Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
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Contents
- 1 Samsung Electro-Mechanics Co., Ltd. Patent Filing Activity
- 2 Samsung Electro-Mechanics Co., Ltd. patent applications in 2025
- 3 Top 10 Technology Areas
- 4 Emerging Technology Areas
- 5 Top Inventors
- 6 Patent Categories
- 7 Geographical Distribution of Inventors
- 8 Geographical Distribution of US Inventors
Samsung Electro-Mechanics Co., Ltd. Patent Filing Activity
Samsung Electro-Mechanics Co., Ltd. patent applications in 2025
Top 10 Technology Areas
- H01G4/30 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- Count: 25 patents
- Example: 20250069804. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- G02B13/0045 ({having five or more lenses})
- Count: 18 patents
- Example: 20250035888. OPTICAL IMAGING SYSTEM (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01G4/012 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 13 patents
- Example: 20250071898. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01F27/292 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites)
- Count: 10 patents
- Example: 20250037927. COIL COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01G4/1227 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- G02B9/64 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS)
- Count: 8 patents
- Example: 20250035888. OPTICAL IMAGING SYSTEM (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 8 patents
- Example: 20250071898. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H05K2201/09827 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 8 patents
- Example: 20250071898. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01G4/232 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- Count: 8 patents
- Example: 20250079086. MULTILAYER CERAMIC CAPACITOR (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Emerging Technology Areas
- H05K2203/107 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/0723 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/072 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2201/09481 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K3/0035 (Apparatus or processes for manufacturing printed circuits)
- H05K3/4682 (Manufacturing multilayer circuits)
- H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate)
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H05K2201/09536 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20250016917. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H05K2201/09327 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20250016917. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Top Inventors
- Yong Joo JO (11 patents)
- Jaeseok Yi (7 patents)
- Boum Seock KIM (6 patents)
- Jungdeok Park (6 patents)
- Hongryul Lee (6 patents)
- Byeong Cheol MOON (5 patents)
- Tae Hyun Kim (5 patents)
- Chi Hyeon JEONG (5 patents)
- Byung Hyun KIM (4 patents)
- Dong Jin LEE (4 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Samsung Electro-Mechanics Co., Ltd. Inventor States 2025 - Up to February 2025
Categories:
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- CPC H04B1/3833
- CPC H04M1/0264
- CPC G02B13/0065
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- Patent Trends by Company in 2025
