SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME: abstract simplified (17984446)

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  • This abstract for appeared for patent application number 17984446 Titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME'

Simplified Explanation

The abstract describes a semiconductor device and its fabrication method. The device includes a pad on a semiconductor chip, a protective layer with an opening exposing part of the pad's top surface, and a bump structure connecting to the pad. The bump structure consists of a metal layer on the pad and a solder ball on top. The width of the metal layer is approximately 0.85 to 0.95 times the width of the opening.


Original Abstract Submitted

Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises a pad on a semiconductor chip, a protective layer on the semiconductor chip and having an opening that exposes a portion of a top surface of the pad, and a bump structure electrically connected to the pad. The bump structure includes a metal layer on the pad and a solder ball on the metal layer. A first width of the metal layer is about 0.85 times to about 0.95 times a second width of the opening.

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