STMicroelectronics International N.V. patent applications published on September 26th, 2024

Summary of the patent applications from STMicroelectronics International N.V. on September 26th, 2024

1. **Summary**: STMicroelectronics International N.V. has recently filed patents for innovative technologies in the field of semiconductor manufacturing and electronic component integration. These patents focus on enhancing the efficiency, reliability, and performance of electronic devices through advanced circuit designs and manufacturing methods.

2. **Key Points of Patents**:

  * Buffer circuit for driving GaN power switches with push-pull and pre-buffer stages.
  * Integrated circuit chip with multiple connection pads and conductive/insulating layers.
  * Method for manufacturing electronic components with multiple contact metallizations.
  * Wafer technology with ultra-low dielectric constant layers for enhanced interconnection networks.

3. **Notable Applications**:

  * Power electronics, renewable energy systems, and electric vehicles benefit from improved efficiency and reliability.
  * Semiconductor industry can utilize advanced manufacturing methods for high-performance electronic devices.
  * Enhanced functionality and connectivity in consumer electronics and communication devices.
  * Potential applications in automotive industry for advanced vehicle electronics.

Patent applications for STMicroelectronics International N.V. on September 26th, 2024

HIGH DENSITY PMUT ARRAY ARCHITECTURE FOR ULTRASOUND IMAGING (18123602)

Main Inventor

Federico VERCESI

RESET FOR SCAN MODE EXIT FOR DEVICES WITH POWER-ON RESET GENERATION CIRCUITRY (18612251)

Main Inventor

Shikhar MAKKAR

ERROR DETECTION FOR ENCRYPTION OR DECRYPTION KEYS (18612406)

Main Inventor

Michael PEETERS

ERROR DETECTION FOR ENCRYPTION OR DECRYPTION KEYS (18612421)

Main Inventor

Pierre-Alexandre BLANC

INTEGRATED CIRCUIT WITH ADDRESS REMAPPING AND DATA RESHAPING (18188365)

Main Inventor

Loris LUISE

IDENTIFICATION OF AN APPLICATION (18610440)

Main Inventor

Michel JAOUEN

SYSTEM-ON-CHIP INCLUDING RESOURCE ISOLATION FRAMEWORK AND COUNTERMEASURE CIRCUIT, AND CORRESPONDING METHOD (18614171)

Main Inventor

Loic Pallardy

METHOD FOR DICING A SEMICONDUCTOR WAFER (18602230)

Main Inventor

Carlos Augusto SUAREZ SEGOVIA

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS (18603113)

Main Inventor

Olivier ORY

ELECTRONIC DEVICE (18601216)

Main Inventor

Romain COFFY

BUFFER CIRCUIT FOR DRIVING A GAN POWER SWITCH AND CORRESPONDING DRIVER CIRCUIT (18604239)

Main Inventor

Francesco PULVIRENTI