SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on June 20th, 2024
SAMSUNG ELECTRONICS CO., LTD.: 210 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H01L23/00 (19), H01L25/065 (19), H01L23/31 (11), H01L23/48 (9), H01L29/06 (7) H01L25/0657 (4), H04W72/23 (4), G06N3/082 (2), H01L23/473 (2), H04W52/0229 (2)
With keywords such as: device, semiconductor, including, layer, surface, configured, data, substrate, based, and portion in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Sehee LEE of Suwon-si (KR) for samsung electronics co., ltd., Eunbee Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/0531, A61B5/00, A61B5/11
CPC Code(s): A61B5/0531
Abstract: various embodiments of the present disclosure may disclose an electronic device for measuring biometrics, and an operation method therefor. the disclosed wearable electronic device may include one or more first electrodes disposed on a first surface of the electronic device and in contact with a first part of a user; one or more second electrodes disposed on a second surface of the electronic device and in contact with a second part of the user; and a processor which measures the body impedance of the user by using the one or more first electrodes and the one or more second electrodes, and which determines the degree of movement of the user during body impedance measurement on the basis of deviation in body impedance.
Inventor(s): Ebrahim Nematihosseinabadi of San Jose CA (US) for samsung electronics co., ltd., Mohsin Ahmed of Sunnyvale CA (US) for samsung electronics co., ltd., Nafiul Rashid of Irvine CA (US) for samsung electronics co., ltd., Jilong Kuang of San Jose CA (US) for samsung electronics co., ltd., Jun Gao of Menlo Park CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/11
CPC Code(s): A61B5/6802
Abstract: in one embodiment, a method includes accessing first sensor data from a first sensor worn on a first portion of a user's body and accessing second sensor data from a second sensor worn on a second portion of the user's body. the method includes determining, based on both the first sensor data and the second sensor data, one or more first features related to the user's activity and determining, based on the first features, an initial classification of the user's activity. when the initial classification indicates a class that includes one or more subclasses that are more distinguishable by one of the sensors, then a specific subclassification may be determined based on sensor data from only that one sensor. otherwise, the classification of the user's activity may be based on the one or more first features that use data from both sensors.
Inventor(s): Hyojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeonseung OH of Suwon-si (KR) for samsung electronics co., ltd., Sungjune CHO of Suwon-si (KR) for samsung electronics co., ltd., Younglae JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A62B18/00, A61B5/08, A61M16/06, A62B7/10, A62B18/02
CPC Code(s): A62B18/006
Abstract: an electronic mask includes a memory configured to store default atmospheric pressure information corresponding to a user and a plurality of preset events corresponding to the default atmospheric pressure information, a pressure sensor configured to measure atmospheric pressure inside the electronic mask, a fan module configured to introduce outside air to inside of the electronic mask or discharge inside air to outside of the electronic mask, and at least one processor configured to obtain the measured atmospheric pressure through the pressure sensor, identify an event among the plurality of preset events based on the measured atmospheric pressure, and control the fan module to perform an operation corresponding to the identified event.
Inventor(s): Soojung BAE of Suwon-si (KR) for samsung electronics co., ltd., Sunae KIM of Suwon-si (KR) for samsung electronics co., ltd., Mijeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Kiwan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B21/00, A63B24/00, A63B71/06, H02J7/00
CPC Code(s): A63B21/4025
Abstract: a wearable walking assist and/or exercise device may detect a start of exercise of the user, select led lamps to be blinked from the plurality of led lamps included in the lighting module based on an exercise intensity of the wearable device, determine a blinking period of the selected led lamps based on a walking speed of the user, and blink the selected led lamps for the determined blinking period.
Inventor(s): Vinayak Narasimhan of Altadena CA (US) for samsung electronics co., ltd., Radwanul Hasan Siddique of Monrovia CA (US) for samsung electronics co., ltd., Wonjong Jung of Seoul (KR) for samsung electronics co., ltd., Kak Namkoong of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): B01L7/00, B01L3/00, B81B1/00, B81C1/00
CPC Code(s): B01L7/52
Abstract: a photothermal nanostructure device for photothermal heating includes a substrate having a first thermal conductivity, a light absorbing layer on a first side of the substrate and configured to absorb light in a wavelength range and to heat the substrate, and a thermally-insulative layer on the light absorbing layer and configured to reduce heat dissipation from the substrate, the thermally-insulative layer having a second thermal conductivity less than the first thermal conductivity.
Inventor(s): Sahand REZAEI-SHOSHTARI of Montreal (CA) for samsung electronics co., ltd., David Meger of Montreal (CA) for samsung electronics co., ltd., Francois Robert Hogan of St-Jean-Sur-Richelieu (CA) for samsung electronics co., ltd., Gregory Lewis Dudek of Westmount (CA) for samsung electronics co., ltd., Charlotte Morissette of Montreal CA (US) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J13/00
CPC Code(s): B25J9/163
Abstract: provided is a method for training a hypernetwork to provide a policy for use on a previously-unseen task. the hypernetwork may be trained at a robot factory and then shipped with a robot. at the point of deployment, the robot may be given a context for the previously-unseen task. the robot then uses the context and the hypernetwork to create a policy for performing the previously-unseen task. the policy represents an artificial intelligence machine generated for the previously-unseen task.
20240198521.ROBOT SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Takeshi YAMAGISHI of Yokohama-shi (JP) for samsung electronics co., ltd., Masaru OKUDA of Yokohama-shi (JP) for samsung electronics co., ltd., Yuki ABE of Yokohama-shi (JP) for samsung electronics co., ltd.
IPC Code(s): B25J9/16
CPC Code(s): B25J9/1664
Abstract: a robot system includes: an arm part; a tool part; and a connection part including a receiving part and a projection part, wherein the receiving part is provided on one of the arm part and the tool part, and the projection part is provided on the other one of the arm part and the tool part, and the receiving part is configured to connect the arm part and the tool part by securely receiving the projection part, and to disconnect the arm part from the tool part by releasing the projection part.
Inventor(s): Jisung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hankil PARK of Suwon-si (KR) for samsung electronics co., ltd., Sehwan HONG of Suwon-si (KR) for samsung electronics co., ltd., Myeonggeun LEE of Gumi-si (KR) for samsung electronics co., ltd., Seongjin JEONG of Gumi-si (KR) for samsung electronics co., ltd.
IPC Code(s): B29C65/00, B29C63/00, B29C63/22, B29L31/34
CPC Code(s): B29C66/8362
Abstract: disclosed is a film attachment apparatus for a housing of an electronic apparatus. the film attachment apparatus according to various embodiments, which adheres a film on the surface of a housing plate in an electronic apparatus having an edge portion having a curve, comprises: a jig configured to mount and fix the housing plate; a roller configured to press the film with respect to the housing plate; a vertical driving portion configured to move the roller from the upper portion to the lower portion of the surface of the housing plate, to which the film is adhered, and to press the roller with respect to the film; and a horizontal driving portion configured to move the roller from the surface of the housing plate in the direction toward the edge portion of the housing plate.
Inventor(s): Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Dosoo SUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B44F5/00, B44C1/22, B44C1/24
CPC Code(s): B44F5/00
Abstract: a home appliance can include: a body having an opening; a door to open and close the opening; and a color panel on at least one of the body or the door, the color panel including: a base panel including: a front surface, and an uneven pattern portion on the front surface, having upper sides, and lower sides that are at a height difference from the upper sides, and a color layer on the uneven pattern portion and including: main ink dots and sub ink dots having a size that is smaller than the main ink dots, wherein at least one sub ink dot is between each two adjacent main ink dots, and at least some of the sub ink dots are on at least one of a periphery of the upper sides or a periphery of the lower sides.
Inventor(s): Hoyoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd., Changheon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07C323/09, G03F7/004, G03F7/20
CPC Code(s): C07C323/09
Abstract: provided are a carboxylate salt represented by formula 1, a photoresist composition including the same, and a pattern forming method using the same:
Inventor(s): Hoyoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd., Changheon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07C323/09, G03F7/004, G03F7/20
CPC Code(s): C07C323/09
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract:
m(l)(l) formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract: wherein, mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/11, H10K50/15, H10K50/16, H10K85/30
CPC Code(s): C07F15/0033
Abstract: wherein xis c(r) or n, xis c(r) or n, xis c(r) or n, and xis c(r) or n; at least one of rto ris —si(q)(q)(q) or —ge(q)(q)(q); rand reach comprises deuterium; * and *′ each indicate a binding site to min formula 1; and the other substituent groups in formulae 1a and 1b are as defined herein.
Inventor(s): Dae Wee Kong of Suwon-si (KR) for samsung electronics co., ltd., Taewon Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangho Roh of Suwon-si (KR) for samsung electronics co., ltd., SongYi Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/455, H01J37/32
CPC Code(s): C23C16/45565
Abstract: a shower head may include a lower shower head part including a lower plate. the lower plate includes a lower plate, the lower plate includes a plurality of gas holes, the plurality of gas holes includes: a vertical hole vertically penetrating the lower plate in a first direction; and an inclined hole penetrating the lower plate in a second direction, which is inclined at an acute angle with respect to the first direction of the vertical hole, the vertical hole has a first diameter and the inclined hole has a second diameter which is different than the first diameter.
Inventor(s): Bobin KIM of Suwon-si (KR) for samsung electronics co., ltd., Haeyoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hansaem KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyoungae LIM of Suwon-si (KR) for samsung electronics co., ltd., Dongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeokjin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Romon SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/30, D06F29/00, D06F31/00, D06F34/04, D06F34/05, D06F34/08, D06F34/28, D06F58/36, D06F58/46, D06F101/12, D06F101/20, D06F105/10, D06F105/56, D06F105/58, D06F105/62, G05B19/042
CPC Code(s): D06F34/30
Abstract: disclosed herein is a washing machine and a control method thereof, and more particularly, to a technology capable of controlling washing modes in various manners by manipulating a control panel of the washing machine. the washing machine includes a display configured to display a washing mode, an inputter configured to receive a washing mode select command, a storage configured to store a selected washing mode, and a controller configured to allow a washing mode, which has the largest number of times selected during a predetermined number of times of washings, to be displayed on a first screen of the display, and in response to the number of the washing mode having the largest number of selection times being plural, configured to allow a washing mode, which is the last selected among the plurality of washing modes, to be displayed on the first screen of the display.
Inventor(s): Hyejoon SEOK of Suwon-si (KR) for samsung electronics co., ltd., Minjoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihaeng HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/44, D06F34/18, D06F34/26, D06F58/20, D06F58/38
CPC Code(s): D06F58/44
Abstract: the dryer apparatus according to the disclosure includes a drum configured to accommodate subjects to be dried, a dryness sensor configured to sense the humidity of the subjects to be dried, a hot wind supplying device configured to provide hot wind to the drum, and at least one processor configured to, based on a user input for a predetermined drying cycle being acquired, acquire a humidity value of the subjects to be dried through the dryness sensor, based on the humidity value of the subjects to be dried being less than a threshold value, perform a washing pre-processing cycle, and based on the humidity value of the subjects to be dried being greater than or equal to the threshold value, control the hot wind supplying device to perform the predetermined drying cycle, wherein the washing pre-processing cycle includes at least one of a cycle of rotating the drum, a cycle of providing moisture to the drum, or a cycle of providing hot wind to the drum based on threshold temperature information.
20240200814.OUTDOOR UNIT OF AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kwangnam SHIN of Suwon-si (KR) for samsung electronics co., ltd., Woong SUN of Suwon-si (KR) for samsung electronics co., ltd., Jaechan PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeonguk KOH of Suwon-si (KR) for samsung electronics co., ltd., Seungjin YUN of Suwon-si (KR) for samsung electronics co., ltd., Soonjae PYO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F11/36, F24F1/16
CPC Code(s): F24F11/36
Abstract: an outdoor unit of an air conditioner, including a cabinet; a heat exchange room inside the cabinet; a component room case at one side of the heat exchange room, including an opening in a first side of the component room case; a component room inside the component room case; an electric component in the component room; a case cover to cover the opening of the component room case; a sealing member between the component room case and the case cover; a duct at a second side of the component room case, and connected to the heat exchange room; and a duct hole in the second side of the component room case connecting the component room case and the duct. the component room case and the duct are configured so that a refrigerant in the component room flows through the duct hole, and then the duct, to outside of the cabinet.
20240200849.PLATE ASSEMBLY AND HOME APPLIANCE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Byungkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Youngmin YOU of Suwon-si (KR) for samsung electronics co., ltd., Wonjae YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D17/06
CPC Code(s): F25D17/062
Abstract: a refrigerator including a storage compartment and a cold air duct to guide cold air to the storage compartment, the cold air duct including a front plate facing the storage compartment, the front plate including a front body with a first coupling portion, a rear plate detachably coupled to the front plate, the rear plate including a rear body with a second coupling portion, and a slit in the rear body so that the second coupling portion is elastically deformable, and a heat insulating member between the front plate and the rear plate. the first coupling portion is coupled to the second coupling portion. the first coupling portion and the second coupling portion are decouplable by an external force pressing on the first coupling portion.
Inventor(s): Kyunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Minkyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog Koh of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Choongkeon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02, F25D27/00, G02F1/1335, G02F1/1339, G02F1/1345, G02F1/167, G02F1/1677, G02F1/1685, G09G3/34
CPC Code(s): F25D23/028
Abstract: a home appliance, includes: a main body; and a door configured to open and close the main body, the door including a door body and a door panel disposed on one side of the door body. the door panel includes: a light-transmissive panel disposed on the one side of the door body, the light-transmissive panel being configured to allow light to pass through; an electrophoretic film disposed between the light-transmissive panel and the door body; a protective plate disposed between the electrophoretic film and the door body, the protective plate being configured to protect the electrophoretic film; and a sealing member disposed along an edge portion of the light-transmissive panel extending outwardly from an edge of the electrophoretic film and an edge of the protective plate, the sealing member being configured to cover the edge of the electrophoretic film and the edge of the protective plate.
20240200858.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changhun CHO of Suwon-si (KR) for samsung electronics co., ltd., Donghwa KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NOH of Suwon-si (KR) for samsung electronics co., ltd., Sungcheul PARK of Suwon-si (KR) for samsung electronics co., ltd., Changhak LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/06, F25D21/14
CPC Code(s): F25D23/065
Abstract: disclosed is a refrigerator capable of minimizing generation of undercuts when manufacturing components of an inner case by injection molding. the refrigerator includes an inner case forming a storage compartment, and comprising a plurality of plates formed by injection molding; an outer case coupled to an outside of the inner case to form an external appearance; and an insulation disposed between the inner case and the outer case. a rear plate corresponding to one of the plates comprises: a drain hole formed through the rear plate to discharge water inside the inner case to the outside of the inner case; an inclined surface inclined downward toward the drain hole to allow water inside the inner case to flow to the drain hole; and an undercut prevention surface disposed below and spaced apart from the inclined surface, and forming a portion of an outer surface of the rear plate.
20240201093.OPTICAL MONITORING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wooram HONG of Suwon-si (KR) for samsung electronics co., ltd., Hyukju KWON of Suwon-si (KR) for samsung electronics co., ltd., Gahee KIM of Suwon-si (KR) for samsung electronics co., ltd., Won Seok OH of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong JEON of Suwon-si (KR) for samsung electronics co., ltd., Hyun Do CHOI of Suwon-si (KR) for samsung electronics co., ltd., Minsu CHANG of Suwon-si (KR) for samsung electronics co., ltd., Younsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/85, G01N21/3577
CPC Code(s): G01N21/85
Abstract: the present disclosure provides optical monitoring devices. in some embodiments, the optical monitoring device includes a heating stirrer, a floating barrel, and a support body arranged to support the floating barrel. the floating barrel includes a barrel body facing the heating stirrer and spaced apart from the heating stirrer by a gap, a cavity provided in the barrel body and configured to accommodate at least one of a vessel and a conduit, an irradiator arranged in the barrel body and configured to radiate light to the cavity, and a light receiver arranged in the barrel body, aligned with the irradiator and the cavity, and configured to receive light from the cavity.
20240201104.INSPECTION DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): KENJI SUZUKI of Yokohama-shi (JP) for samsung electronics co., ltd., Ingi Kim of Suwon-si (JP) for samsung electronics co., ltd., Mitsunori Numata of Yokohama-shi (JP) for samsung electronics co., ltd., Shinji Ueyama of Yokohama-shi (JP) for samsung electronics co., ltd., Tomoki Onishi of Yokohama-shi (JP) for samsung electronics co., ltd.
IPC Code(s): G01N21/95, G01N21/01, G01N35/00
CPC Code(s): G01N21/9501
Abstract: an inspection device improves accuracy characteristics of an (mram), the inspection device including a stage on which a mram element is fixed, and electromagnets generating a first magnetic field. a magnetic field having a component in a direction perpendicular to the stage is changeable from a first direction to a second direction according to a position on the stage. a second magnetic field in which a direction of a magnetic field component is parallel to the stage changes from a third direction to a fourth direction according to the position on the stage, an optical system illuminating the mram element with light including polarized light, and condensing reflected light from reflected illumination light from the mram element, and a detector detecting reflected light when the position of the mram element is changed, and when the position of the mram element in the second magnetic field is changed.
Inventor(s): Koji Murata of Yokohama-shi (JP) for samsung electronics co., ltd., Fumie Machida of Yokohama-shi (JP) for samsung electronics co., ltd., Seunghyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N27/72
CPC Code(s): G01N27/72
Abstract: a calculation device includes a calculation portion that divides a sample having a numerical solution applying portion, a connecting portion and an analytic solution applying portion into a plurality of cells, and calculates an electromagnetic field of each cell based on a physical property value associated with the cell. the calculation portion calculates the electromagnetic field of the numerical solution applying portion and the connecting portion by a numerical calculation using maxwell's equations, fourier transforms the calculated electromagnetic field of the connecting portion into a plane wave expressed by a wavenumber vector, sets the transformed plane wave as an initial value, calculates the a wavenumber space electromagnetic field by an analytic solution of helmholtz's equation, when the plane wave propagates the analytic solution applying portion in the propagation direction, and calculates the electromagnetic field of the analytic solution applying portion by inverse fourier-transforming the wavenumber space electromagnetic field.
Inventor(s): Hyeon Gwan Oh of Suwon-si (KR) for samsung electronics co., ltd., Beomsang Yoo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/317, G01R29/26, H01L21/66, H01L21/67
CPC Code(s): G01R31/31709
Abstract: a jitter analyzing apparatus may include a first delay circuit configured to delay a reference clock to output a first clock, a second delay circuit configured to delay the reference clock to output a second clock having a delay value greater than the first delay circuit, and a test device configured to measure a jitter component of the first and second delay circuits by measuring the first clock and the second clock.
Inventor(s): Sumin Noh of Suwon-si (KR) for samsung electronics co., ltd., Yongki Lee of Suwon-si (KR) for samsung electronics co., ltd., Jieun Park of Suwon-si (KR) for samsung electronics co., ltd., Yunhyeok Choi of Suwon-si (KR) for samsung electronics co., ltd., Bohdan Karpinskyy of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/3177, H04L9/32
CPC Code(s): G01R31/3177
Abstract: a device is provided. the device includes: a plurality of physically unclonable function (puf) cells, each of the plurality of puf cells including at least one logic gate and being configured to generate an output signal based on at least one threshold level of the at least one logic gate; a signal generator configured to generate an input signal that is provided to each of the plurality of puf cells; and a controller configured to, in a test mode, generate a control signal to control the signal generator to vary the input signal to control the plurality of puf cells to output a plurality of output signals according to the input signal, and identify at least one weak puf cell from among the plurality of puf cells based on the output signal generated by the at least one weak puf cell being an unstable output signal. the controller is further configured to disconnect the plurality of puf cells from the signal generator in a normal mode.
Inventor(s): Zijing Shao of Toronto (CA) for samsung electronics co., ltd., Davinder Pal Singh of Coquitlam (CA) for samsung electronics co., ltd.
IPC Code(s): G01R31/392, G01R31/367
CPC Code(s): G01R31/392
Abstract: in one embodiment, a method includes accessing, from a remote server, a general battery-heath model corresponding to a mobile electronic device to calculate a state-of-health value for a battery of the mobile electronic device. the method may access real-time multiple data subgroups of battery charging data from the mobile electronic device for multiple battery charging modes and battery degradation trends. the method may train, using the general battery-health model as a starting model, a customized battery-health model in a cascaded workflow using each of the battery charging data subgroups. the customized battery-health model is a deep neural network trained to calculate state-of-health for the mobile electronic device for the multiple battery charging modes, respectively. the method may determine, using the customized battery-health model, state-of-health values for the mobile electronic device based on real-time battery output capacity, real-time battery output voltage, real-time battery output current, and real-time battery charging mode.
Inventor(s): Changbum LEE of Suwon-si (KR) for samsung electronics co., ltd., Woosung Kim of Suwon-si (KR) for samsung electronics co., ltd., Changgyun Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/481
CPC Code(s): G01S7/4814
Abstract: provided is a wavelength control system including a wavelength tunable laser diode including at least one optical amplifier, and a processor configured to control a tunable wavelength range of the wavelength tunable laser diode by adjusting a bias current applied to the at least one optical amplifier.
Inventor(s): Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Haeyoung JUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/76, G01S13/02
CPC Code(s): G01S13/765
Abstract: the present disclosure provides a method for controlling a non-uwb device by using a uwb. a method of a first uwb device, of the present disclosure, may comprise the steps of: identifying the location of a non-uwb device based on the location of a second uwb device on the basis of the uwb ranging between the first uwb device and the second uwb device; and recognizing the non-uwb device on the basis of the pointing direction of the first uwb device and the identified location of the non-uwb device.
Inventor(s): Dongjae SHIN of Seoul (KR) for samsung electronics co., ltd., Jisan Lee of Seoul (KR) for samsung electronics co., ltd., Hyunil Byun of Seongnam-si (KR) for samsung electronics co., ltd., Changgyun Shin of Anyang-si (KR) for samsung electronics co., ltd., Inoh Hwang of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S17/894, G01S7/4865, G01S17/04
CPC Code(s): G01S17/894
Abstract: an object detection device may include: a converter configured to convert a transmission signal radiated towards an object into a digital transmission signal and a received signal reflected from the object into a digital received signal, according to a predetermined sampling period; and at least one processor configured to: interpolate between elements of the digital transmission signal and the digital received signal that have the predetermined sampling period, to obtain an interpolated transmission signal and an interpolated received signal; remove noise from each of the interpolated transmission signal and the interpolated received signal; generate a cross-correlation signal between the interpolated transmission signal from which the noise is removed and the interpolated received signal from which the noise is removed; and acquire a three-dimensional (3d) image of the object based on at least one peak value of the cross-correlation signal.
Inventor(s): Woosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongjae Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S17/931, H01S5/024, H01S5/10, H01S5/50
CPC Code(s): G01S17/931
Abstract: a tunable laser light source includes a substrate; a waveguide layer disposed on the substrate, and including: a first optical waveguide and a second optical waveguide that are spaced apart from each other in a first direction and that extend in a second direction perpendicular to the first direction; a first optical amplifier provided on the first optical waveguide; a second optical amplifier provided on the second optical waveguide and facing the first optical amplifier at a distance in the first direction; and a thermal isolation structure that is provided between the first optical amplifier and the second optical amplifier in the first direction, wherein, in the thermal isolation structure, the waveguide layer is disconnected in the first direction such that an upper surface of the substrate is exposed outside of the waveguide layer.
Inventor(s): Gavril Nikolaevich VOSTRIKOV of Moscow (RU) for samsung electronics co., ltd., Nikolay Viktorovich MURAVYEV of Podolsk (RU) for samsung electronics co., ltd., Aleksandr Evgenyevich ANGERVAKS of St. Petersburg (RU) for samsung electronics co., ltd., Roman Aleksandrovich OKUN of St. Petersburg (RU) for samsung electronics co., ltd., Anastasia Sergeevna PEREVOZNIKOVA of Izhevsk (RU) for samsung electronics co., ltd.
IPC Code(s): F21V8/00, G02B27/01, G02B27/42
CPC Code(s): G02B6/0016
Abstract: a curved waveguide-based augmented reality device is provided. the device includes a projector, and a curved waveguide. the waveguide has a shape of a concentric cylindrical meniscus and includes an in-coupling diffractive optical element and an out-coupling diffractive optical element, a grating period of a diffraction grating of the in-coupling diffractive optical element at each point of the in-coupling diffractive optical element is such that rays from one point of an initial image are input into the curved waveguide in each point of the in-coupling diffractive optical element at the same angle relative to a normal to a surface of the curved waveguide at a point of ray incidence, and at least at one point on each of the diffractive optical elements a diffraction grating period of the in-coupling diffractive optical element is equal to a diffraction grating period of the out-coupling diffractive optical element.
Inventor(s): Sunil KIM of Suwon-si (KR) for samsung electronics co., ltd., Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Junghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Byunggil JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/29
CPC Code(s): G02F1/29
Abstract: a spatial light modulator includes a substrate, a blocking layer provided on one surface of the substrate, a lower reflective layer provided on the blocking layer, an upper reflective layer facing the lower reflective layer, and a cavity layer provided between the upper reflective layer and the lower reflective layer, where the blocking layer includes a plurality of holes configured to block heat transferred from the upper reflective layer to the substrate.
Inventor(s): Myoungho KANG of SUWON-SI (KR) for samsung electronics co., ltd., Yongah KIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36, G03F1/70, G03F7/00
CPC Code(s): G03F1/36
Abstract: an optical proximity correction (opc) method includes generating a mask layout for target patterns on a wafer, dividing edges of the mask layout into fragments, generating a rotated mask layout by rotating the mask layout at a predetermined angle, extracting a contour of a target pattern by inputting data on the fragments of the rotated mask layout to an opc model, calculating an edge placement error (epe) for each fragment, determining whether to re-perform the extracting of the contour of the target pattern, calculating displacements of the fragments when it is determined that the extracting of the contour of the target pattern is re-performed, and moving the fragments by the displacements.
Inventor(s): Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07C65/10, C07C309/12, C07C311/09, C07C391/02, C07C395/00, G03F7/038, G03F7/039
CPC Code(s): G03F7/0045
Abstract: provided are an organic salt represented by formula 1, a photoresist composition including the same, and a pattern method using the same:
Inventor(s): Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07C65/10, C07C309/12, C07C311/09, C07C391/02, C07C395/00, G03F7/038, G03F7/039
CPC Code(s): G03F7/0045
Abstract:
Inventor(s): Hana KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07C65/10, C07C309/12, C07C311/09, C07C391/02, C07C395/00, G03F7/038, G03F7/039
CPC Code(s): G03F7/0045
Abstract: wherein x, y, and rto rin formula 1 are understood by referring to the specification.
Inventor(s): Namyeong KWON of Suwon-si (KR) for samsung electronics co., ltd., Inchul SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05B13/02, G05B13/04
CPC Code(s): G05B13/0265
Abstract: a method and device with process attribution identification are provided. the method may include generating a process result using a first machine learning model provided input data, where the input data incudes feature values corresponding to a plurality of process features, generating sample data by a first modifying of at least a portion of reference data based on dependency between two or more of the plurality of process features, where the reference data includes a plurality of feature values for a reference process result, identifying an attribution of the plurality of process features based on the generated process result and a sample process result generated using the first machine learning model, or a second machine learning model related to the first machine learning model, provided the generated sample data.
Inventor(s): Kibeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngrog KIM of Suwon-si (KR) for samsung electronics co., ltd., Junwoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jookwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Changryong HEO of Suwon-si (KR) for samsung electronics co., ltd., Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05B15/02, G06F1/16, G06F3/01
CPC Code(s): G05B15/02
Abstract: disclosed is an electronic device comprising: a flexible display including a first state in which a display area has a first size and a second state in which the display area is extended in a first direction so as to have a second size that is larger than the first size; a motor driven in order to change the state of the flexible display; and at least one processor operatively connected to the flexible display and the motor, wherein one or more of the at least one processor is configured to determine, if an input for driving the motor is received, the driving speed of the motor based on the driving pattern of the motor and drive the motor based on the driving speed of the motor.
Inventor(s): Keunseo KIM of Suwon-si (KR) for samsung electronics co., ltd., Gyungmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangdo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05B19/418, G06T7/00, H01L21/66
CPC Code(s): G05B19/41875
Abstract: a processor-implemented method of an apparatus or system includes obtaining an expert classification criterion from a memory of the apparatus or system; converting manufacturing process data associated with a manufacturing process to a test sample in a form of an image; generating, using a machine learning model provided the test sample, a probability value that the test sample corresponds to a target class representing an anomaly occurring in the manufacturing process; adjusting the probability value by reflecting the expert classification criterion for the anomaly; and identifying, by classifying the anomaly based on the adjusted probability value, whether a final abnormality in the manufacturing process has occurred.
Inventor(s): Jinho LIM of Suwon-si (KR) for samsung electronics co., ltd., Gyeongtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Yonghwa KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1656
Abstract: an electronic device includes a display forming at least a portion of the front surface of the electronic device; a frame structure on which the display is disposed and which forms at least a portion of the side surface of the electronic device, the frame structure including a first opening portion exposed to the outside of the electronic device and oriented in a first direction and a recessed portion formed adjacent to the first opening portion; the audio module disposed adjacent to the recessed portion; a waterproof film disposed between the recessed portion and the audio module; a first adhesive member for attaching the waterproof film and the frame structure; a second adhesive member for attaching the audio module and the waterproof film; and a protection member disposed, facing the first opening portion, within a recessed space formed by the recessed portion.
Inventor(s): Junhyeok SONG of Gyeonggi-do (KR) for samsung electronics co., ltd., Backman KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangsik YANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Wonku YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunghyun YOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Suhyun YOU of Gyeonggi-do (KR) for samsung electronics co., ltd., Seokho LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Hwanju JO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/169
Abstract: an electronic device according to an embodiment of the present disclosure may include: a housing including a first plate and a second plate, wherein the first plate includes an opening; a display panel at least partially exposed through the opening and including a touch sensor; a first support member coupled to the display panel and a portion of the first plate along at least part of one side of the opening; and a switch device configured to be actuated according to a depression of the display panel, the depression caused by a downward force exerted on an upper portion of the display panel. other various embodiments are also possible.
Inventor(s): Sang Hun JUN of San Jose CA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F1/26
CPC Code(s): G06F1/266
Abstract: an apparatus may include a storage structure including a power connection fabric, a first device interface configured to receive a first device having a form that may be compatible with a device form, and connect the first device to the power connection fabric, and a second device interface configured to receive a second device having a form that may be compatible with the device form, and connect the second device to the power connection fabric. the first device may include a storage device, and the second device may include a power device. the first device interface may include a connector to connect the storage device to the power connection fabric. the first device interface may include a device slot to receive the storage device. the second device interface may include a connector to connect the power device to the power connection fabric.
Inventor(s): Sang Hun JUN of San Jose CA (US) for samsung electronics co., ltd., Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F1/3225
CPC Code(s): G06F1/3225
Abstract: an apparatus may include a storage device including an interface to connect the storage device to a storage system, and a power control circuit configured to control a power transfer to the storage device. the power control circuit may be configured to control a power transfer to a power device. the power control circuit may be configured to monitor a charge state of a power device. the power control circuit may be configured to send information about a charge state of a power device. an apparatus may include a power device including an interface to connect the power device to a storage system, a power source, and a power control circuit configured to control, at least partially, a power transfer from the power source to a storage device, wherein at least a portion of the power device may have a storage device form.
Inventor(s): Hyun Ju Yi of Hwaseong-si (KR) for samsung electronics co., ltd., Jaeho Sim of Seoul (KR) for samsung electronics co., ltd., Kicheol Eom of Seoul (KR) for samsung electronics co., ltd., Dong-Ryoul Lee of Incheon (KR) for samsung electronics co., ltd., Hyotaek Leem of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3234, G06F13/16, G06F13/42, G11C5/14, G11C16/30, G11C16/32
CPC Code(s): G06F1/3275
Abstract: a storage controller communicates with an external device including a submission queue and a completion queue. an operation method of the storage controller includes receiving a notification associated with a command from the external device, based on a first clock, fetching the command from the submission queue, based on a second clock, performing an operation corresponding to the fetched command, based on a third clock, writing completion information to the completion queue, based on a fourth clock, and transmitting an interrupt signal to the external device, based on a fifth clock. each of the first clock to the fifth clock is selectively activated depending on each operation phase.
20240201808.TOUCH DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JINBONG KIM of Suwon-si (KR) for samsung electronics co., ltd., BYUNGHWEE PARK of Suwon-si (KR) for samsung electronics co., ltd., YEONWOO KU of Suwon-si (KR) for samsung electronics co., ltd., MINSUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., Heejin LEE of Suwon-si (KR) for samsung electronics co., ltd., YUNRAE JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/044, G09G3/20, G09G3/3233
CPC Code(s): G06F3/0412
Abstract: a touch display device, including a display panel including: a plurality of source lines configured to provide a plurality of source signals to a plurality of pixels, and a common electrode coupled to the plurality of source lines; a plurality of touch electrodes coupled to the common electrode, and configured to provide a plurality of touch signals according to a plurality of touch driving signals received from the common electrode; and a touch driving circuit configured to generate a plurality of pieces of touch information based on a difference between the plurality of touch signals and each of the plurality of touch driving signals.
Inventor(s): Nayeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyungsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jinin So of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwan Woo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0613
Abstract: a memory includes: a request register configured to receive a first signal including a requester identifier using a first protocol from a host and configured to output a first priority corresponding to the requester identifier; a checker module configured to receive a second signal including a command and a request type from the host and using a second protocol that is different than the first protocol, where the checker module is configured to receive the first priority from the request register, and where the checker module is configured to determine a second priority of the command based on the first priority and the request type; a command generator configured to generate an internal command for memory operation based on the command; and a memory controller configured to schedule the internal command in a command queue based on the second priority.
Inventor(s): Seungho SONG of Suwon-si (KR) for samsung electronics co., ltd., Jeong-Eun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungho YUN of Suwon-si (KR) for samsung electronics co., ltd., Taehyung KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/123
CPC Code(s): G06F3/0619
Abstract: a storage device includes a memory device and a solid state drive used as a cache memory for the memory device. the solid state drive includes a storage unit including a plurality of nonvolatile memory cells, a memory controller configured to control the storage unit, and a data management unit configured to manage pieces of data, stored in the storage unit, in order of less recent access time. the data management unit may set at least one of the pieces of data, stored in the storage unit, as cold data based on a data access point in time, and may send an internal trim command for the cold data to the memory controller when a valid data ratio of the storage unit is higher than a reference valid ratio. the memory controller may perform an internal trim operation on the cold data.
Inventor(s): Sungrae KIM of Seoul (KR) for samsung electronics co., ltd., Hyeran KIM of Uiwang-si (KR) for samsung electronics co., ltd., Myungkyu LEE of Seoul (KR) for samsung electronics co., ltd., Chisung OH of Suwon-si (KR) for samsung electronics co., ltd., Kijun LEE of Seoul (KR) for samsung electronics co., ltd., Sunghye CHO of Hwaseong-si (KR) for samsung electronics co., ltd., Sanguhn CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: a semiconductor memory device includes a memory cell array and a cyclic redundancy check (crc) engine. the memory cell array includes a plurality of volatile memory cells coupled to respective ones of a plurality of word-lines and respective ones of a plurality of bit-lines. the crc engine, during a memory operation on the memory cell array, detects an error in a main data and a system parity data provided from a memory controller external to the semiconductor memory device through a link, generates an error flag indicating whether the detected error corresponds to either a first type of error associated with the link or a second type of error associated with the volatile memory cells based on the system parity data and transmit the error flag to the memory controller.
Inventor(s): Yongmyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Seokhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Daejun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a storage device includes a non-volatile memory; a volatile memory; and a storage controller configured to: receive a new data and append data write command from a host, write new data and append data to at least one of the non-volatile memory and the volatile memory, receive, from the host, a remap command including mapping information between old data and the new data and a first identification (id), based on the remap command, store in the volatile memory the mapping information between the old data and the new data and the first id, receive, from the host, a metadata write command requesting writing meta data for the append data and including the first id, and based on the metadata write command, update the mapping information between the old data and the new data, and write metadata related to the append data to the non-volatile memory.
Inventor(s): Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd., Krishna T. MALLADI of San Jose CA (US) for samsung electronics co., ltd., Rekha PITCHUMANI of Oak Hill VA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0664
Abstract: a device may include an interconnect interface, a memory system including one or more first type memory devices to receive first data, one or more second type memory devices to receive second data, and an accelerator configured to perform an operation using the first data and the second data. the memory system may further include a cache configured to cache the second data for the one or more second type memory devices. a device may include an interconnect interface, a memory system coupled to the interconnect interface to receive data, an accelerator coupled to the memory system, and virtualization logic configured to partition one or more resources of the accelerator into one or more virtual accelerators, wherein a first one of the one or more virtual accelerators may be configured to perform a first operation on a first portion of the data.
Inventor(s): Kilsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Sukun YOON of Suwon-si (KR) for samsung electronics co., ltd., Jongin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F3/0484, G06F3/16, H04W4/80
CPC Code(s): G06F3/1454
Abstract: a display apparatus including a display, and a processor configured to execute one or more instructions stored in a memory to identify that a first audio input/output device and a second audio input/output device, through which audio data is to be output by using a bluetooth communication protocol, are connected, and based on identifying that different bluetooth communication profiles are used in bluetooth communication for outputting the audio data to the first audio input/output device and the second audio input/output device, control a communication interface to delay the audio data output to one of the first audio input/output device and the second audio input/output device for a preset period of time by using a synchronization buffer and then output the audio data, in order to synchronize the audio data output to the first audio input/output device with the audio data output to the second audio input/output device.
Inventor(s): Hansoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/16, G06F1/3231, G06F1/3234, H04N21/422, H04N21/442
CPC Code(s): G06F3/167
Abstract: disclosed are an electronic apparatus, a display apparatus and a method of controlling the same an electronic apparatus, a display apparatus and a method of controlling the same, the electronic apparatus including: a speaker configured to output a sound; a microphone configured to receive a user voice; a communicator configured to perform communication; a processor configured to: identify a state of an external apparatus through the communicator based on reception of the user voice, process the received user voice and output a sound corresponding to a process result through the speaker based on identification that the external apparatus is in a turned-off state, and control the communicator to transmit information about the received user voice to the external apparatus and request the external apparatus to process the voice based on identification that the external apparatus is in a turned-on state.
Inventor(s): Seonghyeog CHOI of Suwon-si (KR) for samsung electronics co., ltd., Changkyu Seol of Suwon-si (KR) for samsung electronics co., ltd., Dong Kim of Suwon-si (KR) for samsung electronics co., ltd., Inhoon Park of Suwon-si (KR) for samsung electronics co., ltd., Jinsoo Lim of Suwon-si (KR) for samsung electronics co., ltd., Youngdon Choi of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10
CPC Code(s): G06F11/10
Abstract: a method of operating a storage device includes: periodically performing a patrol read operation on a memory device; storing failure information according to the patrol read operation in a buffer memory; generating an uncorrectable error as a result of a first error correction operation performed on read data of the memory device; loading the failure information from the buffer memory; and performing a second error correction operation on the read data by using the failure information.
Inventor(s): Kyung Jin PARK of Suwon-si (KR) for samsung electronics co., ltd., Sung-Joon Kim of Suwon-si (KR) for samsung electronics co., ltd., Ho-Young Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Hee Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F11/07
CPC Code(s): G06F11/106
Abstract: a memory system, a memory controller are provided. the memory system includes: a memory device; and a memory controller configured to: control a patrol scrubbing operation in which data is read from and re-written to the memory device, based on a scrubbing cycle; and adaptively adjust the scrubbing cycle based on a comparison of an error count value of the memory device and a plurality of risk threshold values.
Inventor(s): Jaerim OH of Suwon-si (KR) for samsung electronics co., ltd., Jeong-Eun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/14, G06F11/07
CPC Code(s): G06F11/1469
Abstract: disclosed is a storage device comprises a non-volatile memory configured to store data; a storage controller configured to determine a time to back up recovery data when a sudden power-off occurs and to perform a data dump operation according to a dump level determined based on the determined time when a user data dump fails; and a power loss protection (plp) integrated circuit configured to measure at least one of a discharge time or remaining time of an auxiliary power supply when the sudden power-off occurs and to provide at least one of discharge time information or remaining time information to the storage controller, wherein the storage controller is configured to determine a minimum recovery data backup time in case of a user data dump failure using the at least one of the discharge time information or the remaining time information.
Inventor(s): Ingoo HEO of Suwon-si (KR) for samsung electronics co., ltd., Youngwook NOH of Suwon-si (KR) for samsung electronics co., ltd., Kwangsoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/40
CPC Code(s): G06F13/4068
Abstract: apparatuses and methods are disclosed. the apparatus includes a bus master including processing circuitry and a bus interface. the processing circuitry is configured to control operation of the bus master such that the bus master transmits a first address to a bus slave through a bus in a first mode and to transmit a second address having a same first length as the first address to the bus slave through the bus in a second mode. the bus interface is configured to generate the second address such that the second address includes a plurality of short addresses corresponding to a plurality of special function registers of the bus slave, respectively, in the second mode.
Inventor(s): Yongsuk Lee of Suwon-si (KR) for samsung electronics co., ltd., Myeongjong Ju of Suwon-si (KR) for samsung electronics co., ltd., Jisoo Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/62, G06F21/60
CPC Code(s): G06F21/6245
Abstract: a memory device includes one or more non-volatile memories configured to store user data and at least one key related to the user data; a network-on-chip comprising a bus manager configured to manage access to the user data and the at least one key; and a debug port directly connected to a host and configured to receive a request from the host, wherein the bus manager is further configured to, based on the debug port being activated, determine whether to allow access of the host to the user data and the at least one key based on classification information.
Inventor(s): Hyungil WOO of Suwon-si (KR) for samsung electronics co., ltd., Joonyoung CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/333, G06F21/72, G06F30/327
CPC Code(s): G06F30/333
Abstract: disclosed is an integrated circuit including intellectual property (ip) pieces including test logics, respectively, a scanner configured to collect debugging data from the test logics of the ip pieces, and an encryption circuit configured to convert the debugging data into an encrypted data form.
Inventor(s): Jichang SIM of Suwon-si (KR) for samsung electronics co., ltd., Ohhun KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyuckjoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Bok-Yeon WON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/398, G06F30/392
CPC Code(s): G06F30/398
Abstract: a computing device separates a first target layer including a plurality of target patterns from an original design layout, shifts the plurality of target patterns in the first target layer based on misalignment values at positions of the plurality of target patterns to generate a second target layer, and combines the second target layer with the original design layout from which the first target layer is separated to generate a corrected design layout.
Inventor(s): Ho-Youn KIM of Suwon-si (KR) for samsung electronics co., ltd., Jong-Yoon YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/082, G06N3/0464
CPC Code(s): G06N3/082
Abstract: a method of operating a memory device which is configured to communicate with a host device, and which includes a memory cell array and a processing-in-memory (pim) chip, including loading activation data and weight data from the memory cell array, by the pim chip; generating pruned activation data by performing a first pruning operation on the activation data, by the pim chip; providing the pruned activation data to the host device, by the pim chip; generating pruned weight data by performing a second pruning operation on the weight data, by the pim chip; providing the pruned weight data to the host device, by the pim chip; and storing output data corresponding to a neural network operation performed based on the pruned activation data and the pruned weight data, by the memory cell array.
Inventor(s): Seok-Young YOON of Suwon-si (KR) for samsung electronics co., ltd., Bernhard EGGER of Seoul (KR) for samsung electronics co., ltd., Hyemi MIN of Seoul (KR) for samsung electronics co., ltd., Jaume Mateu CUADRAT of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/082, G06N3/04
CPC Code(s): G06N3/082
Abstract: a method of processing data is performed by a computing device including processing hardware and storage hardware, the method including: converting, by the processing hardware, a neural network, stored in the storage hardware, from a first neural network format into a second neural network format; obtaining, by the processing hardware, information about hardware configured to perform a neural network operation for the neural network and obtaining partition information; dividing the neural network in the second neural network format into partitions, wherein the dividing is based on the information about the hardware and the partition information, wherein each partition includes a respective layer with an input thereto and an output thereof; optimizing each of the partitions based on a relationship between the input and the output of the corresponding layer; and converting the optimized partitions into the first neural network format.
Inventor(s): Junhyuk LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunbin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Seungjin YANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06N20/00
CPC Code(s): G06N20/00
Abstract: according to certain embodiments, an electronic device comprises: a processor and memory storing instructions; and wherein the instructions, when executed by the processor, further cause the electronic device to: load and compile an artificial intelligence model stored in the memory; determine whether the compiled artificial intelligence model includes a first-type activation function; when the first-type activation function is included in the compiled artificial intelligence model, skip a calculation with respect to a designated value when the designated value exists in a feature map and calculate a value to be calculated subsequent to the designated value; and when the first-type activation function is not included in the compiled artificial intelligence model, perform a calculation with respect to input values of the feature map.
Inventor(s): Jonghoe KOO of Suwon-si (KR) for samsung electronics co., ltd., Sungkyu CHO of Suwon-si (KR) for samsung electronics co., ltd., Sehee HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06Q20/32, G06Q20/38
CPC Code(s): G06Q20/3278
Abstract: the present disclosure provides a uwb-based safe proximity payment method. a method of a first electronic device of the present disclosure may comprise the steps of: broadcasting a uwb initiation message including certificate information of the first electronic device; receiving, from at least one second electronic device, a uwb response message including identification information of a payment application included in the second electronic device and certificate information of the payment application; and determining a priority of the at least one second electronic device on the basis of the uwb response message.
Inventor(s): Pilsu Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongseong Choi of Suwon-si (KR) for samsung electronics co., ltd., Byeongdae Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06T5/20, G06T7/13, G06T7/90, G06V10/56
CPC Code(s): G06T3/4015
Abstract: a demosaicing method for an input mosaic image includes: obtaining an input image, for each sub target pixel, estimating a main edge direction based on main color pixel values; determining the main edge direction by performing edge enhancement based on the input mosaic image; generating a main color demosaiced image by performing a main interpolation based on the main edge direction to generate interpolated main color pixel values corresponding to the sub target pixels; and generating a first sub color demosaiced image and a second sub color demosaiced image by performing a sub interpolation to generate interpolated first sub color pixel values and interpolated second sub color pixel values for the sub target pixels and for main target pixels corresponding to the main color pixel values.
Inventor(s): Madhuri Suthar of Pasadena CA (US) for samsung electronics co., ltd., Tyler Luu of Richardson TX (US) for samsung electronics co., ltd., Nguyen Thang Long Le of Garland TX (US) for samsung electronics co., ltd., John W. Glotzbach of Allen TX (US) for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/30, G06T3/40, G06T5/50
CPC Code(s): G06T5/30
Abstract: a method includes obtaining input image frames, including at least two captured using different capture conditions. the method also includes separating color channels of each image frame and generating at least one bad pixel map for each color channel of each image frame. each bad pixel map is generated by identifying one or more outliers in pixel values in the color channel based on an intensity distribution of pixel values in an operation window within the color channel. the operation window has a window size based on the capture condition and/or local image content in the corresponding image frame. the method further includes combining the bad pixel maps and performing a morphological operation to refine the combined bad pixel map. in addition, the method includes using one or more coordinates of one or more bad pixels in the refined bad pixel map to update one or more pixel values of at least one image frame.
Inventor(s): Jinwoo LEE of SUWON-SI (KR) for samsung electronics co., ltd., Bumjoo LEE of SUWON-SI (KR) for samsung electronics co., ltd., Su-Young LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T5/00, G06T7/11, G06T7/62
CPC Code(s): G06T5/50
Abstract: an image processing method includes generating a full image of an area of interest in which unit patterns are repeatedly arranged, blurring each of the unit patterns, calculating respective center positions of each of the unit patterns based on the blurring, setting respective reference positions on each of the unit patterns based on the center positions, cropping the full image into a plurality of unit images, and merging the plurality of unit images based on the reference positions to generate an averaged image.
Inventor(s): Seong-Jin PARK of Suwon-si (KR) for samsung electronics co., ltd., Seon Min RHEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T3/00
CPC Code(s): G06T7/001
Abstract: a processor-implemented method includes: identifying input components of a semiconductor pattern of an original input image from the original input image corresponding to an application target of a process for manufacturing a semiconductor, generating an augmented input image by transforming a transformation target comprising one or more of the input components from the original input image; and executing a neural model for estimating pattern transformation according to the process based on the augmented input image.
Inventor(s): Youjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongsup Park of Suwon-si (KR) for samsung electronics co., ltd., Sangmi Lee of Suwon-si (KR) for samsung electronics co., ltd., Gyehyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Beomseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngo Park of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Jang of Suwon-si (KR) for samsung electronics co., ltd., Kwangpyo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/254, G06T5/20
CPC Code(s): G06T7/254
Abstract: an image processing device configured to obtain difference maps between a first frame or a first feature map corresponding to the first frame, and second feature maps corresponding to a second frame, obtain third feature maps and fourth feature maps by performing pooling processes on the difference maps according to a first size and a second size, obtain modified difference maps by weighted-summing the third feature maps and the fourth feature maps, identify any one collocated sample based on sizes of sample values of collocated samples of the modified difference maps corresponding to a current sample of the first frame, and determine a filter kernel used to obtain the second feature map corresponding to the modified difference map including the identified collocated sample, as a motion vector of the current sample.
Inventor(s): Andrii BUGAIOV of Kyiv (UA) for samsung electronics co., ltd., Serhii KOLIIEV of Kyiv (UA) for samsung electronics co., ltd., Yuriy SIKULA of Kyiv (UA) for samsung electronics co., ltd., Yuliia BAKHMAT of Kyiv (UA) for samsung electronics co., ltd.
IPC Code(s): G06T7/70, G02B27/01, G06F3/01
CPC Code(s): G06T7/70
Abstract: a method for estimating a pose of a user by a head-mounted display (hmd) device is provided. the method includes obtaining at least two images from at least two cameras of the hmd device, each of the at least two obtained images including a view of at least a portion of a body of the user wearing the hmd device, estimating a pose of the body of the user based on the view of the at least portion of the body of the user included in each of the at least two obtained images, estimating a pose of a head of the user based on the at least two obtained images, and estimating the pose of the user based on the estimated pose of the body of the user and the estimated pose of the head of the user.
Inventor(s): Seonghoon KANG of Suwon-si (KR) for samsung electronics co., ltd., Yerin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyoin AHN of Suwon-si (KR) for samsung electronics co., ltd., Jaeik LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T13/20, H04N13/243, H04N23/63
CPC Code(s): G06T13/20
Abstract: an example electronic device may display, based on at least a portion of a plurality of images obtained through a first camera of the electronic device, a preview image on the display; receive a shooting input while displaying the preview image; in response to receiving the shooting input, obtain a first image including a first visual object through the first camera; obtain a second image including a second visual object through a second camera of the electronic device; obtain a third image converted from the second image and including the second visual object having a size corresponding to a size of the first visual object; and obtain a fourth image to provide animation with respect to a subject, by displaying the third image after displaying the first image.
Inventor(s): Liang Zhao of Saratoga CA (US) for samsung electronics co., ltd., Siva Penke of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T13/20, G06T13/40, G10L17/02, G10L17/04, G10L17/18
CPC Code(s): G06T13/205
Abstract: a method includes obtaining, using at least one processing device of an electronic device, an audio input associated with a speaker. the method also includes extracting, using a feature extractor of a trained machine learning model, audio features from the audio input. the method further includes generating (i) one or more content parameter predictions using content embeddings extracted by a content encoder and decoded by a content decoder of the trained machine learning model and (ii) one or more style parameter predictions using style embeddings extracted by a style encoder and decoded by a style decoder of the trained machine learning model. the content embeddings and the style embeddings are based on the audio features of the audio input. the trained machine learning model is trained to generate the one or more content parameter predictions and the one or more style parameter predictions using disentangled content and style embeddings.
Inventor(s): Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G01C21/20, G02B27/01, G06F3/01
CPC Code(s): G06T19/006
Abstract: a wearable device is provided. the wearable device includes a display arranged with respect to eyes of a user wearing the wearable device. the wearable device includes a camera including at least one lens that faces a direction corresponding to a direction in which the eyes faces. the wearable device includes a processor. the processor is configured to identify, in response to a schedule, a place labeled with respect to the schedule. the processor is configured to identify, based at least in part on the identification, whether the camera of the wearable device positioned in the place faces a region in the place to which a graphic region for the schedule is set. the processor is configured to display, via the display, at least portion of the graphic region on at least portion of the region, based on identifying that a direction of the camera corresponds to a first direction in which the camera faces the region. the processor is configured to identify, via the display, information for informing the first direction, based on identifying that the direction corresponds to a second direction different from the first direction.
Inventor(s): Yowon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Junsik JUNG of Daejeon-si (KR) for samsung electronics co., ltd., Sungeui YOON of Daejeon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/82, G06V10/77, G06V20/40
CPC Code(s): G06V10/82
Abstract: an interpolation model learning method, a non-transitory computer-readable storage medium storing instructions allowing the method to be performed, and a device for learning an interpolation frame generating module are provided. the interpolation model learning method may include extracting, by using a neural network model, a temporal-spatial feature of each of a frame group including an interpolation frame generated by an interpolation model based on a neural network and a frame group including a ground truth (gt) frame corresponding to an interpolation frame and changing a weight and/or a bias of a neural network of an interpolation model to decrease a difference between temporal-spatial features.
Inventor(s): Lingyu Zhang of Cupertino CA (US) for samsung electronics co., ltd., Ting Hua of Santa Clara CA (US) for samsung electronics co., ltd., Yilin Shen of Santa Clara CA (US) for samsung electronics co., ltd., Hongxia Jin of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06V20/70, G06F40/284, G06V10/774
CPC Code(s): G06V20/70
Abstract: a method includes obtaining an image, a set of attribute labels, and a set of object labels and performing prompt tuning of a pre-trained vision-language model having first and second textual encoders and a vision encoder. the model is trained during prompt tuning to select one attribute label and one object label that match content in the image. performing the prompt tuning includes, for each attribute label-object label pair, generating object textual features associated with the object label using the first textual encoder, generating attribute textual features associated with the attribute label using the second textual encoder, and generating image features associated with the image using the vision encoder. intermediate outputs from initial layers of the textual encoders and the vision encoder are combined to generate layer-specific learnable prompt tokens that are appended to inputs of specified layers in the first and second textual encoders and the vision encoder.
Inventor(s): Jibum Moon of Suwon-si (KR) for samsung electronics co., ltd., Yuri Min of Suwon-si (KR) for samsung electronics co., ltd., Dongwon Kim of Suwon-si (KR) for samsung electronics co., ltd., Donghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Eunae Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V40/60, G06T7/60, G06T7/70, G06V40/10, G06V40/16, H04N23/71, H04N23/74
CPC Code(s): G06V40/60
Abstract: a display apparatus includes a display, and at least one processor. the at least one processor is configured to identify a guide area, of a plurality of areas of the display, corresponding to a position of a camera; control the display to display a guide image in the guide area; and identify a biometric index of a user positioned at a front surface of the display, based on a measurement image, captured by the camera during display of the guide image in the guide area, of a face of the user.
Inventor(s): Daeyoung NOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G06F1/16
CPC Code(s): G09G3/035
Abstract: an electronic device having a flexible display and a method for operating the display in the electronic device are provided. the electronic device includes a first housing, a second housing, a third housing, and a flexible display. the flexible display includes a first display fixedly disposed in the first housing and visually exposed in a first state of the electronic device, in the second state thereof, in the third state thereof, and in the fourth state thereof, a second display mounted in the second housing to be able to roll and visually exposed in the second and fourth states, the area of the second display being partially expanded in response to a sliding movement of the second housing, and a third display mounted in the third housing to be able to roll and visually exposed in the third and fourth states, the area of the third display being partially expanded.
Inventor(s): Sijun LEE of Suwon-si (KR) for samsung electronics co., ltd., Seongrok LEE of Suwon-si (KR) for samsung electronics co., ltd., Changyong JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/30, G10L15/08, G10L15/22
CPC Code(s): G10L15/30
Abstract: an electronic device is provided. the electronic device includes a device detector, an intelligence device resolver (idr), and a device selector. the device detector may receive user utterance information and identification information of multi-device wakeup (mdw) devices participating in mdw contention from a first electronic device selected in the mdw contention. the idr may identify room information for locations of the mdw devices, based on the identification information of the mdw devices, and acquire device information of the mdw devices and devices located in an equal space to the mdw devices. the device selector may execute a command according to a user utterance, based on the device information of the mdw devices and the devices located in the equal space to the mdw devices.
Inventor(s): Jaemo YANG of Suwon-si (KR) for samsung electronics co., ltd., Sangeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hangil MOON of Suwon-si (KR) for samsung electronics co., ltd., Soonho BAEK of Suwon-si (KR) for samsung electronics co., ltd., Gunwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L21/0208, H04R1/08
CPC Code(s): G10L21/0208
Abstract: an electronic device includes a vibration sensor; a microphone; memory storing at least one instruction; and at least one processor, wherein the at least one processor is configured to execute the at least one instruction to: receive, via the microphone, a speech signal including reverberation uttered by a user, receive, via the vibration sensor, a vibration signal related to the speech signal, transmitted through at least a portion of a body of the user, predict reverberation information based on the speech signal and the vibration signal, and eliminate the reverberation included in the speech signal based on the predicted reverberation information.
Inventor(s): Junyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Garam KIM of Suwon-si (KR) for samsung electronics co., ltd., Joohwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jindo BYUN of Suwon-si (KR) for samsung electronics co., ltd., Eunseok SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunyoon CHO of Suwon-si (KR) for samsung electronics co., ltd., Junghwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10, H03K19/017
CPC Code(s): G11C7/1066
Abstract: a transmitter configured to receive first to n-th data in parallel and sequentially output the first to n-th data in response to first to n-th clock signals having different phases from each other, where n is an integer of at least 2, the transmitter including first to n-th data selectors including a first data selector and a second data selector in correspondence to the first to n-th data, each of the first to n-th data selectors being configured to perform a logical operation on one of the first to n-th data and the first to n-th clock signals and output a plurality of data selection signals, a first pre-driver in correspondence to at least two data selectors among the first to n-th data selectors, the first pre-driver being configured to receive the plurality of data selection signals from the at least two data selectors.
Inventor(s): Sungyong CHO of Suwon-si (KR) for samsung electronics co., ltd., Kiheung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeran KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406, G11C11/408, H01L25/065, H03M13/00, H03M13/11
CPC Code(s): G11C11/40615
Abstract: a semiconductor memory device includes a memory cell array including a plurality of memory cell rows, a row hammer management circuit and a refresh control circuit. the row hammer management circuit counts the number of times of access associated with each of the plurality of memory cell rows in response to an active command from an external memory controller to store the counted values in each of the plurality of memory cell rows as count data, determines a hammer address associated with at least one of the plurality of memory cell rows, which is intensively accessed more than a predetermined reference number of times, based on the counted values, and performs an internal read-update-write operation. the refresh control circuit receives the hammer address and to perform a hammer refresh operation on victim memory cell rows which are physically adjacent to a memory cell row corresponding to the hammer address.
Inventor(s): Yeji SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seokin HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4074, G11C11/4076, G11C11/408, G11C11/4096
CPC Code(s): G11C11/4074
Abstract: a nonvolatile memory device includes a cell array divided into a plurality of planes, a voltage generator configured to generate a word line voltage applied to word lines of each of the plurality of planes, a row decoder configured to transmit the word line voltage to the cell array in response to an address, and a control circuit configured to set up voltages of word lines of each of the plurality of planes to the word line voltage in response to an activated pseudo plane independent read mode setting. the control circuit is configured to sequentially shift voltage setup times of the word lines by a specified time delay corresponding to a number of the plurality of planes.
Inventor(s): Philkyu KANG of Suwon-si (KR) for samsung electronics co., ltd., Chihyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Junehong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jayang YOON of Suwon-si (KR) for samsung electronics co., ltd., Chiweon YOON of Suwon-si (KR) for samsung electronics co., ltd., Dojeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C16/04, G11C16/24, G11C16/30
CPC Code(s): G11C16/08
Abstract: provided is a method of operating a nonvolatile memory device including a voltage generator, the method including calculating a difference between a voltage level of a first word line node and a voltage level of a second word line node, changing a first reference voltage level of the voltage generator to a second reference voltage level based on the difference between the voltage levels, and determining a target voltage level based on any one of the first reference voltage level and the second reference voltage level. the first word line node may be closer from an output terminal of the voltage generator than the second word line node.
Inventor(s): Seungbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Yonghyuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Seungyong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/26, G11C16/10
CPC Code(s): G11C16/26
Abstract: a memory device comprises: a memory cell array including a plurality of cell blocks including a first cell block storing information other than user data and a second cell block storing the user data, wherein each of the plurality of cell blocks includes a plurality of cell strings and control circuitry configured to control a write operation and a read operation of the memory cell array. a first ground select line (gsl) region included in the first cell block includes a plurality of gsls stacked in a vertical direction. one or more ground select transistors of a plurality of ground select transistors connected to each of the gsls are programmed to a first threshold voltage and the other ground select transistors of the plurality of ground select transistors not connected to the gsls are programmed to a second threshold voltage that is higher than the first threshold voltage. a first line included in the first gsl region in the first cell block is arranged at a same height as a word line connected to memory cells storing the user data in the second cell block.
Inventor(s): Jeong Eun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jin Young PARK of Suwon-si (KR) for samsung electronics co., ltd., Myoung Hoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Yoon Jae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Seok MOON of Suwon-si (KR) for samsung electronics co., ltd., Kun Sun EOM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G16H40/63, G16H50/30
CPC Code(s): G16H40/63
Abstract: provided is a method of providing health information using an electronic device with a display devices. one or more processors may be configured to display, based on a request from a user, a home screen of a user interface through a display device, assess a health status of a user based on receiving data related to one or more health indices, display a virtual avatar that responds to a health status of the user on the home screen, determine a new visualization method of the virtual avatar, and modify the representation of the virtual avatar according to the determined new visualization method.
Inventor(s): Kilho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/20
CPC Code(s): H01J37/20
Abstract: a guide pin includes a support part and a frictional column coupled to the support part, and the support part includes a lower support member including a screw structure on an outer surface thereof, and an upper support member on the lower support member. the frictional column surrounds an outer surface of the upper support member. a hardness of the frictional column is lower than a hardness of the support part.
Inventor(s): Kunsu KIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/244, H01J37/147, H01J37/20, H01J37/28
CPC Code(s): H01J37/244
Abstract: an apparatus for manufacturing semiconductor devices is disclosed. the apparatus includes an electron gun configured to generate an input electron beam and irradiate a sample with the input electron beam, an ion beam device configured to generate an ion beam and irradiate the sample with the ion beam, and a detector configured to detect emitted electrons from the sample. the detector includes an electron backscatter diffraction detector and detects the emitted electrons simultaneously when the sample is irradiated by the ion beam.
20240203693.PLASMA PROCESSING EQUIPMENT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hee Won MIN of Suwon-si (KR) for samsung electronics co., ltd., Song Yun KANG of Suwon-si (KR) for samsung electronics co., ltd., Ju Ho KIM of Suwon-si (KR) for samsung electronics co., ltd., Seok Hwan BAE of Suwon-si (KR) for samsung electronics co., ltd., Dong Yun YEO of Suwon-si (KR) for samsung electronics co., ltd., Kui Hyun YOON of Suwon-si (KR) for samsung electronics co., ltd., Seung Bin LIM of Suwon-si (KR) for samsung electronics co., ltd., Ji Yun JU of Suwon-si (KR) for samsung electronics co., ltd., Seo Yeon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/3244
Abstract: a plasma processing equipment includes: an electrostatic chuck on which a substrate is provided; a gas filling unit provided between the substrate and the electrostatic chuck; a gas supply unit extending through the electrostatic chuck and connected to the gas filling unit, the gas supply unit comprising a plurality of first nonconductive balls; and a focus ring provided along an edge of the electrostatic chuck.
Inventor(s): Soonku Kwon of Suwon-si (KR) for samsung electronics co., ltd., Sunggil Kang of Suwon-si (KR) for samsung electronics co., ltd., Chanyeong Jeong of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin Bang of Suwon-si (KR) for samsung electronics co., ltd., Yeongkwang Lee of Suwon-si (KR) for samsung electronics co., ltd., Ilgon Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32522
Abstract: a substrate processing apparatus includes a chamber including a first space and a second space, a substrate support in the first space and configured to support a substrate, a plasma source configured to generate plasma in the second space, an ion blocker between the second space and the first space, the ion blocker including through-holes configured to pass therethrough radicals of the plasma from the second space to the first space and provide the radicals to the substrate, and a temperature controller including a plurality of heaters connected to the ion blocker, one or more chillers, and a controller configured to control output of the plurality of heaters and output of the one or more chillers, where the ion blocker includes a plurality of regions, each of the plurality of regions including a heating line, one or more boundary regions.
20240203702.SUBSTRATE PROCESSING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SUNGIK PARK of Suwon-si (KR) for samsung electronics co., ltd., Yongsu Jang of Cheonan-si (KR) for samsung electronics co., ltd., Seungpil Chung of Cheonan-si (KR) for samsung electronics co., ltd., Jungyoon Yang of Cheonan-si (KR) for samsung electronics co., ltd., Inseong Lim of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/67
CPC Code(s): H01J37/32522
Abstract: a substrate processing apparatus includes a process chamber including a processing space, a heater located inside the process chamber and configured to heat a lower portion of the processing space, and a first heat source located inside the process chamber and spaced apart from the heater and configured to heat an upper portion of the processing space, a plurality of first protrusions protruding in a vertical direction from an upper surface of the heater, and a second protrusion protruding in the vertical direction from an edge portion of the upper surface of the heater.
20240203714.PLASMA MONITORING SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yunsong JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32972
Abstract: a plasma monitoring system includes a chamber with an interior space, the chamber being configured to perform a semiconductor process on a semiconductor substrate using plasma in the interior space, and the chamber including an optical window, a substrate stage within the chamber to support the semiconductor substrate, a light collecting device on the substrate stage, the light collecting device including a body and light collectors, the body having through holes therethrough, and the light collectors being configured to collect light respectively incident on the through holes from the plasma and to transfer the collected lights onto the optical window, and a light analyzer including a spectrometer that is configured to obtain an optical spectrum from each light irradiated onto the optical window, and to map a state of the plasma from the optical spectrum to correspond to positions of the through holes.
Inventor(s): Eunhyoung CHO of Suwon-si (KR) for samsung electronics co., ltd., Sunghee Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeongyub Lee of Suwon-si (KR) for samsung electronics co., ltd., Hanboram Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L21/285
CPC Code(s): H01L21/76849
Abstract: a method of selectively forming a layer according to atomic layer deposition includes providing a substrate which includes a first region consisting of a first material and having a first surface and a second region consisting of a second material and having a second surface, forming a first reaction inhibition layer on the second surface using a reaction inhibitor selectively adsorbed on the second surface, selectively forming a first deposition layer on the first surface using a first precursor and a first reactant, wherein the first reactant reacts with the first precursor to form an atomic layer and does not react with the reaction inhibitor to form the atomic layer, and converting the first reaction inhibition layer on the second surface into a second deposition layer using a second reactant which reacts with the first reaction inhibition layer to form the atomic layer.
Inventor(s): Tae Sun Kim of Ballston Spa NY (US) for samsung electronics co., ltd., Wonhyuk Hong of Clifton Park NY (US) for samsung electronics co., ltd., Jongjin Lee of Clifton Park NY (US) for samsung electronics co., ltd., Buhyun Ham of Mechanicville NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L21/74
CPC Code(s): H01L21/76897
Abstract: in order to achieve higher contact quality for backside power distribution networks, provided is a backside contact to a semiconductor device having a positive slope and a dielectric sidewall liner, and methods for making the same.
Inventor(s): Byeong Seon PARK of Suwon-si (KR) for samsung electronics co., ltd., Sang-Ho Yun of Suwon-si (KR) for samsung electronics co., ltd., Woo Jin Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, G03F1/42, G03F7/00, G03F9/00, H01L21/027
CPC Code(s): H01L22/12
Abstract: a method for manufacturing a semiconductor device, the method including forming a stack on a wafer, wherein the stack includes a plurality of layers of the stack, forming a photoresist pattern on the stack, determining whether a material of at least one layer among the plurality of layers of the stack has changed and whether at least one process among a plurality of processes for forming the plurality of layers of the stack has changed, changing a first wavelength for overlay measurement upon determination that the material of the at least one layer or the at least one process has changed, and measuring an overlay using the changed first wavelength for overlay measurement.
20240203813.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wooseup HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jihye SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/48, H01L25/065
CPC Code(s): H01L23/3171
Abstract: a semiconductor package includes a first semiconductor die, second semiconductor dies each of which has a width less than a width of the first semiconductor die and which are stacked on the first semiconductor die, a first non-conductive layer between the first semiconductor die and a lowermost second semiconductor die, and a second non-conductive layer between adjacent ones of the second semiconductor dies. each of the second semiconductor dies includes a first substrate that has a first front surface and a first rear surface, a first interlayer dielectric layer that covers the first front surface, first through electrodes that penetrate the first substrate, and a first passivation layer that covers the first rear surface. a first groove is in the first passivation layer and a portion of the first substrate. the second non-conductive layer is within the first groove.
Inventor(s): Sungchan KANG of Suwon-si (KR) for samsung electronics co., ltd., Daehyuk SON of Suwon-si (KR) for samsung electronics co., ltd., Seogwoo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/427, H01L25/065
CPC Code(s): H01L23/427
Abstract: a semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel including at least a first portion that is inside the semiconductor chip, a wall surface including a fine pattern configured to generate a capillary force that causes a liquid coolant to flow in the cooling channel, a liquid channel area in a first area of the cooling channel where the fine pattern is formed and configured to pass the liquid coolant, and a gas channel area in a second area of the cooling channel where the fine pattern is not formed and configured to pass a gaseous coolant.
Inventor(s): Daehyuk SON of Suwon-si (KR) for samsung electronics co., ltd., Sungchan KANG of Suwon-si (KR) for samsung electronics co., ltd., Seogwoo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/473, H10N30/20
CPC Code(s): H01L23/473
Abstract: a semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel formed in the semiconductor chip and providing a moving path for a coolant. an ultrasonic vibrator may be arranged in the cooling channel. the ultrasonic vibrator may vibrate the coolant. by doing so, the stagnation of vapors and/or generation of a vapor film may be reduced or prevented.
Inventor(s): Seogwoo HONG of Suwon-si (KR) for samsung electronics co., ltd., Sungchan KANG of Suwon-si (KR) for samsung electronics co., ltd., Daehyuk SON of Suwon-si (KR) for samsung electronics co., ltd., Jeongyub LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/473, H01L23/00, H01L25/065
CPC Code(s): H01L23/473
Abstract: a semiconductor device includes a semiconductor chip including a semiconductor integrated circuit; a cooling channel including a surface of the semiconductor chip and configured to provide a passage for a coolant to cool the semiconductor chip; and a plurality of flexible capillary patterns on the surface of the semiconductor chip inside the cooling channel and configured to move the coolant by capillary action, wherein each capillary pattern of the plurality of flexible capillary patterns may include a first portion in a length direction of the capillary pattern that contacts and is supported by the surface of the semiconductor chip, and a second portion in the length direction that is spaced apart from and unsupported by the surface of the semiconductor chip, and a curvature of the second portion of each capillary pattern of the plurality of flexible capillary patterns changes according to temperature.
Inventor(s): Anthony Dongick LEE of Suwon-si (KR) for samsung electronics co., ltd., Min Chan GWAK of Suwon-si (KR) for samsung electronics co., ltd., Guk Hee KIM of Suwon-si (KR) for samsung electronics co., ltd., Young Woo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jin Kyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Cheol NA of Suwon-si (KR) for samsung electronics co., ltd., Yun Suk NAM of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Woo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hidenobu FUKUTOME of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L21/768, H01L23/528, H01L25/18, H10B80/00
CPC Code(s): H01L23/481
Abstract: a semiconductor device and a method for manufacturing the same is provided. the semiconductor device includes a power delivery network layer; an insulating layer on the power delivery network layer and having an opening therein; a semiconductor layer filling the opening and covering the insulating layer; a first through-via extending through the semiconductor layer and electrically connected to the power delivery network layer; a second through-via extending through the insulating layer and the semiconductor layer and electrically connected to the power delivery network layer; a logic element on the semiconductor layer and electrically connected to the first through-via; and a passive element on the semiconductor layer and electrically connected to the second through-via.
Inventor(s): Jongyoun KIM of Seoul (KR) for samsung electronics co., ltd., Minjun BAE of Hwaseong-si (KR) for samsung electronics co., ltd., Hyeonseok LEE of Asan-si (KR) for samsung electronics co., ltd., Gwangjae JEON of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/34, H01L25/18
CPC Code(s): H01L23/49811
Abstract: disclosed are semiconductor packages and their fabricating methods. the semiconductor package comprises a redistribution substrate, a semiconductor chip on a top surface of the redistribution substrate, and a solder terminal on a bottom surface of the redistribution substrate. the redistribution substrate includes an under-bump pattern in contact with the solder terminal, a dielectric layer on a sidewall of the under-bump pattern, an under-bump seed pattern between the dielectric layer and the sidewall of the under-bump pattern, and a redistribution pattern on the under-bump pattern. the under-bump pattern has central and edge regions. a first top surface at the edge region of the under-bump pattern is at a level higher than that of a second top surface at the central region of the under-bump pattern. an angle between the bottom surface and the sidewall of the under-bump pattern is in a range of 110� to 140�.
20240203854.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeon Jeong HWANG of Suwon-si (KR) for samsung electronics co., ltd., Geun Woo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/065
CPC Code(s): H01L23/49827
Abstract: a semiconductor package an interposer disposed on a substrate, a recess recessed from an upper surface of the interposer, a connection structure disposed inside the recess, a first post disposed on the upper surface of the interposer and electrically connected to the interposer, a second post disposed on an upper surface of the connection structure and electrically connected to the connection structure, a first lower semiconductor chip disposed between the first and second posts and disposed on the upper surface of the interposer and the upper surface of the connection structure. the first lower semiconductor chip is electrically connected to the second post through the connection structure, and a first upper semiconductor chip is disposed on an upper surface of the first lower semiconductor chip. the first upper semiconductor chip is electrically connected to the first lower semiconductor chip through the second post and the connection structure.
Inventor(s): Jaemok JUNG of Suwon-si (KR) for samsung electronics co., ltd., Un-Byoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Dowan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sung Keun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongho PARK of Suwon-si (KR) for samsung electronics co., ltd., Ju-Il CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/56, H01L21/768, H01L23/00, H01L23/31, H01L23/48
CPC Code(s): H01L23/49827
Abstract: an embodiment provides a semiconductor package including: a first redistribution layer substrate; a semiconductor chip on the first redistribution layer substrate; a coupling member on the first redistribution layer substrate, wherein the coupling member is spaced apart from the semiconductor chip; an encapsulant on the first redistribution layer substrate, the semiconductor chip, and the coupling member; and a second redistribution layer substrate on the encapsulant, wherein the coupling member includes a vertical wire and a metal portion extending around the vertical wire, and wherein a first end of the coupling member is electrically connected to the first redistribution layer substrate, and a second end of the coupling member is electrically connected to the second redistribution layer substrate.
20240203872.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seonghun Lim of Hwaseong-si (KR) for samsung electronics co., ltd., Wookyung You of Hwaseong-si (KR) for samsung electronics co., ltd., Kyoungwoo Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Juyoung Jung of Yongin-si (KR) for samsung electronics co., ltd., Il Sup Kim of Suwon-si (KR) for samsung electronics co., ltd., Chin Kim of Seongnam-si (KR) for samsung electronics co., ltd., Kyoungpil Park of Yongin-si (KR) for samsung electronics co., ltd., Jinhyung Park of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/528, H01L27/06
CPC Code(s): H01L23/5228
Abstract: a semiconductor device including a transistor on a substrate; an interlayer insulating layer on the transistor; a first metal-containing layer on the interlayer insulating layer; and a second metal-containing layer on the first metal-containing layer, wherein the second metal-containing layer includes a resistor, the resistor includes a first insulating layer on the first metal-containing layer; a resistor metal layer on the first insulating layer, and a second insulating layer on the resistor metal layer, and the resistor metal layer includes a recessed side surface.
Inventor(s): Jiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Woosung YANG of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, G11C16/04, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device including a first semiconductor structure overlapping a second semiconductor structure, the second semiconductor structure having first and second regions and including a plate layer; gate electrodes spaced apart from each other in a first direction; channel structures passing through the gate electrodes; gate separation regions extending in a second direction; first and second upper isolation regions dividing an upper gate electrode into first, second and third sub-gate electrodes between adjacent gate separation regions; and contact plugs extending in the first direction, each of the first and second upper isolation regions has a region extending in a third direction, and the first sub-gate electrode has a first pad region having a first width and a second pad region having a second width narrower than the first width in a fourth direction, and the first sub-gate electrode is connected to one of the contact plugs.
Inventor(s): Jongjin LEE of Clifton Park NY (US) for samsung electronics co., ltd., Jaejik BAEK of Watervliet NY (US) for samsung electronics co., ltd., Myunghoon JUNG of Clifton NY (US) for samsung electronics co., ltd., Kang-ill SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L29/06, H01L29/40, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L23/5286
Abstract: provided is a method of manufacturing an integrated circuit device. the method includes forming a semiconductor device, wherein the semiconductor device has one or more source/drain structures, one or more channel structures and wherein the substrate is on a first side of the semiconductor device. the method also includes forming a back-end-of-line (beol) region and forming a bottle-neck shaped backside contact structure in the substrate and in contact with a first source/drain structure of the semiconductor device, wherein the bottle-neck shaped backside contact structure has a first side contacting the first source/drain structure, a second side contacting a backside power rail, and sidewalls extending from the first source/drain structure to the backside power rail; and wherein the backside contact structure has a first region having a positive slope and a second region, adjacent to the first region, having no slope.
20240203883.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungyong Yoo of Suwon-si (KR) for samsung electronics co., ltd., Eunji Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/532, H01L21/768, H01L23/522
CPC Code(s): H01L23/53238
Abstract: an integrated circuit device includes an insulating structure above a substrate, and an interconnection structure penetrating the insulating structure in a first direction and including a first local protrusion portion. the first local protrusion portion protrudes outward in a second direction perpendicular to the first direction from a position adjacent to a lower surface of the insulating structure. the interconnection structure further includes a metal plug including a first metal, and a plurality of metal-containing particles including a second metal that is different from the first metal. the plurality of metal-containing particles are irregularly dispersed in a lower plug region of the metal plug, and the lower plug region is spaced apart from an upper surface of the metal plug and includes the first local protrusion portion.
Inventor(s): Hyunsu Hwang of Siheung-si (KR) for samsung electronics co., ltd., Junyun Kweon of Cheonan-si (KR) for samsung electronics co., ltd., Jumyong Park of Cheonan-si (KR) for samsung electronics co., ltd., Jin Ho An of Seoul (KR) for samsung electronics co., ltd., Dongjoon Oh of Suwon-si (KR) for samsung electronics co., ltd., Chungsun Lee of Asan-si (KR) for samsung electronics co., ltd., Ju-il Choi of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L25/065, H01L25/10
CPC Code(s): H01L23/5383
Abstract: disclosed are semiconductor packages and methods of fabricating the same. the semiconductor package includes a redistribution substrate including redistribution line patterns in a dielectric layer, and a semiconductor chip on the redistribution substrate. the semiconductor chip includes chip pads electrically connected to the redistribution line patterns. each of the redistribution line patterns has a substantially planar top surface and a nonplanar bottom surface. each of the redistribution line patterns includes a central portion and edge portions on opposite sides of the central portion. each of the redistribution line patterns has a first thickness as a minimum thickness at the central portion and a second thickness as a maximum thickness at the edge portions.
Inventor(s): Youngwoo PARK of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/552, H01L21/56, H01L21/78, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L23/552
Abstract: disclosed are semiconductor packages and methods of fabricating the same. the method inluces forming a semiconductor chip, forming an electromagnetic shield that covers the semiconductor chip, and forming a molding that covers the electromagnetic shield. the electromagnetic shield is electrically connected to a conductor on a side of the semiconductor chip.
Inventor(s): Tackmo LEE of Suwon-si (KR) for samsung electronics co., ltd., Changkyu CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Gunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonmin HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/60, H01L23/00, H01L23/31, H01L25/16
CPC Code(s): H01L23/60
Abstract: a display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal cover covering the rear surface and a first area of the side surface, the first area extending from the rear surface; and a side member positioned below the outer area from the mounting surface and adhered to a second area of the side surface, the second area extending from the mounting surface, and at least a portion of the metal cover. the metal cover includes a rear portion covering the rear surface, a side portion covering the first area of the side surface, and a bent portion bent between the rear portion and the side portion.
Inventor(s): Hyunsoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Dae-Woo KIM of Suwon-si (KR) for samsung electronics co., ltd., Won-Young KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/48, H01L23/538, H01L25/00
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a power delivery network, a semiconductor chip on a top surface of the power delivery network, and having first and second surfaces opposite to each other, a second semiconductor chip on the top surface horizontally spaced from the first semiconductor chip, the second semiconductor chip having third surface and fourth surfaces, opposite to each other, chip stacks on the first semiconductor chip, and on the second semiconductor chip. the first surface is an active surface. the third surface is an active surface of the second semiconductor chip. the first chip stack includes third semiconductor chips on the first surface of the first semiconductor chip. the third semiconductor chips is disposed such that an active surface thereof faces the first semiconductor chip, and the first chip stack and the second semiconductor chip may be electrically connected to each other through the power delivery network.
20240203940.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung Hyun BAIK of Suwon-si (KR) for samsung electronics co., ltd., Won Hee HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/16, H01L23/31
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes: a substrate extending in first and second directions that intersect each other; a first semiconductor chip stack disposed on the substrate and including a plurality of first semiconductor chips stacked on each other, a second semiconductor chip stack disposed on the substrate, and spaced apart from the first semiconductor chip stack in the first direction, wherein the second semiconductor chip stack includes a plurality of second semiconductor chips stacked on each other, a first spacer disposed on the first semiconductor chip stack and including a coupling layer; and a mold layer covering the first and second semiconductor chip stacks and in contact with the first spacer.
20240203942.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Doyoung Jang of Suwon-si (KR) for samsung electronics co., ltd., Eunsu Lee of Suwon-si (KR) for samsung electronics co., ltd., Daeyoung Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/48, H01L25/10
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip, each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip which is adjacent thereto, and a width of each of the second semiconductor chips is smaller than a width of the first semiconductor chip.
Inventor(s): Junhyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Minyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Dohyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/528, H10B80/00
CPC Code(s): H01L25/0657
Abstract: the inventive concept provides a chip stack structure including a first semiconductor chip and a second semiconductor chip bonded to each other, and a semiconductor package including a plurality of chip stack structures stacked in a vertical direction.
Inventor(s): Jae Seung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byung-Su Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065
CPC Code(s): H01L25/0657
Abstract: a semiconductor device includes a first die including a plurality of first micro bumps on a first upper face of the first die, a plurality of first macro metal pads at positions respectively corresponding to the plurality of first micro bumps, a first routing wiring layer comprising a plurality of first routing metals, where a first end of each of the plurality of first routing metals is respectively under the plurality of first macro metal pads, a plurality of through silicon vias (tsvs), where first ends of the plurality of tsvs are respectively connected to second ends of the plurality of first routing metals, and where each of the plurality of tsvs extends downward from the respective second ends of the plurality of first routing metals, a first plurality of keep-out zones including a first keep-out zone bundle region, and a plurality of first micro metal pads.
Inventor(s): Yeongkwon Ko of Hwaseong-si (KR) for samsung electronics co., ltd., Jinwoo Park of Seoul (KR) for samsung electronics co., ltd., Jaekyung Yoo of Seoul (KR) for samsung electronics co., ltd., Teakhoon Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L21/56, H01L23/00, H01L23/29, H01L23/31, H01L25/00, H01L25/18
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a package substrate on which a base chip is disposed. a first semiconductor chip is disposed on the base chip. a second semiconductor chip is disposed on the first semiconductor chip. an inner mold layer surrounds an upper surface of the base chip and respective side surfaces of the first semiconductor chip and the second semiconductor chip. a first outer mold layer is interposed between the package substrate and the base chip while covering at least a portion of a side surface of the base chip. a second outer mold layer is disposed on the first outer mold layer while covering at least a portion of a side surface of the inner mold layer. the second outer mold layer is spaced apart from the package substrate. the first outer mold layer and the second outer mold layer have different viscosities.
Inventor(s): Junyeong HEO of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung KANG of Daejeon (KR) for samsung electronics co., ltd., Sera LEE of Daejeon (KR) for samsung electronics co., ltd., Jihoon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L21/78, H01L23/00, H01L23/48, H01L29/06
CPC Code(s): H01L25/0657
Abstract: a semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite the active surface. a semiconductor device layer is disposed on the active surface. a modified region is positioned on an entirety of a lateral side surface of the semiconductor substrate.
20240203958.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SHLE-GE LEE of Suwon-si (KR) for samsung electronics co., ltd., HYUNGGIL BAEK of Suwon-si (KR) for samsung electronics co., ltd., GYUNGHWAN OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/31, H01L23/498, H01L25/065, H10B80/00
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes a lower substrate that has a contact region and a non-contact region, a first upper substrate on the lower substrate, a lower device on the first upper substrate, a plurality of first solder balls between the first upper substrate and the lower substrate contact region, a plurality of capacitors between the first upper substrate and the lower substrate non-contact region, and a plurality of support blocks between the plurality of capacitors and the lower substrate non-contact region.
20240203960.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seokhyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H10B80/00
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes a first semiconductor chip, a connection die adjacent a side surface of the first semiconductor chip, and a second semiconductor chip on the first semiconductor chip and the connection die. the first semiconductor chip includes a plurality of first through electrodes. the connection die includes a plurality of second through electrodes. the first through electrodes and the second through electrodes are below and vertically overlap the second semiconductor chip.
20240203961.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeonjeong HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Lim SUK of Suwon-si (KR) for samsung electronics co., ltd., Inhyung SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L21/56, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L25/16
Abstract: a semiconductor package may include a first redistribution substrate, a semiconductor chip disposed on the first redistribution substrate, a mold layer covering the semiconductor chip and including a first opening exposing a portion of a top surface of the semiconductor chip, a first passive device disposed on the portion of the top surface of the semiconductor chip exposed by the first opening, an insulating pattern filling the first opening and covering at least a portion of the first passive device, and a second redistribution substrate disposed on the mold layer. the first passive device may be spaced apart from the mold layer, with the insulating pattern interposed therebetween.
20240203964.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ara LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/00, H01L23/498, H01L23/522, H10B80/00
CPC Code(s): H01L25/162
Abstract: a semiconductor package includes a lower substrate, a lower device on a center of the lower substrate, an upper substrate on the lower device and the lower substrate, and a plurality of post electrodes between a region adjacent an edge of the lower substrate and a region adjacent an edge of the upper substrate. the plurality of post electrodes connect the lower substrate to the upper substrate. a plurality of passive devices are between the plurality of post electrodes and the region adjacent the edge of the lower substrate and connect the plurality of post electrodes to the lower substrate.
20240203969.STACKED-CHIP PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daeho LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Taeje CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L25/065
CPC Code(s): H01L25/18
Abstract: a stacked-chip package of the inventive concepts includes a first chip and a second chip stacked on the first chip. the first chip may include a first cell array region, a first core circuit region including a first core terminal, and a first peripheral circuit region including a plurality of first peripheral circuit terminals. the second chip may include a second cell array region on the first cell array region, a second core circuit region on the first core circuit region and including a second core terminal, and a through via on the first peripheral circuit region and connected to at least one first peripheral circuit terminal of the plurality of first peripheral circuit terminals.
Inventor(s): Hakchul Jung of Seoul (KR) for samsung electronics co., ltd., Ingyum Kim of Bucheon-si (KR) for samsung electronics co., ltd., Giyoung Yang of Seoul (KR) for samsung electronics co., ltd., Jaewoo Seo of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L29/06, H01L29/423, H01L29/786
CPC Code(s): H01L27/0207
Abstract: an integrated circuit includes a standard cell including a first active region extending in a first direction and having a first width, and a filler cell including a second active region of a same type as that of the first active region and being adjacent to the standard cell in the first direction, the second active region extending in the first direction and having a second width which is greater than the first width, wherein the standard cell further includes a first tapering portion of the same type as that of the first active region, the first tapering portion being arranged between the first active region and the second active region.
Inventor(s): JUNG-HO DO of Hwaseong-si (KR) for samsung electronics co., ltd., DAL-HEE LEE of Seoul (KR) for samsung electronics co., ltd., JIN-YOUNG LIM of Seoul (KR) for samsung electronics co., ltd., TAE-JOONG SONG of Seongnam-si (KR) for samsung electronics co., ltd., JONG-HOON JUNG of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, G06F30/00, G11C5/06, G11C8/16, G11C11/412, H01L21/768, H01L27/088, H01L27/118
CPC Code(s): H01L27/0207
Abstract: an integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. a first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. the first transistor may include a gate to which a first input signal is applied. the first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.
20240203977.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongeun CHO of Suwon-si (KR) for samsung electronics co., ltd., Kibum KIM of Suwon-si (KR) for samsung electronics co., ltd., Seonkyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hayoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong ROH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L23/48
CPC Code(s): H01L27/0255
Abstract: a semiconductor device may include a substrate including a keep-out zone (koz) and a layout finishing cell region, a through silicon via (tsv) penetrating the substrate and surrounded by the koz; an esd diode on an upper surface of the substrate, a driver circuit, gate structures, and metal wirings electrically connecting the tsv, the esd diode, and the driver circuit. the layout finishing cell region may surround the koz and the esd diode. the driver circuit may be adjacent to and outside the layout finishing cell region. the substrate may include active regions extending from an end inside the layout finishing cell region. the gate structures may intersect the active regions to form semiconductor components. the driver circuit may include at least some of the semiconductor components.
Inventor(s): Yongeun CHO of Suwon-Si (KR) for samsung electronics co., ltd., Hyunjeong ROH of Suwon-Si (KR) for samsung electronics co., ltd., Kibum KIM of Suwon-Si (KR) for samsung electronics co., ltd., Seonkyeong KIM of Suwon-Si (KR) for samsung electronics co., ltd., Hayoung KIM of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L21/8234, H01L23/48, H02H9/04, H01L23/00, H01L25/065
CPC Code(s): H01L27/0292
Abstract: a semiconductor device includes: a first i/o interface cell region having a plurality of first electrostatic discharge (esd) diodes, a first driver and a first through silicon via (tsv) disposed therein and having first wiring patterns and first via patterns for electrically connecting the plurality of first esd diodes, the first driver and the first tsv; and a second i/o interface cell region having a plurality of second esd diodes, a second driver and a second tsv disposed therein and having second wiring patterns and second via patterns for electrically connecting the second driver, the second tsv and a subset of the plurality of second esd diodes, wherein the second esd diodes other than the subset are separated from the second driver and the second tsv.
Inventor(s): Sun Ki MIN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L21/762, H01L29/423
CPC Code(s): H01L27/0886
Abstract: a semiconductor device including a gate separation region is provided. the semiconductor device includes an isolation region between active regions; interlayer insulating layers on the isolation region; gate line structures overlapping the active regions, disposed on the isolation region, and having end portions facing each other; and a gate separation region disposed on the isolation region, and disposed between the end portions of the gate line structures facing each other and between the interlayer insulating layers. the gate separation region comprises a gap fill layer and a buffer structure, the buffer structure includes a buffer liner disposed between the gap fill layer and the isolation region, between the end portions of the gate line structures facing each other and side surfaces of the gap fill layer, and between the interlayer insulating layers and the side surfaces of the gap fill layer.
Inventor(s): Jinbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Gyeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jangwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangmoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sujin JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L29/04, H01L29/06, H01L29/08, H01L29/161, H01L29/417, H01L29/423, H01L29/775
CPC Code(s): H01L27/092
Abstract: a semiconductor device includes a substrate including a p-type metal-oxide-semiconductor (mos) field-effect transistor (fet) (pmosfet) region and an n-type mosfet (nmosfet) region, a first active pattern on the pmosfet region, a second active pattern on the nmosfet region, a first channel pattern and a first source/drain pattern on the first active pattern, the first channel pattern connected to the first source/drain pattern, a second channel pattern and a second source/drain pattern provided on the second active pattern, the second channel pattern connected to the second source/drain pattern, and a gate electrode on the first channel pattern and the second channel pattern.
Inventor(s): Seunghyun Cho of Suwon-si (KR) for samsung electronics co., ltd., Jaemin Jung of Suwon-si (KR) for samsung electronics co., ltd., Jeongkyu Ha of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/12
CPC Code(s): H01L27/1244
Abstract: a film package includes: a film substrate having a first side surface and a second side surface opposing each other in a first direction, each of the first side surface and the second side surface extending in a second direction perpendicular to the first direction; at least one semiconductor chip disposed on the film substrate and extending lengthwise in the first direction; input terminals arranged on the film substrate along the first side surface, output terminals arranged on the film substrate along the second side surface, and wirings formed on the film substrate and electrically connecting the input terminals and the output terminals to the at least one semiconductor chip; and a protective layer covering the wirings on the film substrate.
20240204013.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungjun IN of Suwon-si (KR) for samsung electronics co., ltd., Sungchul KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeho KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14603
Abstract: an image sensor includes a substrate having a plurality of pixels. each pixel includes a photoelectric conversion region and a floating diffusion region in the substrate, a pixel transistor including a pixel gate on the first surface of the substrate, a first transmission gate between the photoelectric conversion region and the floating diffusion region, extending into the substrate, and having a first width in a horizontal direction, and a second transmission gate between the photoelectric conversion region and the floating diffusion region, arranged between the pixel gate and the first transmission gate when viewed in a plan view, and having a second width less than the first width in the horizontal direction.
20240204015.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daehyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Kwanyoung Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14614
Abstract: an image sensor includes at least one pixel, and the pixel includes a photoelectric conversion region in a semiconductor substrate having a first surface and a second surface, a floating diffusion region spaced apart from the photoelectric conversion region in the semiconductor substrate, and a vertical transfer gate that extends into the semiconductor substrate from the first surface of the semiconductor substrate. a transfer channel is between the photoelectric conversion region and the floating diffusion region.
Inventor(s): Sookyoung ROH of Yongin-si (KR) for samsung electronics co., ltd., Seokho YUN of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B3/00
CPC Code(s): H01L27/14627
Abstract: provided is an image sensor including a color separating lens array. the image sensor includes a sensor substrate including a plurality of first photosensitive cells and a plurality of second photosensitive cells configured to sense light, and a color separating lens array including a plurality of first regions respectively corresponding to the plurality of first photosensitive cells and each including a first fine structure, and a plurality of second regions respectively corresponding to the plurality of second photosensitive cells and each including a second fine structure that is different from the first fine structure, wherein, among incident light incident on the color separating lens array, light of a first wavelength and light of a second wavelength are branched into different directions and focused on the first photosensitive cells and the second photosensitive cells.
20240204025.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byeongtaek BAE of Suwon-si (KR) for samsung electronics co., ltd., Seunghwi YOO of Suwon-si (KR) for samsung electronics co., ltd., Kooktae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jingyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: provided is an image sensor including a substrate including a first photoelectric conversion region, and an isolation region arranged in the substrate vertically from the first surface and defining the first photoelectric conversion region, wherein the isolation region includes a first semiconductor pattern conformally covering an inner wall of a trench, an insulating film conformally covering an inner wall of the first semiconductor pattern, a second semiconductor pattern conformally covering an inner wall of a lower portion of the insulating film, and a conductive pattern covering an inner wall of an upper portion of the insulating film and an uppermost surface and an inner wall of the second semiconductor pattern, wherein a vertical distance from the first surface to the uppermost surface of the first semiconductor pattern is substantially the same as a vertical distance from the first surface to the uppermost surface of the conductive pattern.
Inventor(s): JUNGHOON KANG of Suwon-si (KR) for samsung electronics co., ltd., UN-BYOUNG KANG of Suwon-si (KR) for samsung electronics co., ltd., SEUNGWAN SHIN of Suwon-si (KR) for samsung electronics co., ltd., JUNG HYUN LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14634
Abstract: an image sensor package according to an embodiment includes: a substrate including a metal portion; an image sensor chip on the substrate; and a transparent glass cover disposed on the substrate and including an upper plate and sidewalls, the upper plate and the sidewalls defined by a cavity at a lower portion and spaced from the image sensor chip, wherein the sidewalls are directly bonded to the metal portion of the substrate, and the image sensor chip is sealed by the transparent glass cover and the substrate.
Inventor(s): Sanghoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Seongho Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14634
Abstract: the inventive concept provides an image sensor including a step having a slope shape and an image sensor including the wafer-to-wafer bonding structure. the image sensor includes a first substrate including a pixel array, a first multilayer wiring, a first insulation layer formed on a first junction surface to pass through the first insulation layer and a second substrate on the first substrate, wherein the second substrate includes a logic circuit, a second multilayer wiring, a second insulation layer on a second junction surface opposite to the first junction surface and a second metal pad passing through the second insulation layer, and a second step formed in the second junction surface engages with a first step formed in the first junction surface in a symmetrical slope shape to form direct bonding between the first substrate and the second substrate.
Inventor(s): Daehyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Kwanyoung Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1464
Abstract: a pixel of an image sensor and a backside illuminated image sensor are provided. the pixel includes a semiconductor substrate including a first surface and a second surface, a photoelectric conversion region formed between the first surface and the second surface of the semiconductor substrate, a floating diffusion region formed on the first surface and spaced apart from the photoelectric conversion region in a vertical direction, and a first vertical transfer gate formed inside a recess extending from the first surface of the semiconductor substrate into the inside of the semiconductor substrate and forming a first transfer channel between the photoelectric conversion region and the floating diffusion region, wherein the first vertical transfer gate may have a structure inclined with a first angle less than 90 degrees with respect to the first surface.
20240204035.DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungyeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyehoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Pujjae Choi of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Chunsoon Park of Suwon-si (KR) for samsung electronics co., ltd., Junsung Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/15, G02F1/1335, G02F1/13357, H01L25/065
CPC Code(s): H01L27/15
Abstract: a display apparatus, includes: a liquid crystal panel; and a backlight configured to provide light to the liquid crystal panel, the backlight including a substrate and a light-emitting diode (led) that is mounted on the substrate. the led includes a plurality of light-emitting layers configured to emit light of different wavelengths. a wavelength of light emitted from each of the plurality of light-emitting layers is greater than or equal to 430 nm and less than or equal to 480 nm.
Inventor(s): Ho-Jun Kim of Suwon-si (KR) for samsung electronics co., ltd., Woong Sik NAM of Suwon-si (KR) for samsung electronics co., ltd., Mirco CANTORO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L21/8234, H01L29/423, H01L29/66
CPC Code(s): H01L29/0673
Abstract: a semiconductor device includes first and second active patterns, a field insulating film between the first and second active patterns, a first gate structure intersecting the first active pattern and including a first gate electrode and a first gate spacer, a second gate structure intersecting the second active pattern and including a second gate electrode and a second gate spacer, a gate separation structure on the field insulating film between the first and second gate structures, the gate separation structure including a gate separation filling film on a gate separation liner, and a connecting spacer between the gate separation structure and the field insulating film, the connecting spacer protruding from a top surface of the field insulating film, and the gate separation liner contacting the connecting spacer and extending along a top surface and sidewalls of the connecting spacer and along the top surface of the field insulating film.
Inventor(s): Jongki JUNG of Hwaseong-si (KR) for samsung electronics co., ltd., Myungil KANG of Yongin-si (KR) for samsung electronics co., ltd., Yoonhae KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwanheum LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L21/8234, H01L27/088, H01L29/06, H01L29/16, H01L29/161, H01L29/165, H01L29/66, H01L29/78
CPC Code(s): H01L29/0847
Abstract: a semiconductor device includes a substrate, a first active fin on the substrate, the first active fin including a first side surface and a second side surface opposing the first side surface, a second active fin on the substrate, the second active fin including a third side surface facing the second side surface and a fourth side surface opposing the third side surface of the second active fin, a first isolation layer on the first side surface of the first active fin, a second isolation layer between the second side surface of the first active fin and the third side surface of the second active fin, a third isolation layer on the fourth side surface of the second active fin and a merged source/drain on the first and second active fins.
Inventor(s): Noh Yeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Dong Il BAE of Seongnam-si (KR) for samsung electronics co., ltd., Beomjin PARK of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/10, H01L21/8238, H01L27/092, H01L29/08, H01L29/16, H01L29/417, H01L29/423
CPC Code(s): H01L29/1033
Abstract: disclosed are semiconductor devices and/or method of fabricating the same. the semiconductor device comprises a substrate including first and second regions, a first active pattern on the first region and including a pair of first source/drain patterns and a first channel pattern including first semiconductor patterns, a second active pattern on the second region and including a pair of second source/drain patterns and a second channel pattern including second semiconductor patterns, a support pattern between two vertically adjacent first semiconductor patterns, and a first gate electrode and a second gate electrode on the first channel pattern and the second channel pattern. a channel length of the first channel pattern is greater than that of the second channel pattern. a ratio of a width of the support pattern to the channel length of the first channel pattern is in a range of 0.05 to 0.2.
Inventor(s): HYUNGJOO NA of Suwon-si (KR) for samsung electronics co., ltd., WOO BIN SONG of Suwon-si (KR) for samsung electronics co., ltd., JIN-WOOK YANG of Suwon-si (KR) for samsung electronics co., ltd., Cheoljin YUN of Suwon-si (KR) for samsung electronics co., ltd., YOSHINAO HARADA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/48, H01L27/092, H01L29/06, H01L29/423, H01L29/49, H01L29/775, H01L29/786
CPC Code(s): H01L29/41775
Abstract: a semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns that are spaced apart from each other and are vertically stacked, a source/drain pattern connected to the plurality of semiconductor patterns, a through pattern penetrating the source/drain pattern, a metal-semiconductor compound layer between the source/drain pattern and the through pattern, a gate electrode on the plurality of semiconductor patterns, the gate electrode including inner electrodes between adjacent semiconductor patterns of the plurality of semiconductor patterns and an outer electrode on an uppermost semiconductor pattern of the plurality of semiconductor patterns, an active contact on the through pattern, and a first metal layer on the active contact, the first metal layer including a power wiring and first wirings connected to the active contact.
Inventor(s): HYUN-KWAN YU of Suwon-si (KR) for samsung electronics co., ltd., MIN-HEE CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/762, H01L21/8234, H01L27/088
CPC Code(s): H01L29/41791
Abstract: a semiconductor device comprising a plurality of active patterns on a substrate. the semiconductor device may include a device isolation layer defining the plurality of active patterns, a gate electrode extending across the plurality of active patterns, and a source/drain pattern on the active patterns. the plurality of active patterns may comprise a first active pattern and a second active pattern. the source/drain pattern comprises a first part on the first active pattern, a second part on the second active pattern, and a third part extending from the first part and along an upper portion of the first active pattern. the device isolation layer comprises a first outer segment on a sidewall of the first active pattern below the source/drain pattern. a lowermost level of a bottom surface of the third part may be lower than an uppermost level of a top surface of the first outer segment.
Inventor(s): Junhyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaejoon OH of Suwon-si (KR) for samsung electronics co., ltd., Sunkyu HWANG of Suwon-si (KR) for samsung electronics co., ltd., Boram KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongseob KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonyong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/778, H01L23/31, H01L29/20, H01L29/66
CPC Code(s): H01L29/7786
Abstract: a semiconductor device includes a channel layer, a lower barrier layer on the channel layer and including first impurities, an upper barrier layer arranged on the lower barrier layer and including second impurities having a concentration greater than a concentration of the first impurities, a gate electrode on the upper barrier layer, a gate semiconductor layer between the upper barrier layer and the gate electrode, and a source and a drain that are on the channel layer and are spaced apart from each other.
20240204107.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sang Koo KANG of Suwon-si (KR) for samsung electronics co., ltd., Woo Kyung YOU of Suwon-si (KR) for samsung electronics co., ltd., Min Jae KANG of Suwon-si (KR) for samsung electronics co., ltd., Koung Min RYU of Suwon-si (KR) for samsung electronics co., ltd., Hoon Seok SEO of Suwon-si (KR) for samsung electronics co., ltd., Woo Jin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jun Chae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L27/088, H01L29/417, H01L29/66
CPC Code(s): H01L29/7869
Abstract: a semiconductor device includes: a substrate including an upper side and a lower side; first and second active patterns spaced apart from each other; a field insulating film covering side walls of the first and second active patterns; a power rail disposed adjacent to a first side wall of the second active pattern and between the first active pattern and the second active pattern; a power rail via disposed on the power rail and connected to the power rail; a semiconductor etching stop pattern disposed adjacent to a second side wall of the second active pattern; and a first semiconductor pattern disposed on the semiconductor etching stop pattern, wherein a lower surface of the semiconductor etching stop pattern is disposed on substantially a same plane as the lower side of the substrate, and wherein at least part of the first semiconductor pattern is disposed in the field insulating film.
Inventor(s): Tackmo Lee of Suwon-si (KR) for samsung electronics co., ltd., Gunwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Seonghwan Shin of Suwon-si (KR) for samsung electronics co., ltd., Gyun Heo of Suwon-si (KR) for samsung electronics co., ltd., Soonmin Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/48, H01L25/075, H01L25/16, H01L27/15, H01L33/62
CPC Code(s): H01L33/486
Abstract: a display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal plate positioned on the rear surface of the substrate; a side molding covering the side surface and positioned below the outer area from the mounting surface; and a grounding member grounded to the metal plate and adhered to a lower surface of the side molding, where the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface.
Inventor(s): Elena Aleksandrovna SHEPELEVA of Moscow (RU) for samsung electronics co., ltd., Artem Rudolfovich VILENSKIY of Moscow (RU) for samsung electronics co., ltd., Gennadiy Alexandrovich EVTYUSHKIN of Moscow (RU) for samsung electronics co., ltd., Anton Sergeevich LUKYANOV of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): H01Q21/06, H01Q15/00
CPC Code(s): H01Q21/065
Abstract: the disclosure relates to radio engineering, and more specifically, to a wide scan angle antenna array. technical result consists in expanding the scanning range, increasing the efficiency of the antenna array and reducing losses. antenna array is provided. the antenna array includes a plurality of antenna array elements, and a metasurface disposed above the antenna array, wherein the metasurface is a dielectric layer having, on a first side thereof, conductive elements configured to reflect part of radiation of the antenna array; the distance between the antenna array and the metasurface is based on an integer number of half wavelengths, an operating wavelength of the antenna array in a medium in the space between the antenna array and the metasurface, and a predetermined scanning angle of the antenna array.
20240204574.ENERGY SUPPLY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Tomoyuki KANAGAWA of Kanagawa (JP) for samsung electronics co., ltd., Masashi SASAGAWA of Kanagawa (JP) for samsung electronics co., ltd., Yasushi SODA of Kanagawa (JP) for samsung electronics co., ltd., Seisaku OOSAKO of Kanagawa (JP) for samsung electronics co., ltd., Yutaka YAGI of Kanagawa (JP) for samsung electronics co., ltd., Nobuharu NISHIKOORI of Kanagawa (JP) for samsung electronics co., ltd.
IPC Code(s): H02J50/60, H02J50/12, H02J50/40, H05B6/44
CPC Code(s): H02J50/60
Abstract: an energy supply device that supplies energy to an object. in an embodiment, the energy supply device may include at least one processor, and a plurality of coils connected to a resonant condenser for energy supply and an inverter circuit. in an embodiment, the at least one processor may determine a first coil from among a plurality of coils as a transmission coil and determine a second coil from among the plurality of coils as a reception coil. further, the at least one processor may transmit a detection signal to the first coil, obtain an induction signal induced in the second coil through a reception circuit connected to the second coil, and detect the object on the energy supply device based on the obtained induction signal.
Inventor(s): Junghwan MOON of Suwon-si (KR) for samsung electronics co., ltd., Youngyoon Woo of Suwon-si (KR) for samsung electronics co., ltd., Minsik Jun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F3/24, H03F1/32, H04B1/04
CPC Code(s): H03F3/245
Abstract: an electronic device may include: a processor; a power amplifier; a power supply configured to supply power to the power amplifier; a crest factor reduction (cfr) module; and a digital predistortion (dpd) module, wherein the processor is configured to: transmit a first radio frequency (rf) signal, based on a first state of each of the cfr module, the dpd module, and the power supply, in a first transmission interval, the first rf signal being generated from a first baseband signal; identify voltage information of a second rf signal associated with a second transmission interval after the first transmission interval; change a state of each of the cfr module, the dpd module, and the power supply from the first state to a second state, based on the voltage information, in a first reception interval between the first transmission interval and the second transmission interval; and transmit the second rf signal generated from a second baseband signal based on the second state of each of the cfr module, the dpd module, and the power supply, in the second transmission interval.
Inventor(s): Joonyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanglok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungjune PARK of Suwon-si (KR) for samsung electronics co., ltd., Chiweon YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/3562, G11C16/04, G11C16/10, G11C16/26, G11C16/32
CPC Code(s): H03K3/35625
Abstract: a data flip-flop circuit includes a flip-flop, a recovery latch and a cut-off transistor. the flip-flop stores a data signal that is input, using a clock signal and a virtual power supply voltage and provides the stored data signal as an output signal at an output node in response to a rising transition of the clock signal. the recovery latch is connected to a power supply voltage and a ground voltage, is connected to the flip-flop at the output node, stores the output signal internally in response to a first transition of a chip enable signal, recovers the stored output signal in response to end of a power gating interval based on the chip enable signal, and provides the recovered output signal to the flip-flop. the cut-off transistor floats the virtual power supply voltage provided to the flip-flop based on a first power gating signal.
Inventor(s): Jungsik MIN of Suwon-si (KR) for samsung electronics co., ltd., Youngjin KANG of Suwon-si (KR) for samsung electronics co., ltd., Jinseong PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Seunghee SON of Suwon-si (KR) for samsung electronics co., ltd., Kyoungsik YOON of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun HAN of Suwon-si (KR) for samsung electronics co., ltd., Wonhyung HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/401, H04B1/04, H04L5/00
CPC Code(s): H04B1/401
Abstract: an electronic device includes an antenna, a radio frequency front end (rffe) connected to the antenna through an electrical path and including a power amplifier (pa). the electronic device includes a control circuit operably coupled to the rffe and configured to control the output of the pa in order to transmit a sounding reference signal (srs) based on a first value which is a target transmit (tx) power value of the srs to be transmitted to a base station through the antenna, a second value for compensating a power loss caused by the electric path when providing the srs to the antenna through the electric path, and whether a third value obtained based on the first value and the second value is less than or equal to a reference value or greater than the reference value.
20240204845.CHANNEL STATE INFORMATION REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/0626
Abstract: apparatuses and method for channel state information (csi) reporting. a method performed by a user equipment (ue) includes receiving a configuration about a channel state information (csi) report. the configuration indicates (i) a value of n, (ii) a value of paramcombination indicating values of three parameters, and (iii) a codebooktype. the method further includes determining the csi report based on the configuration and transmitting the csi report. here, nis a number of time-domain (td) slot intervals.
Inventor(s): Ameha Tsegaye ABEBE of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd., Seongmok LIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/0639
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a user equipment (ue) in a communication system is provided. the ue comprising a transceiver, and a controller configured to receive, from a base station, configuration information for enabling precoding matrix indicator (pmi) for single transmit-receive point (strp) and multi trp (mtrp) operation on non-coherent joint transmission (ncjt) mode; generate channel state information (csi) including pmi for strp or pmi for mtrp, based on ue capability and configuration associated with partial pmi; and transmit, to the base station, the csi including the pmi for strp or pmi for mtrp.
Inventor(s): Hoda SHAHMOHAMMADIAN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Jungwon LEE of San Diego CA (US) for samsung electronics co., ltd., Dongwoon BAI of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/08, H04B7/06, H04W64/00
CPC Code(s): H04B7/086
Abstract: methods and apparatuses are provided in which position information is determined corresponding to movement of a user equipment (ue) from first local coordinates to second local coordinates. receive angles of the ue are derived from the position information of the ue. a beamforming weight of the ue is determined based on the derived receive angles of the ue. the beamforming weight is configured such that a beam direction of the second local coordinates matches a beam direction of the first local coordinates.
Inventor(s): Donghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Seho MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwonjong LEE of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/00
CPC Code(s): H04L1/0061
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a method performed by a transmitting node in a wireless communication system may include encoding a plurality of information bits using a plurality of cyclic redundancy check (crc) bits, interleaving the plurality of the information bits and the plurality of the crc bits using an interleaving pattern, generating a codeword by convolution-encoding and polar-encoding the plurality of the interleaved information bits and the plurality of the interleaved crc bits, and transmitting the codeword to a receiving node. the interleaving pattern may correspond to a matrix generated based on a size of the plurality of the information bits and a size the plurality of the crc bits.
Inventor(s): Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/1829, H04L1/1812, H04L1/1867
CPC Code(s): H04L1/1854
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. provided are a method and an apparatus for periodically transmitting and receiving data. the method of a terminal comprises: receiving, from a base station, a configuration on a cg; identifying, based on the configuration, a plurality of cg puschs within a periodicity; identifying, based on an order of a cg pusch within the periodicity, a plurality of harq process ids for the plurality of cg puschs; and transmitting, to the base station, the plurality of cg puschs within the periodicity based on the plurality of harq process ids.
Inventor(s): Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyojin LEE of Seoul (KR) for samsung electronics co., ltd., Sungjin PARK of Incheon (KR) for samsung electronics co., ltd., Jinyoung OH of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L1/00, H04L27/26, H04W28/06, H04W72/12, H04W72/20
CPC Code(s): H04L5/0053
Abstract: the present disclosure relates to a communication technique that combines, with iot technology, 5g communication system for supporting a higher data transfer rate than a 4g system, and a system therefor. the present disclosure can be applied to intelligent services, such as smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail businesses, security and safety related services, etc. on the basis of 5g communication technologies and iot related technologies. disclosed, in the present invention, are a method and an apparatus for determining the size of a transport block in a communication or broadcasting system.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0453, H04W72/23, H04W76/28
CPC Code(s): H04L5/0092
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). the present disclosure provides method for frequency band switching performed by a user equipment and the user equipment. the method for frequency band switching performed by the user equipment includes: acquiring a configuration of one or more first frequency bands and one or more second frequency bands; performing switching between the first frequency band and the second frequency band.
Inventor(s): Daeyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Joontae Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok Yu of Suwon-si (KR) for samsung electronics co., ltd., Gangminh Lee of Suwon-si (KR) for samsung electronics co., ltd., Youngik Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/14
CPC Code(s): H04L5/1461
Abstract: an interference cancellation circuit includes: an activation circuit configured to receive at least one transmission path signal and a reception path signal and configured to generate an activation control signal based on at least one of the reception path signal and the at least one transmission path signal; a forgetting factor control circuit configured to compare a control metric with a plurality of threshold values and control a forgetting factor value based on the control metric compared with the plurality of threshold values; a kernel generation circuit configured to receive a transmission signal corresponding to the at least one transmission path signal and configured to generate an interference model; and an adaptive filter configured to receive a kernel signal from the kernel generation circuit, and configured to receive the forgetting factor value from the forgetting factor control circuit to cancel self-interference.
Inventor(s): Peng LIN of Beijing (CN) for samsung electronics co., ltd., Di SU of Beijing (CN) for samsung electronics co., ltd., Chen QIAN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04W72/0446, H04W72/0453, H04W72/1263
CPC Code(s): H04L27/2605
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure provides a method performed by a first node in a wireless communication system, the method comprising: generating a first physical signal and a second physical signal; and generating a first baseband signal on a first time unit based on the first physical signal and a second baseband signal on a second time unit based on the second physical signal, wherein the first baseband signal comprises a first part in which the first physical signal is leftwaard cyclic shifted by a length of a first cyclic prefix and the first cyclic prefix which is appended to a head of the first part, wherein the second baseband signal comprises a second part and a second cyclic prefix which is appended to a head of the second part, and wherein a third part comprising a part of the first part of the first baseband signal and the second cyclic prefix of the second baseband signal is configured as a cyclic prefix for the second part of the second baseband signal which is used for joint communication and sensing (jcas).
Inventor(s): Vasanth Kanakaraj of Bangalore (IN) for samsung electronics co., ltd., Shreyanshu Agarwal of Bangalore (IN) for samsung electronics co., ltd., Issaac Kommineni of Bangalore (IN) for samsung electronics co., ltd., Vishal Murgai of Bangalore (IN) for samsung electronics co., ltd., Anish Nediyanchath of Bangalore (IN) for samsung electronics co., ltd., Gaurav Jha of Bangalore (IN) for samsung electronics co., ltd., Naveen Kumar Srinivasa Naidu of Bangalore (IN) for samsung electronics co., ltd., Sukhdeep Singh of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L41/5009, H04L41/16, H04W28/08
CPC Code(s): H04L41/5009
Abstract: a method of providing congestion control and reducing latency of data incoming to a core network, the method performed by a control plane gateway, includes: monitoring values of key performance indicators (kpis) associated with a plurality of user plane gateways in the core network; predicting, using a machine learning (ml) model, an optimal window size respectively for each of the plurality of user plane gateways, based on the monitored values of the kpis; and transmitting the optimal window size to the respective user plane gateway in the plurality of user plane gateways.
Inventor(s): Sunhyun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiyoung CHA of Gyeonggi-do (KR) for samsung electronics co., ltd., Sangho LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongmyung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L43/026, H04W16/18, H04W24/02, H04W24/08
CPC Code(s): H04L43/026
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a method performed by a user plane function (upf) node in a wireless communication system includes receiving multiple traffic packets; identifying at least one encrypted traffic packet among the multiple traffic packets; identifying frame type information of the at least one traffic packet, based on an artificial intelligence (ai) model embedded in the upf; identifying a quality of service (qos) flow corresponding to at least one traffic packet, based on the identified frame type information; and transmitting the at least one traffic packet, based on the identified qos flow.
Inventor(s): Young Jun HONG of Suwon-si (KR) for samsung electronics co., ltd., Yong In LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L49/15
CPC Code(s): H04L49/15
Abstract: an electronic apparatus includes a plurality of processor device-memory device groups, and each of the plurality of processor device-memory device groups includes a plurality of memory devices respectively comprising one or more memories, a plurality of processor devices respectively comprising one or more processors, and a plurality of switches. each of the plurality of switches includes a plurality of ports. each of first memory devices included in a first processor device-memory device group of the plurality of processor device-memory device groups is connected to a first subset of ports of one switch of first switches included in the first processor device-memory device group, and to a first subset of ports of one switch of second switches of the plurality of switches included in a second processor device-memory device group of the plurality of processor device-memory device groups.
Inventor(s): Choel-Hwi KWON of Gumi-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L51/00, G06F21/84, H04M1/673, H04M1/72436
CPC Code(s): H04L51/00
Abstract: a method and an apparatus for transmitting a message in an electronic device are provided. the method for transmitting a hidden message includes displaying one or more hiding frames in an input message display area of a display, and transmitting a message including information on the hiding frame.
Inventor(s): Dongeun SUH of Suwon-si (KR) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L67/141
CPC Code(s): H04L67/141
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. provided is a method of solving a problem in which pdu session creation is rejected due to an nsac in a wireless communication system according to an embodiment of the disclosure through alternative s-nssai.
Inventor(s): Hyungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Daehyeong PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0216
Abstract: an electronic device includes a first housing, a second housing, a display supported by the first housing and the second housing, and a hinge structure rotatably connecting the first housing and the second housing, wherein the hinge structure includes a body including a first guide groove forming a first rotation path and a second groove forming a second rotation path having a second rotation axis different from the first rotation axis of the first rotation path, and facing the display, a first rotating plate including a first pin in the first guide groove moved along the first rotation path and a second pin in the second guide groove moved along the second rotation path, to pivotably connect a side of the body, and a second rotating plate pivotably connected to the first rotating plate and having a slope relative to the first rotating plate in the folded state of the electronic device. other embodiments are possible.
Inventor(s): Heecheul MOON of Suwon-si (KR) for samsung electronics co., ltd., Kwonho SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0216
Abstract: an electronic device according to an embodiment, may include: a hinge structure including a hinge housing, a first housing connected to the hinge structure, a second housing connected to the first housing through the hinge structure and configured to rotate with respect to the first housing, a flexible display disposed in the first housing with a first portion and disposed in the second housing with a second portion, and at least one protection structure disposed to cover at least a part of a periphery of the flexible display and the at least one protection structure may include: a base disposed on the hinge housing and including a fixing portion formed in a direction in which a front surface of the electronic device faces, and a blocking member comprising an elastic body integrally formed with at least a part of the fixing portion, and disposed to cover at least a part of the periphery of the flexible display.
Inventor(s): Yongseok LEE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sangmin KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Daeyoung NOH of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Heecheul MOON of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sangyoup SEOK of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Kwonho SON of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Minchang SHIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Minwoo YOO of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/18, H04M1/02, H05K5/03
CPC Code(s): H04M1/18
Abstract: according to one embodiment of the present invention, an electronic device may include: a cover part, which forms an outer surface of the electronic device, and which includes a first cover member including a portion of an edge of the outer surface, and a second cover member including a second portion of the edge; a support member positioned inside the electronic device; and a first adhesive member, which includes a first adhesive part having a closed curve shape positioned between the cover part and the support member along the edge, and a second adhesive part extending from the first adhesive part and covering a boundary part along the boundary part between the first cover member and the second cover member. other various embodiments are possible.
Inventor(s): Seongki JEONG of Suwon-si (KR) for samsung electronics co., ltd., Chijoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/18, H04M1/02
CPC Code(s): H04M1/185
Abstract: according to an embodiment, an electronic device includes a first housing, a second housing rotatably coupled to the first housing, a display disposed on the first housing and the second housing, a protective member including a recess disposed along at least a part of edges of the display and including a through hole, a damper supported by the recess, a rod including an end protruding from the damper via the through hole, a fastener contacting a surface of the protective member facing an inner space formed by the first surface, the second surface, and a side surface of the first housing, and combined with an end of the rod, extending from the end of the rod in a radial direction of the through hole, and covering the through hole.
Inventor(s): Byounghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghee KIM of Suwon-si (KR) for samsung electronics co., ltd., Younho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Cheulhee HAHM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/488, G06T7/62, G06T7/70, G06V10/25, H04N21/4728
CPC Code(s): H04N21/4884
Abstract: an embodiment of the present disclosure relates to a display device including a display, a memory storing at least one instruction, and a processor configured to execute the at least one instruction stored in the memory to receive an image and a closed caption corresponding to the image, detect at least one region of interest (roi) included in the image by using a neural network, generate at least one integrated region by grouping the at least one roi into at least one group of adjacent rois, determine a closed caption output region among at least one preset candidate closed caption region, based on whether the at least one preset candidate closed caption region overlaps at least one of the at least one roi and the at least one integrated region, and control the display to display the closed caption in the closed caption output region.
Inventor(s): Sewon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/57, H05K1/18
CPC Code(s): H04N23/57
Abstract: a camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (rpcb), a metal plate coupled to the lower surface of the rpcb and having one or more holes formed therein, a multi-layer ceramic condenser (mlcc) disposed in the one or more holes in the rpcb, and an image sensor disposed on the metal plate. with reference to the lower surface of the rpcb, the mlcc may be formed to have a height less than the height of the metal plate. a camera module structure according to an embodiment of the present disclosure may comprise: a flexible printed circuit board (fpcb), an rpcb coupled to the lower surface of the fpcb and having one or more first holes formed therein, a metal plate coupled to the lower surface of the rpcb and having one or more second holes formed in areas corresponding to the first holes, respectively, an mlcc disposed in the first holes and the second holes below the fpcb, and an image sensor disposed on the metal plate. the mlcc may be disposed in at least one of spaces formed through the first holes and the second holes. according to various embodiments of the present disclosure, a different camera module structure may be utilized such that no separate space is necessary to mount a laminated ceramic capacitor, and space utilization may be improved.
Inventor(s): Kapil Raj MATHUR of Noida (IN) for samsung electronics co., ltd., Sawan Dineshbhai KAULIC of Noida (IN) for samsung electronics co., ltd., Anubhav SACHAN of Noida (IN) for samsung electronics co., ltd., Harvind SINGH of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): H04N23/61, G06T7/80, H04N23/60, H04N23/63
CPC Code(s): H04N23/61
Abstract: provided are a system, an electronic device, and a method for adjusting camera configurations including rendering an image of a scene to be obtained by a camera of the electronic device, identifying relevant bounding boxes associated with the image, each relevant bounding box comprising a corresponding object. the corresponding object of each relevant bounding box includes a co-occurrence value. the method includes generating a set of reference parameters associated with the corresponding objects of the relevant bounding boxes by identifying a reference parameter for the corresponding object of each relevant bounding box of the relevant bounding boxes, identifying one or more reference images and retrieving corresponding reference configurations associated with the identified one or more reference images based on the set of reference parameters; and configuring the camera of the user device based on the reference configurations of at least one of one or more reference images.
Inventor(s): Duhyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Wontaek Seo of Suwon-si (KR) for samsung electronics co., ltd., Jangwoo You of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/955, G02B1/00, G02B5/20, H04N23/11
CPC Code(s): H04N23/955
Abstract: provided is an imaging system including a phase mask including a phase modulation meta surface coded with an image reconstruction phase function configured to reconstruct an image, the image reconstruction phase function being obtained by adding a first phase function corresponding to a lens phase to a second phase function which is a random function, and an image sensor configured to convert light, transmitted through the phase mask from an object, into an electrical signal.
Inventor(s): Heesung SHIM of Suwon-si (KR) for samsung electronics co., ltd., Jaekyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Ingyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/51, H04N25/42, H04N25/59, H04N25/616, H04N25/771, H04N25/778, H04N25/78
CPC Code(s): H04N25/51
Abstract: an image sensor according to some example embodiments of the present inventive concepts may operate in a global shutter mode, and each pixel circuit may support a high conversion gain (hcg) mode and a low conversion gain (lcg) mode so as to have high dynamic range (hdr). accordingly, the image sensor according to some example embodiments of the present inventive concepts may have hdr and may generate a high-quality image.
Inventor(s): Bongki SON of Suwon-si (KR) for samsung electronics co., ltd., Junseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Keunjoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/766, H04N25/771, H04N25/778
CPC Code(s): H04N25/766
Abstract: provided is a dynamic vision sensor. the dynamic vision sensor includes: a pixel array including a plurality of pixels arranged in a plurality of rows and a plurality of columns, wherein each of the plurality of pixels is configured to detect a change in intensity of incident light; and a readout circuit configured to simultaneously select first pixels of first target columns among the plurality of columns in a first section of a binning operation, and generate and output first binning event signals of first binning pixel groups based on first event signals simultaneously output from the first pixels.
Inventor(s): Yongjun CHO of Suwon-si (KR) for samsung electronics co., ltd., Sunyool KANG of Suwon-si (KR) for samsung electronics co., ltd., Yunhwan JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/772
CPC Code(s): H04N25/772
Abstract: an image sensor including a pixel array including a plurality of pixels arranged in a plurality of rows and a plurality of columns, a row driver configured to transmit control signals to the pixel array, and an analog-to-digital converter array configured to receive pixel signals from the pixel array and convert the pixel signals into a digital signal, wherein the row driver is configured to transmit a control signal such that a first pixel group arranged in a first row from among the plurality of rows and a second pixel group arranged in a second row from among the plurality of rows output pixel signals during a first period, and transmit a control signal such that a third pixel group arranged in the first row and a fourth pixel group arranged in the second row output pixel signals during a second period.
Inventor(s): Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Arijit SEN of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Koustav ROY of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W12/72, H04W8/06, H04W12/61, H04W48/18, H04W60/06, H04W84/04
CPC Code(s): H04W12/72
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte).
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04L69/04, H04W76/20
CPC Code(s): H04W28/06
Abstract: in accordance an embodiment of the disclosure, a method performed by a user equipment (ue) in a wireless communication system is provided. the method may comprise: identifying an inter-system change from a first mode to a second mode, transferring a data session established in the first mode to the second mode from the first mode, determining whether the ue and a network entity in the second mode support a header compression, and initiating, based on a result of the identifying, a procedure for negotiating a header compression configuration in the transferred data session, wherein the first mode is one of n an mode or an s mode, and the second mode is the other of the n mode or the s mode.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W28/02, H04W76/27, H04W80/02
CPC Code(s): H04W36/0022
Abstract: a method, performed by a terminal, in a wireless communication system is provided. the method includes receiving, from a source base station, a radio resource control (rrc) reconfiguration message for a handover, the rrc reconfiguration message configuring a first data radio bearer (drb) as a dual active protocol stack (daps) bearer and a second drb as a non-daps bearer, for the first drb, in case that an uplink data switching is requested from an upper layer, indicating, by a packet data convergence protocol (pdcp) entity for the drb, a pdcp data volume excluding a pdcp control protocol data unit (pdu) associated with the source base station, to a medium access control (mac) entity for a target base station, and for the second drb, in case that an indication of pdcp re-establishment is set, performing a pdcp re-establishment for the second drb.
20240205766.L1/L2 TRIGGERED MOBILITY EXECUTION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W36/36
CPC Code(s): H04W36/0079
Abstract: methods and apparatuses for a l1/l2 triggered mobility execution in a wireless communication system are provided. the method of ue comprises: receiving information related to (i) an ltm configuration and (ii) an applicability of the ltm configuration to recover from a failure of an ltm execution; determining whether the applicability of the ltm configuration to recover from the failure of the ltm execution is enabled; determining whether the ltm execution fails; performing a cell selection operation based on a determination that the ltm execution fails; determining whether a cell that is selected in the cell selection operation is an ltm candidate cell; performing the ltm execution based on a determination that the cell is an ltm candidate cell and the applicability of the ltm configuration to recover from the failure of the ltm execution is enabled; applying the ltm configuration and transmitting a random access preamble.
Inventor(s): Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/00, H04W76/20
CPC Code(s): H04W36/08
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes entering a radio resource control (rrc) connected mode with a first primary cell (pcell), performing secondary node addition procedure with a primary secondary cell (pscell), and storing visited information associated with the first pcell and the pscell in case that the first pcell is changed to a second pcell and the pscell is released at the same time as the change of the first pcell to the second pcell.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W52/36
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method performed by a terminal in a communication system is provided. the method includes receiving, from a first base station, configuration information for a secondary cell group (scg) including at least one serving cell associated with a second base station, receiving, from the first base station, a first message for activation or deactivation of the scg, and in case that the scg is deactivated based on the first message and uplink data arrives on at least one bearer of the scg, transmitting a second message for activation of the scg. according to the disclosure, carrier aggregation and dual connectivity can be quickly activated, thereby reducing battery consumption of a terminal.
Inventor(s): Kipyo NAM of Suwon-si (KR) for samsung electronics co., ltd., Jinyup Kim of Suwon-si (KR) for samsung electronics co., ltd., Myonghwan Jung of Suwon-si (KR) for samsung electronics co., ltd., Changhyun Joo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04M1/72472, H04W84/04
CPC Code(s): H04W48/16
Abstract: provided are an electronic device and method including, based on an input related to a public land mobile network (plmn) scan being detected, performing a network scan related to a cellular network through a first communication circuit; acquiring network information related to the cellular network of at least one external electronic device through direct communication, based on the input; generating a network list comprising at least one plmn and at least one radio access technology (rat), based on at least one of a result of the network scan or the network information related to the cellular network of the at least one external electronic device; and providing information related to the network list.
Inventor(s): Dongyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jungshin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W8/18, H04W76/10, H04W76/30
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a communication technique of converging a 5generation (5g) communication system for supporting higher data rates after a 4generation (4g) system with internet of things (iot), and a system therefor. the disclosure provides a method performed by a first network entity managing a packet data network (pdn) session in a wireless communication system supporting interworking between a first and second networks. the method comprises receiving subscription update information of a user equipment (ue) for which a pdn connection associated with a network slice is established in the second network, the network slice being subscribed in the first network, determining whether to release the pdn connection if the subscription update information includes information notifying that network slice related information of the ue is changed, and performing a release of the pdn connection associated with the network slice if the release of the pdn connection is determined.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W52/02
CPC Code(s): H04W52/0229
Abstract: a wireless communication network includes an access point (ap) multi-link device (mld) and a non-ap mld. a sta of a non-ap mld may inform the ap mld about changes in power management mode and/or power save state for another sta affiliated with the same non-ap mld via cross-link signaling. the ap mld may inform the non-ap mld about its capability to receive, and the time required to process cross-link signaling for the changes in power management mode and/or power save state.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04L5/00
CPC Code(s): H04W52/0229
Abstract: apparatuses and methods for transmitting and receiving low power signals. a method of a user equipment (ue) in a wireless communication system includes receiving configurations for occasions to receive first and second types of low power signals and determining, based on the configurations, a first set of periodic occasions to receive the first type of low power signal and a second set of non-periodic occasions to receive the second type of low power signal. the method further includes receiving the first type of low power signal and the second type of low power signal and performing, based on the first type of low power signal, at least one of a synchronization measurement and a radio resource management (rrm) measurement.
Inventor(s): Seijoon SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04L5/00
CPC Code(s): H04W56/001
Abstract: in various example embodiments, a method performed by a digital unit (du) is provided. the method may comprise providing a radio unit (ru) with one or more reference signals for phase alignment. the one or more reference signals may be associated with one or more transmission paths of the ru. the method may comprise transmitting, to the radio unit (ru), a response signal control message for a response message. the method may comprise receiving, from the ru, the response message. the response message may include, for each transmission path of the one or more transmission paths of the ru, a path identifier (id) and a response signal for a reference signal corresponding to the path id.
Inventor(s): Chenggang Guo of Suzhou Industrial Park (CN) for samsung electronics co., ltd.
IPC Code(s): H04W60/00
CPC Code(s): H04W60/005
Abstract: a method of establishing a communication connection by a user equipment (ue) includes transmitting a first attachment request to a communication network using a plmn and an apn; receiving a reason for rejecting the first attachment request from the communication network; and disabling an n1 mode of the ue according to the reason for rejecting, to disable a new radio (nr) standalone (sa) mode of the ue. thereafter, a second attachment request is transmitted for establishing a communication connection with an lte network using the same plmn and apn. the n1 mode is re-enabled and a corresponding process is initiated when a specific condition is satisfied or a specific time period has expired. the ue reports updated ability to the communication network when the n1 mode is re-enabled. the ue supports nr sa and interworking between nr sa and lte. the communication network does not support nr sa or interworking between the nr sa and lte at least in a coverage area where the ue is located.
Inventor(s): Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W48/16
CPC Code(s): H04W60/04
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure related to method and apparatus for a network slice access management for a user equipment in a wireless communication system. the method includes receiving, from an access and mobility management function (amf) entity, temporary slice related information for a first single network slice selection assistance information (s-nssai). further, the method includes identifying whether the first s-nssai is available or not available. further, the method includes transmitting, to the amf entity, a registration request message including a second s-nssai based on the identification. further, the registration request message does not include the first s-nssai.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04W24/10
CPC Code(s): H04W64/00
Abstract: the present disclosure aims to decrease latency due to a measurement gap occurring when a user equipment (ue) attempts to transmit measured position related information to a base station (bs). main configurations include transmitting, to a ue, configuration information about a plurality of measurement gaps, based on an nr positioning protocol a (nrppa) message received from a location management function (lmf) entity; and performing a measurement gap activation procedure via a medium access control (mac) control element (ce), based on the configuration information.
Inventor(s): Yanru WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Xiaoning MA of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04W36/24, H04W36/32, H04W60/04
CPC Code(s): H04W64/006
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a first node in a wireless communication system is provided. the method includes acquiring information related to at least one of trajectory prediction of user equipment, data usage prediction of the user equipment, quality of service and/or quality of experience prediction and/or reporting of a second node and/or a user equipment, or positioning of the user equipment, and performing a corresponding operation based on the information.
Inventor(s): Euichang JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Suyoung PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Suha YOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunghyuk SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaebong CHUN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/044, H04B7/0408, H04W72/51, H04W72/542
CPC Code(s): H04W72/044
Abstract: the present disclosure relates to a 5g or pre-5g communication system for supporting higher data transfer rates than that of a beyond 4g communication system such as lte. a control method of a terminal in a wireless communication system, according to an embodiment of the present invention, may comprise the steps of: receiving radio resource control signaling (rrc signaling) for a signal measured by a terminal; identifying a transmission interval of a signal measured by the terminal, on the basis of the received rrc signaling; identifying first information for forming a predetermined beam; and determining whether to change the first information for forming a beam to second information for forming a beam, on the basis of the identified transmission interval.
Inventor(s): Yaser Mohamed Mostafa Kamal FOUAD of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Sili LU of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/20, H04W4/40, H04W72/51
CPC Code(s): H04W72/20
Abstract: a user equipment (ue) is provided that includes a memory and a processor. the processor is configured to determine whether to send assistance information. in response to determining to send the assistance information, the processor is also configured to transmit the assistance information either via sidelink control information (sci) or via a medium access control (mac) control element (ce) having one or more resource selection assistance information elements.
Inventor(s): Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L1/1812, H04L1/1867, H04W72/566, H04W76/27, H04W80/02
CPC Code(s): H04W72/23
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method performed by a terminal in a communication system is provided. the method includes receiving, from a base station, configuration information on a configured grant for uplink transmission, the configured grant being configured with an autonomous transmission; in case that a previous configured grant for a hybrid automatic repeat request (harq) process was not prioritized, a transmission of a first medium access control (mac) protocol data unit (pdu) obtained for the harq process has not been performed, and a size of the first mac pdu matches a size of a configured grant, identifying that the first mac pdu has been obtained for the configured grant; and in case that the configured grant is a prioritized uplink grant, delivering the obtained first mac pdu.
Inventor(s): Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd., Chen QIAN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L1/1812, H04L1/1867, H04W68/00, H04W72/0446, H04W72/0453, H04W72/1273, H04W72/50, H04W76/27
CPC Code(s): H04W72/23
Abstract: the present disclosure provides a method of transmitting and/or receiving a transport block. the method includes: receiving and/or transmitting a transport block according to information for scheduling multiple transport blocks. the present disclosure also provides a method for downlink transmission, a method of receiving an nrs on a non-anchor carrier, and corresponding ue, base station, and computer readable medium.
Inventor(s): Jinyoung OH of Seoul (KR) for samsung electronics co., ltd., Seunghoon CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Incheon (KR) for samsung electronics co., ltd., Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngbum KIM of Seoul (KR) for samsung electronics co., ltd., Taehyoung KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L5/00, H04W72/20
CPC Code(s): H04W72/23
Abstract: the present disclosure relates to a communication technique for joining an iot technology with a 5g communication system for supporting a higher data transfer rate than a 4g system, and a system thereof. the disclosure may be applied to intelligent services (for example, a smart home, a smart building, a smart city, a smart car or a connected car, a health care, a digital education, retailing, security and safe-related service, etc.) on the basis of a 5g communication technology and an iot related technology. the present disclosure relates to a wireless communication system, and to a method and an apparatus for smoothly providing a service in a communication system. more particularly, the present disclosure relates to a method and an apparatus for transmitting and receiving downlink and uplink control information within a communication system.
Inventor(s): Hamid SABER of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L1/00, H04L1/1867, H04W24/10, H04W72/1273
CPC Code(s): H04W72/23
Abstract: a method and a user equipment (ue) are provided for explicitly linking repeated physical downlink control channels (pdcchs). the ue receives the repeated pdcchs from a network. each of the repeated pdcchs include downlink control information (dci) that schedules reception of a same physical downlink shared channel (pdsch) at the ue. the ue links the repeated pdcchs having common pdcch candidate numbers across search space (ss) sets of a control resource set (coreset). the repeated pdcchs are received in accordance with the ue and the network communicating using a multi-transmission and reception point (trp) repetition scheme or a multi-trp multi-chance scheme.
Inventor(s): Yaser Mohamed Mostafa Kamal FOUAD of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Liang HU of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/40, H04W72/0446, H04W72/25
CPC Code(s): H04W72/40
Abstract: a system and a method are disclosed for processing, by a user equipment (ue), a first automatic gain control (agc) symbol at a first slot of a wireless transmission; receiving, by the ue, an indication of a number of agc symbols for processing in the wireless transmission; and determining, by the ue and based on the indication received, whether to process at least a second agc symbol of the wireless transmission. the indication may include information that at least the second agc symbol exists in a subsequent slot of the wireless transmission and the ue may further processing, based on the determination and indication, at least a second agc symbol. the ue may further send, to a separate transmitting (tx) ue, a request to send the wireless transmission comprising multiple agc symbols, wherein the indication is based on the request sent to the tx ue.
Inventor(s): Haiyi LIU of Beijing (CN) for samsung electronics co., ltd., Huiyang WANG of Beijing (CN) for samsung electronics co., ltd., Xiaohui LIANG of Beijing (CN) for samsung electronics co., ltd., Jing YUAN of Beijing (CN) for samsung electronics co., ltd., Yi ZHAO of Beijing (CN) for samsung electronics co., ltd., Xiangning LI of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/56, H04B17/345, H04W72/541
CPC Code(s): H04W72/56
Abstract: a method performed by a network node and a network node is provided. the method includes obtaining interference information for a current cell, the interference information for indicating interference levels at time units of a next period in each interference measurement area of a plurality of interference measurement areas of the current cell, obtaining scheduling priorities of user equipments (ues) at the time units of the next period according to the interference information and locations of the ues in the current cell, and performing a scheduling of the ues in the current cell according to the scheduling priorities.
Inventor(s): Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/14, H04W76/27, H04W88/04
CPC Code(s): H04W76/14
Abstract: provided is a method, performed by a relay user equipment (ue), of relaying communication between a remote ue and a base station, in a wireless communication system. the method includes: transmitting, to the base station, a message about sidelink ue information including first identifier information of the remote ue; receiving, from the base station, a radio resource control (rrc) reconfiguration message including configuration information for relaying data of the remote ue and second identifier information, based on the message about the sidelink ue information; and transmitting the data of the remote ue to the base station, based on the rrc reconfiguration message.
Inventor(s): Elijah KIM of Suwon-si (KR) for samsung electronics co., ltd., Chunseong KIM of Suwon-si (KR) for samsung electronics co., ltd., Byoungwoo KO of Suwon-si (KR) for samsung electronics co., ltd., Haedeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinho JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jaewan HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/64, G01G19/52, G01G21/22
CPC Code(s): H05B6/6464
Abstract: provided in various embodiments of the present disclosure are a device for measuring the load of food materials put on a tray in a cooking apparatus, and a control method therefor. to this end, the cooking apparatus has a stick-shaped guide rod extending in the vertical direction toward the bottom of a cavity from the lower side of an accommodation tray to which each of a plurality of rollers making roll-contact with the bottom surface of the tray can be independently mounted, has a first coupling part formed on a load-transferring member such that the lower end portion of the guide rod is fitted and fixed therein, and generates an electrical signal in a load cell due to the load transferred by the load-transferring member. other various embodiments are possible.
Inventor(s): Seonghun SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H01R12/79, H05K1/14, H05K1/18, H05K5/00
CPC Code(s): H05K1/0281
Abstract: an electronic device is provided. the electronic device includes a flexible printed circuit board comprising a housing, a first printed circuit board disposed in an inner space of the housing, a second printed circuit board disposed so as to be spaced apart from the first printed circuit board, a connection part electrically connecting the first printed circuit board and the second printed circuit board and connected to the second printed circuit board, and a coupling part including a bent part extending from the connection part and capable of being at least partially bent.
20240206068.PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yang LIU of Suzhou Industrial Park (CN) for samsung electronics co., ltd., Zhenrong YANG of Suzhou Industrial Park (CN) for samsung electronics co., ltd.
IPC Code(s): H05K1/14, H05K1/02, H05K1/03, H05K3/28
CPC Code(s): H05K1/142
Abstract: a printed circuit board, divided into a printed circuit board area and a peripheral area surrounding the printed circuit board area, includes: a plurality of unit printed circuit boards provided in the printed circuit board area; a base portion provided in the peripheral area and the printed circuit board area, and including a circuit pattern portion and an insulating material portion; a first solder resist portion provided in the peripheral area on a first surface of the base portion and a second surface of the base portion, the first surface being opposite to the second surface; and a second solder resist portion provided in the printed circuit board area on the first surface of the base portion and the second surface of the base portion. the first solder resist portion surrounds the second solder resist portion in the printed circuit board area. the first solder resist portion includes a first filler and the second solder resist portion includes a second filler that is different from the first filler.
20240206083.DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Suhwan JIN of Suwon-si (KR) for samsung electronics co., ltd., Jeongryeol Seo of Suwon-si (KR) for samsung electronics co., ltd., Jung Hur of Suwon-si (KR) for samsung electronics co., ltd., Chanhyuk Boo of Suwon-si (KR) for samsung electronics co., ltd., Sungook Ok of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00
CPC Code(s): H05K5/0026
Abstract: a display device includes a display module on which a second connector is provided; a chassis assembly configured to support the display module; a printed circuit board provided in the chassis assembly and configured to drive or control the display module; and a first connector electrically connected to the printed circuit board and arranged to match the second connector, the first connector being configured to transmit and receive electric signals to the display module, wherein the first connector may include a first power connector for power and a first switching signal connector for switching signal that have areas facing the second connector, each of the first switching signal connector and the first power connector has a length of an area in a direction in which the display module is coupled to the chassis assembly, the length of the area of the first switching signal connector is less than the length of the area of the first power connector, and in a state in which the display module is coupled to the chassis assembly, the first power connector contacts the second connector before the first switching signal connector contacts the second connector.
Inventor(s): Taewook HAM of Suwon-si (KR) for samsung electronics co., ltd., Moonhyung KWON of Suwon-si (KR) for samsung electronics co., ltd., Younggirl YUN of Suwon-si (KR) for samsung electronics co., ltd., Taekkyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Wonhyung HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20
CPC Code(s): H05K7/20336
Abstract: the present disclosure relates to an electronic device comprising a heat dissipation structure. the electronic device may comprise: a bracket comprising a first area, a second area partitioned from the first area, and a heat dissipation area extendedly formed from a portion of the first area up to a portion of the second area; a circuit board comprising a heating source and disposed in the first area; a battery disposed in the second area; a vapor chamber disposed in the heat dissipation area and, in order to provide a transfer path for heat generated from the heating source, comprises a first part disposed so as to face the heating source, and a second part disposed so as to face the battery; and a filling member coated between the second area and the battery in order to transfer the heat dissipated from the vapor chamber to the battery, wherein the vapor chamber has a buffer area formed at an edge area thereof in order to receive the filling member.
Inventor(s): Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Mijeong SONG of Suwon-si (KR) for samsung electronics co., ltd., Ahyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeongju LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20, A47L9/28
CPC Code(s): H05K7/20509
Abstract: a cleaner includes a battery which is detachable from a main body, a printed circuit board (pcb) provided in the main body, a first connector provided on the pcb and including a first terminal portion, a second connector provided in the battery and including a second terminal portion coupled to the first terminal portion when the battery is mounted onto a battery mounting portion, and a heat dissipation structure provided on the pcb and configured to dissipate heat from the first terminal portion. the heat dissipation structure including a heat dissipation pad provided on the pcb and a plurality of heat dissipation patterns arranged two-dimensionally on the heat dissipation pad.
Inventor(s): Minjun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongseok Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/20
Abstract: a semiconductor device includes a source line extending in a first horizontal direction on a substrate, a channel layer extending in a vertical direction perpendicular to an upper surface of the substrate, and including a first end, a second end opposite to the first end, and a channel layer sidewall connecting the first end with the second end, the first end being disposed on the source line, a trap layer disposed on the channel layer sidewall, a gate insulating layer disposed on an outer surface of the trap layer, a word line disposed on at least one sidewall of the gate insulating layer and extending in a second horizontal direction crossing the first horizontal direction, a drain area disposed on the second end of the channel layer and including a metal or metal nitride, and a bit line disposed on the drain area and extending in the first horizontal direction.
Inventor(s): Hyejin Seong of Suwon-si (KR) for samsung electronics co., ltd., Dongsoo Woo of Seoul (KR) for samsung electronics co., ltd., Wonchul Lee of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/34
Abstract: a semiconductor memory device includes a substrate having a memory cell region where a plurality of active regions are defined; a word line having a stack structure of a lower word line layer and an upper word line layer and extending over the plurality of active regions in a first horizontal direction, and a buried insulation layer on the word line; a bit line structure arranged on the plurality of active regions, extending in a second horizontal direction perpendicular to the first horizontal direction, and having a bit line; and a word line contact plug electrically connected to the lower word line layer by penetrating the buried insulation layer and the upper word line layer and having a plug extension in an upper portion of the word line contact plug, the plug extension having a greater horizontal width than a lower portion of the word line contact plug.
Inventor(s): Hyunjung Lee of Suwon-si (KR) for samsung electronics co., ltd., Dongsik Kong of Suwon-si (KR) for samsung electronics co., ltd., Junsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Junbum Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinseong Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/488
Abstract: integrated circuit devices may include a substrate including a word line trench extending longitudinally in a first horizontal direction, a gate dielectric film extending along an inner surface of the word line trench, a word line in a lower portion of the word line trench on the gate dielectric film and extending longitudinally in the first horizontal direction, and an insulating capping pattern in an upper portion of the word line trench on the word line and extending longitudinally in the first horizontal direction. the word line may include a work-function control conductive plug including a conductive metal nitride that include a metal dopant, and the work-function control conductive plug includes a top surface in contact with a bottom surface of the insulating capping pattern, a sidewall in contact with the gate dielectric film, and a bottom surface in contact with a monolithic layer.
Inventor(s): Seulye KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunhwa LIM of Suwon-si (KR) for samsung electronics co., ltd., Moohyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunggil KIM of Suwon-si (KR) for samsung electronics co., ltd., Yunji PARK of Suwon-si (KR) for samsung electronics co., ltd., Younghwan JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/35, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device may include a gate stack including insulating and conductive patterns, which are alternately stacked on top of each other, a memory channel structure penetrating the gate stack, a selection line structure on the gate stack, and a selection channel structure penetrating the selection line structure. the selection channel structure may include a selection channel layer, which is electrically connected to the memory channel layer, and a selection insulating structure, which encloses the selection channel layer. the selection channel layer may include a connecting portion on the memory channel structure and a pillar portion on the connecting portion, and an average size of grains in the connecting portion may be less than an average size of grains in the pillar portion.
20240206177.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wukang Kim of Suwon-si (KR) for samsung electronics co., ltd., Sejun Park of Yongin-si (KR) for samsung electronics co., ltd., Hyoje Bang of Anyang-si (KR) for samsung electronics co., ltd., Jaeduk Lee of Seongnam-si (KR) for samsung electronics co., ltd., Junghoon Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/522, H01L23/535, H10B43/35
CPC Code(s): H10B43/27
Abstract: a semiconductor device including a stack structure including gate layers and interlayer insulating layers spaced apart in a vertical direction, a channel hole penetrating the stack structure in the vertical direction, a core region extending within the channel hole, a channel layer disposed on a side surface of the core region, a first dielectric layer, a data storage layer and a second dielectric layer, which are disposed between the channel layer and the gate layers, and a pad pattern disposed on the core region, in the channel hole, and in contact with the channel layer. a first horizontal distance between a side surface of a first portion of an uppermost gate layer and an outer side surface of the channel layer is greater than a second horizontal distance between a side surface of a second portion of the uppermost gate layer and an outer side surface of the pad pattern.
Inventor(s): Dongsung Choi of Suwon-si (KR) for samsung electronics co., ltd., Byongju Kim of Suwon-si (KR) for samsung electronics co., ltd., Youjung Kim of Suwon-si (KR) for samsung electronics co., ltd., Chaeho Kim of Suwon-si (KR) for samsung electronics co., ltd., Changheon Cheon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/792
CPC Code(s): H10B43/35
Abstract: a vertical non-volatile memory device may include a mold structure including first and second insulation patterns and a first gate electrode, a semiconductor pattern extending through the mold structure in a first direction, a first charge insulation layer between the first insulation pattern and the semiconductor pattern, a second charge insulation layer spaced apart from the first charge insulation layer and between the second insulation pattern and the semiconductor pattern, a charge storage layer between the first and second charge insulation layers and between the first gate electrode and the semiconductor pattern, and a first blocking insulation layer between the first gate electrode and the charge storage layer, and a first length in the first direction of the first gate electrode is shorter than a second length in the first direction of a first surface of the charge storage layer which is in contact with the first blocking insulation layer.
20240206182.NON-VOLATILE MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changmin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Ryoongbin LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Junhee LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B41/10, H10B41/40, H10B43/10
CPC Code(s): H10B43/40
Abstract: a non-volatile memory device including a memory cell array including a plurality of word lines stacked on a substrate in a first direction perpendicular to an upper surface of the substrate, and a common source line below the plurality of word lines, a plurality, of driving signal lines connected to a row decoder, and a plurality of pass transistor arrays each including a plurality of vertical pass transistors respectively connected the plurality of driving signal lines and the plurality of word lines, wherein each of the plurality of pass transistor arrays further include an active region including a drain to which at least two of the plurality of vertical pass transistors are simultaneously bonded, and a main contact applying a signal to the active region.
Inventor(s): Sanghun JEON of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/00, G11C11/22, H01L29/51, H01L29/78, H10B53/20
CPC Code(s): H10B53/00
Abstract: the present invention relates to ferroelectric capacitors, transistors, memory device, and method of manufacturing ferroelectric devices. the ferroelectric capacitor includes a first electrode, a second electrode facing the first electrode, a ferroelectric layer between the first electrode and the second electrode, and an interfacial layer between the ferroelectric layer and the first electrode or between the ferroelectric layer and the second electrode. the ferroelectric layer includes hafnium-based oxide. the interfacial layer includes hfo.
20240206297.ELECTRONIC DEVICE COMPRISING DISPLAY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongseop LEE of Suwon-si (KR) for samsung electronics co., ltd., Junghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung SHIN of Suwon-si (KR) for samsung electronics co., ltd., Byungduk YANG of Suwon-si (KR) for samsung electronics co., ltd., Minsuk UHM of Suwon-si (KR) for samsung electronics co., ltd., Yilin WU of Suwon-si (KR) for samsung electronics co., ltd., Haechang LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K59/80, G06F3/044, H10K59/122, H10K59/35, H10K59/38, H10K59/40
CPC Code(s): H10K59/8792
Abstract: an electronic device is provided. the electronic device includes a board, a plurality of pixels including a first pixel disposed on the board, and including a first organic light emitting layer including a first sub-organic light emitting layer and a second sub-organic light emitting layer, and a second pixel including a second organic light emitting layer, a pixel definition layer located between the first sub-organic light emitting layer and the second sub-organic light emitting layer, a first light shielding member located on the pixel definition layer to overlap the pixel definition layer between the first and second sub-organic light emitting layer in a first direction, and an opaque member overlapping the first light shielding member in the first direction, and located between at least a portion of the pixel definition layer located between the first sub-organic light emitting layer and the second sub-organic light emitting layer, and the first light shielding member.
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
CPC Code(s): H10K85/342
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
CPC Code(s): H10K85/342
Abstract:
m(l)(l) formula 1
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
CPC Code(s): H10K85/342
Abstract: wherein, mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
CPC Code(s): H10K85/342
Abstract:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06
CPC Code(s): H10K85/342
Abstract: wherein xis c or n, xis c or n, xis c or n, xis c or n, yis o, s, se, c(r)(r), n(r), or si(r)(r), two or more of rto rare linked to each other to form a substituted or unsubstituted c-ccarbocyclic group or a substituted or unsubstituted c-cheterocyclic group, and the remaining substituent groups of formulae 1a and 1b are as described herein.
Inventor(s): Jongwon CHOI of Yongin-si (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Kum Hee LEE of Suwon-si (KR) for samsung electronics co., ltd., Banglin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho CHOI of Seoul (KR) for samsung electronics co., ltd., Seungyeon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Seoul (KR) for samsung electronics co., ltd., Sangdong KIM of Seongnam-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Seoul (KR) for samsung electronics co., ltd., Chul BAIK of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk CHO of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K101/10, H10K102/00
CPC Code(s): H10K85/346
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Jongwon CHOI of Yongin-si (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Kum Hee LEE of Suwon-si (KR) for samsung electronics co., ltd., Banglin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho CHOI of Seoul (KR) for samsung electronics co., ltd., Seungyeon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Seoul (KR) for samsung electronics co., ltd., Sangdong KIM of Seongnam-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Seoul (KR) for samsung electronics co., ltd., Chul BAIK of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk CHO of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K101/10, H10K102/00
CPC Code(s): H10K85/346
Abstract:
SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- A61B5/0531
- A61B5/00
- A61B5/11
- CPC A61B5/0531
- Samsung electronics co., ltd.
- CPC A61B5/6802
- A62B18/00
- A61B5/08
- A61M16/06
- A62B7/10
- A62B18/02
- CPC A62B18/006
- A63B21/00
- A63B24/00
- A63B71/06
- H02J7/00
- CPC A63B21/4025
- B01L7/00
- B01L3/00
- B81B1/00
- B81C1/00
- CPC B01L7/52
- B25J9/16
- B25J13/00
- CPC B25J9/163
- CPC B25J9/1664
- B29C65/00
- B29C63/00
- B29C63/22
- B29L31/34
- CPC B29C66/8362
- B44F5/00
- B44C1/22
- B44C1/24
- CPC B44F5/00
- C07C323/09
- G03F7/004
- G03F7/20
- CPC C07C323/09
- C07F15/00
- H10K50/11
- H10K50/15
- H10K50/16
- H10K85/30
- CPC C07F15/0033
- C23C16/455
- H01J37/32
- CPC C23C16/45565
- D06F34/30
- D06F29/00
- D06F31/00
- D06F34/04
- D06F34/05
- D06F34/08
- D06F34/28
- D06F58/36
- D06F58/46
- D06F101/12
- D06F101/20
- D06F105/10
- D06F105/56
- D06F105/58
- D06F105/62
- G05B19/042
- CPC D06F34/30
- D06F58/44
- D06F34/18
- D06F34/26
- D06F58/20
- D06F58/38
- CPC D06F58/44
- F24F11/36
- F24F1/16
- CPC F24F11/36
- F25D17/06
- CPC F25D17/062
- F25D23/02
- F25D27/00
- G02F1/1335
- G02F1/1339
- G02F1/1345
- G02F1/167
- G02F1/1677
- G02F1/1685
- G09G3/34
- CPC F25D23/028
- F25D23/06
- F25D21/14
- CPC F25D23/065
- G01N21/85
- G01N21/3577
- CPC G01N21/85
- G01N21/95
- G01N21/01
- G01N35/00
- CPC G01N21/9501
- G01N27/72
- CPC G01N27/72
- G01R31/317
- G01R29/26
- H01L21/66
- H01L21/67
- CPC G01R31/31709
- G01R31/3177
- H04L9/32
- CPC G01R31/3177
- G01R31/392
- G01R31/367
- CPC G01R31/392
- G01S7/481
- CPC G01S7/4814
- G01S13/76
- G01S13/02
- CPC G01S13/765
- G01S17/894
- G01S7/4865
- G01S17/04
- CPC G01S17/894
- G01S17/931
- H01S5/024
- H01S5/10
- H01S5/50
- CPC G01S17/931
- F21V8/00
- G02B27/01
- G02B27/42
- CPC G02B6/0016
- G02F1/29
- CPC G02F1/29
- G03F1/36
- G03F1/70
- G03F7/00
- CPC G03F1/36
- C07C65/10
- C07C309/12
- C07C311/09
- C07C391/02
- C07C395/00
- G03F7/038
- G03F7/039
- CPC G03F7/0045
- G05B13/02
- G05B13/04
- CPC G05B13/0265
- G05B15/02
- G06F1/16
- G06F3/01
- CPC G05B15/02
- G05B19/418
- G06T7/00
- CPC G05B19/41875
- CPC G06F1/1656
- CPC G06F1/169
- G06F1/26
- CPC G06F1/266
- G06F1/3225
- CPC G06F1/3225
- G06F1/3234
- G06F13/16
- G06F13/42
- G11C5/14
- G11C16/30
- G11C16/32
- CPC G06F1/3275
- G06F3/041
- G06F3/044
- G09G3/20
- G09G3/3233
- CPC G06F3/0412
- G06F3/06
- CPC G06F3/0613
- G06F12/123
- CPC G06F3/0619
- CPC G06F3/0659
- CPC G06F3/0664
- G06F3/14
- G06F3/0484
- G06F3/16
- H04W4/80
- CPC G06F3/1454
- G06F1/3231
- H04N21/422
- H04N21/442
- CPC G06F3/167
- G06F11/10
- CPC G06F11/10
- G06F11/07
- CPC G06F11/106
- G06F11/14
- CPC G06F11/1469
- G06F13/40
- CPC G06F13/4068
- G06F21/62
- G06F21/60
- CPC G06F21/6245
- G06F30/333
- G06F21/72
- G06F30/327
- CPC G06F30/333
- G06F30/398
- G06F30/392
- CPC G06F30/398
- G06N3/082
- G06N3/0464
- CPC G06N3/082
- G06N3/04
- G06N20/00
- CPC G06N20/00
- G06Q20/32
- G06Q20/38
- CPC G06Q20/3278
- G06T3/40
- G06T5/20
- G06T7/13
- G06T7/90
- G06V10/56
- CPC G06T3/4015
- G06T5/30
- G06T5/50
- CPC G06T5/30
- G06T5/00
- G06T7/11
- G06T7/62
- CPC G06T5/50
- G06T3/00
- CPC G06T7/001
- G06T7/254
- CPC G06T7/254
- G06T7/70
- CPC G06T7/70
- G06T13/20
- H04N13/243
- H04N23/63
- CPC G06T13/20
- G06T13/40
- G10L17/02
- G10L17/04
- G10L17/18
- CPC G06T13/205
- G06T19/00
- G01C21/20
- CPC G06T19/006
- G06V10/82
- G06V10/77
- G06V20/40
- CPC G06V10/82
- G06V20/70
- G06F40/284
- G06V10/774
- CPC G06V20/70
- G06V40/60
- G06T7/60
- G06V40/10
- G06V40/16
- H04N23/71
- H04N23/74
- CPC G06V40/60
- G09G3/00
- CPC G09G3/035
- G10L15/30
- G10L15/08
- G10L15/22
- CPC G10L15/30
- G10L21/0208
- H04R1/08
- CPC G10L21/0208
- G11C7/10
- H03K19/017
- CPC G11C7/1066
- G11C11/406
- G11C11/408
- H01L25/065
- H03M13/00
- H03M13/11
- CPC G11C11/40615
- G11C11/4074
- G11C11/4076
- G11C11/4096
- CPC G11C11/4074
- G11C16/08
- G11C16/04
- G11C16/24
- CPC G11C16/08
- G11C16/26
- G11C16/10
- CPC G11C16/26
- G16H40/63
- G16H50/30
- CPC G16H40/63
- H01J37/20
- CPC H01J37/20
- H01J37/244
- H01J37/147
- H01J37/28
- CPC H01J37/244
- CPC H01J37/3244
- CPC H01J37/32522
- CPC H01J37/32972
- H01L21/768
- H01L21/285
- CPC H01L21/76849
- H01L21/74
- CPC H01L21/76897
- G03F1/42
- G03F9/00
- H01L21/027
- CPC H01L22/12
- H01L23/31
- H01L23/00
- H01L23/48
- CPC H01L23/3171
- H01L23/427
- CPC H01L23/427
- H01L23/473
- H10N30/20
- CPC H01L23/473
- H01L23/528
- H01L25/18
- H10B80/00
- CPC H01L23/481
- H01L23/498
- H01L23/34
- CPC H01L23/49811
- CPC H01L23/49827
- H01L21/56
- H01L23/522
- H01L27/06
- CPC H01L23/5228
- H10B41/10
- H10B41/27
- H10B41/35
- H10B43/10
- H10B43/27
- H10B43/35
- CPC H01L23/5283
- H01L29/06
- H01L29/40
- H01L29/417
- H01L29/423
- H01L29/66
- H01L29/775
- CPC H01L23/5286
- H01L23/532
- CPC H01L23/53238
- H01L23/538
- H01L21/48
- H01L25/10
- CPC H01L23/5383
- H01L23/552
- H01L21/78
- CPC H01L23/552
- H01L23/60
- H01L25/16
- CPC H01L23/60
- H01L25/00
- CPC H01L25/0652
- H01L23/16
- CPC H01L25/0655
- CPC H01L25/0657
- H01L23/29
- CPC H01L25/105
- CPC H01L25/16
- CPC H01L25/162
- CPC H01L25/18
- H01L27/02
- H01L29/786
- CPC H01L27/0207
- G06F30/00
- G11C5/06
- G11C8/16
- G11C11/412
- H01L27/088
- H01L27/118
- CPC H01L27/0255
- H01L21/8234
- H02H9/04
- CPC H01L27/0292
- H01L21/762
- CPC H01L27/0886
- H01L27/092
- H01L29/04
- H01L29/08
- H01L29/161
- CPC H01L27/092
- H01L27/12
- CPC H01L27/1244
- H01L27/146
- CPC H01L27/14603
- CPC H01L27/14614
- G02B3/00
- CPC H01L27/14627
- CPC H01L27/1463
- CPC H01L27/14634
- CPC H01L27/1464
- H01L27/15
- G02F1/13357
- CPC H01L27/15
- CPC H01L29/0673
- H01L29/16
- H01L29/165
- H01L29/78
- CPC H01L29/0847
- H01L29/10
- H01L21/8238
- CPC H01L29/1033
- H01L29/49
- CPC H01L29/41775
- CPC H01L29/41791
- H01L29/778
- H01L29/20
- CPC H01L29/7786
- CPC H01L29/7869
- H01L33/48
- H01L25/075
- H01L33/62
- CPC H01L33/486
- H01Q21/06
- H01Q15/00
- CPC H01Q21/065
- H02J50/60
- H02J50/12
- H02J50/40
- H05B6/44
- CPC H02J50/60
- H03F3/24
- H03F1/32
- H04B1/04
- CPC H03F3/245
- H03K3/3562
- CPC H03K3/35625
- H04B1/401
- H04L5/00
- CPC H04B1/401
- H04B7/06
- CPC H04B7/0626
- CPC H04B7/0639
- H04B7/08
- H04W64/00
- CPC H04B7/086
- H04L1/00
- CPC H04L1/0061
- H04L1/1829
- H04L1/1812
- H04L1/1867
- CPC H04L1/1854
- H04L27/26
- H04W28/06
- H04W72/12
- H04W72/20
- CPC H04L5/0053
- H04W72/0453
- H04W72/23
- H04W76/28
- CPC H04L5/0092
- H04L5/14
- CPC H04L5/1461
- H04W72/0446
- H04W72/1263
- CPC H04L27/2605
- H04L41/5009
- H04L41/16
- H04W28/08
- CPC H04L41/5009
- H04L43/026
- H04W16/18
- H04W24/02
- H04W24/08
- CPC H04L43/026
- H04L49/15
- CPC H04L49/15
- H04L51/00
- G06F21/84
- H04M1/673
- H04M1/72436
- CPC H04L51/00
- H04L67/141
- CPC H04L67/141
- H04M1/02
- CPC H04M1/0216
- H04M1/18
- H05K5/03
- CPC H04M1/18
- CPC H04M1/185
- H04N21/488
- G06V10/25
- H04N21/4728
- CPC H04N21/4884
- H04N23/57
- H05K1/18
- CPC H04N23/57
- H04N23/61
- G06T7/80
- H04N23/60
- CPC H04N23/61
- H04N23/955
- G02B1/00
- G02B5/20
- H04N23/11
- CPC H04N23/955
- H04N25/51
- H04N25/42
- H04N25/59
- H04N25/616
- H04N25/771
- H04N25/778
- H04N25/78
- CPC H04N25/51
- H04N25/766
- CPC H04N25/766
- H04N25/772
- CPC H04N25/772
- H04W12/72
- H04W8/06
- H04W12/61
- H04W48/18
- H04W60/06
- H04W84/04
- CPC H04W12/72
- H04L69/04
- H04W76/20
- CPC H04W28/06
- H04W36/00
- H04W28/02
- H04W76/27
- H04W80/02
- CPC H04W36/0022
- H04W36/08
- H04W36/36
- CPC H04W36/0079
- CPC H04W36/08
- H04W48/16
- H04W52/36
- CPC H04W48/16
- H04M1/72472
- H04W8/18
- H04W76/10
- H04W76/30
- CPC H04W48/18
- H04W52/02
- CPC H04W52/0229
- H04W56/00
- CPC H04W56/001
- H04W60/00
- CPC H04W60/005
- H04W60/04
- CPC H04W60/04
- H04W24/10
- CPC H04W64/00
- H04W36/24
- H04W36/32
- CPC H04W64/006
- H04W72/044
- H04B7/0408
- H04W72/51
- H04W72/542
- CPC H04W72/044
- H04W4/40
- CPC H04W72/20
- H04W72/566
- CPC H04W72/23
- H04W68/00
- H04W72/1273
- H04W72/50
- H04W72/40
- H04W72/25
- CPC H04W72/40
- H04W72/56
- H04B17/345
- H04W72/541
- CPC H04W72/56
- H04W76/14
- H04W88/04
- CPC H04W76/14
- H05B6/64
- G01G19/52
- G01G21/22
- CPC H05B6/6464
- H05K1/02
- H01R12/79
- H05K1/14
- H05K5/00
- CPC H05K1/0281
- H05K1/03
- H05K3/28
- CPC H05K1/142
- CPC H05K5/0026
- H05K7/20
- CPC H05K7/20336
- A47L9/28
- CPC H05K7/20509
- H10B12/00
- CPC H10B12/20
- CPC H10B12/34
- CPC H10B12/488
- CPC H10B43/27
- H01L23/535
- H01L29/792
- CPC H10B43/35
- H10B43/40
- H10B41/40
- CPC H10B43/40
- H10B53/00
- G11C11/22
- H01L29/51
- H10B53/20
- CPC H10B53/00
- H10K59/80
- H10K59/122
- H10K59/35
- H10K59/38
- H10K59/40
- CPC H10K59/8792
- C09K11/06
- CPC H10K85/342
- H10K50/17
- H10K50/18
- H10K101/10
- H10K102/00
- CPC H10K85/346
