SK hynix Inc. patent applications published on July 25th, 2024
Summary of the patent applications from SK hynix Inc. on July 25th, 2024
1. **Summary**: SK hynix Inc. has recently filed patents for innovative semiconductor devices aimed at enhancing memory storage and processing efficiency. The patents describe unique stack structures with alternating electrodes and insulating layers, variable resistance patterns strategically placed for improved data storage, and multi-layer memory cell structures optimized for space utilization. These advancements promise increased performance, reliability, and energy efficiency in electronic devices.
2. **Key Points of Patents**:
* Formation of carbon electrode materials with surface treatment for semiconductor memory devices. * Stack structure with first electrodes, insulating layers, second electrode, and variable resistance patterns. * Semiconductor device with vertical and half conductive patterns separated by a slit. * Stacked structure with alternating conductive and insulating layers and a single-layer channel.
3. **Notable Applications**:
* Memory devices, Resistive random-access memory (ReRAM), Neuromorphic computing. * High-performance memory chips for consumer electronics, data storage devices, and computing systems. * Various semiconductor devices such as memory chips, processors, and integrated circuits.
Contents
- 1 Patent applications for SK hynix Inc. on July 25th, 2024
- 1.1 METHOD OF DETECTING AND CORRECTING MULTI-PATH INTERFERENCE COMPONENT IN TOF CAMERA (18532875)
- 1.2 MEMORY, OPERATION METHOD OF MEMORY, AND OPERATION METHOD OF MEMORY SYSTEM (18585054)
- 1.3 PERIPHERAL COMPONENT INTERCONNECT EXPRESS DEVICE AND OPERATING METHOD THEREOF (18602751)
- 1.4 CONTROLLER, STORAGE DEVICE AND TEST SYSTEM (18318655)
- 1.5 DATA STORAGE DEVICE, OPERATION METHOD THEREOF, AND STORAGE SYSTEM INCLUDING THE SAME (18626328)
- 1.6 IMAGE PROCESSING DEVICE AND PIXEL INTERPOLATION METHOD (18358641)
- 1.7 BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE BUFFER CHIP AND A MEMORY CHIP (18509039)
- 1.8 BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, MEMORY MODULE, AND OPERATION METHOD OF SEMICONDUCTOR PACKAGE (18509145)
- 1.9 BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP (18509188)
- 1.10 BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE (18494614)
- 1.11 MEMORY DEVICE AND METHOD OF OPERATING THE SAME (18356051)
- 1.12 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY THERMAL TREATMENT USING LASER LIGHT (18625405)
- 1.13 SEMICONDUCTOR SYSTEMS WITH DATA CLOCK APPLIED (18458415)
- 1.14 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE (18623909)
- 1.15 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (18624721)
- 1.16 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME (18346634)
- 1.17 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE (18624983)
- 1.18 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE (18590813)
Patent applications for SK hynix Inc. on July 25th, 2024
METHOD OF DETECTING AND CORRECTING MULTI-PATH INTERFERENCE COMPONENT IN TOF CAMERA (18532875)
Main Inventor
Min Hyuk KIM
MEMORY, OPERATION METHOD OF MEMORY, AND OPERATION METHOD OF MEMORY SYSTEM (18585054)
Main Inventor
Munseon JANG
PERIPHERAL COMPONENT INTERCONNECT EXPRESS DEVICE AND OPERATING METHOD THEREOF (18602751)
Main Inventor
Yong Tae JEON
CONTROLLER, STORAGE DEVICE AND TEST SYSTEM (18318655)
Main Inventor
Seung Hwa BAEK
DATA STORAGE DEVICE, OPERATION METHOD THEREOF, AND STORAGE SYSTEM INCLUDING THE SAME (18626328)
Main Inventor
Gun Wook LEE
IMAGE PROCESSING DEVICE AND PIXEL INTERPOLATION METHOD (18358641)
Main Inventor
Dong Gyun KIM
BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING THE BUFFER CHIP AND A MEMORY CHIP (18509039)
Main Inventor
Choung Ki SONG
BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, MEMORY MODULE, AND OPERATION METHOD OF SEMICONDUCTOR PACKAGE (18509145)
Main Inventor
Choung Ki SONG
BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP (18509188)
Main Inventor
Choung Ki SONG
BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE (18494614)
Main Inventor
Choung Ki SONG
MEMORY DEVICE AND METHOD OF OPERATING THE SAME (18356051)
Main Inventor
Sang Tae AHN
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY THERMAL TREATMENT USING LASER LIGHT (18625405)
Main Inventor
Won Tae KOO
SEMICONDUCTOR SYSTEMS WITH DATA CLOCK APPLIED (18458415)
Main Inventor
Kyu Dong HWANG
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE (18623909)
Main Inventor
Jin Ha KIM
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (18624721)
Main Inventor
Nam Jae LEE
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME (18346634)
Main Inventor
Chi Ho KIM
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE (18624983)
Main Inventor
Hyung Keun KIM
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE (18590813)
Main Inventor
Myoung Sub KIM