SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on June 13th, 2024
SAMSUNG ELECTRONICS CO., LTD.: 184 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H01L23/00 (14), H01L25/065 (14), H10B12/00 (10), H10B80/00 (9), H01L23/31 (8) H01L25/0652 (5), H04W24/08 (3), H01L23/5283 (2), H10B51/20 (2), H10B43/27 (2)
With keywords such as: device, layer, semiconductor, including, based, surface, configured, information, structure, and substrate in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Ui Kun KWON of Suwon-si (KR) for samsung electronics co., ltd., Young Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Chang Soon Park of Suwon-si (KR) for samsung electronics co., ltd., Hye Rim Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/0205, A61B5/029, A61B5/11
CPC Code(s): A61B5/0205
Abstract: provided is an apparatus for estimating blood pressure, including a pulse wave sensor configured to measure a pulse wave signal of a user, and a processor configured to obtain, based on the pulse wave signal, one or more feature values corresponding to the blood pressure, detect whether a change in a posture of a user from a first posture to a second posture occurs while measuring the pulse wave signal, based on the change in the posture being detected, correct a reference blood pressure based on a blood pressure variation caused by the change in the posture, correct the one or more feature values based on a variation in one or more pulse wave signal feature values caused by the change in the posture, and estimate the blood pressure based on the corrected reference blood pressure and the corrected one or more feature values.
Inventor(s): Jae Min KANG of Suwon-si (KR) for samsung electronics co., ltd., Byung Hoon Ko of Suwon-si (KR) for samsung electronics co., ltd., Seung Woo Noh of Suwon-si (KR) for samsung electronics co., ltd., Sang Yun Park of Suwon-si (KR) for samsung electronics co., ltd., Jin Woo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/117, A61B5/0205
CPC Code(s): A61B5/117
Abstract: an apparatus for performing user recognition may include: a first sensor configured to measure health information from a user; a second sensor configured to measure a pulse wave signal from the user; and a processor configured to obtain oxygen saturation based on the pulse wave signal, to recognize the user based on an oxygen saturation pattern of the obtained oxygen saturation, and to update the measured health information as health information of the recognized user.
Inventor(s): Juneyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/145, A61B5/00, A61B5/1455, A61B5/1495
CPC Code(s): A61B5/14546
Abstract: an electronic device determines accuracy of an analyte concentration non-invasively by calculating an analyte concentration of an analyte from an in-vivo spectrum obtained non-invasively using a calibration model, generates a test calibration model based on feature vectors of the in-vivo spectrum obtained non-invasively from which a spectrum specific to the analyte have been subtracted, calculates a test concentration for the analyte from the in-vivo spectrum using the test calibration model, and analyzes the test concentration for the analyte using the test calibration model to determine the accuracy of the analyte concentration using the calibration model.
Inventor(s): Jaechun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kitae PARK of Suwon-si (KR) for samsung electronics co., ltd., Chisung BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B01L3/00
CPC Code(s): B01L3/502715
Abstract: an apparatus includes a housing including a hollow inside; a cover configured to cover the housing and support a portion of a biological cell on the cover; an opening formed through the cover and configured to expose at least a portion of the cell to the hollow inside of the housing; an electrode base disposed on a bottom of the housing; and one or more electrode rods arranged between the electrode base and the cover, and configured to support the cover, wherein the electrode base and/or the one or more electrode rods are arranged for sensing an electrical signal from at least another portion of the cell.
20240189830.FOOD WASTE DISPOSER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongjun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Keonpyo KOO of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiho SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B02C18/00, B02C18/14, B02C18/24
CPC Code(s): B02C18/0092
Abstract: a food waste disposer includes a housing, a grinding device detachably mounted inside the housing to grind food waste, and a storage device disposed below the grinding device to store the ground food waste, the grinding device includes a grinding case in which the food waste is ground, and having a discharge portion and openable to transfer the food waste to the storage device, a valve assembly configured to open or close the discharge portion and to be separable to the outside of the housing together with the grinding case, a first grinder rotatably mounted inside the grinding case, and having a grinding blade, a second grinder including a grinding blade to mutually grind the food waste with the grinding blade of the first grinder and a transfer blade below the first grinder and the second grinder to transfer the ground food waste to the discharge portion.
Inventor(s): Yearin BYUN of Suwon-si (KR) for samsung electronics co., ltd., Inkwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangkyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/24, B24B37/22
CPC Code(s): B24B37/24
Abstract: a membrane coating compound for a chemical mechanical polishing process, a membrane structure for a chemical mechanical polishing process, and a polishing apparatus for a chemical mechanical polishing process in which a wafer is holdable under pressure on the polishing apparatus, the membrane coating compound includes a functional group capable of hydrogen bonding.
Inventor(s): Gyeongdam Baek of Suwon-si (KR) for samsung electronics co., ltd., Hyeonuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Byungkook Yoo of Suwon-si (KR) for samsung electronics co., ltd., Seungjun Lee of Suwon-si (KR) for samsung electronics co., ltd., Mingu Chang of Suwon-si (KR) for samsung electronics co., ltd., Younboo Jung of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk Cha of Suwon-si (KR) for samsung electronics co., ltd., Jimin Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunoh Kim of Cheonan-si (KR) for samsung electronics co., ltd., Kyeongjun Min of Cheonan-si (KR) for samsung electronics co., ltd., Donghoon Yang of Cheonan-si (KR) for samsung electronics co., ltd., Jiwon Yoon of Cheonan-si (KR) for samsung electronics co., ltd., Seungjun Lee of Cheonan-si (KR) for samsung electronics co., ltd., Insung Choi of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J9/00
CPC Code(s): B25J9/162
Abstract: an autonomous driving robot includes a storage unit including a housing, which provides a space for storing an article, and a shelf which is provided inside the housing and on which the article is loaded, a manipulator including a linear actuator, and a selective compliance articulated robot arm, which is coupled to the linear actuator, and a transport unit coupled to the storage unit, wherein a plurality of shelves are provided, some of the shelves are provided adjacent to one inner wall of the housing and spaced apart from each other in the vertical direction, and the other shelves are provided adjacent to another inner wall which faces the one inner wall and spaced apart from each other in the vertical direction, and the plurality of shelves extend toward a central portion of the housing, but extend to a point before reaching the central portion of the housing.
Inventor(s): Hyungho Choi of Suwon-si (KR) for samsung electronics co., ltd., Kwangjun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinho So of Suwon-si (KR) for samsung electronics co., ltd., Huigwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunkook Jeon of Suwon-si (KR) for samsung electronics co., ltd., Soonwook Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J9/08
CPC Code(s): B25J9/1679
Abstract: a gas supply stage includes a gas supply cabinet and a fastening vehicle. the gas supply cabinet includes a cabinet frame including an inner space configured to house a gas container and a holding module including a connector holder configured to be detachably fastened to a valve nozzle. the fastening vehicle includes a traveling unit configured to travel in a facility space in which the gas supply cabinet is installed, a multi-axis robot attached to the traveling unit, and a module gripper mounted to the multi-axis robot and configured to detachably grip a valve manipulation module and the holding module.
Inventor(s): Jihwan CHUN of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinju KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B41M5/00, C25D11/24
CPC Code(s): B41M5/0011
Abstract: a manufacturing method of an aluminum exterior panel including: preparing an aluminum material; anodizing to form pores on a surface of the aluminum material; performing atmospheric-pressure plasma treating, at room-temperature, to improve hydrophilicity of the surface of the aluminum material on which the pores are formed; digital printing of implementing a color and an image on the surface of the aluminum material with improved hydrophilicity; and sealing to close the pores.
Inventor(s): Gyucheol Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C02F5/08, C02F1/00
CPC Code(s): C02F5/08
Abstract: a pipe cleaning system includes a copper waste water supply line for supplying copper waste water, an alkali waste water supply line for supplying alkali waste water, and a connecting line connecting the copper waste water supply line and the alkali waste water supply line, wherein the copper waste water supply line includes a first pipe which is connected to a storage for storing the copper waste water and includes a first valve, and a second pipe connected to the first pipe. the alkali waste water supply line includes a third pipe that is connected to a storage for storing the alkali waste water and includes a third valve, and a fourth pipe connected to the third pipe, and the connecting line includes a connecting pipe connecting the second pipe and the third pipe to each other, and a connecting valve formed on the connecting pipe.
Inventor(s): Hyeyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Inji LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C30B15/04, C30B15/20, C30B29/06, C30B33/00
CPC Code(s): C30B15/04
Abstract: a method of manufacturing a silicon single crystal includes preparing a silicon melt and growing the silicon single crystal based on co-doping boron and phosphorus into the silicon melt. the growing of the silicon single crystal includes controlling, a doping concentration ratio, which is a ratio of an initial concentration of phosphorus to an initial concentration of boron, to be a particular ratio and controlling the initial concentration of boron to be within a range of about 8.0e12 atom/cmto about 1.5e13 atom/cm.
Inventor(s): Unyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Myungbae BANG of Suwon-si (KR) for samsung electronics co., ltd., Myunggui CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jonggu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhyung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/30, H02K1/18, H02K5/22, H02K7/08
CPC Code(s): D06F37/304
Abstract: an apparatus including a motor including a stator including a core, a rotor inside the stator, and rotatable by interacting with the stator, and a rotation shaft mounted on the rotor so as to be rotatable together with the rotor, and a bracket including a main body unit including a space in which the stator is mounted, a front mount at a front of the main body unit, and including a front fastening hole, and a rear mount at a rear of the main body unit, and including a rear fastening hole.
Inventor(s): Juyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Daesung KI of Suwon-si (KR) for samsung electronics co., ltd., Hyunuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongpil SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/22, D06F58/04, F26B13/10, F26B13/14
CPC Code(s): D06F58/22
Abstract: a clothes dryer including a cabinet, a drum rotatably supported in the cabinet, a supply port configured to guide air into the drum, an exhaust port configured to guide the air in the drum to an outside of the drum, and a lint removing apparatus configured to remove lint from the air passing through the exhaust port. where the lint removing apparatus includes a lint filter configured to capture lint, a rotation member rotatably installed to scrape and collect the lint captured in the lint filer, a driving device configured to generate power, a first coupler connected to the driving device to receive the power from the driving device, and a second coupler coupled to the first coupler to transmit the power to the rotation member.
Inventor(s): Mingu JEON of Suwon-si (KR) for samsung electronics co., ltd., Donghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunho KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungyul SO of Suwon-si (KR) for samsung electronics co., ltd., Joonho YOON of Suwon-si (KR) for samsung electronics co., ltd., Buyoun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/0047
CPC Code(s): F24F1/0047
Abstract: an air conditioner that is installable in a ceiling, the air conditioner including a housing having an intake port; a piping connection including a pipe connected from an inside of the housing to an outside of the housing; a blower fan inside the housing; and a control box configured to control driving of the blower fan, wherein the control box is connected to the housing so as to be movable, when the air conditioner is installed in the ceiling, between a first position in which the control box overlaps the piping connection vertically, and a second position in which the control box overlaps less of the piping connection than when the control box is in the first position.
Inventor(s): Jongsoo HONG of Suwon-si (KR) for samsung electronics co., ltd., Doyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokho JU of Suwon-si (KR) for samsung electronics co., ltd., Byoungwoo KO of Suwon-si (KR) for samsung electronics co., ltd., Jaewan HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F11/63
CPC Code(s): F24F11/63
Abstract: an air conditioner includes: a filter assembly including a first filter and a second filter sequentially disposed in an air flow path; a differential pressure sensor configured to detect a differential pressure value corresponding to a pressure difference between a front surface and a rear surface of the second filter; a memory; and a processor configured to store, in the memory, differential pressure values detected by the differential pressure sensor, wherein the processor may be further configured to: identify a degree of contamination of the second filter based on a magnitude of the differential pressure values, determine a rate of change of the differential pressure values stored in the memory over time, and identify a degree of contamination of the first filter based on the rate of change.
20240191906.AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mingu JEON of Suwon-si (KR) for samsung electronics co., ltd., Hyunho KIM of Suwon-si (KR) for samsung electronics co., ltd., Wooyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Yongho SEO of Suwon-si (KR) for samsung electronics co., ltd., Joonho YOON of Suwon-si (KR) for samsung electronics co., ltd., Changwoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sunghyun CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F13/14, F24F1/0011
CPC Code(s): F24F13/1486
Abstract: an air conditioner including a main body including a first side, a second side opposite to the first side, an outlet between the first and second side, and a guide protrusion on the outlet; and a blade to open and close the outlet, the blade including a blade body extending from the first side to the second side of the main body when the outlet is closed by the blade, and a guide rail on a top surface of the blade body facing the outlet. the blade is configured so that the blade body is rotatable relative to the outlet to adjust a direction of air from the outlet, and the guide rail is supported by the guide protrusion to be slidable to guide at least one of a translational or a rotational movement of the blade body with respect to the main body during rotation of the blade body.
20240191929.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taeyun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Donghwa KIM of Suwon-si (KR) for samsung electronics co., ltd., Kangil SONG of Suwon-si (KR) for samsung electronics co., ltd., Donghak HEO of Suwon-si (KR) for samsung electronics co., ltd., Hyesung HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D11/02, F25D17/06, F25D23/06
CPC Code(s): F25D11/02
Abstract: disclosed is a refrigerator that does not include a separate partition member disposed between an upper inner case and a lower inner case to reduce storage costs, logistics costs, and production costs, and to increase productivity. the refrigerator includes n first and second inner cases forming a first and second storage compartments and including a plurality of first and second plates each formed by injection molding; an outer case coupled to an outer side of the first and second inner cases to form an exterior of the refrigerator; an insulation provided between the first and second inner cases and the outer case and between the first inner case and the second inner case; and a cold air guide surrounded by the insulation between the first and second inner cases, and configured to form a cold air flow path communicating the first and second storage compartments.
Inventor(s): Kyunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Jihwan CHUN of Suwon-si (KR) for samsung electronics co., ltd., Heecheol KANG of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinju KIM of Suwon-si (KR) for samsung electronics co., ltd., Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/00, B23K26/359, B41M5/00, C23F1/36, C25D11/04
CPC Code(s): F25D23/00
Abstract: a manufacturing method of an aluminum exterior panel including preparing an aluminum material; machining to shape an edge of the aluminum material; implementing a fine multilayered pattern on a surface of the processed aluminum material; forming of forming fine corrugations on the surface of the aluminum material on which the fine multilayered pattern is implemented; anodizing to form pores on the surface of the aluminum material on which the fine corrugations are formed; digital printing of implementing a color and an image on the aluminum material on which the pores are formed; and sealing to close the pores.
Inventor(s): Sungmin YOO of Suwon-si (KR) for samsung electronics co., ltd., Myounghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Juik OH of Suwon-si (KR) for samsung electronics co., ltd., Youngchan YOON of Suwon-si (KR) for samsung electronics co., ltd., Sangjoe CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F28F21/08, F28F1/32, F28F19/00
CPC Code(s): F28F21/084
Abstract: a high corrosion resistance heat exchanger is disclosed, which has improved corrosion resistance. the improved corrosion resistance is achieved by controlling alloy components in a tube material and a fin material and inducing sacrificial corrosion of the fin material. the high corrosion resistance heat exchanger includes a tube having a channel formed therein to allow a refrigerant to flow, and a plurality of fins coupled to the outer circumferential surface of the tube. the fins may contain 0.1 wt % to 0.45 wt % of mg, and 0.5 wt % to 0.8 wt % of zn, a remainder wt % of al.
20240192071.BAFFLE INSPECTION APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangjine PARK of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Park of Suwon-si (KR) for samsung electronics co., ltd., Kuntack Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01L9/12
CPC Code(s): G01L9/12
Abstract: a baffle inspection apparatus is provided and includes: a baffle including a spray surface configured to receive and spray fluid; an upper vessel coupled to the baffle such that the spray surface of the baffle faces downwards; an upper plate above the upper vessel and supporting the upper vessel; a lower vessel below the upper vessel and apart from the upper vessel and the upper plate; a pressure measurement sensor on an upper surface of the lower vessel; a lower plate on a lower surface of the lower vessel and supporting the lower vessel; and a support that supports the upper plate and the lower plate. the upper vessel includes a flow path pipe that is configured to supply the fluid to the baffle so that the fluid is sprayed from the spray surface of the baffle.
Inventor(s): Kwangeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Sewon Kim of Suwon-si (KR) for samsung electronics co., ltd., Huisoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Ahn of Suwon-si (KR) for samsung electronics co., ltd., Sungeun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N23/2251
CPC Code(s): G01N23/2251
Abstract: a pattern inspection apparatus includes a sample including a plurality of holes having thicknesses that are different from each other, an electron gun configured to generate an input electron beam and emit the input electron beam onto a wafer and the sample, a stage configured to support the wafer and the sample, a detector configured to generate a scanning electron microscope (sem) image by detecting emitted electrons from the wafer and the sample, and a processor configured to process the sem image into a three-dimensional profiling image containing depth information of the wafer and determine whether a condition of the input electron beam has changed based on the processing of the sem image.
Inventor(s): Ilhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kangyoon LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G01N29/02, G01N29/44
CPC Code(s): G01N29/022
Abstract: a dust mass measurement device includes a sensing channel configured to generate a sensing clock signal, a reference channel configured to generate a reference clock signal, a counter configured to generate a first output signal based on the sensing clock signal, and generate a second output signal based on the reference clock signal, and a controller configured to calculate a frequency difference between the sensing clock signal and the reference clock signal based on a difference value between the first output signal and the second output signal, which are received from the counter, and measure a mass of dust based on the calculated frequency difference.
Inventor(s): Wenjun Jiang of San Jose CA (US) for samsung electronics co., ltd., Tianwei Xing of Santa Clara CA (US) for samsung electronics co., ltd., Xun Chen of Fremont CA (US) for samsung electronics co., ltd.
IPC Code(s): G01P15/18, G01P3/44
CPC Code(s): G01P15/18
Abstract: a method for detecting a drop event of an electronic device, may include: obtaining an angular velocity and a proper acceleration of the electronic device based on sensor data received from an inertial measurement unit (imu) sensor of the electronic device; obtaining centripetal acceleration of the electronic device based on the angular velocity, principal moments of inertia of the electronic device, and position of the imu sensor within the electronic device; based on an acceleration difference between the centripetal acceleration and the proper acceleration, determining whether the electronic device is in a fall state; and based on the electronic device being determined to be in the fall state, providing an analysis result of the drop event.
Inventor(s): Woosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunil BYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/481, G02B5/18
CPC Code(s): G01S7/4814
Abstract: provided is a grating structure including a grating layer including a first surface, a second surface opposite to the first surface, and a plurality of grating teeth between the first surface and the second surface, a slab layer on a surface of at least one of the plurality of grating teeth, and a heater on at least one of the first surface, the second surface, and the plurality of grating teeth.
Inventor(s): Woosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongjae SHIN of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunil BYUN of Suwon-si (KR) for samsung electronics co., ltd., Changbum LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/481, G01S7/4911, G01S7/4912
CPC Code(s): G01S7/4817
Abstract: a lidar apparatus includes a light source module configured to generate light, an optical transmitter configured to transmit the light generated by the light source module to outside, an optical receiver configured to receive light coming from the outside, an optical detector configured to detect the light received by the optical receiver, and a processor configured to control the operation of each of the light source module and the optical transmitter, wherein the light source module includes a first tunable laser light source configured to emit light in a first wavelength band, a second tunable laser light source configured to emit light in a second wavelength band different from the first wavelength band, and a light selection element configured to select and output one of the lights emitted by the first tunable laser light source and the second tunable laser light source.
Inventor(s): Seung Tae KHANG of Suwon-si (KR) for samsung electronics co., ltd., Jinyong JEON of Suwon-si (KR) for samsung electronics co., ltd., Sungdo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jong-Sok KIM of Suwon-si (KR) for samsung electronics co., ltd., Young Rae CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/46, G01S7/03, G01S7/295, G01S7/40
CPC Code(s): G01S13/46
Abstract: a processor implement method may include determining a target azimuth angle of the target object based on an initial radar signal received through an array antenna of a radar sensor, generating a correction radar signal by correcting a phase of the initial radar signal based on the target azimuth angle, and determining an elevation angle of the target object based on the correction radar signal.
Inventor(s): Sunkyoung YU of Suwon-si (KR) for samsung electronics co., ltd., Youmin JOUNG of Suwon-si (KR) for samsung electronics co., ltd., Jungbeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Kisoo YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S19/26, G01S19/22
CPC Code(s): G01S19/26
Abstract: a gnss (global navigation satellite system) receiver includes a signal processing module that receives a satellite signal from a satellite, processes the received satellite signal into a baseband signal, and outputs the baseband signal as input data. a classification module determines a reception environment of the satellite signal through a machine learning model by extracting a plurality of features related to motion characteristics of a user wearing the gnss receiver (for example, user speed and acceleration) and features of the satellite (for example, number of visible satellites) and outputs environment information. the environment information indicates reception environment. a position calculation module calculates, based on the baseband signal and the environment information, position information of the user corresponding to the position of the gnss receiver.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S19/42, G01S19/05
CPC Code(s): G01S19/42
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting higher data rates. a method performed by a user equipment (ue) in a wireless communication system is provided. the method may include: transmitting, to a location server, capability information of the ue related to global navigation satellite system (gnss) positioning integrity (pi); receiving information about one or more key performance indicators (kpis) from the location server; and transmitting, to the location server, resultant information about the gnss pi, based on the one or more kpis.
Inventor(s): Jonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Changtaek KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaeha PARK of Suwon-si (KR) for samsung electronics co., ltd., Seongkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Yonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeock LEE of Suwon-si (KR) for samsung electronics co., ltd., Chulmin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hochul HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01, G06F3/16, G06V10/764
CPC Code(s): G02B27/017
Abstract: a wearable device outputting a sound for an object of interest and a method for controlling the same are disclosed. in an embodiment, a wearable device may comprise at least one microphone, at least one speaker, and at least one processor. the at least one processor may be configured to identify an object of interest of a user wearing the wearable device, obtain a sound signal generated from the identified object of interest using the at least one microphone, and output the sound signal generated from the object of interest through the at least one speaker or output a sound related to the object of interest through the at least one speaker, based on a sensitivity of the obtained sound signal.
20240192536.DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daegun HONG of Suwon-si (KR) for samsung electronics co., ltd., Byoungjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungdo JO of Suwon-si (KR) for samsung electronics co., ltd., Byeonghwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1333
CPC Code(s): G02F1/13332
Abstract: a display apparatus includes a display panel displaying an image; a top chassis provided along an outer periphery of the display panel and supporting the display panel, the top chassis including a magnet fastening portion therein; a chassis cover provided on an exterior of the top chassis and covering the top chassis; a magnet provided on the magnet fastening portion and configured to allow the chassis cover to be detachably mounted to the top chassis; and an elastic bracket configured to fasten the magnet to the magnet fastening portion, the elastic bracket may include a bracket body to which the magnet is mounted and an interference portion configured to interfere with the magnet fastening portion.
Inventor(s): Hyunil BYUN of Suwon-si (KR) for samsung electronics co., ltd., Woosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyunghyun SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/29, G01S7/481
CPC Code(s): G02F1/292
Abstract: an optical phased array device may include a substrate, a light distribution unit configured to distribute input light along a plurality of paths as distributed light, a light modulator configured to modulate a phase of distributed light to establish phase-modulated light, an antenna configured to emit the phase-modulated light, a clad surrounding the light distribution unit, the light modulator, and the antenna and including a first surface facing the substrate and a second surface opposite the first surface, and a reflective layer facing the second surface of the clad. the reflective layer may be configured to reflect the phase-modulated light emitted from the antenna so that reflected light is emitted to an exterior environment that is external to the optical phased array device based on passing through the substrate.
20240192604.POST BAKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehong LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngho HWANG of Suwon-si (KR) for samsung electronics co., ltd., Byungjo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangki NAM of Suwon-si (KR) for samsung electronics co., ltd., Suyoung YOO of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkyun IM of Suwon-si (KR) for samsung electronics co., ltd., Hyungkyu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seok HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/40
CPC Code(s): G03F7/40
Abstract: a post baking apparatus comprising a baking chamber configured to receive a substrate with an exposed photoresist film, a lower heater in the baking chamber under the substrate to heat the exposed photoresist film, an applier applying an electric field or a magnetic field to the exposed photoresist film along a vertical direction, which is substantially perpendicular to an upper surface of the exposed photoresist film, to control diffusions of an acid or a secondary electron, which are generated from the exposed photoresist film, along a horizontal direction, and a controller configured to control an operation of the applier.
Inventor(s): Wontaek Seo of Yongin-si (KR) for samsung electronics co., ltd., Youngil Kim of Seongnam-si (KR) for samsung electronics co., ltd., Byeongsoo Son of Seongnam-si (KR) for samsung electronics co., ltd., Changkun Lee of Seoul (KR) for samsung electronics co., ltd., Gyewon Seo of Seongnam-si (KR) for samsung electronics co., ltd., Geeyoung Sung of Daegu (KR) for samsung electronics co., ltd.
IPC Code(s): G03H1/22, G02B27/01, G02B27/28, G03H1/02, G03H1/12, G03H1/28
CPC Code(s): G03H1/2294
Abstract: provided is a multi-image display apparatus including a light source configured to emit light, a spatial light modulator configured to provide a first image by modulating the light emitted from the light source, and an optical system configured to transmit the first image provided by the spatial light modulator to a viewer, wherein the optical system is configured such that a travelling path of the first image provided by the spatial light modulator includes a first optical path in a first direction, a second optical path in a second direction orthogonal to the first direction, and a third optical path in a third direction orthogonal to the first direction and the second direction, respectively, and wherein the optical system is configured such that the first image and a second image provided from an optical path different from the travelling path of the first image are provided to the viewer.
Inventor(s): HYEONJUN YUN of SUWON-SI (KR) for samsung electronics co., ltd., SANGSU YEH of SUWON-SI (KR) for samsung electronics co., ltd., MINSU LEE of SUWON-SI (KR) for samsung electronics co., ltd., JONGHWA KIM of SUWON-SI (KR) for samsung electronics co., ltd., JOOYEOP NAM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G05D23/19, H01L21/683
CPC Code(s): G05D23/1931
Abstract: a temperature control system of a semiconductor manufacturing device includes first and second heating media storages that respectively store low-temperature heating media and high-temperature heating media, a mixing device including a mixing valve that mixes the low-temperature heating media and the high-temperature heating media at a predetermined mixing ratio, and a control device. the mixing device provides mixed heating media to a load, and distributes recovered heating media recovered from the load to the first and second heating media storages. the control device is configured to, by performing feed-forward control and feedback control over a mixing unit temperature using a relationship model between a reference temperature representing a temperature of heating media passing through the load and the mixing unit temperature which is a temperature of heating media output by the mixing valve, control the mixing ratio such that the reference temperature has a target reference temperature.
Inventor(s): Jaegon LEE of Seongnam-si (KR) for samsung electronics co., ltd., Yohan Kwon of Seoul (KR) for samsung electronics co., ltd., Sangho Kim of Suwon-si (KR) for samsung electronics co., ltd., Seki Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonseok Kim of Seoul (KR) for samsung electronics co., ltd., Yooseok Shon of Seoul (KR) for samsung electronics co., ltd., Dooseok Yoon of Suwon-si (KR) for samsung electronics co., ltd., Iksu Lee of Yongin-si (KR) for samsung electronics co., ltd., Jongpil Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyongmin Lee of Seoul (KR) for samsung electronics co., ltd., Wookyeong Jeong of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/28, G05F1/59, H02M3/157
CPC Code(s): G06F1/28
Abstract: a system on chip includes a core configured to maintain a clock gating state; a plurality of header switch circuits configured to deliver a supply voltage, which is reduced from an external supply voltage, to the core in response to a plurality of control signals; and a voltage regulator configured to monitor the supply voltage, change logic levels of the plurality of control signals according to a difference level corresponding to a difference between the supply voltage and a preset target voltage, and output the plurality of control signals of which the logic levels have been changed to the plurality of header switch circuits.
Inventor(s): Jae Min Kang of Suwon-si (KR) for samsung electronics co., ltd., Seung Woo Noh of Suwon-si (KR) for samsung electronics co., ltd., Byung Hoon Ko of Suwon-si (KR) for samsung electronics co., ltd., Sang Yun Park of Suwon-si (KR) for samsung electronics co., ltd., Jun Woo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, A61B5/117
CPC Code(s): G06F3/011
Abstract: an electronic device and a control method using the same are provided. the electronic device may include: a photoplethysmography (ppg) sensor having a plurality of channels arranged isotropically; and a processor configured to: detect a center of gravity of an external force applied to a measurement area of the ppg sensor by an object, based on ppg signals that are detected from the plurality of channels when the object is in contact with the measurement area of the ppg sensor, and generate a control command based on a change in the detected center of gravity.
Inventor(s): Sungjun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Daewung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiyeon MA of Suwon-si (KR) for samsung electronics co., ltd., Donghun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Euijun KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngah LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01
CPC Code(s): G06F3/017
Abstract: an electronic apparatus including a camera, a display, a communication interface configured to perform communication with an external device, a memory configured to store at least one instruction, and a processor, and the processor, by executing the at least one instruction, is configured to, based on a gesture of a user photographed through the camera being a capture gesture that is a predetermined gesture, obtain information regarding a setting state of at least one of the electronic apparatus or the external device, control the display to display a ui including information regarding the setting state, and based on a first gesture of the user using a specific object being input while the ui is displayed, match the first gesture with the obtained information regarding the setting state and store the first gesture matched with the obtained information regarding the setting state as a custom gesture.
Inventor(s): Yanggeun OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Byungjun SON of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjoo AHN of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungwook YOUN of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiyoon PARK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/14
CPC Code(s): G06F3/017
Abstract: disclosed is an electronic device configured to obtain a second image, by cropping a first image obtained through a camera, detect at least one finger object in the second image, the at least one finger object corresponding to at least one finger, determine at least one key column corresponding to the at least one finger object among a plurality of key columns of a virtual keyboard by matching the plurality of key columns of the virtual keyboard to a plurality of regions of the second image, and identifying at least one region corresponding to at least one position of the at least one finger object among the plurality of regions of the second image, determine at least one key row corresponding to the at least one finger object among a plurality of key rows of the virtual keyboard, identify, based on the determined at least one key column and the determined at least one key row, at least one virtual key corresponding to the at least one finger object among a plurality of virtual keys of the virtual keyboard, and identify an input of the identified at least one virtual key, based on detecting a typing movement of the at least one finger object.
Inventor(s): Aram SONG of Suwon-si (KR) for samsung electronics co., ltd., Sangheon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hoondo HEO of Suwon-si (KR) for samsung electronics co., ltd., Minuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongdae PARK of Suwon-si (KR) for samsung electronics co., ltd., Ilyong YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/044, G06F3/041
CPC Code(s): G06F3/0446
Abstract: according to various embodiments of the present invention, an electronic device may comprise a touch layer in which a sensor may be disposed below a designated area, wherein the touch layer comprises: a first touch line including a first touch electrode and a second touch electrode arranged in a first direction in the designated area; a second touch line including a third touch electrode and a fourth touch electrode arranged in a second direction while crossing the first touch line in the designated area; a first opening formed in the area where the first touch line and the second touch line cross each other; and a first connection wiring disposed in the peripheral portion of the first opening and connecting the first touch electrode and the second touch electrode to each other. various other embodiments are also possible.
Inventor(s): Jong-Sung NA of Suwon-si (KR) for samsung electronics co., ltd., Seona CHO of Suwon-si (KR) for samsung electronics co., ltd., Kyungduk LEE of Suwon-si (KR) for samsung electronics co., ltd., Sohyun HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/061
Abstract: disclosed is a storage device, the device comprising, a nonvolatile memory device configured to store data; and a storage controller configured to perform logging for a selected memory area of the nonvolatile memory device in response to a specific event based on receiving a telemetry request from a host, and transmit log data collected by the logging in response to the telemetry request, the storage controller including a logging module configured to sample distribution data of a voltage range corresponding to the event type during the logging and provide the sampled distribution data as the log data.
Inventor(s): Kun ZHANG of SUWON-SI (KR) for samsung electronics co., ltd., Bei QI of SUWON-SI (KR) for samsung electronics co., ltd., Dan CAO of SUWON-SI (KR) for samsung electronics co., ltd., Kun DOU of SUWON-SI (KR) for samsung electronics co., ltd., Tianyi ZHANG of SUWON-SI (KR) for samsung electronics co., ltd., Zongyuan ZHANG of SUWON-SI (KR) for samsung electronics co., ltd., Ruyi ZHANG of SUWON-SI (KR) for samsung electronics co., ltd., Yutao LI of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F16/22
CPC Code(s): G06F3/0619
Abstract: a log-structured merge-tree (lsm-tree) based key-value (kv) data storage method includes writing kv data into a nand flash memory. the kv data includes a key-value pair including a key and a corresponding value. the kv data is stored in a key-value solid state drive (kvssd), which includes a storage class memory (scm) and the nand flash memory. the method further includes storing metadata of the kv data in the scm. the metadata of the kv data includes the key and index information of the corresponding value of the kv data, and the index information of the corresponding value of the kv data indicates address information of the kv data in the nand flash memory.
Inventor(s): Thomas Cougar VAN EATON of Caldwell ID (US) for samsung electronics co., ltd., Donhak KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Lucky Ananda HEMARGA of Austin TX (US) for samsung electronics co., ltd., Pilchang SON of Seattle WA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0622
Abstract: a system and method using a programmable physical security identifier. in some embodiments, the method includes: receiving, by a persistent storage device including persistent storage, a first identifier programming command, the first identifier programming command being for defining a first physical security identifier; storing, by the persistent storage device, the first physical security identifier; receiving, by the persistent storage device, a revert command, the revert command including an input physical security identifier; and erasing, by the persistent storage device, based on the input physical security identifier matching the first physical security identifier, a portion of the persistent storage.
Inventor(s): Seungho Lee of Suwon-si (KR) for samsung electronics co., ltd., Yunho Youm of Suwon-si (KR) for samsung electronics co., ltd., Myungsik Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F11/10
CPC Code(s): G06F3/0623
Abstract: a storage device, including at least one nonvolatile memory device configured to store data; and a storage controller configured to: generate a virtual table including a plurality of random values, wherein each random value of the plurality of random values designates an index from among a plurality of indexes corresponding to a plurality of main functions; transmit the virtual table to a host; receive from the host a vendor unique command (vuc) generated by the host based on the virtual table; parse the vuc based on the virtual table, perform an operation corresponding to the at least one nonvolatile memory device based on the parsed vuc; and transmit a result of the operation to the host.
Inventor(s): Ali SHAFIEE ARDESTANI of Santa Clara CA (US) for samsung electronics co., ltd., Hamzah Ahmed Ali ABDELAZIZ of San Jose CA (US) for samsung electronics co., ltd., Ardavan PEDRAM of San Jose CA (US) for samsung electronics co., ltd., Joseph H. HASSOUN of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F7/544
CPC Code(s): G06F7/5443
Abstract: systems and methods for handling processing with sparse weights and outliers. in some embodiments, the method includes reading a first activation from a first row of an array of activations; multiplying a first weight by the first activation to form a first product; directing, by a first demultiplexer, the first product to a first adder tree, of a plurality of adder trees; reading a second activation from a second row of the array of activations; and multiplying a second weight by the second activation.
Inventor(s): Moongyung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/34
CPC Code(s): G06F11/3409
Abstract: a system on chip includes a processor configured to execute an application by using a shared library, the application being supported by an operating system, a performance prediction module configured to generate control information of the processor for executing a function by the processor and predictive performance information of the processor that is predicted during control according to the control information when the function included in the shared library is executed the control information referencing a history corresponding to the function from a history table, and a performance management module configured to generate a control signal for performance control of the processor based on the control information, wherein the history is an accumulation of performance information of the processor measured by executing in advance the function at least once.
Inventor(s): Sungjoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngjin KWON of Daejeon (KR) for samsung electronics co., ltd., Inhoe KOO of Daejeon (KR) for samsung electronics co., ltd., Jongyul KIM of Daejeon (KR) for samsung electronics co., ltd., Jinyoung OH of Daejeon (KR) for samsung electronics co., ltd., Young Jun HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/0884, G06F12/0817
CPC Code(s): G06F12/0884
Abstract: a computational network interface card (nic) sharing a storage space with a memory expander thereof includes: a nic memory including instructions; a nic processor including a cache and electrically connected to the nic memory; and a nic configured to transmit data stored in the nic memory or the cache to a network, wherein, the instructions are configured to cause the nic processor to perform operations including: receiving a request to read or write metadata; and checking whether the requested metadata is stored in a local metadata cache of the computational nic by sequentially checking whether the metadata is stored in the cache of the nic processor, a cache of the nic, the nic memory, or the memory expander.
Inventor(s): Doo Hwan OH of Hwaseong-si (KR) for samsung electronics co., ltd., Seung-Hun Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Jin Hu Jeong of Suwon-si (KR) for samsung electronics co., ltd., Chang Ho Yun of Seoul (KR) for samsung electronics co., ltd., Kyung-Hee Han of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G11C11/406
CPC Code(s): G06F13/1636
Abstract: provided is an operating method of a storage device. the method includes providing temperature information of each of a plurality of volatile memory devices in the storage device to a host device; and receiving a setting command related to a refresh operation of the plurality of volatile memory devices from the host device, wherein the plurality of volatile memory devices are classified into groups based on temperature information, and wherein the setting command indicates a number of rows of the plurality of volatile memory devices to be refreshed differently for each of the groups based on the temperature information.
Inventor(s): Jong Won LEE of Suwon-si (KR) for samsung electronics co., ltd., Sang Oak WOO of Suwon-si (KR) for samsung electronics co., ltd., Myung June JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jae Ho SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/16
CPC Code(s): G06F13/1668
Abstract: an operating method of a computational storage device includes: setting a first computing namespace, including a first queue and a first accelerator and having a first value as its first id, per instructions from a first host; setting a second computing namespace, including a second queue and a second accelerator and having a second value as its first id, per instructions from a second host; loading a first program from the first host in the first computing namespace; loading a second program from the second host in the second computing namespace; setting a second id of the first computing namespace to a third value based on an id of the first program per instructions to activate the first program; and setting the second id of the second computing namespace to a fourth value based on an id of the second program per instructions to activate the second program.
Inventor(s): Krishna T. MALLADI of San Jose CA (US) for samsung electronics co., ltd., Hongzhong ZHENG of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/28, G06F9/445, G06F9/48, G06F15/76
CPC Code(s): G06F13/28
Abstract: an apparatus may include a heterogeneous computing environment that may be controlled, at least in part, by a task scheduler in which the heterogeneous computing environment may include a processing unit having fixed logical circuits configured to execute instructions; a reprogrammable processing unit having reprogrammable logical circuits configured to execute instructions that include instructions to control processing-in-memory functionality; and a stack of high-bandwidth memory dies in which each may be configured to store data and to provide processing-in-memory functionality controllable by the reprogrammable processing unit such that the reprogrammable processing unit is at least partially stacked with the high-bandwidth memory dies. the task scheduler may be configured to schedule computational tasks between the processing unit, and the reprogrammable processing unit.
Inventor(s): Sungbin MIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Taeyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Chounjong NAM of Suwon-si (KR) for samsung electronics co., ltd., Changmok YANG of Suwon-si (KR) for samsung electronics co., ltd., Sunkee LEE of Suwon-si (KR) for samsung electronics co., ltd., Eonji LEE of Suwon-si (KR) for samsung electronics co., ltd., Mincheol JEONG of Suwon-si (KR) for samsung electronics co., ltd., Junyeop JUNG of Suwon-si (KR) for samsung electronics co., ltd., Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/42, G06F11/14
CPC Code(s): G06F13/4282
Abstract: with respect to an electronic device and an electronic device operating method, according to various embodiments, the electronic device comprises: a communication module including a communication circuit and at least one processor, comprising processing circuitry, configured to support short-range wireless communication; and at least one application processor, comprising processing circuitry, electrically connected to the communication module through an interface supporting a plurality of operating modes, wherein at least one processor, individually and/or collectively, can be configured to: select one operating mode from among the plurality of operating modes based on capability information about the external electronic device, received from the external electronic device; and transmit data to the application processor through the selected operating mode and/or receive, through the selected interface, data transmitted by the application processor, and the capability information about the external electronic device can be configured to be received from the external electronic device before completion of the establishment of the short-range wireless communication.
Inventor(s): Moongyung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F15/78, G06F11/34
CPC Code(s): G06F15/7807
Abstract: disclosed are system-on-chip devices (socs) and operating methods thereof. a system-on-chip (soc) may include a memory including a history storage, a processor configured to execute an application, performance optimization module configured to generate and transmit optimized control information for the processor executing a function included in the application, based on a history corresponding to the function, when the processor executes the function and the history corresponding to the function is in the history storage, and a performance management module configured to generate a control signal for controlling performance of the processor, based on the optimized control information received from the performance optimization module, wherein the history includes control information for the processor and utilization information accumulated according to the control information, the control information having been accumulated during at least one time of previous execution of the function.
Inventor(s): Zhonggang CHEN of Xi'an hi tech Zone (CN) for samsung electronics co., ltd.
IPC Code(s): G06F16/18, G06F16/906
CPC Code(s): G06F16/1847
Abstract: a data storage method includes allocating first stream identifiers (ids) of a first subset of streams of a storage device that supports multi-stream to data files based on first access attribute information of the data files, allocating second stream ids of a second subset of the streams to metadata for the data files based on second access attribute information of the metadata, and writing the data files and the metadata into storage areas of the storage device based on the first stream ids and the second stream ids, respectively.
Inventor(s): Jaehong KIM of Suwon-si (KR) for samsung electronics co., ltd., Juyong SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jungwook KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/31, G06F8/61, G06F18/20, G06N3/045, G06V10/764, G06V10/82
CPC Code(s): G06F21/31
Abstract: an electronic device and a controlling method of an electronic device are provided. the electronic device includes identifying whether each of one or more neural network models included in a first external device is suitable for hardware of the electronic device and whether each of the one or more neural network models identified as suitable for the hardware of the electronic device is suitable to replace the neural network models included in the electronic device, based on first device information on a hardware specifications of the electronic device, second device information on a hardware specification of the first external device, first model information on the one or more neural network models included in the first external device, and second model information on the one or more neural network models included in the electronic device.
Inventor(s): JOHN HONGJIP KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/57, G06F21/12
CPC Code(s): G06F21/575
Abstract: an electronic device loads a boot code and checks a select bit. when the select bit has a first value, the electronic device verifies the boot code based on a pre-quantum cryptography algorithm. if verification of the boot code fails, the electronic device verifies the boot code based on a post-quantum cryptography algorithm. if verification of the boot code based on the post-quantum cryptography algorithm is successful, the electronic device sets the select bit to a second value.
Inventor(s): Yukihide TSUJI of Suwon-si (KR) for samsung electronics co., ltd., Hisashi KOTAKEMORI of Suwon-si (KR) for samsung electronics co., ltd., Shinwook YI of Suwon-si (KR) for samsung electronics co., ltd., Yuntae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05B19/4099
CPC Code(s): G05B19/4099
Abstract: a simulation method of a semiconductor process includes receiving first input data including values of a plurality of parameters received from the outside, setting a simulation using the plurality of parameters, improving the simulation by ordering the plurality of parameters, and executing the simulation by processing a job stored in a queue, wherein the optimizing includes generating a table with respect to the plurality of parameters, ordering the plurality of parameters based on the first input data, generating a job tree based on the plurality of ordered parameters, reconstructing the table based on the job tree, and generating the queue by storing the job in the queue based on the reconstructed table.
Inventor(s): Jordan Timothy Davis of Suwon-si (KR) for samsung electronics co., ltd., Woojin Seo of Suwon-si (KR) for samsung electronics co., ltd., Chanhee Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/392, G06F30/327, G06F30/394
CPC Code(s): G06F30/392
Abstract: in an example method of analyzing an electrostatic discharge (esd) network, input data characterizing a semiconductor device is received. the semiconductor device includes an input/output (i/o) pad, an esd protection circuit, and at least one functional circuit. a common resistance of the esd protection circuit is calculated based on the input data and using a plurality of resistances and at least one predetermined equation. the plurality of resistances are associated with the i/o pad, the esd protection circuit, and the at least one functional circuit. a network analysis is performed on the semiconductor device by excluding the common resistance.
Inventor(s): Sunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/392, G06F30/394
CPC Code(s): G06F30/392
Abstract: a method of designing a layout of an integrated circuit includes generating floorplan data by performing floorplan based on input data for the integrated circuit, searching for a path between a first point and a second point, which are specified, the searching based on the floorplan data, and positioning components of the layout based on a result of the searching. the searching for the path includes distinguishing based on the floorplan data a first region where routing is possible from a second region where the routing is not possible, receiving position data on the first point and the second point, and searching for a shortest path between the first point and the second point, on the first region.
Inventor(s): Seok-Young YOON of Suwon-si (KR) for samsung electronics co., ltd., Bernhard EGGER of Seoul (KR) for samsung electronics co., ltd., Hyemi MIN of Seoul (KR) for samsung electronics co., ltd., Jungyoon KWON of Seoul (KR) for samsung electronics co., ltd., Jaume Mateu CUADRAT of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0464
CPC Code(s): G06N3/0464
Abstract: a method and apparatus with scheduling a neural network (nn), which relate to extracting and scheduling priorities of operation sets, are provided. a scheduler may be configured to receive a loop structure corresponding to a nn model, generate a plurality of operation sets based on the loop structure, generate a priority table for the operation sets based on memory benefits of the operation sets, and schedule the operation sets based on the priority table.
Inventor(s): Seong-Jin PARK of Suwon-si (KR) for samsung electronics co., ltd., Seon Min RHEE of Suwon-si (KR) for samsung electronics co., ltd., Jaewon YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/08
CPC Code(s): G06N3/08
Abstract: a processor-implemented method including generating a first corrected result image of a first desired pattern image using a backward correction neural network provided an input based on the first desired pattern image, the backward correction neural network performing a backward correction of a first process, generating a first simulated result image using a forward simulation neural network based on the first corrected result image, the forward simulation neural network performing a forward simulation of a performance of the first process, and updating the first corrected result image so that an error between the first desired pattern image and the first simulated result image is reduced.
Inventor(s): Hyeonseung YU of Suwon-si (KR) for samsung electronics co., ltd., Nahyup KANG of Suwon-si (KR) for samsung electronics co., ltd., Hanjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoung MOON of Suwon-si (KR) for samsung electronics co., ltd., Juyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hwiryong JUNG of Suwon-si (KR) for samsung electronics co., ltd., Inwoo HA of Suwon-si (KR) for samsung electronics co., ltd., Seokpyo HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06T3/00, G06T7/50, G06T7/90, G06V10/764
CPC Code(s): G06T3/4053
Abstract: a processor implemented method includes generating a semantic map indicating a visualization property assigned to an object of an obtained frame image having a first resolution and generating a reconstruction image using an image reconstruction machine learning model provided input based on the obtained frame image and the semantic map having a second resolution and including a second object having a visualization property indicated by the semantic map.
Inventor(s): Chao ZHANG of Beijing (CN) for samsung electronics co., ltd., Qiang WANG of Beijing (CN) for samsung electronics co., ltd., Jingu HEO of Suwon-si (KR) for samsung electronics co., ltd., Dong Kyung NAM of Suwon-si (KR) for samsung electronics co., ltd., Yasi WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G06T3/4053, G06T7/20, G06V10/24, G06V10/44, G06V10/80
CPC Code(s): G06T3/4053
Abstract: provided is an image processing method of an image processing model, the image processing method including obtaining an input image group, the input image group including a plurality of low-resolution images corresponding to a plurality of different viewpoints, respectively, obtaining a feature of low-resolution images by extracting a feature for each low-resolution image of the plurality of low-resolution images included in the input image group, obtaining a fusion residual feature by fusing the feature of low-resolution images, and obtaining a super-resolution image corresponding to the input image group based on the fusion residual feature.
Inventor(s): Jungkee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Noyoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T7/11
CPC Code(s): G06T7/0006
Abstract: a pattern defect inspection device includes an inspection apparatus inspecting a pattern on a substrate, a database storing a pattern layout including a plurality of defect patterns from the inspection apparatus, a preset field of view (fov) size, and a target measurement number, and a processor setting a plurality of inspection regions of the inspection apparatus based on the pattern layout, wherein the processor includes a defect search unit searching for a region defect pattern existing in any one of a plurality of inspection regions in the pattern layout, an inspection region aligning unit arranging the plurality of inspection regions based on the region defect pattern, an overlapping region removal unit removing an overlapping region from the plurality of inspection regions, and an inspection region selecting unit selecting an inspection region other than the overlapping region, among the plurality of inspection regions, as a final inspection region.
Inventor(s): Prashant Pandurang SHINDE of Bengaluru (IN) for samsung electronics co., ltd., Shashishekara Parampalli ADIGA of Bengaluru (IN) for samsung electronics co., ltd., Priyadarshini Panemangalore PAI of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T7/11, G06T7/62, G06V10/70
CPC Code(s): G06T7/0008
Abstract: a processor-implemented method with image generation includes: receiving a plurality of input parameters for a plurality of images to be generated; generating a plurality of defect profiles comprising a size and location of one or more defects to be formed in an image; and generating the plurality of images comprising defect information based on the plurality of defect profiles and the plurality of input parameters using an image rendering operation.
Inventor(s): Woohyun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jinwang AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G06V20/40
CPC Code(s): G06T17/00
Abstract: a first electronic device is provided. the electronic device includes memory, a communication module, a display, and at least one processor. the memory stores at least one instruction configured to cause, when executed by the processor, the first electronic device to, display a first virtual object, identify an input to the first virtual object, transmit information about a first event corresponding to the input to the first virtual object and first identification information of the first electronic device to the server when the first virtual object is in the active state, receive, second identification information of one among multiple electronic devices connected to the server and information about a second event for the first virtual object, and execute the first event when the second identification information corresponds to the first identification information.
Inventor(s): Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Kihwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Harksang KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Hyuntaek WOO of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungjik LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Daehee KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomsu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/20, G06T7/73, G06T19/00, G06V20/20, G06V40/20, H04B10/114, H04N7/22
CPC Code(s): G06T19/20
Abstract: according to an embodiment, a processor of a wearable device is configured to identify, based on an image output from a camera, an external electronic device. the processor, based on the identification, is configured to request outputting of an optical signal to the external electronic device through a communication circuit. the processor is configured to identify, in a portion of the image where the external electronic device is displayed, a position of the optical signal output from the external electronic device. the processor is configured to control a display to display a visual object having an extended shape based on the identified position in the display.
Inventor(s): Sangsoo KO of Yongin-si (KR) for samsung electronics co., ltd., Byeoungsu KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Kyoungyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuck HA of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/56, B60W50/00, G06F18/213, G06F18/214, G06F18/241, G06V10/22, G06V10/25, G06V10/77, G06V20/64, H04N13/111
CPC Code(s): G06V20/56
Abstract: adas includes a processing circuit and a memory which stores instructions executable by the processing circuit. the processing circuit executes the instructions to cause the adas to receive, from a vehicle that is in motion, a video sequence, generate a position image including at least one object included in the stereo image, generate a second position information associated with the at least one object based on reflected signals received from the vehicle, determine regions each including at least a portion of the at least one object as candidate bounding boxes based on the stereo image and the position image, and selectively adjusting class scores of respective ones of the candidate bounding boxes associated with the at least one object based on whether a respective first position information of the respective ones of the candidate bounding boxes matches the second position information.
Inventor(s): Hongjun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, H04N23/60
CPC Code(s): G09G3/035
Abstract: an example electronic device includes a flexible display, a first housing, a second housing, a hinge structure, a first region, and a display region including a second region surrounding the first region, a first sensor, a second sensor in the first housing, and a processor. the processor is configured to identify an angle change between the first surface of the first housing and the third surface of the second housing from a first angle to a second angle, identify a second set of pixels among the pixels in the first region corresponding to the second angle from reference data, deactivate the second set of identified pixels, and activate the remaining pixels except for the second set of pixels.
Inventor(s): Jungwon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10K11/178, F25B49/02
CPC Code(s): G10K11/17873
Abstract: a refrigerator includes a microphone and at least one processor configured to identify a first driving noise level corresponding to first driving state information of the refrigerator, based on receiving an ambient noise through the microphone while operating according to the first driving state information, identify a reception noise level based on the received ambient noise, identify an external noise level based on the reception noise level and the first driving noise level, and based on a ratio of the external noise level to the first driving noise level being smaller than a threshold ratio, drive the refrigerator based on second driving state information corresponding to a lower noise level than the first driving state information.
Inventor(s): Kyungmin LEE of Suwon (KR) for samsung electronics co., ltd., Jaeyong ROH of Suwon-si (KR) for samsung electronics co., ltd., Jonguk YOO of Suwon-si (KR) for samsung electronics co., ltd., Youngho HAN of Suwon-SI (KR) for samsung electronics co., ltd., Haeri KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/06, G10L13/08, G10L15/20
CPC Code(s): G10L15/063
Abstract: an electronic device includes: one or more processors being configured to: while the electronic device operates in a speech recognition mode, perform speech recognition by inputting a user speech signal from the microphone into a speech recognition model, obtain environment information around the electronic device while the user speech is received according to a result of the speech recognition, store the obtained environment information in the memory, identify an external device for outputting a user speech for learning from among a plurality of external devices based on the environment information that is among a plurality of environment information stored in the memory, control the communication interface to transmit a command to the external device for controlling the output of the user speech for learning, and based on receiving a user speech for learning signal, train the speech recognition model with respect to the received user speech for learning signal.
Inventor(s): Young-chul SOHN of Seoul (KR) for samsung electronics co., ltd., Gyu-tae Park of Seoul (KR) for samsung electronics co., ltd., Ki-Beom Lee of Seoul (KR) for samsung electronics co., ltd., Jong-ryul Lee of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G06F3/16, G10L15/08, G10L15/18, G10L17/22, H04L12/28, H04N21/41, H04N21/422, H04N21/4223, H04N21/439, H04N21/44
CPC Code(s): G10L15/22
Abstract: an approach for controlling method of an electronic device is provided. the approach acquires voice information and image information for setting an action to be executed according to a condition, the voice information and the image information being respectively generated from a voice and a behavior associated with the voice of a user. the approach determines an event to be detected according to the condition and a function to be executed according to the action when the event is detected, based on the acquired voice information and the acquired image information. the approach determines at least one detection resource to detect the determined event. in response to the at least one determined detection resource detecting at least one event satisfying the condition, the approach executes the function according to the action.
Inventor(s): Sangyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Cheulhee HAHM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L17/04, G10L17/02, G10L17/06, G10L17/26
CPC Code(s): G10L17/04
Abstract: provided is a display device including a memory for storing one or more instructions and at least one processor for executing the one or more instructions stored in the memory to obtain a first character string by using a character recognition model to determine whether there is at least one character on a play screen of content and recognizing a character string including the at least one character in response to determining that there is the at least one character on the play screen of the content, obtain a second character string including at least one character by using a speech recognition model to determine whether there is speech in audio data included in a play section of the content where there is the at least one character, and recognizing the speech and converting the recognized speech into a character string in response to determining that there is the speech in the audio data, and compare the first character string with the second character string and update the character recognition model based on a mismatched part.
Inventor(s): Oleksandra SOKOL of Kyiv (UA) for samsung electronics co., ltd., Dmytro PROGONOV of Kyiv (UA) for samsung electronics co., ltd., Heorhii NAUMENKO of Kyiv (UA) for samsung electronics co., ltd., Kostiantyn VOLOBUIEV of Kyiv (UA) for samsung electronics co., ltd., Vasyl KUZNETSOV of Kyiv (UA) for samsung electronics co., ltd., Viacheslav DERKACH of Kyiv (UA) for samsung electronics co., ltd.
IPC Code(s): G10L17/26, G10L17/02, G10L17/04, G10L17/06, G10L25/63
CPC Code(s): G10L17/26
Abstract: an electronic device includes a microphone, and at least one processor configured to, based on receiving voice data through the microphone, input the voice data into a non-semantic feature extractor model and acquire a non-semantic feature included in the voice data using the non-semantic feature extractor model, input the non-semantic feature into a synthetic voice classifier model and classify the voice data into a synthetic voice or a user voice the synthetic voice classifier model, and provide a result of the classification, and the synthetic voice classifier model is a model that is transfer-learned based on the non-semantic feature extractor model.
Inventor(s): Lei YANG of Beijing (CN) for samsung electronics co., ltd., Weiqin WANG of Beijing (CN) for samsung electronics co., ltd., Lufen TAN of Beijing (CN) for samsung electronics co., ltd., Lizhong WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G10L25/84, G10L25/30, H04M3/00, H04S7/00
CPC Code(s): G10L25/84
Abstract: a position detection method may include obtaining voice signals during a voice call by at least two voice collecting devices; obtaining position energy information of the voice signals; and identifying a position of the terminal device relative to a user during the voice call, from predefined positions based on the position energy information.
20240194243.NONVOLATILE MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hee-Woong KANG of Suwon-si (KR) for samsung electronics co., ltd., Dong-Hun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jun-Ho SEO of Suwon-si (KR) for samsung electronics co., ltd., Hee-Won LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4074, G11C7/10, G11C7/12, G11C8/12, G11C11/408, G11C11/4097, G11C11/56, G11C16/04, G11C16/06, G11C16/08, G11C16/10, G11C16/30, G11C16/34
CPC Code(s): G11C11/4074
Abstract: a nonvolatile memory device includes a memory cell array and a row decoder. the memory cell array includes a plurality of mats. a first cell string of first mat is connected to a plurality of first word-lines, a first bit-line and a first string selection line. a second cell string of second mat is connected to a plurality of second word-lines, a second bit-line and a second string selection line. each of the first and second cell strings includes a ground selection transistor, memory cells, and a string selection transistor coupled in series. the row decoder applies a first voltage to a third word-line among the plurality of first and second word-lines for a first period of time in a single mat mode and to apply a second voltage to the third word-line for a second period of time longer than the first period of time in a multi-mat mode.
Inventor(s): Gyosoo CHOO of Suwon-si (KR) for samsung electronics co., ltd., Daeseok BYEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C5/06, G11C16/04, H10B41/27, H10B41/35, H10B41/40, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): G11C16/08
Abstract: memory devices having an asymmetric page buffer array architecture are provided. the memory device includes a memory cell array in which each of plural memory planes is included in a cell array structure, and a row decoder array and a page buffer array included in a peripheral circuit structure vertically overlap the cell array structure. the row decoder array is buried in a region vertically overlapping a word line step region of the cell array structure and a partial region of a memory cell array adjacent to the word line step region. in the page buffer array, bit lines of a partial region of the memory cell array in which the row decoder array is buried are connected to a first page buffer array, and bit lines not included in the partial region are connected to a second page buffer array.
Inventor(s): Jiwon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Woosung Yang of Suwon-si (KR) for samsung electronics co., ltd., Dohyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, H01L23/522, H01L23/528, H01L25/065, H10B41/27, H10B41/35, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): G11C16/08
Abstract: a semiconductor device includes a first substrate structure including a first decoder circuit region, a second decoder circuit region, and a page buffer circuit region, and a second substrate structure connected to the first substrate structure. the second substrate structure includes a first cell structure that includes first horizontally extending gate electrodes, and a second cell structure that includes second horizontally extending gate electrodes. the second cell structure is disposed below the first cell structure. a first stair structure is disposed to one side of the first and second cell structures, and a second stair structure is disposed to a second side opposite the first side. a dummy structure is disposed below the first stair structure. first contact plugs pass through the first stair structure and the first dummy structure and are respectively connected to the first gate electrodes, and second contact plugs pass through the second stair structure and are respectively connected to the second gate electrodes.
Inventor(s): Yonghyuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seungbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/10, G11C16/04, G11C16/16
CPC Code(s): G11C16/102
Abstract: a memory device is provided. the memory device includes: memory cells respectively connected with word lines; first ground selection transistors connected with a first ground selection line programmed to have a first threshold voltage; second ground selection transistors connected with a second ground selection line programmed to have a second threshold voltage which differs from the first threshold voltage; and a control circuit configured to: control an erase operation to be performed on each of at least one first ground selection transistor of the first ground selection transistors based on a threshold voltage of each of the at least one first ground selection transistor being greater than a predetermined first criterion; and control a threshold voltage of each of the second ground selection transistors to be compared with a predetermined second criterion based on the erase operation on the at least one first ground selection transistor being completed.
Inventor(s): Byungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Yohan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunggon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sang Soo PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongsoon LIM of Suwon-si (KR) for samsung electronics co., ltd., Jin-Young CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/16, G11C16/04
CPC Code(s): G11C16/16
Abstract: a memory device includes a memory cell array having a plurality of memory blocks therein, including a target memory block. a voltage generator is provided, which is configured to generate an erase voltage and row line voltages, which are provided to the target memory block upon which an erase operation is to be performed. control logic is provided, which is configured to control the memory cell array and the voltage generator. in addition, during operation, the erase voltage is provided to at least one of a bitline or a common source line associated with the target memory block, and a gate line of a transistor provided with the erase voltage is precharged before the erase voltage is provided to the at least one of the bitline or the common source line of the target memory block.
Inventor(s): Chiweon Yoon of Suwon-si (KR) for samsung electronics co., ltd., Chihyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Philkyu Kang of Suwon-si (KR) for samsung electronics co., ltd., Junehong Park of Suwon-si (KR) for samsung electronics co., ltd., Jayang Yoon of Suwon-si (KR) for samsung electronics co., ltd., Hyeongdo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/30, G06F1/20, G11C16/04, G11C16/08
CPC Code(s): G11C16/30
Abstract: a nonvolatile memory device comprising a charge pump circuit with pump units connected in series that receives an external voltage for charge pumping and outputs a pump voltage in stages according to stage control signals, a switching circuit that controls the charge pump circuit to output pumping voltages in response to switch control signals, a stage controller that outputs the stage control signals and the switch control signals based on a temperature code, and a digital temperature sensor that generates the temperature code.
Inventor(s): Yonghyuk Choi of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk Yu of Suwon-si (KR) for samsung electronics co., ltd., Yohan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/34, G11C16/04, G11C16/08, G11C16/28
CPC Code(s): G11C16/3404
Abstract: a memory device includes a word line area that is between a bit line and a common source line. the word line area includes a plurality of stacks. a first area includes first stacks with a first resistance value in the word line area, a second area includes second stacks with a second resistance value in the word line area, wherein the second resistance value is different from the first resistance value, a third area includes third stacks with a third resistance value that different from the first resistance value, and a processor is configured to control a recovery sequence of the first area, the second area, and the third area.
Inventor(s): Ho Young LEE of Suwon-si (KR) for samsung electronics co., ltd., Jong Doo Kim of Suwon-si (KR) for samsung electronics co., ltd., Ju Yun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/308, H01L29/66
CPC Code(s): H01L21/308
Abstract: a method for manufacturing a mask pattern includes forming a mold mask layer on a substrate. a pre-mold mask pattern that includes a first trench extending in a first direction is formed by etching the mold mask layer. the first trench has a first width in a second direction crossing the first direction. a mold mask pattern that includes a second trench connected to the first trench is formed by etching the pre-mold mask pattern. the second trench has a second width different from the first width in the second direction. the second trench is adjacent to the first trench in the first direction. a process mask pattern that fills the first and second trenches is formed in the mold mask pattern and disposed on the substrate. the mold mask pattern is removed and the process mask pattern remains disposed on the substrate after removing the mold mask pattern.
Inventor(s): Chaelyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/02
CPC Code(s): H01L21/67051
Abstract: in a method for cleaning process, a substrate on which a layer is formed may be loaded on a substrate stage. a photocurable resin may be spin coated on the layer to form a photocurable resin layer. light may be irradiated onto the photocurable resin layer for curing the photocurable resin layer to form a polymer layer containing particles adsorbed from a surface of the layer. the polymer layer containing the particles may be removed.
Inventor(s): Jisoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Junghan Lee of Suwon-si (KR) for samsung electronics co., ltd., Kwanyoung Chun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L21/033, H01L21/311
CPC Code(s): H01L21/76816
Abstract: a method of forming a pattern of a semiconductor device, the method comprising forming an insulating film on a substrate having a first region and a second region, sequentially forming a lower mask layer and an upper mask layer on the insulating film, forming a line-shaped hard mask pattern having a plurality of narrow openings having the same width in the first region and the second region, respectively, on the upper mask layer, forming line-shaped spacers on sidewalls of the opening of the line-shaped hard mask pattern, forming a composite mask pattern composed of the spacer and a pattern having a first width among the line-shaped hard mask pattern by removing a pattern having a second width among the line-shaped hard mask patterns, the second width being smaller than the first width.
Inventor(s): Heesub KIM of Suwon-si (KR) for samsung electronics co., ltd., GUNHO JO of Suwon-si (KR) for samsung electronics co., ltd., BOMI KIM of Suwon-si (KR) for samsung electronics co., ltd., Eunho CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/8234, H01L27/088
CPC Code(s): H01L21/823481
Abstract: a method for manufacturing a semiconductor device includes: forming a semiconductor structure and a dummy structure on a substrate; forming a first insulating layer between the semiconductor structure and the dummy structure; forming a first space by removing the dummy structure; forming an isolation pattern in the first space; forming a main gate sacrificial pattern crossing the first direction to overlap the semiconductor structure; forming second spaces by removing portions of the semiconductor structure at both sides of the main gate sacrificial pattern, and forming source/drain patterns in the second spaces; forming a second insulating layer on the source/drain patterns; forming a third space by removing the main gate sacrificial pattern, and forming a gate electrode in the third space; and forming fourth spaces by removing the second insulating layer, and forming, in the fourth spaces, contact structures connected to the source/drain patterns and disposed on both sides of the isolation pattern.
Inventor(s): Junghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Yongil KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jekook LYU of Suwon-si (KR) for samsung electronics co., ltd., Heeju SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, G01R31/28, H01L25/065
CPC Code(s): H01L22/34
Abstract: provided are a substrate including a test circuit capable of testing a damaged state thereof. the substrate includes a substrate body, and a test circuit arranged on at least one of an upper surface and a lower surface of the substrate body, wherein the test circuit includes two contact pads and at least one test wiring, the two contact pads being at an end portion of the substrate body and configured to contact two probe pins of a test element, the test wiring extending to surround an outer periphery portion of the substrate body and configured to connect the two contact pads to each other, and wherein, in an electrical test using the test element, when the test wiring is in a closed state, the substrate body is determined as normal, and when the test wiring is in an open state, the substrate body is determined as defective.
Inventor(s): Jinyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonbin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kiseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihye SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/29, H01L23/498, H01L25/065, H01L25/10, H01L25/16, H10B80/00
CPC Code(s): H01L23/3135
Abstract: a semiconductor package includes a first chip including a first substrate, a first wiring layer on the first substrate, and a plurality of through-electrodes to be connected to the first wiring layer and protruding from a lower surface of the first substrate, a double gap-fill layer covering a side surface and a lower surface of the first chip and a protruding portion of the through-electrode and having a double layer structure, a second chip disposed on the first chip and the double gap-fill layer, including a second wiring layer and a second substrate on the second wiring layer, and bonded to the first chip by hybrid bonding, and a bump on a lower surface of the first chip and connected to the through-electrode.
Inventor(s): Hyunggyun Noh of Suwon-si (KR) for samsung electronics co., ltd., Jinsoo Bae of Suwon-si (KR) for samsung electronics co., ltd., Il-Joo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/433, H01L21/56, H01L23/00
CPC Code(s): H01L23/4334
Abstract: a semiconductor package includes: a substrate; a semiconductor chip provided on the substrate; a plurality of heat dissipation reinforcements provided on the substrate; and an encapsulant, on the substrate, molding the semiconductor chip and the plurality of heat dissipation reinforcements. each of the plurality of heat dissipation reinforcements has an elongated shape, and extends along lateral surfaces and an upper surface of the semiconductor chip at a predetermined interval from the semiconductor chip.
Inventor(s): JI SOO HWANG of Suwon-si (KR) for samsung electronics co., ltd., JUN SO PAK of Suwon-si (KR) for samsung electronics co., ltd., HEE SEOK LEE of Suwon-si (KR) for samsung electronics co., ltd., WOO BIN JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/498
CPC Code(s): H01L23/481
Abstract: a substrate includes a first layer including a first power line extending in a first direction and a second power line extending in the first direction, and a second layer disposed under the first layer. the second layer includes a third power line extending in a second direction different from the first direction, and a fourth power line extending in the second direction, a first via electrically connecting the first power line and the third power line to each other, and a second via electrically connecting the second power line and the fourth power line to each other. a first voltage is transferred via the third power line, the first via, and the first power line, and a second voltage is transferred via the fourth power line, the second via, and the second power line.
Inventor(s): Seungryong Oh of Suwon-si (KR) for samsung electronics co., ltd., Chajea Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a semiconductor package includes a first semiconductor chip including a first bonding layer, the first bonding layer including a first chip pad and a first insulating layer covering a side surface of the first chip pad, a second semiconductor chip disposed below the first semiconductor chip and including a substrate having front and rear surfaces, the front surface forming a second bonding layer, and through-electrodes passing through the substrate and having protrusions protruding from the rear surface, the second bonding layer including a second chip pad contacting the first chip pad and a second insulating layer covering a side surface of the second chip pad, a redistribution layer disposed below the second semiconductor chip and electrically connected to the second semiconductor chip, vias disposed between the redistribution layer and the first semiconductor chip and disposed around the second semiconductor chip, and an encapsulant surrounding the second semiconductor chip, the redistribution layer, and the vias. the encapsulant may be in contact with the protrusions of the through-electrodes.
20240194577.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yoonyoung Jeon of Suwon-si (KR) for samsung electronics co., ltd., Youngmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonseok Oh of Suwon-si (KR) for samsung electronics co., ltd., Woongkeon Lee of Suwon-si (KR) for samsung electronics co., ltd., Changbo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a first redistribution structure having at least one first redistribution layer and at least one first insulating layer that are alternately stacked, a semiconductor chip electrically connected to the first redistribution structure, a second insulating layer disposed above the semiconductor chip and having an opening, a pad electrically connected to the first redistribution structure, disposed on the second insulating layer, and overlapping the opening, a pad surface layer disposed on a first region of an upper surface of the pad to overlap the opening, the pad surface layer formed of a first conductive material different from a second conductive material forming the pad. the pad has an anchor portion protruding from a second region of the upper surface of the pad. the anchor portion protrudes to a position higher than that of a lower surface of the pad surface layer.
Inventor(s): Seokkyu Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihye Shim of Suwon-si (KR) for samsung electronics co., ltd., Kiseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Wonbin Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31
CPC Code(s): H01L23/49894
Abstract: a semiconductor package includes a redistribution substrate having a first surface and a second surface opposite to each other, and including a plurality of first photosensitive insulating layers and a plurality of redistribution layers disposed among the plurality of first photosensitive insulating layers; at least one semiconductor chip disposed on the first surface of the redistribution substrate and including a plurality of contact pads electrically connected to the plurality of redistribution layers; a protective insulating layer including a second photosensitive insulating layer disposed on the second surface of the redistribution substrate and having a plurality of contact holes, and a non-photosensitive insulating layer disposed on an outer surface of the second photosensitive insulating layer and an internal sidewall of each of the plurality of contact holes; and a plurality of under bump metallurgy (ubm) connectors each having a ubm pad disposed on the protective insulating layer and a ubm via disposed in a respective contact hole of the plurality of contact holes and electrically connected to the plurality of redistribution layers.
20240194595.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunjung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H10B12/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a wiring line on a substrate, a first line portion having a line shape in a first direction, a head hammer pattern connected to an end of the first line portion in the first direction; a second wiring line spaced from the first wiring line in a second direction perpendicular to the first direction, the second wiring line including a second line portion parallel to the first line portion; a first contact plug electrically connecting the first line portion and the second line portion, the first contact plug being positioned adjacent to the first end of the first line portion and a second end of the second line portion in the first direction. the first contact plug has a bottom surface higher than a bottom surface of the first and second wiring lines. the upper surface of the first head hammer pattern contacts an insulation material.
Inventor(s): Donghoon KWON of Suwon-si (KR) for samsung electronics co., ltd., Yanghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Jonghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H10B12/00
CPC Code(s): H01L23/5283
Abstract: a wiring structure includes a substrate; a lower insulating layer on the substrate; a lower wiring structure extending in a vertical direction and passing through the lower insulating layer; a spacer surrounding a side wall of the lower wiring structure; a capping insulating layer on the lower insulating layer; and a via structure extending in the vertical direction and passing through the capping insulating layer, wherein the via structure overlaps the lower wiring structure and the spacer in the vertical direction, and the via structure includes a protruding portion extending in the vertical direction and passing through at least a portion of the spacer.
Inventor(s): Seungju Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528
CPC Code(s): H01L23/5286
Abstract: a semiconductor device includes a plurality of logic cells disposed in a first direction, a plurality of filler cells disposed in the first direction, and a power rail configured to apply a voltage to the logic cells and the filler cells, wherein the power rail extending in the first direction and electrically connected to the plurality of logic cells, and a reinforcement pattern disposed in at least one of the plurality of filler cells and electrically connected to the power rail, wherein the reinforcement pattern is electrically connected to the power rail at a plurality of distinct points.
Inventor(s): Eunyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonwoong CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Buseo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kkotchorong PARK of Suwon-si (KR) for samsung electronics co., ltd., Seulgi BAE of Suwon-si (KR) for samsung electronics co., ltd., Uisuk JUNG of Suwon-si (KR) for samsung electronics co., ltd., Dong-Chan LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/532, H01L21/768, H01L23/528
CPC Code(s): H01L23/53223
Abstract: the described technology relates generally to a material for a metal line in a semiconductor device including an alloy including aluminum as a main material, copper, and an element x, wherein the element x has 1) a coefficient of thermal expansion (cte) of greater than about 0.55 ppm/k and less than about 5 ppm/k, 2) a melting point (mp) of greater than about 3000� c., and 3) electronegativity of greater than about 2.2, a metal line in a semiconductor device including the alloy, and a method of forming a metal line in a semiconductor device.
Inventor(s): Suin Kim of Suwon-si (KR) for samsung electronics co., ltd., Insub Kwak of Suwon-si (KR) for samsung electronics co., ltd., Hanhong Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungki Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/552, G06F1/18, H01L23/495, H01L23/528, H01L25/18, H05K9/00, H10B80/00
CPC Code(s): H01L23/552
Abstract: a solid state drive apparatus includes a case including an upper wall and a lower wall, a substrate in the case and including a plurality of first connection pads in or on a first surface of the substrate facing the upper wall of the case, a first semiconductor chip on the first surface of the substrate, and a first shielding structure electrically connecting the upper wall of the case to the plurality of first connection pads, wherein the first shielding structure includes a plurality of first unit shielding structures surrounding the first semiconductor chip and spaced apart from each other with gaps therebetween, and wherein each of the plurality of first unit shielding structures includes an elastic body.
20240194616.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyoungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Anthony Dongick LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyungmin KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Gukhee KIM of Suwon-si (KR) for samsung electronics co., ltd., Beomjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Sangcheol NA of Suwon-si (KR) for samsung electronics co., ltd., Myeonggyoon CHAE of Suwon-si (KR) for samsung electronics co., ltd., Seungseok HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/58, H01L23/00, H01L23/48
CPC Code(s): H01L23/585
Abstract: a semiconductor device includes a semiconductor substrate having a first surface and a second surface facing the first surface and including, in a plan view, a main chip region and a sealing region surrounding the main chip region, a front wiring layer on the first surface of the semiconductor substrate and including a front wiring structure, a back wiring layer on the second surface of the semiconductor substrate and including a power wiring structure, a front ring structure in the front wiring layer of the sealing region, and a back ring structure in the back wiring layer of the sealing region.
Inventor(s): Hyeonjeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jimin Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48, H01L23/522, H01L25/065
CPC Code(s): H01L24/06
Abstract: a semiconductor chip includes a semiconductor substrate including an active surface and an inactive surface facing the active surface, a multi wiring layer arranged on the active surface of the semiconductor substrate, and including a wiring structure having at least two layers and including a conductive wiring and a dummy wiring, a lower protection layer arranged on a front surface of the multi wiring layer, and including a conductive medium pad connected to the conductive wiring, a plurality of through vias configured to penetrate the semiconductor substrate, and including a plurality of power through vias, a plurality of signal through vias, and a plurality of dummy through vias; and a plurality of back side pads arranged on the inactive surface of the semiconductor substrate, and connected to the plurality of through vias, wherein the plurality of dummy through vias are connected to the wiring structure.
20240194626.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SOOJEOUNG PARK of Hwaseong-si (KR) for samsung electronics co., ltd., HEESEOK LEE of Suwon-si (KR) for samsung electronics co., ltd., HEI SEUNG KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/538
CPC Code(s): H01L24/09
Abstract: a semiconductor package includes a redistribution layer and a semiconductor chip provided on the redistribution layer having a first surface and a second surface opposite to the first surface. the semiconductor chip includes a first chip pad and a second chip pad which are exposed at the first surface. the semiconductor package further includes a capacitor chip disposed between the first surface and the redistribution layer and including a capacitor chip pad connected to the first chip pad, an insulating layer covering the first surface and the capacitor chip, and a conductive post being in contact with the second chip pad and penetrating the insulating layer so as to be connected to the redistribution layer. the conductive post may be spaced apart from the capacitor chip.
Inventor(s): Seungmin Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/48, H01L21/56, H01L23/13, H01L23/31, H01L23/498, H01L23/538, H01L25/00, H01L25/10
CPC Code(s): H01L24/20
Abstract: a semiconductor device may include a seed structure on a complex structure. the seed structure may include a first barrier layer, a first seed layer on the first barrier layer, a second barrier layer on the first seed layer, and a second seed layer on the second barrier layer. the second barrier layer may contact a side surface of at least one of the first barrier layer and the first seed layer. an electrode layer may be disposed on the seed structure.
20240194639.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sang Cheon PARK of Suwon-si (KR) for samsung electronics co., ltd., Chungsun Lee of Suwon-si (KR) for samsung electronics co., ltd., Soohwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Young Kun Jee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/538, H10B80/00
CPC Code(s): H01L25/0652
Abstract: provided is a semiconductor chip stack structure including a plurality of first semiconductor chip dies stacked in a vertical direction, and one or more second semiconductor chip dies between adjacent first semiconductor chip dies among the plurality of first semiconductor chip dies, wherein a thickness of each second semiconductor chip die of the one or more second semiconductor chip dies is greater than a thickness of each first semiconductor chip die of the plurality of first semiconductor chip dies in the vertical direction.
Inventor(s): SEONGHO YOON of Suwon-si (KR) for samsung electronics co., ltd., SANG SUB SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H10B80/00
CPC Code(s): H01L25/0652
Abstract: a substrate for a semiconductor package includes a semiconductor chip mounting region; a bonding terminal region including at least one bonding terminal; at least one plating line extending across the semiconductor chip mounting region; a plating line prohibition region at an opposite side of the bonding terminal region from the semiconductor chip mounting region; and a plating line removal region that is between the bonding terminal region and the semiconductor chip mounting region and is free of a portion of the plating line so that each of the at least one bonding terminal is electrically isolated.
Inventor(s): Chi Woo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong HWANG of Suwon-si (KR) for samsung electronics co., ltd., Mi Hyae PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/528, H01L23/538
CPC Code(s): H01L25/0652
Abstract: disclosed are semiconductor packages and fabrication methods thereof. the semiconductor package includes a substrate, a first semiconductor chip and a second semiconductor chip that are mounted on the substrate, and a bridge chip between a first lateral surface of the first semiconductor chip and a second lateral surface of the second semiconductor chip. the first semiconductor chip and the second semiconductor chip are electrically connected through the bridge chip. the first semiconductor chip includes a first chip pad on the first lateral surface. the bridge chip includes a first connection pad on a first surface of the bridge chip. the first lateral surface of the first semiconductor chip and the first surface of the bridge chip are in contact with each other. the first chip pad and the first connection pad include a same material and are bonded to each other to constitute an integral piece formed.
20240194642.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungmock HA of Suwon-si (KR) for samsung electronics co., ltd., Hyunggyun NOH of Suwon-si (KR) for samsung electronics co., ltd., Gunhee BAE of Suwon-si (KR) for samsung electronics co., ltd., Jinsoo BAE of Suwon-si (KR) for samsung electronics co., ltd., Iljoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/522
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a lower chip. a chip stacked structure is arranged on the lower chip. the chip stacked structure includes a plurality of upper chips. an underfill layer is disposed between the lower chip and the chip stacked structure and between the plurality of upper chips. a molding layer surrounds the underfill layer and the chip stacked structure. the lower chip has at least one lower trench positioned on an upper surface of the lower chip. at least one of the plurality of upper chips has at least one upper trench on an upper surface of the at least one of the plurality of upper chips.
Inventor(s): Youngdeuk KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes: a first semiconductor chip including a first substrate, first through electrodes, first signal bonding pads electrically connected to the first through electrodes, and first dummy bonding pads electrically insulated from the first through electrodes, wherein the first through electrodes penetrate the first substrate; a second semiconductor chip stacked on the first semiconductor chip and including a second substrate and a plurality of second chip pads on the second substrate and respectively corresponding to the first signal bonding pads and the first dummy bonding pads; first conductive bumps between the first signal bonding pads and the corresponding second chip pads; and second conductive bumps between the first dummy bonding pads and the corresponding second chip pads, wherein the first conductive bumps include a signal bump pad and a first solder bump, and the second conductive bumps include a thermal bump pad and a second solder bump.
20240194648.STACKED SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dawoon Jung of Suwon-si (KR) for samsung electronics co., ltd., Seungduk Baek of Suwon-si (KR) for samsung electronics co., ltd., Donghun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H10B80/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a base structure and a plurality of semiconductor chips disposed on the base structure. each of the plurality of semiconductor chips has a chip region. the plurality of semiconductor chips are stacked in a vertical direction such that chip regions at least partially overlap each other. in the stack of the plurality of semiconductor chips, each of the plurality of semiconductor chips has a first width in a first direction and a second width in a second direction. the plurality of semiconductor chips include a first semiconductor chip and a second semiconductor chip, having scribe regions on opposite sides of each of the chip regions. a first width of the first semiconductor chip is greater than a first width of the second semiconductor chip.
20240194704.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung Joon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14614
Abstract: an image sensor includes a substrate including first and second surfaces opposite to each other in a first direction; pixels each including a photoelectric conversion area in the substrate; and a transfer gate electrode overlapping the photoelectric conversion area of one pixel of the plurality of pixels in the first direction. the substrate contains impurities of a first conductivity type. the photoelectric conversion area contains impurities of a different second conductivity type. the transfer gate electrode includes first, second and third extensions extending from the first surface into the substrate and having respective a first, second, and third depths. the first depth is larger than each of the second and third depths. a bottom surface of the first extension is in the photoelectric conversion area. each of the bottom surfaces of the second and third extensions is spaced apart from the photoelectric conversion area in the first direction.
20240194713.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangin BAE of Suwon-si (KR) for samsung electronics co., ltd., YUN KI LEE of Suwon-si (KR) for samsung electronics co., ltd., HYEYEON PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14627
Abstract: disclosed is an image sensor comprising a first substrate including pixel sections each of which includes a photoelectric conversion region; a plurality of color filters on the pixel sections and on a first surface of the first substrate, and a plurality of microlenses on the color filters. an array of the microlenses includes a repetitive periodic structure. the periodic structure includes a first microlens, a second microlens, and a third microlens that are sequentially arranged adjacent to each other along a first direction. a first spacing in the first direction between the first and second microlenses is substantially the same as a second spacing in the first direction between the second and third microlenses. a first pitch in the first direction between the first and second microlenses is different from a second pitch in the first direction between the second and third microlenses.
20240194717.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaekyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Changyong UM of Suwon-si (KR) for samsung electronics co., ltd., Dongseok CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14636
Abstract: an image sensor includes a photoelectric conversion element in a first semiconductor substrate, a second semiconductor substrate on the first semiconductor substrate, a source follower transistor on the second semiconductor substrate, and a through-plug penetrating the second semiconductor substrate. the through-plug electrically connects the photoelectric conversion element to the source follower transistor. a source terminal of the source follower transistor is electrically connected to the second semiconductor substrate.
Inventor(s): Jae Young CHOI of Suwon-si (KR) for samsung electronics co., ltd., Mincheol OH of Suwon-si (KR) for samsung electronics co., ltd., Wooseok KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L23/48, H01L27/092, H01L29/08, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device includes an active pattern on a substrate, source/drain patterns on the active pattern, channel patterns on the active pattern and connected to the source/drain patterns each including stacked semiconductor patterns, gate electrodes on the channel patterns and extending in parallel to each other in a first direction, and a power line adjacent to the active pattern. the power line extends in a second direction. the active pattern includes a first region having a first width, a second region having a second width, and a third region between the first and second regions. the first region has a first sidewall extending in the second direction. the second region has a second sidewall extending in the second direction. the third region has a recessed sidewall that connects the first and second sidewalls. the recessed sidewall is recessed toward the power line.
20240194752.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Woo Kyung YOU of Suwon-si (KR) for samsung electronics co., ltd., Sang Koo KANG of Suwon-si (KR) for samsung electronics co., ltd., Jun Chae LEE of Suwon-si (KR) for samsung electronics co., ltd., Koung Min RYU of Suwon-si (KR) for samsung electronics co., ltd., Woo Jin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/40, H01L29/423, H01L29/775, H01L29/78
CPC Code(s): H01L29/41791
Abstract: a semiconductor device includes a substrate, an active pattern disposed on the substrate and extending in a first direction, gate electrodes covering the active pattern and extending in a second direction, a gate spacer disposed on a sidewall of each of the gate electrodes, a source/drain pattern disposed between adjacent ones of the gate electrodes, an etch stop film disposed along a sidewall of the gate spacer and a profile of the source/drain pattern, an interlayer insulating film disposed between the adjacent ones of the gate electrodes with a contact trench exposing the source/drain pattern defined therein, a liner film disposed on an outer sidewall of the contact trench, and a source/drain contact disposed on the liner film and filling the contact trench, in which the source/drain contact is connected to the source/drain pattern. at least a portion of the liner film may be disposed in the source/drain pattern.
Inventor(s): Sanghyun JO of Suwon-si (KR) for samsung electronics co., ltd., Hyangsook LEE of Suwon-si (KR) for samsung electronics co., ltd., Eunha LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinseong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/51, H01L29/49, H01L29/78, H10B51/20, H10B53/30
CPC Code(s): H01L29/516
Abstract: provided as an electronic device and an electronic apparatus including the electronic device. the electronic device includes a conductive material layer, a mixed material layer covering the conductive material layer, and an electrode layer covering the mixed material layer. the mixed material layer includes an orthorhombic crystal phase and a tetragonal crystal phase mixed therein such that a ferroelectric material and an anti-ferroelectric material coexist therein.
Inventor(s): Gilhwan Son of Suwon-si (KR) for samsung electronics co., ltd., Taegon Kim of Suwon-si (KR) for samsung electronics co., ltd., Sihyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihye Yi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L21/8234, H01L27/088, H01L29/20, H01L29/78
CPC Code(s): H01L29/66795
Abstract: a method of manufacturing an integrated circuit device includes forming a preliminary channel stack, which includes sacrificial layers and channel layers, on a substrate, forming a preliminary channel pattern and a fin-type active region by removing a portion of the preliminary channel stack and a portion of the substrate to define a buried trench, forming a sacrificial buried layer in the buried trench, forming a source/drain region on the fin-type active region, forming, on the sacrificial buried layer, a power via electrically connected to the source/drain region, removing a portion of the substrate to expose a bottom surface of the sacrificial buried layer, removing the sacrificial buried layer and forming, in the buried trench, a backside buried wiring layer connected to the power via, and forming a backside wiring structure electrically connected to the backside buried wiring layer.
20240194786.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong Suk SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jung Taek KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun-Kwan YU of Suwon-si (KR) for samsung electronics co., ltd., Seok Hoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Pan Kwi PARK of Suwon-si (KR) for samsung electronics co., ltd., Seo Jin JEONG of Suwon-si (KR) for samsung electronics co., ltd., Nam Kyu CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L29/08, H01L29/423, H01L29/66, H01L29/786
CPC Code(s): H01L29/7855
Abstract: there is provided a semiconductor device capable of improving performance and reliability of an element. the semiconductor device includes an active pattern extending in a first direction, and a plurality of gate structures spaced apart from each other in the first direction on the active pattern. each gate structure comprises a gate electrode extending in a second direction and a gate spacer on a sidewall of the gate electrode and a source/drain pattern disposed between adjacent gate structures. the gate structure comprises a semiconductor liner layer and a semiconductor filling layer on the semiconductor liner layer, wherein the semiconductor liner layer and the semiconductor filling layer are formed of silicon-germanium. the semiconductor filling layer comprises an upper portion protruding in a third direction beyond an upper surface of the active pattern. a maximum width of the upper portion of the semiconductor filling layer in the first direction is greater than a width of the semiconductor filling layer in the first direction on the upper surface of the active pattern. the semiconductor liner layer comprises an outer surface in contact with the active pattern and an inner surface facing the semiconductor filling layer. in a plan view, the inner surface of the semiconductor liner layer comprises a concave region.
20240194789.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jung Taek Kim of Yongin-si (KR) for samsung electronics co., ltd., Seok Hoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Pan Kwi Park of Incheon (KR) for samsung electronics co., ltd., Moon Seung Yang of Hwaseong-si (KR) for samsung electronics co., ltd., Seo Jin Jeong of Incheon (KR) for samsung electronics co., ltd., Min-Hee Choi of Suwon-si (KR) for samsung electronics co., ltd., Ryong Ha of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L29/06, H01L29/423
CPC Code(s): H01L29/78618
Abstract: a semiconductor device includes a multi-channel active pattern, a plurality of gate structures on the multi-channel active pattern and spaced apart from each other in a first direction, the plurality of gate structures including a gate electrode that extends in a second direction different from the first direction, a source/drain recess between the adjacent gate structures, and a source/drain pattern on the multi-channel active pattern in the source/drain recess, wherein the source/drain pattern includes: a semiconductor liner layer including silicon-germanium and extending along the source/drain recess, a semiconductor filling layer including silicon-germanium on the semiconductor liner layer, and at least one or more semiconductor insertion layers between the semiconductor liner layer and the semiconductor filling layer, and wherein the at least one or more semiconductor insertion layers have a saddle structure.
Inventor(s): Eunhye KIM of Suwon-si (KR) for samsung electronics co., ltd., Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Yoonsuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungryong HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/58, H01L25/16
CPC Code(s): H01L33/58
Abstract: a display module includes a display substrate, a plurality of light emitting diodes (leds) provided on the substrate, an adhesive layer provided on a first surface of the substrate on which the plurality of leds are provided, and an optical film connected to the substrate by the adhesive layer and configured to increase luminous intensity by scattering light emitted by the plurality of leds.
Inventor(s): SoYeon KIM of Cambridge MA (US) for samsung electronics co., ltd., Andrea MAURANO of Boston MA (US) for samsung electronics co., ltd., WonSeok CHANG of Mountain View CA (US) for samsung electronics co., ltd., Ju LI of Weston MA (US) for samsung electronics co., ltd., Valentina LACIVITA of Cambridge MA (US) for samsung electronics co., ltd., James GIBSON of Cambridge MA (US) for samsung electronics co., ltd.
IPC Code(s): H01M4/40, H01M10/058
CPC Code(s): H01M4/405
Abstract: a metal battery including: a cathode; an anode; and an electrolyte between the cathode and the anode; wherein the anode includes a metal alloy including a plurality of elements and the metal alloy has a melting temperature lower than melting temperatures of each of the plurality of elements.
Inventor(s): Gidae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24
CPC Code(s): H01Q1/243
Abstract: an electronic device includes a support member and a lateral member extending from the support member and defining a side surface, a circuit board on the support member and including a camera spaced apart from the side surface, a signal-radiating antenna electrically connected to the circuit board, and a flexible circuit board electrically connecting the circuit board to the signal-radiating antenna and including a flexible area and a rigid area. the support member further defines an inclined surface between the side surface and the camera, on which the signal-radiating antenna is disposed, the inclined surface forming a first inclined angle with respect to one surface of the support member, and a flexible circuit board support surface adjacent to the first inclined surface along which a length of the flexible circuit board extends, the flexible circuit board support surface forming a second inclined angle with respect to one surface of the support member.
Inventor(s): Artem Rudolfovitch VILENSKIY of Moscow (RU) for samsung electronics co., ltd., Elena Aleksandrovna SHEPELEVA of Moscow (RU) for samsung electronics co., ltd., Gennadiy Aleksandrovich EVTYUSHKIN of Moscow (RU) for samsung electronics co., ltd., Anton Sergeevich LUKYANOV of Moscow (RU) for samsung electronics co., ltd.
IPC Code(s): H01Q25/00, H01Q21/06
CPC Code(s): H01Q25/001
Abstract: an antenna array element with dual polarization is provided. the antenna array element includes a multilayer printed circuit board (pcb), a first patch placed on an inner layer of the multilayer pcb, a second patch placed on an upper layer of the multilayer pcb and coupled by electromagnetic field with the first patch, two u slots placed orthogonally on the multilayer pcb layer under the first patch, feedlines placed on one pcb layer under the u slots orthogonally to each other and configured to excite the u slots, ad a plurality of electromagnetic band gap (ebg) elements located in a boundary area of the antenna array element.
Inventor(s): Jaejin KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwoong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Heejun KANG of Suwon-si (KR) for samsung electronics co., ltd., Namju PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/12, H02J50/40, H02J50/80, H05B1/02, H05B6/06, H05B6/12
CPC Code(s): H02J50/12
Abstract: a wireless power transmission device is provided. the wireless power transmission device includes a wireless power transmitter configured to wirelessly transmit power to a cooking appliance, a communication interface configured to establish a wireless communication connection to the cooking appliance, memory storing one or more programs including instructions and transmission frequency information for each of a plurality of cooking appliances including a load, and one or more processors, wherein instructions, when executed by the one or more processors, cause the wireless power transmission device to control the communication interface to receive identification information related to a type of the cooking appliance, determine a limited frequency corresponding to the identification information, based on the transmission frequency information, and set an operation frequency range of first power being transmitted to the cooking appliance in a low-load state in which an operation of a main load of the cooking appliance is stopped, based on the limited frequency.
Inventor(s): Wooram LEE of Suwon-si (KR) for samsung electronics co., ltd., Yusu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/60, G01R29/08, G06V40/10, H02J50/12, H02J50/80
CPC Code(s): H02J50/60
Abstract: a power receiving device comprises: a camera; a coil configured to resonate at a designated frequency; a power receiving circuit configured to rectify a power signal received from a power transmitting device through the coil; a wireless communication circuit for wireless communication with the power transmitting device; at least one processor, comprising processing circuitry, electrically connected to the camera, the coil, the power receiving circuit, and the wireless communication circuit; and a memory connected to the processor. at least one processor, individually and/or collectively, is configured to: receive identification information for identifying the exterior of the power transmitting device from the power transmitting device through the wireless communication circuit; receive first notification information to notify the proximity of an object from the power transmitting device through the wireless communication circuit; identifying a first object corresponding to the power transmitting device, based on the identification information, from an image received from the camera, in response to receiving the first notification information; determine whether a second object corresponding to a human body exists in the image; and transmit second notification information indicating that the approaching object is a human body, to the power transmitting device through the wireless communication circuit, based on the first object being identified from the image, and based on the second object being deemed to exist in the image.
Inventor(s): JINOOK JUNG of Suwon-si (KR) for samsung electronics co., ltd., JAEWOO PARK of Suwon-si (KR) for samsung electronics co., ltd., MYOUNGBO KWAK of Suwon-si (KR) for samsung electronics co., ltd., JUNGHWAN CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K17/30, H03K17/687, H03K19/0185
CPC Code(s): H03K17/302
Abstract: a power gating circuit including: a power gating transistor; a gate bias generating circuit configured to provide a gate bias control signal to the gate of the power gating transistor; and a body bias generating circuit configured to provide a body bias control signal to the body of the power gating transistor, wherein when the power gating transistor is turned on, the gate bias generating circuit provides the gate bias control signal having a positive voltage level and the body bias generating circuit provides the body bias control signal having the positive voltage level, and when the power gating transistor is turned off, the gate bias generating circuit provides the gate bias control signal having a ground voltage level or a negative voltage level, and the body bias generating circuit provides the body bias control signal having the ground voltage level or the negative voltage level.
Inventor(s): Junhwa OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Yuntae PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Sanghyuk WI of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungi JEONG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/04
CPC Code(s): H04B7/04013
Abstract: a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a reconfigurable intelligent surface (ris) including a plurality of unit cells in a wireless communication system includes a first pattern included in a top layer of a unit cell included in the ris, a second pattern included in a bottom layer of the unit cell included in the ris, and at least one switch configured to electrically ground or short the first pattern and the second pattern in response to a command for determining whether the unit cell included in the ris operates as a transmissive ris or a reflective ris.
Inventor(s): Federico PENNA of San Diego CA (US) for samsung electronics co., ltd., Hyukjoon KWON of San Diego CA (US) for samsung electronics co., ltd., Dongwoon BAI of San Diego CA (US) for samsung electronics co., ltd., Jaein KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Junho LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Hui Won JE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04B7/06, H04L5/00
CPC Code(s): H04B7/0456
Abstract: the disclosure provides methods of providing implicit channel state information (csi) feedback from a user equipment (ue). a method performed by a first device includes determining a feedback parameter selection decision metric; selecting a particular method from a plurality of methods, based on the feedback parameter selection decision metric; determining, based at least in part on the particular method, and based on a configuration of an associated second device, one or more values associated with precoding; and transmitting the one or more values to the second device.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Dhivagar BASKARAN of Bangalore (IN) for samsung electronics co., ltd., Jinyoung OH of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0404, H04L5/00, H04W52/24
CPC Code(s): H04B7/06952
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure related generally to wireless communication system and, more specifically, the present disclosure relates to default beam behaviour of pusch.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L1/1829, H04W72/20, H04W72/56
CPC Code(s): H04L1/1861
Abstract: an harq feedback method and a ue performing the harq feedback method are provided. the harq feedback method includes transmitting a physical sidelink control channel (pscch)/physical sidelink shared channel (pssch) to a second ue, and receiving a physical sidelink feedback channel (psfch) transmitted by the second ue performing the harq feedback according to a decoding result of the pscch/pssch.
Inventor(s): Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Younsun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunseok RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Jonghyun BANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/1867, H04L5/00
CPC Code(s): H04L1/1887
Abstract: the disclosure relates to a method performed by a terminal in a wireless communication system, including identifying a first physical downlink control channel (pdcch) that schedules a first physical downlink shared channel (pdsch), identifying a second pdcch that schedules a second pdsch, and receiving the first pdsch and the second pdsch that are at least partially overlapped at least in time, in case that the first pdcch scheduling the first pdsch and the second pdcch scheduling the second pdsch are associated with different control resource sets (coresets).
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B7/0417, H04B7/06, H04W72/21, H04W72/23
CPC Code(s): H04L5/0057
Abstract: a method of a user equipment (ue) in a wireless communication system is provided. the method comprises: receiving, from at least one base station (bs) of a group of (n) bss, channel state information (csi) configuration information including a number of uplink control information (uci) parts for a csi reporting; identifying the number of uci parts for the csi reporting; determining a csi report based on the identified number of uci parts; identifying one or more bss in the group of (n) bss to transmit the determined csi report; and transmitting, to the one or more identified bss, via an uplink channel, a uci including the determined csi report, wherein the uci includes the identified number of uci parts each of which includes a part of the determined csi report.
Inventor(s): Kyeongyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Won Jun KIM of Seoul (KR) for samsung electronics co., ltd., Jin Hong KIM of Seoul (KR) for samsung electronics co., ltd., Byong Hyo SHIM of Seoul (KR) for samsung electronics co., ltd., Yong Jun AN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/02
CPC Code(s): H04L25/0254
Abstract: a device and a method for channel estimation using a short/long-term memory network in a millimeter-wave (mmwave) communication system are provided. the channel estimation method includes the operations of inputting a received pilot signal of a time slot to a long short-term memory network, extracting a time-varying channel feature embedding vector by estimating a change state of a channel by using the received pilot signal of the time slot as an input in the long short-term memory network, estimating a parameter of a channel model by using the time-varying channel feature embedding vector as an input in a fully connected network, and estimating a channel for the received pilot signal of the time slot, using the parameter of the channel model.
Inventor(s): Deepanshu GAUTAM of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L41/5025, H04W24/02, H04W84/04
CPC Code(s): H04L41/5025
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure relates to a method and an assurance closed control loop (accl) system () for providing wireless communication network assurance. the method comprises receiving one or more assurance goals targeted for at least one of, one or more target locations and one or more target user equipments (ues). the one or more assurance goals are configured for an accl. further, the method comprises monitoring a wireless communication network () based on the one or more assurance goals configured for the accl. furthermore, the method comprises determining whether the one or more assurance goals are complied based on the monitoring.
Inventor(s): Sapan Pramodkumar SHAH of Bangalore (IN) for samsung electronics co., ltd., Nishant GUPTA of Bangalore (IN) for samsung electronics co., ltd., Narendranath Durga TANGUDU of Bangalore (IN) for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd., Deepanshu GAUTAM of Bangalore (IN) for samsung electronics co., ltd., Varadarajan SEENIVASAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L41/5067, H04L41/50, H04L41/5009, H04W24/08
CPC Code(s): H04L41/5067
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide a method for application service management using a client feedback in a wireless network (). the method includes receiving, by an asm server () in the wireless network (), a val service experience report having information about a val server () and a plurality of information elements by an asm client device () in the wireless network (). further the method includes storing, by the asm server (), the val service experience report. further the method includes analyzing, by the asm server (), the val service experience report received from the asm client device () and val service experience reports received from other asm client devices () in the wireless network (). further the method includes performing, by the asm server (), at least one corrective action based on the analysis.
Inventor(s): Gidae KIM of Suwon-si (KR) for samsung electronics co., ltd., Moohyun BAEK of Suwon-si (KR) for samsung electronics co., ltd., Minsung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongchul CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H05K1/03, H05K3/36
CPC Code(s): H04M1/0216
Abstract: an electronic device is provided. the electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (fpcb) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.
Inventor(s): Sungho CHAE of Suwon-si (KR) for samsung electronics co., ltd., Eunseok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31
CPC Code(s): H04N9/3185
Abstract: an electronic apparatus is disclosed. the electronic apparatus comprises: an acceleration sensor; a distance sensor; an image projector; and at least one processor connected to the acceleration sensor, the distance sensor, and the image projector to control the electronic apparatus, wherein the processor controls the image projector to project an image onto a projection surface, acquires vertical distortion information corresponding to a projected image on the basis of slope information of the electronic apparatus acquired by the acceleration sensor and distance information to the projection surface acquired by the distance sensor, acquires vertical keystone correction information on the basis of the vertical distortion information, when a first user command for keystone correction is received, performs keystone correction for the image on the basis of vertical keystone correction information corresponding to the first user command and the acquired vertical keystone correction information, and controls the image projector to project a keystone-corrected image.
Inventor(s): Pyoungyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sooin KANG of Suwon-si (KR) for samsung electronics co., ltd., Haekwang LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/422, H04N7/025
CPC Code(s): H04N21/42221
Abstract: provided is an electronic apparatus comprising: a communication interface including communication circuitry; a memory; and at least one processor connected to the communication interface and the memory, and configured to control the electronic apparatus, wherein the processor is configured to: control the communication interface to transmit a channel signal to another electronic apparatus, control the communication interface to transmit an approval signal to the another electronic apparatus, based on the first cancellation signal being received from a remote control device through the communication interface, control the communication interface to transmit a second cancellation signal corresponding to the first cancellation signal to the another electronic apparatus, and based on the number of inputs of the first cancellation signal after transmitting the channel signal and the approval signal being a specified number of times or more, store information indicating that no approval signal is transmitted after transmitting the channel signal in the memory as usage pattern information.
Inventor(s): Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhun BAE of Suwon-si (KR) for samsung electronics co., ltd., Seokhyun YOON of Suwon-si (KR) for samsung electronics co., ltd., Taehwa LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R3/00, G06F3/16
CPC Code(s): H04R3/00
Abstract: an electronic apparatus including a communication interface; and a processor configured to obtain a first signal in an enhanced audio return channel (earc) format based on a predetermined parameter, control the communication interface to transmit the obtained first signal to an external speaker, change the parameter based on receiving, through the communication interface, a first error signal corresponding to the first signal transmitted from the external speaker, obtain a second signal in the earc format based on the changed parameter, and control the communication interface to transmit the obtained second signal to the external speaker.
Inventor(s): Allan Devantier of Newhall CA (US) for samsung electronics co., ltd., Sunil Bharitkar of Stevenson Ranch CA (US) for samsung electronics co., ltd., Seongnam Oh of Irvine CA (US) for samsung electronics co., ltd., Carlos Tejeda Ocampo of Tuxtla Gutiérrez (MX) for samsung electronics co., ltd.
IPC Code(s): H04S7/00, G06V20/40
CPC Code(s): H04S7/305
Abstract: one embodiment provides a method of audio upmixing comprising performing video scene analysis by segmenting visual objects from video frames of a video, and performing audio analysis by extracting audio signals from an audio corresponding to the video. the method further comprises determining whether any of the audio signals correspond to any of the visual objects, and estimating a video-based trajectory of a visual object if the visual object is in motion and transitions from on-screen to off-screen, or vice versa, during the video. the method further comprises positioning an audio trajectory of an audio signal from at least one speaker associated with the display to at least one other speaker associated with providing surround sound. the audio trajectory is automatically matched with the video. the audio signal is delivered to the at least one speaker and the at least one other speaker for audio reproduction during the presentation.
Inventor(s): Yunhwa SEO of Suwon-si (KR) for samsung electronics co., ltd., Myeongwoo KOO of Suwon-si (KR) for samsung electronics co., ltd., Sunggyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunggyu YIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/021, G01S5/00, G01S5/02
CPC Code(s): H04W4/021
Abstract: an electronic device is provided. the electronic device includes one or more application processor, memory electrically coupled with the one or more application processor, and a wireless communication chipset which supports a short-range communication and is electrically coupled to the one or more application processor, wherein the wireless communication chipset is configured to receive an advertising packet broadcast by a first external device with a specified interval, and wherein the memory stores instructions that, when executed by the one or more application processor, cause the electronic device to obtain first locations of the electronic device, measured in response to receiving a plurality of first advertising packets by the wireless communication chipset while the first external device is located in a first point, and determine a first geofence corresponding to the first external device located in the first point, based on at least some of the obtained first locations.
Inventor(s): Lalith KUMAR of Suwon-si (KR) for samsung electronics co., ltd., Danish Ehsan HASHMI of Suwon-si (KR) for samsung electronics co., ltd., Govind Irappa UTTUR of Suwon-si (KR) for samsung electronics co., ltd., Utsav SINHA of Suwon-si (KR) for samsung electronics co., ltd., Vijay Kumar MISHRA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/90, H04W36/08
CPC Code(s): H04W4/90
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure is for handling operation in standalone non-public network (snpn). embodiments herein disclose methods for handling an operation in a standalone non-public network (snpn) by a ue. the method includes determining that a dialed number is an emergency number. further, the method includes determining a current snpn does not support an emergency service for the dialed number. further, the method includes performing a deregistration procedure upon determining that the current snpn does not support the emergency service for the dialed number. further, the method includes selecting at least one of a cell and a public land mobile network (plmn) that provides the emergency service to the ue after performing the deregistration procedure.
Inventor(s): Hyunjeong KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/00, H04W72/566
CPC Code(s): H04W8/005
Abstract: the disclosure relates to a method performed by a user equipment (ue) for transmitting a sidelink relay discovery message in a wireless communication system, the method comprising identifying a priority of a logical channel corresponding to the sidelink relay discovery message, configuring a medium access control protocol data unit (mac pdu) including the sidelink relay discovery message, based on the identified priority, and transmitting the mac pdu, wherein the mac pdu is configured not to comprise a general sidelink message.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd., Himke VAN DER VELDE of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W8/20, H04L1/1822
CPC Code(s): H04W8/205
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide method for link management for musim ue () performing coordinated gaps. in another embodiment, the method includes sending ue assistance information message comprising at least one requested switching gap release by a gap index to first network apparatus () in response to determining that the switching gap is not required, and receiving a musim gap configuration comprising release of the switching gap with the gap index from the first network apparatus (). in another embodiment, the method includes sending a ue assistance information message comprising a preferred rrc state to the first network apparatus () in response to determining that the rrc connection release or rrc connection release with suspend configuration is required, and receiving one of a rrc connection release and a rrc connection release with suspend configuration, wherein the preferred rrc state is one of an idle state, an inactive state, and a non-connected state.
Inventor(s): Mayank MITTAL of Bangalore (IN) for samsung electronics co., ltd., Arijit Sen of Bangalore (IN) for samsung electronics co., ltd., Pratibha Kattemane Satyaganapati of Bangalore (IN) for samsung electronics co., ltd., Subhrodip Mazumdar of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W8/24, H04W8/20
CPC Code(s): H04W8/24
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for controlling standalone access (sa) capability performed by a terminal, includes: detecting that at least one subscriber identity module (sim) card is available in the terminal; determining whether the at least one sim card supports sa capability available in the terminal; enabling the sa capability in the terminal based on determining that the at least one sim card supports the sa capability; and disabling the sa capability in the terminal based on determining that the at least one sim card does not support the sa capability.
Inventor(s): Neha SHARMA of Bangalore (IN) for samsung electronics co., ltd., Ramesh Chandra VUPPALA of Bangalore (IN) for samsung electronics co., ltd., Anshuman NIGAM of Bangalore (IN) for samsung electronics co., ltd., Dongmyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun JE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/03, H04W8/22, H04W12/72, H04W76/30
CPC Code(s): H04W12/03
Abstract: the disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting a higher data transmission rate. a method of ue for camping on a network entity is provided. the method includes receiving, by the ue, an information block from one of one or more network entities, determining, by the ue, if the indicated capability of the network entity or the corresponding security level are compliant with capability and security level requirement of the ue for camping, and camping by the ue, on the network entity when the indicated capability or the corresponding security level supported by the network entity is determined to be compliant with the capability and the security level requirement of the ue using the compliant type of cryptography technique.
Inventor(s): Xiaoning MA of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Yi WANG of Beijing (CN) for samsung electronics co., ltd., Bin WANG of Beijing (CN) for samsung electronics co., ltd., Donmyoung LEE of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04L43/0876, H04W92/20
CPC Code(s): H04W24/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method and device for self-configuration and self-optimization. there is disclosed a method performed by a first node in a wireless communication network, comprising: receiving, by the first node, a first message related to information on an unlicensed spectrum from a second node; performing, by the first node, self-optimization according to the information on the unlicensed spectrum.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04L5/00, H04W72/0446, H04W72/542
CPC Code(s): H04W24/08
Abstract: radio link monitoring in full-duplex systems. a method includes receiving first information for a first set of radio link monitoring (rlm) reference signals (rss) corresponding to a first subset of slots on a cell and receiving second information for a second set of rlm rss corresponding to a second subset of slots on the cell. the method further includes determining a radio link failure for the first subset of slots when a reception quality of any of the first set of rlm rss is below a reception quality threshold for a time period and determining a radio link failure for the second subset of slots when a reception quality of any of the second set of rlm rss is below a reception quality threshold for a time period. the second subset of slots includes time-domain resources indicated for simultaneous transmission and reception and the first subset of slots do not.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/08
CPC Code(s): H04W24/08
Abstract: a method includes receiving information for a set of radio link monitoring (rlm) reference signals (rss) corresponding to a first subset of slots on a cell and a first set of parameters associated with an evaluation of the set of rlm rss and receiving the set of rlm rss. the method further includes determining a first reception quality for a rlm rs from the first set of rlm rss; determining, based on the first reception quality and an adjustment value, a second reception quality for a second subset of slots from the set of slots; and determining a radio link failure for the second subset of slots when the second reception quality is below a reception quality threshold for a time period. the second subset of slots includes time-domain resources indicated for simultaneous transmission and reception on the cell and slots from the first subset of slots does not.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04L5/00, H04W24/10
CPC Code(s): H04W24/08
Abstract: a method, performed by a user equipment (ue), for controlling activation of a cell group includes: receiving, from a base station, a radio resource control (rrc) message including configuration information indicating a number of temporary reference signals; receiving, from the base station, a medium access control (mac) control element (ce) indicating to activate a secondary cell (scell); receiving, from the base station, a temporary reference signal; based on the mac ce and the rrc message, measuring the temporary reference signal; and transmitting, to the base station, a measurement result regarding the temporary reference signal.
Inventor(s): Seungbeom JEONG of Suwon-si (KR) for samsung electronics co., ltd., Himke VAN DER VELDE of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W8/22, H04W76/20, H04W76/30
CPC Code(s): H04W24/10
Abstract: the present disclosure relates to a method and device that allow a user equipment (ue) to manage quality of experience (qoe) in a wireless communication system, and an operation method of the ue managing qoe in the wireless communication system may include establishing a radio resource control (rrc) connection with a base station, transmitting ue capability information to the base station, receiving, from the base station, logged qoe measurement configuration information generated based on the ue capability information, logging qoe measurement results based on the received logged qoe measurement configuration information, reporting availability of logged qoe data to the base station, receiving a qoe data retrieval request from the base station, and transmitting logged qoe measurement result data to the base station.
Inventor(s): Jungshin PARK of Seoul (KR) for samsung electronics co., ltd., Sangjun MOON of Seoul (KR) for samsung electronics co., ltd., Kisuk KWEON of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinsung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04L41/08, H04W36/02, H04W36/14, H04W88/08
CPC Code(s): H04W36/0005
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). the embodiments in the present disclosure allow to transfer remaining data between different base stations in a dual-registration interworking process, which provides terminal mobility between 4g and 5g networks without a data loss. further, it provides the terminal mobility with no data loss without changing 5g and 4g base station implementation through addition of a simple function of new equipment, such as smf and upf. further, it supports different qos and forwarding path units in the 5g/4g networks without changing 5g and 4g base station functions. further, it exempts additional function implementation costs for re-ordering in a terminal and a network through in-order delivery of packets to the terminal without changing the packet order during 4g-5g network movement.
Inventor(s): Jiwon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeonsoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00
CPC Code(s): H04W36/0007
Abstract: a device and a method for performing wireless communication based on a multicast mode in an electronic device are provided. the electronic device includes a communication circuit, a memory, and at least one processor, wherein the at least one processor may receive data from a first cell supporting the multimedia broadcast multicast service (mbms) through the communication circuit, based on a multicast mode, may detect a second cell, based on channel state information about the first cell, may perform a measurement report related to the second cell when the second cell is included in the mbms support list, and may restrict the measurement report related to the second cell when the second cell is included in the mbms nonsupport list.
Inventor(s): Kyungjoo SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W68/02
CPC Code(s): H04W36/0022
Abstract: the present disclosure relates to a 5g or pre-5g communication system for supporting a higher data transmission rate than a 4g communication system such as lte. a method for mobility/session/connection management by user equipment (ue) in a mobile communication system, according to an embodiment of the present disclosure, comprise the steps of: when receiving a paging from an access and mobility management function (amf) while registered with the amf, transmitting a service request message to the amf; receiving a service accept from the amf; and transmitting a protocol data unit (pdu) session modification request message to the amf, wherein a first timer may start when transmitting the service request message, and a second timer may start when transmitting the pdu session modification request message.
Inventor(s): Himke VAN DER VELDE of Staines (GB) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seungbeom JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08
CPC Code(s): H04W36/008355
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. in an embodiment, a method of performing minimising drive test (mdt) of a user equipment (ue) in a wireless communication system is provided. the method comprises: receiving, from a base station, a configuration including inter radio access technology (irat) frequencies; performing measurement on available irat frequencies based on the configuration; and logging the measurement results.
Inventor(s): TUSHAR VRIND of Bengaluru (IN) for samsung electronics co., ltd., LALIT KUMAR PATHAK of Bengaluru (IN) for samsung electronics co., ltd., SAMIR KUMAR MISHRA of Bengaluru (IN) for samsung electronics co., ltd., DEBABRATA DAS of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/00, H04W76/27, H04W84/06
CPC Code(s): H04W36/083
Abstract: a method of replacing a source aerial cell with a target aerial cell includes receiving a transfer request from the target aerial cell to transfer link related parameters between the source aerial cell and ue and link related parameters between the source aerial cell and a core network. the method further includes transmitting each of the link related parameters to the target aerial cell in response to the received transfer request and further notifying, via a notification message, a change in pcid of the source aerial cell to the ue. the method furthermore includes transmitting a cell switching request to the target aerial cell along with positioning information of the source aerial cell for a switchover of a communication operation with the ue and terrestrial cells served by the source aerial cell, and thereafter the target aerial cell moves to a hovering position indicated by the transmitted positioning information.
Inventor(s): Jonas SEDIN of Staines (GB) for samsung electronics co., ltd., Chadi KHIRALLAH of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W48/08
CPC Code(s): H04W48/08
Abstract: the disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, a first system information block (sib) associated with satellite assistance information, the first sib including first information on serving cell ephemeris and second information on a validity duration of the serving cell ephemeris, and receiving, from the base station, a second system information block (sib) associated with neighbor satellite information based on a first timer with a duration of the validity duration of the serving cell ephemeris and a second timer for an acquisition of the first sib before a radio link failure (rlf), the second sib including third information on neighbor cell ephemeris.
Inventor(s): Seshadri ELLURU of Bengaluru (IN) for samsung electronics co., ltd., Prasad Basavaraj DANDRA of Bangalore (IN) for samsung electronics co., ltd., Vijay Ganesh SURISETTY of Bangalore (IN) for samsung electronics co., ltd., Rajdeep KAUR of Bengaluru (IN) for samsung electronics co., ltd., Sameer Kumar MANDAL of Bengaluru (IN) for samsung electronics co., ltd., Siddhi Chandrashekhar MAYEKAR of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W48/16, H04W60/04, H04W84/04
CPC Code(s): H04W48/18
Abstract: a method for selecting a public land mobile network (plmn) in a wireless communication system by a user equipment (ue), the method includes detecting, by the ue, that the ue is operating in an interworking mode, triggering, by the ue, a manual scan in the interworking mode for acquiring a list of plmns in the wireless communication system, and causing, by the ue, a display to output the list of plmns in response to the triggering.
Inventor(s): Changsung LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Suhwook KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sooeun SONG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaehong YI of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyeondeok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/24, H04W24/02, H04W52/14, H04W74/04
CPC Code(s): H04W52/242
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a method and an apparatus are provided in a wireless communication system, in which, artificial intelligence (ai) model setup information for estimating ai-based uplink (ul) pathloss is received from a base station. the ai-based ul pathloss for an ul carrier is estimated based on the ai model setup information.
Inventor(s): Youngseok Jung of SUWON-SI (KR) for samsung electronics co., ltd., Inhyoung Kim of YONGIN-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/32, H04B7/06, H04W24/08, H04W52/24, H04W52/42
CPC Code(s): H04W52/325
Abstract: an operating method of a wireless communication device configured to perform wireless communication with a cell. the method involves identifying, from a downlink signal received from the cell, an electromagnetic field state associated with an antenna of the wireless communication device. a power compensation mode for compensating transmission power of a sounding reference signal is selected based on the identified electromagnetic field state. the transmission power of the sounding reference signal is compensated based on the selected power compensation mode. the sounding reference signal is transmitted with the compensated transmission power through the antenna to the cell.
Inventor(s): Youngyoon WOO of Suwon-si (KR) for samsung electronics co., ltd., Yunsilk PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00
CPC Code(s): H04W56/0045
Abstract: a method performed by a base station in a wireless communication system includes receiving, from a terminal configured with timing advance (ta), an uplink signal in an uplink period, according to a time division duplex (tdd) configuration, transmitting, through a transmission path of the base station to the terminal, an advance signal for a predetermined duration between an end point of receiving the uplink signal and a start point of a downlink period of the tdd configuration, the transmission path of the base station having a power amplifier as a transmission end, and transmitting, to the terminal, a downlink signal in the downlink period.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/00, H04W24/08, H04W72/044, H04W72/23, H04W76/28
CPC Code(s): H04W68/005
Abstract: in an exemplary embodiment, a method performed by a relay user equipment (ue) in a wireless communication system is provided. the method comprising: receiving, from a base station (bs), a paging configuration including at least one of a number of total paging frame, a number of paging occasion for a paging frame, an offset for paging frame, a first drx cycle of a remote ue, or paging search space; transmitting, to a remote ue, the paging configuration; receiving, from the remote ue, information related the remote ue including at least one of identity of the remote ue, paging identity of the remote ue or a second drx cycle of the remote ue; identifying a paging occasion of the remote ue based on the information related the remote ue and the paging configuration; and monitoring the paging occasion of the remote ue for receiving a paging message for the remote ue.
Inventor(s): Yue WANG of Staines (GB) for samsung electronics co., ltd., Junhyuk SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/04, H04W48/18, H04W84/04
CPC Code(s): H04W72/04
Abstract: a method of operating a telecommunication network, the network comprising at least one intelligent system and the network being configured in an o-ran architecture, wherein cell configuration is controlled by means of one or more cell control information elements, ies, facilitating control on a cell and/or slice level, wherein said control is effected via an e2 interface or an f1 interface.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L5/00, H04W72/21
CPC Code(s): H04W72/1268
Abstract: a user equipment (ue) apparatus for wireless communication with a base station is provided. the ue includes a transceiver and a processor. the processor is configured to transmit, to the base station, via the transceiver, at least one uplink (ul) data packet in a radio resource control (rrc) inactive state, and in response to a ul transmission failure, fall back to a random access channel (rach) transmission mode, and receive, from the base station, via the transceiver, a message indicating the ue to change from the rach transmission mode to a configured grant-based transmission mode.
Inventor(s): Euichang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seho MYUNG of Suwon-si (KR) for samsung electronics co., ltd., Suyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Suha YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/21, H04B7/0408, H04L41/0803, H04W72/044
CPC Code(s): H04W72/21
Abstract: disclosed are a communication technique for merging, with iot technology, a 5g communication system for supporting a data transmission rate higher than that of a 4g system; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail, security, and safety-related services, and the like) on the basis of 5g communication technology and iot-related technology. the present invention relates to a method and device for managing transmission beams of a terminal in a 5g system.
Inventor(s): Jaewon LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngbum KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyungjun CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04L5/00, H04W72/1268, H04W76/20
CPC Code(s): H04W72/232
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting higher data rates. disclosed is a method performed by a terminal in a wireless communication system, including receiving downlink control information (dci) from a base station, identifying whether the dci includes a dynamic waveform indicator, and in case that the dci includes a dynamic waveform indicator, transmitting, to the base station, an uplink signal through a physical uplink shared channel (pusch) based on an uplink waveform indicated by the dynamic waveform indicator.
20240196435.MULTI-BEAM LBT FOR NR-U AT 60 GHZ_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/0808, H04W16/14, H04W84/04
CPC Code(s): H04W74/0808
Abstract: a system and a method are disclosed for accessing a wireless medium for a nr-u deployed at 60 ghz. a directional cca sensing is performed on a set of multiple beams in the medium in which each beam is oriented in a different direction. it is determined whether at least one beam of is busy and, if so, a back-off timer is initialized. the back-off timer is decreased by a predetermined amount based on a determination that all beams of the set of multiple beams are idle. the back-off timer is repeatedly decreased the predetermined amount based on a determination that all beams of the set of multiple beams are idle until the back-off timer equals a predetermined amount. data is transmitted at least one beam of the set of multiple beams based on the back-off timer equaling the predetermined amount.
Inventor(s): Pravjyot Singh DEOGUN of Bangalore (IN) for samsung electronics co., ltd., Anil AGIWAL of Bangalore (IN) for samsung electronics co., ltd., Abhishek Kumar SINGH of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W24/08, H04W72/0446, H04W72/0453, H04W72/23, H04W72/50, H04W74/00, H04W74/0816, H04W76/11
CPC Code(s): H04W74/0841
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. accordingly the embodiments herein provides a method for handling a rar in a wireless communication system ().
Inventor(s): Youngsun JO of Suwon-si (KR) for samsung electronics co., ltd., Dohoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongkyu MIN of Suwon-si (KR) for samsung electronics co., ltd., Seoyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Yunoh CHI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K1/11, H05K1/14
CPC Code(s): H05K1/0219
Abstract: disclosed is an electronic device. the electronic device includes: a housing, a first board and a second board disposed in an interior of the housing, and an interposer electrically connecting the first board and the second board, the interposer includes a first part that defines an outer surface thereof, and a second part that defines an inner surface thereof, vias included in the first part are all ground vias and are spaced apart from each other by a first interval, and the vias included in the second part include signal vias, and ground vias, the number of which is less than that of the signal vias, and may be spaced apart from each other by a second interval that is larger than or equal to the first interval.
Inventor(s): Baekeun CHO of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Bohyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Youngmin JI of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K7/20
CPC Code(s): H05K5/0217
Abstract: an electronic device is provided including a first housing, a second housing that slides relative to the first housing, a flexible display configured such that a size of a region exposed on a front side of the electronic device is changed in response to a sliding motion of the second housing relative to the first housing, a heat radiating sheet disposed on at least a portion of a rear surface of the flexible display, and a flexible display support member disposed on a portion of a rear surface of the heat radiating sheet to support a portion of the flexible display. the flexible display support member includes a plurality of support bars that extend in a direction perpendicular to a sliding direction of the second housing. the plurality of support bars are spaced apart. the heat radiating sheet includes a plurality of folding portions, and at least portions of the heat radiating sheet are located in spaces separating the plurality of support bars.
Inventor(s): Hangyu HWANG of Suwon-si (KR) for samsung electronics co., ltd., Yoonhee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/04, B29C37/00, B29C65/48, B29C65/64, B29C65/70, B29C65/72, B29L31/34, H04M1/02, H05K5/00
CPC Code(s): H05K5/04
Abstract: an electronic device including a housing defining an outer surface of the electronic device. the housing includes metal regions comprising a surface treatment layer defining the outer surface at the metal regions, and an insulation region which is between the metal regions and coupled to each of the metal regions. the insulation region includes a polymer material portion, and a coating layer which is on the polymer material portion and defines the outer surface at the insulation region. the coating layer comprising a polymer matrix and siloxane.
Inventor(s): Jinseo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sohyang LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin JIN of Suwon-si (KR) for samsung electronics co., ltd., Sohee CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/02
Abstract: a method of fabricating a semiconductor device include providing a substrate including cell and peripheral regions, forming a cell gate structure on the cell region, forming a peripheral gate structure on the peripheral region, forming a bit-line structure on the cell region, forming a preliminary pad layer covering the bit-line structure and the peripheral gate structure, and etching the preliminary pad layer to form a landing pad and a peripheral conductive pad. the etching the preliminary pad layer includes forming a first mask structure on the preliminary pad layer, forming a second mask structure on the first mask structure, forming a first photoresist layer on the second mask structure, and using the first photoresist layer as an etching mask to etch the second mask structure. the first photoresist layer includes a first line opening overlapping the cell region, and peripheral resist patterns overlapping the peripheral region.
20240196593.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Moonyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hyungjun NOH of Suwon-si (KR) for samsung electronics co., ltd., Sangho LEE of Suwon-si (KR) for samsung electronics co., ltd., Yoongi HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device includes a bit line on a substrate and extending in a first direction parallel to a bottom surface of the substrate, a first active pattern on the bit line, a first word line intersecting the first active pattern in a second direction which is parallel to the bottom surface of the substrate and intersects the first direction, and a first conductive pattern on the first active pattern. the first word line includes a first side surface facing the first direction. the first active pattern includes a first portion between the first word line and the first conductive pattern, a second portion between the first word line and the bit line, and a third portion extending on the first side surface of the first word line to connect the first portion to the second portion of the first active pattern.
20240196596.SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junhyeok Ahn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/34
Abstract: a semiconductor memory device may include an active pattern on a substrate and at least partially surrounded by a device isolation pattern, a gate electrode that crosses the active pattern in a first direction parallel to a bottom surface of the substrate, the gate electrode including lower and upper portions, and a side-capping pattern on a top surface of the lower portion of the gate electrode. the side-capping pattern may be on a side surface of the upper portion of the gate electrode, and a top surface of the side-capping pattern may be located at a level lower than an uppermost surface of the device isolation pattern, relative to the bottom surface of the substrate where the bottom surface of the substrate is a base reference layer.
20240196598.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jun Kwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Dong Woo KIM of Suwon-si (KR) for samsung electronics co., ltd., Mun Jun KIM of Suwon-si (KR) for samsung electronics co., ltd., On Yu BAE of Suwon-si (KR) for samsung electronics co., ltd., Yong Jin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Min WOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/34
Abstract: a semiconductor device is provided. the semiconductor device includes a substrate containing deuterium at a first concentration, an active pattern disposed on the substrate and extending in a first horizontal direction, a gate electrode disposed on the active pattern and extending in a second horizontal direction different from the first horizontal direction, a gate insulating layer disposed between the active pattern and the gate electrode, the gate insulating layer containing deuterium at a second concentration, a first interlayer insulating layer disposed on the gate electrode, a second interlayer insulating layer disposed on the first interlayer insulating layer, and a wiring pattern disposed inside the second interlayer insulating layer, the wiring pattern containing deuterium at a third concentration lower than the first concentration, wherein each of the first to third concentrations is a concentration of deuterium atoms contained in the same unit volume.
20240196599.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaekang KOH of Suwon-si (KR) for samsung electronics co., ltd., Byeongguk KO of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangkoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Yongsoon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes: an active pattern disposed on a substrate; a gate structure disposed on the active pattern; a bit line structure disposed on the active pattern, and including a first conductive pattern, a second conductive pattern and an insulation structure stacked on each other, a lower spacer structure disposed on a sidewall of the bit line structure; an upper spacer structure disposed on the lower spacer structure, wherein the upper spacer structure is disposed on an upper portion of the sidewall of the bit line structure; a contact plug structure disposed on the active pattern, wherein the contact plug structure is spaced apart from the bit line structure; and a capacitor disposed on the contact plug structure, wherein the lower spacer structure includes: a first spacer partially covering a sidewall of the first conductive pattern, and including air; and a second spacer disposed on the first spacer.
20240196600.SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeongmin Jin of Suwon-si (KR) for samsung electronics co., ltd., Sohyang Lee of Suwon-si (KR) for samsung electronics co., ltd., Sohee Choi of Suwon-si (KR) for samsung electronics co., ltd., Jinseo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device includes a substrate including a plurality of active regions in a memory cell region, a plurality of bit line structures extending in parallel with each other in a first horizontal direction in the memory cell region, a plurality of buried contacts respectively and electrically connected to the active regions and partially filling a space between the bit line structures, a plurality of lower landing pads in the space between the bit line structures and respectively on the buried contacts, a landing pad insulating structure in contact with the bit line structures and the lower landing pads and including a plurality of landing pad holes, a plurality of upper landing pads respectively filling the landing pad holes and respectively connected to the lower landing pads, and a plurality of capacitor structures.
20240196602.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonhee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Daejin NAM of Suwon-si (KR) for samsung electronics co., ltd., Sunguk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/423
CPC Code(s): H10B12/485
Abstract: an integrated circuit device includes a substrate having an active region, a word line extending in the substrate in a first horizontal direction, a bit line extending on the word line in a second horizontal direction, a bit line contact electrically connecting the bit line to the active region, a doping contact connecting the bit line contact to the active region, a cell pad having a horizontal width greater than that of the active region, a buried contact that digs into one side wall of the cell pad, and a conductive landing pad facing the bit line in the first horizontal direction. the doping contact includes a first doping contact and a second doping contact, and a thickness of the first doping contact in the vertical direction is less than that of the second doping contact in the vertical direction.
Inventor(s): Kwanghee CHEON of Suwon-si (KR) for samsung electronics co., ltd., Hyukwoo KWON of Suwon-si (KR) for samsung electronics co., ltd., Munjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Younseok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/423
CPC Code(s): H10B12/488
Abstract: an integrated circuit device includes a substrate having a plurality of active regions defined by a device isolation trench, a device isolation structure including an etching induction film and filling the device isolation trench, the etching induction film covering a bottom surface of the device isolation trench, a word line trench intersecting with the plurality of active regions and the device isolation structure and extending in a first lateral direction, a gate dielectric film covering an inner wall of the word line trench, and a word line filling a portion of the word line trench on the gate dielectric film, wherein each of the plurality of active regions includes a fin body portion under the word line and a saddle fin portion protruding from the fin body portion toward the word line, and the etching induction film is exposed by the word line trench.
Inventor(s): Seungmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Yu of Suwon-si (KR) for samsung electronics co., ltd., Byungman Ahn of Suwon-si (KR) for samsung electronics co., ltd., Bonghyun Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, G11C16/04, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/35, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a substrate comprising a chip region and a scribe lane region including a first key pattern region, a capping insulating layer disposed on the scribe lane region, a barrier metal layer covering the capping insulating layer and an inner wall of a via hole penetrating the capping insulating layer, a substrate layer disposed on the barrier metal layer and filling the via hole, an insulating plate and an upper base layer disposed on the substrate layer, a pattern insulating layer disposed on the capping insulating layer in the first key pattern region, a stacked structure disposed on the upper base layer and the pattern insulating layer, and first pattern structures overlapping the pattern insulating layer in a vertical direction and penetrating the stacked structure and the pattern insulating layer, wherein the pattern insulating layer extends through the barrier metal layer in the first key pattern region.
Inventor(s): Byongju KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongsung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Wonjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghwa LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaemin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Changheon CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27, H10B51/20
CPC Code(s): H10B43/27
Abstract: an integrated circuit device includes a semiconductor substrate; a plurality of conductive lines extending on the semiconductor substrate in a horizontal direction and overlapping each other in a vertical direction; a plurality of insulating layers between pairs of conductive lines of the plurality of conductive lines and extending in the horizontal direction; and a channel structure passing through the plurality of conductive lines and the plurality of insulating layers, wherein the channel structure includes a core insulating layer, a channel layer on a side wall and a bottom surface of the core insulating layer, a gate insulating layer on an outer wall of the channel layer, and a ferroelectric layer on an outer wall of the gate insulating layer.
Inventor(s): Kangoh Yun of Suwon-si (KR) for samsung electronics co., ltd., Sohyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Dongjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Junhee Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H01L23/00, H01L25/065, H01L25/18, H10B41/41, H10B80/00
CPC Code(s): H10B43/40
Abstract: a semiconductor device includes a substrate including an active region including a central active region extending in a first direction and first to fourth extended active regions extending from an edge of the central active region in a second direction perpendicular to the first direction, and a device isolation layer defining the active region; and first to fourth gate structures on the active region and spaced apart from one another, wherein the central active region, the first to fourth extended active regions, and the first to fourth gate structures constitute first to fourth pass transistors, the first to fourth pass transistors share one drain region on the central active region, and the active region has an h shape in a plan view.
Inventor(s): Yunseong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinseong HEO of Suwon-si (KR) for samsung electronics co., ltd., Kihong KIM of Suwon-si (KR) for samsung electronics co., ltd., Dukhyun CHOE of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H01L21/28, H01L29/51, H01L29/66, H01L29/78, H10B53/20
CPC Code(s): H10B51/20
Abstract: an electronic device may include a conductive material layer, a ferroelectric layer covering the conductive material layer, and an electrode covering the ferroelectric layer. the ferroelectric layer may include a compound represented by hfao, where 0≤x≤1, 0≤y≤1, and 2(x+y)<z.
Inventor(s): Yunheub SONG of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., CHANGHWAN CHOI of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., JAEMIN SIM of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H01L29/66, H01L29/78
CPC Code(s): H10B51/20
Abstract: a method of manufacturing a ferroelectric-based 3-dimensional flash memory is disclosed. also, a 3-dimensional flash memory that improves ferroelectric polarization properties and a method of manufacturing the same are disclosed.
Inventor(s): Yunseok Yang of Suwon-si (KR) for samsung electronics co., ltd., Seula Ryu of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Shin of Suwon-si (KR) for samsung electronics co., ltd., Minhwan An of Suwon-si (KR) for samsung electronics co., ltd., Seongjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghak Lee of Suwon-si (KR) for samsung electronics co., ltd., Eungchang Lee of Suwon-si (KR) for samsung electronics co., ltd., Yunkyeong Jeong of Suwon-si (KR) for samsung electronics co., ltd., Jinsuk Chung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: a memory device and a system includes a plurality of physical interfaces. the memory device includes a buffer die including a first interface circuit and a second interface circuit configured to communicate with an external device and a memory die stack mounted on the buffer die and including a plurality of stacked memory dies. the plurality of memory dies are electrically connected to the first interface circuit and the second interface circuit, the first interface circuit is configured to activate responsive to a first selection signal, and the second interface circuit is configured to activate responsive to a second selection signal. the first selection signal and the second selection signal are received from a memory controller external to the memory device.
Inventor(s): Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Chul Joon HEO of Suwon-si (KR) for samsung electronics co., ltd., Hyeong-Ju KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd., Tae Jin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K39/34, G06V40/13, H10K59/35
CPC Code(s): H10K39/34
Abstract: a sensor-embedded display panel includes a light emitting element and a sensor which include separate portions of a first common auxiliary layer including a hole transport material and a second common auxiliary layer including an electron transport material. the sensor includes first and second semiconductor layers proximate to the first and second common auxiliary layers, respectively, and including a p-type semiconductor and a non-fullerene n-type semiconductor having a lumo energy level deeper than that of the electron transport material, respectively. an insertion layer between the second semiconductor layer and the second common auxiliary layer includes a metal, a metal compound, or any combination thereof. a work function of the metal or a lumo energy level of the metal compound is deeper or shallower than the lumo energy level of the non-fullerene n-type semiconductor and the lumo energy level of the electron transport material within less than about 1.3 ev, respectively.
Inventor(s): Yilin WU of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung SHIN of Suwon-si (KR) for samsung electronics co., ltd., Minsuk UHM of Suwon-si (KR) for samsung electronics co., ltd., Dongseop LEE of Suwon-si (KR) for samsung electronics co., ltd., Haechang LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K59/35, H10K59/40, H10K59/80
CPC Code(s): H10K59/353
Abstract: a display device is provided. the display device includes a substrate, a plurality of pixels disposed on the substrate and including a first pixel and a second pixel, a first opaque member located not to overlap a first light emitting area of a first sub-pixel that displays a first color included in the first pixel and to surround a circumference of the first light emitting area, and a second opaque member disposed to overlap at least a portion of a second light emitting area of a second sub-pixel that displays a second color included in the second pixel and to wrap a periphery of the second light emitting area around once by a specific first thickness, wherein the first light emitting area is an area, in which a first electrode of the first sub-pixel and a first organic light emitting layer of the first sub-pixel contact each other, and the first light emitting area may include at least two divided areas, and wherein the second light emitting area may be an area, in which a second electrode of the second sub-pixel and a second organic light emitting layer of the second sub-pixel contact each other, and the second pixel does not include an opaque member at a portion, at which the second pixel does not overlap the second light emitting area.
Inventor(s): Yumin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Garam PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae SONG of Suwon-si (KR) for samsung electronics co., ltd., Seungyeul YANG of Suwon-si (KR) for samsung electronics co., ltd., Seungdam HYUN of Suwon-si (KR) for samsung electronics co., ltd., Jooheon KANG of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N70/00, H10B63/00
CPC Code(s): H10N70/826
Abstract: a variable resistance memory device includes a pillar, a resistance change layer provided at a side surface of the pillar, a semiconductor layer provided at a side surface of the resistance change layer, a gate insulating layer provided at a side surface of the semiconductor layer, a plurality of isolating layers and a plurality of gate electrodes alternately arranged along a surface of the gate insulating layer, and an internal resistance layer between the resistance change layer and the semiconductor layer, where a resistance of the internal resistance layer is greater than a resistance of the semiconductor layer when the semiconductor layer includes conductor characteristics and the resistance of the internal resistance layer is less than the resistance of the semiconductor layer when the semiconductor layer includes insulator characteristics.
SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- A61B5/0205
- A61B5/029
- A61B5/11
- CPC A61B5/0205
- Samsung electronics co., ltd.
- A61B5/117
- CPC A61B5/117
- A61B5/145
- A61B5/00
- A61B5/1455
- A61B5/1495
- CPC A61B5/14546
- B01L3/00
- CPC B01L3/502715
- B02C18/00
- B02C18/14
- B02C18/24
- CPC B02C18/0092
- B24B37/24
- B24B37/22
- CPC B24B37/24
- B25J9/16
- B25J9/00
- CPC B25J9/162
- B25J9/08
- CPC B25J9/1679
- B41M5/00
- C25D11/24
- CPC B41M5/0011
- C02F5/08
- C02F1/00
- CPC C02F5/08
- C30B15/04
- C30B15/20
- C30B29/06
- C30B33/00
- CPC C30B15/04
- D06F37/30
- H02K1/18
- H02K5/22
- H02K7/08
- CPC D06F37/304
- D06F58/22
- D06F58/04
- F26B13/10
- F26B13/14
- CPC D06F58/22
- F24F1/0047
- CPC F24F1/0047
- F24F11/63
- CPC F24F11/63
- F24F13/14
- F24F1/0011
- CPC F24F13/1486
- F25D11/02
- F25D17/06
- F25D23/06
- CPC F25D11/02
- F25D23/00
- B23K26/359
- C23F1/36
- C25D11/04
- CPC F25D23/00
- F28F21/08
- F28F1/32
- F28F19/00
- CPC F28F21/084
- G01L9/12
- CPC G01L9/12
- G01N23/2251
- CPC G01N23/2251
- G01N29/02
- G01N29/44
- CPC G01N29/022
- G01P15/18
- G01P3/44
- CPC G01P15/18
- G01S7/481
- G02B5/18
- CPC G01S7/4814
- G01S7/4911
- G01S7/4912
- CPC G01S7/4817
- G01S13/46
- G01S7/03
- G01S7/295
- G01S7/40
- CPC G01S13/46
- G01S19/26
- G01S19/22
- CPC G01S19/26
- G01S19/42
- G01S19/05
- CPC G01S19/42
- G02B27/01
- G06F3/16
- G06V10/764
- CPC G02B27/017
- G02F1/1333
- CPC G02F1/13332
- G02F1/29
- CPC G02F1/292
- G03F7/40
- CPC G03F7/40
- G03H1/22
- G02B27/28
- G03H1/02
- G03H1/12
- G03H1/28
- CPC G03H1/2294
- G05D23/19
- H01L21/683
- CPC G05D23/1931
- G06F1/28
- G05F1/59
- H02M3/157
- CPC G06F1/28
- G06F3/01
- CPC G06F3/011
- CPC G06F3/017
- G06F3/14
- G06F3/044
- G06F3/041
- CPC G06F3/0446
- G06F3/06
- CPC G06F3/061
- G06F16/22
- CPC G06F3/0619
- CPC G06F3/0622
- G06F11/10
- CPC G06F3/0623
- G06F7/544
- CPC G06F7/5443
- G06F11/34
- CPC G06F11/3409
- G06F12/0884
- G06F12/0817
- CPC G06F12/0884
- G06F13/16
- G11C11/406
- CPC G06F13/1636
- CPC G06F13/1668
- G06F13/28
- G06F9/445
- G06F9/48
- G06F15/76
- CPC G06F13/28
- G06F13/42
- G06F11/14
- CPC G06F13/4282
- G06F15/78
- CPC G06F15/7807
- G06F16/18
- G06F16/906
- CPC G06F16/1847
- G06F21/31
- G06F8/61
- G06F18/20
- G06N3/045
- G06V10/82
- CPC G06F21/31
- G06F21/57
- G06F21/12
- CPC G06F21/575
- G05B19/4099
- CPC G05B19/4099
- G06F30/392
- G06F30/327
- G06F30/394
- CPC G06F30/392
- G06N3/0464
- CPC G06N3/0464
- G06N3/08
- CPC G06N3/08
- G06T3/40
- G06T3/00
- G06T7/50
- G06T7/90
- CPC G06T3/4053
- G06T3/4053
- G06T7/20
- G06V10/24
- G06V10/44
- G06V10/80
- G06T7/00
- G06T7/11
- CPC G06T7/0006
- G06T7/62
- G06V10/70
- CPC G06T7/0008
- G06T17/00
- G06V20/40
- CPC G06T17/00
- G06T19/20
- G06T7/73
- G06T19/00
- G06V20/20
- G06V40/20
- H04B10/114
- H04N7/22
- CPC G06T19/20
- G06V20/56
- B60W50/00
- G06F18/213
- G06F18/214
- G06F18/241
- G06V10/22
- G06V10/25
- G06V10/77
- G06V20/64
- H04N13/111
- CPC G06V20/56
- G09G3/00
- H04N23/60
- CPC G09G3/035
- G10K11/178
- F25B49/02
- CPC G10K11/17873
- G10L15/06
- G10L13/08
- G10L15/20
- CPC G10L15/063
- G10L15/22
- G10L15/08
- G10L15/18
- G10L17/22
- H04L12/28
- H04N21/41
- H04N21/422
- H04N21/4223
- H04N21/439
- H04N21/44
- CPC G10L15/22
- G10L17/04
- G10L17/02
- G10L17/06
- G10L17/26
- CPC G10L17/04
- G10L25/63
- CPC G10L17/26
- G10L25/84
- G10L25/30
- H04M3/00
- H04S7/00
- CPC G10L25/84
- G11C11/4074
- G11C7/10
- G11C7/12
- G11C8/12
- G11C11/408
- G11C11/4097
- G11C11/56
- G11C16/04
- G11C16/06
- G11C16/08
- G11C16/10
- G11C16/30
- G11C16/34
- CPC G11C11/4074
- G11C5/06
- H10B41/27
- H10B41/35
- H10B41/40
- H10B43/27
- H10B43/35
- H10B43/40
- CPC G11C16/08
- H01L23/522
- H01L23/528
- H01L25/065
- H10B80/00
- G11C16/16
- CPC G11C16/102
- CPC G11C16/16
- G06F1/20
- CPC G11C16/30
- G11C16/28
- CPC G11C16/3404
- H01L21/308
- H01L29/66
- CPC H01L21/308
- H01L21/67
- H01L21/02
- CPC H01L21/67051
- H01L21/768
- H01L21/033
- H01L21/311
- CPC H01L21/76816
- H01L21/8234
- H01L27/088
- CPC H01L21/823481
- H01L21/66
- G01R31/28
- CPC H01L22/34
- H01L23/31
- H01L23/00
- H01L23/29
- H01L23/498
- H01L25/10
- H01L25/16
- CPC H01L23/3135
- H01L23/433
- H01L21/56
- CPC H01L23/4334
- H01L23/48
- CPC H01L23/481
- CPC H01L23/49822
- CPC H01L23/49838
- CPC H01L23/49894
- H10B12/00
- CPC H01L23/5283
- CPC H01L23/5286
- H01L23/532
- CPC H01L23/53223
- H01L23/552
- G06F1/18
- H01L23/495
- H01L25/18
- H05K9/00
- CPC H01L23/552
- H01L23/58
- CPC H01L23/585
- CPC H01L24/06
- H01L23/538
- CPC H01L24/09
- H01L21/48
- H01L23/13
- H01L25/00
- CPC H01L24/20
- CPC H01L25/0652
- CPC H01L25/0657
- H01L27/146
- CPC H01L27/14614
- CPC H01L27/14627
- CPC H01L27/14636
- H01L29/06
- H01L27/092
- H01L29/08
- H01L29/423
- H01L29/775
- H01L29/786
- CPC H01L29/0673
- H01L29/417
- H01L29/40
- H01L29/78
- CPC H01L29/41791
- H01L29/51
- H01L29/49
- H10B51/20
- H10B53/30
- CPC H01L29/516
- H01L29/20
- CPC H01L29/66795
- CPC H01L29/7855
- CPC H01L29/78618
- H01L33/58
- CPC H01L33/58
- H01M4/40
- H01M10/058
- CPC H01M4/405
- H01Q1/24
- CPC H01Q1/243
- H01Q25/00
- H01Q21/06
- CPC H01Q25/001
- H02J50/12
- H02J50/40
- H02J50/80
- H05B1/02
- H05B6/06
- H05B6/12
- CPC H02J50/12
- H02J50/60
- G01R29/08
- G06V40/10
- CPC H02J50/60
- H03K17/30
- H03K17/687
- H03K19/0185
- CPC H03K17/302
- H04B7/04
- CPC H04B7/04013
- H04B7/0456
- H04B7/06
- H04L5/00
- CPC H04B7/0456
- H04B7/0404
- H04W52/24
- CPC H04B7/06952
- H04L1/1829
- H04W72/20
- H04W72/56
- CPC H04L1/1861
- H04L1/1867
- CPC H04L1/1887
- H04B7/0417
- H04W72/21
- H04W72/23
- CPC H04L5/0057
- H04L25/02
- CPC H04L25/0254
- H04L41/5025
- H04W24/02
- H04W84/04
- CPC H04L41/5025
- H04L41/5067
- H04L41/50
- H04L41/5009
- H04W24/08
- CPC H04L41/5067
- H04M1/02
- H05K1/03
- H05K3/36
- CPC H04M1/0216
- H04N9/31
- CPC H04N9/3185
- H04N7/025
- CPC H04N21/42221
- H04R3/00
- CPC H04R3/00
- CPC H04S7/305
- H04W4/021
- G01S5/00
- G01S5/02
- CPC H04W4/021
- H04W4/90
- H04W36/08
- CPC H04W4/90
- H04W8/00
- H04W72/566
- CPC H04W8/005
- H04W8/20
- H04L1/1822
- CPC H04W8/205
- H04W8/24
- CPC H04W8/24
- H04W12/03
- H04W8/22
- H04W12/72
- H04W76/30
- CPC H04W12/03
- H04L43/0876
- H04W92/20
- CPC H04W24/02
- H04W72/0446
- H04W72/542
- CPC H04W24/08
- H04W24/10
- H04W76/20
- CPC H04W24/10
- H04W36/00
- H04L41/08
- H04W36/02
- H04W36/14
- H04W88/08
- CPC H04W36/0005
- CPC H04W36/0007
- H04W68/02
- CPC H04W36/0022
- CPC H04W36/008355
- H04W76/27
- H04W84/06
- CPC H04W36/083
- H04W48/08
- CPC H04W48/08
- H04W48/18
- H04W48/16
- H04W60/04
- CPC H04W48/18
- H04W52/14
- H04W74/04
- CPC H04W52/242
- H04W52/32
- H04W52/42
- CPC H04W52/325
- H04W56/00
- CPC H04W56/0045
- H04W68/00
- H04W72/044
- H04W76/28
- CPC H04W68/005
- H04W72/04
- CPC H04W72/04
- H04W72/1268
- CPC H04W72/1268
- H04B7/0408
- H04L41/0803
- CPC H04W72/21
- H04W72/232
- CPC H04W72/232
- H04W74/0808
- H04W16/14
- CPC H04W74/0808
- H04W74/0833
- H04W72/0453
- H04W72/50
- H04W74/00
- H04W74/0816
- H04W76/11
- CPC H04W74/0841
- H05K1/02
- H05K1/11
- H05K1/14
- CPC H05K1/0219
- H05K5/02
- H05K7/20
- CPC H05K5/0217
- H05K5/04
- B29C37/00
- B29C65/48
- B29C65/64
- B29C65/70
- B29C65/72
- B29L31/34
- H05K5/00
- CPC H05K5/04
- CPC H10B12/02
- CPC H10B12/315
- CPC H10B12/34
- CPC H10B12/482
- CPC H10B12/485
- CPC H10B12/488
- H10B41/10
- H10B43/10
- CPC H10B43/27
- H10B41/41
- CPC H10B43/40
- H01L21/28
- H10B53/20
- CPC H10B51/20
- CPC H10B80/00
- H10K39/34
- G06V40/13
- H10K59/35
- CPC H10K39/34
- H10K59/40
- H10K59/80
- CPC H10K59/353
- H10N70/00
- H10B63/00
- CPC H10N70/826
