SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on October 17th, 2024
SAMSUNG ELECTRONICS CO., LTD.: 127 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H01L23/00 (13), H10B12/00 (7), H01L25/065 (7), H01L23/498 (6), H10B61/00 (6) H10N50/85 (2), H04B7/0626 (2), G06F3/0418 (2), H04W8/005 (2), G06F9/5027 (2)
With keywords such as: device, layer, memory, surface, data, based, pattern, electronic, including, and information in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Jinoh IM of Suwon-si (KR) for samsung electronics co., ltd., Seungjiun LEE of Suwon-si (KR) for samsung electronics co., ltd., IIyoung YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A46B17/06, A46B9/00, A46B9/02, A46B15/00, B08B3/10, B08B5/04, B08B7/02, H01L21/67
CPC Code(s): A46B17/06
Abstract: a brush cleaning device includes a brush including an electrode therein; a cleaning tank in which the brush is accommodatable; a platen in the cleaning tank, the platen being spaced apart from the brush, and including an electrode therein that interacts with the electrode of the brush; and a voltage supplier having an electrode interacting with the electrode of the brush, and supplying a voltage to form an electrical field on the brush and the platen, wherein the brush includes a cylindrical body including a plurality of protrusions on a surface thereof, and pores in at least a portion of the plurality of protrusions; a particle collection pipe at a center of the cylindrical body; and a particle suction pipe in fluid communication with the particle collection pipe and extending radially to the pores at an outer surface of the brush.
Inventor(s): Kangjun SEO of Suwon-si (KR) for samsung electronics co., ltd., Hyelim PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun SON of Suwon-si (KR) for samsung electronics co., ltd., Kyoungha SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dongmin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Myoungsoo JANG of Suwon-si (KR) for samsung electronics co., ltd., Chihong CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L11/40, A47L9/28
CPC Code(s): A47L11/4011
Abstract: a cleaner is provided. the cleaner includes an output interface, a communicator, one or more processors, and memory one or more computer programs further comprise computer-executable instructions that, when executed by the one or more processors, cause the cleaner to receive information about a non-cleaned zone obtained by a robot cleaner through the communicator, and control the output interface to output guidance information to guide the cleaner to the non-cleaned zone based on the information about the non-cleaned zone.
Inventor(s): Jusik KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyuha LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/50
CPC Code(s): A47L15/502
Abstract: a dishwasher is disclosed. the dishwasher comprises: a cabinet; a washing tub provided inside the cabinet; and a cutlery basket inside the washing tub and including a first sidewall, a second side wall opposite to the first sidewall, a main body including first holes formed in the first and second sidewalls and second holes spaced apart from the first holes at right angles, and a handle including a first fastener facing the outer surface of the first side wall, a second fastener facing the outer surface of the second sidewall, and a grip connecting the first and second fasteners, first and second protrusions formed on each of the first and second fasteners and the first protrusions inserted into the first holes and have an upper surface contacting the main body, and the second protrusions are inserted into the second holes and have a lower surface contacting the main body.
Inventor(s): Kirill Gennadievich BELIAEV of Moscow (RU) for samsung electronics co., ltd., Dmitrii Igorevich CHERNAKOV of Moscow (RU) for samsung electronics co., ltd., Viacheslav Sergeevich KHOLOBURDIN of Moscow (RU) for samsung electronics co., ltd., Vladimir Mikhailovich SEMENOV of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): A61B5/024, A61B5/00
CPC Code(s): A61B5/02427
Abstract: a method for measuring heart rate is provided. the method includes illuminating a body portion with light, detecting light scattered by tissues of the body portion and blood particles by a plurality of photodetectors including at least one pair of photodetectors which are connected in anti-parallel in each pair of photodetectors, eliminating a frequency component of motion artifacts in an analog photocurrent differential signal by subtracting a first analog photocurrent signal detected by a first photodetector of a pair of photodetectors of the at least one pair of the photodetectors from a second analog photocurrent signal detected by a second photodetector of the pair of photodetectors, converting the analog photocurrent differential signal into an analog voltage differential signal, converting the analog voltage differential signal into a digital differential signal, calculating an envelope of the digital differential signal, and calculating the heart rate from peaks of the calculated envelope of the digital differential signal.
Inventor(s): Hongkwan CHO of Suwon-si (KR) for samsung electronics co., ltd., Youngchul KO of Suwon-si (KR) for samsung electronics co., ltd., Keonpyo KOO of Suwon-si (KR) for samsung electronics co., ltd., Dohyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmok KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61L9/20, A61L9/014, B01D53/00, B01D53/04, B01D53/88, B09B3/35, B09B3/38, B09B3/40, B09B101/70
CPC Code(s): A61L9/205
Abstract: a food waste disposal apparatus, according to one embodiment of the present disclosure, comprises: a chamber for accommodating food waste; and a deodorizing device for deodorizing gas inside the chamber. the deodorizing device may comprise: a photocatalyst filter arranged to be inclined; a light source unit for irradiating light having a frequency within a specific range to the photocatalyst filter; and an activated carbon filter in which activated carbon is accommodated so as to deodorize gas passing through the photocatalyst filter.
Inventor(s): Suhyeon HAN of Suwon-si (KR) for samsung electronics co., ltd., Myunghyuk IM of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Duckjin SUNG of Suwon-si (KR) for samsung electronics co., ltd., Yujeub HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01D39/10, A47J36/38, C09D183/04
CPC Code(s): B01D39/10
Abstract: a coating filter having a coating layer formed on a filter surface to improve cleanability and a hood using the same. a coating filter includes: a stainless steel or aluminum material; and a coating layer formed on the stainless steel or aluminum material, wherein the coating layer may include silicone and methyl methacrylate (mma) resin.
Inventor(s): Hyunnam LEE of Suwon-si (KR) for samsung electronics co., ltd., Namsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Keonpyo KOO of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmok KIM of Suwon-si (KR) for samsung electronics co., ltd., Daegeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungkwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonyoung SEO of Suwon-si (KR) for samsung electronics co., ltd., Yongjun HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B09B3/35, A61L9/014, A61L9/20, B02C23/26, B09B3/38, B09B3/40, B09B101/70
CPC Code(s): B09B3/35
Abstract: a food waste disposer comprising a chamber for accommodating food for disposal; a deodorization device for deodorizing gas and discharging same to the outside; and a cover member for covering the chamber. the cover member includes a fan, which is arranged to face the inside of the chamber so as to generate, when being driven, a convection current inside the chamber; and a discharge pipe arranged such that a discharge port formed at a first end portion is arranged on outside a path of upward flow of air such that the upward flow of air bypasses the fan, and a second end portion, which is opposite to the first end portion, is connected to the deodorization device.
Inventor(s): Kyoungha SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyelim PARK of Suwon-si (KR) for samsung electronics co., ltd., Kangjun SEO of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun SON of Suwon-si (KR) for samsung electronics co., ltd., Myoungsoo JANG of Suwon-si (KR) for samsung electronics co., ltd., Chihong CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J13/06, B25J9/00
CPC Code(s): B25J13/06
Abstract: a mobile robot is provided. the mobile robot includes a communication circuitry configured to communicate with an electronic device, a sensor configured to detect a user, a user interface configured to provide information related to an operation of the electronic device, and a controller. the controller may be configured to: determine a target user to provide the information related to the operation of the electronic device, based on at least one of state information of the electronic device or user information obtained by the sensor, obtain event information about a change in the operation of the electronic device, determine a notification type of the event information, based on at least one of a location of the target user or a state of the target user, and control the user interface to provide the event information in the determined notification type.
Inventor(s): Doyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonho KIM of Suwon-si (KR) for samsung electronics co., ltd., Suhyeon JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F33/34, D06F103/40, D06F105/02
CPC Code(s): D06F33/34
Abstract: a washing machine including a washing tub, a water supply unit, a front door, at least one hose connectable to the water supply unit to form a first water supply path and a second water supply path, a first valve, and a second valve. the first water path may supply water into the washing tub and the second water supply path may supply water to a front portion of the washing tub. the first valve may be connected to the water supply unit, the washing tub, and the second valve to form the first water supply path and the second water supply path, and the second valve may be connected to the first valve and the front portion of the washing tub to form the second water supply path.
Inventor(s): Sujin SEONG of Suwon-si (KR) for samsung electronics co., ltd., Byung-In MA of Suwon-si (KR) for samsung electronics co., ltd., Kisup LEE of Suwon-si (KR) for samsung electronics co., ltd., Yong Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sukyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/18, D06F34/28, D06F103/02
CPC Code(s): D06F34/18
Abstract: a clothing management apparatus including: a body including a reception space to accommodate clothes to be managed; an optical sensor; a door; a display arrangeable at one side of the door; and a processor which controls the optical sensor to emit ultraviolet light, when reflected light of the emitted light is received through the optical sensor, identifies an allergen value of the clothes to be managed based on an intensity of the reflected light, identifies a degree of contamination of the clothes to be managed on the basis of the identified allergen value, and controls the display to display information on a recommended management course corresponding to the clothes to be managed on the basis of the identified degree of contamination.
Inventor(s): Deulre MIN of Suwon-si (KR) for samsung electronics co., ltd., Seokjun SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D29/00, F25D17/06
CPC Code(s): F25D29/00
Abstract: a refrigerator that comprises a storage compartment; a case disposed in the storage compartment; a heater disposed in the case; a cooling fan configured to introduce air outside the case into an inside of the case; and a processor configured to determine a target time based on information about an object, configured to operate the heater for the target time, and configured to intermittently operate the cooling fan while operating the heater.
Inventor(s): Yuhan ZHOU of San Diego CA (US) for samsung electronics co., ltd., Philippe SARTORI of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): G01S5/10, G01S11/06, H04L5/00, H04W56/00, H04W64/00
CPC Code(s): G01S5/10
Abstract: a system and methods are disclosed for reducing rx/tx timing errors in a wireless network for latency of positioning measurements. additionally, a system and methods are disclosed for increasing positioning accuracy by mitigating nlos errors and/or by performing two-stage beam sweeping for dl-aod. further, a system and methods are disclosed for performing m-sample positioning measurements to improve latency reporting in connection with positioning reporting.
Inventor(s): Kyoungha SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyelim PARK of Suwon-si (KR) for samsung electronics co., ltd., Kangjun SEO of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun SON of Suwon-si (KR) for samsung electronics co., ltd., Myoungsoo JANG of Suwon-si (KR) for samsung electronics co., ltd., Chihong CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/622
CPC Code(s): G05D1/637
Abstract: a mobile robot is provided. the mobile robot includes a communication circuitry configured to communicate with at least one of a user device or a server, a sensor configured to collect environmental information of an indoor space, and a controller configured to be electrically connected to the sensor and the communication circuitry. the controller is configured to: store the environmental information of each of a plurality of zones of the indoor space obtained by the sensor, set a purpose of a first zone of the plurality of zones, based on a user input or the environmental information of each of the plurality of zones, and generate information recommending a target device to be placed in the first zone, based on environmental information of the first zone and required environmental information corresponding to the set purpose.
Inventor(s): Jungmoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongpyo KIM of Seoul (KR) for samsung electronics co., ltd., Insuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeonjeong LEE of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05F1/575, G09G3/20
CPC Code(s): G05F1/575
Abstract: an integrated circuit includes: a power supply circuit configured to generate a supply voltage from at least one of first and second power source voltages; and a system load configured to operate by receiving the supply voltage through an output node of the power supply circuit, wherein the power supply circuit includes: a first low drop-output (ldo) regulator configured to generate, from the first power source voltage, a first load current flowing to the system load through the output node; and a second ldo regulator configured to selectively generate a second load current flowing to the system load through the output node, from the second power source voltage based on a difference between voltages of internal nodes of the first ldo regulator.
Inventor(s): Youngsang JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, A44C9/00
CPC Code(s): G06F1/163
Abstract: according to an embodiment, a wearable device includes a frame including a first surface facing a part of the body of a user when the wearable device is worn on the user, and a second surface opposite to the first surface, and a resizing structure on the first surface at least partially movable relative to the frame in response to pressure from the part of the body of the user. the resizing structure includes an elastic member which is deformable according to a shape of the part of the body of the user. the resizing structure includes a supporting member guiding a deformation of the elastic member by supporting the elastic member and extending from the first surface to cover at least a portion of the elastic member.
Inventor(s): Dooryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewon YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1681
Abstract: an electronic device includes a display including a folding area between first and second areas; first and second housings respectively supporting the first and second areas; a hinge unit connected to the first and second housings, and operating between a folded state in which the first and second areas face each other and an unfolded state in which the first and second areas are open; a hinge housing including the hinge unit; a cap connected to the hinge housing and covering a side of the folding area; and a fixing member fixing the cap to the hinge housing. a fixing groove into which the fixing member is fixed is defined in the hinge housing. the fixing member includes a fixing part to which the cap is fixed, and a wing part protruding from the fixing part, including an end contacting the fixing groove, and limiting movement of the fixing member.
Inventor(s): Rajendra SUBRAMANYAIAH of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, A01K29/00, G16Y20/10, G16Y40/20
CPC Code(s): G06F3/011
Abstract: a method for user assisted event-context management in an internet of things (iot) environment is disclosed. the method comprising: detecting, via one or more iot devices and one or more smart devices, at least one of one or more current actions of a user or one or more events in the iot environment; detecting, via the one or more iot devices, a current operating state of each of the one or more devices within the iot environment and obtaining, from a database, one or more specified association rules indicating a relationship between each of a plurality of predefined user actions, a plurality of specified events, and pre-configured operating states of the one or more devices; and controlling the current operating state of the one or more devices based on the obtained one or more specified association rules.
Inventor(s): Bongjun KO of Suwon-si (KR) for samsung electronics co., ltd., Sanghun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Dongnam BYUN of Suwon-si (KR) for samsung electronics co., ltd., Jongmin WI of Suwon-si (KR) for samsung electronics co., ltd., Hoondo HEO of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06N3/0464, G06N3/08
CPC Code(s): G06F3/0418
Abstract: an electronic device is provided. the electronic device includes a display, a touch sensor disposed in the display and including a plurality of lines and a plurality of nodes formed by the plurality of lines, a memory storing instructions, and a processor. the instructions, when being executed by the processor, cause the electronic device to obtain a plurality of node values from each of the plurality of nodes, change the touch sensitivity of the touch sensor from a first touch sensitivity to a second touch sensitivity lower than the first touch sensitivity based on identifying a pattern by the plurality of node values, identify whether to recognize contact on the touch sensor as a touch input through the plurality of line values obtained from each of the plurality of lines based on identifying changes of the pattern by the plurality of node values.
Inventor(s): Hyungsoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/046
CPC Code(s): G06F3/0418
Abstract: an electronic device includes memory storing instructions, a radar configured to transmit an electromagnetic signal and receive a radar signal which is a reflected signal of the electromagnetic signal, the reflected signal being reflected from at least one target object, a touch pad configured to detect a touch of a user based on a designated touch threshold value, and at least one processor operatively coupled with the memory, the radar, and the touch pad. the instructions may, when executed by the at least one processor, cause the electronic device to: obtain the radar signal received by the radar; identify, based on the radar signal, a surrounding environment of the electronic device, and adjust the touch threshold value based on the surrounding environment.
Inventor(s): Jaehwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungchul AN of Suwon-si (KR) for samsung electronics co., ltd., Sangil PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/046, G06F3/041, H05K1/02, H05K1/14
CPC Code(s): G06F3/046
Abstract: an electronic device may include: a first housing; a second housing that is foldably coupled, directly or indirectly, to the first housing through a hinge device; a display disposed to be supported by at least the first housing and the second housing; a digitizer disposed under the display; a first printed circuit board disposed at least partially in a first inner space of the first housing and electrically connected, directly or indirectly, to the digitizer; a second printed circuit board disposed at least partially in a second inner space of the second housing and electrically connected, directly or indirectly, to the digitizer; a third fpcb structure electrically connecting the first printed circuit board and the second printed circuit board; and a processor that detects the coordinates of an electronic pen that is close to the digitizer. the digitizer may include a first electro magnetic resonance (emr) sheet disposed at least partially in the first inner space of the first housing and including a first flexible printed circuit board (fpcb) structure and a second emr sheet disposed at least partially in the inner space of the second housing and including a second fpcb structure. the digitizer may include a plurality of x-axis channels and a plurality of y-axis channels orthogonal to the plurality of x-axis channels, and the plurality of x-axis channels may include single channels formed of single wires and common channels formed of common wires.
Inventor(s): Taeyang SONG of Suwon-si (KR) for samsung electronics co., ltd., Dahee KIM of Suwon-si (KR) for samsung electronics co., ltd., Teayoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Changhan LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd., Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jookwan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0484, G06F1/16, G06F3/0481, H04M1/72403, H04M1/72469
CPC Code(s): G06F3/0484
Abstract: a shape-changeable electronic apparatus according to an embodiment includes: a display module having a first area and a second area. in response to the shape of the electronic apparatus being a first shape, the first area is activated, and in response to the shape of the electronic apparatus being a second shape, the second area is activated. the electronic apparatus further includes a memory storing computer-executable instructions and a processor which executes the instructions. when the instructions are executed, in the first shape, first content related to a first application is displayed in the first area. information is identified from the first content. the presence of a candidate application to which the identified information can be applied is determined. in response to the candidate application being present, a graphic object capable of receiving an input for changing the shape of the electronic apparatus is displayed on the first area.
Inventor(s): Junsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Bosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Taekyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seoghee JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Heewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeunwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04886, G06F3/04842
CPC Code(s): G06F3/04886
Abstract: a method for operating an electronic device including a display, according to one embodiment, may comprise an operation of receiving a touch input having a point of contact on a first key from among a plurality of keys in a virtual keyboard displayed through the display. the method may comprise an operation of identifying, in response to the touch input, (a) one from among a first character and a second character on the basis of the first character represented by the first key, the second character represented by a second key adjacent to the first key from among the plurality of keys, and at least one third character displayed before the touch input is received within a text input part displayed together with the virtual keyboard. the method may comprise an operation of displaying the identified character within the text input part through the display.
Inventor(s): Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd., Chanik PARK of San Jose CA (US) for samsung electronics co., ltd., Sungwook RYU of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/0804, G06F12/0811
CPC Code(s): G06F3/0619
Abstract: a persistent memory device is disclosed. the persistent memory device may include a cache coherent interconnect interface. the persistent memory device may include a volatile storage and a non-volatile storage. the volatile storage may include at least a first area and a second area. a backup power source may be configured to provide backup power selectively to the second area of the volatile storage. a controller may control the volatile storage and the non-volatile storage. the persistent memory device may use the backup power source while transferring a data from the second area of the volatile storage to the non-volatile storage based at least in part on a loss of a primary power for the persistent memory device.
Inventor(s): Jinwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minji Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangwon Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0652
Abstract: disclosed is a storage device which includes nonvolatile memory devices each including a plurality of memory blocks, a memory controller that controls the nonvolatile memory devices, and a buffer memory that buffers data to be written in the nonvolatile memory devices. in an on-time erase operation, the memory controller controls the nonvolatile memory devices such that an erase operation is performed in a memory block for each of the nonvolatile memory devices. when an early erase condition is satisfied, the memory controller selects nonvolatile memory device among the nonvolatile memory devices and controls the selected nonvolatile memory device such that the erase operation is performed in a memory block of the selected nonvolatile memory device. when a free capacity of the buffer memory is smaller than a first threshold value, the memory controller determines that the early erase condition is satisfied.
Inventor(s): Seungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hongsup LEE of Suwon-si (KR) for samsung electronics co., ltd., Jin SAGONG of Suwon-si (KR) for samsung electronics co., ltd., Youngjin OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F8/65
CPC Code(s): G06F8/65
Abstract: a firmware update method, an electronic device performing same, and a charging device are provided. an electronic device includes a battery, memory storing one or more computer programs, a communication module for establishing communication with a user terminal and a charging device, and one or more processors communicatively coupled to the battery, the memory, and the communication moule, wherein the one or more computer programs further include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to transmit, to the charging device via the communication module, a set time to initiate a firmware upgrade and a flag that causes firmware of at least one of the electronic device or the charging device to be updated at the set time, receive, via the communication module, the flag from the charging device at the set time, and update firmware of at least one of the electronic device or the charging device by using firmware data that is received from the user terminal according to the flag and stored in the memory.
Inventor(s): Jonghyeon Kim of San Jose CA (US) for samsung electronics co., ltd., Soogil Jeong of Pleasanton CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F9/48, G06F9/54
CPC Code(s): G06F9/5027
Abstract: provided is a method for performing computations near memory, the method including receiving, at a storage device, first data associated with a first data set, the first data having a first format, receiving, at a processor core of the storage device, a request to perform a function on the first data, the function including a first operation and a second operation, performing, by a first processor-core acceleration engine of the storage device, the first operation on the first data, based on first processor-core custom instructions, to generate first result data, and performing, by a first extra-processor-core circuit of the storage device, the second operation on the first result data, based on the first processor-core custom instructions.
Inventor(s): Jonghyeon Kim of San Jose CA (US) for samsung electronics co., ltd., Soogil Jeong of Pleasanton CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F9/54
CPC Code(s): G06F9/5027
Abstract: provided is a method for performing computations near memory, the method including receiving, at a processor core of a storage device, a request to perform a first function on first data, the first function including a first operation and a second operation, performing, by a first processor-core acceleration engine of the storage device, the first operation on the first data, based on first processor-core custom instructions, to generate first result data, and performing, by a first co-processor acceleration engine of the storage device, the second operation on the first result data, based on first co-processor custom instructions.
Inventor(s): Yongwong KWON of Suwon-si (KR) for samsung electronics co., ltd., Ho-Jin AHN of Suwon-si (KR) for samsung electronics co., ltd., Dohyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sungtae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/07, G06F11/34
CPC Code(s): G06F11/0772
Abstract: a failure prediction method of predicting a failure of a storage device includes: identifying at least a portion of telemetry information, stored in a memory, as risk data based on a predetermined first criterion; inputting first data of a first attribute, among the risk data, to a machine learning model; obtaining a first anomaly score output from the machine learning model; detecting whether an anomaly is present in the first attribute, based on whether the first anomaly score satisfies a predetermined second criterion; transmitting an alert, associated with the first attribute, to a host when an anomaly is detected for the first attribute, among the risk data; and receiving feedback, corresponding to the alert, from the host. the machine learning model may receive the risk data to learn a pattern of data, and may output an anomaly score of the received data based on the learned pattern of the data.
Inventor(s): Rekha PITCHUMANI of Fairfax VA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F3/06
CPC Code(s): G06F11/1076
Abstract: according to one general aspect, an apparatus may include a regeneration-code-aware (rca) storage device configured to calculate at least one type of data regeneration code for data error correction. the rca storage device may include a memory configured to store data in chunks which, in turn, comprise data blocks. the rca storage device may include a processor configured to compute, when requested by an external host device, a data regeneration code based upon a selected number of data blocks. the rca storage device may include an external interface configured to transmit the data regeneration code to the external host device.
Inventor(s): KI-HEUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Oh of Suwon-si (KR) for samsung electronics co., ltd., Taekwoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinseong Yun of Suwon-si (KR) for samsung electronics co., ltd., Yoonjae Jeong of Suwon-si (KR) for samsung electronics co., ltd., Hyongryol Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0223
Abstract: a method of operating a memory configured to communicate with a memory controller, the method includes: temporarily storing a unique identification (id) for each of a plurality of memory devices included in the memory to each of the plurality of memory devices; selecting a target memory device from among the plurality of memory devices; and permanently or substantially permanently programming, in the target memory device, a unique id corresponding to the target memory device.
Inventor(s): Ramzi AMMARI of Santa Clara CA (US) for samsung electronics co., ltd., Changho CHOI of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/16
CPC Code(s): G06F13/1668
Abstract: a storage device is disclosed. the storage device may include a storage for a data and a controller to process an input/output (i/o) request from a host processor on the data in the storage. a computational storage unit may implement at least one service for execution on the data in the storage. a command router may route a command received from the host processor to the controller or the computational storage unit based at least in part on the command.
Inventor(s): Moonkyu SONG of Suwon-si (KR) for samsung electronics co., ltd., Hanhui LI of Suwon-si (KR) for samsung electronics co., ltd., Jiangbo CHEN of Suwon-si (KR) for samsung electronics co., ltd., Yongjoo KWON of Suwon-si (KR) for samsung electronics co., ltd., Joohwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Junseo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jieun JANG of Suwon-si (KR) for samsung electronics co., ltd., Hanju JE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/45, G06F21/32
CPC Code(s): G06F21/45
Abstract: a dynamic update system includes an input unit configured to receive biometric information of a user in real time and convert the biometric information into biometric data, a dynamic update processing unit configured to use the biometric data for dynamic update, and a storage configured to back up registered biometric data of the user and data for the dynamic update, wherein the dynamic update processing unit determines whether to perform the dynamic update using the biometric data by utilizing one of spatial information and time information of the biometric data.
Inventor(s): Jiho Han of Suwon-si (KR) for samsung electronics co., ltd., Jong-Seong Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungju Jang of Suwon-si (KR) for samsung electronics co., ltd., Hyuckjoon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Sunghoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Raehyun Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/392
CPC Code(s): G06F30/392
Abstract: disclosed is an operating method of an electronic device that includes a processor and supports manufacture of a semiconductor device. the operating method includes receiving, at the processor, circuit schematics for the manufacture of the semiconductor device, partitioning, at the processor, circuit components of the circuit schematics into at least two mats, calculating, at the processor, availability of placement and routing of the circuit components, based on limited connecting elements electrically connected to the circuit components, for each of the at least two mats, and performing, at the processor, the placement and routing to generate a layout image for the manufacture of the semiconductor device when the availability indicates that the placement and routing is available. the limited connecting elements include vertical lines, which electrically connect an upper portion and a lower portion of the semiconductor device, at limited locations of the semiconductor device.
Inventor(s): Jijoong MOON of Suwon-si (KR) for samsung electronics co., ltd., Parichay KAPOOR of Suwon-si (KR) for samsung electronics co., ltd., Jihoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Myungjoo HAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08, G06N3/04
CPC Code(s): G06N3/08
Abstract: an electronic apparatus may include a memory configured to store data related to a neural network model and at least one processor configured to divide a learning step performed through a plurality of layers of the neural network model into a plurality of steps including a forward propagation step, a gradient calculation step, and a derivative calculation step, and determine an execution order of the plurality of steps, obtain first information regarding in which step of a plurality of steps according to the determined execution order a plurality of sensors used in the plurality of layers are used, based on the determined execution order, integrate the determined execution order based on the first information and second information regarding whether tensors used in neighboring layers from among the plurality of layers are able to be shared, allocate the data to the plurality of tensors by minimizing a region of the memory for allocating data corresponding to the plurality of tensors, based on the integrated execution order, and train the neural network model according to the integrated execution order using the plurality of tensors and the data allocated to the plurality of tensors. various other embodiments are possible to be implemented.
20240346317. NEURAL NETWORK METHOD AND APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minkyoung CHO of Incheon (KR) for samsung electronics co., ltd., Wonjo LEE of Uiwang-si (KR) for samsung electronics co., ltd., Seungwon LEE of Ansan-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/082, G06N3/04
CPC Code(s): G06N3/082
Abstract: a method and apparatus for the pruning of a neural network is provided. the method sets a weight threshold value based on a weight distribution of layers included in a neural network, predicts a change of inference accuracy of a neural network by pruning of each layer based on the weight threshold value, determines a current subject layer to be pruned with a weight threshold value among the layers included in the neural network, and prunes a determined current subject layer.
Inventor(s): Haoyu Ren of San Diego CA (US) for samsung electronics co., ltd., Mostafa El-Khamy of San Diego CA (US) for samsung electronics co., ltd., Jungwon Lee of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T7/579, G06T3/18, G06T7/194
CPC Code(s): G06T7/579
Abstract: a method of depth detection based on a plurality of video frames includes receiving a plurality of input frames including a first input frame, a second input frame, and a third input frame respectively corresponding to different capture times, convolving the first to third input frames to generate a first feature map, a second feature map, and a third feature map corresponding to the different capture times, calculating a temporal attention map based on the first to third feature maps, the temporal attention map including a plurality of weights corresponding to different pairs of feature maps from among the first to third feature maps, each weight of the plurality of weights indicating a similarity level of a corresponding pair of feature maps, and applying the temporal attention map to the first to third feature maps to generate a feature map with temporal attention.
Inventor(s): Yejin KIM of Suwon-si (KR) for samsung electronics co., ltd., Pius LEE of Suwon-si (KR) for samsung electronics co., ltd., Chaebin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T15/10, G03B21/14, G06T19/00, G06T19/20
CPC Code(s): G06T15/10
Abstract: an electronic device according to an embodiment of the disclosure may be configured to: obtain a raster image including one or more real objects using one or more cameras, generate a vector image by vectorizing the raster image, generate an edit screen by superposing the vector image and the raster image, display a user interface representation including the edit screen on a display, generate a projection screen in response to one or more inputs to the user interface representation, and transmit the projection screen to an external electronic device connected to the electronic device.
Inventor(s): Anna Ilyinichna SOKOLOVA of Moscow (RU) for samsung electronics co., ltd., Anna Borisovna VORONTSOVA of Moscow (RU) for samsung electronics co., ltd., Alexander Georgievich LIMONOV of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): G06T17/20, G06T7/11, G06V10/74
CPC Code(s): G06T17/20
Abstract: a method for 3d scene reconstruction and visualization, may include, using at least one processor: obtaining a trained base neural network by training the base neural network for obtaining distance information for voxels of a real scene; operating the trained base neural network for obtaining the distance information of an input sequence of frames of the real scene; inputting the distance information to an algorithm that outputs a 3d reconstruction of the real scene; obtaining a 3d visualization of the real scene by rendering the 3d reconstruction of the real scene; and instructing at least one display to display the 3d visualization of the real scene.
Inventor(s): Yingen Xiong of Mountain View CA (US) for samsung electronics co., ltd., Christopher A. Peri of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06T5/80, H04N13/344
CPC Code(s): G06T19/006
Abstract: a method includes determining that an inter-pupillary distance (ipd) between display lenses of a video see-through (vst) extended reality (xr) device has been adjusted with respect to a default ipd. the method also includes obtaining an image captured using a see-through camera of the vst xr device. the see-through camera is configured to capture images of a three-dimensional (3d) scene. the method further includes transforming the image to match a viewpoint of a corresponding one of the display lenses according to a change in ipd with respect to the default ipd in order to generate a transformed image. the method also includes correcting distortions in the transformed image based on one or more lens distortion coefficients corresponding to the change in ipd in order to generate a corrected image. in addition, the method includes initiating presentation of the corrected image on a display panel of the vst xr device.
Inventor(s): Erick Wong of Vancouver (CA) for samsung electronics co., ltd., Alexi Georgiev Jordanov of Westminster (CA) for samsung electronics co., ltd.
IPC Code(s): G07B15/00, G06Q20/32, G06Q20/38
CPC Code(s): G07B15/00
Abstract: in one embodiment, a method includes sending, via an ultra-wide band (uwb) communication protocol from a first application associated with a first uwb-enabled device to a second application associated with a second uwb-enabled device, (1) location information indicating a location of the first uwb-enabled device with respect to the second uwb-enabled device and (2) balance information indicating an available monetary balance on the first uwb-enabled device. the second application associated with the second uwb-enabled device may use the location and balance information to perform an action with respect to the second uwb-enabled device. a payment cryptogram may be generated based on event information relating to the action performed with respect to the second uwb-enabled device and unique device characteristics associated with the first uwb-enabled device. the payment cryptogram may be used for securely authorizing a payment transaction relating to the action performed with respect to the second uwb-enabled device.
Inventor(s): Seungryong HAN of Suwon-si (KR) for samsung electronics co., ltd., Tetsuya SHIGETA of Suwon-si (KR) for samsung electronics co., ltd., Gangmo KOO of Suwon-si (KR) for samsung electronics co., ltd., Hwaseok SEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32
CPC Code(s): G09G3/32
Abstract: a display device including: a display including a plurality of pixels in a plurality of pixel lines; a memory for storing a first cross-talk and a second cross-talk weight; and at least one processor configured to: simultaneously apply an image signal to the plurality of pixel lines; acquire a plurality of grayscale values and a plurality of grayscale sections of each of the plurality of pixels; acquire, based on the plurality of grayscale values, first histogram and second histogram information; identify a first cross-talk amount based on the first histogram information and the first cross-talk weight; identify a second cross-talk amount based on the second histogram information and the second cross-talk weight; acquire grayscale correction data of the target pixel based on the first cross-talk amount and the second cross-talk amount; and acquire a corrected grayscale value of the target pixel based on the grayscale correction data.
20240347080. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunsuk Kang of Suwon-si (KR) for samsung electronics co., ltd., Jeongsu Lee of Suwon-si (KR) for samsung electronics co., ltd., Eunji An of Suwon-si (KR) for samsung electronics co., ltd., Jungjune Park of Suwon-si (KR) for samsung electronics co., ltd., Chiweon Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C5/14
CPC Code(s): G11C5/147
Abstract: a semiconductor device includes a first pull-up circuit connected between a first power node supplying a first power voltage and an output node through which a signal is output, and including a plurality of nmos transistors; a second pull-up circuit connected in parallel to the first pull-up circuit between the first power node and the output node and including a plurality of pmos transistors; and a control circuit outputting a first pull-up code to the first pull-up circuit and outputting the second pull-up code to the second pull-up circuit. in a first operating mode, the signal swings between a first low level lower than the first power voltage, and a first high level lower than � times the first power voltage, resistance of the first pull-up circuit is determined based on the first pull-up code, and resistance of the second pull-up circuit is determined based on the second pull-up code.
Inventor(s): Dongin SEO of Suwon-si (KR) for samsung electronics co., ltd., Jaewoong KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhyun BAE of Suwon-si (KR) for samsung electronics co., ltd., Hyeseung YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/20, G11C7/10, G11C7/22
CPC Code(s): G11C7/20
Abstract: a receiver includes a buffer configured to generate an internal data signal by comparing a received data signal with a reference voltage, a decision feedback equalizer configured to generate a sampled signal based on a present value of the internal data signal and on a feedback signal, and configured to provide one of the sampled signal or a first logic level as the feedback signal based on a reset control signal, the sampled signal corresponding to a previous value of the internal data signal, a deserializer configured to generate an output data by deserializing the sampled signal, and a reset control circuit configured to generate the reset control signal based on operating information associated with a write operation of the data signal and configured to provide the reset control signal to the decision feedback equalizer.
Inventor(s): Jaewoo Jeong of Los Altos CA (US) for samsung electronics co., ltd., Tiar Ikhtiar of San Jose CA (US) for samsung electronics co., ltd., Panagiotis Charilaos Filippou of San Jose CA (US) for samsung electronics co., ltd., Chirag Garg of San Jose CA (US) for samsung electronics co., ltd., Mahesh Govind Samant of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G11C11/16, H01F10/32, H10B61/00, H10N50/01, H10N50/10, H10N50/85
CPC Code(s): G11C11/161
Abstract: a magnetic random-access memory (mram) device includes a substrate, a bottom magnetic reference layer on the substrate, a tunnel barrier layer above the bottom magnetic reference layer, and a top magnetic free layer above the tunnel barrier layer. the top magnetic free layer includes a chemical templating layer on the tunnel barrier layer and a magnetic layer on the chemical templating layer. the chemical templating layer includes a binary alloy of fex which may have a bifprototype structure in which y is in a range from 0.9 to 3.3, and the magnetic layer includes a heusler compound having substantially perpendicular magnetic anisotropy.
Inventor(s): Lava Kumar Pulluru of Bengaluru (IN) for samsung electronics co., ltd., Manish Chandra Joshi of Bengaluru (IN) for samsung electronics co., ltd., Parvinder Kumar Rana of Bengaluru (IN) for samsung electronics co., ltd., Poornima Venkatasubramanian of Bengaluru (IN) for samsung electronics co., ltd., Ved Prakash of Bengaluru (IN) for samsung electronics co., ltd., Chaitanya Vavilla of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G11C11/419
CPC Code(s): G11C11/419
Abstract: a memory device and its operation reduce the impact of a parasitic wire resistance and capacitance (rc) in the memory device. at least one of a rise transition and a fall transition of a signal transmitted by a long metal line is sensed by a sense circuit of a signal boosting circuit. at least one of a pull up (pu) circuit and a pull down (pd) circuit of the signal boosting circuit is enabled to speed-up one or both of the rise transition and the fall transition of the signal transmitted by the long metal line. the duration of an operation of one of the pu circuit and the pd circuit may be controlled using a control signal.
Inventor(s): Dam YUN of Suwon-si (KR) for samsung electronics co., ltd., Dongyeon KWAG of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jehyung YOON of Suwon-si (KR) for samsung electronics co., ltd., Sangik CHO of Suwon-si (KR) for samsung electronics co., ltd., Dae-Hoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/30, H03F3/45, H03K17/56
CPC Code(s): G11C16/30
Abstract: a parallel e-fuse device including: a first e-fuse to receive an input voltage and transfer a first fuse current to an output terminal; and a second e-fuse to receive the input voltage and transfer a second fuse current to the output terminal, the first e-fuse includes: a power transistor to control the first fuse current according to a gate voltage; a clamp amplifier to provide a charging current to charge a gate of the power transistor, the charging current being obtained by monitoring a feedback voltage; a balance amplifier to provide a first sinking current to discharge the gate of the power transistor, the first sinking current being obtained by comparing a current sensing signal with a current monitoring signal, wherein the clamp amplifier generates the charging current according to a differential voltage between the feedback voltage and a reference voltage.
Inventor(s): Minjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Wooil KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehun KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun ROH of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaehun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungbae YI of Suwon-si (KR) for samsung electronics co., ltd., Hwangrae LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinmook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G16H20/60
CPC Code(s): G16H20/60
Abstract: an electronic apparatus and a controlling method thereof are provided. the electronic apparatus includes memory storing one or more computer programs, and one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions executed by the one or more processors and wherein the one or more processors configured to acquire nutritional ingredient information corresponding to food information in case of acquiring the food information, acquire candidate food probability information based on the nutritional ingredient information, and acquire final food group capacity information corresponding to the food information based on the nutritional ingredient information and the candidate food probability information.
Inventor(s): Dongjoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyoungran Kim of Suwon-si (KR) for samsung electronics co., ltd., Kwanghyeon Jeong of Suwon-si (KR) for samsung electronics co., ltd., Myeongock Ko of Suwon-si (KR) for samsung electronics co., ltd., Jaeuk Sim of Suwon-si (KR) for samsung electronics co., ltd., Seongbeom Lee of Suwon-si (KR) for samsung electronics co., ltd., Daesung Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/687, H01L21/66, H05F3/06
CPC Code(s): H01L21/68742
Abstract: a carrier dechucking system includes a work carrier including a substrate having a first surface, an opposite second surface with a support film attached, and a ring frame surrounding the substrate. the work carrier is placed on a placement table having a support surface on which a lower surface of the support film is maintained, lifting pins configured to move the work carrier, an ionizer configured to eject ions to the lower surface, and a controller. the controller is configured to control the lifting pins to move the work carrier from the support surface to first and second levels, and to control the ionizer to remove static electricity charged on the support film from the support surface to the first level. at the first level, a surface voltage of the first surface of the substrate is lower than a surface voltage of the lower surface of the support film.
20240347401. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): KYONG HWAN KOH of Suwon-si (KR) for samsung electronics co., ltd., JONGWAN KIM of Cheonan-si (KR) for samsung electronics co., ltd., JUHYEON OH of Asan-si (KR) for samsung electronics co., ltd., YONGKWAN LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/13, H01L21/48, H01L21/56, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L23/13
Abstract: a semiconductor package includes a base substrate that includes a first surface and a second surface that face each other, a plurality of first metal line patterns disposed on the first surface, a plurality of second metal line patterns disposed on the second surface, a plurality of vias that penetrate the base substrate and connect the first metal line patterns to the second metal line patterns, a semiconductor chip disposed on the first surface, and a molding member that covers the first surface and the semiconductor chip. the base substrate includes at least one recess at a corner of the base substrate. the recess extends from the first surface toward the second surface. the molding member includes a protrusion that fills the recess.
Inventor(s): Jingu Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Yongkoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Seokkyu Choi of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/00, H01L23/31, H01L23/538, H01L25/10
CPC Code(s): H01L23/367
Abstract: a semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. a width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.
20240347424. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongsik SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kyongbeom KOH of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung KO of Suwon-si (KR) for samsung electronics co., ltd., Hyonwook RA of Suwon-si (KR) for samsung electronics co., ltd., Dongsoo SEO of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeon SEO of Suwon-si (KR) for samsung electronics co., ltd., Kwangyong YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/78, H01L29/786
CPC Code(s): H01L23/481
Abstract: a semiconductor device may include an active region extending in a first direction; a gate structure extending in a second direction on the active region; a source/drain region on the active region and disposed at least one side of the gate structure; a contact structure on the source/drain region; a device isolation layer surrounding the active region; an interlayer insulating layer on the device isolation layer, the gate structure, and the source/drain region; a vertical power structure penetrating through the device isolation and interlayer insulating layers and connected to the contact structure; a rear power structure electrically connected to the vertical power structure and surrounding an entirety of a lower surface and a portion of a side surface of the vertical power structure; a vertical insulating film between the vertical power structure and the rear power structure; and a rear insulating film covering a side of the rear power structure.
Inventor(s): Hyeonjeong Hwang of Suwon-si (KR) for samsung electronics co., ltd., Kyounglim SUK of Suwon-si (KR) for samsung electronics co., ltd., Seokhyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065, H01L25/10
CPC Code(s): H01L23/49822
Abstract: a semiconductor package includes a semiconductor chip, a lower redistribution layer disposed under the semiconductor chip, the lower redistribution layer including a plurality of lower insulating layers, a plurality of lower redistribution patterns, and a plurality of lower conductive vias, a lower passivation layer disposed under the lower redistribution layer and provided with a recess at a bottom surface of the lower passivation layer, an under bump metallization (ubm) pad disposed in the first recess, a ubm protective layer disposed in the first recess and connected to the lower conductive vias while covering a top surface and opposite side surfaces of the ubm pad, and an outer connecting terminal connected to a bottom surface of the ubm pad. the bottom surface of the ubm pad is positioned at a first depth from the bottom surface of the lower passivation layer.
20240347437. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinho Chun of Suwon-s (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/065, H01L25/10
CPC Code(s): H01L23/49827
Abstract: a semiconductor package includes a redistribution substrate including a plurality of redistribution layers in an insulating layer and including an upper redistribution and a lower redistribution layer, a first pad structure; a second pad structure on the redistribution substrate and connected to the upper redistribution layer; a through-via extending to electrically connect the second pad structure and the plurality of redistribution layers; and a semiconductor chip, wherein the upper redistribution layer includes an upper pattern portion, a first upper pad portion connected to the first pad structure, and a second pad portion having an upper hole through which the through-via extends, the lower redistribution layer includes a lower pattern portion and a lower pad portion on at least one end of the lower pattern portion and having a lower hole through which the through-via extends, and the second pad structure includes a through-hole through which the through-via extends.
Inventor(s): Jang-gn YUN of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Hyunho KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, G11C5/06, H01L25/065, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device including a first conductive pattern having a first connection part and a plurality of first branch parts connected to the first connection part, a second conductive pattern having a second connection part and a plurality of second branch parts connected to the second connection part, a first memory channel structure in contact with a corresponding one of the first branch parts and a corresponding one of the second branch parts, and a gate cutting pattern in contact with the corresponding one of the second branch parts and the first connection part may be provided. the first conductive pattern and the second conductive pattern may be spaced apart from each other.
20240347468. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myungsam Kang of Hwaseong-si (KR) for samsung electronics co., ltd., Youngchan Ko of Seoul (KR) for samsung electronics co., ltd., Jeongseok Kim of Cheonan-si (KR) for samsung electronics co., ltd., Bongju Cho of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L21/56, H01L21/683, H01L23/00, H01L23/31, H01L25/10
CPC Code(s): H01L23/5389
Abstract: a semiconductor package includes a first redistribution structure having a first surface in which a first pad and a second pad are embedded and including a first redistribution layer thereon, and a vertical connection structure including a land layer and a pillar layer. the land layer is embedded in the first surface of the first redistribution structure, and a width of an upper surface of the land layer is narrower than a width of a lower surface of the pillar layer.
Inventor(s): Jaeean Lee of SUWON-SI (KR) for samsung electronics co., ltd., Dahee Kim of SUWON-SI (KR) for samsung electronics co., ltd., Taehoon Lee of SUWON-SI (KR) for samsung electronics co., ltd., Gyujin Choi of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L24/05
Abstract: an upper redistribution wiring layer of a semiconductor package includes a protective layer provided on at least one upper insulating layer and having an opening that exposes at least a portion of an uppermost redistribution wiring among second redistribution wirings, and a bonding pad provided on the uppermost redistribution wiring through the opening. the bonding pad includes a first plating pattern formed on the uppermost redistribution wiring, the first plating pattern including a via pattern provided in the opening and a pad pattern formed on the via pattern to be exposed from the opening, a second plating pattern on the second plating pattern, and a third plating pattern on the second plating pattern.
Inventor(s): Jaeho Ahn of Seoul (KR) for samsung electronics co., ltd., Jiwon KIM of Seoul (KR) for samsung electronics co., ltd., Sungmin HWANG of Hwaseong-si (KR) for samsung electronics co., ltd., Joonsung LIM of Seongnam-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H01L25/18
CPC Code(s): H01L24/08
Abstract: a nonvolatile memory device and a data storage system including the same are provided. the nonvolatile memory device includes: a first structure including at least one first memory plane; and a second structure bonded to the first structure and including at least one second memory plane, wherein the number of the at least one first memory plane included in the first structure is different from the number of the at least one second memory plane included in the second structure.
Inventor(s): Daesik MOON of Suwon-si (KR) for samsung electronics co., ltd., Sangwook PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/498, H10B80/00
CPC Code(s): H01L24/48
Abstract: a memory device comprising: a semiconductor substrate; a plurality of wire bonding pads on the semiconductor substrate and arranged in a first direction; a plurality of signal redistribution patterns connecting first wire bonding pads among the plurality of wire bonding pads to a plurality of signal via pads, respectively, wherein the plurality of signal redistribution patterns are on a first side with respect to the plurality of wire bonding pads in a second direction that is perpendicular to the first direction; and a plurality of power redistribution patterns connected to second wire bonding pads among the plurality of wire bonding pads, respectively, wherein the plurality of power redistribution patterns are on a second side with respect to the plurality of wire bonding pads in the second direction, wherein the first and second directions are parallel with an upper surface of the semiconductor substrate.
20240347499. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongjin Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
CPC Code(s): H01L24/49
Abstract: a semiconductor package includes a package substrate including a power pad and a ground pad that are spaced apart from each other in a first horizontal direction, first and second semiconductor chips on the package substrate, the first and second semiconductor chips being stacked in a stepped shape that extends in a second horizontal direction perpendicular to the first horizontal direction, and a plurality of connection wires that electrically connect the package substrate to the first semiconductor chip and/or the second semiconductor chip. the first semiconductor chip includes a plurality of lower option pads. the second semiconductor chip includes a plurality of upper option pads. the plurality of connection wires include a conductive wire that electrically connects at least one of first and second upper chip pads of the second semiconductor chip to at least one of the lower option pads of the first semiconductor chip.
Inventor(s): Jihyun Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/04, H01L23/31, H01L23/538, H01L25/10
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes a lower redistribution wiring layer having lower redistribution wirings; an encapsulation structure on the lower redistribution wiring layer; a plurality of conductive bumps between the lower redistribution wiring layer and the encapsulation structure; and an adhesive layer attaching the lower redistribution wiring layer and the encapsulation structure. the encapsulation structure includes a core substrate having a cavity formed therein, at least one semiconductor chip in the cavity such that a front surface on which chip pads are formed faces the lower redistribution wiring layer, and an upper redistribution wiring layer covering an upper surface of the core substrate and having upper redistribution wiring layers that are electrically connected to conductive structures of the core substrate.
Inventor(s): Jeongil Lee of Suwon-si (KR) for samsung electronics co., ltd., Byeongchan Kim of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Jumyong Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/48, H01L23/498
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. the first semiconductor chip includes a plurality of through electrodes, first bonding pads provided on a first surface of a first substrate, a first passivation layer provided on the first surface and exposing the first bonding pads, a polishing stop layer pattern provided on a second surface of the first substrate and exposing end portions of the plurality of through electrodes, and second bonding pads provided on the polishing stop layer pattern. the second semiconductor chip includes third bonding pads provided on a first surface of a second substrate, and a second passivation layer provided on the first surface of the second substrate and exposing the third bonding pads. the first bonding pads and the third bonding pads are directly bonded to each other.
20240347524. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonho Jun of Suwon-si (KR) for samsung electronics co., ltd., Kyomin Sohn of Suwon-si (KR) for samsung electronics co., ltd., Duksung Kim of Suwon-si (KR) for samsung electronics co., ltd., Byoungkon Jo of Suwon-si (KR) for samsung electronics co., ltd., Jangseok Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L25/00, H10B80/00
CPC Code(s): H01L25/18
Abstract: a semiconductor package according to an example embodiment of the present disclosure includes: a package substrate; and first to third memory dies disposed on the package substrate and sequentially stacked in a first direction, perpendicular to an upper surface of the package substrate, and the first memory die and the second memory die are attached to each other without a bump, and the second memory die and the third memory die are attached to each other by a plurality of bumps.
20240347537. COMMON OUTPUT IN 3D STACK FET_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mehdi Saremi of Danville CA (US) for samsung electronics co., ltd., Aravindh Kumar of Mountain View CA (US) for samsung electronics co., ltd., Ming He of San Jose CA (US) for samsung electronics co., ltd., Muhammed Ahosan Ul Karim of San Jose CA (US) for samsung electronics co., ltd., Rebecca Park of Mountain View CA (US) for samsung electronics co., ltd., Harsono Simka of Saratoga CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/02, H01L21/8238, H01L29/08
CPC Code(s): H01L27/0922
Abstract: a method for manufacturing a semiconductor device according to one or more embodiments may include growing a first epitaxy layer at a first side and a second side of a stack of gates and channels, applying a sacrificial layer on the first epitaxy layer, growing a second epitaxy layer on the sacrificial layer, removing the sacrificial layer, and depositing a metal layer on the first epitaxy layer and the second epitaxy layer at the first side of the stack of gates and channels.
Inventor(s): Hoemin Jeong of Suwon-si (KR) for samsung electronics co., ltd., Seungjoo Nah of Gwangju (KR) for samsung electronics co., ltd., Heegeun Jeong of Suwon-si (KR) for samsung electronics co., ltd., Wonmo Chun of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14605
Abstract: an image sensor includes first through fourth pixels. the first pixel includes a first color filter, a first photoelectric conversion device (pd), and a first microlens. the second pixel includes a second pd and a first filling portion. the third pixel includes a third pd and a second filling portion. the fourth pixel includes a fourth pd, a second microlens, and a second color filter different from the first color filter. the second pixel is adjacent to the first pixel. the third pixel is adjacent to the second pixel. the second and third pixels do not comprise any one of a red, blue, and green color filter. each of the first and second filling portions is configured to transmit light of wavelengths corresponding to blue, red, and green to the second and third pds, respectively. the first color filter is configured to transmit light of the wavelength corresponding to blue.
Inventor(s): Junoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Munhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseop Yoo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14616
Abstract: an image sensor includes a substrate, a polysilicon-vertical gate, a photoelectric conversion element, a channel, and a floating diffusion region. the substrate has a front surface and a back surface that opposes the front surface. the polysilicon-vertical gate is disposed in an upper region adjacent to the front surface of the substrate and extends into the substrate. the photoelectric conversion element is disposed at a lower position within the substrate with respect to the polysilicon-vertical gate. the channel is disposed adjacent to the polysilicon-vertical gate and doped with dopants of a same conductivity type as the photoelectric conversion element. the floating diffusion region is disposed in the upper region of the substrate and adjacent to the polysilicon-vertical gate in a first parallel direction that is parallel to the front surface of the substrate. the polysilicon-vertical gate, the photoelectric conversion element, and the floating diffusion region constitute a junctionless transfer transistor.
20240347589. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngsoo SONG of SUWON-SI (KR) for samsung electronics co., ltd., Suhyeon KIM of SUWON-SI (KR) for samsung electronics co., ltd., Rooli CHOI of SUWON-SI (KR) for samsung electronics co., ltd., Jihoon PARK of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/02, H01L27/092, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/0649
Abstract: a semiconductor device includes an active region on a substrate and an active pattern extending in a first direction. a device isolation layer surrounds the active pattern. a gate structure extends in a second direction. a source/drain region is on the active pattern. an interlayer insulating layer covers the source/drain region. a contact structure is connected to the source/drain region. a buried conductive structure extends in the first direction, is electrically connected to the contact structure, and passes through the interlayer insulating layer to extend in a third direction. a power delivery structure extends from a lower surface of the substrate towards an upper surface thereof, and is electrically connected to the buried conductive structure. the buried conductive structure includes a body portion extending in the first direction, and an extension portion extending from a region of at least one side surface of the body portion in the second direction.
Inventor(s): Junmo PARK of Suwon-si (KR) for samsung electronics co., ltd., Deokhwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Junsu Kong of Suwon-si (KR) for samsung electronics co., ltd., Yeonho Park of Suwon-si (KR) for samsung electronics co., ltd., Hyungjin Park of Suwon-si (KR) for samsung electronics co., ltd., Sujin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinseok Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/092, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device including a substrate having an active pattern, first and second semiconductor patterns provided on the active pattern vertically spaced apart from each other, a source/drain pattern connected to the first and second semiconductor patterns, a gate electrode between the first and second semiconductor patterns, and a gate insulating pattern enclosing the gate electrode, wherein the gate insulating pattern includes, a high-k dielectric pattern enclosing the gate electrode, an inner spacer between the high-k dielectric pattern and the source/drain pattern, and a mask insulating pattern having an etch selectivity with respect to the inner spacer between the high-k dielectric pattern and the inner spacer.
20240347597. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JINWOO LEE of Suwon-si (KR) for samsung electronics co., ltd., YOUNGKYOU SHIN of Suwon-si (KR) for samsung electronics co., ltd., SUTAE KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device includes a substrate including an active pattern, a first semiconductor pattern on the active pattern, and gate electrodes extending in a first direction and arranged in a second direction intersecting the first direction. a first top surface of the first semiconductor pattern includes first and second corners spaced apart from each other in the first direction. the first top surface of the first semiconductor pattern includes a first portion connecting the first and second corners. a length of the first portion of the first semiconductor pattern is greater than a distance in the first direction between the first corner and the second corner.
20240347609. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): DONGHOON HWANG of Suwon-si (KR) for samsung electronics co., ltd., HYOJIN KIM of Suwon-si (KR) for samsung electronics co., ltd., BYUNGHO MOON of Suwon-si (KR) for samsung electronics co., ltd., MYUNGIL KANG of Suwon-si (KR) for samsung electronics co., ltd., WOOSEOK PARK of Suwon-si (KR) for samsung electronics co., ltd., JAEHO JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/08, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: a semiconductor device includes a substrate including an active pattern, first and second source/drain patterns overlapping with the active pattern, a separation insulating layer between the first and second source/drain patterns, and first and second gate electrodes spaced apart from each other with the separation insulating layer interposed therebetween. a level of a top surface of the separation insulating layer is higher than a level of a top surface of the first gate electrode and a level of a top surface of the second gate electrode.
Inventor(s): Nikhil Sivadas of Boston MA (US) for samsung electronics co., ltd., Yongwoo Shin of Concord MA (US) for samsung electronics co., ltd., Mahdi Amachraa of Cambridge MA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/51, H01L29/49
CPC Code(s): H01L29/517
Abstract: a structure includes a p-doped thin layer and an oxide high-k gate dielectric layer doped with cd, as, cr, pd, sc, v, sn, mo, mn, ti, ge, ag, ni, in, or ga within a fractional (x) limit 0<x<0.25, wherein the thin layer has a thickness of 10 nm or less, and another structure includes a p-doped transition metal dichalcogenide layer with a binary oxide high-k gate dielectric layer doped with v, sn, mo, mn, ti, ge, ag, ni, in, or ga within a fractional (x) limit 0<x<0.2. a method for p-doping a thin layer includes doping an oxide high-k gate dielectric layer with cd, as, cr, pd, sc, v, sn, mo, mn, ti, ge, ag, ni, in, or ga within a fractional (x) limit 0<x<0.25 to thereby p-dope the thin layer by surface charge transfer doping, wherein the thin layer has a thickness of 10 nm or less.
20240347631. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seonhaeng LEE of Suwon-si (KR) for samsung electronics co., ltd., DONGHEE SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H10B12/00
CPC Code(s): H01L29/7831
Abstract: a semiconductor device includes an outer active pattern on a substrate, the outer active pattern having a trench crossing the outer active pattern, an outer word line covering a wall of the trench, an inner active pattern covering the outer word line in the trench, an inner word line covering the inner active pattern in the trench, and a separation insulating pattern interposed between the outer word line and the inner active pattern in the trench. the outer word line and the inner word line are insulated from each other.
Inventor(s): Dooseok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kyeol KWON of Suwon-si (KR) for samsung electronics co., ltd., Youngki LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongkwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/29, H01Q3/06, H01Q21/08
CPC Code(s): H01Q21/293
Abstract: an electronic device includes: a first housing including a first surface and a second surface connected to the first surface and having an area that is smaller than an area of the first surface; a second housing including a third surface and a fourth surface connected to the third surface and having an area that is smaller than an area of the third surface; a hinge structure connecting the first housing and the second housing to be foldable relative to each other at a folding axis between a folded state of the electronic device and an unfolded state of the electronic device; a first antenna array provided at the first surface; and a second antenna array provided at the fourth surface; and a flexible board connecting the first antenna array and the second antenna array, wherein the first antenna array and the second antenna array are configured to form a third antenna array and to form a fourth antenna array, according to whether the electronic device is in the unfolded state or in the folded state.
Inventor(s): Seunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngsik CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/00, H01F27/02, H01F27/28, H02J50/10
CPC Code(s): H02J50/005
Abstract: an electronic device includes a first cover plate, a rear plate including a second cover plate disposed so as to surround at least a portion of the first cover plate, a circuit board disposed inside the rear plate so as to face the first cover plate, a molding member disposed on the inner surface of the second cover plate inside the rear plate and a coil assembly that is at least partially embedded in the molding member.
Inventor(s): Seungshik SHIN of Suwon-si (KR) for samsung electronics co., ltd., Baewon PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungchul PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinsik CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/80, H02J50/12
CPC Code(s): H02J50/80
Abstract: an electronic device is provided. the electronic device includes a battery, a multi-coil circuitry including a first coil and a second coil, magnetic field control circuitry electrically connected to the multi-coil circuitry, a power management module electrically connected to the battery and the magnetic field control circuitry, memory storing one or more computer programs, and one or more processors communicatively coupled to the battery, the multi-coil circuitry, the magnetic field control circuitry, the power management module, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to detect an external electronic device by performing a ping operation using the first coil, identify a type of the detected external electronic device, when the external electronic device is an external electronic device of a first type, wirelessly transmit power to the external electronic device by using the first coil and the second coil, when the external electronic device is an external electronic device of a second-type, wirelessly transmit power through the first coil, identify a magnitude of transmission power transmitted through the first coil, select the first coil or select the first coil and the second coil based on comparing the magnitude of the transmission power with a designated power threshold, and wirelessly transmit power to the external electronic device using the first coil or wirelessly transmit power to the external electronic device using the first coil and second coil.
20240348162. VOLTAGE CONVERTER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghee Kang of Suwon-si (KR) for samsung electronics co., ltd., Hobin Yi of Suwon-si (KR) for samsung electronics co., ltd., Hocheol Chung of Suwon-si (KR) for samsung electronics co., ltd., Woojin Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/07, H02M1/00, H02M3/158
CPC Code(s): H02M3/07
Abstract: a voltage converter includes: a plurality of switches, a switch controller, a first flying capacitor and a second flying capacitor connected to the first flying capacitor, and a third flying capacitor and a fourth flying capacitor each being connected to an output node. the switch controller controls the plurality of switches to alternately perform a first operation and a second operation in order to allow the voltage source to generate a first input voltage.
Inventor(s): Yousung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd., Yohan MOON of Suwon-si (KR) for samsung electronics co., ltd., Seonjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongil YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H01Q3/24, H04B1/04
CPC Code(s): H04B1/0078
Abstract: an electronic device is provided. the electronic device includes a power amplifier (pa). the electronic device includes a first switch. the electronic device includes a second switch. the electronic device includes a plurality of antennas including a first antenna and a second antenna. the electronic device includes first circuitry coupled with the first antenna. the electronic device includes second circuitry capable of being coupled with the second antenna according to control of the second switch. the electronic device includes a radio frequency integrated circuit (rfic). the electronic device includes at least one processor.
Inventor(s): Hyunsang KANG of Suwon-si (KR) for samsung electronics co., ltd., Yohan MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd., Juho VAN of Suwon-si (KR) for samsung electronics co., ltd., Yongjun AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H03F1/02, H03F3/24
CPC Code(s): H04B1/04
Abstract: according to an embodiment, an electronic device may comprise: memory storing instructions, a first power amplifier (pa) selectively connected to at least one of a plurality of modulators through a first switch, a first modulator including a second switch connected between the first switch and a first capacitor and a third switch connected to an output end of a first buck converter and being among the plurality of modulators configured to selectively operate in an envelope tracking (et) mode or an average power tracking (apt) mode, a second modulator including a fourth switch connected between the first switch and a second capacitor and a fifth switch connected to an output end of a second buck converter and being among the plurality of modulators configured to selectively operate in the et mode or the apt mode, and at least one processor, comprising processing circuitry, operatively connected to the first pa, the first modulator, and the second modulator. the instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to: control the first modulator to operate in the apt mode based on identifying a first event associated with network communication, control the first switch to connect the first pa to the first modulator and the second modulator; control the second switch, the third switch, and the fourth switch to turn on; and control the fifth switch to turn off based on the first modulator operating in the apt mode.
Inventor(s): Paul Nicholas Fletcher of Impington (GB) for samsung electronics co., ltd., Donghan Kim of Cambridge (GB) for samsung electronics co., ltd., Fei Tong of Bassingbourn (GB) for samsung electronics co., ltd., Ziming He of Barnet (GB) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H03F1/32, H03F3/24
CPC Code(s): H04B1/0475
Abstract: a distortion apparatus for a power amplifier comprises: pre-distortion circuitry that comprises a memory polynomial look-up-table (lut) circuit; and post-distortion circuitry that updates the pre-distortion circuitry based on an output of the power amplifier. the pre-distortion circuitry comprises a plurality of luts. each lut corresponds to a different memory depth of a memory polynomial of a volterra series. each lut indexed by an instantaneous power of an input sample delayed by an amount corresponds to a respective memory depth of each lut. an output of the memory polynomial lut circuit corresponds to a summation of an output of each lut multiplied by the input sample delayed by the amount corresponding to the respective memory depth of each lut, and an output of the pre-distortion circuitry is provided to the power amplifier.
Inventor(s): Mouna HAJIR of San Diego CA (US) for samsung electronics co., ltd., Mojtaba RAHMATI of San Diego CA (US) for samsung electronics co., ltd., Hyuk Joon KWON of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B1/04
CPC Code(s): H04B1/0475
Abstract: a system and a method are disclosed and include generating a first kernel based on a tap of a first transmission and a plurality of taps of a second transmission; calculating a first weighted coefficient set based on the first kernel; calculating a first self-interference transmission signal estimation based on the first weighted coefficient set; and obtaining a first cancellation signal by subtracting the first self-interference transmission signal estimation from a downlink received signal.
Inventor(s): Jin Hyun SO of San Diego CA (US) for samsung electronics co., ltd., Hyuk Joon KWON of San Diego CA (US) for samsung electronics co., ltd., Kee-Bong SONG of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/0626
Abstract: a system and a method are disclosed. the method includes partitioning channel state information (csi) into one or more discrete elements based on a predetermined dimension; categorizing the partitioned csi into one or more bins having an equal length; and encoding the categorized partitioned csi.
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W76/20
CPC Code(s): H04B7/0626
Abstract: methods and apparatuses for determining transmission configuration indication (tci) states for channel state information reference signals (csi-rss). a method performed by a user equipment (ue) includes receiving, first information about receiving an aperiodic csi-rs when a triggering offset is less than a threshold; receiving, second information including an indicator to indicate whether to apply a first tci state or a second tci state for the aperiodic csi-rs; and receiving the aperiodic csi-rs. the method further includes identifying whether another downlink (dl) signal is present in a same symbol as the aperiodic csi-rs and determining, based on the identification, the first information, or the indicator, to apply the first or second tci state for the aperiodic csi-rs.
Inventor(s): Junsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Minho YANG of Suwon-si (KR) for samsung electronics co., ltd., Taeyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Euichang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Chaeman LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W68/00, H04W72/232
CPC Code(s): H04B7/06952
Abstract: an electronic device is provided. the electronic device includes memory storing one or more computer programs, a wireless communication circuit, and one or more processors communicatively coupled to the memory and the wireless communication circuit, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to receive, from an external device through a physical downlink control channel (pdcch), a first signal including information indicating whether a paging message is present, in response to identifying that the paging message is present, identify whether an identification (id) of the electronic device is present in the paging message received through a physical downlink shared channel (pdsch), in response to identifying that the id of the electronic device is present in the paging message, identify a quality of the first signal and a quality of a synchronization signal block (ssb) received from the external device, and in response to identifying that at least one of the quality of the first signal or the quality of the ssb satisfies specified conditions, determine whether to search for a new reception beam for wireless communication with the external device.
20240348317. REDUCED OVERHEAD BEAM TRACKING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mustafa Furkan Ozkoc of Plano TX (US) for samsung electronics co., ltd., Jianhua Mo of Allen TX (US) for samsung electronics co., ltd., Jeehwan Noh of Suwon-si (KR) for samsung electronics co., ltd., Young Han Nam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W24/10
CPC Code(s): H04B7/0696
Abstract: a method includes selecting, by a base station, a partial search set based on one or more previous measurement reports from a user equipment (ue), the partial search set comprising a set of narrow beams that is a subset of an extended search set associated with an extended search. the method also includes performing, by the base station, a beam tracking search that sweeps the partial search set in order to select a next narrow beam. the method further includes communicating with the ue using the selected next narrow beam.
Inventor(s): Donghwa HAN of Gyeonggi-do (KR) for samsung electronics co., ltd., Seho MYUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwonjong LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Donghun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Min JANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/00, H03M13/23, H03M13/41
CPC Code(s): H04L1/006
Abstract: the disclosure relates to fifth generation (5g) or sixth generation (6g) communication systems to support higher data rates. a receiver of a communication system includes a transceiver configured to receive a signal encoded based on polarization-adjusted convolutional (pac) coding from a transmitter, and a controller configured to calculate branch metrics of branches defined in a trellis associated with the pac, calculate a path metric based on an accumulated sum of the branch metrics, determine a path assigned to each state based on the path metric, and estimate a codeword based on the determined path, wherein a number of paths assigned to each state is dynamically determined according to the number of active states, and wherein the active state includes at least one branch.
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L1/1867, H04W72/1273, H04W72/232
CPC Code(s): H04L1/1887
Abstract: methods and apparatuses for acknowledgment information for multiple sets of cells. a method performed by a user equipment for providing hybrid automatic repeat request acknowledgment (harq-ack) information is provided includes receiving first information for a first set of serving cells including multiple serving cells, first downlink control information (dci) formats, and first pdschs on respective first serving cells. the method further includes determining first harq-ack information corresponding to the first pdschs and a first harq-ack codebook associated with the first dci formats that includes the first harq-ack information. the first harq-ack information includes a negative acknowledgment (nack) for the first pdsch. the nack is appended to harq-ack information corresponding to the first pdschs except for the first pdsch. the method further includes transmitting an uplink channel that provides harq-ack codebooks including the first harq-ack codebook.
Inventor(s): Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Gyeonggi-do (KR) for samsung electronics co., ltd., Seongmok LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00
CPC Code(s): H04L5/0051
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a ue in a wireless communication system includes receiving, from a bs, dci scheduling a pusch of two cws, the dci including information on an association between a ptrs and a dmrs; identifying a ptrs port based on the information; and transmitting, to the bs, the pusch and the ptrs for the pusch. the ptrs is transmitted on the ptrs port.
Inventor(s): Hamid SABER of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00
CPC Code(s): H04L5/0053
Abstract: a system and a method are disclosed for monitoring a pdcch. a method performed by a ue includes i. selecting a coreset from among a set of coresets in a slot; ii. determining a qcl type value of the reference coreset; iii. determining a first set of coresets in the set of coresets in the slot that overlap with the reference coreset and have a same qcl type value as the reference coreset; iv. determining a second set of coresets in the set of coresets in the slot that overlaps with the first set of coresets and has a different qcl type value than the reference coreset; and v. removing, from the set of coresets in the slot, the first and second sets of coresets.
Inventor(s): Anisha MUKHERJEE of Graz (AT) for samsung electronics co., ltd., Aikata AIKATA of Graz (AT) for samsung electronics co., ltd., Ahmet Can MERT of Graz (AT) for samsung electronics co., ltd., Yongwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunmin KWON of Suwon-si (KR) for samsung electronics co., ltd., Maksim DERIABIN of Suwon-si (KR) for samsung electronics co., ltd., Sujoy SINHA ROY of Graz (AT) for samsung electronics co., ltd.
IPC Code(s): H04L9/00, G06F9/48, H04L9/06
CPC Code(s): H04L9/008
Abstract: an apparatus includes: one or more memories configured to store an operation key comprising a re-linearization key and ciphertext comprising a plurality of modules; a controller configured to schedule a homomorphic encryption operation based on the ciphertext, based on at least one of the plurality of modules and a modulus of the ciphertext; and a plurality of operation devices configured to parallelly process respective parts of the homomorphic encryption operation according to a result of the scheduling.
Inventor(s): Andrew Thomas TAUFERNER of Rochester MN (US) for samsung electronics co., ltd., Douglas JOSEPH of Austin TX (US) for samsung electronics co., ltd., Matthew WOLF of Oak Ridge TN (US) for samsung electronics co., ltd.
IPC Code(s): H04L9/08
CPC Code(s): H04L9/0869
Abstract: a computing device includes a memory and a processing device. the memory enters an uninitialized state in response to power being applied to the memory. the processing device is coupled to the memory, and is configured to select a portion of the memory in the uninitialized state to seed a random number generator process. the processing device may alternatively select an uninitialized state of the network hardware that is coupled to the processing device to seed a random number generator process. in one embodiment, the computing device is a compute node in a multi-node processing system, and the memory is a high-bandwidth memory.
Inventor(s): Hoondong NOH of Suwon-si (KR) for samsung electronics co., ltd., Jinhyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Heecheol YANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04B7/0456, H04L5/00, H04L27/18, H04W72/21
CPC Code(s): H04L27/2614
Abstract: a method, performed by a user equipment (ue), of transmitting an uplink (ul) reference signal in a wireless communication system is provided. the method includes receiving first information indicating whether to apply transform precoding and pi/2 binary phase shift keying (bpsk) modulation to a physical uplink shared channel (pusch), receiving second information indicating whether to apply the pi/2 bpsk modulation to an ul demodulation reference signal (dmrs), and identifying a sequence having characteristics of a first peak-to-average power ratio (papr) based on the first information and the second information.
Inventor(s): Ji Hyun PARK of Seongnam-si (KR) for samsung electronics co., ltd., Kwang Sub SON of Suwon-si (KR) for samsung electronics co., ltd., Byoung Tack ROH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L41/0813, G04G21/04, G06F3/0482, G06F3/04842, G06F3/04847, H04L41/22, H04M1/72412, H04M1/72448, H04M19/04, H04W4/50, H04W4/80
CPC Code(s): H04L41/0813
Abstract: a wearable electronic device includes: an input module configured to receive a user manipulation for changing a configuration setting value of a main electronic device; and a communication module configured to transmit a control signal for changing a configuration setting value to the main electronic device.
Inventor(s): Mehrdad SHARIAT of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04L41/14, H04L41/40, H04L43/06, H04L69/28
CPC Code(s): H04L41/14
Abstract: the disclosure relates to a pre-5th-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th-generation (4g) communication system such as long term evolution (lte). disclosed is a method of providing processed analytics data from a plurality of analytics data suppliers to an analytics data consumer, wherein the analytics data consumer takes action on the basis of the processed analytics data only when the processed analytics data from all of the plurality of analytics data suppliers has been received or until a defined period has elapsed.
Inventor(s): Han Wang of Allen TX (US) for samsung electronics co., ltd., Yan Xin of Princeton NJ (US) for samsung electronics co., ltd., Yong Ren of Somerset NJ (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L41/142
CPC Code(s): H04L41/142
Abstract: a method includes generating multiple embedded features representing operational data of network elements in a wireless communication network. the method also includes generating a relationship graph based on the embedded features, the relationship graph representing behavior of the network elements in the wireless communication network. the method also includes detecting one or more anomalies in the wireless communication network using the relationship graph, the one or more anomalies identifying one or more deviations of one or more of the network elements from an expected behavior of the one or more network elements. the method also includes generating network analytics based on the one or more detected anomalies.
Inventor(s): Changmok YANG of Suwon-si (KR) for samsung electronics co., ltd., Chounjong NAM of Suwon-si (KR) for samsung electronics co., ltd., Taeyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungbin MIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Sunkee LEE of Suwon-si (KR) for samsung electronics co., ltd., Eonji LEE of Suwon-si (KR) for samsung electronics co., ltd., Mincheol JEONG of Suwon-si (KR) for samsung electronics co., ltd., Junyeop JUNG of Suwon-si (KR) for samsung electronics co., ltd., Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L47/25
CPC Code(s): H04L47/25
Abstract: electronic devices according to present disclosure may comprise: a communication circuit which supports a plurality of communication links including a first link and a second link through a plurality of frequency bands; and at least one processor, wherein the at least one processor is configured to: distribute data packets to be transmitted at least one of the plurality of communication links, respectively; identify a first transmission rate of the first link and a second transmission rate of the second link; and perform at least one of an adjustment of the transmission rates or an adjustment of the number of distribution of data packets for the first link and the second link so that a difference between transmission times of the data packets distributed to the first link and the second link, respectively, is within a designated time range.
Inventor(s): Chandrashekhar S BYADGI of Bengaluru (IN) for samsung electronics co., ltd., Kartik Anand of Bengaluru (IN) for samsung electronics co., ltd., Praveen Naik S of Bengaluru (IN) for samsung electronics co., ltd., Ashish Kumar of Bengaluru (IN) for samsung electronics co., ltd., Srinidhi N of Bengaluru (IN) for samsung electronics co., ltd., Ramesh Babu Venkat Dabbiru of Bengaluru (IN) for samsung electronics co., ltd., Jyotirmoy Karejee of Bengaluru (IN) for samsung electronics co., ltd., Siva Prased Gundur of Bengaluru (IN) for samsung electronics co., ltd., Eric Ho Ching Yip of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L69/04
CPC Code(s): H04L69/04
Abstract: the present disclosure relates to methods and devices for managing communication of artificial intelligence (ai) data between devices in a computing environment. detecting one or more sets of changes in data values associated with current data frame based on comparison between current data frame and previously generated data frame. further, performing generation of one or more data chunks of an updated data frame, comprising one or more data segments based on the one or more sets of changes, based on one of, a first codec technique and second codec technique. transmitting one or more data chunks to one or more receiver devices based on the respective data chunk satisfying a specified chunk size. transmitting the one or more data chunks generated for updated data frame to one or more receiver devices based on respective data chunk satisfying a specified chunk size.
Inventor(s): Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0268
Abstract: according to various embodiments, an electronic device comprises: a first housing; a second housing slidably coupled to the first housing; a flexible display disposed on a surface formed by the first housing and the second housing; a motor for inserting the flexible display into the second housing, or retracting same from the second housing; an integrated circuit for controlling the voltage related to the motor; at least one sensor; and at least one processor. the at least one processor is configured to: identify data on the temperature related to the flexible display; identify the voltage to be applied to the motor through the integrated circuit; and change the display area of the flexible display.
Inventor(s): Hyosang AN of Suwon-si (KR) for samsung electronics co., ltd., Hwajoong JUNG of Suwon-si (KR) for samsung electronics co., ltd., Beomsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungjin RHO of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jaeheung PARK of Suwon-si (KR) for samsung electronics co., ltd., Kwangseok BYON of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon WON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/55, H04N23/54
CPC Code(s): H04N23/55
Abstract: a camera module according to various embodiments of the disclosure may include: an image sensor (); a substrate () electrically connected to the image sensor (); a bracket () configured to fix the substrate (); and a plate () disposed on the bracket () such that the width () of a surface of the plate () facing the image sensor () includes the width () of an area in which the image sensor () is disposed, thereby shielding at least a part of a space in which the image sensor () is disposed from the outside, wherein the bracket () may be formed by injection molding a material forming the bracket () in a state in which the plate () is inserted into a mold. various other embodiments inferable from the specification are also possible
Inventor(s): Amit Kumar SONI of Bengaluru (IN) for samsung electronics co., ltd., Debayan MUKHERJEE of Bengaluru (IN) for samsung electronics co., ltd., Swadha JAISWAL of Bengaluru (IN) for samsung electronics co., ltd., Rahul KUMAR of Bengaluru (IN) for samsung electronics co., ltd., Sai Pranav MATHIVANAN of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04N23/60, H04N9/82, H04N19/46, H04N23/62, H04N23/667
CPC Code(s): H04N23/64
Abstract: a method for capturing a video in a user equipment (ue) includes capturing a plurality of first frames of a video of a scene in a first mode upon detecting an initiation of a video capture; analyzing the captured plurality of first frames in the first mode to determine at least one second mode from a plurality of second modes for the video capture; capturing a plurality of second frames of the video in accordance with the at least one second mode from the plurality of second modes; recording metadata associated with the captured plurality of second frames in the second mode; applying the metadata associated with the plurality of second frames onto the plurality of first frames to generate a plurality of modified first frames; and merging the plurality of modified first frames with the plurality of second frames to generate an output video.
Inventor(s): Jongkeun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jugun PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongwon YEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/73, G06V10/26, H04N23/611, H04N23/71
CPC Code(s): H04N23/73
Abstract: an electronic device according to various embodiments of the present disclosure includes a camera, a processor, and memory storing instructions. the instructions, when executed by the processor, cause the electronic device obtain an image via the camera, identify at least one area in the image by performing segmentation on the image, the at least one area respectively corresponding to at least one object included in the image, obtain a brightness of the at least one area, identify at least one weight respectively corresponding to the at least one object, and control an exposure of the camera based on the brightness of the at least one area and the at least one weight.
Inventor(s): Junseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Raeyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Keun Joo PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongki SON of Suwon-si (KR) for samsung electronics co., ltd., Se-Hoon LIM of Suwon-si (KR) for samsung electronics co., ltd., Hee-Jae JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/79, H04N25/47, H04N25/77
CPC Code(s): H04N25/79
Abstract: a dynamic vision sensor (dvs) including a plurality of substrates electrically connected to one another and stacked vertically includes a photoelectric conversion device configured to generate charges in response to incident light from an external environment that is external to the dvs sensor, a bipolar junction transistor (bjt) device including a base connected to the photoelectric conversion device and configured to output a current based on amplifying a current output from the photoelectric conversion device, and a dvs pixel circuit that detects a change in intensity of the incident light and to output an event signal based on the current. the photoelectric conversion device is on a first substrate among the plurality of substrates. at least part of the dvs pixel circuit is on a different substrate from the first substrate among the plurality of substrates.
Inventor(s): Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd., Dongyeon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/00, H04B7/185, H04L67/51
CPC Code(s): H04W8/005
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose systems and methods for ensuring that a network function (nf) supporting correct uncrewed aerial system network function (uas nf) functionality is selected by an access and mobility management function (amf) and/or session management function during authentication and authorization of uncrewed aerial vehicle (uav).
Inventor(s): Mehrdad SHARIAT of Middlesex (GB) for samsung electronics co., ltd., Jungshin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/00, H04L67/55, H04W4/06, H04W4/24
CPC Code(s): H04W8/005
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method of managing analytics data in a telecommunication network is provided. the method includes a consumer network function, (nf), determines how analytics data from a plurality of individual sources is collected and analyzed in one of a) a distributed manner from a plurality of network data analytics functions (nwdaf), b) a centralized manner by aggregating analytics data from the plurality of nwdafs, before analyzing it at an aggregator nwdaf, or c) a mixture of a) and b) above.
Inventor(s): Janggun BAE of Suwon-si (KR) for samsung electronics co., ltd., Inshik KANG of Suwon-si (KR) for samsung electronics co., ltd., Sukkyung YOON of Suwon-si (KR) for samsung electronics co., ltd., Kyoungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Yunbeom LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/04, H04W72/51, H04W88/06
CPC Code(s): H04W24/04
Abstract: according to an embodiment, an electronic device may comprise memory and at least one processor, comprising processing circuitry. the memory may store at least one instruction that, when executed by at least one processor, individually and/or collectively, causes the electronic device to: perform a call service based on a first network communication corresponding to a first subscriber identification module (sim) in a state in which a first portion of rf resources of the electronic device is allocated for the first network communication corresponding to the first sim, and a second portion, at least partially different from the first portion, of the rf resources is allocated for a second network communication corresponding to a second sim different from the first sim; identify a service failure in the second network communication corresponding to the second sim while performing the call service based on the first network communication based on the first sim; based on the service failure, perform a scan for the second network communication corresponding to the second sim one or more times; and perform at least one operation for restricting the scan for the second network communication based on a cell for the second network communication not being identified as a result of the scan one or more times.
Inventor(s): Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Suha YOON of Suwon-si (KR) for samsung electronics co., ltd., Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Seho MYUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04L5/00, H04L27/26
CPC Code(s): H04W56/0015
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure relates to a method performed by a base station in a wireless communication system and, particularly, to a method and a device for performing same, the method comprising the steps of: identifying a frequency band; determining a size of a subcarrier spacing (scs) to be used on the frequency band if a size of the frequency band is smaller than a preconfigured bandwidth size; generating a synchronization signal block (ssb) on the basis of the determined size of the scs; and transmitting the ssb on the frequency band.
Inventor(s): Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W40/22, H04W76/20
CPC Code(s): H04W60/04
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for operating a terminal according to the present disclosure comprises the steps of: transmitting, to a first base station of a first network, a registration request message including an indicator indicating that a terminal has local access to a second network; receiving, from the first base station, a policy update request message including a cell identifier or an area identifier associated with the second network; updating a local access policy for the second network on the basis of the policy update request message; and connecting to a second base station of the second network through the local access on the basis of the updated policy.
Inventor(s): Yunchuan YANG of Beijing (CN) for samsung electronics co., ltd., Longhai ZHAO of Beijing (CN) for samsung electronics co., ltd., Qi XIONG of Beijing (CN) for samsung electronics co., ltd., He WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, G01S5/02, H04W24/02
CPC Code(s): H04W64/00
Abstract: a node in a wireless communication system and a method performed by the same are provided. the method includes obtaining information related to a channel between a user equipment (ue) and a base station, and extracting first feature information based on the information related to the channel between the ue and the base station, the first feature information being used to determine information of a location of the ue using an artificial intelligence (ai) model and/or to monitor whether the ai model needs to be updated.
Inventor(s): Yanru WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Xiaoning MA of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/04
CPC Code(s): H04W72/04
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a first node, a second node, a method performed by first node and a method performed by second node in a wireless communication system are provided. the method performed by first node includes receiving a message regarding at least one of a measurement report of a ue, a suggested target cell for ue, a suggested handover execution condition for ue, and a pdcp sequence number for ue from a second node, and determining information for handover of ue based on the received message. the invention can improve efficiency of handover and/or avoid redundancy for data forwarding during handover.
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/12, H04W72/232
CPC Code(s): H04W72/12
Abstract: apparatuses and methods for dormancy indication via multi-cell scheduling. a method includes receiving first information for a set of serving cells and a downlink control information (dci) format. the dci format schedules reception of a physical downlink shared channel (pdsch) on a first serving cell from the set of serving cells, includes a frequency domain resource allocation (fdra) field providing a first value that is associated with the first serving cell and is different from predetermined values, and provides an indication for a dormant or a non-dormant active downlink (dl) bandwidth part (bwp) for each serving cell from second serving cells. the method further includes receiving the pdsch on the first serving cell and determining the dormant or non-dormant active dl bwp for each serving cell from the second serving cells based on the indication.
Inventor(s): Hamid SABER of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Yuan-Sheng CHENG of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L1/1607, H04L5/00, H04W36/18, H04W74/0808
CPC Code(s): H04W72/1268
Abstract: a method and user equipment are provided. the method includes receiving a scheduling of a transmission on a target cell that collides with a scheduled transmission on a source cell; determining a time duration from an ending symbol of a physical downlink control channel (pdcch) scheduling the transmission on the target cell to a first symbol of the transmission on the source cell; determining a time value based on a physical uplink shared channel (pusch) preparation time and a subcarrier spacing (scs) configuration; and determining that the time duration is greater than the time value and, in response, performing the transmission on the target cell and cancelling the transmission on the source cell.
Inventor(s): Chaithanya Sai G of Bengaluru (IN) for samsung electronics co., ltd., Chetan Ramesh Ganig of Bengaluru (IN) for samsung electronics co., ltd., Prasad Basavaraj Dandra of Bengaluru (IN) for samsung electronics co., ltd., Sivasankar Comaravelou of Bengaluru (IN) for samsung electronics co., ltd., Danish Ehsan Hashmi of Bengaluru (IN) for samsung electronics co., ltd., Lalith Kumar of Bengaluru (IN) for samsung electronics co., ltd., Utsav Sinha of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W74/0816, H04W60/06
CPC Code(s): H04W74/0816
Abstract: a method for handling collision of signaling messages between a user equipment (ue) and a network entity is disclosed. the method includes transmitting a first signaling message comprising a first access type and a second signaling message comprising a second access type different from the first access type. the ue is registered on a network for the first access type and the second access type. the method also includes determining that the first access type and the second access type correspond to different access types. the method further includes processing the first signaling message and the second signaling message based on the determination by processing of the first signaling message and the second signaling message in parallel or re-triggering one or more of the first signaling message or the second signaling message.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04W76/19, H04W76/38
CPC Code(s): H04W76/28
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of controlling timer t3440 or t3540 in a user equipment, ue, the timer being operable to guard a time during which the ue maintains a certain type of connection to a telecommunication network, wherein the timer has a default first time period in the absence of a first condition and a second condition being met, wherein if both the first condition and the second condition are met, then the first default time period is extended to a second time period.
Inventor(s): Heejun RYU of Suwon-si (KR) for samsung electronics co., ltd., Sungkeun KOO of Suwon-si (KR) for samsung electronics co., ltd., Dongju YEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00, H05K1/18
CPC Code(s): H05K5/0056
Abstract: an electronic device includes a plate including an inner surface exposed to an internal space of the electronic device, a circuit board facing the inner surface of the plate, the circuit board including a first surface and a second surface which is opposite to the first surface of the circuit board and faces the inner surface of the plate, an electronic component on the first surface of the circuit board, a sealing member on the second surface of the circuit board, and a waterproof member which is on the inner surface of the plate and is configured to be assembled with the sealing member. the sealing member assembled with the waterproof member includes the sealing member in contact with the waterproof member.
Inventor(s): SUBIN LEE of Suwon-si (KR) for samsung electronics co., ltd., HYOKYEOM KIM of Suwon-si (KR) for samsung electronics co., ltd., JAE HYUN KANG of Suwon-si (KR) for samsung electronics co., ltd., JONGWON SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B10/00
CPC Code(s): H10B10/18
Abstract: a semiconductor device is provided. the semiconductor device includes: a substrate including first and second active regions wherein a boundary is provided between the first and second active regions, a device isolation layer on the substrate in a trench between the first and second active regions, a first channel pattern and a first source/drain pattern on the first active region, a second channel pattern and a second source/drain pattern on the second active region, a first gate electrode on the first channel pattern and extending across the first active regions, a second gate electrode on the second channel pattern and extending across the second active regions, and active contacts on the first and second source/drain patterns. the device isolation layer includes a protrusion structure between the first active regions. the protrusion structure is adjacent to the boundary.
20240349483. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SOHYUN PARK of Suwon-si (KR) for samsung electronics co., ltd., Inwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device includes an active pattern on a substrate; a bit line structure on a central portion of the active pattern; a first spacer structure and a second spacer structure disposed on a first sidewall and a second sidewall, respectively, of the bit line structure, the first sidewall and the second sidewall of the bit line structure facing each other in the first direction; a lower contact plug on each of opposite end portions of the active pattern; and an upper contact plug on the lower contact plug. the upper contact plug may include a conductive pattern; and a conductive spacer covering a lower surface of the conductive pattern, wherein the conductive spacer contacts an outer sidewall of the first spacer structure, and does not contact an outer sidewall of the second spacer structure.
20240349484. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taeyoung EOM of Suwon-si (KR) for samsung electronics co., ltd., Hyungmin KO of Suwon-si (KR) for samsung electronics co., ltd., Boryeon BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device includes a substrate including a memory cell region, a first bit line on a center region of the memory cell region, a first landing pad on the first bit line, a first bit line capping pattern between the first bit line and first landing pad, a second bit line on an edge region of the memory cell region, a second landing pad on the second bit line, and a second bit line capping pattern between the second bit line and the second landing pad. the first and second bit line capping patterns vertically overlap the first and second landing pads, respectively. a distance from the top of the first bit line capping pattern from the top of the first landing pad is greater than a distance from the top of the second bit line capping pattern to from the top of the second landing pad.
Inventor(s): Sungnam Lyu of Suwon-si (KR) for samsung electronics co., ltd., Hyojung Noh of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Yang of Suwon-si (KR) for samsung electronics co., ltd., Byounghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Eulji Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/34
Abstract: a gate structure may include a first conductive pattern, a second conductive pattern on the first conductive pattern and including polysilicon doped with impurities, and a gate insulation pattern on sidewalls of the first and second conductive patterns. a capping layer including a semiconductor material or an insulating material may be disposed under the first conductive pattern. the first conductive pattern may include metal grains. at least one of the metal grains may extend from an upper surface of the capping layer to a lower surface of the second conductive pattern, and may contact the upper surface of the capping layer and the lower surface of the second conductive pattern.
20240349490. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Huije RYU of SUWON-SI (KR) for samsung electronics co., ltd., Hyungki CHO of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device includes a bit line that extends in a first direction, semiconductor patterns disposed on the bit line and spaced apart from each other in the first direction and each including a first vertical part, a second vertical part, and a horizontal part, first and second word lines disposed on the horizontal part and respectively adjacent to the first and second vertical parts, and a semiconductor dielectric pattern disposed on the bit line and between the semiconductor patterns. the semiconductor dielectric pattern includes a lower capping pattern, sidewall dielectric patterns spaced apart from each other in the first direction on the lower capping pattern, an air gap between the sidewall dielectric patterns, and an upper capping pattern disposed on the sidewall dielectric patterns. top surfaces of the sidewall dielectric patterns are at the same height as top surfaces of the first and second vertical parts.
20240349491. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myeong-Dong Lee of Suwon-si (KR) for samsung electronics co., ltd., Jongmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Taejin Park of Suwon-si (KR) for samsung electronics co., ltd., Seung-Bo Ko of Suwon-si (KR) for samsung electronics co., ltd., Hui-Jung Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: an example semiconductor memory device includes first and second active patterns, which are extended in a first direction and are disposed side by side in a second direction. each of the first and second active patterns includes first and second edge portions, which are spaced apart from each other in the first direction. a pair of word lines are disposed to cross each of the first and second active patterns, a pair of bit lines are disposed on each of the first and second active patterns and are extended in a third direction, and a storage node contacts on the first edge portion of the first active pattern. when measured in the second direction, a first width of the storage node contact at a first level is larger than a second width at a second level. the first level is lower than the second level.
20240349492. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): MYEONG-DONG LEE of Suwon-si (KR) for samsung electronics co., ltd., SEUNG-BO KO of Suwon-si (KR) for samsung electronics co., ltd., KEUNNAM KIM of Suwon-si (KR) for samsung electronics co., ltd., JONGMIN KIM of Suwon-si (KR) for samsung electronics co., ltd., HUI-JUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., TAEJIN PARK of Suwon-si (KR) for samsung electronics co., ltd., DONGHYUK AHN of Suwon-si (KR) for samsung electronics co., ltd., KISEOK LEE of Suwon-si (KR) for samsung electronics co., ltd., MINYOUNG LEE of Suwon-si (KR) for samsung electronics co., ltd., INHO CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: a semiconductor memory device include first and second active patterns extending in a first direction and spaced apart from each other in a second direction crossing the first direction. the first and second active patterns include a first and second edge portions spaced apart from each other in the first direction, and a center portion therebetween. bit line node contacts are on the center portions. bit lines are on the bit line node contacts and extend in a third direction crossing the first and second directions. the center portions of the first and second active patterns are sequentially disposed in the second direction. each of the bit line node contacts has a first width at a level of a top surface, a second width at a level of a bottom surface, and a third width between the top and bottom surfaces less than the first and second widths.
Inventor(s): Suk YOUN of Suwon-si (KR) for samsung electronics co., ltd., Taehyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung TANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B20/00
CPC Code(s): H10B20/387
Abstract: an integrated circuit includes a read only memory (rom) cell which includes an on-cell. the on-cell includes: a first source/drain region and a second source/drain region; a frontside contact between the first source/drain region and a bit line on a front side of the on-cell; and a backside contact between the second source/drain region and a power line on a back side of the on-cell. the bit line is configured to provide a bit line signal to the on-cell, and the power line is configured to provide a power supply voltage signal to the on-cell. the bit line and the power line are vertically aligned with each other.
Inventor(s): Jungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Ji-Sung KIM of Suwon-si (KR) for samsung electronics co., ltd., Han Jin LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/30, H01G4/10
CPC Code(s): H10B53/30
Abstract: a capacitor according to at least one embodiment may include a first electrode and a second electrode spaced apart from each other, and a dielectric layer disposed between the first electrode and the second electrode and including a ferroelectric layer and an auxiliary portion disposed in the ferroelectric layer, wherein an energy band gap eg of the auxiliary portion may be lower than about 4.0 ev.
Inventor(s): Moorym CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sunil SHIM of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo PAEK of Suwon-si (KR) for samsung electronics co., ltd., Jimin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/00, H01L25/18, H10B41/27, H10B43/27
CPC Code(s): H10B80/00
Abstract: a semiconductor device includes bonded circuit and cell regions. the cell region includes a substrate, a base memory portion, and a bonding memory portion. here, base memory portion includes a first gate stacking structure on the substrate and having first and second surfaces, a first channel structure penetrating the first gate stacking structure, and a base bonding pad on the second surface and connected to the first channel structure. the bonding memory portion includes a second gate stacking structure having a third surface bonded to the base memory portion and a fourth surface bonded to the circuit region, a second channel structure penetrating the second gate stacking structure, a first bonding pad connected to the second channel structure in the third surface and bonded to the base bonding pad, and a second bonding pad connected to the second channel structure in the fourth surface and bonded to the circuit region.
Inventor(s): JUN HO PARK of Suwon-si (KR) for samsung electronics co., ltd., BYOUNG JAE BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N50/01, G11C11/16, H10B61/00, H10N50/10, H10N50/80
CPC Code(s): H10N50/01
Abstract: a magnetic memory device and a method for fabricating the same are provided. the magnetic memory device includes a substrate, a lower insulating layer on the substrate, a memory cell including a first magnetic pattern, a tunnel barrier pattern and a second magnetic pattern, which are sequentially stacked on the lower insulating layer, and a re-deposition insertion layer extending along an upper surface of the lower insulating layer from a side of the memory cell, wherein the re-deposition insertion layer includes a re-deposition insulating layer, a mixed layer and a re-deposition byproduct layer, which are sequentially stacked on the lower insulating layer, and the mixed layer includes both a material included in the re-deposition insulating layer and a material included in the re-deposition byproduct layer.
Inventor(s): Jaewoo Jeong of San Jose CA (US) for samsung electronics co., ltd., Tiar Ikhtiar of San Jose CA (US) for samsung electronics co., ltd., Panagiotis Charilaos Filippou of Fremont CA (US) for samsung electronics co., ltd., Chirag Garg of San Jose CA (US) for samsung electronics co., ltd., See-Hun Yang of Morgan Hill CA (US) for samsung electronics co., ltd., Mahesh Govind Samant of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H10N50/80, H01F10/32, H10B61/00, H10N50/01, H10N50/20, H10N50/85
CPC Code(s): H10N50/80
Abstract: a magnetic memory device includes a substrate, a thermally stable nitride seed layer substantially oriented in a (001) direction above the substrate, a chemical templating layer above the thermally stable nitride seed layer, and a magnetic layer above the chemical templating layer. the chemical templating layer includes a binary alloy having a cscl prototype structure, and the magnetic layer includes a heusler compound having perpendicular magnetic anisotropy (pma).
20240349621. MAGNETIC MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongjae Kim of Suwon-si (KR) for samsung electronics co., ltd., Kuhoon Chung of Seoul (KR) for samsung electronics co., ltd., Gwanhyeob Koh of Seoul (KR) for samsung electronics co., ltd., Bae-Seong Kwon of Incheon (KR) for samsung electronics co., ltd., Kyungtae Nam of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N50/80, H10B61/00, H10N50/01
CPC Code(s): H10N50/80
Abstract: a magnetic memory device includes a lower contact plug on a substrate and a data storage structure on the lower contact plug. the data storage structure includes a bottom electrode, a magnetic tunnel junction pattern, and a top electrode that are sequentially stacked on the lower contact plug. the lower contact plug and the data storage structure have a first thickness and a second thickness, respectively, in a first direction perpendicular to a top surface of the substrate. the first thickness of the lower contact plug is about 2.0 to 3.6 times the second thickness of the data storage structure.
Inventor(s): Jaewoo Jeong of Los Altos CA (US) for samsung electronics co., ltd., Tiar Ikhtiar of San Jose CA (US) for samsung electronics co., ltd., Panagiotis Charilaos Filippou of Fremont CA (US) for samsung electronics co., ltd., Chirag Garg of San Jose CA (US) for samsung electronics co., ltd., Mahesh Govind Samant of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H10N50/85, H10B61/00, H10N50/01, H10N50/10
CPC Code(s): H10N50/85
Abstract: a magnetic memory device includes a substrate, a seed layer above the substrate, a chemical templating layer above the seed layer, and a first magnetic layer above the chemical templating layer. the seed layer includes scn, mnn, or mgo substantially oriented in (001) direction. the chemical templating layer includes a binary alloy having a cuau prototype structure or a bifprototype structure. the first magnetic layer includes a heusler compound having perpendicular magnetic anisotropy.
Inventor(s): Won Joon CHO of Suwon-si (KR) for samsung electronics co., ltd., Daesu LEE of Pohang-si (KR) for samsung electronics co., ltd., Yongjoo JO of Pohang-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N50/85, H10B61/00
CPC Code(s): H10N50/85
Abstract: a spin orbit torque (spin orbit torque, sot) material may include a substrate and an epitaxial thin film including a plurality of sub-stacks on the substrate, a manufacturing method of the sot material, and a magnetic memory device including the sot material are provided.
SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- A46B17/06
- A46B9/00
- A46B9/02
- A46B15/00
- B08B3/10
- B08B5/04
- B08B7/02
- H01L21/67
- CPC A46B17/06
- Samsung electronics co., ltd.
- A47L11/40
- A47L9/28
- CPC A47L11/4011
- A47L15/50
- CPC A47L15/502
- A61B5/024
- A61B5/00
- CPC A61B5/02427
- A61L9/20
- A61L9/014
- B01D53/00
- B01D53/04
- B01D53/88
- B09B3/35
- B09B3/38
- B09B3/40
- B09B101/70
- CPC A61L9/205
- B01D39/10
- A47J36/38
- C09D183/04
- CPC B01D39/10
- B02C23/26
- CPC B09B3/35
- B25J13/06
- B25J9/00
- CPC B25J13/06
- D06F33/34
- D06F103/40
- D06F105/02
- CPC D06F33/34
- D06F34/18
- D06F34/28
- D06F103/02
- CPC D06F34/18
- F25D29/00
- F25D17/06
- CPC F25D29/00
- G01S5/10
- G01S11/06
- H04L5/00
- H04W56/00
- H04W64/00
- CPC G01S5/10
- G05D1/622
- CPC G05D1/637
- G05F1/575
- G09G3/20
- CPC G05F1/575
- G06F1/16
- A44C9/00
- CPC G06F1/163
- CPC G06F1/1681
- G06F3/01
- A01K29/00
- G16Y20/10
- G16Y40/20
- CPC G06F3/011
- G06F3/041
- G06N3/0464
- G06N3/08
- CPC G06F3/0418
- G06F3/046
- H05K1/02
- H05K1/14
- CPC G06F3/046
- G06F3/0484
- G06F3/0481
- H04M1/72403
- H04M1/72469
- CPC G06F3/0484
- G06F3/04886
- G06F3/04842
- CPC G06F3/04886
- G06F3/06
- G06F12/0804
- G06F12/0811
- CPC G06F3/0619
- CPC G06F3/0652
- G06F8/65
- CPC G06F8/65
- G06F9/50
- G06F9/48
- G06F9/54
- CPC G06F9/5027
- G06F11/07
- G06F11/34
- CPC G06F11/0772
- G06F11/10
- CPC G06F11/1076
- G06F12/02
- CPC G06F12/0223
- G06F13/16
- CPC G06F13/1668
- G06F21/45
- G06F21/32
- CPC G06F21/45
- G06F30/392
- CPC G06F30/392
- G06N3/04
- CPC G06N3/08
- G06N3/082
- CPC G06N3/082
- G06T7/579
- G06T3/18
- G06T7/194
- CPC G06T7/579
- G06T15/10
- G03B21/14
- G06T19/00
- G06T19/20
- CPC G06T15/10
- G06T17/20
- G06T7/11
- G06V10/74
- CPC G06T17/20
- G06T5/80
- H04N13/344
- CPC G06T19/006
- G07B15/00
- G06Q20/32
- G06Q20/38
- CPC G07B15/00
- G09G3/32
- CPC G09G3/32
- G11C5/14
- CPC G11C5/147
- G11C7/20
- G11C7/10
- G11C7/22
- CPC G11C7/20
- G11C11/16
- H01F10/32
- H10B61/00
- H10N50/01
- H10N50/10
- H10N50/85
- CPC G11C11/161
- G11C11/419
- CPC G11C11/419
- G11C16/30
- H03F3/45
- H03K17/56
- CPC G11C16/30
- G16H20/60
- CPC G16H20/60
- H01L21/687
- H01L21/66
- H05F3/06
- CPC H01L21/68742
- H01L23/13
- H01L21/48
- H01L21/56
- H01L23/00
- H01L23/31
- H01L23/498
- CPC H01L23/13
- H01L23/367
- H01L23/538
- H01L25/10
- CPC H01L23/367
- H01L23/48
- H01L29/06
- H01L29/417
- H01L29/423
- H01L29/66
- H01L29/775
- H01L29/78
- H01L29/786
- CPC H01L23/481
- H01L25/065
- CPC H01L23/49822
- CPC H01L23/49827
- H01L23/528
- G11C5/06
- H10B43/10
- H10B43/27
- H10B43/35
- H10B80/00
- CPC H01L23/5283
- H01L21/683
- CPC H01L23/5389
- CPC H01L24/05
- H01L25/18
- CPC H01L24/08
- CPC H01L24/48
- CPC H01L24/49
- H01L23/04
- CPC H01L25/0655
- CPC H01L25/0657
- H01L25/00
- CPC H01L25/18
- H01L27/092
- H01L21/02
- H01L21/8238
- H01L29/08
- CPC H01L27/0922
- H01L27/146
- CPC H01L27/14605
- CPC H01L27/14616
- H01L27/02
- CPC H01L29/0649
- CPC H01L29/0673
- CPC H01L29/41733
- H01L29/51
- H01L29/49
- CPC H01L29/517
- H10B12/00
- CPC H01L29/7831
- H01Q21/29
- H01Q3/06
- H01Q21/08
- CPC H01Q21/293
- H02J50/00
- H01F27/02
- H01F27/28
- H02J50/10
- CPC H02J50/005
- H02J50/80
- H02J50/12
- CPC H02J50/80
- H02M3/07
- H02M1/00
- H02M3/158
- CPC H02M3/07
- H04B1/00
- H01Q3/24
- H04B1/04
- CPC H04B1/0078
- H03F1/02
- H03F3/24
- CPC H04B1/04
- H03F1/32
- CPC H04B1/0475
- H04B7/06
- CPC H04B7/0626
- H04W76/20
- H04W68/00
- H04W72/232
- CPC H04B7/06952
- H04W24/10
- CPC H04B7/0696
- H04L1/00
- H03M13/23
- H03M13/41
- CPC H04L1/006
- H04L1/1867
- H04W72/1273
- CPC H04L1/1887
- CPC H04L5/0051
- CPC H04L5/0053
- H04L9/00
- H04L9/06
- CPC H04L9/008
- H04L9/08
- CPC H04L9/0869
- H04L27/26
- H04B7/0456
- H04L27/18
- H04W72/21
- CPC H04L27/2614
- H04L41/0813
- G04G21/04
- G06F3/0482
- G06F3/04847
- H04L41/22
- H04M1/72412
- H04M1/72448
- H04M19/04
- H04W4/50
- H04W4/80
- CPC H04L41/0813
- H04L41/14
- H04L41/40
- H04L43/06
- H04L69/28
- CPC H04L41/14
- H04L41/142
- CPC H04L41/142
- H04L47/25
- CPC H04L47/25
- H04L69/04
- CPC H04L69/04
- H04M1/02
- CPC H04M1/0268
- H04N23/55
- H04N23/54
- CPC H04N23/55
- H04N23/60
- H04N9/82
- H04N19/46
- H04N23/62
- H04N23/667
- CPC H04N23/64
- H04N23/73
- G06V10/26
- H04N23/611
- H04N23/71
- CPC H04N23/73
- H04N25/79
- H04N25/47
- H04N25/77
- CPC H04N25/79
- H04W8/00
- H04B7/185
- H04L67/51
- CPC H04W8/005
- H04L67/55
- H04W4/06
- H04W4/24
- H04W24/04
- H04W72/51
- H04W88/06
- CPC H04W24/04
- CPC H04W56/0015
- H04W60/04
- H04W40/22
- CPC H04W60/04
- G01S5/02
- H04W24/02
- CPC H04W64/00
- H04W72/04
- CPC H04W72/04
- H04W72/12
- CPC H04W72/12
- H04W72/1268
- H04L1/1607
- H04W36/18
- H04W74/0808
- CPC H04W72/1268
- H04W74/0816
- H04W60/06
- CPC H04W74/0816
- H04W76/28
- H04W76/19
- H04W76/38
- CPC H04W76/28
- H05K5/00
- H05K1/18
- CPC H05K5/0056
- H10B10/00
- CPC H10B10/18
- CPC H10B12/315
- CPC H10B12/34
- CPC H10B12/482
- CPC H10B12/485
- H10B20/00
- CPC H10B20/387
- H10B53/30
- H01G4/10
- CPC H10B53/30
- H10B41/27
- CPC H10B80/00
- H10N50/80
- CPC H10N50/01
- H10N50/20
- CPC H10N50/80
- CPC H10N50/85
