC G03F1/70
- G03F7/00
- H01L21/66
- CPC G03F7/70591
- G06T7/00
- CPC G03F7/706839
- G05B15/02
- H04N21/442
- CPC G05B15/02
- G06F1/26
- CPC G06F1/263
- G06F1/28
- CPC G06F1/28
- G06F3/041
- G06F3/044
- G06F3/0488
- CPC G06F3/0418
- G06F3/06
- CPC G06F3/0607
- G11C11/56
- G11C16/04
- G11C16/26
- CPC G06F3/0619
- CPC G06F3/0631
- CPC G06F3/0632
- CPC G06F3/0659
- G06N20/00
- G06F3/16
- G06F3/0482
- H04R29/00
- CPC G06F3/162
- G06F11/07
- G06F9/38
- G06F9/4401
- CPC G06F11/073
- G06F11/20
- G06F13/40
- CPC G06F11/2002
- G06F11/263
- G06F11/22
- CPC G06F11/263
- G06F12/02
- CPC G06F12/0223
- G06F13/42
- CPC G06F13/4282
- G06F16/18
- G06F16/16
- CPC G06F16/1805
- G06F21/32
- G06V40/12
- G06V40/18
- CPC G06F21/32
- G06F21/57
- G06F13/28
- CPC G06F21/575
- G06F21/60
- G06F7/487
- G06F17/15
- CPC G06F21/602
- G06N3/092
- G06N3/096
- CPC G06N3/092
- G06Q10/1093
- CPC G06Q10/1093
- G06T7/30
- G06T3/00
- G06T3/40
- G06T5/00
- G06T7/20
- G06T7/50
- G06V10/75
- CPC G06T7/30
- G06T11/00
- G06F3/0346
- H04L43/0864
- H04L65/70
- H04N7/035
- CPC G06T11/00
- G06V10/80
- G06V10/40
- G06V10/764
- G06V10/77
- G06V10/82
- CPC G06V10/806
- G06V20/40
- G06V10/60
- CPC G06V20/44
- G06T7/70
- G06V10/74
- CPC G06V20/48
- G06V20/70
- CPC G06V20/70
- G09F9/30
- G06F1/16
- CPC G09F9/301
- G09G3/00
- H01L27/12
- CPC G09G3/006
- G09G3/20
- G06T5/90
- G06V10/774
- CPC G09G3/20
- G09G3/32
- CPC G09G3/32
- G10L15/20
- G10L15/08
- G10L15/22
- CPC G10L15/20
- G06F3/02
- G06F3/04886
- G10L15/30
- CPC G10L15/22
- G11B27/10
- CPC G11B27/10
- G11C7/22
- H01L25/065
- H01L25/10
- H01L25/18
- CPC G11C7/22
- G11C7/10
- G11C7/14
- CPC G11C7/222
- G11C16/12
- G11C16/28
- G11C16/30
- CPC G11C16/12
- G11C16/34
- G11C16/08
- CPC G11C16/3431
- G11C29/12
- G11C7/04
- G11C29/02
- CPC G11C29/12005
- H01J37/32
- H01J37/34
- CPC H01J37/32926
- CPC H01J37/32972
- H01L21/67
- G05B13/02
- CPC H01L21/67288
- CPC H01L22/34
- H01L23/373
- H01L23/00
- H01L23/367
- H01L23/498
- CPC H01L23/3735
- H01L23/48
- H01L21/762
- H01L21/768
- H01L29/06
- CPC H01L23/481
- H01L27/02
- H01L27/088
- H01L23/535
- H01L23/522
- H01L27/092
- H01L29/417
- H01L29/423
- H01L29/78
- H01L29/786
- CPC H01L23/535
- H01L21/48
- H01L23/544
- CPC H01L24/02
- CPC H01L24/05
- H01L23/31
- CPC H01L25/0652
- H01L23/538
- H10B80/00
- CPC H01L25/0657
- H01L21/56
- CPC H01L25/18
- H01L23/13
- H01L23/58
- H01L27/118
- CPC H01L27/0207
- H01L27/06
- H01L21/306
- H01L29/732
- CPC H01L27/0623
- H01L27/146
- G02B3/00
- G02B5/18
- H04N25/70
- CPC H01L27/14621
- H04N25/63
- CPC H01L27/14623
- CPC H01L27/14627
- CPC H01L27/1463
- H01G4/12
- H10B12/00
- CPC H01L28/40
- CPC H01L29/0657
- H01L29/08
- CPC H01L29/0847
- H01L29/45
- H01L29/66
- H01L29/775
- H01L21/8234
- CPC H01L29/41733
- CPC H01L29/42392
- H01L29/47
- H01L27/095
- H01L29/20
- H01L29/778
- CPC H01L29/475
- H01L21/28
- H01L29/51
- CPC H01L29/78391
- H01L33/38
- H01L25/16
- H01L33/42
- CPC H01L33/38
- H01L33/50
- H01L33/46
- CPC H01L33/502
- H01L25/075
- H01L33/32
- CPC H01L33/505
- H01L33/62
- CPC H01L33/62
- H01M10/42
- H01M50/105
- H01M50/184
- CPC H01M10/4257
- H01Q1/22
- CPC H01Q1/22
- H01Q1/24
- H01Q15/14
- CPC H01Q1/2283
- H02N2/02
- G02B27/64
- H04N23/50
- CPC H02N2/025
- H03K19/08
- CPC H03K19/08
- H03L7/091
- H03L7/081
- CPC H03L7/091
- H04B1/525
- CPC H04B1/525
- H04B7/0456
- H04B7/06
- CPC H04B7/0456
- CPC H04B7/0626
- H04L5/00
- CPC H04B7/06968
- H04J11/00
- H04W72/23
- CPC H04J11/0073
- H04L1/1812
- H04L1/1607
- CPC H04L1/1812
- H04W72/231
- H04W72/563
- H04W88/06
- CPC H04L5/0035
- H04W64/00
- CPC H04L5/0051
- H04W72/044
- CPC H04L5/0055
- H04L9/08
- G06F21/62
- CPC H04L9/088
- H04L12/28
- G01S13/02
- G06F1/3206
- CPC H04L12/2818
- H04L25/02
- CPC H04L25/0204
- H04L41/0803
- G16Y10/75
- G16Y40/35
- CPC H04L41/0803
- H04L65/80
- H04L65/1104
- H04L65/60
- CPC H04L65/80
- H04N5/265
- CPC H04N5/265
- H04N9/73
- G06T5/92
- H04N9/64
- H04N9/68
- CPC H04N9/73
- H04N19/105
- H04N19/132
- H04N19/159
- H04N19/176
- H04N19/46
- H04N19/82
- CPC H04N19/105
- H04N19/52
- H04N19/44
- CPC H04N19/52
- H04N19/577
- H04N19/139
- H04N19/172
- H04N19/573
- CPC H04N19/577
- H04N23/61
- G06K19/06
- H04N23/60
- CPC H04N23/61
- H04N25/47
- H04N25/69
- H04N25/78
- CPC H04N25/47
- H04N25/53
- G01S7/4863
- G01S17/894
- H04N23/56
- H04N25/771
- CPC H04N25/53
- H04R3/00
- G06N3/0464
- CPC H04R3/00
- H04R1/10
- CPC H04R29/001
- H04W8/20
- H04L43/0882
- H04W8/18
- CPC H04W8/20
- H04W8/24
- H04W76/38
- CPC H04W8/24
- H04W24/02
- H04L41/16
- CPC H04W24/02
- H04L41/5009
- H04W12/08
- H04W24/10
- H04W72/1268
- H04W72/232
- CPC H04W24/10
- H04W52/02
- Samsung electronics co., ltd.s
- H04W28/02
- H04L43/04
- CPC H04W28/0215
- CPC H04W28/0226
- H04W28/04
- H04W28/06
- CPC H04W28/0242
- H04W36/00
- H04W76/30
- CPC H04W36/00837
- H04W36/08
- CPC H04W36/08
- H04W36/28
- CPC H04W36/28
- H04W36/30
- H04W36/36
- CPC H04W36/30
- H04W36/32
- CPC H04W36/328
- H04W48/04
- H04L65/65
- H04W8/22
- CPC H04W48/04
- H04W48/08
- CPC H04W48/08
- H04W48/20
- H04W84/06
- CPC H04W48/20
- H04W4/90
- H04W68/00
- CPC H04W52/0229
- H04W76/27
- H04W76/28
- CPC H04W52/0235
- H04W52/24
- H04W16/14
- CPC H04W52/243
- H04W52/32
- H04W52/06
- CPC H04W52/325
- H04W52/40
- H04B1/3827
- H04W52/30
- CPC H04W52/40
- H04W56/00
- H04M15/00
- H04W76/20
- CPC H04W56/0015
- CPC H04W64/00
- H04W68/02
- CPC H04W68/02
- H04W72/02
- H04W4/40
- H04W72/0446
- H04W72/0453
- H04W76/11
- H04W80/02
- H04W92/12
- CPC H04W72/02
- H04W72/1273
- CPC H04W72/1273
- H04W72/542
- CPC H04W72/542
- H04W74/00
- CPC H04W74/006
- H04W76/10
- CPC H04W76/10
- H04W76/14
- H04Q9/04
- H04W4/80
- H04W8/00
- H04W48/16
- CPC H04W76/14
- H04W80/10
- CPC H04W76/20
- H05B6/06
- H05B1/02
- H05B6/44
- CPC H05B6/065
- CPC H10B12/0335
- CPC H10B12/315
- CPC H10B12/34
- CPC H10B12/482
- H01L29/788
- CPC H10B12/485
- H10B43/27
- H10B43/35
- H10B43/40
- CPC H10B43/27
- H10B41/10
- H10B41/27
- H10B43/10
- CPC H10B43/40
- H10B51/30
- H10B51/20
- CPC H10B51/30
- H10K30/85
- H10K30/87
- H10K39/32
- H10K85/20
- H10K85/30
- H10K85/60
- H10K101/30
- CPC H10K30/85
- C07D209/86
- C07D403/14
- C07F7/08
- C09K11/06
- H10K50/12
- H10K85/40
- H10K101/00
- CPC H10K85/6572
