SKYWORKS SOLUTIONS, INC. (20240250424). MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES simplified abstract
Contents
MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES
Organization Name
Inventor(s)
Siva Viswanathan Thyagarajan of San Jose CA (US)
Stephen Joseph Kovacic of Newport Beach CA (US)
MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250424 titled 'MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES
The abstract describes a packaged module with multiple interposer layers containing an array of transmit and/or receive elements, each partitioned into high-performance and low-performance functionality blocks to enable multi-channel beamforming.
- Packaged module with interposer layers
- Transmit and/or receive elements on each layer
- Elements partitioned into high-performance and low-performance blocks
- Enables multi-channel beamforming functionality
Potential Applications: - Telecommunications - Radar systems - Satellite communication - Autonomous vehicles - Medical imaging
Problems Solved: - Enhanced beamforming capabilities - Improved signal processing efficiency - Increased data transmission speeds
Benefits: - Higher performance functionality - Enhanced digital processing capabilities - Improved overall system efficiency
Commercial Applications: Title: Advanced Beamforming Technology for Enhanced Communication Systems This technology can be utilized in various industries such as telecommunications, radar systems, and satellite communication to improve signal processing efficiency and data transmission speeds. The market implications include faster and more reliable communication systems, leading to enhanced performance and customer satisfaction.
Prior Art: Researchers can explore prior art related to beamforming technology, interposer layers in packaging substrates, and partitioning of functionality blocks in transmit/receive elements to understand the evolution of this innovation.
Frequently Updated Research: Researchers are continually exploring ways to enhance beamforming technology, improve signal processing algorithms, and optimize the performance of multi-channel communication systems.
Questions about the Technology: 1. How does the partitioning of transmit/receive elements into high-performance and low-performance blocks impact overall system efficiency? 2. What are the potential challenges in implementing multi-channel beamforming functionality in communication systems?
Original Abstract Submitted
in some embodiments, a packaged module can include a packaging substrate having a plurality of interposer layers, and an array of transmit and/or receive elements implemented on a respective interposer layer, each transmit/receive element partitioned into a first block configured to provide high-performance functionality, and a second block configured to provide digitally-intensive low-performance functionality, the first and second blocks in combination configured to provide multi-channel beamforming functionality.
