SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on January 2nd, 2025
SAMSUNG ELECTRONICS CO., LTD.: 138 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H01L23/00 (15), H01L23/31 (10), H01L23/498 (10), H01L25/065 (9), G06F3/01 (6) H01L27/1463 (3), G06T11/60 (3), G06F3/017 (3), H04N13/305 (2), G06N3/049 (2)
With keywords such as: device, layer, substrate, surface, including, semiconductor, display, based, electronic, and configured in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjoon OH of Suwon-si (KR) for samsung electronics co., ltd., Seungmoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28
CPC Code(s): A47L9/2831
Abstract: a cleaner includes a brush device including a voltage detection circuit configured to measure a voltage applied to the brush device from a battery, a capacitor charged with the voltage applied to the brush device from the battery, an inrush current reduction circuit including a resistor configured to reduce an inrush current which occurs in charging the capacitor and a switching device used to control the inrush current, and a processor configured to turn off the switching device included in the inrush current reduction circuit based on a drop rate of the voltage measured through the voltage detection circuit being at least a threshold rate.
Inventor(s): Jihye LEE of Suwon-si (KR) for samsung electronics co., ltd., Hoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Hyunsu PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A63B71/06
CPC Code(s): A63B24/0062
Abstract: an exercise assistance method of assisting user's exercise based on ground inclination, a wearable device and an electronic device for performing the same are provided. the exercise assistance method may include determining ground inclination in a direction in which a wearable device worn by the user moves based on sensor data, determining whether a ground surface in the direction in which the wearable device moves is downward inclination or upward inclination based on the ground inclination, when the ground surface is the downward inclination or the upward inclination, determining target exercise speed to achieve a target exercise amount of an exercise program performed by the wearable device based on the ground inclination, and adjusting at least one of current target exercise speed set to the exercise program and current exercise intensity set to the exercise program based on the determined target exercise speed.
Inventor(s): Suk Min CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yun Seok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byoung Chaul SON of Anseong-si (KR) for samsung electronics co., ltd., Dong Cheol SIM of Suwon-si (KR) for samsung electronics co., ltd., Jae Sun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jae Hyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Eun Seok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B03C1/30, B24B37/34
CPC Code(s): B03C1/30
Abstract: a substrate treating apparatus in which foreign substances are reduced by using a foreign substance collecting unit includes a magnetic structure. the substrate treating apparatus includes a roller configured to be disposed on a rail extending in a first direction and attached to a side surface of a carrier unit to move along the rail, and a foreign substance collecting unit installed on the side surface of the carrier unit, moving together with the roller, and configured to be spaced apart from the rail when the roller is disposed on the rail, wherein the foreign substance collecting unit includes a magnetic structure for adsorbing foreign magnetic substances using a magnetic force, and a case surrounding the magnetic structure.
20250001548. GRINDER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jwahyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungyeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Taesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyuntae KIM of Suwon-si (KR) for samsung electronics co., ltd., Byunghyuck AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B45/00, B24B7/22
CPC Code(s): B24B45/006
Abstract: a grinder may include a spindle, a grinding wheel and a mount disk. the spindle may be configured to generate a rotary force. the grinding wheel may be configured to receive the rotary force from the spindle and grind an object. the mount disk may be between the spindle and the grinding wheel and may be configured automatically engage or disengage the grinding wheel based on a rotation direction of the mount disk. thus, an exchange or replacement of the grinding wheel may be performed in a short time by rotating the spindle so that the grinding wheel is disengaged from the mount disk.
Inventor(s): Sangyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Woomok KIM of Suwon-si (KR) for samsung electronics co., ltd., Boseok MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J19/06, G05D1/246, G05D1/689
CPC Code(s): B25J9/1676
Abstract: an electronic device is provided. the electronic device includes a communication interface and one or more processors configured to receive operation information of each of a plurality of robot devices through the communication interface, identify at least one first robot device from among the plurality of robot devices as a target device based on a plurality of pieces of operation information, control at least one robot device so that the at least one robot device from among the remaining robot devices monitors the target device, based on monitoring data being received from the at least one robot device that monitors the target device, identify whether an operation of the target device according to the operation is safe based on the monitoring data, and transmit a command for controlling the target device to the target device based on a result of the identification.
20250003135. CLOTHES CARE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kwanwoo BAEK of Suwon-si (KR) for samsung electronics co., ltd., Zoohyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Changwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/26, D06F25/00, D06F37/04, D06F37/30, D06F39/04
CPC Code(s): D06F37/264
Abstract: a clothes care apparatus includes: a housing in which a laundry inlet is formed on a front; a tub provided in the housing and configured to store water and including a tub back forming a rear side of the tub; a drum configured to be rotatable in the tub and accommodate laundry; and a drying device disposed above the tub, and configured to remove moisture from air exhausted from the tub and supply heated air to the tub, wherein the tub back includes: a plurality of reinforcing ribs protruding rearward to reinforce a rigidity of the tub back; and a tub duct formed in a portion of the tub back, configured to guide the air exhausted from the tub to the drying device.
20250003136. CLOTHES TREATING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kwanwoo BAEK of Suwon-si (KR) for samsung electronics co., ltd., Zoohyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Jonghun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Changwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/26, D06F25/00, D06F58/02, D06F58/20
CPC Code(s): D06F37/269
Abstract: a clothes treating apparatus comprises: a housing comprising a laundry inlet formed on a front surface of the housing; a tub disposed in the housing and configured to store water; a drum configured to rotate in the tub and provided to accommodate laundry; and a drying device comprising a heat pump disposed above the tub and configured to remove moisture from air discharged from the tub, and configured to supply heated air to the tub. the tub includes a tub opening disposed on a front surface of the tub to correspond to the laundry inlet, and a tub back disposed on a rear surface of the tub and comprising a tub outlet for discharging air inside the tub. the clothes treating apparatus includes a bearing housing configured to rotatably support a rotating shaft connected to the drum is coupled to the tub back. a housing outlet is formed in a position, which corresponds to a position of the tub outlet, in the bearing housing.
20250003139. CLOTHING TREATMENT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Ohjin KWON of Suwon-si (KR) for samsung electronics co., ltd., Dohaeng KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongryeol MYEONG of Suwon-si (KR) for samsung electronics co., ltd., Sungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jewoo BANG of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/20, D06F34/14, D06F58/02, D06F58/24, D06F103/58, D06F105/02, D06F105/26, D06F105/36
CPC Code(s): D06F58/206
Abstract: a dryer including a main body; a drum inside the main body to receive an object for drying; a heat pump to supply hot and dry air to the drum, and including an evaporator, compressor, and condenser, wherein the evaporator, compressor, and condenser are configured to circulate a refrigerant through the evaporator, the compressor, and the condenser; a condensate tank to store condensate generated by the evaporator; and a connection pipe between the condenser and the evaporator, with at least a portion of the connection pipe being in the condensate tank, wherein the dryer is configured so that refrigerant that has been heat-exchanged with external air in the condenser, and discharged from the condenser, then passes through the connection pipe so as to additionally exchange heat with the condensate in the condensate tank while passing through the at least a portion of the connection pipe in the condensate tank.
20250003606. AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seonghyun YOON of Suwon-si (KR) for samsung electronics co., ltd., Yongbin LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/0063, F24F1/0018, F24F11/79, F24F13/14, F24F13/30
CPC Code(s): F24F1/0063
Abstract: an air conditioner comprises: a housing having an air inlet and an air outlet, a heat exchanger in the housing, a blower in the housing configured to move air through the air inlet, and thereafter to the heat exchanger, to be discharged through the air outlet, a first motor and a second motor disposed in the housing, a rotating shaft including a first shaft connected to the first motor, and a second shaft connected to the second motor, a first blade configured to adjust a direction of air moved by the blower and discharged from a first portion of the outlet, and disposed on a first side of the rotating shaft to receive power from the first motor, and a second blade configured to adjust a direction of air moved by the blower and discharged from a second portion of the outlet, and disposed on a second side of the rotating shaft to receive power from the second motor, and the first motor may be disposed on a first side in an extending direction of the rotating shaft, and the second motor may be disposed on a second side in the extending direction of the rotating shaft.
Inventor(s): Incheol LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonjun JANG of Suwon-si (KR) for samsung electronics co., ltd., Ho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hooijoong KIM of Suwon-si (KR) for samsung electronics co., ltd., Eungryeol SEO of Suwon-si (KR) for samsung electronics co., ltd., Nokhaeng LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeawon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/028, F24F1/035, F24F13/08, F24F13/24
CPC Code(s): F24F1/028
Abstract: an air cleaner including a housing including a flow path through which air is movable; a fan configured to operate to move air through the flow path; and an air guide adjacent to the fan, the air guide including a guide surface along which the air moving through the flow path flows while the fan operates, and a sound absorption hole extending from the guide surface so that a sound generated by the fan while the fan operates is absorbed through the sound absorption hole.
Inventor(s): Sangjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Keonpyo KOO of Suwon-si (KR) for samsung electronics co., ltd., Eungryeol SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/06
CPC Code(s): F25D23/063
Abstract: a refrigerator may include an insulation panel including an inner shell, an outer shell, and insulation between the inner shell and the outer shell, wherein the insulation panel has a cutout portion forming a cutout groove in the insulation panel, and the insulation panel is folded about the cutout groove so that the insulation panel forms a main wall; a rear wall coupled to a rear side of the main wall, so that the rear wall and the main wall together form a main body having a storage room; a door to open and close the storage room; and an evaporator to cool the storage room.
Inventor(s): Sungyoon Ryu of Suwon-si (KR) for samsung electronics co., ltd., Ingi Kim of Suwon-si (KR) for samsung electronics co., ltd., Suhwan Park of Suwon-si (KR) for samsung electronics co., ltd., Inkeun Baek of Suwon-si (KR) for samsung electronics co., ltd., Younghoon Sohn of Suwon-si (KR) for samsung electronics co., ltd., Soobin Sinn of Suwon-si (KR) for samsung electronics co., ltd., Yusin Yang of Suwon-si (KR) for samsung electronics co., ltd., Sunhong Jun of Suwon-si (KR) for samsung electronics co., ltd., Ikseon Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01B11/06
CPC Code(s): G01B11/06
Abstract: a measuring system measures an overall resistance of two or more films on a substrate/measurement object by a terahertz absorption measurement and an overall film thickness by a photoacoustic measurement. the system estimates a first film thickness based on the overall resistance, then subtracts this estimated thickness from the overall film thickness measured by the photoacoustic measurement. the system includes a source unit to output a laser beam. a first pump-probe unit receives the laser beam and performs a photoacoustic test on the measurement object. a second pump-probe unit receives the laser beam and performs a terahertz signal test on the measurement object. the system also includes a stage to support the measurement object and controls for controlling elements and calculating the film thicknesses
Inventor(s): Jaebum LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Youngho KIM of Suwon-si (KR) for samsung electronics co., ltd., Junho LEE of Suwon-si (KR) for samsung electronics co., ltd., Seokmin JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01K13/06, G01K7/22
CPC Code(s): G01K13/06
Abstract: an electronic device according to various embodiments of the disclosure may include a first housing, a second housing configured to be slid into the first housing and slid out from the first housing, a substrate part disposed between the front surface and the rear surface in the first housing and including at least one heat source, a first temperature sensor disposed on the substrate part, a second temperature sensor disposed in the second housing, and at least one processor. the at least one processor is configured to calculate a temperature of the electronic device based on at least one of a measurement value of the first temperature sensor or a measurement value of the second temperature sensor. various other embodiments may be possible.
Inventor(s): Jinyeong Yun of Yongin-si (KR) for samsung electronics co., ltd., Meehyun Lim of Seoul (KR) for samsung electronics co., ltd., Sungjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Masahiko Yamabe of Hwaseong-si (KR) for samsung electronics co., ltd., Sungyeol Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungyong Lim of Seoul (KR) for samsung electronics co., ltd., Sunghwi Cho of Gwangju-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R29/12, H01L21/66, H01L21/683, H01L21/687
CPC Code(s): G01R29/12
Abstract: an electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. the lift pin moves to first and second positions. the control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.
Inventor(s): Sagar BHARATHRAJ of Bengaluru (IN) for samsung electronics co., ltd., Shashishekara Parampalli ADIGA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G01R31/389, G01R31/367, G01R31/371, G01R31/52, H02J7/00
CPC Code(s): G01R31/389
Abstract: a processor-implemented method includes monitoring a plurality of direct current (dc) resistance values of a battery for a predefined time period during one of a constant power charging or discharging window of the battery, determining the plurality of dc resistance values of the battery at a plurality of timestamps corresponding to the predefined time period, determining a deviation of the determined plurality of dc resistance values by comparing the determined plurality of dc resistance values with a plurality of predefined dc resistance values associated with a reference battery, detecting a persistent short circuit in the battery in response to the determined deviation of the determined plurality of dc resistance values being greater than a threshold value, and estimating, in response to detecting the persistent short circuit in the battery, a short resistance of the battery based on a value of power supply in the constant power charging or discharging window and a magnitude of the determined deviation of the determined plurality of dc resistance values with respect to the plurality of predefined dc resistance values.
Inventor(s): Hyunseob OH of Suwon-si (KR) for samsung electronics co., ltd., Jonghoe KOO of Suwon-si (KR) for samsung electronics co., ltd., Jinwook SEO of Suwon-si (KR) for samsung electronics co., ltd., Kisoo AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/40, G01S7/00, G01S7/282, G01S13/02, G01S13/76
CPC Code(s): G01S7/4013
Abstract: the present disclosure relates to a method for dynamically controlling ranging power. an electronic device method using ultra-wide band (uwb) communication, according to various embodiments of the present disclosure, comprises the steps of: transmitting an initiation message for initiating uwb ranging; and identifying whether a response message corresponding to the initiation message has been received from another electronic device. the initiation message includes ranging power control request information for dynamic power control with respect to the uwb ranging, and the response message can include ranging power control response information corresponding to the ranging power control request information.
20250004122. WIRELESS BASED PRESENCE DETECTION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Songwei Li of Plano TX (US) for samsung electronics co., ltd., Guanbo Chen of Plano TX (US) for samsung electronics co., ltd., Yuming Zhu of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Frisco TX (US) for samsung electronics co., ltd., Viet Nguyen of Frisco TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S13/56, G01S7/00, G01S7/41, G01S13/00
CPC Code(s): G01S13/56
Abstract: one embodiment provides a method for presence detection based on wireless signal analysis, the method comprising extracting features from wireless signals transmitted between a plurality of stations (stas) and at least one access-point (ap) located within a space comprising a plurality of portions, wherein the ap is located in a particular portion of the space and a plurality of stas are located in different portions in the space such that there are non-line-of-sight (nlos) signals between the ap and the plurality of stas as a result of signal obstructions within the space, processing the features using feature analysis, and detecting a location of a user motion within a particular portion of the plurality of portions of the space based on the feature analysis.
Inventor(s): Yuichiro GOTO of Yokohama-shi (JP) for samsung electronics co., ltd., Tsuyoshi OHYAMA of Yokohama-shi (JP) for samsung electronics co., ltd., Yoshihiro YOKOTE of Yokohama-shi (JP) for samsung electronics co., ltd., Naewon JANG of Suwon-si (KR) for samsung electronics co., ltd., Byoungjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Seunggi KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B1/111
CPC Code(s): G02B1/111
Abstract: disclosed is a resin film including an anti-glare layer that includes scattering particles having irregularities formed on surfaces of the anti-glare layer. the resin film includes a binder made of a resin dispersing the scattering particles, and a low refractive index layer on the anti-glare layer. the low refractive index layer has a refractive index less than or equal to 1.4, and the anti-glare layer has a flat portion and a protrusion where the scattering particles protrude from the flat portion.
Inventor(s): Youngran KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B9/12, G02B1/11, G02B13/00, G02B27/01, G02B27/14, G02B27/28
CPC Code(s): G02B9/12
Abstract: a lens assembly is provided. the lens assembly includes a first lens having a positive refractive power and a fixed position, a second lens having a positive refractive power and being movable in position with respect to an optical axis, and a third lens having a positive refractive power and being movable in position with respect to the optical axis together with the second lens, wherein a first film layer is disposed between the first lens and the second lens, wherein a mirror coating layer is disposed on one surface, which is configured to face a display, of at least one of the second lens or the third lens, wherein the first lens, the second lens, and the third lens are sequentially disposed along the optical axis from a user's eye side to a display side, and wherein a ratio of a distance from one surface of the first lens facing the user's eye side to an imaging surface of the display to a distance from one surface of the second lens facing the user's eye side to the imaging surface of the display satisfies a condition defined by 1.55>t/ttl, where ‘total track length (ttl)’ represents the distance from the user's eye-side of the first lens to the imaging surface of the display, and ‘t’ represents the distance from one surface of the second lens facing the user's eye-side to the imaging surface of the display.
Inventor(s): Yibing Michelle WANG of Temple City CA (US) for samsung electronics co., ltd., Radwanul Hasan SIDDIQUE of Pasadena CA (US) for samsung electronics co., ltd.
IPC Code(s): G02B27/10, G02B1/00, G02B3/10, G02B3/14, G02B27/00, G02C7/06
CPC Code(s): G02B27/1066
Abstract: a metalens includes one or more regions of nanostructures. a first region of nanostructures directs a first field of view (fov) of light incident on the first region of nanostructures to a first region of an image plane. a second region of nanostructures directs a second fov of light incident on the second region of nanostructures to a second region of the image plane in which the second fov is different from the first fov, and the second region of the image plane is different from the first region of the image plane. a third region of nanostructures directs a third fov of light to a third region of the image plane, in which the third fov is different from the first fov and the second fov, and the third region of the image plane is different from the first region and the second region of the image plane.
Inventor(s): Hyukjun JANG of Suwon-si (KR) for samsung electronics co., ltd., Kyehoon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1335, G02F1/13357, H01L25/075, H01L33/54, H05K1/02, H05K1/18
CPC Code(s): G02F1/133612
Abstract: provided is a display apparatus including: a liquid crystal panel; a substrate; a light source module disposed on the substrate. the light source module includes a light emitting diode disposed on the substrate, a feed pad provided on the substrate, an antistatic pad provided on the substrate; and an insulating dome provided on the substrate and covering the light emitting diode. the antistatic pad is divided into two parts by an outline of the insulating dome.
Inventor(s): Woo-Yong Cho of Suwon-si (KR) for samsung electronics co., ltd., Hun Kang of Suwon-si (KR) for samsung electronics co., ltd., Sangwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Useong Kim of Suwon-si (KR) for samsung electronics co., ltd., Heungsuk Oh of Suwon-si (KR) for samsung electronics co., ltd., Hee-Jun Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeeeun Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/36
CPC Code(s): G03F1/36
Abstract: disclosed are semiconductor fabrication methods and optical proximity correction (opc) methods. the semiconductor fabrication method comprises performing opc on a design pattern of a layout to generate a corrected layout, and forming a photoresist pattern on a substrate by using a photomask manufactured with the corrected layout. performing the opc includes generating shape points on a contour of the design pattern, producing a hash value of the shape point, selecting a first unique shape point that represents first shape points, determining a first correction bias of the first unique shape point, and creating a correction pattern by applying the first correction bias in common to the first shape points. producing the hash value includes generating a query range around a target shape point and, based on geometry analysis in the query range, producing the hash value.
Inventor(s): Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Chanjae AHN of Suwon-si (KR) for samsung electronics co., ltd., Changheon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/038, C08F12/22, G03F7/004, G03F7/20
CPC Code(s): G03F7/0382
Abstract: provided are a polymer including a first repeating unit represented by formula 1, a resist composition including the polymer, and a method of forming a pattern using the resist composition:
Inventor(s): Beomseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si (KR) for samsung electronics co., ltd., Chanjae AHN of Suwon-si (KR) for samsung electronics co., ltd., Changheon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuhyun IM of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/038, C08F12/22, G03F7/004, G03F7/20
CPC Code(s): G03F7/0382
Abstract:
Inventor(s): Hyungju Ryu of Suwon-si (KR) for samsung electronics co., ltd., Dokyeong Kwon of Suwon-si (KR) for samsung electronics co., ltd., Sangjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Changmin Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/38
CPC Code(s): G03F7/38
Abstract: methods of forming a photoresist pattern are provided. a photoresist layer may be formed on a substrate. an exposure process may be performed on the photoresist layer. a post exposure baking (peb) process may be performed on the photoresist layer with a temperature gradient in the photoresist layer in a vertical direction substantially perpendicular to an upper surface of the substrate. a development process may be performed on the photoresist layer.
Inventor(s): Seongoh LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KWAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/246, A47L11/40, G05D1/224, G05D105/10, G05D107/40, G06T5/30, G06T5/70
CPC Code(s): G05D1/2469
Abstract: an electronic device and a control method thereof are provided. the electronic device includes a communication interface, memory storing one or more computer programs, and one or more processors communicatively coupled to the communication interface and the memory. the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to obtain a 2-dimensional (2d) map of an indoor space generated based on sensing data, and traveling data obtained by at least one external device, simplify the obtained 2d map, based on the traveling data, and generate a 3-dimensional (3d) map, based on the simplified 2d map.
Inventor(s): Hyungjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1656
Abstract: an electronic device according to various embodiments of the disclosure may include: a housing including a first housing and a second housing, a wireless communication circuit, and at least one contact structure comprising a conductor, wherein the first housing may include a ground and the second housing may include a conductive portion, wherein, in a first state, the second housing may be configured to move in a first direction to be changed to a second state and, in a second state, the second housing may be configured to move in a second direction to be change to the first state, and wherein, in the first state, the at least one contact structure may be configured to electrically connect the ground of the first housing to the conductive portion of the second housing, and the wireless communication circuit may be configured to receive a signal by feeding power to a point of the conductive portion of the second housing.
Inventor(s): Daehyeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaehee KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Chungkeun YOO of Suwon-si (KR) for samsung electronics co., ltd., Soobin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sooyeon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F16C11/04, H05K5/02
CPC Code(s): F16C11/04
Abstract: a hinge structure includes a fixing bracket, a first rotation member including a first rail structure and rotated about a first axis, and a second rail structure extending from the first rail structure and rotated about a second axis, a second rotation member including a third rail structure and rotated about a third axis, and a fourth rail structure extending from the third rail structure and rotated about a fourth axis, a first link member including a first slide holding part including a third rail, a second link member including a second slide holding part including a fourth rail, a first arm member including a first slide structure, in which the first slide holding part is held, and a second arm member including a second slide structure, in which the second slide holding part is held, and a foldable electronic device including the same.
Inventor(s): Vutha Va of Plano TX (US) for samsung electronics co., ltd., Priyabrata Parida of Dallas TX (US) for samsung electronics co., ltd., Saifeng Ni of Santa Clara CA (US) for samsung electronics co., ltd., Anum Ali of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G01S7/41
CPC Code(s): G06F3/017
Abstract: a method includes obtaining a gesture sample via a gesture classifier. the gesture sample includes parameters of features extracted from the radar signals based on user motion in performance of a gesture. the method includes determining whether to obtain feedback for a target gesture associated with the gesture sample. the method includes in response to a determination to obtain the feedback, obtaining the feedback for the target gesture. the feedback includes a label indicating a type of gesture. the method includes determining whether the gesture sample associated with the label is valid based on comparison to a dataset of pre-existing validated gesture samples and a distance threshold. the method includes in response to determining that the gesture sample associated with the label is valid, determining whether to update a model for the gesture classifier using the validated gesture sample as a training sample.
Inventor(s): Priyabrata Parida of Dallas TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Anum Ali of Frisco TX (US) for samsung electronics co., ltd., Saifeng Ni of Santa Clara CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G01S7/41
CPC Code(s): G06F3/017
Abstract: an electronic device includes a transceiver configured to transmit and receive radar signals. the electronic device further comprises a processor operatively coupled to the transceiver. the processor is configured to adjust a field of view (fov) associated with the transceiver based on a plurality of radar frames corresponding to the radar signals, extract a plurality of feature vectors from the plurality of radar frames based on the adjusted fov. the processor is further configured to identify an activity based on the plurality of feature vectors, perform a gesture magnitude operation, and perform an action based on the gesture and a result of the gesture magnitude operation.
Inventor(s): Edgar Charles Evangelista of San Jose CA (US) for samsung electronics co., ltd., Hiroshi Horii of Pleasanton CA (US) for samsung electronics co., ltd., Ajinkya Waghulde of Castro Valley CA (US) for samsung electronics co., ltd., Yujie Jiang of Santa Clara CA (US) for samsung electronics co., ltd., Sooryuh Kim of Seoul (KR) for samsung electronics co., ltd., Minkyung Cho of Seoul (KR) for samsung electronics co., ltd., Boosun Shin of Seoul (KR) for samsung electronics co., ltd., Sungman Kim of Seoul (KR) for samsung electronics co., ltd., Chaekyung Lee of Gwacheon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G02B27/01, G06F3/04842, G06F3/04845, G06F3/0485, G06F3/16, G06T19/00, G06V40/20
CPC Code(s): G06F3/017
Abstract: a method includes rendering a virtual widget at a first position in an extended reality (xr) space using a head-mounted display. the method also includes detecting a hand gesture of a user at a second position in the xr space using at least one optical sensor. the second position is between the first position and the optical sensor. the method further includes determining a duration of the hand gesture and a distance between the first and second positions. the method also includes performing a first or second type of action based on the duration and/or the distance. the first type of action corresponds to a system-level control of the virtual widget, and the second type of action corresponds to a content-level control of the virtual widget. in addition, the method includes rendering a visual and/or audio feedback based on at least one of the duration or the distance.
Inventor(s): Suna KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/044, G06V40/12, G06V40/13, G09G3/00, G09G3/3208
CPC Code(s): G06F3/04164
Abstract: an electronic device is provided. the electronic device includes a display in which a plurality of pixels are arranged, a display driver integrated circuit (ic) configured to control an operation of the display, a touch fingerprint sensor disposed inside the display and including transmit (tx) lines and receive (rx) lines formed of a metal mesh, a touch fingerprint sensor ic configured to control an operation of the touch fingerprint sensor, one or more processors configured to control operations of the display driver ic and the touch fingerprint sensor ic, and memory operatively connected to the one or more processors, wherein the memory store one or more computer programs, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors during a touch sensing operation, cause the electronic device to configure a plurality of tx touch channels by grouping the tx lines in a predetermined number of units, and supply a first tx signal to the plurality of tx touch channels, configure a plurality of rx channels by grouping the rx lines in a predetermined number of units, and receive a first rx signal of each of the plurality of rx channels, and detect a touch location, based on the first rx signal of each of the plurality of rx channels.
Inventor(s): Ajinkya Waghulde of Castro Valley CA (US) for samsung electronics co., ltd., Edgar Charles Evangelista of San Jose CA (US) for samsung electronics co., ltd., Hiroshi Horii of Pleasanton CA (US) for samsung electronics co., ltd., Yujie Jiang of Santa Clara CA (US) for samsung electronics co., ltd., Sooryuh Kim of Seoul (KR) for samsung electronics co., ltd., Minkyung Cho of Seoul (KR) for samsung electronics co., ltd., Boosun Shin of Seoul (KR) for samsung electronics co., ltd., Sungman Kim of Seoul (KR) for samsung electronics co., ltd., Chaekyung Lee of Gwacheon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04815, G06F3/01, G06F3/16, G06T19/00
CPC Code(s): G06F3/04815
Abstract: a method includes rendering a semi-transparent or opaque board on a display of an xr headset, such that the board does not overlap with at least one real-world object. the method also includes receiving a first user input to open a widget library. the method also includes rendering a grid structure on the board after receiving the first user input. the method also includes receiving a second user input to select a widget from the widget library. the method also includes receiving a third user input to move the selected widget to the grid structure on the board. the method also includes placing the selected widget at a position in the grid structure on the board. the method also includes stopping rendering the grid structure, while displaying the selected widget at the position on the board, with an orientation determined based at least partly on a user's head position.
Inventor(s): Younsun LEE of Suwon-si (KR) for samsung electronics co., ltd., Juyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunjung MOON of Suwon-si (KR) for samsung electronics co., ltd., Sungchan BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04845, G06F3/0481, G06F3/14
CPC Code(s): G06F3/04845
Abstract: a method for operating an electronic device is provided. the method includes changing a size of a first display area in response to identifying a user input instructing the electronic device to perform a sliding operation, and based on a size of a first user interface (ui) object included in the first display area, displaying the first ui object in a first display area and a second ui object corresponding to the first ui object in a second display area while the size of the first display area is changed, wherein the first display area includes a size-variable area, and the second display area includes a size-fixed area.
Inventor(s): Peng Gu of Santa Barbara CA (US) for samsung electronics co., ltd., Krishna T. Malladi of San Jose CA (US) for samsung electronics co., ltd., Hongzhong Zheng of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06N3/08
CPC Code(s): G06F3/064
Abstract: a storage device and method of controlling a storage device are disclosed. the storage device includes a host, a logic die, and a high bandwidth memory stack including a memory die. a computation lookup table is stored on a memory array of the memory die. the host sends a command to perform an operation utilizing a kernel and a plurality of input feature maps, includes finding the product of a weight of the kernel and values of multiple input feature maps. the computation lookup table includes a row corresponding to a weight of the kernel, and a column corresponding to a value of the input feature maps. a result value stored at a position corresponding to a row and a column is the product of the weight corresponding to the row and the value corresponding to the column.
Inventor(s): Ganesh Prabhakar Katyarmal of Bangalore (IN) for samsung electronics co., ltd., Amit Sharma of Bangalore (IN) for samsung electronics co., ltd., Puneet Jangid of Bangalore (IN) for samsung electronics co., ltd., Subhankar Ghosh of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06F7/544, G06F7/499, G06F7/57
CPC Code(s): G06F7/5443
Abstract: a method for performing a double precision high-speed arithmetic operation includes receiving first input data and second input data, generating first output data by performing a first logical operation on each of the first input data and the second input data, arranging a plurality of dot products in a row-wise manner, generating a second output data by performing a first arithmetic operation on the dot products, performing a transpose operation on a plurality of bit elements of the second output data by arranging least significant bits of the plurality of bit elements and the most significant bits in successive rows, and generating final output data by performing a second arithmetic operation on the transposed bit elements.
Inventor(s): Sangbum KIM of Seoul (KR) for samsung electronics co., ltd., Sung Min LEE of Yongin-si (KR) for samsung electronics co., ltd., Hoonroe LEE of Seoul (KR) for samsung electronics co., ltd., Hyunin MOON of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/049, G06N3/084
CPC Code(s): G06N3/049
Abstract: a computing device and an operating method of the computing device based on a spiking neural network (snn) are disclosed. the computing device includes a pulse generator configured to generate a pulse corresponding to an input spike signal; an snn including layers of spiking neurons each generating an output spike signal by applying the pulse to a neuron model; and a loss circuit module configured to calculate a loss value based on a potential value accumulated by the output spike signal generated for each of the layers and backpropagate the loss value to the snn.
Inventor(s): Yeongsik LEE of Seoul (KR) for samsung electronics co., ltd., Youngsok KIM of Seoul (KR) for samsung electronics co., ltd., Hanjun KIM of Seoul (KR) for samsung electronics co., ltd., Sungjun CHO of Seoul (KR) for samsung electronics co., ltd., Seonyeong HEO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/049, G06N3/084, G06V10/20, G06V10/82
CPC Code(s): G06N3/049
Abstract: a data processing method and apparatus using a neural network, and an electronic device including the data processing apparatus. the data processing method includes identifying an operator that selects one of a plurality of execution paths for a portion of the neural network while sequentially executing layers included in the neural network, selecting a specific execution path, from among the plurality of execution paths, based on a remaining time that is left for an inference of the neural network, and obtaining a result of the inference of the neural network through the specific execution path.
Inventor(s): Jongchul CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Bonkon KOO of Suwon-si (KR) for samsung electronics co., ltd., Youngmo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/50, G06F3/01, G06V10/25, G09G3/34, G09G3/36
CPC Code(s): G06T7/50
Abstract: an electronic device for obtaining a depth map from a coded image obtained using an active phase mask and a method for operating the same are provided. the electronic device according to an embodiment of the present disclosure may generate a first phase mask having a first coded aperture pattern in a first area on the active mask panel based on controlling the electrical driving signal applied to the active mask panel, obtain a coded image based on light transmitted through the first phase mask, wherein the coded image is phase-modulated, and wherein the light transmitted through the first phase mask is received via the image sensor, and obtain a depth map corresponding to the coded image by using an artificial intelligence model trained to extract a depth map from a convolution image.
Inventor(s): Jeongseop KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghyun Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/00, G06F16/58, G06F40/279, G06F40/40, G06V10/40, G06V20/60
CPC Code(s): G06T11/00
Abstract: a method for providing a personalized image using an electronic device, including: obtaining a prompt for image generation; extracting a keyword from the prompt; searching for one or more reference images corresponding to the keyword from among a plurality of images stored in the electronic device; segmenting a region related to the keyword within each reference image of the one or more reference images; obtaining image feature information based on the region related to the keyword; transmitting the prompt and the image feature information to a server; and receiving, from the server, a personalized image generated by providing the prompt and the image feature information as an input to a generative model.
Inventor(s): Jeongseop KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungmin Kwon of Suwon-si (KR) for samsung electronics co., ltd., Hyeji Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/60
CPC Code(s): G06T11/60
Abstract: a method includes: obtaining an original image designated as a background screen; obtaining, based on time information and weather information, a predefined prompt; obtaining display area information of a user interface (ui) object; generating a modified image corresponding to the time information and the weather information by applying the original image, the predefined prompt, and the display area information as input data to a generative model that generates the modified image, wherein in the modified image, the predefined prompt is reflected in a display area where the ui object is displayed in accordance with a first degree, and the predefined prompt is reflected in a remaining area other than the display area in accordance with a second degree that is different from the first degree; and displaying the modified image and the ui object as the background screen by overlaying the ui object on the modified image.
Inventor(s): Minjeong MOON of Suwon-si (KR) for samsung electronics co., ltd., Woonghee PARK of Suwon-si (KR) for samsung electronics co., ltd., Giyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Minjung MON of Suwon-si (KR) for samsung electronics co., ltd., Chunbae PARK of Suwon-si (KR) for samsung electronics co., ltd., Dami JEON of Suwon-si (KR) for samsung electronics co., ltd., Hayoung JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/60, G06T13/80
CPC Code(s): G06T11/60
Abstract: an electronic device includes an input module configured to receive, from a user, an input of a plurality of emotion representation contents representing emotions, a display, and a processor electrically connected to the input module and the display. the processor is configured to, in response to at least one emotion representation content among the plurality of emotion representation contents being different from other emotion representation contents among the plurality of emotion representation contents, present a recommended animation representation based on an emotion combination of the plurality of emotion representation contents.
Inventor(s): Woo-Yong CHANG of Yongin-si (KR) for samsung electronics co., ltd., Seung-dong YU of Osan-si (KR) for samsung electronics co., ltd., Se-jun PARK of Yongin-si (KR) for samsung electronics co., ltd., Min-jeong MOON of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/60, G01C21/36
CPC Code(s): G06T11/60
Abstract: an example system includes an electronic device and a server. the electronic device includes a display; a first communicator; and a first controller configured to: control to transmit, to the server, location data identifying locations of the electronic device. the server includes a second communicator; and a second controller configured to: control to receive the location data; identify a course of travel; link photograph images to locations on the course of travel; and control to transmit to the electronic device the course of travel and the photograph images. the first controller of the electronic device is configured to control to receive the course of travel and the photograph images and to control to display on the display, at the same time, a map image, the course of travel, and one or more of the photograph images linked to a selected location on the course of travel.
Inventor(s): Daiwoong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Soowan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/0346, G06V20/20
CPC Code(s): G06T19/006
Abstract: an electronic device is provided. the electronic device is configured to execute an augmented reality (ar) application, to obtain an image, to obtain sensing information including at least one of posture information or position information of the electronic device that correspond to the image, to produce a virtual object that is superimposed on the image according to a user input, to obtain, based on the image and the sensing information, identification information corresponding to the virtual object, and to output the virtual object to a display, in response to a case in which information, obtained via at least one sensor in the state in which the ar application is executed, corresponds to the sensing information.
Inventor(s): Xianbing TENG of Jiangsu (CN) for samsung electronics co., ltd., Jiang YU of Jiangsu (CN) for samsung electronics co., ltd., Jianhua BI of Jiangsu (CN) for samsung electronics co., ltd., Youxin CHEN of Jiangsu (CN) for samsung electronics co., ltd., Soonmook JEONG of Suwon-si (KR) for samsung electronics co., ltd., Longhai WU of Jiangsu (CN) for samsung electronics co., ltd., Jie CHEN of Jiangsu (CN) for samsung electronics co., ltd.
IPC Code(s): G06V10/26, G06F3/01, G06V10/25
CPC Code(s): G06V10/26
Abstract: an obstacle avoidance playing method includes acquiring human eye position information of a viewer in a playing scene and three-dimensional data of an object in a respective viewing space region; determining a visible region of a display screen based on the human eye position information, the three-dimensional data of the object, and size and position information of the display screen, the visible region corresponding to a portion of the display screen that is unobstructed to the viewer; and displaying image content using (i) a matched obstacle avoidance mode determined based on the visible region and (ii) a preset obstacle avoidance strategy such that the image content is displayed in the visible region.
Inventor(s): Jingzhi LI of Xi’an (CN) for samsung electronics co., ltd., Kai WANG of Xi’an (CN) for samsung electronics co., ltd., Zidong GUO of Xi’an (CN) for samsung electronics co., ltd., Jiwon BAEK of Suwon-si (KR) for samsung electronics co., ltd., Seungju HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V40/16, G06T3/40, G06T7/50
CPC Code(s): G06V40/172
Abstract: a processor-implemented method with image processing includes detecting facial keypoints from an input face image determining a face area of the input face image and a facial feature area of the input face image based on the facial keypoints, and determining the input face image to be an invalid face image in response to the facial feature area satisfying a first preset condition, wherein the first preset condition comprises either one or both of a shape condition regarding a shape of the facial feature area, and a position condition regarding a relationship between a position of the facial feature area and a position of the face area.
Inventor(s): Chaehoon LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyoungup KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungu PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00
CPC Code(s): G09G3/035
Abstract: an electronic device is provided. the electronic device includes a first display driving circuit configured to control the first area of the flexible display, a second display driving circuit configured to control the second area of the flexible display, a processor, and a memory storing instructions, which when executed by the processor, cause the electronic device to: while the housing is in the flat state, display a first execution screen, corresponding to a first application, on the first area and the second area of the flexible display, while the first execution screen, corresponding to the first application, is displayed on the first area and the second area of the flexible display, identify the housing being moved from flat state to the partially folded state, based at least on the housing being moved from the flat state to the partially folded state, display a second execution screen corresponding to the first application, different from the first execution screen, on the first area and the second area of the flexible display, and while the second execution screen is displayed in the partially folded state, control the first display driving circuit and the second driving circuit such that one of the first area and the second area of the flexible display, which is more closely aligned with a ground plane, consumes electrical power less than electrical power consumed by the other one of the first area and the second area of the flexible display.
Inventor(s): Choonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sung-Jin PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo BAE of Suwon-si (KR) for samsung electronics co., ltd., Seung-Hoon BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3233
CPC Code(s): G09G3/3233
Abstract: a display device includes a pixel array that includes a pixel including a light emitting diode and a first transistor that includes a source terminal to which a pixel drive voltage is applied and a gate terminal to which a data signal is applied, and outputs drive current generated based on the voltage difference between the gate terminal and the source terminal, to the light emitting diode, and a display driver ic that generates the data signal based on the pixel drive voltage.
Inventor(s): Heejin Lee of Suwon-si (KR) for samsung electronics co., ltd., Minsung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunkwon Kim of Suwon-si (KR) for samsung electronics co., ltd., Seongyoung Ryu of Suwon-si (KR) for samsung electronics co., ltd., Uijong Song of Suwon-si (KR) for samsung electronics co., ltd., Yilho Lee of Suwon-si (KR) for samsung electronics co., ltd., Yunrae Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3275, G09G3/00
CPC Code(s): G09G3/3275
Abstract: a display driving circuit includes a control logic, a source amplifier, and first and second switching elements. the source amplifier includes a first input terminal, a second input terminal, and an output terminal, and amplifies a pixel voltage for displaying an image on a display panel and provides the amplified pixel voltage to a pixel through a data line. the first switching element is connected between the first input terminal and the output terminal, and the second switching element is connected between the first input terminal and the sensing line. the control logic controls the first switching element and the second switching element such that the source amplifier compares a sample voltage that is input to the first input terminal through a sensing line with a comparison voltage input to the second input terminal and outputs comparison data based on the comparison.
Inventor(s): Pablo Peso PARADA of Chertsey (GB) for samsung electronics co., ltd., Mete OZAY of Chertsey (GB) for samsung electronics co., ltd., Karthikeyan SARAVANAN of Chertsey (GB) for samsung electronics co., ltd.
IPC Code(s): G10L15/07, G10L15/02, G10L15/04, G10L15/06, G10L15/18, G10L15/22, G10L15/30, G10L21/028
CPC Code(s): G10L15/075
Abstract: the disclosure generally relate to a method performed by a user device obtaining a pre-trained automatic speech recognition (asr) model, obtaining a user data from a user database, analysing a distribution of the user data with respect to an acoustic characteristic, determining, using the distribution, whether data augmentation for the acoustic characteristic is to be applied, when it is determined that data augmentation is to be applied, dividing the user data into a training subset and a validation subset, based on an acoustic characteristic being less audible in the training subset than in the validation subset, applying data augmentation to add the acoustic characteristic to the user data in the training subset, and updating the pre-trained asr model with the augmented training subset to generate a personalised local ml model.
Inventor(s): Manjunath Belgod LOKANATH of Bengaluru (IN) for samsung electronics co., ltd., Vishwanath Pethri KAMATH of Bengaluru (IN) for samsung electronics co., ltd., Rishabh SHUKLA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G10L15/22
CPC Code(s): G10L15/22
Abstract: a method for waking up a device among a plurality of devices in in a multi-reality environment is provided. the method includes detecting a voice input from a user, receiving, based on the voice input, a first plurality of wakeup parameters associated with a plurality of real-world devices in the real-world and a second plurality of wakeup parameters associated with a plurality of virtual-world devices in a virtual world, feeding the first plurality of wakeup parameters and the second plurality of wakeup parameters into a pre-trained artificial intelligence (ai)-based model a correlation of one or more of a context of the user, a history a device state of each of the plurality of real-world devices and the plurality of virtual-world devices, a device wakeup operation information of each of the plurality of real-world devices and the plurality of virtual-world devices, a task execution information of each of the plurality of real-world devices and the plurality of virtual-world devices, and error information in wake-up of each of the plurality of real-world devices and the plurality of virtual-world devices, predicting, by the pre-trained ai-based model, a target device based on the first plurality of wakeup parameters, the second plurality of wakeup parameters, and sending a wake-up signal to the target device for turning the target device into a listening state.
Inventor(s): Donghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Kiho Kim of Suwon-si (KR) for samsung electronics co., ltd., Kihan Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10
CPC Code(s): G11C7/1048
Abstract: disclosed are a memory device that performs offset calibration and a method of operating the memory device. the memory device includes an input/output pad configured to receive data from a device external, an on-die termination (odt) circuit connected to the input/output pad, a plurality of receivers connected to the odt circuit and configured to receive the data from the input/output pad, an offset calibration circuit configured to perform an offset calibration operation on data output from the plurality of receivers and output an offset correction, a first switch configured to provide a first voltage to the plurality of receivers, and a second switch configured to provide a second voltage to the plurality of receivers. during the offset calibration operation, the plurality of receivers receive a third voltage in response to the odt circuit being enabled and the first voltage through the first switch.
Inventor(s): DONGHA KIM of Suwon-si (KR) for samsung electronics co., ltd., DO-HAN KIM of Suwon-si (KR) for samsung electronics co., ltd., BOBAE KIM of Suwon-si (KR) for samsung electronics co., ltd., CHANGMIN LEE of Suwon-si (KR) for samsung electronics co., ltd., KYEONGJIN CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406
CPC Code(s): G11C11/40618
Abstract: a memory device according to an embodiment includes a memory cell array including a plurality of memory cells disposed in a plurality of rows, a register configured to store row addresses corresponding to the plurality of rows and access counts for the plurality of rows, and a refresh controller configured to determine a refresh address based on the stored row addresses and a refresh command being received, and change a refresh period for a target row based on the refresh address being associated with a previously performed refresh for the target row and the access count for a row corresponding to the target row being reached a threshold value.
Inventor(s): Woosul Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C16/04, G11C16/26
CPC Code(s): G11C16/08
Abstract: a memory device includes a memory cell array, a page buffer circuit including first to nth page buffers, each page buffer including a sensing node, and a control logic configured to control page buffer operations, wherein the control logic is further configured to control the page buffer operations such that, in a first page buffer operation on a first page buffer included in a first group, a precharge period and a discharge period for a first sensing node of the first page buffer are performed, in a fifth page buffer operation on a fifth page buffer included in a second group, a precharge period and a discharge period for a fifth sensing node of the fifth page buffer are performed, and in a sensing period of the fifth page buffer operation, sensing operations on the first and fifth sensing nodes are performed together.
Inventor(s): Haewook PARK of Suwon-si (KR) for samsung electronics co., ltd., Juhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Younsok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, G01R19/25, H01L21/683
CPC Code(s): H01J37/3299
Abstract: a plasma diagnosis apparatus comprising; an upper substrate, a lower substrate stacked with the upper substrate, at least one probe on the upper substrate, a plasma diagnosis circuit mounted in the lower substrate and configured to diagnose plasma in a chamber through the probe, a wireless communication circuit mounted in the lower substrate and configured to wirelessly transmit a result of the plasma diagnosis circuit to an external device, a battery mounted in the lower substrate and configured to supply power to the plasma diagnosis circuit and the wireless communication circuit, and a wireless charging circuit mounted in the lower substrate and configured to wirelessly charge the battery. the plasma diagnosis circuit includes a transformer, a first circuit connected to a primary wound line of the transformer, a second circuit connected between a secondary wound line of the transformer and the probe, a current detection circuit connected to the primary wound line of the transformer, and a signal processing circuit configured to generate data with diagnostic characteristics of the plasma based on an output of the current detection circuit.
20250006534. SEMICONDUCTOR TRANSFER DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seong Won Yeom of Suwon-si (KR) for samsung electronics co., ltd., Ki Beom Kil of Suwon-si (KR) for samsung electronics co., ltd., Byeong Kuk Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/677
CPC Code(s): H01L21/67766
Abstract: a semiconductor transfer device includes a vertical extension part extending in a first direction and including a first surface and a second surface opposite to each other in a second direction crossing the first direction, a support part on the first surface of the vertical extension part and extending in the first direction, a horizontal plate on the support part and extending in the second direction, and including a corner at which a first edge extending in the second direction along a circumference of the horizontal plate and a second edge extending in a third direction crossing the first direction and the second direction along the circumference of the horizontal plate intersect, and a first-type guide part extending from an upper surface of the horizontal plate at the corner.
Inventor(s): Youngtek OH of Suwon-si (KR) for samsung electronics co., ltd., Kyungwook HWANG of Suwon-si (KR) for samsung electronics co., ltd., Dongho KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Minchul YU of Suwon-si (KR) for samsung electronics co., ltd., Junsik HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, H01L21/67, H01L21/68
CPC Code(s): H01L21/6835
Abstract: a semiconductor chip wet transfer method includes: preparing a transfer substrate that includes a plurality of recesses; supplying a liquid that includes semiconductor chips onto the plurality of recesses of the transfer substrate; aligning the semiconductor chips in the plurality of recesses by sweeping, with an align bar, an upper surface of the transfer substrate supplied with the liquid; and performing cleaning by removing semiconductor chips that are not aligned in the plurality of recesses by using a first magnetic force generating device disposed facing a lower surface of the transfer substrate.
20250006567. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunsu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/13, H01L21/48, H01L23/00, H01L23/31, H01L25/16
CPC Code(s): H01L23/13
Abstract: a semiconductor package includes a substrate including a first surface and a second surface facing each other, a semiconductor chip on the substrate, a passive element disposed spaced apart from the semiconductor chip in a first direction parallel to the first surface of the substrate, and a first insulating pattern on an edge region of the first surface. the substrate includes a recessed portion formed on the first surface, the passive element vertically overlaps the recess portion, and the first insulating pattern protrudes in a second direction perpendicular to the first surface of the substrate.
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Youngkun Jee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/36, H01L23/00, H01L23/31, H01L23/498, H01L23/538, H01L25/10, H10B80/00
CPC Code(s): H01L23/36
Abstract: a semiconductor package is provided. the semiconductor package includes: a redistribution substrate; a first semiconductor chip provided on a right portion, in a first direction, of the redistribution substrate; a through-post provided on the redistribution substrate in a region adjacent to a left side, in the first direction, of the first semiconductor chip; a heat dissipation chip provided on the first semiconductor chip; and a second semiconductor device provided adjacent to the heat dissipation chip on the through-post. a metal pad and an adhesive layer are provided between the heat dissipation chip and the first semiconductor chip.
20250006594. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SHAOFENG DING of Suwon-si (KR) for samsung electronics co., ltd., JEONG HOON AHN of Seongnam-si (KR) for samsung electronics co., ltd., YUN KI CHOI of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/522, H01L23/528, H01L25/18
CPC Code(s): H01L23/481
Abstract: a semiconductor device includes a substrate provided with an integrated circuit and a contact, an interlayer dielectric layer covering the integrated circuit and the contact, a through electrode penetrating the substrate and the interlayer dielectric layer, a first intermetal dielectric layer on the interlayer dielectric layer, and first and second wiring patterns in the first intermetal dielectric layer. the first wiring pattern includes a first conductive pattern on the through electrode, and a first via penetrating the first intermetal dielectric layer and connecting the first conductive pattern to the through electrode. the second wiring pattern includes a second conductive pattern on the contact, and a second via penetrating the first intermetal dielectric layer and connecting the second conductive pattern to the contact. a first width in a first direction of the first via is greater than a second width in the first direction of the second via.
Inventor(s): HYUNJU LEE of Suwon-si (KR) for samsung electronics co., ltd., GYUHO KANG of Suwon-si (KR) for samsung electronics co., ltd., SUNG KEUN PARK of Suwon-si (KR) for samsung electronics co., ltd., KWANGOK JEONG of Suwon-si (KR) for samsung electronics co., ltd., JAEMOK JUNG of Suwon-si (KR) for samsung electronics co., ltd., JU-IL CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00
CPC Code(s): H01L23/49816
Abstract: a semiconductor package may include: a substrate; a seed layer on a first surface of the substrate; a pad on the seed layer and including a first metal layer and a second metal layer on the first metal layer; an insulating layer on the first surface and including a side surface in contact with the second metal layer; and a semiconductor chip above a second surface of the substrate. an interface between the side surface of the insulating layer and the second metal layer may be nonplanar.
20250006618. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Youngkun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/48, H01L25/18
CPC Code(s): H01L23/49838
Abstract: provided is a semiconductor package including a package substrate, a redistribution structure including a single-layered insulating layer positioned above the package substrate, and a plurality of horizontal redistribution structures embedded in the insulating layer and arranged side-by-side in a first horizontal direction parallel to an upper surface of the package substrate and in a second horizontal direction perpendicular to the first horizontal direction, external connection terminals arranged below the redistribution structure, and a semiconductor chip provided on the redistribution structure and including a chip body and chip connection terminals arranged below the chip body, wherein each of the plurality of horizontal redistribution structures includes a via passing through the insulating layer, and a tracer pattern formed integrally with the via and inclined and long from the first horizontal direction and the second horizontal direction.
Inventor(s): Chonghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Yunrae CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L23/49838
Abstract: a package substrate includes a substrate base, a plurality of wiring pads, and a plurality of wiring lines. the substrate base includes a first surface and a second surface that is opposite to the first surface. the substrate base is divided into a plurality of regions. the plurality of wiring pads are arranged on the first surface of the substrate base and are apart from each other in a horizontal direction. the plurality of wiring lines are arranged on the first surface of the substrate base and extend from corresponding ones of the plurality of wiring pads, respectively. the plurality of wiring pads have different horizontal area in different regions of the substrate base.
20250006625. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunsoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaesic Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/00, H01L23/31, H01L23/48, H01L23/498, H01L23/538, H01L25/065, H10B80/00
CPC Code(s): H01L23/5222
Abstract: a semiconductor package is provided. the semiconductor package includes a first semiconductor chip, which includes: a first semiconductor substrate having a first surface and a second surface, which are opposite to each other; a circuit layer on the first surface; a first interconnection layer on the circuit layer; a second interconnection layer on the second surface; a penetration via extending from the second surface into the first semiconductor substrate; and a capacitor extending from the second surface toward the first surface. the capacitor is spaced apart from the penetration via in a first direction that is parallel to the first surface of the first semiconductor substrate.
20250006636. SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gwang Guk AN of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho SONG of Suwon-si (KR) for samsung electronics co., ltd., Zhe WU of Suwon-si (KR) for samsung electronics co., ltd., So Yeon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H10B63/00, H10N70/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor memory device comprising: a substrate extending in a first direction and a second direction; first conductive lines extending in the first direction on the substrate; first insulating structures that are alternately arranged with the first conductive lines in the second direction, wherein the first insulating structures extend in a third direction intersecting the first direction and the second direction; first information storage films on the first conductive lines and the first insulating structures; and second conductive lines extending in the second direction on the first information storage films, wherein the first information storage films include first regions that overlap the first conductive lines in the third direction and second regions that overlap the first insulating structures in the third direction, and a first height of upper surfaces of the first regions is different from a second height of upper surfaces of the second regions.
20250006641. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yoon Hee KANG of Suwon-si (KR) for samsung electronics co., ltd., Jong Min BAEK of Suwon-si (KR) for samsung electronics co., ltd., Eui Bok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/535, H01L21/768, H01L23/522, H01L23/532
CPC Code(s): H01L23/535
Abstract: a semiconductor device including a first interlayer insulating layer on a substrate, a lower wiring pattern in the first interlayer insulating layer, a second interlayer insulating layer on the first interlayer insulating layer, a via filling layer filling a via trench in the second interlayer insulating layer, a third interlayer insulating layer contacting an upper surface of the second interlayer insulating layer, and an upper wiring pattern in an upper wiring trench formed on the via trench in the third interlayer insulating layer and contacting an upper surface of the via filling layer, the upper wiring pattern including a first upper wiring barrier layer on sidewalls of the upper wiring trench, a second upper wiring barrier layer on sidewalls of the first upper wiring barrier layer and the upper surface of the via filling layer, and an upper wiring filling layer on the second upper wiring barrier layer.
Inventor(s): YOUNGBAE KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L23/00, H01L23/373, H01L25/065, H01L25/18, H10B80/00
CPC Code(s): H01L23/5385
Abstract: a wiring substrate may include a core portion, an upper peripheral portion on a top surface of the core portion, and a lower peripheral portion on a bottom surface of the core portion. the upper peripheral portion may include a bridge chip provided on the top surface of the core portion, upper insulating patterns provided on the top surface of the core portion to cover the bridge chip, and upper interconnection patterns in the upper insulating patterns. the lower peripheral portion may include a dummy structure on the bottom surface of the core portion, lower insulating patterns on the bottom surface of the core portion to cover the dummy structure, and lower interconnection patterns in the lower insulating patterns. a mean thermal expansion coefficient of the upper peripheral portion may be substantially equal to a mean thermal expansion coefficient of the lower peripheral portion.
Inventor(s): Seunghye BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jeonghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae KANG of Suwon-si (KR) for samsung electronics co., ltd., Ilhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngsik PARK of Suwon-si (KR) for samsung electronics co., ltd., Muyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangho JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544
CPC Code(s): H01L23/544
Abstract: a semiconductor device includes a semiconductor substrate, a first test pattern disposed on the semiconductor substrate, and a second test pattern located adjacent to the first test pattern. the first test pattern includes an overlay pattern, and the second test pattern includes a test element group.
Inventor(s): Jinkyeong SEOL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L24/06
Abstract: a semiconductor package includes a first semiconductor chip including first bonding pads disposed in a first main region on a first surface of a first substrate, first dummy bonding pads disposed in a first peripheral region on the first surface of the first substrate, and a first passivation layer disposed on the first surface, and a second semiconductor chip on the first semiconductor chip and including a wiring layer on a third surface of a second substrate and including redistribution pads in a second main region, second bonding pads disposed on the redistribution pads, second dummy bonding pads disposed in a second peripheral region on the wiring layer, and a second passivation layer disposed on the wiring layer. the first bonding pads and the second bonding pads are directly bonded to each other. the first dummy bonding pads and the second dummy bonding pads are directly bonded to each other.
Inventor(s): Yongkoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngchan KO of Suwon-si (KR) for samsung electronics co., ltd., Byung Ho KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/522, H01L25/00
CPC Code(s): H01L25/0652
Abstract: a semiconductor package may include a first redistribution layer, bridge dies on an upper surface of the first redistribution layer, a second redistribution layer on the bridge dies and electrically connected to the bridge dies, conductive posts between the first and second redistribution layer, and semiconductor chips on an upper surface of the second redistribution layer. each bridge die may include connection pads on an upper surface of the bridge dies. a pitch between first connection pads of a first bridge die among the bridge dies may be smaller than a pitch between second connection pads of a second bridge die among the bridge dies. a distance between an upper surface of the first bridge die and a lower surface of the second redistribution layer may be smaller than a distance between an upper surface of the second bridge die and a lower surface of the second redistribution layer.
Inventor(s): Chulwoo KIM of Incheon (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes a package substrate, an interposer on the package substrate, semiconductor devices in individual mounting regions on a first surface of the interposer, respectively, first conductive connection members, and a molding member on the interposer. the interposer has first bonding pads in the individual mounting regions, respectively. the semiconductor devices each have chip pads electrically connected to the first bonding pads. the first conductive connection members are between the first bonding pads and the chip pads. the molding member covers the semiconductor devices and fills gaps between the first surface of the interposer and the semiconductor devices. at least one of the individual mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, and the first bonding pads are in the pad regions.
20250006703. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong Uk KIM of Suwon-si (KR) for samsung electronics co., ltd., Heon Joo HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a package substrate. a lower chip is on the package substrate. an upper chip is on the lower chip. an input/output signal bump is between the lower chip and the package substrate and receives/outputs a signal to/from the lower chip. a wire bonding pad is on the upper chip and includes a wire connected thereto. a first input/output signal ball is on the package substrate and receives/outputs the signal to/from the lower chip and is connected to the input/output signal bump. a second input/output signal ball is on the package substrate and receives/outputs a signal to/from the upper chip and is electrically connected to the wire bonding pad. the input/output signal bump is closer to the first input/output signal ball than the second input/output signal ball. the wire bonding pad is closer to the second input/output signal ball than the first input/output signal ball.
20250006714. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): DAEHO LEE of Hwaseong-si (KR) for samsung electronics co., ltd., JINHYUN KIM of Yongin-si (KR) for samsung electronics co., ltd., WANSOO PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/498
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes a first redistribution substrate, a first semiconductor chip disposed on the first redistribution substrate, a first mold layer that covers the first semiconductor chip and the first redistribution substrate, a second redistribution substrate disposed on the first mold layer, a second semiconductor chip disposed on the second redistribution substrate, where the second semiconductor chip includes a second-chip first conductive bump that does not overlap the first semiconductor chip, a first sidewall that overlaps the first semiconductor chip, and a second sidewall that does not overlap the first semiconductor chip, wherein the first sidewall and the second sidewall are opposite to each other, and a first mold via that penetrates the first mold layer connects the second-chip first conductive bump to the first redistribution substrate, and overlaps the second-chip first conductive bump.
Inventor(s): Daeyoung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jongbo SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L21/56, H01L23/00, H01L23/29, H01L23/31, H01L23/498
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes a package substrate, at least one dam structure extending on the package substrate to surround substrate pads and defining an inner space that accommodates the substrate pads on the package substrate, a first semiconductor on the package substrate, a second semiconductor chip attached to the first semiconductor chip by an adhesive film, bonding wires electrically connecting chip pads of the second semiconductor chip to the substrate pads of the package substrate, a first underfill member filling a gap between the package substrate and the first semiconductor chip, a second underfill member filling the inner space of the at least one dam structure, and a molding member covering the first semiconductor chip, the second semiconductor chip and the first and second underfill members on the package substrate.
Inventor(s): Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Yibing Michelle WANG of Temple City CA (US) for samsung electronics co., ltd., Tze-Ching FUNG of Diamond Bar CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14625
Abstract: provided are systems, methods, and apparatuses for non-scattering nanostructures of silicon pixel image sensors. in one or more examples, the systems, devices, and methods include forming a metal layer on a substrate layer of the pixel, the metal layer to reflect electromagnetic radiation incident on the pixel; forming a photodetector on a silicon layer of the pixel, the photodetector to generate photoelectrons based on the electromagnetic radiation; and forming a passivation layer over the silicon layer, the passivation layer including a thin film dielectric. in one or more examples, the systems, devices, and methods include forming a nanostructure on the passivation layer, the nanostructure to allow the electromagnetic radiation to pass through the nanostructure and steer the electromagnetic radiation linearly towards the photodetector, and forming a microlens on the nanostructure, the microlens including at least one of a flat coat layer or a curved lensing layer.
Inventor(s): Kook Tae Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor includes a substrate that includes a plurality of pixel areas, where the substrate includes a first surface and a second surface that are opposite to each other; and a device isolation pattern that extends from the first surface and into the substrate, where the device isolation pattern is between the plurality of pixel areas, where the device isolation pattern includes an intervening region, a crossing region, a first device isolation portion, and a second device isolation portion, where the intervening region includes: a first dielectric pattern; a conductive liner; and a second dielectric pattern, where the first dielectric pattern extends from the first device isolation portion and toward the second device isolation portion, and where the first device isolation portion includes the conductive liner and the second dielectric pattern.
Inventor(s): Kook Tae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jingyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor includes a substrate that includes a first surface and a second surface that are opposite to each other, where the substrate includes a plurality of pixel areas; an isolation pattern that extends from the first surface and into the substrate, where the isolation pattern is between the plurality of pixel areas; and an antireflection layer on the isolation pattern, where the isolation pattern includes: a first device isolation pattern that contacts the antireflection layer; and a second device isolation pattern that is spaced apart from the antireflection layer, where the first device isolation pattern includes: a first dielectric layer; and a conductive reflection layer on the first dielectric layer, and where a top surface of the conductive reflection layer and a top surface of the first dielectric layer extend from the second surface of the substrate by a same distance.
20250006765. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jehyung RYU of Suwon-si (KR) for samsung electronics co., ltd., Hajin Lim of Suwon-si (KR) for samsung electronics co., ltd., Taeksoo Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor is provided. the image sensor includes a semiconductor substrate including a first surface, and a second surface opposite to the first surface, the semiconductor substrate further including a photoelectric conversion region; a transmission gate disposed on the first surface of the semiconductor substrate; a buried insulation layer disposed on the first surface of the semiconductor substrate to cover the transmission gate; and a pixel isolation structure disposed in a pixel isolation trench, the pixel isolation trench extending toward the second surface of the semiconductor substrate from the first surface of the semiconductor substrate and passing through the buried insulation layer, the pixel isolation structure defining a plurality of pixels in the semiconductor substrate, a portion of the pixel isolation structure being covered by the buried insulation layer.
Inventor(s): Jihun Lim of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Myunghae Seo of Suwon-si (KR) for samsung electronics co., ltd., Sungki Min of Suwon-si (KR) for samsung electronics co., ltd., Chang Kyu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14643
Abstract: a dual vertical transfer gate, a transistor including the same, and a cmos image sensing device including the same. in some embodiments, a gate of the dual vertical transfer transistor may include a pair of poles, which are extended to an n-type region of a photodiode, and a connecting portion, which connects the paired poles to each other. a first insulating pattern may be provided between the poles and on the substrate.
20250006771. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon Park of Suwon-si (KR) for samsung electronics co., ltd., Yun Ki Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14645
Abstract: an image sensor includes a first sub-pixel group including a plurality of first unit pixels, a first color filter, a first micro lens at least partially overlapping the plurality of first unit pixels, a second sub-pixel group including a plurality of second unit pixels, a second color filter, a second micro lens at least partially overlapping the plurality of second unit pixels, a third sub-pixel group including a plurality of third unit pixels, a third color filter, a third micro lens at least partially overlapping the plurality of third unit pixels, a first dead zone in which the first micro lens does not overlap the first sub-pixel group, a second dead zone in which the second micro lens does not overlap the second sub-pixel group, and a third dead zone in which the third micro lens does not overlap the third sub-pixel group.
Inventor(s): Haeryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Eunae CHO of Hwaseong-si (KR) for samsung electronics co., ltd., Beomseok KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Jeeeun YANG of Suwon-si (KR) for samsung electronics co., ltd., Jooho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/08, H01G4/008, H10B12/00
CPC Code(s): H01L28/56
Abstract: a capacitor includes a first electrode, a second electrode spaced apart from the first electrode, a dielectric layer arranged between the first electrode and the second electrode, and an interface layer arranged between the second electrode and the dielectric layer, wherein the interface layer includes a first element, a second element, and a third element, the first element includes aluminum (al), the second element includes gallium (ga), and the third element includes oxygen (o).
20250006789. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bo Kyung SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sang Min CHO of Suwon-si (KR) for samsung electronics co., ltd., Jeong Yong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Dong Woo KANG of Suwon-si (KR) for samsung electronics co., ltd., Hong Bae PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device includes an active pattern including a lower pattern extending a first direction and a plurality of sheet patterns spaced apart from the lower pattern in a second direction, the plurality of sheet patterns including an uppermost sheet pattern, a plurality of gate structures disposed to be spaced apart from each other in the first direction on the active pattern and including gate electrodes extending in a third direction and gate spacers on sidewalls of the gate electrodes and a source/drain pattern disposed between the gate structures adjacent to each other and including a semiconductor liner film and a semiconductor filling film on the semiconductor liner film, wherein the semiconductor liner film covers a portion of an upper surface of an uppermost sheet pattern.
Inventor(s): Tae Hyun Ryu of Suwon-si (KR) for samsung electronics co., ltd., Dong Hoon Hwang of Suwon-si (KR) for samsung electronics co., ltd., Myung Il Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyo Jin Kim of Suwon-si (KR) for samsung electronics co., ltd., Byung Ho Moon of Suwon-si (KR) for samsung electronics co., ltd., Nam Hyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/10, H01L29/417
CPC Code(s): H01L29/1033
Abstract: a semiconductor device includes a first and second channel separation structures extending in a first direction and spaced apart from each other in a second direction, first gate structures spaced apart from each other in the first direction between the first and second channel separation structures and in contact with the first and second channel separation structures, first and second channel patterns including first and second sheet patterns, respectively, spaced apart from each other in a third direction and in contact with the corresponding first and second channel separation structures, first and second source/drain patterns between the first and second channel separation structures, the first source/drain patterns in contact with the first channel patterns and the first channel separation structure, the second source/drain patterns in contact with the second channel patterns and the second channel separation structure, and first gate separation structures between the first and second source/drain patterns.
20250006817. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungmin KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L29/06, H01L29/423
CPC Code(s): H01L29/66553
Abstract: a semiconductor device comprising: a substrate including an active pattern; a channel pattern on the active pattern, wherein the channel pattern includes a plurality of semiconductor patterns; a source/drain pattern connected to the plurality of semiconductor patterns; a gate electrode extending in a first direction on the channel pattern, wherein the gate electrode includes an inner gate electrode between first and second semiconductor patterns among the plurality of semiconductor patterns; and an inner gate spacer between the inner gate electrode and the source/drain pattern, wherein the inner gate spacer includes a center portion and an edge portion, the center portion has a first thickness in a second direction, the edge portion has a second thickness in the second direction, the first thickness is greater than the second thickness, the first and second semiconductor patterns are adjacent to each other in a third direction.
20250006830. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongryeol Yoo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/775, H01L27/092, H01L29/06, H01L29/417, H01L29/423, H01L29/786
CPC Code(s): H01L29/775
Abstract: a semiconductor device includes an insulating substrate, a silicon layer on the insulating substrate, a dopant layer on the silicon layer, a buried spacer on a side surface of the dopant layer, a channel pattern on the dopant layer, the channel pattern comprising a plurality of semiconductor patterns vertically stacked and spaced apart from each other, a source/drain pattern on the buried spacer, the source/drain pattern connected to the channel pattern, a gate electrode on the channel pattern, the gate electrode comprising a plurality of inner electrodes between the semiconductor patterns, respectively, a lower power interconnection line in a lower portion of the insulating substrate, and a backside contact extending into the insulating substrate and the silicon layer to electrically connect the lower power interconnection line to the source/drain pattern. a side surface of the backside contact is in contact with the silicon layer and the buried spacer.
20250006844. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeeeun YANG of Suwon-si (KR) for samsung electronics co., ltd., Sangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkwan CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L27/118, H01L29/66, H10B10/00
CPC Code(s): H01L29/78618
Abstract: a semiconductor device includes an oxide semiconductor layer, a first electrode and a second electrode, which are arranged apart from each other on the oxide semiconductor layer, a metal oxide layer arranged between the oxide semiconductor layer and at least one of the first electrode and the second electrode, and a metal nitride layer arranged between the metal oxide layer and the oxide semiconductor layer.
Inventor(s): Seongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongeun YUN of Suwon-si (KR) for samsung electronics co., ltd., Jeongrok OH of Suwon-si (KR) for samsung electronics co., ltd., Sungwoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Chulsoo YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/50, F21V8/00, H01L25/075
CPC Code(s): H01L33/504
Abstract: a light emitting device includes a first light emitter including a first light emitting chip emitting first blue light and at least one among a first phosphor and a second phosphor, the first light emitter being configured to emit second blue light, and a second light emitter including a second light emitting chip emitting third blue light and at least one among a third phosphor and a fourth phosphor, the second light emitter being configured to emit fourth blue light, wherein a ratio of an intensity of a peak wavelength of the fourth blue light to an intensity of a peak wavelength of the second blue light is greater than or equal to 0.6.
20250007148. ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Eunbae KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd., Kyonghwan CHO of Suwon-si (KR) for samsung electronics co., ltd., Sungjae MOON of Suwon-si (KR) for samsung electronics co., ltd., Wanjae JU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/38, H04M1/02
CPC Code(s): H01Q1/243
Abstract: according to an example embodiment of the disclosure, an electronic device is provided. the electronic device includes a front cover forming at least a portion of the front surface of the electronic device, a non-conductive case including a rear portion forming at least a portion of the rear surface of the electronic device and a side portion forming at least a portion of the side surface of the electronic device, a support positioned between the front cover and the non-conductive case and including a first portion and a second portion, wherein the first portion is positioned between the second portion and the side portion, a first conductive pattern disposed between the first portion or the side portion, a second conductive pattern positioned between the second portion and the rear portion and spaced apart from the first conductive pattern, a wireless communication circuit configured to transmit a signal in a designated frequency band through the first conductive pattern and the second conductive pattern, and a seal disposed between the first portion and the rear portion and configured to block fluid flow from a first area where the first conductive pattern is disposed to a second area where the second conductive pattern is disposed.
Inventor(s): Jungwoo SEO of Suwon-si (KR) for samsung electronics co., ltd., Jungi JEONG of Suwon-si (KR) for samsung electronics co., ltd., Taeksun KWON of Suwon-si (KR) for samsung electronics co., ltd., Chanju PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongjin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk WI of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q9/04, H01Q21/06
CPC Code(s): H01Q9/0407
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate than a 4g communication system such as lte. an electronic device comprising an antenna module, according to an embodiment of the present disclosure, comprises: a communication module for communicating with an external electronic device; a first antenna module including a plurality of first antenna cells and first dummy cells surrounding the plurality of first antenna cells; and a controller for controlling the communication module and the first antenna module. each of the plurality of first antenna cells may be configured to have a first size, and each of the first dummy cells may be configured to have a second size smaller than the first size.
Inventor(s): Mingi SONG of Suwon-si (KR) for samsung electronics co., ltd., Juhyang LEE of Suwon-si (KR) for samsung electronics co., ltd., Geonhong MIN of Suwon-si (KR) for samsung electronics co., ltd., Kyungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Changhak O of Suwon-si (KR) for samsung electronics co., ltd., Inkook YOON of Suwon-si (KR) for samsung electronics co., ltd., Hwarang CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00, H02J7/06, H02J50/00
CPC Code(s): H02J7/007182
Abstract: a first electronic device configured to receive power wirelessly according to an embodiment may include: a power receiving circuit including a plurality of capacitors, at least one coil, and at least one switch, a rectifier including a plurality of transistors, and a control circuit. the control circuit according to an embodiment may be configured to: set the plurality of capacitors and the at least one coil to a first connection state through the at least one switch, based on a frequency specified by a second electronic device transmitting power wirelessly; receive alternating current (ac) power wirelessly from the second electronic device through the power receiving circuit set to the first connection state; control the plurality of transistors included in the rectifier to rectify the power received from the second electronic device; identify a first voltage of power rectified to direct current (dc) through the rectifier; set the plurality of capacitors and the at least one coil to a second connection state through the at least one switch to increase an impedance of the plurality of capacitors and/or change a resonant frequency of the power, based on identifying that the first voltage is greater than a first threshold; and control the plurality of transistors included in the rectifier to freewheel the power received from the second electronic device.
Inventor(s): Kihoon KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyungpil KUM of Suwon-si (KR) for samsung electronics co., ltd., Donghwan SEO of Suwon-si (KR) for samsung electronics co., ltd., Hyeonchang SON of Suwon-si (KR) for samsung electronics co., ltd., Sejeong OH of Suwon-si (KR) for samsung electronics co., ltd., Jinbae LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyeongmun JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03L1/02
CPC Code(s): H03L1/02
Abstract: provided in an embodiment of the present disclosure are a method and an apparatus for maintaining communication performance of an electronic device in correspondence with the internal temperature of the electronic device. the electronic device according to an embodiment of the present disclosure can comprise: a communication circuit; an oscillator set to generate a clock related to the communication circuit; a plurality of electronic components arranged in the vicinity of the oscillator; a plurality of temperature sensing devices each corresponding to each of the plurality of electronic components; and a processor. according to one embodiment, the processor can operate to: collect, from the plurality of temperature sensing devices, temperature data related to the plurality of electronic components; predict a temperature change related to the plurality of electronic components on the basis of the collected temperature data; determine, on the basis of the predicted temperature change, a reference electronic component to be referred to in the oscillator clock generation; and control the oscillator clock generation on the basis of temperature data on the determined reference electronic component.
Inventor(s): Yohan MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd., Hyunsang KANG of Suwon-si (KR) for samsung electronics co., ltd., Dongil YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H03F1/02, H03F3/24
CPC Code(s): H04B1/0458
Abstract: an electronic device is provided. the electronic device includes a first antenna. the electronic device includes a second antenna. the electronic device includes power supply circuitry including a first power supply circuit and a second power supply circuit. the electronic device includes a first front end module (fem) including a power amplifier (pa) connected to the first power supply circuit and connectable to the second power supply circuit. the electronic device includes a second fem including a pa connected to the second power supply circuit and connectable to the first power supply circuit. the electronic device includes at least one processor comprising processing circuitry.
20250007544. POWER AMPLIFIER-AWARE MODULATION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Caleb K. Lo of San Jose CA (US) for samsung electronics co., ltd., Joonyoung Cho of Portland OR (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd., Chance Anthony Tarver of Arlington TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H04L27/04
CPC Code(s): H04B1/0475
Abstract: methods and apparatuses for dynamically adjusting parameters of a modulation scheme and parameters of a digital pre-distorter (dpd) to pre-compensate for distortion effects of a power amplifier (pa). a user equipment (ue) comprises a modulator configured to generate modulation symbols from input bits according to an adjusted symbol constellation, a dpd operably configured to generate pre-distorted symbols, and a pa configured to amplify the pre-distorted symbols to generate transmission symbols that include distortion effects of the pa. the adjusted symbol constellation is adjusted from a target symbol constellation such that the generated modulation symbols pre-compensate for the distortion effects. the dpd is further configured to generate the pre-distorted symbols from the modulation symbols using a pre-distortion function to further pre-compensate for the distortion effects, and update the pre-distortion function such that a difference between the transmission symbols and a scaled version of the target symbol constellation is reduced.
Inventor(s): Donggu KIM of Suwon-si (KR) for samsung electronics co., ltd., Woojae JEONG of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungsoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hanjin KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/04, H04W56/00
CPC Code(s): H04B7/04013
Abstract: disclosed is a network entity including a transceiver; a memory storing one or more instructions; and at least one processor configured to execute the one or more instructions stored in the memory, wherein the at least one processor is configured to receive, from a base station (bs), a reconfigurable intelligent surface (ris) control signal including ris reflective pattern information and configuration information for the ris reflective pattern information, and control a reflective pattern of an ris based on the ris reflective pattern information and the configuration information for the ris reflective pattern information.
Inventor(s): Seunghyun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwonjong LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyungje LEE of Seoul (KR) for samsung electronics co., ltd., Chahyeon EOM of Seoul (KR) for samsung electronics co., ltd., Chungyong LEE of Seoul (KR) for samsung electronics co., ltd., Jieun YU of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L25/02, H04W72/23
CPC Code(s): H04B7/0626
Abstract: the present disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting higher data rates after a 4generation (4g) communication system such as long term evolution (lte). an embodiment of the present disclosure provides a method by which a base station (bs) supports multiple accesses of a plurality of user equipments (ues) by using a switch network (sn). the method may include obtaining channel state information (csi) from the plurality of ues, identifying a plurality of subarrays (sas) formed from an antenna array having a plurality of antenna elements, identifying at least one sa to be allocated to the plurality of ues from among the plurality of sas, determining a structure of a sn corresponding to each of the plurality of ues, and supporting the multiple accesses of the plurality of ues, based on the determined structure of the sn.
Inventor(s): Caleb K. Lo of San Jose CA (US) for samsung electronics co., ltd., Joonyoung Cho of Portland OR (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L1/00, H04L27/26
CPC Code(s): H04L1/0042
Abstract: methods and devices for transmission symbol modulation that accounts for distortion introduced by a power amplifier (pa). a user equipment (ue) comprises a transceiver and a processor. the transceiver is configured to transmit, to a base station (bs), ue capability information that indicates support for adjusted symbol constellations, wherein the adjusted symbol constellations are adjusted to pre-compensate for distortion effects of a power amplifier (pa) in the transceiver, and receive, from the bs, a modulation and coding scheme (mcs) indication. the processor is configured to determine, based on the mcs indication, an adjusted symbol constellation, and generate modulation symbols from input bits according to the determined adjusted symbol constellation. the transceiver is further configured to transmit, to the bs, the modulation symbols.
Inventor(s): Anum Ali of Frisco TX (US) for samsung electronics co., ltd., Yuqiang Heng of Plano TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Priyabrata Parida of Dallas TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L47/12, H04L43/0888
CPC Code(s): H04L47/12
Abstract: a method of operating a ue includes receiving and transmitting traffic, over a time step, based on a first set of rf parameters received from a nw device. the method further includes classifying the traffic received and transmitted over the time step into a traffic class, selecting a second set of rf parameters based on the traffic class, estimating a throughput demand and a throughput supply, and determining, based on the estimated throughput demand and the estimated throughput supply, whether an anomalous traffic condition has occurred. the method further includes, if an anomalous traffic condition has not occurred, transmitting a request to the nw device to configure the ue with the second set of rf parameters, and if an anomalous traffic condition has occurred, transmitting a request to the nw device to configure the ue with a third set of rf parameters selected to alleviate the anomalous traffic condition.
Inventor(s): Kisuk KWEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L61/256, H04L61/2514, H04W76/38
CPC Code(s): H04L61/256
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of operation by a first network entity in a wireless communication system. the method includes transmitting a first request message for a list of services which can be provided to the first network entity and type information of network address translation (nat) to a second network entity having an nat function, receiving a first response message including the list of the services which can be provided to the first network entity and the type information of the nat from the second network entity, transmitting an operation indication message related to a timer of ip address mapping information managed by the nat to the second network entity, and receiving a response message to the operation indication message from the second network entity.
20250007918. MULTITENANCY SSD ACCESS CONTROL_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daniel Lee HELMICK of Thornton CO (US) for samsung electronics co., ltd., Mark Allen GAERTNER of Fort Myers FL (US) for samsung electronics co., ltd., Chun-Chu Chen-Jhy Archie WU of San Carlos CA (US) for samsung electronics co., ltd., Siamak ARYA of Cupertino CA (US) for samsung electronics co., ltd., Vipin Kumar AGRAWAL of San Jose CA (US) for samsung electronics co., ltd., Vasili ZHDANKIN of Prior Lake MN (US) for samsung electronics co., ltd., Sumanth JANNYAVULA VENKATA of Pleasanton CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
CPC Code(s): H04L63/105
Abstract: provided are systems, methods, and apparatuses for multitenancy ssd access control. in one or more examples, the systems, devices, and methods include determining capabilities of a storage device for supporting multitenancy based on a physical function message from the storage device, identifying a tenant of a host, the host being communicatively connected with the storage device, negotiating an access contract between the tenant and the storage device, where the negotiating includes sending an access descriptor of the tenant to the storage device, the access descriptor indicating a requested level of access to the storage device, receiving, from the storage device, an access grant based on the negotiating, the access grant including an access allocation for the tenant based on the access descriptor, and enabling the tenant to access the storage device based on configuring the tenant with a virtualized computing environment in accordance with the access allocation.
Inventor(s): Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Taeho GIL of Suwon-si (KR) for samsung electronics co., ltd., Moonsun KIM of Suwon-sI (KR) for samsung electronics co., ltd., Taewoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhee YOO of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Seokmin JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H02P6/08, H02P7/18
CPC Code(s): H04M1/0237
Abstract: an electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, a driving mechanism which provides a driving force for moving the second housing part, and a processor. the processor is configured to identify external force causing a movement in a state in which the first housing part and the second housing part are stationary, and control the driving mechanism so that the first housing part and the second housing part remain the stationary state, based on the identified external forces.
20250008010. FLEXIBLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Areum YOO of Suwon-si (KR) for samsung electronics co., ltd., Hosoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Sooyoung Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinkeun Nam of Suwon-si (KR) for samsung electronics co., ltd., Byengchun Park of Suwon-si (KR) for samsung electronics co., ltd., Suakjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Wonjin Choi of Suwon-si (KR) for samsung electronics co., ltd., Jinsoo Choi of Suwon-si (KR) for samsung electronics co., ltd., Jinwan An of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G02B1/04, G02B1/14
CPC Code(s): H04M1/0268
Abstract: the present disclosure relates to an electronic device. the electronic device according to one embodiment of the present disclosure has a flexible display module, wherein the flexible display module includes a patterned window, and the patterned window includes a plurality of first pattern elements having a geometric pattern, and a plurality of second pattern elements extending in a first direction corresponding to a rotation axis direction, so as to connect at least two first pattern elements.
Inventor(s): Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunggwang KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyoungtak CHO of Suwon-si (KR) for samsung electronics co., ltd., Youngmin JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0268
Abstract: according to various embodiments, an electronic apparatus may comprise: a first housing, of which left and right lateral portions at least partially comprise a metallic material; a second housing which can slide relative to the first housing and of which left and right lateral portions at least partially comprise a conductive member; a wireless communication circuit disposed in the second housing and configured to transmit and/or receive wireless signals via a conductive member comprising a conductive material; a rollable display supported by the first housing and the second housing and configured to bend or unfold based on the slide-in or slide-out of the second housing; and at least one dielectric material disposed between the metallic material portion of the first housing and the conductive member of the second housing in a state in which the second housing has slid inside the first housing.
Inventor(s): Moonchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Yeonggyu YOON of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunggun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/18, H04M1/02
CPC Code(s): H04M1/18
Abstract: an electronic device according to various embodiments of the present disclosure includes a first housing, a second housing slidably coupled to the first housing, a flexible display configured to expand or reduce a size of a display area visible to the outside of the electronic device based on slide-in or slide-out of the second housing, a drive motor disposed to provide driving force to drive the second housing, a pinion gear coupled to the drive motor, a rack gear disposed to be driven to engage with the pinion gear, and a rack cover coupled to the rack gear, wherein the rack cover includes a first blocking mechanism blocking foreign substances from entering the rack cover, and wherein the rack gear includes a second blocking mechanism blocking foreign substances from entering the rack gear.
Inventor(s): Geeyoung SUNG of Suwon-si (KR) for samsung electronics co., ltd., Changkun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungkwuen AN of Suwon-si (KR) for samsung electronics co., ltd., Hongsuk KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N13/305, G06T7/507, G06T7/593, G09G3/36, H04N13/15, H04N13/282, H04N13/351, H04N13/356, H04N13/398
CPC Code(s): H04N13/305
Abstract: an electronic apparatus and a method for controlling thereof are provided. the electronic apparatus includes a first display comprising a first display panel for displaying a multi-view image and a micro-lens array which is arranged on a front surface of the first display panel and is for adjusting directions of lights output through the first display panel, a second display comprising a second display panel which is arranged on the front surface of the first display and displays a two-dimensional image corresponding to the multi-view image and has a transmittance greater than or equal to a predetermined value, memory storing one or more computer program, and one or more processors communicatively coupled to the first display, the second display, and the memory.
Inventor(s): Kyungmin LIM of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Daeyeong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N13/305, G09G3/00, H04N13/398
CPC Code(s): H04N13/305
Abstract: a method performed by a display device including a lenticular lens is provided. the method includes obtaining, by the display device, a target image, identifying, by the display device, a predefined slanted angle of the lenticular lens, identifying, by the display device, in the target image, at least one area including at least one edge having a slanted angle of which similarity to the slanted angle of the lenticular lens is within a preset range, selecting, by the display device, a plurality of sub-pixels of a same row as a first sub-pixel included in the identified at least one area, and allocating, by the display device, a first combination value to an output value of each of the plurality of sub-pixels, the first combination value being obtained by combining values of the plurality of sub-pixels.
20250008074. LIGHT FIELD DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daeyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaesung LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjin JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N13/31, H04N13/128, H04N13/305, H04N13/32, H04N13/398
CPC Code(s): H04N13/31
Abstract: a light field display apparatus is provided. the light field display apparatus includes a display panel configured to emit light that forms an image, a first lens array which is provided in the display panel and in which a plurality of first lenses are arranged, a second lens array which is arranged spaced apart from the first lens array and in which a plurality of second lenses are arranged, and a barrier arranged in any one place from among between the display panel and the first lens array, between the first lens array and the second lens array, or in front of the second lens array, wherein the barrier has an aperture that transmits the light.
Inventor(s): Seokil MOON of Suwon-si (KR) for samsung electronics co., ltd., Bongsu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Changkun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N13/359, B82Y20/00, G02B1/00, G02B27/00, H04N13/305, H04N13/337, H04N13/398
CPC Code(s): H04N13/359
Abstract: a display module includes: a light emitter configured to emit light corresponding to image data through a plurality of pixels; a polarization adjuster configured to, based on a request to provide an image in three dimensions or two dimensions, adjust a polarization of light incident from the light emitter to a first polarization or a second polarization different from the first polarization; a geometric phase lens configured to operate as a convex lens or a concave lens based on the polarization of light incident from the polarization adjuster; and a lenticular lens configured to output light incident from the geometric phase lens in a preset direction.
Inventor(s): Yangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungho Lee of Suwon-si (KR) for samsung electronics co., ltd., Woohyun Nam of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04S7/00, G06F3/16, G06N3/008, G06N3/04, G06N3/08, H04R3/00
CPC Code(s): H04S7/304
Abstract: an electronic apparatus is provided. the electronic apparatus includes a camera, a processor and a memory configured to store at least one instruction executable by the processor where and the processor is configured to input input audio data to an artificial intelligence model corresponding to user information, and obtain output audio data from the artificial intelligence model, and the artificial intelligence model is a model learned based on first learning audio data obtained by recording a sound source with a first recording device, second learning audio data obtained by recording the sound source with a second recording device, and information on a recording device for obtaining the second learning audio data, and the second learning audio data is binaural audio data.
Inventor(s): Suqin Xu of Jiangsu (CN) for samsung electronics co., ltd., Jie Fan of Jiangsu (CN) for samsung electronics co., ltd., Ruichao Liu of Jiangsu (CN) for samsung electronics co., ltd., Suohua Li of Jiangsu (CN) for samsung electronics co., ltd.
IPC Code(s): H04W4/029, H04W4/02
CPC Code(s): H04W4/029
Abstract: a method for obtaining a media access control (mac) address of a connectable ultra wide band (uwb) device includes obtaining, by a first device, device information of the connectable uwb device using a uwb signal; obtaining, by the first device synchronously with the obtaining the device information, first three-dimensional position set data of a target object, the device information comprising the mac address and first position information of the connectable uwb device; and determining, by the first device, the mac address of the connectable uwb device belonging to the target object based on the device information and the first three-dimensional position set data.
Inventor(s): Hyesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/50, H04W8/24
CPC Code(s): H04W4/50
Abstract: the present disclosure relates to a communication technique for converging iot technology with a 5g communication system for supporting a higher data transmission rate beyond a 4g system, and a system therefor. a method for supporting a network function exposure service of a terminal, according to one embodiment of the present disclosure, may comprise the steps of: transmitting, to a network entity, a first request message including information on an application programming interface (api) invocation capability of a terminal; receiving, from the network entity, as a response to the first request message, a first response message including information on whether the api invocation is allowed; and invoking the api on the basis of the information on whether the api invocation is allowed.
Inventor(s): Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk RYU of Suwon-si (KR) for samsung electronics co., ltd., Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W16/28, H04L5/00, H04W8/22, H04W24/10
CPC Code(s): H04W16/28
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a terminal in a wireless communication system is provided. the method includes receiving, from a base station, configuration information on at least one reference signal, receiving, from the base station, the at least one reference signal based on the configuration information, measuring for at least one beam based on a combining for the at least one reference signal, and transmitting, to the base station, measurement information including a result of a measurement, wherein the result includes at least one of information on a phase difference for the at least one beam or information on a direction of the at least one beam.
20250008357. BEAM MEASUREMENT AND REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/08
CPC Code(s): H04W24/08
Abstract: methods and apparatuses for beam measurement and reporting. a method performed by a user equipment (ue) includes transmitting capability information; receiving information indicating a group based beam reporting; and measuring reference signals. the method further includes determining, based on the information and the measurement, a group of two resource indicators; determining, based on the measurement, beam metrics corresponding to the group of two resource indicators; and transmitting, in a channel state information (csi) reporting instance, the group of two resource indicators and the beam metrics. a resource indicator in the group of two resource indicators is one of: (1) a synchronization signal/physical broadcast channel (pbch) block (ssb) resource indicator (ssbri) and (2) a csi reference signal (csi-rs) resource indicator (cri). a beam metric in the beam metrics is one of: (1) a layer-1 reference signal received power (l1-rsrp) and (2) a layer-1 signal to interference and noise ratio (l1-sinr).
Inventor(s): Aby Kanneath ABRAHAM of Muvattupuzha (IN) for samsung electronics co., ltd., Vinay Kumar SHRIVASTAVA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W76/15
CPC Code(s): H04W24/10
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide a method for handling measurement gap during dual connectivity operation in a wireless network (). the method includes receiving, by a second node () in the wireless network (), an inter-node message (inm) comprising a configuration from a first node () in the wireless network () to configure measurement gap for at least one ue () associated with the second node () with measurement gap.
Inventor(s): Dongyeon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/08, H04W24/02
CPC Code(s): H04W28/0942
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method by which a first entity performs a policy control function (pcf) in a wireless communication system, according to one embodiment of the present disclosure, comprises the steps of: sensing the need for determination of a policy control function with respect to the first entity; transmitting a data analysis information request message for determination of the policy control function to a second entity performing a network data analytics function (nwdaf) on the basis of the sensing result; receiving data analysis information from the second entity; and determining the policy control function on the basis of the data analysis information, wherein the data analysis information is determined on the basis of a data access type.
Inventor(s): Donggun KIM of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W56/00, H04W76/19, H04W76/20, H04W80/02
CPC Code(s): H04W36/00725
Abstract: a method performed by a terminal in a wireless communication system is provided. the method includes receiving, from a base station, a radio resource control (rrc) message including layer 1 (l1)/layer 2 (l2) triggered mobility (ltm) configuration information, the ltm configuration information including at least one ltm candidate configuration for at least one candidate cell, transmitting, to the base station, a report for an l1 measurement on the at least one candidate cell, receiving, from the base station via a medium access control (mac) control element (ce), an ltm cell switch command based on the report, identifying whether a value of a timing advance command (tac) in the mac ce is set to a specific value, and in case that the value of the tac is not set to the specific value, processing the tac and performing a random access channel (rach)-less ltm cell switch for a target cell identified by the mac ce.
Inventor(s): Yong Ren of Somerset NJ (US) for samsung electronics co., ltd., Xiaochuan Ma of Hillsborough NJ (US) for samsung electronics co., ltd., Han Wang of Allen TX (US) for samsung electronics co., ltd., Yan Xin of Princeton NJ (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/22
CPC Code(s): H04W36/22
Abstract: a method includes generating relationship information representing spatial relationships between network elements in a wireless communication network. the method also includes dividing the relationship information into multiple communities of network elements, wherein network elements within each community have a higher correlation than network elements in different communities. the method also includes identifying, for a target network element, one or more community level key network elements and one or more local key network elements in the relationship information. the method also includes predicting traffic at the target network element using a temporal-spatial algorithm, wherein the temporal-spatial algorithm predicts the traffic based on temporal features derived from historical data and spatial features derived from the one or more community level key network elements and the one or more local key network elements.
Inventor(s): Yuqiang Heng of Plano TX (US) for samsung electronics co., ltd., Anum Ali of Frisco TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Priyabrata Parida of Dallas TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/26, H04W24/02
CPC Code(s): H04W52/0209
Abstract: a method includes determining a preferred configuration of a user equipment (ue) based on side information about the ue. the method also includes sending the preferred configuration of the ue to a base station via a ue assistance information (uai) framework. the method further includes receiving a new configuration of the ue from the base station after the base station determines the new configuration based on the preferred configuration. the method also includes configuring the ue according to the new configuration.
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W68/02, H04W72/1273, H04W76/40
CPC Code(s): H04W52/0235
Abstract: methods and apparatuses for a paging monitoring operation for a multicast and broadcast session in a wireless communication system. a method performed by a user equipment (ue) includes monitoring for a low power wakeup signal (lp wus) on a carrier of a cell where the ue is camped; receiving the lp wus; instructing a main receiver (mr) to monitor for multicast broadcast (mbs) session data in response to a reception of the lp wus; and receiving the mbs session data when at least one mbs session is activated.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04L27/26, H04W92/18
CPC Code(s): H04W56/0015
Abstract: apparatuses and methods for a sidelink synchronization signal block (s-ssb) structure for larger subcarrier spacing. a method performed by a user equipment (ue) in a wireless communication system includes determining a number m of consecutive orthogonal frequency division multiplexing (ofdm) symbols for a sidelink synchronization signals and physical sidelink broadcast channel (s-ss/psbch) block and determining a slot group of s consecutive slots including a number nof s-ss/psbch blocks. the method further includes determining a time domain pattern for a number nof s-ss/psbch blocks within a period and receiving the s-ss/psbch block based on the time domain pattern.
Inventor(s): Sunhyun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Daeun KO of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongmyung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sangho LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04B7/185
CPC Code(s): H04W56/0045
Abstract: provided is a 5g or 6g communication system for supporting higher data rates than a 4g communication system. a method of a terminal in an ntn includes receiving a first broadcast message comprising at least part of synchronization information from a satellite at a first time point, receiving a second broadcast message comprising a remainder of the synchronization information from the satellite at a second time point, receiving a third broadcast message comprising location information related to a location of the satellite from the satellite at a third time point, determining a first location of the satellite at the first time point, a second location of the satellite at the second time point, and a third location of the satellite at the third time point, based on the first broadcast message, the second broadcast message, and the third broadcast message, determining a ta value related to a distance between the terminal and the satellite, based on the first location, the second location, and the third location, adjusting a transmission time point of an initial message for initial access to the satellite, based on the determined ta value, and transmitting the initial message to the satellite at the adjusted transmission time point.
Inventor(s): Pengru LI of Beijing (CN) for samsung electronics co., ltd., Qi XIONG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04L5/00, H04W8/22, H04W24/10
CPC Code(s): H04W64/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the application provides a method for positioning performed by a user equipment in a wireless communication system, comprising: determining window configuration information, wherein the window configuration information is used for configuring resources of the window; measuring the signal for positioning in the window, according to the window configuration information; and reporting the measurement result.
Inventor(s): Prasad Basavaraj DANDRA of Bengaluru (IN) for samsung electronics co., ltd., Chetan Ramesh GANIG of Bengaluru (IN) for samsung electronics co., ltd., Sivasankar COMARAVELOU of Bengaluru (IN) for samsung electronics co., ltd., Umasankar Baskar CEENDHRALU of Bengaluru (IN) for samsung electronics co., ltd., Lalith KUMAR of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W60/04
CPC Code(s): H04W68/02
Abstract: the present subject matter refers to methods and systems for managing paging restriction in multi sim multi standby (musim). the method performed by a user equipment (ue) () comprises transmitting (), to a network entity (), a request message including paging restriction information. further, the method includes receiving (), from the network entity, a request accept message including an indication of an implementation of a paging restriction between the network entity and the ue based on the paging restriction information included in the registration request message. thereafter, the method includes transmitting, to the network entity, a release request message including information related to a release of the paging restriction for the ue when the ue intend to receive paging messages from the network entity. moreover, in response to a reception of the release request message, the network entity releases the paging restriction for the ue.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyemin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04B7/06, H04L1/18, H04L5/00
CPC Code(s): H04W72/0446
Abstract: the disclosure relates to 5g or 6g communication systems to support higher data rates. the disclosure relates to operations of a ue and a base station in a wireless communication system, and specifically, the disclosure proposes a method and device for transmitting and receiving channel state information in a full-duplex communication system.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04W72/0457, H04W72/566, H04W80/02
CPC Code(s): H04W72/1268
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments of the present disclosure provide a communication method, an electronic device and a computer-readable storage medium. for an uplink service, the method comprises steps of: by a user equipment, determining a remaining pdb of a data packet in a buffer, and reporting related information of the remaining pdb to a base station, so as to assist the base station to perform proper uplink scheduling for the user equipment according to the related information of the remaining pdb. accordingly, the packet loss rate of data packets is reduced, and the transmission efficiency is improved.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Taehyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung OH of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L1/08, H04L5/00
CPC Code(s): H04W72/1268
Abstract: the disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as a smart home, a smart building, a smart city, a smart car, a connected car, health care, digital education, smart retail, security and safety services. various embodiments of the disclosure provide a method for repeatedly transmitting/receiving uplink data in a network cooperative communication system, and an apparatus capable of performing the same.
Inventor(s): Junhwan AN of Suwon-si (KR) for samsung electronics co., ltd., Beomjip KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/14, H04W8/22
CPC Code(s): H04W76/14
Abstract: a method for adjusting a data transmission sequence and an electronic device for performing same are provided. the electronic device includes memory storing one or more computer programs, and one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to search for external electronic devices located near the electronic device, receive user inputs for selecting external electronic devices to which data of the electronic device is to be transmitted from among found external electronic devices, adjust a data transmission order corresponding to an order in which the selected external electronic devices are selected by the user inputs, based on at least one of the communication connection characteristics of the selected external electronic devices, a size of the data, or account information of the selected external electronic devices, and transmit the data to the selected external electronic devices according to the adjusted data transmission order.
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/28
CPC Code(s): H04W76/28
Abstract: methods and apparatuses for energy saving operations in a wireless communication system. a method of a ue comprises: receiving, from a base station, an rrc message indicating (i) a payload size of cell dtx/drx activation/deactivation dci for at least one cell group and (ii) a starting position of a cell dtx/drx information for at least one cell in dci; receiving the cell dtx/drx activation/deactivation dci; identifying the cell dtx/drx information for the at least one cell in the dci based on (i) the payload size of the cell dtx/drx activation/deactivation dci corresponding to the at least one cell group and (ii) the starting position of the cell dtx/drx information corresponding to the at least one cell; and activating or deactivating a cell dtx/drx configuration of the at least one cell based on the identified cell dtx/drx information in the cell dtx/drx activation/deactivation dci.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Sriganesh RAJENDRAN of Bangalore (IN) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/40, H04L1/1812, H04W76/19, H04W76/20, H04W76/30
CPC Code(s): H04W76/40
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. accordingly, the embodiment herein is to provide a method and a user equipment () for enhancing medium access control (mac) reset mechanism and other rrc procedures in a new radio (nr) multicast and broadcast service (mbs) communication. the method includes receiving a service from a network device (), where the service includes an mbs multicast service and an mbs broadcast service. furthermore, the method includes receiving a plurality of network messages from the network device. furthermore, the method includes determining a plurality of events associated with the ue (). furthermore, the method includes performing the mac reset mechanism in the mbs communication based on the service and/or the plurality of network messages, and/or the plurality of events.
Inventor(s): Mahmoud WATFA of Middlesex (GB) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/50, H04W28/02, H04W76/10, H04W76/25
CPC Code(s): H04W76/50
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for managing protocol data unit, pdu, session establishment, by a user equipment, ue, connected to a network for disaster roaming is disclosed. the method comprises receiving a non access stratum, nas, session management message from the network; determining whether the nas session management message includes an evolved packet system, eps, related quality of service, qos, parameter, and whether a session related to the nas session management message is an emergency pdu session; and deleting an associated eps bearer context based on determining that the nas session management message includes the eps related qos parameter, and the session is not the emergency pdu session.
Inventor(s): Jiwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungyong JOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K9/00
CPC Code(s): H05K1/0233
Abstract: a display device and an electronic device are provided. the display device comprises: a display panel; a display case which supports the display panel and which includes a board mounting portion; a printed circuit board mounted on the board mounting portion; and a line filter mounted on the printed circuit board so as to reduce current noise, wherein the line filter includes: a core; a shielding member which is arranged between the core and the board mounting portion and which blocks electric fields or magnetic fields; a core case, which accommodates the core, has a coil wound around at least a portion of the outer side thereof, and includes a shielding support portion to support one surface of the board mounting portion of the shielding member.
20250008667. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Pilyong OH of Suwon-si (KR) for samsung electronics co., ltd., Seungjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisu KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00, H01L25/16, H05K5/02
CPC Code(s): H05K5/0021
Abstract: a display apparatus may include: a plurality of display modules; and a frame configured to support the plurality of display modules in a matrix arrangement. the frame may include: a first module attachment layer to which some display modules among the plurality of display modules are attached and having a first thermal expansion coefficient; a first frame panel coupled to the first module attachment layer and having a second thermal expansion coefficient different from the first thermal expansion coefficient; and a second module attachment layer to which remaining display modules of the plurality of display modules are attached, having the first thermal expansion coefficient, and disposed adjacently with the first module attachment layer; a second frame panel coupled to the second module attachment layer, having the second thermal expansion coefficient.
20250008672. SLIDABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SEO of Suwon-si (KR) for samsung electronics co., ltd., Hojin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Baekeun CHO of Suwon-si (KR) for samsung electronics co., ltd., Nakhyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K1/14, H05K5/00, H05K7/14
CPC Code(s): H05K5/0217
Abstract: an electronic device according to various embodiments of the present disclosure includes a first housing including a first support member and a second support member. the electronic device also includes a second housing that slides with respect to the first housing, a flexible display which is a display including a first display region and a second display region extending from the first display region, and which enables at least a part of the second display region to be exposed on the basis of the slide movement of the second housing. the electronic device further includes a first circuit board arranged at the first support member and a second circuit board arranged at the second support member, where the second circuit board can be electrically connected to the first circuit board through a hole formed in one surface of the second support member.
Inventor(s): Gisoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Raetae KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongyoun KIM of Suwon-si (KR) for samsung electronics co., ltd., Byunghun CHO of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K5/00
CPC Code(s): H05K5/0217
Abstract: according to an embodiment of the disclosure, an electronic device may include: a housing, a sliding plate configured to slide-out from the housing, a flexible display including a first section coupled to overlap the sliding plate, and a bendable section extending from the first section and configured to be pulled out from an inner space of the housing during the slide-out, a support sheet disposed on a rear surface of the flexible display, a first curved portion located inside the housing to correspond to the bendable section, a belt connecting the support sheet and the sliding plate to each other, and a second curved portion located inside the housing to correspond to the belt and spaced apart from the first curved portion in a slide-out direction.
Inventor(s): Gyeyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangho Yun of Suwon-si (KR) for samsung electronics co., ltd., Jeonghee Choi of Suwon-si (KR) for samsung electronics co., ltd., Woojin Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L21/308, H01L21/762
CPC Code(s): H10B12/053
Abstract: a method of forming a pattern is provided. the method includes: forming a first recess in a substrate; forming a first mask layer on the substrate that extends into the first recess; performing a heat treatment process on the first mask layer; removing an upper portion of the first mask layer to form a first mask in the first recess, the first mask comprising a lower portion of the first mask layer; forming a second mask on the substrate and the first mask, the second mask comprising a material having a tolerance with respect to an etching process that is greater than that of the first mask; and performing an etching process on the substrate using the second mask as an etching mask to form the pattern on the substrate.
Inventor(s): Kang Lib KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk LEE of Suwon-si (KR) for samsung electronics co., ltd., Sea Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Tackhwi LEE of Suwon-si (KR) for samsung electronics co., ltd., Seongpil CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/27, H01L23/48, H01L25/065, H10B41/10, H10B41/35, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H10B41/27
Abstract: a semiconductor device includes a first substrate; a wiring layer on the first substrate; a second substrate on the wiring layer and including a conductive material; a first horizontal conductive layer and a second horizontal conductive layer sequentially stacked on the second substrate and connected to the second substrate; a gate stacking structure including an interlayer insulating layer and a gate electrode alternately stacked on the second horizontal conductive layer; a channel structure passing through the gate stacking structure and connected to the second substrate; a first capacitor electrode on a same layer as the second substrate; a second capacitor electrode overlapping the first capacitor electrode; and a first dielectric layer between the first capacitor electrode and the second capacitor electrode, wherein the second capacitor electrode is on a same layer as at least one of the wiring layer, the second substrate, the first horizontal conductive layer, or the gate electrode.
Inventor(s): Daehwan CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanju PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a cell array region and a contact region; a gate stack structure groups of gate electrodes; a channel structure extending through the gate stack structure in the cell array region; and gate contact portions connected to respective gate electrodes in the contact region. at least some of the gate contact portions extend through a through gate electrode connected to a connection gate electrode at a lower end portion. the gate contact portions include contact groups extending from a first side to a second side of the gate electrodes in an extending direction. each of the electrode groups includes an upper group on a lower group. each of the contact groups includes a first group connected to the upper group and a second group on the second side in the extending direction, and connected to the lower group, and a number of layers of the connection gate electrodes to which the gate contact portions are connected sequentially increases as a distance from a boundary between the first group and the second group increases in the first group and the second group.
Inventor(s): Sanghun Chun of Suwon-si (KR) for samsung electronics co., ltd., Shinhwan Kang of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35
CPC Code(s): H10B43/40
Abstract: a semiconductor device includes a lower structure including a peripheral circuit; a stack structure on the lower structure, extending from a memory cell array region to a stepped region, and including a gate stacked region, and an insulator stacked regions arranged in the stepped region in a first direction; a capping insulating structure on the stack structure; and separation structures passing through the gate stacked region. the stack structure includes interlayer insulating layers and horizontal layers, alternately and repeatedly stacked, the horizontal layers include gate horizontal layers and insulating horizontal layers, the gate stacked region includes the gate horizontal layers, each of the insulator stacked regions includes the insulating horizontal layers, in the stepped region, the stack structure includes a first stepped region, a connection stepped region, and a second stepped region.
Inventor(s): Suhyun Bang of Suwon-si (KR) for samsung electronics co., ltd., Seulji Song of Suwon-si (KR) for samsung electronics co., ltd., Youngsun Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00, G11C5/06, H10N70/00
CPC Code(s): H10B63/84
Abstract: a three-dimensional memory device includes a base insulating layer on a substrate, a stack structure including word lines and first interlayer insulating layers which are alternately stacked on the base insulating layer, and a second interlayer insulating layer on an uppermost one of the word lines, bit lines that are in the stack structure and spaced apart from each other in a first direction parallel to a top surface of the substrate, each bit line including a first portion that protrudes from a top surface of the stack structure and a second portion that are in the stack structure, an outer electrode on the stack structure and on the first portions of the bit lines, and a dielectric layer between the outer electrode and the first portion of the bit line and surrounding a side surface of the first portion of the bit line in plan view.
Inventor(s): Hyundong LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonseok OH of Suwon-si (KR) for samsung electronics co., ltd., Sangyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Changbo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L23/31, H01L23/538, H01L25/065, H01L25/10
CPC Code(s): H10B80/00
Abstract: a semiconductor package includes a substrate structure having a bridge chip therein; a semiconductor memory device on a first upper surface of the substrate structure and electrically connected to the bridge chip; and a semiconductor logic device on the first upper surface of the substrate structure and spaced apart from the semiconductor memory device, and the semiconductor logic device electrically connected to the bridge chip. the semiconductor memory device may include a redistribution wiring layer on the substrate structure and having a plurality of redistribution wirings; a plurality of buffer dies on a second upper surface of the redistribution wiring layer and electrically connected to the bridge chip through the plurality of redistribution wirings; and a plurality of semiconductor chips sequentially stacked on each of the plurality of buffer dies and electrically connected to the plurality of buffer dies.
SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- A47L9/28
- CPC A47L9/2831
- Samsung electronics co., ltd.
- A63B24/00
- A63B71/06
- CPC A63B24/0062
- B03C1/30
- B24B37/34
- CPC B03C1/30
- B24B45/00
- B24B7/22
- CPC B24B45/006
- B25J9/16
- B25J19/06
- G05D1/246
- G05D1/689
- CPC B25J9/1676
- D06F37/26
- D06F25/00
- D06F37/04
- D06F37/30
- D06F39/04
- CPC D06F37/264
- D06F58/02
- D06F58/20
- CPC D06F37/269
- D06F34/14
- D06F58/24
- D06F103/58
- D06F105/02
- D06F105/26
- D06F105/36
- CPC D06F58/206
- F24F1/0063
- F24F1/0018
- F24F11/79
- F24F13/14
- F24F13/30
- CPC F24F1/0063
- F24F1/028
- F24F1/035
- F24F13/08
- F24F13/24
- CPC F24F1/028
- F25D23/06
- CPC F25D23/063
- G01B11/06
- CPC G01B11/06
- G01K13/06
- G01K7/22
- CPC G01K13/06
- G01R29/12
- H01L21/66
- H01L21/683
- H01L21/687
- CPC G01R29/12
- G01R31/389
- G01R31/367
- G01R31/371
- G01R31/52
- H02J7/00
- CPC G01R31/389
- G01S7/40
- G01S7/00
- G01S7/282
- G01S13/02
- G01S13/76
- CPC G01S7/4013
- G01S13/56
- G01S7/41
- G01S13/00
- CPC G01S13/56
- G02B1/111
- CPC G02B1/111
- G02B9/12
- G02B1/11
- G02B13/00
- G02B27/01
- G02B27/14
- G02B27/28
- CPC G02B9/12
- G02B27/10
- G02B1/00
- G02B3/10
- G02B3/14
- G02B27/00
- G02C7/06
- CPC G02B27/1066
- G02F1/1335
- G02F1/13357
- H01L25/075
- H01L33/54
- H05K1/02
- H05K1/18
- CPC G02F1/133612
- G03F1/36
- CPC G03F1/36
- G03F7/038
- C08F12/22
- G03F7/004
- G03F7/20
- CPC G03F7/0382
- G03F7/38
- CPC G03F7/38
- A47L11/40
- G05D1/224
- G05D105/10
- G05D107/40
- G06T5/30
- G06T5/70
- CPC G05D1/2469
- G06F1/16
- CPC G06F1/1656
- F16C11/04
- H05K5/02
- CPC F16C11/04
- G06F3/01
- CPC G06F3/017
- G06F3/04842
- G06F3/04845
- G06F3/0485
- G06F3/16
- G06T19/00
- G06V40/20
- G06F3/041
- G06F3/044
- G06V40/12
- G06V40/13
- G09G3/00
- G09G3/3208
- CPC G06F3/04164
- G06F3/04815
- CPC G06F3/04815
- G06F3/0481
- G06F3/14
- CPC G06F3/04845
- G06F3/06
- G06N3/08
- CPC G06F3/064
- G06F7/544
- G06F7/499
- G06F7/57
- CPC G06F7/5443
- G06N3/049
- G06N3/084
- CPC G06N3/049
- G06V10/20
- G06V10/82
- G06T7/50
- G06V10/25
- G09G3/34
- G09G3/36
- CPC G06T7/50
- G06T11/00
- G06F16/58
- G06F40/279
- G06F40/40
- G06V10/40
- G06V20/60
- CPC G06T11/00
- G06T11/60
- CPC G06T11/60
- G06T13/80
- G01C21/36
- G06F3/0346
- G06V20/20
- CPC G06T19/006
- G06V10/26
- CPC G06V10/26
- G06V40/16
- G06T3/40
- CPC G06V40/172
- CPC G09G3/035
- G09G3/3233
- CPC G09G3/3233
- G09G3/3275
- CPC G09G3/3275
- G10L15/07
- G10L15/02
- G10L15/04
- G10L15/06
- G10L15/18
- G10L15/22
- G10L15/30
- G10L21/028
- CPC G10L15/075
- CPC G10L15/22
- G11C7/10
- CPC G11C7/1048
- G11C11/406
- CPC G11C11/40618
- G11C16/08
- G11C16/04
- G11C16/26
- CPC G11C16/08
- H01J37/32
- G01R19/25
- CPC H01J37/3299
- H01L21/677
- CPC H01L21/67766
- H01L21/67
- H01L21/68
- CPC H01L21/6835
- H01L23/13
- H01L21/48
- H01L23/00
- H01L23/31
- H01L25/16
- CPC H01L23/13
- H01L23/36
- H01L23/498
- H01L23/538
- H01L25/10
- H10B80/00
- CPC H01L23/36
- H01L23/48
- H01L23/522
- H01L23/528
- H01L25/18
- CPC H01L23/481
- CPC H01L23/49816
- CPC H01L23/49838
- H01L25/065
- CPC H01L23/5222
- H10B63/00
- H10N70/00
- CPC H01L23/5283
- H01L23/535
- H01L21/768
- H01L23/532
- CPC H01L23/535
- H01L23/373
- CPC H01L23/5385
- H01L23/544
- CPC H01L23/544
- CPC H01L24/06
- H01L25/00
- CPC H01L25/0652
- CPC H01L25/0655
- CPC H01L25/0657
- CPC H01L25/105
- H01L21/56
- H01L23/29
- CPC H01L25/18
- H01L27/146
- CPC H01L27/14625
- CPC H01L27/1463
- CPC H01L27/14643
- CPC H01L27/14645
- H01G4/08
- H01G4/008
- H10B12/00
- CPC H01L28/56
- H01L29/06
- H01L29/423
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H01L29/0673
- H01L29/10
- H01L29/417
- CPC H01L29/1033
- CPC H01L29/66553
- H01L27/092
- CPC H01L29/775
- H01L27/118
- H10B10/00
- CPC H01L29/78618
- H01L33/50
- F21V8/00
- CPC H01L33/504
- H01Q1/24
- H01Q1/38
- H04M1/02
- CPC H01Q1/243
- H01Q9/04
- H01Q21/06
- CPC H01Q9/0407
- H02J7/06
- H02J50/00
- CPC H02J7/007182
- H03L1/02
- CPC H03L1/02
- H04B1/04
- H03F1/02
- H03F3/24
- CPC H04B1/0458
- H04L27/04
- CPC H04B1/0475
- H04B7/04
- H04W56/00
- CPC H04B7/04013
- H04B7/06
- H04L25/02
- H04W72/23
- CPC H04B7/0626
- H04L1/00
- H04L27/26
- CPC H04L1/0042
- H04L47/12
- H04L43/0888
- CPC H04L47/12
- H04L61/256
- H04L61/2514
- H04W76/38
- CPC H04L61/256
- H04L9/40
- CPC H04L63/105
- H02P6/08
- H02P7/18
- CPC H04M1/0237
- G02B1/04
- G02B1/14
- CPC H04M1/0268
- H04M1/18
- CPC H04M1/18
- H04N13/305
- G06T7/507
- G06T7/593
- H04N13/15
- H04N13/282
- H04N13/351
- H04N13/356
- H04N13/398
- CPC H04N13/305
- H04N13/31
- H04N13/128
- H04N13/32
- CPC H04N13/31
- H04N13/359
- B82Y20/00
- H04N13/337
- CPC H04N13/359
- H04S7/00
- G06N3/008
- G06N3/04
- H04R3/00
- CPC H04S7/304
- H04W4/029
- H04W4/02
- CPC H04W4/029
- H04W4/50
- H04W8/24
- CPC H04W4/50
- H04W16/28
- H04L5/00
- H04W8/22
- H04W24/10
- CPC H04W16/28
- H04W24/08
- CPC H04W24/08
- H04W76/15
- CPC H04W24/10
- H04W28/08
- H04W24/02
- CPC H04W28/0942
- H04W36/00
- H04W76/19
- H04W76/20
- H04W80/02
- CPC H04W36/00725
- H04W36/22
- CPC H04W36/22
- H04W52/26
- CPC H04W52/0209
- H04W52/02
- H04W68/02
- H04W72/1273
- H04W76/40
- CPC H04W52/0235
- H04W92/18
- CPC H04W56/0015
- H04B7/185
- CPC H04W56/0045
- H04W64/00
- CPC H04W64/00
- H04W60/04
- CPC H04W68/02
- H04W72/0446
- H04L1/18
- CPC H04W72/0446
- H04W72/1268
- H04W72/0457
- H04W72/566
- CPC H04W72/1268
- H04L1/08
- H04W76/14
- CPC H04W76/14
- H04W76/28
- CPC H04W76/28
- H04L1/1812
- H04W76/30
- CPC H04W76/40
- H04W76/50
- H04W28/02
- H04W76/10
- H04W76/25
- CPC H04W76/50
- H05K9/00
- CPC H05K1/0233
- H05K5/00
- CPC H05K5/0021
- H05K1/14
- H05K7/14
- CPC H05K5/0217
- H01L21/308
- H01L21/762
- CPC H10B12/053
- H10B41/27
- H10B41/10
- H10B41/35
- H10B43/10
- H10B43/27
- H10B43/35
- CPC H10B41/27
- CPC H10B43/27
- H10B43/40
- H10B41/40
- CPC H10B43/40
- G11C5/06
- CPC H10B63/84
- CPC H10B80/00
