SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on March 28th, 2024
SAMSUNG ELECTRONICS CO., LTD.: 164 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H01L23/00 (14), H10B43/27 (13), H01L29/775 (12), H01L24/16 (11), H10B80/00 (11)
With keywords such as: layer, device, including, surface, direction, configured, semiconductor, based, information, and substrate in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
20240099508.COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangwon YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaegyeong MA of Suwon-si (KR) for samsung electronics co., ltd., Chulwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47J36/38, A47J27/00, A47J36/10
Abstract: a cooking apparatus includes a main body including an electronic chamber and a front plate disposed on a front side of the electronic chamber, a control box detachably mounted on a front side of the front plate, the control box including a case and an inlet panel disposed on an upper portion of the case to be in communication with outside of the main body, a plate hole formed in the front plate to communicate with the control box and the electronic chamber, and a moisture inflow prevention member disposed on an upper side of the electronic chamber to prevent moisture introduced from the inlet panel from entering the electronic chamber through the plate hole.
Inventor(s): Taegwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo HA of Suwon-si (KR) for samsung electronics co., ltd., Kihwan KWON of Suwon-si (KR) for samsung electronics co., ltd., Seokman HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/04, A47L9/02
Abstract: a cleaner head is provided. the cleaner head includes: a nozzle; a case disposed close to an inlet of the nozzle; and a brush rotatably disposed in the case, wherein the case includes an air passage groove disposed in an outer side surface of the case and having a passage formed for the air to flow from an edge region of the case toward a surface to-be-cleaned.
Inventor(s): Jiyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Byunghwan KO of Suwon-si (KR) for samsung electronics co., ltd., Seunghee YI of Suwon-si (KR) for samsung electronics co., ltd., Jeawon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunggee HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/30, A47L15/42
Abstract: a dishwasher according to an embodiment of the disclosure includes a main body, a tub disposed inside the main body, having a washing chamber formed therein, and having an opening at a front side thereof, a basket configured to be rotatable in a first or second direction inside the tub, a driver configured to supply power to rotate the basket, and a door configured to be rotatable in the first direction based on a rotation of the basket in the first direction so as to open or close the opening of the tub.
Inventor(s): Sungkoo Cho of Suwon-si (KR) for samsung electronics co., ltd., Mukyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Mijo Kang of Suwon-si (KR) for samsung electronics co., ltd., Kyungah Chang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A62B23/02, A62B7/10
Abstract: provided are an electronic mask and a method of controlling the electronic mask. the electronic mask includes at least one filter; at least one sensor configured to obtain sensing data related to the at least one filter; a fan configured to generate a flow of air toward the at least one filter; and at least one processor configured to: identify a grade of the at least one filter based on the sensing data obtained from the at least one sensor, and control a rotation speed of the fan based on the grade of the at least one filter.
Inventor(s): Jaehong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungchan KO of Suwon-si (KR) for samsung electronics co., ltd., Seungyong HYUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A61H1/02, A61H3/00, A63B71/06, G09G3/00, G09G3/38
Abstract: a motion assist apparatus having a color change function using electric ink may include a waist frame and a waist belt that are to be worn on a waist of a user, a force transmission frame and a thigh belt that are to be worn on a thigh of the user, an actuator connected to the waist belt and configured to generate power, a drive frame connected to the actuator and configured to transmit the power to the force transmission frame, an input unit configured to detect at least one of exercise information of the user, body information of the user, and clothing information of the user, a color indicator including a first electrode layer disposed on the drive frame, an electronic ink layer disposed on the first electrode layer, and a second electrode layer disposed on the electronic ink layer, a color determiner configured to determine a target color of the color indicator based on information detected by the input unit, and a color controller configured to receive information about the target color from the color determiner and control a voltage applied to the first electrode layer and a voltage applied to the second electrode layer so as to change a color of the electronic ink layer.
Inventor(s): Hyukbin JO of Suwon-si (KR) for samsung electronics co., ltd., Eunjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01D46/00
Abstract: provided are a method and an electronic device for detecting contamination of a filter. when a revolutions per minute (rpm) of a fan motor increases so as to exceed a target rpm, a stabilization time is detected from a time point when the rpm of the fan motor reaches the target rpm to a time point when the rpm of the fan motor is maintained within a reference rpm difference with respect to the target rpm. when it is determined that the detected stabilization time is greater than a filter replacement threshold time, a notification to replace the filter is displayed on a display.
[[20240100634.LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Jaeseok JANG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Seunghyun BAIK of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): B23K35/02, B22F1/054, B22F1/142, B23K35/26, C22C12/00, C22C13/00, C22F1/16, C22F3/00, H01L23/00
Abstract: a lead-free solder alloy composition includes a lead-free solder alloy; and a flower-shaped metal nano-particle including a metal core and protrusion portions extending from a surface of the metal core, wherein the metal core and the protrusion portions of the metal nano-particle include only one metal element.
20240100639.ELECTROSTATIC CHUCK_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): INSEOK SEO of SUWON-SI (KR) for samsung electronics co., ltd., MINSUNG KIM of SUWON-SI (KR) for samsung electronics co., ltd., DASOM LEE of SUWON-SI (KR) for samsung electronics co., ltd., HEEWON MIN of SUWON-SI (KR) for samsung electronics co., ltd., DONGYUN YEO of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): B23Q3/15
Abstract: an electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. the fastening member passes through the cooling plate and is coupled to a fastening portion provided on a lower surface of the upper plate. movement of the fastening member is constrained only in a first direction intersecting an upper surface of the upper plate.
Inventor(s): Donghoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Boun YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/20
Abstract: a substrate processing apparatus includes a substrate support portion including a platen and a transparent polishing pad on the platen, the platen comprising a light generator that generates light that passes through the transparent polishing pad and proceeds towards a semiconductor substrate on the substrate support portion, and the transparent polishing pad including a surface that contacts and polishes the semiconductor substrate. the substrate processing apparatus further includes: a substrate holder that fixes the semiconductor substrate such that the semiconductor substrate is in contact with the substrate support portion; and a slurry supply portion that supplies slurry between the semiconductor substrate and the transparent polishing pad. the slurry includes a light blocking material that blocks the light; and abrasive particles that are configured to be activated by accepting electrons generated, based on the light, by a photocatalyst within the slurry.
Inventor(s): Siddharth RUPAVATHARAM of Piscataway NJ (US) for samsung electronics co., ltd., Richard Howard of Highland Park NJ (US) for samsung electronics co., ltd., Daewon Lee of Princeton NJ (US) for samsung electronics co., ltd., Lawrence Jackel of Keyport NJ (US) for samsung electronics co., ltd., Caleb Sebastian Escobedo of Brooklyn NY (US) for samsung electronics co., ltd., Ibrahim Volkan Isler of Saint Paul MN (US) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J15/08
Abstract: in some embodiments, an apparatus for performing reactive positioning of a robot gripper includes one or more fingers disposed on an end-effector of the robot, a signal processing circuit, a memory storing instructions, and a processor. each of the one or more fingers includes a transducer configured to generate vibrational energy based on an input signal, and convert an acoustic reflection of the vibrational energy from an object into a voltage signal. the signal processing circuit is configured to provide the input signal to each transducer, and perform signal processing on the voltage signal of each transducer resulting in reflection data. the processor is configured to execute the instructions to perform pre-touch proximity detection on the reflection data, perform grasp positioning on the reflection data, perform contact detection from the reflection data, and provide, to the robot, results of the pre-touch proximity detection, the grasp positioning, and the contact detection.
Inventor(s): Donghan KOO of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KWAK of Suwon-si (KR) for samsung electronics co., ltd., Minhee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J11/00, B25J9/16
Abstract: a serving robot and a control method thereof are disclosed. the serving robot includes a main body, a loading part on which food is loaded, an arm of which one end is rotatably connected to the main body, and the other end is rotatably connected to the loading part, a driving part, and at least one processor, wherein the at least one processor is configured to control the driving part so that the loading part maintains horizontality at the time of a forward rotation or a backward rotation of the arm.
Inventor(s): Jeong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Chul Joon HEO of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07D487/06, C07D421/14, H10K85/60
Abstract: an organic compound is represented by chemical formula 1a or chemical formula 1b.
Inventor(s): Jeong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Chul Joon HEO of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07D487/06, C07D421/14, H10K85/60
Abstract:
Inventor(s): Jeong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Chul Joon HEO of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07D487/06, C07D421/14, H10K85/60
Abstract: in chemical formulas 1a and 1b, ar, ar, r, r, n, and m are each the same as in the detailed description.
Inventor(s): Seung Hoon Song of Suwon-si (KR) for samsung electronics co., ltd., Heejoo Han of Daejeon (KR) for samsung electronics co., ltd., Woo Yong Shim of Suwon-si (KR) for samsung electronics co., ltd., Sukhwan Yoon of Daejeon (KR) for samsung electronics co., ltd., Jae-Young Kim of Suwon-si (KR) for samsung electronics co., ltd., Sojung Yoon of Daejeon (KR) for samsung electronics co., ltd., Yu Kyung Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C12P3/00, C02F3/28, C02F3/34, C12M1/00
Abstract: a method of reducing a concentration of a nitrogen oxide, the method comprising: contacting a microorganism with a nitrogen oxide-containing sample to reduce the concentration of the nitrogen oxide in the sample, wherein the contacting comprises contacting the microorganism with fe(ii)(l)-noin a bioreactor, wherein the fe(ii)(l)-nois a complex in which a chelating agent, fe, and noare chelated, wherein l is the chelating agent, and wherein nois a nitrogen oxide ligand.
20240102160.METHOD OF DEPOSITING ATOMIC LAYER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunjun AHN of Suwon-si (KR) for samsung electronics co., ltd., Byounghoon JI of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwoo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/455, H01J37/32, H01L21/02
Abstract: a method of depositing an atomic layer is provided. the method includes a plurality of deposition cycles. each of the plurality of deposition cycles includes rotating a valve plate included in an exhaust port by a first angle while supplying a precursor to a chamber into which a substrate is loaded, rotating the valve plate by a second angle while supplying a purge gas to the chamber, rotating the valve plate by a third angle while supplying a reactor to the chamber, and rotating the valve plate by the second angle while supplying the purge gas to the chamber, and wherein the first angle, the second angle, and the third angle are certain angles between an upper surface of the valve plate and a virtual plane vertical to an internal path of the exhaust port, and the first angle differs from the third angle.
Inventor(s): Kyungeun SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C15/20, G06V10/82, G06V20/70
Abstract: a range hood is disclosed. the range hood includes a driving part that suctions the ambient air and discharges the air to the outside, and at least one processor configured to acquire first identification information for a subject for cooking and second identification information for a cooking container, acquire operation information of the driving part based on the first identification information and the second identification information, and control the driving part based on the operation information.
Inventor(s): Chanyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Daesung KI of Suwon-si (KR) for samsung electronics co., ltd., Juyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyeonkyu LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25C5/08, F25C1/25
Abstract: an ice maker includes an ice-making container that includes a first tray and a second tray coupled to each other at a sealing surface between the first tray and the second tray. the ice maker may include a water supply guide including one end connected to the ice-making container, the water supply guide being configured to supply water to the ice-making container. the ice maker may include a first heater provided adjacent to or in the ice-making container; and a second heater provided adjacent to or in the ice-making container, and provided at a position that is different than a position of the first heater. the first heater may be provided closer to the sealing surface than the second heater.
20240102727.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyun Joo KIM of Suwon-si (KR) for samsung electronics co., ltd., Yong Man SEO of Suwon-si (KR) for samsung electronics co., ltd., In-Sung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Bok Hyun JANG of Suwon-si (KR) for samsung electronics co., ltd., Tae Youl LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeong Won CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D29/00, F25D23/02
Abstract: a refrigerator may include a storage compartment, an inner door which comprises an opening having a size corresponding to a size of the storage compartment, a plurality of door guards, and an outer door which open and close the storage compartment, wherein the inner door comprises a control unit may control an internal environment of the storage compartment.
Inventor(s): Yeonjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jongmin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/28, H01L21/66
Abstract: provided is a semiconductor device including a substrate including an element region and a scribe lane region defining the element region, and one or more test element groups arranged on the substrate and including one or more test elements for characteristic evaluation and one or more test pads for applying a test signal for testing the one or more test elements, wherein all of the one or more test pads are spaced apart from the element region in a horizontal direction.
Inventor(s): Minook KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongsik CHO of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Jinmyoung MOK of Suwon-si (KR) for samsung electronics co., ltd., Seung Hak LEE of Suwon-si (KR) for samsung electronics co., ltd., Younggyu JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B13/00, G02B7/09, G02B13/02, G02B27/64, H04N23/54, H04N23/55
Abstract: a camera module includes a first reflective member including a first reflective surface, a telephoto lens spaced apart from the first reflective surface in a first direction, a second reflective member spaced apart from the first reflective surface in a second direction, the second direction intersecting the first direction, and a sensor support member configured to support an image sensor. the second reflective member includes a second reflective surface configured to reflect light from the first reflective surface toward the sensor support member, and the sensor support member is spaced from the second reflective surface in a third direction, the third direction intersecting each of the first direction and the second direction.
Inventor(s): Jongmin YOON of Suwon-si (KR) for samsung electronics co., ltd., Chulkwi KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01, H02J7/00
Abstract: an embodiment of the present disclosure provides a wearable electronic device and a method for controlling a power path in the wearable electronic device. an electronic device according to various embodiments may comprise: a first support frame including a first system; a second support frame including a second system; a switch module including at least one switch configured to change a configuration of a power path between the first system and the second system; and at least one processor provided in the first system and/or the second system and operatively connected to the switch module, wherein one or more of the at least one processor is configured to change the configuration of the switch module so that the power path between the first system and the second system is connected to a power path of a first power source (vbus) under a first specified condition of the electronic device, and change the configuration of the switch module so that the power path between the first system and the second system is connected to a power path of a second power source (vbat) under a second specified condition of the electronic device.
20240103325.DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyesung HAN of Suwon-si (KR) for samsung electronics co., ltd., Bupmyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungho Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1345
Abstract: a display apparatus includes a display panel having a curvature, a plurality of chip-on-films connected to a side of the display panel, a first printed circuit board (pcb) connected to a first part of the plurality of chip-on-films, and a second pcb provided farther outside of the display panel than the first pcb from a center of the display panel, the second pcb being connected to a second part of the plurality of chip-on-films, and a number of chip-on-films of the second part of the plurality of chip-on-films is different than a number of chip-on-films of the first part of the plurality of chip-on-films.
20240103543.ROBOT AND CONTROL METHOD THEREOF_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungsoo RYU of Suwon-si (KR) for samsung electronics co., ltd., Jongmyeong KO of Suwon-si (KR) for samsung electronics co., ltd., Koeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jiho CHU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/644, G05D1/229
Abstract: a robot is provided. the robot includes a camera, a driving unit, and a processor. the robot is configured to, if a plurality of users included in one group are identified in an image captured via the camera, acquire profile information of each of the plurality of users, based on the profile information, acquire group feature information including group type information of the group, priority information of the plurality of users, and preferred waypoint information of the one group, and control the driving unit to perform a route guidance function based on the group feature information and destination information.
Inventor(s): CHEOLHWAN LIM of Suwon-si (KR) for samsung electronics co., ltd., HWANSEOK YEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05F3/24, G05F1/46, G05F1/567
Abstract: a proportional-to-absolute-temperature current generating device includes a differential difference amplifier (dda) that outputs a comparison signal based on a reference voltage, a first voltage, and a second voltage, a current source that generates a first current and a second current based on the comparison signal, a proportional-to-absolute-temperature voltage (vptat) generating unit that generates the first voltage based on the first current, and a complementary-to-absolute-temperature voltage (vctat) generating unit that generates the second voltage based on the second current. each of the first current and the second current is a proportional-to-absolute-temperature current that increases in proportion to a temperature of the proportional-to-absolute-temperature current generating device.
20240103564.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon CHUN of Seoul (KR) for samsung electronics co., ltd., Jaenam KIM of Incheon (KR) for samsung electronics co., ltd., Sanghyeon PARK of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/12
Abstract: an example embodiment of the present invention provides a semiconductor device including: an encoder configured to receive a plurality of bit data by dividing the plurality of bit data into first group data and second group data, the plurality of bit data being divided into 2-bit units, to delay the second group data for a first period, and to output the first group data and the delayed second group data; and an output driver configured to output the first group data and the delayed second group data together to an external semiconductor device.
Inventor(s): Heeyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Kijung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H04B1/3888
Abstract: a wearable electronic device according to an embodiment may comprise: a housing which includes a front housing, a rear housing opposite to the front member, and a side housing surrounding the inner space between the front housing and the rear housing; a circuit board disposed in the housing and including at least one ground portion; a speaker module comprising a speaker disposed at one side of the rear housing and connected to the circuit board; and a support configured to support the speaker module and comprising a conductive material, wherein the support is electrically connected to the ground portion of the circuit board.
Inventor(s): Sanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungmin OH of Suwon-si (KR) for samsung electronics co., ltd., Yoseob KWAK of Suwon-si (KR) for samsung electronics co., ltd., Joohong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/20, H04W52/18
Abstract: an electronic device is provided. the electronic device includes a temperature sensor, a communication circuit, a memory, and a processor. the processor identifies whether the temperature measured through the temperature sensor satisfies a specified condition, in a state of performing data transmission or reception through a call channel between an external electronic device and the electronic device, adjusts the bit rate of a codec that encodes data to be transmitted through the call channel when the measured temperature satisfies the specified condition, and blocks data transmission and/or reception through a radio bearer mapped to a packet data network (pdn) corresponding to an internet protocol (ip) data type among data to be transmitted by the electronic device.
Inventor(s): Seungwon Yang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3296, G06F1/3228
Abstract: an operating method of an electronic device is provided. the operating method includes: generating an idle time corresponding to an idle state; selecting a low-power state from among a plurality of low-power states based on the idle time, a time condition, power consumption in the idle state and an entry success rate of a previous low-power state; and entering each of a plurality of devices into a low-power mode according to the low-power state.
Inventor(s): Vipul GUPTA of Noida (IN) for samsung electronics co., ltd., Abhishek SHARMA of Noida (IN) for samsung electronics co., ltd., Aryan JAISWAL of Noida (IN) for samsung electronics co., ltd., Vaibhav NEGI of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G01C21/16, G06T7/00, G06T7/194, G06T7/246, G06T19/00
Abstract: the present disclosure provides a method for intelligent user localization in a metaverse, including: detecting movements of a wearable head gear configured to present virtual content to a user, and generating sensor data and visual data using an inertial sensor and a camera, respectively, mapping the visual data to a virtual world using an image associated with the visual data to localize the user in the virtual world; providing the visual data and the sensor data to a first machine learning (ml) model and a second ml model, respectively; extracting a plurality of key points from the visual data and distinguishing stable key points and dynamic key points; and removing visual impacts corresponding to the visual data having a relatively low weightage, and providing a relatively high weightage to the sensor data processed through the second ml model.
Inventor(s): Jinkyo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Eunah JANG of Suwon-si (KR) for samsung electronics co., ltd., Minwook NA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482, G06F3/041, G06F3/04812, G06F3/04883, G06F3/04886, H04M1/02
Abstract: an electronic device includes a hinge configured to foldably connect a first housing to a second housing; a display including a first display area disposed on the first housing, and a second display area and a third display area arranged on the second housing; and at least one processor configured to: in a first state in which the hinge is unfolded, display a first application in the first display area and the second display area, and display, in the third display area, at least one default button, in a second state in which the hinge is folded, control the display to display a panel button, in the third display area, and based on a selection of the panel button in the second state, display the first application in the first display area, and display, in the second display area, a first panel including at least one control button and at least one system button.
Inventor(s): Dong-goo KANG of Seoul (KR) for samsung electronics co., ltd., Yun-Kyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Yong-yeon Lee of Suwon-si (KR) for samsung electronics co., ltd., Ji-yeon Kwak of Seoul (KR) for samsung electronics co., ltd., Hyun-Jin Kim of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482, G06F1/16, G06F3/04817, G06F3/04842, G06F3/0487, G06F3/0488, G06F3/04883, G06F3/04886, G06F9/451, G11B27/34, H04M1/02, H04M1/72403, H04M1/72469
Abstract: a user terminal device and a controlling method thereof are provided. the user terminal device includes a display configured to be divided into a first area and a second area which is larger than the first area with reference to a folding line, a cover disposed on a rear side of the display, a detector configured to detect a user interaction on the display and the cover, and a controller configured to, in response to the display being folded along the folding line such that the first area and the second area face each other, control the detector to detect a user interaction through an exposure area, which is an exposed part of the second area, and the cover, and, in response to the display being folded such that the two parts of the cover face with each other with reference to the folding line, control the detector to detect a user interaction through the first area and the second area.
Inventor(s): Doo Suk KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Geon Soo KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Dong Hyun YEOM of Gyeonggi-do (KR) for samsung electronics co., ltd., Pil Joo YOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Yong Joon JEON of Gyeonggi-do (KR) for samsung electronics co., ltd., Bo Kun CHOI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04842, G06F3/04883
Abstract: an electronic device including a touch-enabled display module configured to display a plurality of windows according to a multi-window mode; and a control module configured to displaying on the touch screen a first application window and a second application window according to the multi-window mode, alter the first application window in response to a touchscreen input received via the touch-enabled display, and automatically alter the second application window in response to the alteration of the first application window.
20240103735.MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungjun Shin of Suwon-si (KR) for samsung electronics co., ltd., Yeongwoo Kang of Suwon-si (KR) for samsung electronics co., ltd., DongHyeok Cho of Suwon-si (KR) for samsung electronics co., ltd., Younghun Seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: disclosed is a memory device which includes a first memory cell that is electrically connected with a first word line and a first bit line, a first bit line sense amplifier circuit that is electrically connected with the first bit line, a first local sense amplifier circuit that is electrically connected with the first bit line sense amplifier circuit through a first local input/output line, a first local driver that is electrically connected with the first local sense amplifier circuit through a first pre-global input/output line, and a sense amplifier and write driver that is electrically connected with the first local driver through a global input/output line, and the first local driver selectively electrical-disconnects the first pre-global input/output line from the global input/output line, based on an operation for the first memory cell.
Inventor(s): Wonseb JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hongju KAL of Seoul (KR) for samsung electronics co., ltd., Won Woo RO of Seoul (KR) for samsung electronics co., ltd., Seokmin LEE of Goryeong-gun (KR) for samsung electronics co., ltd., Gun KO of Gunpo-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a data processing system and method for accessing a heterogeneous memory system including a processing unit are provided. the heterogeneous memory system includes a memory module and high bandwidth memory (hbm) including a processing-in-memory (pim) circuit combined with a memory controller. the memory controller is configured to detect a data array required for an arithmetic operation from a memory module or the hbm by using a border index value when the arithmetic operation is performed by the pim circuit of the hbm and generate a memory module command set and an hbm command set using physical address spaces respectively designated in the memory module and the hbm.
Inventor(s): Younghoon MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/16
Abstract: an electronic apparatus is disclosed. the electronic apparatus includes a communication interface and a processor configured to control, based on a signal corresponding to a play start of a first audio being received from a first device through the communication interface, to output the first audio received from the first device, end, based on a signal corresponding to a play start of a second audio being received from a second device through the communication interface while the first audio is being output, an output of the first audio and control to output the second audio received from the second device, transmit, based on an output of the second audio being ended, a signal requesting playing of the first audio to the first device through the communication interface, and control, based on the signal corresponding to the play start of the first audio corresponding to the signal requesting the playing of the first audio being received, to output the first audio received from the first device.
Inventor(s): Dong-Jin CHANG of Suwon-si (KR) for samsung electronics co., ltd., Soon-Wan KWON of Suwon-si (KR) for samsung electronics co., ltd., Seok Ju YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungmeen MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Daekun YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/507, G06F7/504, G06F7/544
Abstract: provided is a computation method of a memory processor configured to perform an operation between a first vector including first elements and a second vector including second elements, the first elements including respective first bits and the second elements including respective second bits, the method performed by the memory processor including: applying, to single-bit operation gates, the respective first bits and the respective second bits; obtaining bit operation result sum values for the respective first and second elements based on bit operation results obtained using the single-bit operation gates; and obtaining an operation result of the first vector and the second vector based on the bit operation result sum value.
Inventor(s): Hyunjoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jaedeok KIM of Suwon-si (KR) for samsung electronics co., ltd., Chiyoun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/445, G06N3/045, G06N3/08, G06N20/10, G06N20/20
Abstract: provided is an apparatus configured to determine a common neural network based on a comparison between a first neural network included in a first application program and a second neural network included in a second application program, utilize the common neural network when the first application program or the second application program is executed.
Inventor(s): Jae-Hun LEE of Seongnam-si (KR) for samsung electronics co., ltd., Myung-Sun KIM of Seongnam-si (KR) for samsung electronics co., ltd., Ayush JAIN of Seoul (KR) for samsung electronics co., ltd., Tae-Ho SWANG of Seoul (KR) for samsung electronics co., ltd., Jae-Hong KIM of Yongin-si (KR) for samsung electronics co., ltd., Hye-Jung CHO of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/07
Abstract: a method performed by a managing server includes: receiving, from an electronic device, operation data of the electronic device; identifying, by using artificial intelligence (ai), a device usage pattern of the electronic device; identifying, by using the ai, information related to a failure or an abnormal operation of the electronic device and a solution to the failure or the abnormal operation based on the device usage pattern and the operation data received from the electronic device; and transmitting, to a user terminal, the information related to the failure or the abnormal operation of the electronic device and the solution to the failure or the abnormal operation.
Inventor(s): Dawoon Choi of Suwon-si (KR) for samsung electronics co., ltd., Inseop Lee of Suwon-si (KR) for samsung electronics co., ltd., Hee Jeong of Suwon-si (KR) for samsung electronics co., ltd., Bongkeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Myungsoo Noh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/398, G03F1/36, G06F30/392
Abstract: provided is a layout design method including designing a preliminary layout including a source/drain contact pattern of an integrated circuit device, designing a first layout including a cut pattern for cutting the source/drain contact pattern, designing a second layout configured by excluding a pattern overlapping the pattern of the first layout from the preliminary layout, and correcting the preliminary layout by reflecting an etch skew based on at least one parameter of the second layout.
Inventor(s): Yen-Chang Hsu of Fremont CA (US) for samsung electronics co., ltd., Harshavardhan Kamarthi of Atlanta GA (US) for samsung electronics co., ltd., Yilin Shen of Santa Clara CA (US) for samsung electronics co., ltd., Hongxia Jin of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F40/35, G06F40/166, G06F40/284, G06F40/40, G06N3/09
Abstract: a method includes receiving an input for a large language model (llm) from a user. the method also includes generating one or more token embeddings based on the input. the method further includes generating one or more prompt embeddings based on the input using a contextual prompt generator (cpg), the one or more prompt embeddings representing new or updated information that is not contained in existing knowledge of the llm. the method also includes providing the one or more token embeddings and the one or more prompt embeddings to the llm. in addition, the method includes outputting a prediction based on the one or more token embeddings and the one or more prompt embeddings using the llm, wherein the prediction reflects the new or updated information represented by the one or more prompt embeddings.
Inventor(s): Jiaqian Yu of Beijing (CN) for samsung electronics co., ltd., Yiwei CHEN of Beijing (CN) for samsung electronics co., ltd., Yifan YANG of Beijing (CN) for samsung electronics co., ltd., Byung In YOO of Suwon-si (KR) for samsung electronics co., ltd., Changbeom PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongwook LEE of Suwon-si (KR) for samsung electronics co., ltd., Qiang WANG of Beijing (CN) for samsung electronics co., ltd., Siyang PAN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G06N5/046, G06N20/20
Abstract: disclosed is a method and device for processing data, and the method includes generating a target augmentation task sequence by processing the target data with a trained first model that performs inference on the target data to generate the target data augmentation task sequence, generate augmented target data by performing data augmentation on the target data according to the target augmentation task sequence, and obtaining a prediction result corresponding to the target data by inputting the augmented target data to a trained second model and performing a corresponding processing on the augmented target data by the trained second model.
Inventor(s): Boyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Daehee KIM of Suwon-si (KR) for samsung electronics co., ltd., Suhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongil CHO of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06F3/01, G06T7/10, G06T7/70
Abstract: a processor of a wearable device is provided. the processor includes obtaining posture information of the wearable device in a space including the wearable device, based on classification information for selecting at least one feature point within pixels based on differences between pixels included in a first frames output from a first camera, identifying resolutions of each of a plurality of areas included in field-of-view (fov) formed based on a display, based on the number of feature points obtained in each of the plurality of areas by the classification information, and changing resolution, among resolutions identified based on gaze information indicating gaze of user wearing the wearable device, corresponding to a first area, among a plurality of areas, to resolution larger than resolution corresponding to second area.
Inventor(s): Gahee KIM of Suwon-si (KR) for samsung electronics co., ltd., Joon-Kee CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyun Do CHOI of Suwon-si (KR) for samsung electronics co., ltd., Younsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jeonghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06V10/25, G06V10/28, G06V10/62
Abstract: an apparatus for measuring solubility includes: a display configured to display at least one patterned background image; an image obtaining sensor configured to obtain at least one transmission image formed by light from the at least one patterned background image being transmitted through a container accommodating a target sample, of which solubility is to be measured; and a processor configured to analyze a degree of dissolution of the target sample from the at least one transmission image based on at least one analysis algorithm.
Inventor(s): Iegor VDOVYCHENKO of Kyiv (UA) for samsung electronics co., ltd., Oleksandr SAPOZHNIK of Kyiv (UA) for samsung electronics co., ltd., Vladyslav DYKYI of Kyiv (UA) for samsung electronics co., ltd., Volodymyr SAVIN of Kyiv (UA) for samsung electronics co., ltd., Alona VITIUK of Kyiv (UA) for samsung electronics co., ltd., Andrii TUZHYKOV of Kyiv (UA) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, H04N23/61, H04N23/69, H04N23/695
Abstract: an electronic device and method are provided. the electronic device includes receiving a plurality of operation contexts for the wearable electronic device to perform an operation according to an operation context, designating a priority between the plurality of operation contexts, calculating a parameter related to a movement of a plurality of cameras to perform an operation context having a top priority, and changing a combined field-of-view (fov) and overlapping area formed by the plurality of cameras based on the movement of the plurality of cameras, wherein the plurality of cameras are configured to moved, independently.
Inventor(s): Duncan Knarr of Santa Rosa CA (US) for samsung electronics co., ltd., Andrew R. McHugh of San Jose CA (US) for samsung electronics co., ltd., Seokhyun Yoon of Cupertino CA (US) for samsung electronics co., ltd.
IPC Code(s): G09F9/30, G06F1/16
Abstract: a system and method for controlling presentation on a foldable display of an electronic device is provided. a foldable electronic device comprises a foldable housing including a hinge structure, a first housing structure and a second housing structure foldable and unfoldable with respect to the first housing structure about the hinge structure. the electronic device includes a processor and a memory to store instructions that cause the processor to receive a first user input to select an application program; detect a change from a folded state to an unfolded state; determine whether the selected application program has user interface size restrictions; and in the unfolded state, display a user interface of the selected application on at least a portion of the foldable display, based in part on the screen size restriction.
Inventor(s): Sungho LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Hohak RHO of Seongnam-si (KR) for samsung electronics co., ltd., Junjae LEE of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20
Abstract: a dual source driver includes first and second gamma voltage generators configured to generate first and second gamma voltages, respectively, first and second latches configured to latch first and second data, respectively, a first driving cell configured to receive the first gamma voltage and the first data, and to transmit a first voltage corresponding to the first data and the first gamma voltage to a panel load based on a first switching operation, and a second driving cell configured to receive the second gamma voltage and the second data, and to transmit a second voltage corresponding to the second data and the second gamma voltage to the panel load based on a second switching operation. the first switching operation and the second switching operation may operate complementarily to each other.
Inventor(s): Hyunji YOON of Suwon-si (KR) for samsung electronics co., ltd., Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungchun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sukyun WOO of Suwon-si (KR) for samsung electronics co., ltd., Pansoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungil KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeongtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisu YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/34
Abstract: a method of driving a light emitting diode (led) backlight unit, which includes a plurality of led elements that are connected to a plurality of gate lines and a plurality of source lines, includes generating a plurality of gate signals applied to the plurality of gate lines. while the plurality of gate signals are generated, a non-overlap interval between activation intervals of two adjacent gate signals is generated. all of the plurality of gate signals are deactivated during the non-overlap interval. a plurality of source signals applied to the plurality of source lines are generated. while the plurality of source signals are generated, a high-impedance (hi-z) interval included in the non-overlap interval is generated. at least some of the plurality of source signals have a high-impedance state during the high-impedance interval.
Inventor(s): Namhyeon JEON of Suwon-si (KR) for samsung electronics co., ltd., Sungwon RYU of Suwon-si (KR) for samsung electronics co., ltd., Gyudong EOM of Suwon-si (KR) for samsung electronics co., ltd., Dongseop LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongsik KANG of Suwon-si (KR) for samsung electronics co., ltd., Seungjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/10
Abstract: an electronic device is provided. the electronic device includes a display including a display driver circuit and a display panel. the electronic device includes a processor. the display driver circuit is configured to obtain information regarding an image from the processor. the display driver circuit is configured to display, based on an on pixel ratio (opr) of the image that is a first opr, the image within a first brightness range from a first reference brightness level to a second reference brightness level greater than the first reference brightness level, through the display panel. the display driver circuit is configured to display, based on the opr that is a second opr lower than the first opr, the image within a second brightness range from the first reference brightness level to a third reference brightness level greater than the second reference brightness level, through the display panel.
Inventor(s): Jongwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hanbeen KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonsang PARK of Suwon-si (KR) for samsung electronics co., ltd., Miyeoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G06T19/00, G06V20/50, G10L15/18, G10L15/30
Abstract: an example electronic device may include a memory storing computer-executable instructions and a processor configured to execute the instructions by accessing the memory. the instructions may cause the processor to control the electronic device receive a voice input for requesting to apply an interaction with a second entity to a first entity; obtain a graphic representation corresponding to the second entity based on the received voice input; display the obtained graphic representation on a screen area corresponding to the first entity on a display of the electronic device; and based on receiving a control input for the second entity, transmit, to an external device corresponding to the first entity, a control command, converted from the control input, for triggering an operation of the external device.
Inventor(s): Woohyun NAM of Suwon-si (KR) for samsung electronics co., ltd., Kyungrae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangchul KO of Suwon-si (KR) for samsung electronics co., ltd., Yoonjae SON of Suwon-si (KR) for samsung electronics co., ltd., Tammy LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunkwon CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Sunghee HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L25/57, G10L15/25, G11B27/031
Abstract: a method of matching a voice for each object included in a video, includes: separating a plurality of voices in a video; determining a dissimilarity between the plurality of voices; selecting a partial duration in an entire duration of the video as a matching duration, based on the dissimilarity between the plurality of voices; matching, within the matching duration, the plurality of voices with a plurality of objects in the video respectively, based on mouth movements of the plurality of objects; and matching the plurality of voices with the plurality of objects respectively in the entire duration of the video, based on results of the matching between the plurality of voices and the plurality of objects within the matching duration.
Inventor(s): SANG KYU KANG of Anyang-si (KR) for samsung electronics co., ltd., JIEUN SHIN of Seongnam-si (KR) for samsung electronics co., ltd., HOCHEOL BANG of Hwaseong-si (KR) for samsung electronics co., ltd., HAEWON LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406, G11C7/10, G11C11/4076, G11C16/34
Abstract: a semiconductor memory device includes a memory cell array including a plurality of memory cells and a control logic circuit configured to control the semiconductor memory device. the control logic circuit includes a mode register and a remaining lifetime calculating device configured to count usage metrics based on one or more of the following: a number of clock signals received from a memory controller, an amount of data transmitted or received to or from the memory controller, and/or a number of commands received from the memory controller. the remaining lifetime calculating device generates a remaining lifetime code representing a remaining lifetime of the semiconductor memory device based on the usage metrics, and stores the remaining lifetime code in the mode register.
Inventor(s): Duckyoung Seo of Suwon-si (KR) for samsung electronics co., ltd., Younghun Seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/4097
Abstract: disclosed is a sense amplifier which includes a sense amplification circuit and a sensitivity control circuit. the sense amplification circuit includes first and second mos transistors. the first mos transistor is connected with a first bit line and a target memory cell. the second mos transistor is connected with a second bit line and a non-target memory cell. the sense amplification circuit pre-charges the first and second bit lines with a first driving voltage, compensates for an offset, and senses the target data based on a change in a voltage level of the first bit line, after charge sharing between the target memory cell and the first bit line. the sensitivity control circuit adjusts the sensing sensitivity for the target data indicating a first logical value by increasing a magnitude of a current flowing through the first mos transistor while the sense amplification circuit senses the target data.
Inventor(s): Seung-Jun Lee of Suwon-si (KR) for samsung electronics co., ltd., Sang-Yun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Bok-Yeon Won of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/4074, G11C11/4093
Abstract: a semiconductor memory device includes a memory bank arranged into first through nth split regions containing at least one memory cell sub-array within each split region, and first through nth global input/output (gio) split lines electrically coupled to the first through nth split regions. first through n-lth connection control transistors are provided, which have gate terminals responsive to respective connection control signals. the first connection control transistor is configured to electrically short the first and second gio split lines together when enabled by a corresponding connection control signal, and the n-1th connection control transistor is configured to electrically short the n-1th and nth gio split lines together when enabled by a corresponding connection control signal. a gio sense amplifier is provided, which is electrically coupled to the memory bank. a control circuit is provided, which is configured to reduce i/o signal line power consumption within the memory device during read (and write) operations.
20240105267.NON-VOLATILE MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Inho Kang of Suwon-si (KR) for samsung electronics co., ltd., Daeseok Byeon of Suwon-si (KR) for samsung electronics co., ltd., Beakhyung Cho of Suwon-si (KR) for samsung electronics co., ltd., Min-Hwi Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongsung Cho of Suwon-si (KR) for samsung electronics co., ltd., Gyosoo Choo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/24, G11C16/04, H01L23/00, H01L25/065, H01L25/18, H10B41/41, H10B43/40, H10B80/00
Abstract: provided is a non-volatile memory device including a page buffer circuit having a multi-stage structure, wherein a stage of the multi-stage structure includes a high voltage region, a first low voltage region, and a second low voltage region. the high voltage region includes a first high voltage transistor connected to one of first to sixth bit lines and a second high voltage transistor connected to one of seventh to twelfth bit lines, the first low voltage region includes a first transistor connected to the first high voltage transistor, and the second low voltage region includes a second transistor connected to the second high voltage transistor. each of the first low voltage region and the second low voltage regions has a first width corresponding to a pitch of six bit lines, and the high voltage region has a second width corresponding to a pitch of twelve bit lines.
Inventor(s): Seungyeon Kim of Seoul (KR) for samsung electronics co., ltd., Daeseok Byeon of Seongnam-si (KR) for samsung electronics co., ltd., Pansuk Kwak of Goyang-si (KR) for samsung electronics co., ltd., Hongsoo Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/24, G11C5/06, G11C16/26, H10B41/27, H10B43/27
Abstract: a memory device includes: a memory cell array including a first memory block and a second memory block adjacently disposed in a first direction, driving signal lines respectively corresponding to vertically stacked word lines, and a pass transistor circuit including an odd number of pass transistor groups and connected between the driving signal lines and the memory cell array. one of the odd number of pass transistor groups includes a first pass transistor connected between a first word line of the first memory block and a first driving signal line among the driving signal lines, and a second pass transistor connected between a first word line of the second memory block and the first driving signal line adjacently disposed to the first pass transistor in a second direction.
Inventor(s): Yeoseon Choi of Suwon-si (KR) for samsung electronics co., ltd., Donghoon Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/20, H01J37/26
Abstract: a sample holder includes a head, a first holding plate extending in a first direction from one surface of the head and including at least one first sample hole configured to accommodate at least one first sample and a first main surface configured such that the at least one first sample accommodated in the at least one first sample hole is exposed at the first main surface, and a second holding plate extending in the first direction from the one surface of the head and including at least one second sample hole configured to accommodate at least one second sample and a second main surface configured such that the at least one second sample accommodated in the at least one second sample hole is exposed at the second main surface, wherein a direction perpendicular to the first main surface of the first holding plate differs from a direction perpendicular to the second main surface of the second holding plate.
Inventor(s): Seungwan Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeon Lee of Suwon-si (KR) for samsung electronics co., ltd., Dohyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehong Park of Suwon-si (KR) for samsung electronics co., ltd., Dongchan Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/02, H01L21/67
Abstract: a substrate processing apparatus including a first chamber configured to accommodate a substrate therein and a second chamber including a heater provided in an internal space thereof, wherein the first chamber includes a target assembly configured to fix a target including a deposition material, a first ion gun configured to irradiate an ion beam onto the target to discharge deposition particles, which are ions of the deposition material, to the substrate, and a second ion gun configured to irradiate a hydrogen ion beam toward the substrate, the second ion gun includes a plasma generator configured to generate plasma, and a first grid electrode and a second grid electrode each configured to extract ions from the container, and the second chamber is configured to be provided with the substrate, on which the hydrogen ion beam has been irradiated, and perform thermal treatment on the substrate.
Inventor(s): Hyungsik KO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
Abstract: a showerhead includes an inner plate including at least one gas hole that penetrates the inner plate in a first direction, and an outer plate at least partially surrounding the inner plate, the outer plate having a ring shape with an axis that extends in the first direction, where the outer plate includes a first inner surface that extends downward and forms an acute angle with a line corresponding to the first direction, a first bottom surface that extends outward from the first inner surface, and a first outer surface that extends upward from the first bottom surface, and where a first angle between the first inner surface and a line corresponding to the first direction is greater than a second angle between the first outer surface of the outer plate and a line corresponding to the first direction.
Inventor(s): Woo Rim LEE of Suwon-si (KR) for samsung electronics co., ltd.., Myoung Jae Seo of Suwon-si (KR) for samsung electronics co., ltd.., In Hye Jeong of Suson-si (KR) for samsung electronics co., ltd.., Sung Gil Kang of Suwon-si (KR) for samsung electronics co., ltd..
IPC Code(s): H01L21/3065, H01L21/67
Abstract: a substrate processing apparatus, a substrate processing method, and a method of fabricating a semiconductor device are provided. the substrate processing method includes providing a process gas, generating a preliminary etchant, which includes a first etchant and a second etchant, from the process gas through plasma ignition, generating a process etchant by controlling a composition ratio of the preliminary etchant, and performing a selective etching of the substrate with the process etchant.
20240105469.LIQUID SUPPLY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Takashi Sasa of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwhan Oh of Suwon-si (KR) for samsung electronics co., ltd., Hokyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, B01D19/00
Abstract: a liquid supply system includes a liquid supply unit; a liquid pressurizer connected to the liquid supply unit; a compressor connected to the liquid pressurizer; a pump at a rear end of the liquid pressurizer to allow liquid to flow; an inflow control valve between the liquid supply unit and the liquid pressurizer; and an outflow control valve between the liquid pressurizer and the pump, wherein the liquid pressurizer is configured to supply liquid having a dissolved gas concentration that is lower than a dissolved gas concentration of liquid supplied from the liquid supply unit to the pump.
Inventor(s): Dong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Sang-Woo JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/02, H01L21/683
Abstract: a method may include loading a substrate into a substrate processing apparatus and performing a plasma treatment process on the substrate. the substrate processing apparatus includes a housing that defines a processing region, a power supply source on the housing and configured to generate plasma, a shower head in the housing and configured to supply the plasma to the processing region, an adapter between the power supply source and the shower head and separated from the shower head, a lid surrounding at least part of the adapter, and pads between the shower head and the lid. the shower head may include first fastening holes. the lid may be connected to the shower head through fastening portions respectively inserted into the first fastening holes. the pads may include polytetrafluoroethylene. at least a part of the pads may contact a bottom surface of the adapter.
Inventor(s): Hyungjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Minhwan SEO of Suwon-si (KR) for samsung electronics co., ltd., Wondon JOO of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung CHU of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo BAE of Suwon-si (KR) for samsung electronics co., ltd., Sungmin AHN of Suwon-si (KR) for samsung electronics co., ltd., Seungyeol OH of Suwon-si (KR) for samsung electronics co., ltd., Jungyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, G02B5/30, G02B27/09, G02B27/28, H01L21/68
Abstract: the optical device includes an illuminator configured to emit illumination light in a first horizontal direction, a polarizing prism configured to polarize the illumination light incident thereto through a first surface thereof in the first horizontal direction, a first reflector and a second reflector, each configured to reflect the illumination light from the polarizing prism, and a first lens and a second lens configured to condense the illumination light reflected from the first and second reflectors, respectively.
Inventor(s): Seokbong PARK of Suwon-si (KR) for samsung electronics co., ltd., Sechul PARK of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Junhyun AN of Suwon-si (KR) for samsung electronics co., ltd., Hyojin YUN of Suwon-si (KR) for samsung electronics co., ltd., Seunghun CHAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/498, H01L25/10
Abstract: a semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer on the first redistribution structure, the first molding layer including at least one lower recess in a top surface thereof and being disposed on the first semiconductor chip, connection structures on the first redistribution structure, the connection structures extending in a vertical direction and passing through the first molding layer, a first insulating layer on the first molding layer, and a second redistribution structure including a lower redistribution insulating layer on the first insulating layer, wherein the first insulating layer at least partially fills the at least one lower recess of the first molding layer.
Inventor(s): Yonghwan KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/373, H01L23/48, H01L23/498, H01L23/538, H01L25/00, H01L25/10
Abstract: a semiconductor package includes a first redistribution wiring layer including a first redistribution wiring layer having a plurality of first redistribution wires, and a plurality of first bonding pads electrically connected to the first redistribution wires and exposed from a lower surface, a first semiconductor substrate on an upper surface of the plurality of first redistribution wiring layer, the first semiconductor substrate having at least one first semiconductor chip and through vias that are electrically connected to the first redistribution wires, and the first semiconductor substrate having a first heat dissipation structure that surrounds an outer surface of the first semiconductor chip, a second redistribution wiring layer on the first semiconductor substrate, and the second redistribution having a plurality of second redistribution wires that are electrically connected to the through vias, and a second semiconductor substrate having at least one second semiconductor chip that is electrically connected to the plurality of second redistribution wires, and a second heat dissipation structure surrounding an outer surface of the second semiconductor chip.
20240105556.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SHAOFENG DING of Suwon-si (KR) for samsung electronics co., ltd., JEONG HOON AHN of Seongnam-si (KR) for samsung electronics co., ltd., YUN KI CHOI of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/522, H01L23/528
Abstract: a semiconductor device includes a substrate provided with an integrated circuit and a contact, an interlayer dielectric layer covering the integrated circuit and the contact, a through electrode penetrating the substrate and the interlayer dielectric layer, a first intermetal dielectric layer on the interlayer dielectric layer, and first and second wiring patterns in the first intermetal dielectric layer. the first wiring pattern includes a first conductive pattern on the through electrode, and a first via penetrating the first intermetal dielectric layer and connecting the first conductive pattern to the through electrode. the second wiring pattern includes a second conductive pattern on the contact, and a second via penetrating the first intermetal dielectric layer and connecting the second conductive pattern to the contact. a first width in a first direction of the first via is greater than a second width in the first direction of the second via.
Inventor(s): Choong Bin YIM of SUWON-SI (KR) for samsung electronics co., ltd., Ji Yong PARK of SUWON-SI (KR) for samsung electronics co., ltd., Jong Bo SHIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L21/56, H01L23/00, H01L23/31, H01L25/10, H10B80/00
Abstract: a semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.
Inventor(s): Hyunmog PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B43/40, H10B80/00
Abstract: a semiconductor device is provided. the semiconductor device includes: gate lines spaced apart from each other between a conductive layer and a conductive pad; and a channel structure extending through the gate lines. the channel structure includes: a channel region which defines a columnar space, and includes a first channel end in contact with the conductive pad and a second channel end in contact with the conductive layer; and a variable resistance pattern including an outer sidewall and a first end, the outer sidewall overlapping first gate lines, from among the gate lines, in a horizontal direction with the channel region therebetween, the first end being spaced apart from the first channel end of the channel region, and the variable resistance pattern being offset from, in the horizontal direction, at least one second gate line, from among the gate lines, that is adjacent to the conductive pad.
Inventor(s): Sung-Hun Lee of Yongin-si (KR) for samsung electronics co., ltd., Seokjung Yun of Iksan-si (KR) for samsung electronics co., ltd., Chang-Sup Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Seong Soon Cho of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L23/522, H10B41/20, H10B41/27, H10B43/10, H10B43/20, H10B43/27, H10B43/35, H10B43/50
Abstract: a three-dimensional (3d) semiconductor device includes a stack structure including first and second stacks stacked on a substrate. each of the first and second stacks includes a first electrode and a second electrode on the first electrode. a sidewall of the second electrode of the first stack is horizontally spaced apart from a sidewall of the second electrode of the second stack by a first distance. a sidewall of the first electrode is horizontally spaced apart from the sidewall of the second electrode by a second distance in each of the first and second stacks. the second distance is smaller than a half of the first distance.
Inventor(s): Jongjin LEE of Clifton Park NY (US) for samsung electronics co., ltd., Wonhyuk HONG of Clifton Park NY (US) for samsung electronics co., ltd., Kang-Ill SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L29/06, H01L29/40, H01L29/417, H01L29/423, H01L29/66, H01L29/775
Abstract: provided is field-effect transistor structure including: a channel structure; a source/drain region and a 2source/drain region connected to each other through the channel structure; a 1contact plug, on a top surface of the 1source/drain region, connected to a voltage source or 1circuit element through a back-end-of-line (beol) structure; and a 2contact plug, on a bottom surface of the 2source/drain region, connected to the 1voltage source, through a backside power rail, or another circuit element, wherein the 1source/drain region and the 2source/drain region have a substantially same height.
20240105636.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kanggyune LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Woojin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/31, H01L23/36, H01L23/00, H01L25/065
Abstract: a semiconductor package includes a package substrate, a first semiconductor chip on the package substrate, a sealing layer on the package substrate and at least partially covering the first semiconductor chip and including an upper surface, a first side surface, and a first inclined surface extending between the upper surface and the first side surface, and a first marking pattern in or on the first inclined surface of the sealing layer.
Inventor(s): Duhyoung AHN of Suwon-si (KR) for samsung electronics co., ltd., Minseok KANG of Suwon-si (KR) for samsung electronics co., ltd., Sungwook MOON of Suwon-si (KR) for samsung electronics co., ltd., Yongjin HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48, H01L23/522, H01L25/065
Abstract: provided is a semiconductor package including a three-dimensional (3d) stacked structure in which an upper second semiconductor chip is stacked on a lower first semiconductor chip. in the semiconductor package, a power distribution network for the first semiconductor chip and a power distribution network for the second semiconductor chip are implemented through circuits of the first semiconductor chip and separated from the first semiconductor chip.
20240105657.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hansung Ryu of Suwon-si (KR) for samsung electronics co., ltd., Yongsung Park of Suwon-si (KR) for samsung electronics co., ltd., Jongbeom Park of Suwon-si (KR) for samsung electronics co., ltd., Junho Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
Abstract: a semiconductor package includes a first substrate, a first bonding pad on the first substrate, a solder ball on the first bonding pad, and a blocking layer on the solder ball, wherein a thickness of the blocking layer varies in a direction away from the first substrate.
20240105662.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungho SHIM of Suwon-si (KR) for samsung electronics co., ltd., Han KIM of Suwon-si (KR) for samsung electronics co., ltd., Chulkyu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/48, H01L21/56, H01L21/683, H01L23/14, H01L23/31, H01L23/538, H01L25/16, H01L25/18
Abstract: a semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.
Inventor(s): YOUNG KUN JEE of Suwon-si (KR) for samsung electronics co., ltd., SANGHOON LEE of Suwon-si (KR) for samsung electronics co., ltd., UN-BYOUNG KANG of Suwon-si (KR) for samsung electronics co., ltd., SANG CHEON PARK of Suwon-si (KR) for samsung electronics co., ltd., JUMYONG PARK of Suwon-si (KR) for samsung electronics co., ltd., HYUNCHUL JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L21/768, H01L23/00, H01L23/31, H01L23/48
Abstract: disclosed are semiconductor packages and their fabrication methods. the semiconductor package comprises providing a semiconductor substrate, forming a semiconductor element on an active surface of the semiconductor substrate, forming in the semiconductor substrate through vias that extend from the active surface into the semiconductor substrate, forming a first pad layer on the active surface of the semiconductor substrate, performing a first planarization process on the first pad layer, performing on an inactive surface of the semiconductor substrate a thinning process to expose the through vias, forming a second pad layer on the inactive surface of the semiconductor substrate, performing a second planarization process on the second pad layer, and after the second planarization process, performing a third planarization process on the first pad layer.
Inventor(s): Junyoung Oh of Suwon-si (KR) for samsung electronics co., ltd., Jumyong Park of Suwon-si (KR) for samsung electronics co., ltd., Dongjoon Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498
Abstract: a semiconductor chip stack structure includes: a first semiconductor chip including a first semiconductor substrate, a first redistribution layer on the first semiconductor substrate and including a first redistribution pattern, and a first pad on an outermost side of the first redistribution layer; a second semiconductor chip including a second semiconductor substrate, a second redistribution layer on the second semiconductor substrate and including a second redistribution pattern, and a second pad on an outermost side of the second redistribution layer, and an area of the second semiconductor chip being smaller than an area of the first semiconductor chip; a first metal wire on the first semiconductor chip; a second metal wire on the second semiconductor chip; and a molding member on the first semiconductor chip and at least a portion of each of the second semiconductor chip, the first metal wire, and the second metal wire.
Inventor(s): Seokhyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/498, H01L25/00, H10B80/00
Abstract: a semiconductor package includes: a lower redistribution wiring layer having: a first chip mounting region; a peripheral region, and lower redistribution wirings; a logic semiconductor chip mounted in the first chip mounting region, the logic semiconductor chip having a plurality of first through electrodes that are electrically connected to at least some of the lower redistribution wirings; a first sealing member covering the logic semiconductor chip, a plurality of conductive connectors penetrating the first sealing member in the peripheral region; an upper redistribution wiring layer provided on the first seal and having upper redistribution wirings that are electrically connected to the plurality of conductive connectors, the upper redistribution wiring layer having at least one second chip mounting region that overlaps at least a portion of the first chip mounting region; and at least one memory semiconductor chip mounted in the second chip mounting region using first and second conductive bumps.
Inventor(s): Jung Hoo YUN of Suwon-si (KR) for samsung electronics co., ltd., Jae Moon LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L21/027, H01L23/00, H01L23/13, H01L23/498
Abstract: a semiconductor package includes a semiconductor chip including a first area and a second area around the first area, and a substrate including a second surface, the second surface facing a first surface of the semiconductor chip, a first trench defined on the second surface, and the first trench at least partially overlapping the second area of the semiconductor chip. the semiconductor package includes a bump structure including first bumps on the first area of the semiconductor chip, and second bumps on the second area of the semiconductor chip, the bump structure between the substrate and the semiconductor chip, and a first passive device in the first trench. the second bumps are in contact with the first surface of the semiconductor chip and the first passive device.
Inventor(s): Jaehyun Lim of Suwon-si (KR) for samsung electronics co., ltd., Kwangjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunjong Moon of Suwon-si (KR) for samsung electronics co., ltd., Inho Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, G06K19/073, G06V40/13, H01L23/00, H01L23/538, H01L25/00
Abstract: a fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.
Inventor(s): Hyeongyu You of Suwon-si (KR) for samsung electronics co., ltd., Jungho Do of Suwon-si (KR) for samsung electronics co., ltd., Geonwoo Nam of Suwon-si (KR) for samsung electronics co., ltd., Jisu Yu of Suwon-si (KR) for samsung electronics co., ltd., Minjae Jeong of Suwon-si (KR) for samsung electronics co., ltd., Jaehee Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L23/522, H01L23/528, H01L27/088, H01L27/092
Abstract: an integrated circuit includes a first cell in a first row extending in a first direction, a first power line extending in the first direction in a power rail layer, and configured to provide a first supply voltage to the first cell, and a first pattern overlapping a first boundary of the first row, and extending in the first direction in a first wiring layer, wherein the first cell includes at least one pattern extending in the first direction in the first wiring layer, and at least one transistor between the power rail layer and the first wiring layer, and the first pattern is configured to receive an input signal or an output signal of the first cell.
Inventor(s): JONGKYU SONG of SUWON-SI (KR) for samsung electronics co., ltd., Minho KIM of SUWON-SI (KR) for samsung electronics co., ltd., JIN HEO of SUWON-SI (KR) for samsung electronics co., ltd., Kyoungil DO of SUWON-SI (KR) for samsung electronics co., ltd., Jooyoung SONG of SUWON-SI (KR) for samsung electronics co., ltd., CHANHEE JEON of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H02H9/04
Abstract: an electro-static discharge protection device includes a substrate that includes a first well that has a first conductive type and a second well that has a second conductive type, and first to eighth diffusion regions formed on the first well and the second well. at least a portion of the diffusion regions formed in the first well are connected to a first electrode, and at least a portion of diffusion regions formed in a second well are connected to a second electrode. the contact between one of diffusion regions formed in the first well and an n well forms a trigger diode. a junction between one of diffusion regions formed in a second well and a p well forms a trigger diode. the trigger diodes are electrically connected to each other.
20240105717.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunme LIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Changjoon YOON of Suwon-si (KR) for samsung electronics co., ltd., Yeji LEE of Suwon-si (KR) for samsung electronics co., ltd., Heejun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L21/8234, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775
Abstract: a semiconductor device may include a first nanosheet structure having a first width, a second nanosheet structure having a second width and a diffusion break pattern disposed between the first and second nanosheet structures in a first direction. a first epitaxial pattern is disposed between the first nanosheet structure and the diffusion break pattern and is in direct contact therewith. a second epitaxial pattern is disposed between the second nanosheet structure and the diffusion break pattern and is in direct contact therewith. at least one of imaginary first lines connecting a first contact point of an end portion between the diffusion break pattern and the first epitaxial pattern and a second contact point at an end portion between the diffusion break pattern and the second epitaxial pattern extends to have an angle less than about 30 degrees with respect to the first direction.
Inventor(s): DONGHOON HWANG of Suwon-si (KR) for samsung electronics co., ltd., MYUNGIL KANG of Suwon-si (KR) for samsung electronics co., ltd., MINCHAN GWAK of Suwon-si (KR) for samsung electronics co., ltd., Kyungho KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyung Hee CHO of Suwon-si (KR) for samsung electronics co., ltd., DOYOUNG CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775
Abstract: a three-dimensional semiconductor device includes a first active region on a substrate, the first active region including a lower channel pattern and a lower source/drain pattern connected to the lower channel pattern, a second active region stacked on the first active region, the second active region including an upper channel pattern and an upper source/drain pattern connected to the upper channel pattern, a gate electrode on the lower channel pattern and the upper channel pattern, a lower contact electrically connected to the lower source/drain pattern, the lower contact having a bar shape extending on the lower source/drain pattern in a first direction, a first active contact coupled to the lower contact, and a second active contact coupled to the upper source/drain pattern. a first width of the lower source/drain pattern in a second direction is larger than a second width of the lower contact in the second direction.
20240105745.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanho PARK of Suwon-si (KR) for samsung electronics co., ltd., Hongkyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Byoungho KWON of Suwon-si (KR) for samsung electronics co., ltd., Kyungrae BYUN of Suwon-si (KR) for samsung electronics co., ltd., Minhwan JEON of Suwon-si (KR) for samsung electronics co., ltd., Hwiyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: provided is an image sensor including a sensor substrate, a spacer layer on the sensor substrate, and a color separating lens array on the spacer layer and configured to separate light based on a wavelength of the light, wherein the color separating lens array includes a first lens layer including a plurality of first nano posts and a first peripheral material layer around the plurality of first nano posts, a chemical mechanical polishing (cmp) stop layer on the first peripheral material layer, an etch stop layer on an upper surface of the cmp stop layer and directly on an upper surface of each first nano post of the plurality of first nano posts, and a second lens layer on the etch stop layer, the second lens layer including a plurality of second nano posts and a second peripheral material layer around the plurality of second nano posts.
Inventor(s): Jongmin JEON of Suwon-si (KR) for samsung electronics co., ltd., Hajin LIM of Suwon-si (KR) for samsung electronics co., ltd., Keewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kijoong YOON of Suwon-si (KR) for samsung electronics co., ltd., Taeksoo JEON of Suwon-si (KR) for samsung electronics co., ltd., Jsesung Hur of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B5/04
Abstract: an image sensor includes a light detector disposed on a substrate and including a plurality of light sensing cells, an interlayer device disposed on the light detector and configured to transmit a light, and a nano prism including a first nano post and a second nano post spaced apart from each other on the interlayer device and configured to condense a light onto the light detector, the first nano post includes a first refractive layer doped with aluminum at a first doping concentration, and a second refractive layer surrounding a bottom surface and a side surface of the first refractive layer and doped with aluminum at a second doping concentration, and the first doping concentration is higher than the second doping concentration.
Inventor(s): Dusik JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: a film for transferring an image sensor includes: a first surface and a second surface opposite the first surface in a vertical direction; protrusion portions disposed in a horizontal direction on the first surface; and a recess on each of the protrusion portions.
Inventor(s): Changsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinhong Kim of Suwon-si (KR) for samsung electronics co., ltd., Yong-Hee Cho of Suwon-si (KR) for samsung electronics co., ltd., Cheheung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jooho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a capacitor includes a lower electrode, an upper electrode disposed to face the lower electrode, and a dielectric layer between the lower electrode and the upper electrode. the lower electrode includes a first lower electrode layer apart from the dielectric layer and a second lower electrode layer between the first lower electrode layer and the dielectric layer. the second lower electrode layer includes vanadium oxide.
Inventor(s): Jungmin Park of SUWON-SI (KR) for samsung electronics co., ltd., Intak Jeon of SUWON-SI (KR) for samsung electronics co., ltd., Hanjin Lim of SUWON-SI (KR) for samsung electronics co., ltd., Hyungsuk Jung of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/30, H10B12/00
Abstract: a capacitor structure includes a first lower conductive pattern, a first capacitor, a first upper conductive pattern, a second lower conductive pattern, a second capacitor and a second upper conductive pattern. the first capacitor includes first lower electrodes, first upper electrodes and first dielectric structures. each of the first dielectric structures are disposed between one of the first lower electrodes and a corresponding one of the first upper electrodes. the first upper conductive pattern is formed on and is electrically connected to the first upper electrodes. the second lower conductive pattern is spaced apart from the first lower conductive pattern disposed on the substrate. the second capacitor includes second lower electrodes, second upper electrodes and second dielectric structures. the second upper conductive pattern is formed on and is electrically connected to the second upper electrodes. the first and second conductive patterns are electrically insulated from each other.
20240105773.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hae Jun YU of Suwon-si (KR) for samsung electronics co., ltd., Kyung In CHOI of Suwon-si (KR) for samsung electronics co., ltd., Soon Wook JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/08, H01L29/417, H01L29/423, H01L29/775, H01L29/786
Abstract: there is provided a semiconductor device having improved performance and reliability. a semiconductor device comprises an active pattern extending in a first direction, a gate structure including a gate electrode, a gate spacer, and a gate capping pattern on the active pattern, the gate electrode extending in a second direction different from the first direction and the gate capping pattern including a lower gate capping pattern and an upper gate capping pattern; a source/drain pattern disposed on the active pattern; and a source/drain etch stop film disposed on an upper surface of the source/drain pattern and extending along a sidewall of the gate spacer. the lower gate capping pattern is disposed on an upper surface of the gate electrode and an upper surface of the gate spacer, and the source/drain etch stop film does not extend along a sidewall of the lower gate capping pattern.
20240105776.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Namkyu Cho of Suwon-si (KR) for samsung electronics co., ltd., Seokhoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungtaek Kim of Suwon-si (KR) for samsung electronics co., ltd., Pankwi Park of Suwon-si (KR) for samsung electronics co., ltd., Seojin Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L21/02, H01L29/06, H01L29/161, H01L29/423, H01L29/66, H01L29/775
Abstract: a semiconductor device includes a substrate including an active region extending in a first direction, a gate structure intersecting the active region on the substrate and extending in a second direction, where the active region includes a recessed region at at least one side of the gate structure, a plurality of channel layers on the active region, spaced apart from each other in a third direction that is substantially perpendicular to an upper surface of the substrate, and at least partially surrounded by the gate structure and a source/drain region in the recessed region of the active region and connected to the plurality of channel layers.
Inventor(s): WONHYUK LEE of Suwon-Si (KR) for samsung electronics co., ltd., SANGDUK PARK of Suwon-Si (KR) for samsung electronics co., ltd., DONGSOO SEO of Suwon-Si (KR) for samsung electronics co., ltd., JINWOOK LEE of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L27/092, H01L29/06, H01L29/423, H01L29/45, H01L29/775
Abstract: embodiments of the present inventive concepts provide a semiconductor device including a substrate that includes an active pattern, a channel pattern disposed on the active pattern, a first source/drain pattern and a second source/drain pattern that are connected to the plurality of semiconductor patterns, a gate electrode disposed on the plurality of semiconductor patterns, and a first active contact electrically connected to the first source/drain pattern and a second active contact electrically connected to the second source/drain pattern. in one aspect, the channel pattern includes a plurality of semiconductor patterns that are spaced apart from and vertically stacked on each other. in one aspect, the gate electrode includes inner electrodes disposed between neighboring semiconductor patterns of the plurality of semiconductor patterns and an outer electrode disposed on an uppermost semiconductor pattern.
20240105790.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongjin KUH of Suwon-si (KR) for samsung electronics co., ltd., Bongsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Yoonjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongsoo WOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H10B12/00
Abstract: provided is an integrated circuit device including a substrate including a first active area and a second active area each extending in a first direction, a bit line extending in the first direction in a first trench of the substrate and arranged between the first active area and the second active area in a second direction perpendicular to the first direction, a contact structure including a lower contact contacting the bit line and an upper contact contacting the first active area, a word line extending in the second direction in a second trench of the substrate, a plurality of landing pads on the substrate, and a capacitor structure including a plurality of lower electrodes on the plurality of landing pads, wherein the bit line and the word line are buried under an upper surface of the substrate.
Inventor(s): Daeyoung MOON of Suwon-si (KR) for samsung electronics co., ltd., Jamin Koo of Suwon-si (KR) for samsung electronics co., ltd., Kyuwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonghyeok Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyokyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Kisoo Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H10B12/00
Abstract: an integrated circuit device includes a substrate including a plurality of active regions; a plurality of device isolation layers provided in the substrate and defining the plurality of active regions; a plurality of bitlines spaced apart from each other in a first horizontal direction on the substrate and extending in a second horizontal direction crossing the first horizontal direction; a plurality of insulating fences spaced apart from each other in the second horizontal direction and provided between adjacent bitlines of the plurality of bitlines; a plurality of buried contacts connected to the plurality of active regions and provided between adjacent bitlines of the plurality of bitlines and between the plurality of insulating fences; and a plurality of vertical insulating layers vertically positioned between the plurality of insulating fences and the plurality of buried contacts.
Inventor(s): Sunghwan JANG of Suwon-si (KR) for samsung electronics co., ltd., Dohee KIM of Suwon-si (KR) for samsung electronics co., ltd., Pyung MOON of Suwon-si (KR) for samsung electronics co., ltd., Sunguk JANG of Suwon-si (KR) for samsung electronics co., ltd., Mina SEOL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L21/02, H01L21/308, H01L29/40
Abstract: in a method of manufacturing a semiconductor device, a first selective epitaxial growth (seg) process is performed on a substrate to form a first channel. a first etching process is performed to form a first recess through the first channel and an upper portion of the substrate. a sidewall of the first channel exposed by the first recess is slanted with respect to an upper surface of the substrate. a second seg process is performed to form a second channel on a surface of the substrate and the sidewall of the first channel exposed by the first recess. a gate structure is formed to fill the first recess. an impurity region is formed at an upper portion of the substrate adjacent to the gate structure.
Inventor(s): Jaehyok KO of Suwon-si (KR) for samsung electronics co., ltd., Changsig KANG of Suwon-si (KR) for samsung electronics co., ltd., Junhyeok KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/861, H01L27/02, H01L29/06, H01L29/417
Abstract: an electrostatic discharge (esd) device may include a semiconductor substrate, a base well in the semiconductor substrate, a first region including a first impurity region having a first conductivity type within the base well, a second region apart from the first region in a horizontal direction in the base well and including a second impurity region having a second conductivity type a first silicide layer at least partially overlapping the first impurity region in a vertical direction on the first impurity region, and a second silicide layer on the second impurity region and apart from the first silicide layer in the horizontal direction. the second silicide layer may at least partially overlap the second impurity region in the vertical direction. the second conductivity type may be opposite the first conductivity type.
Inventor(s): Shang Hyeun PARK of Yongin-si (KR) for samsung electronics co., ltd., Deukseok CHUNG of Yongin-si (KR) for samsung electronics co., ltd., Tae Gon KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Min Jong BAE of Yongin-si (KR) for samsung electronics co., ltd., Shin Ae JUN of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L25/16
Abstract: a display panel including a wavelength conversion structure that includes a base structure including partition walls that define a first space and a second space, a first quantum dot composite disposed in the first space, and a second quantum dot composite disposed in the second space. the height of the partition wall is greater than or equal to about 5 micrometers and less than or equal to about 50 micrometers, and the first quantum dot composite provides a first top surface and the second quantum dot composite provides a second top surface. a production method for making the wavelength conversion structure uses a first ink composition that includes first quantum dots and a first matrix, and a second ink composition that includes second quantum dots and a second matrix.
20240105886.DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeongshan NA of Suwon-si (KR) for samsung electronics co., ltd., Youngchol LEE of Suwon-si (KR) for samsung electronics co., ltd., Naewon JANG of Suwon-si (KR) for samsung electronics co., ltd., Dukjin JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L27/15
Abstract: a display apparatus comprises: a light source device configured to emit light; a display panel configured to display the light emitted from the light source device; and an optical sheet disposed at a rear of the display panel, wherein the light source device may include: a substrate; at least one light source electrically connected to the substrate; a light conversion member configured to convert a wavelength of light emitted from the light source; and a conversion member cover covering the light conversion member and configured to allow light to pass therethrough.
Inventor(s): Victor ROEV of Suwon-si (KR) for samsung electronics co., ltd., Jusik Kim of Suwon-si (KR) for samsung electronics co., ltd., Myungjin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M10/0562, H01M4/04, H01M4/62, H01M10/0525
Abstract: an all-solid battery including a cathode including a cathode active material layer; an anode including an anode current collector, and an interlayer disposed on the anode current collector; and a solid electrolyte layer disposed between the cathode and the anode, the solid electrolyte layer including a porous first surface facing the anode, and an opposite second surface, wherein the interlayer of the anode faces the solid electrolyte layer, and the interlayer includes a water-soluble first layer and a second layer disposed on the first layer, the second layer facing the anode current collector, wherein the first layer includes a first binder on at least a portion of the porous first surface of the solid electrolyte layer, and wherein the second layer includes an organic second binder.
Inventor(s): Jungho CHU of Gyeonggi-do (KR) for samsung electronics co., ltd., Shihyun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Seonyoung PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Tari PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Kiyoun JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Sinyoung JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01M50/466, H01M4/36, H01M10/04, H01M50/538, H04M1/02
Abstract: an electronic device may include a processor, and a battery configured to supply power to the processor. the battery may include multiple first electrodes including first tabs configured to protrude toward a first direction, multiple second electrodes including second tabs configured to protrude toward the first direction, and a separator configured to restrict contact between the multiple first electrodes and the multiple second electrodes. the separator may include a first separator configured to be folded in a second direction perpendicular to the first direction or a fourth direction opposite to the second direction, the first separator including multiple through-holes configured to accommodate the first tabs and the second tabs, and a second separator configured to be folded in the first direction or a third direction opposite to the first direction, the second separator being alternately stacked with the first separator. in addition, various embodiments may be possible.
20240106103.ELECTRONIC DEVICE COMPRISING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gyusub KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiho KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungmoon SEOL of Suwon-si (KR) for samsung electronics co., ltd., Seongyong AN of Suwon-si (KR) for samsung electronics co., ltd., Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyihyun JANG of Suwon-si (KR) for samsung electronics co., ltd., Myunghun JEONG of Suwon-si (KR) for samsung electronics co., ltd., Nakchung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/22, H01Q1/48, H01Q5/40
Abstract: an electronic device is provided. the electronic device includes a housing including a lateral member including a first side surface, a second side surface, and a third side surface, a first conductive portion segmented through a first segmentation portion, a substrate including a ground, and a wireless communication circuit disposed on the substrate, the first conductive portion includes a first power feed unit, a second power feed unit, a first ground part, and a second ground part.
Inventor(s): Soonheung KWON of Suwon-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd., Ahyun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sumin YUN of Suwon-si (KR) for samsung electronics co., ltd., Hyungjoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q9/04, H01Q1/24, H01Q1/48, H01Q5/10
Abstract: an electronic device includes a substrate including a ground layer; and a plurality of antenna structures space apart from each other on the substrate. each of the plurality of antenna structures may include, on the substrate: a rectangular first conductive patch including a pair of cutting portions in which diagonally opposite corners are cut; a rectangular second conductive patch disposed so as to be coupled to the first conductive patch; and a plurality of conductive pads which are disposed along the periphery of the second conductive patch so as to be spaced apart from each other at a specified interval, and are electrically connected to the ground layer.
Inventor(s): Yangdon LEE of Suwon-si (KR) for samsung electronics co., ltd., Taejun KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00
Abstract: provided is an electronic device configured to charge at least one charging service use device and an operating method thereof. an embodiment of the present disclosure provides an electronic device configured to receive charging state information including at least one of device identification information, charging specifications, a current remaining battery capacity, and an expected discharge time from at least one charging service use device, generate a charging schedule for charging the at least one charging service use device based on a remaining capacity of a built-in battery and the received charging state information, move to a location of a charging target device determined based on the charging schedule, and supply power stored in the built-in battery to the charging target device by connecting to a charging terminal of the charging target device to charge the charging target device.
Inventor(s): Kyung Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Gyu Sik KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung Jin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jae Hong JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03L7/093, G05F3/26, H03L1/00, H03L7/099
Abstract: a phase locked loop circuit and a semiconductor device are provided. the phased locked loop circuit includes a reference current generator configured to generate a summed compensation current in which at least one of a process change, a temperature change or a power supply voltage change are compensated and output the summed compensation current as a reference current, a current digital-to-analog converter configured to convert the reference current into a control current in accordance with a digital code and a voltage control oscillator configured to generate a signal based on the control current, wherein the summed compensation current is based on weighted-averaging a first type compensation current and a second type compensation current in response to at least one of the process change, the temperature change or the power supply voltage change.
Inventor(s): Dae-Yeol Yang of Suwon-si (KR) for samsung electronics co., ltd., BOHWAN JUN of Suwon-si (KR) for samsung electronics co., ltd., HONG RAK SON of Suwon-si (KR) for samsung electronics co., ltd., GEUNYEONG YU of Suwon-si (KR) for samsung electronics co., ltd., YOUNGJUN HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M13/11, H03M13/00
Abstract: a g-ldpc decoder is provided. the g-ldpc decoder includes: a generalized check node decoder configured to, in each of a plurality of iterations: group connected variable nodes into groups, the connected variable nodes being connected to an mgeneralized check node among generalized check nodes; generate test patterns in each of one or more of the groups based on a first message received by the mgeneralized check node from the connected variable nodes; and identify a value of a second message to be provided from the mgeneralized check node to the connected variable nodes based on the test patterns; and a ldpc decoder circuitry configured to, in each of the iterations, update a value of an nvariable node, among the variable nodes, based on the second message received by the nth variable node from a generalized check node that is connected to the nth variable node.
Inventor(s): Yongbeen YUN of Suwon-si (KR) for samsung electronics co., ltd., Joongkwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongho PARK of Suwon-si (KR) for samsung electronics co., ltd., Wonhyung HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/40
Abstract: according to various embodiments, an electronic device may include: an antenna, an antenna tuner, a transceiver, a power amplifier electrically connected to the antenna tuner and configured to perform power amplification according to an execution of impedance matching, and at least one processor operatively connected to the transceiver, the antenna tuner, and the power amplifier. the at least one processor may be configured to: configure a reference tuner code for the antenna tuner connected to the antenna in a signal path of the transceiver and identify a reflection coefficient of the antenna, calculate a tuner code of the antenna tuner based on whether the identified reflection coefficient of the antenna has been changed and an operation of at least one component of the antenna tuner, and perform the impedance matching of the antenna.
Inventor(s): Yosub PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyojin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hanjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/00, H04L27/26
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a data transmission rate higher than that of a 4g communication system, such as lte. according to one embodiment of the present disclosure, a base station of a communication system confirms a subcarrier spacing in which a signal is to be transmitted to or received from a terminal, transmits, to the terminal, a signal including information that indicates the allocation of additional symbols and/or the number of additional symbols, generates data allocation information for data on the basis of the allocation of the additional symbols, and transmits the data allocation information and the data to the terminal, wherein the additional symbols can be allocated to the predetermined part of a first slot at every 0.5 ms of boundary.
Inventor(s): Yi WANG of Beijing (CN) for samsung electronics co., ltd., Yingyang LI of Beijing (CN) for samsung electronics co., ltd., Shichang ZHANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0446, H04W72/20
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. embodiments of the present invention provide a method for transmitting a signal, comprising: selecting a starting position of the signal from a set of candidate starting positions for transmitting the signal; determining a symbol mapping of the signal based on a selected starting position or a set of candidate starting positions of the signal; and transmitting the signal is based on the symbol mapping. the embodiment of the invention also provides a corresponding apparatus.
Inventor(s): Jong-Seon NO of Seoul (KR) for samsung electronics co., ltd., Yongwoo LEE of Seoul (KR) for samsung electronics co., ltd., Young-Sik KIM of Gwangju (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/08, G06F7/523, G06F7/76, G06F17/16, H04L9/00, H04L9/06
Abstract: a processor-implemented method with homomorphic encryption includes: receiving a first ciphertext corresponding to a first modulus; generating a second ciphertext corresponding to a second modulus by performing modulus raising on the first ciphertext; and performing bootstrapping by encoding the second ciphertext using a commutative property and an associative property of operations included in a rotation operation.
Inventor(s): SUMIN KIM of SUWON-SI (KR) for samsung electronics co., ltd., HYUNG SUN LIM of SUWON-SI (KR) for samsung electronics co., ltd., HONGMIN CHOI of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/36, H04B1/40
Abstract: an electronic device includes a processor that converts am-am data and am-pm data into complex domains for each of a plurality of different amplitudes to acquire a plurality of preprocessed data parts, converts the plurality of preprocessed data parts into a time domain to generate a plurality of filters for each of a plurality of different amplitudes, generates an output signal by performing a convolution on an input signal with the plurality of filters, and models a non-linear memory system using the input signal and the output signal.
Inventor(s): Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seungbeom JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L41/5067, H04W76/40
Abstract: the disclosure relates to a fifth-generation (5g) or a sixth-generation (6g) communication system for supporting higher data rates, especially, for performing quality of experience (qoe) measurement and reporting for multimedia broadcast service (mbs) services are provided. a method performed by a terminal in a wireless communication system is provided. the method includes receiving, from a base station, a message including information to configure an application layer measurement while the terminal is in a radio resource control (rrc) connected state, the information including a configuration of qoe measurements for multimedia broadcast service (mbs) broadcast, identifying whether the information further includes an indicator for identifying at least one rrc state for which the configuration is applied, and in case that the information further includes the indicator, performing the qoe measurements using the configuration, based on the indicator.
Inventor(s): Sungja Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L51/02, H04L51/216
Abstract: an electronic apparatus may include a communication interface, a memory configured to store at least one instruction, and one or more processors configured to generate response information based on conversation content received through the communication interface by executing the at least one instruction to: identify a user request by confirming a current request and a previous request of a user in the conversation content, identify whether the user request is a multi-turn request or a single-turn request based on the conversation content, generate a confirmation request to request the user to confirm the user request based on the user request being identified as the single-turn request, and omit a generation of the confirmation request and generate a response corresponding to the user request based on the user request being identified as the multi-turn request.
Inventor(s): Seunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Heecheul MOON of Suwon-si (KR) for samsung electronics co., ltd., Kwonho SON of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
Abstract: an electronic device includes a hinge, a first housing and a second housing rotatably connected to each other by the hinge, a flexible display disposed in the first housing and the second housing, a first circuit board disposed in the first housing, a flexible circuit board which is electrically connected to the first circuit board and extends from the first housing and across the hinge, and a slide structure which is connected to the flexible circuit board and is slidably connected with the first housing, wherein the slide structure slides together with a portion of the flexible circuit board in the first housing while the electronic device is being folded or unfolded via the hinge.
Inventor(s): Kwang-Youn KIM of Seoul (KR) for samsung electronics co., ltd., Won-Nam JANG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04M3/493, G06F3/04817, G06F3/0482, G06F3/04842, G06F3/0487, G06F3/16, G06F16/33, G06F16/957, G10L15/22
Abstract: an example electronic apparatus for providing voice recognition control includes a display; and a processor, wherein the processor may be configured to obtain a content including at least one object; distinguish the at least one object within the content; display an instruction text in correspondence with a non-text object among the at least one object; and select the non-text object corresponding to the instruction text if a voice command corresponding to the instruction text is inputted.
Inventor(s): Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/523, H04N19/103, H04N19/176, H04N19/513
Abstract: provided is a video decoding method including: obtaining, from a sequence parameter set, sequence merge mode with motion vector difference (sequence mmvd) information indicating whether an mmvd mode is applicable in a current sequence; when the mmvd mode is applicable according to the sequence mmvd information, obtaining, from a bitstream, first mmvd information indicating whether the mmvd mode is applied in a first inter prediction mode for a current block included in the current sequence; when the mmvd mode is applicable in the first inter prediction mode according to the first mmvd information, reconstructing a motion vector of the current block which is to be used in the first inter prediction mode, by using a distance of a motion vector difference and a direction of a motion vector difference obtained from the bitstream; and reconstructing the current block by using the motion vector of the current block.
Inventor(s): Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/53, H04N19/139, H04N19/176
Abstract: in a video encoding and decoding process, a video decoding method and a video decoding apparatus are provided to for determining whether a motion vector of an adjacent block at a location corresponding to one motion vector resolution among a plurality of motion vector resolutions is available, when the motion vector of the adjacent block is available, obtaining the motion vector of the adjacent block as a motion vector predictor of a current block, when the motion vector of the adjacent block is unavailable, obtaining a default motion vector by using a motion vector of one of two other adjacent blocks of the current block as a motion vector predictor of the current block, and performing prediction on the current block based on the motion vector predictor of the current block.
Inventor(s): Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/53, H04N19/139, H04N19/176
Abstract: in a video encoding and decoding process, a video decoding method and a video decoding apparatus are provided to for determining whether a motion vector of an adjacent block at a location corresponding to one motion vector resolution among a plurality of motion vector resolutions is available, when the motion vector of the adjacent block is available, obtaining the motion vector of the adjacent block as a motion vector predictor of a current block, when the motion vector of the adjacent block is unavailable, obtaining a default motion vector by using a motion vector of one of two other adjacent blocks of the current block as a motion vector predictor of the current block, and performing prediction on the current block based on the motion vector predictor of the current block.
Inventor(s): Sukhoon YOON of Suwon-si (KR) for samsung electronics co., ltd., Kwanyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Minsup KIM of Suwon-si (KR) for samsung electronics co., ltd., Kihyun SONG of Suwon-si (KR) for samsung electronics co., ltd., Wonjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongkeun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/422
Abstract: a remote control device is disclosed. a remote control device includes: a user interface; a memory storing at least one instruction and a plurality of binary codes; a communication interface; and at least one processor operatively connected with the user interface, the memory, and the communication interface and configured to execute the at least one instruction to: identify, based on a user command receiving through the user interface, a binary code corresponding to the user command from among the plurality of binary codes, identify, based on a pre-set number of bit units, a plurality of bit groups corresponding to the binary code, and control the communication interface to transmit a first pulse signal corresponding to the plurality of bit groups.
Inventor(s): Heejin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/11, G01J3/28, H04N23/73
Abstract: an image acquisition apparatus includes a multispectral imaging sensor for acquiring images of at least four channels based on a wavelength band of about 10 nm to about 1000 nm and a processor for setting an exposure time for each of the four channels based on transmission efficiency and quantum efficiency for each wavelength of each of the four channels and generating an hdr image using image signals corresponding to the four channels and obtained according to the set exposure time.
Inventor(s): Yunwon MOON of Suwon-si (KR) for samsung electronics co., ltd., Sungkoo CHO of Suwon-si (KR) for samsung electronics co., ltd., Jihyung HA of Suwon-si (KR) for samsung electronics co., ltd., Sangyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungah CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/52, F24C15/00
Abstract: a cooking device includes a main body, a cooking chamber inside the main body, a grill heater provided in an upper portion of the cooking chamber and including a plurality of straight sections arranged in parallel and a plurality of curved sections connecting the plurality of straight sections, a camera module disposed above the grill heater and configured to photograph the inside of the cooking chamber, and first and second lighting modules disposed on both sides of the camera module above the grill heater and configured to radiate light toward the inside of the cooking chamber. portions of at least some of the plurality of straight sections and portions of at least some of the plurality of curved sections are detour sections bypassing a photographing area of the camera module, a light irradiation area of the first lighting module, and a light irradiation area of the second lighting module so that the grill heater does not interfere with the photographing area of the camera module, the light irradiation area of the first lighting module, and the light irradiation area of the second lighting module.
Inventor(s): Kiyun JO of Suwon-si (KR) for samsung electronics co., ltd., Jongjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Heeyun CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Kihuk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/52, H04N23/54
Abstract: a camera module according to an embodiment may comprise: a printed circuit board including a first opening; a housing assembly comprising a housing arranged on a first surface of the printed circuit board; a first rear member comprising a plate arranged on a second surface of the printed circuit board, and arranged to overlap with the first opening and a part of the printed circuit board; a second rear member comprising a support arranged on the second surface of the printed circuit board and including a second opening in which the first rear member is arranged, and has a thickness thicker than a thickness of the first rear member; an image sensor arranged on one surface of the first rear member and exposed toward the housing assembly through the first opening; and at least one lens aligned to have the same optical axis of the image sensor, and arranged in the inner space of the housing assembly.
Inventor(s): Jungkweon BAE of Suwon-si (KR) for samsung electronics co., ltd., Myungho Kim of Suwon-si (KR) for samsung electronics co., ltd., Changmin Keum of Suwon-si (KR) for samsung electronics co., ltd., Junghyun Byun of Suwon-si (KR) for samsung electronics co., ltd., Seokjae Chung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/74, G03B7/18, G06V10/75, G06V40/10, H04N23/55, H04N23/71, H04N23/75
Abstract: a projecting device includes a light source configured to output an image light; a projection lens configured to externally project the image light; a camera configured to photograph an object positioned between the camera and an external projection surface of the image light that is projected; a light blocker configured to block the image light output by the light source during a blocking period; and at least one processor configured to: obtain illuminance information regarding illuminance of the external projection surface, set the blocking period during which the image light output by the light source is blocked, based on the illuminance information, set a photographing period within the blocking period, control the light blocker to block the image light output by the light source during the blocking period, and control the camera to photograph the object during the photographing period.
Inventor(s): Geonwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Sung Kwang Cho of Suwon-Si (KR) for samsung electronics co., ltd., Yang Ho Cho of Suwon-si (KR) for samsung electronics co., ltd., Dong Kyung Nam of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/84
Abstract: an optimization method includes determining first information related to a difference between the color filter spectrum and the color spectrum or a difference between an image transformed by the color transformation matrix and a ground truth (gt) image in the reset color space, determining second information representing smoothness of the color filter spectrum, third information representing a transmittance of the color filter spectrum, calculating a cost value based on the first information, the second information, and the third information, compare the calculated cost value and a threshold, and updating one of the filter spectrum information and the color transformation matrix in response to the calculated cost value being equal to or greater than the threshold.
Inventor(s): Junseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Raeyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Keunjoo Park of Suwon-si (KR) for samsung electronics co., ltd., Jaeha Park of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk Park of Suwon-si (KR) for samsung electronics co., ltd., Jiwon Im of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/47, H04N25/77
Abstract: a pixel of a vision sensor includes a photoelectric converter configured to convert an optical signal into a current, a current-to-voltage converter configured to convert the current into a first voltage, an amplifier configured to generate an output voltage by amplifying a voltage level of the first voltage, at least one comparator configured to identify whether an event occurs based on comparing the output voltage with at least one threshold voltage, and generate an event signal based on identifying that the event occurs, and at least one counter configured to receive the event signal from the at least one comparator, obtain a count value by counting the event signal as information about an amount of change in illumination, and transmit output data comprising the count value.
Inventor(s): Heesung Shim of Suwon-si (KR) for samsung electronics co., ltd., Seungsik Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaekyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun Lim of Suwon-si (KR) for samsung electronics co., ltd., Sungjae Jun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/771, H04N23/667, H04N25/531, H04N25/532
Abstract: an image sensor comprising a pixel array in which a plurality of pixels are arranged and a row driver . each of the pixel includes a photodiode, a transfer transistor for transferring photocharges of the photodiode to a floating diffusion node (fd), a conversion gain control transistor, a first source follower for amplifying and outputting the voltage of the fd to a first node, a precharge selection transistor connected between the first node and a second node, a first capacitor, a first sampling transistor connected between the second node and the first capacitor, a second capacitor, a second sampling transistor connected between the second node and the second capacitor, a second source follower for amplifying a voltage of the second node, a first selection transistor connected between the second source follower and a column line, and a second selection transistor connected between the first node and the column line.
Inventor(s): Seunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngsik CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/02
Abstract: according to various embodiments, an electronic device may include: a housing including a first housing oriented in a first direction and a second housing oriented in a second direction that is opposite to the first direction; a display disposed on the surface of the first housing oriented in the first direction; a window disposed on the surface of the display oriented in the first direction; a first adhesive member disposed along the edge of the surface of the display oriented in the second direction, such that the edge of the surface of the display oriented in the second direction is adhered to the surface of the first housing oriented in the first direction; and an actuator which is to positioned in the inner space of the housing so as to he positioned more on the second direction side than the display, and which generates sound by vibrating the display.
Inventor(s): Youngsang JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/10
Abstract: according to an embodiment, a wearable device includes: a housing, an audio port protruding from the housing in a first direction and configured to transmit an audio signal from an audio output circuit disposed in the housing, and an ear tip including a fastening part inserted in a pit disposed in an end portion of the audio port, an extension part extending from the fastening part in the first direction, a radiation surface including openings spaced apart from the extension part, a wing extending from a periphery of the radiation surface to the audio port. the extension part includes a first material, and the fastening part includes a second material having lower flexibility than a flexibility of the first material.
Inventor(s): Sanghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seonmi KIM of Suwon-si (KR) for samsung electronics co., ltd., Hangil MOON of Suwon-si (KR) for samsung electronics co., ltd., Kyoungho BANG of Suwon-si (KR) for samsung electronics co., ltd., Jaemo YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04S7/00, G10L21/055, H04B17/364
Abstract: an electronic device obtains acoustic signals through a plurality of microphones of a microphone array, while displaying a visual object on a display. the electronic device obtains first information related to propagated characteristics of the acoustic signals in a space where the microphone array is provided, based on the obtained acoustic signals. the electronic device changes an audio signal corresponding to the visual object based on the first information and second information for displaying the visual object in the display. the electronic device provides the changed audio signal using a speaker.
Inventor(s): Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd., Sapan Pramodkumar SHAH of Bangalore (IN) for samsung electronics co., ltd., Narendranath Durga TANGUDU of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W4/08
Abstract: a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot) are provided. the embodiments herein disclose a method performed by a service enabler architecture layer (seal) server in a wireless communication system, the method comprising receiving, from a seal client, a group creation request; performing group creation based on the group creation request, creating group information during the group creation, transmitting, to a vertical application layer (val) server, group creation notification, and in response to receiving the group creation request, transmitting, to the seal client, a group creation response. the group creation notification comprises an identity list.
Inventor(s): Youngkyo BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/08, H04W76/40
Abstract: a method performed by a first entity in a wireless communication system is provided. the method includes receiving a first request message for receiving a multicast service from a second entity, detecting information about a multicast session identifier (id) from the first request message, requesting information about a fourth entity corresponding to the multicast session id from a third entity when the first entity does not correspond to the information about the multicast session id, receiving the information about the fourth entity corresponding to the multicast session id, identifying the fourth entity based on the information about the fourth entity, transmitting a multicast session join request message to the fourth entity, and receiving a message accepting multicast session join from the fourth entity.
Inventor(s): Himanshu SHARMA of Noida (IN) for samsung electronics co., ltd., Sakshi BHATIA of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): H04W4/12, H04W8/18
Abstract: the disclosure relates to a method for supporting rich communication service (rcs) auto-configuration failure. the method includes: monitoring a plurality of messages exchanged between a user device and a configuration server, detecting a first message received from the configuration server is a failure message, extracting a timer from header of the failure message and a rate limiting factor of service provider from one or more databases, setting an alarm in the user device for sending a second message to the configuration server, storing configuration information including the timer and the rate limiting factor into a sim memory, retrieving the stored configuration information from the sim memory with reference to a requesting mode, and configuring the user device to a third message to the configuration server based on the retrieved configuration information.
Inventor(s): Giho LEE of Suwon-si (KR) for samsung electronics co., ltd., Gupil CHEONG of Suwon-si (KR) for samsung electronics co., ltd., Juyeon JIN of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Bokun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/24, H04W76/11
Abstract: disclosed is an electronic device for performing coupling between external electronic devices. an electronic device may include a transceiver, a display, and at least one processor operatively coupled to the transceiver and the display. the processor may be configured to receive, from a first external electronic device, device capability information and coupling information, receive, from a second external electronic device, device capability information and coupling information, decide whether the first external electronic device and the second external electronic device are operable as a set, decide whether to display a user interface for the coupling, display the user interface for the coupling through the display, identify a user input through the user interface for the coupling, displayed through the display, and transmit first connection information to the first external electronic device and transmit second connection information to the second external electronic device, in response to identifying the user input.
Inventor(s): Seungbo YOO of Yongin-si (KR) for samsung electronics co., ltd., Daejoong KIM of Yongin-si (KR) for samsung electronics co., ltd., Hoon CHANG of Seoul (KR) for samsung electronics co., ltd., Namryul JEON of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/041, H04W12/0433, H04W24/10, H04W36/00, H04W36/04, H04W36/08, H04W74/08, H04W76/27, H04W80/02, H04W80/08
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). a handover method for a terminal according to one embodiment of the present disclosure may include: receiving, from a source cell, a message including information on one or more target cells for performing a fast handover; and performing a fast handover by reusing a radio bearer based on the received information.
Inventor(s): Deming XIU of Beijing (CN) for samsung electronics co., ltd., Yougang HUANG of Beijing (CN) for samsung electronics co., ltd., Ming JIN of Beijing (CN) for samsung electronics co., ltd., Haokun LIU of Beijing (CN) for samsung electronics co., ltd., Haoqiu SHE of Beijing (CN) for samsung electronics co., ltd., Yuhan HU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W16/18, H04W24/02, H04W24/08
Abstract: the disclosure relates to a method performed by a network node, comprising acquiring cell capacity information of a plurality of cells corresponding to a distributed unit (du) of a base station. the method comprises determining cell capacity summations corresponding to the du based on each cell corresponding to different cell capacities, based on the cell capacity information. the method comprises determining a predicted cell capacity of the plurality of cells based on the cell capacity summations, for the base station allocating a cell capacity with respect to each of the plurality of cells according to the predicted cell capacity.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04L41/0803, H04W56/00, H04W76/27
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services.
Inventor(s): Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., Donggun KIM of Seoul (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Alexander SAYENKO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W76/11
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present invention suggests a method and an operation for configuring a pdcp layer and a service data association protocol (sdap) layer, thereby facilitating an efficient flow-based qos process.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04L69/04
Abstract: disclosed are: a communication technique for merging, with iot technology, a 5g communication system for supporting a data transmission rate higher than that of a 4g system; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail, security, and safety related services, and the like) on the basis of 5g communication technology and iot-related technology. disclosed is an operating method of a terminal, comprising the steps of: receiving, from a base station, a radio resource control (rrc) message including information for indicating whether to use uplink data compression (udc); receiving data from an upper application layer of the terminal; compressing the data and encoding the compressed data; generating an uplink data compression (udc) header and a service data adaption protocol (sdap) header together; generating a block to which the udc header and the sdap header are bonded in the encoded data; and transmitting the block to a lower layer of the terminal.
Inventor(s): Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W76/30
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data rate. a method performed by a user equipment (ue) includes receiving from a base station first configuration information including information on frequencies for early measurement reporting (emr), receiving from the base station second configuration information including information on frequencies for cell reselection, transmitting to the base station a message including a measurement result of at least some of the frequencies for emr and the frequencies for cell reselection, and performing eps fallback to one frequency based on the measurement result. in case that the second configuration information comprises a field indicating fallback or the ue has switched to a connected mode to start an ip multimedia subsystem (ims) voice service, the message comprises a measurement result of at least some of the frequencies for cell reselection.
Inventor(s): Sangyeob JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). methods and devices are provided in a wireless communication system. configuration information on a measurement report is received from a base station. the configuration information includes first information on a first number of triggering cells. a first measurement report for at least one first cell fulfilling an entry condition is transmitted to the base station, in case that a second number of the at least one first cell is larger than or equal to the first number of triggering cells. a second measurement report for at least one second cell fulfilling a leaving condition is transmitted to the base station. the at least one second cell is in the first measurement report.
Inventor(s): Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Avneesh TIWARI of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/12
Abstract: a method for access control of a ue () connecting through a mobile base station relay (mbsr)-ue () in a wireless network () by an iab-donor gnb (). the method includes connecting the ue () to the iab-donor gnb () through a first mbsr-ue () to receive an emergency service in the wireless network. further, the method includes determining that the first mbsr-ue () is about to become unavailable to provide the emergency service to the ue () in the wireless network. further, the method includes transmitting a handover request message to the ue () to perform an handover procedure to move the ue () to a ng-ran node () before the first mbsr-ue () becomes unavailable in the wireless network upon determining that the first mbsr-ue () is about to become unavailable.
Inventor(s): Jeongseok YU of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunjeong KANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W40/22, H04W8/00
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system to support a data transmission rate higher than before. disclosed is a method performed by a first user equipment (ue), including obtaining configuration information including information on a threshold used for identifying, by the first ue performing a ue-to-ue (u2u) relay operation, whether to perform transmission of a second message based on a first message received by the first ue from a second ue, receiving, from the second ue, a first discovery message including information on the second ue, identifying, based on reference signal received power (rsrp) measured based on communication with the second ue and the threshold, whether to perform transmission of the second message based on the received first discovery message, and performing, based on a result of the identification, transmission of the second message based on the received first discovery message.
Inventor(s): Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04L69/327, H04W8/08, H04W60/04
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method for replacement of a dnn and/or s-nssai in a wireless communication system is provided.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W72/232, H04W76/28
Abstract: a method performed by at least one user equipment (ue) in a wireless communication system is provided. the method including receiving, from a base station, group downlink control information (dci) indicating a discontinuous reception (drx) or discontinuous transmission (dtx) pattern.
Inventor(s): Cheolkyu SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngbum KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunseok RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyoungmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L1/00, H04L5/00
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting higher data transmission rates. disclosed is a method performed by a first terminal in wireless communication system supporting sl, including identifying whether an s-prs sequence id for generation of an s-prs is obtained from a higher layer of the first terminal, generating the s-prs based on the obtained s-prs sequence id, in case that the s-prs sequence id is obtained from the higher layer of the first terminal, generating the s-prs sequence id based on a 12 lsbs of a crc for a pscch associated with the s-prs, generating the s-prs based on the generated s-prs sequence id, in case that the s-prs sequence id is not obtained from the higher layer of the first terminal, and transmitting the generated s-prs to a second terminal.
Inventor(s): Xiong QI of Beijing (CN) for samsung electronics co., ltd., Pengru LI of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00, H04W56/00
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. disclosed is a method performed by a first device in a communication system, including performing measurement of a first reference signal based on configuration information for the first reference signal, when the first device meets a predetermined condition, and reporting a result of the measurement, wherein the predetermined condition is based on at least one of location information, information related to downlink reference signals, and information related to at least one base station.
Inventor(s): Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04W72/21
Abstract: an apparatus in a wireless communication system and a method performed by the same are provided. the method includes determining whether uplink control information (uci) is multiplexed in a first physical uplink shared channel (pusch) including more than one transport block and/or whether the first pusch is simultaneously transmitted with a physical uplink control channel (pucch) including the uci, receiving information for scheduling transmission of the first pusch, and transmitting the first pusch and/or the pucch including the uci based on the determination. the disclosure can improve the communication efficiency.
Inventor(s): Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L1/00, H04W72/11, H04W72/232
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a terminal in a wireless communication system is provided. the method includes receiving, from a base station on a first cell, first downlink control information (dci) for scheduling multiple physical downlink shared channels (pdschs) on first multiple cells and receiving, from the base station, the multiple pdschs on the first multiple cells based on the first dci. at least one crc of the first dci is scrambled with at least one of a cell radio network temporary identifier (c-rnti) or a modulation coding scheme (mcs)-c-rnti
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/20
Abstract: the present disclosure provides an information configuration method, an information interaction method, and an address information update method. the information configuration method may be performed by a first node, and may include: transmitting, to a second node, a first configuration request message comprising a request for a bearer context setup; receiving, from the second node, a first configuration response message comprising a response to the bearer context setup request in the first configuration request message; and establishing a bear context based on the first configuration response message, wherein the first configuration request message comprises at least one of information related to data profile, or profile indication information.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/23
Abstract: the disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting a higher data transmission rate. a communication method and an electronic equipment are provided. the method includes receiving configuration information of periodical physical downlink control channel (pdcch) monitoring, wherein within each cycle of the configuration comprises a first time window and/or a second time window, and according to the configuration information, performing pdcch monitoring on type 3 common search space (css) and ue-specific search space (uss) in the first time window, and/or, skipping pdcch monitoring on type 3 css and uss in the second time window. by the embodiments of the disclosure, the user equipment (ue) periodically performs pdcch monitoring and/or skips pdcch monitoring to achieve the objective of power-saving, and it is avoided that ue cannot timely receive scheduling information to thereby cause data transmission delay.
Inventor(s): Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Alexander SAYENKO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/02, H04W36/00, H04W36/06, H04W76/19
Abstract: the present disclosure relates to a communication technique for converging a 5g communication system, which is provided to support a higher data transmission rate beyond a 4g system with an iot technology, and a system therefor. the disclosure may be applied to intelligent services (e.g., smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety related service, or the like) based on the 5g communication technology and the iot related technology. the disclosure relates to a method for recovering a beam into a correct beam according to a position of a terminal using a non-contention-based and contention-based beam failure recovery method in order to recover a beam failure in which communication is disconnected due to movement of a terminal or the like in a wireless communication system performing beam-based communication services.
Inventor(s): Dong gun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Bum KIM of Suwon-si (KR) for samsung electronics co., ltd., Soeng Hun KIM of Suwon-si (KR) for samsung electronics co., ltd., Alexander SAYENKO of Suwon-si (KR) for samsung electronics co., ltd., Jae Hyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Seung Ri JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04W76/30
Abstract: a method, performed by a user equipment (ue), of transmitting and receiving signals in a wireless communication system, according to an embodiment, includes receiving a logical channel release request from a next-generation node b (gnb), determining a logical channel to release, an operation mode of the logical channel to release, and whether a packet data convergence protocol (pdcp) layer apparatus connected to the logical channel is re-established, based on the logical channel release request, and performing pdcp data recovery based on the determination result.
20240107637.COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangwon YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaegyeong MA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/64
Abstract: the present disclosure relates to a cooking apparatus including an outer housing, an inner housing positioned inside the outer housing to provide a cooking chamber, a door provided in front of the inner housing to open and close the cooking chamber, a vent fan positioned in a separation space formed between the outer housing and the inner housing and including a discharge port to flow air through the discharge port, an electrical component located on a route along which air flowing by the vent fan moves, and an electrical component cover including an electrical component cover body provided to surround the electrical component to protect the electrical component from the air flowing by the vent fan.
Inventor(s): Keonwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongil KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B45/382, H02M3/335
Abstract: an electronic apparatus including a converter including a first transformer, the first transformer including a primary-side winding and a secondary-side winding; a first rectifier connected to the secondary-side winding of the first transformer, and including a diode; and a second transformer including a primary-side winding and a secondary-side winding, wherein the secondary-side winding of the first transformer is a single winding, and the primary-side winding of the second transformer is connected to a node to which the secondary-side winding of the first transformer and the diode included in the first rectifier are connected.
Inventor(s): Young-Gyun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Minjung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jeeyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Gyoosug LEE of Gyeongsangbuk-do (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, B29C43/00, B29C43/02, B29C43/50, B29C43/52, B32B1/00, B32B27/08, B32B27/30, B32B27/36, H04M1/02, H05K5/00
Abstract: an electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. the polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. other embodiments are also possible.
Inventor(s): Hyelim YUN of Suwon-si (KR) for samsung electronics co., ltd., Bongkyu MIN of Suwon-si (KR) for samsung electronics co., ltd., Dohoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Taewoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungje BANG of Suwon-si (KR) for samsung electronics co., ltd., Hyeongju LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K9/00, H05K1/11, H05K1/14, H05K1/18, H05K7/14
Abstract: an example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. the interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. the outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
20240107743.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JUNHYEOK AHN of SUWON-SI (KR) for samsung electronics co., ltd., KISEOK LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/108
Abstract: a semiconductor device includes; a substrate including an active region including a first region and a second region, a bitline extending in a first direction on the substrate and electrically connected to the first region of the active region, a spacer structure disposed on a side surface of the bitline, a contact structure disposed on a side surface of the spacer structure and electrically connected to the second region of the active region and a data storage structure disposed on the contact structure and electrically connected to the contact structure. the contact structure includes; a conductive contact layer including a first portion and a second portion disposed on the first portion, a barrier layer surrounding the first portion of the conductive contact layer, and an air gap surrounding the second portion of the conductive contact layer.
20240107751.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin A KIM of Suwon-si (KR) for samsung electronics co., ltd., Kang-Uk KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Hoon MIN of Suwon-si (KR) for samsung electronics co., ltd., Choong Hyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor memory device is provided. the semiconductor memory device comprises a substrate including a cell region having an active region defined by a cell element isolation layer, a peripheral region near the cell region, and a boundary region between the cell region and the peripheral region. the device includes a word line structure in the substrate and extending in a first direction, a bit line structure on the substrate extending from the cell region to the boundary region in a second direction that crosses the first direction, including first and second cell conductive layers sequentially stacked on the substrate, and a bit line contact between the substrate and the bit line structure and connecting the substrate with the bit line structure. the second cell conductive layer in the boundary region is thicker than the second cell conductive layer in the cell region.
Inventor(s): Dongwon LIM of Suwon-si (KR) for samsung electronics co., ltd., Inseok BAEK of Suwon-si (KR) for samsung electronics co., ltd., Sangbin AHN of Suwon-si (KR) for samsung electronics co., ltd., Seokyeong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seungyong HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: an integrated circuit device including a first cell block on a substrate that includes a first cell area, a first dummy cell area surrounding the first cell area in a plan view, the first dummy cell area including first active regions and second active regions in an outer periphery of the first dummy cell area, the first active regions each having a first size and the second active regions each having a second size larger than the first size, first and second word lines extending in a first direction and alternating with each other in a second direction, each of the first word lines including a first landing area extending between a second active region and a first active region, the first active region being near and apart from the second active region in the second direction, and first word line contacts on the first landing area may be provided.
Inventor(s): Sunghee CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Joongshik SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/522, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/35, H10B43/40, H10B80/00
Abstract: a semiconductor device includes a source structure including a plate layer and first and second horizontal conductive layers stacked in order on the plate layer, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the source structure, a channel structure penetrating through the gate electrodes, extending in the first direction, and including a channel layer in contact with the first horizontal conductive layer, and a separation region penetrating through the gate electrodes and extending in the first direction and in a second direction perpendicular to the first direction, wherein the first horizontal conductive layer extends horizontally below the separation region and has a seam overlapping the separation region in the first direction.
Inventor(s): Junhyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonyoung Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinhyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27
Abstract: a semiconductor device includes a gate electrode structure, a first division pattern, and a memory channel structure. the gate electrode structure includes gate electrodes stacked in a first direction and extending in a second direction. the first division pattern extends in the second direction through the gate electrode structure, and divides the gate electrode structure in a third direction. the memory channel structure extends through the gate electrode structure, and includes a channel and a charge storage structure. the first division pattern includes first and second sidewalls opposite to each other in the third direction. first recesses are spaced apart from each other in the second direction on the first sidewall, and second recesses are spaced apart from each other in the second direction on the second sidewall. the first and second recesses do not overlap in the third direction.
20240107770.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): So Hyeon Lee of Suwon-si (KR) for samsung electronics co., ltd., Sung Su Moon of Hwaseong-si (KR) for samsung electronics co., ltd., Jae Duk Lee of Seongnam-si (KR) for samsung electronics co., ltd., Ik-Hyung Joo of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/522, H10B41/10, H10B41/27, H10B41/40, H10B43/10, H10B43/40
Abstract: a semiconductor memory device includes; a first stacked structure including a first staircase portion, a second stacked structure on the first stacked structure and including a second staircase portion overlapping the first staircase portion, a first contact plug penetrating the first stacked structure and the second stacked structure, electrically connected to the first stacked structure and not electrically connected to the second stacked structure, and a second contact plug penetrating the first stacked structure and the second stacked structure, electrically connected to the second stacked structure and not electrically connected to the first stacked structure.
Inventor(s): JEON IL LEE of Suwon-si (KR) for samsung electronics co., ltd., KYUNGHWAN LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, G11C16/04, H10B51/10, H10B51/40
Abstract: a semiconductor memory device includes a cell string and a first conductive pillar and a second conductive pillar connected to the cell string. the cell string includes plural memory cells, which are stacked on a substrate to be spaced apart from each other. the first conductive pillar is spaced apart from the second conductive pillar in a first direction. each of the memory cells includes a channel layer that extends from the first conductive pillar to the second conductive pillar in the first direction, a ferroelectric layer on the channel layer, and an electrode on the ferroelectric layer. the channel layer comprises single crystalline silicon.
Inventor(s): Jeon Il LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H10B51/30, H10B51/40
Abstract: a semiconductor memory device includes first through structures on a substrate, the first through structures arranged in a first direction, an electrode adjacent to the first through structures and extending horizontally in the first direction along the first through structures, and a ferroelectric layer interposed between the electrode and the first through structures. each of the first through structures includes a first conductive pillar and a second conductive pillar spaced apart from each other in the first direction, a channel layer extending from a sidewall of the first conductive pillar to a sidewall of the second conductive pillar, the channel layer interposed between the ferroelectric layer and the first and second conductive pillars, the first and second conductive pillars being spaced apart from each other in the first direction and defining a first air gap. adjacent ones of the first through structures define a second air gap.
Inventor(s): Hyunmook Choi of Suwon-si (KR) for samsung electronics co., ltd., Hyunmog Park of Suwon-si (KR) for samsung electronics co., ltd., JIHONG KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H10B51/30
Abstract: an integrated circuit device includes a plurality of conductive lines on a semiconductor substrate, the plurality of conductive lines extending in a horizontal direction and overlapping each other in a vertical direction, a plurality of insulating layers alternating with the plurality of conductive lines in a vertical direction and extending in the horizontal direction, and a channel structure extending through the plurality of conductive lines and the plurality of insulating layers in the vertical direction. the channel structure includes a core insulating layer, a channel layer on a side wall and a bottom surface of the core insulating layer, an information storage layer on an outside wall of the channel layer, and a pad pattern covering a top surface of the core insulating layer. the pad pattern contacts a portion of the outside wall of the channel layer and a topmost surface of the information storage layer.
Inventor(s): Changseung LEE of Suwon-si (KR) for samsung electronics co., ltd., Kiyeon Yang of Suwon-si (KR) for samsung electronics co., ltd., Youngjae Kang of Suwon-si (KR) for samsung electronics co., ltd., Hajun Sung of Suwon-si (KR) for samsung electronics co., ltd., Dongho Ahn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/10, H10B63/00
Abstract: a phase-change memory structure includes lower and upper electrodes spaced apart from each other, and a phase-change material stack between the lower and upper electrodes. the phase-change material stack includes a plurality of phase-change layers, at least two phase-change layers of the plurality of phase-change layers have different phase-change temperatures, and a plurality of barrier layers between the plurality of phase-change layers the at least two phase-change layers of the plurality of phase-change layers have different thicknesses.
Inventor(s): Hyunmog Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00
Abstract: an integrated circuit device includes a plurality of conductive lines extending on a semiconductor substrate in a horizontal direction and overlapping each other in a vertical direction, a plurality of insulating layers alternating with the plurality of conductive lines and extending in the horizontal direction, and a channel structure extending through the plurality of conductive lines and the plurality of insulating layers. the channel structure includes a core insulating layer, a resistance change layer on a side wall and a bottom surface of the core insulating layer, a channel layer on an outside wall of the resistance change layer, and a pad pattern on a top surface of the core insulating layer. a topmost surface of the resistance change layer is in contact with the core insulating layer and is spaced apart from a bottommost surface of the pad pattern.
Inventor(s): Minsik MIN of Suwon-si (KR) for samsung electronics co., ltd., Sangmo KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Wook KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Daegu (KR) for samsung electronics co., ltd., Hyejin BAE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jhunmo SON of Yongin-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Seoul (KR) for samsung electronics co., ltd., Jun CHWAE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract: provided are the organometallic compound represented by formula 1 and an organic light-emitting device including the same:
Inventor(s): Minsik MIN of Suwon-si (KR) for samsung electronics co., ltd., Sangmo KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Wook KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Daegu (KR) for samsung electronics co., ltd., Hyejin BAE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jhunmo SON of Yongin-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Seoul (KR) for samsung electronics co., ltd., Jun CHWAE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract:
Inventor(s): Minsik MIN of Suwon-si (KR) for samsung electronics co., ltd., Sangmo KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Wook KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Daegu (KR) for samsung electronics co., ltd., Hyejin BAE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jhunmo SON of Yongin-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Seoul (KR) for samsung electronics co., ltd., Jun CHWAE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
Abstract: m, xto x, x, ring cyto ring cy, t, t, rto r, and ato ain formula 1 are the same as described in the present specification.
Inventor(s): Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Jeoung In YI of Suwon-si (KR) for samsung electronics co., ltd., Hyerim HONG of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D219/02, C07D293/10, C07D401/10, C07D471/06, C07D493/04, C07F7/08, H10K39/34, H10K85/40
Abstract: provided a compound represented by chemical formula 1, and a photoelectric device, a light absorption sensor, and an electronic device including the same.
Inventor(s): Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Jeoung In YI of Suwon-si (KR) for samsung electronics co., ltd., Hyerim HONG of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D219/02, C07D293/10, C07D401/10, C07D471/06, C07D493/04, C07F7/08, H10K39/34, H10K85/40
Abstract:
Inventor(s): Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Jeoung In YI of Suwon-si (KR) for samsung electronics co., ltd., Hyerim HONG of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D219/02, C07D293/10, C07D401/10, C07D471/06, C07D493/04, C07F7/08, H10K39/34, H10K85/40
Abstract: in chemical formula 1, the definition of each substituent is as described in the specification.
SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- A47J36/38
- A47J27/00
- A47J36/10
- Samsung electronics co., ltd.
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- B23Q3/15
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- B25J15/08
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- H10K85/60
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