SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (20240255600). SENSOR ARRAY MODULE FOR AN ADVANCED DRIVER ASSISTANCE SYSTEM simplified abstract
Contents
- 1 SENSOR ARRAY MODULE FOR AN ADVANCED DRIVER ASSISTANCE SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SENSOR ARRAY MODULE FOR AN ADVANCED DRIVER ASSISTANCE SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about the Technology
- 1.13 Original Abstract Submitted
SENSOR ARRAY MODULE FOR AN ADVANCED DRIVER ASSISTANCE SYSTEM
Organization Name
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor(s)
Marek Hustava of Bratislava (SK)
SENSOR ARRAY MODULE FOR AN ADVANCED DRIVER ASSISTANCE SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240255600 titled 'SENSOR ARRAY MODULE FOR AN ADVANCED DRIVER ASSISTANCE SYSTEM
Simplified Explanation
This patent application describes a smart ultrasonic integrated circuit that combines a MEMS device with a piezoelectric transducer in a sensor array module. This module can provide dual-mode sensing (audio and ultrasonic) in a single unit, enhancing the capabilities of advanced driver assistance systems.
Key Features and Innovation
- Integration of a MEMS device with a piezoelectric transducer in a sensor array module
- Dual-mode sensing (audio and ultrasonic) in a single module
- Use of a two-dimensional array for receiving ultrasonic echoes, adding a dimension to ultrasonic range detection
Potential Applications
The technology can be used in advanced driver assistance systems, automotive safety systems, and industrial automation for enhanced sensing capabilities.
Problems Solved
The technology addresses the need for improved sensing capabilities in driver assistance systems, allowing for simultaneous detection of audio and ultrasonic signals.
Benefits
- Enhanced sensing capabilities for driver assistance systems
- Improved safety features in vehicles
- Cost-effective solution for integrating MEMS devices with piezoelectric transducers
Commercial Applications
- Automotive industry for driver assistance systems
- Industrial automation for enhanced sensing capabilities
Prior Art
Readers can explore prior research on MEMS devices, piezoelectric transducers, and sensor array modules in the field of ultrasonic sensing technology.
Frequently Updated Research
Stay updated on advancements in MEMS technology, piezoelectric transducers, and sensor array modules for ultrasonic sensing applications.
Questions about the Technology
What are the potential commercial applications of this technology?
The technology can be applied in driver assistance systems, automotive safety features, and industrial automation for enhanced sensing capabilities.
How does the integration of MEMS devices with piezoelectric transducers improve sensor array modules?
By combining MEMS devices with piezoelectric transducers, the sensor array module can provide dual-mode sensing and improved functionality for driver assistance systems.
Original Abstract Submitted
a smart ultrasonic integrated-circuit that allows at least one mems device to be combined with a piezoelectric transducer in a sensor array module. the sensor array module is capable of additional functionality for an advanced driver assistance system. for example, the mems device can add functionality because its wide bandwidth allows for simultaneous detection of audio signals and ultrasonic signals. accordingly, the sensor array module may provide dual-mode (audio and ultrasonic) sensing in a single module. additionally the size/cost of a mems device allows for the use of a two-dimensional array for receiving ultrasonic echoes which can add a dimension to the ultrasonic range detection for a vehicle.
