SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on February 1st, 2024
SAMSUNG ELECTRONICS CO., LTD.: 186 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H10B80/00 (26), H01L23/00 (14), H10B41/27 (10), H04W72/232 (10), H01L25/065 (10)
With keywords such as: layer, device, substrate, information, semiconductor, including, configured, based, structure, and surface in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Sanghwa CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunkoo KANG of Suwon-si (KR) for samsung electronics co., ltd., Seehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Juhyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinwook YOON of Suwon-si (KR) for samsung electronics co., ltd., Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeongju LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeonghee CHO of Suwon-si (KR) for samsung electronics co., ltd., Jiwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A47L5/30, A47L9/04, A46B13/00, A46B13/02
Abstract: a vacuum cleaner includes a main body, a suction motor in the main body, an extension pipe, a suction head, connected to the suction motor through an extension pipe and including a suction port through which the foreign substances are sucked, a brush inside the suction head, a brush motor configured to rotate the brush, a pressure sensor configured to detect a pressure of air flowing through the suction port, a memory configured to store reference data used to identify the type of surface to be cleaned and a learning model to update the reference data, and a controller configured to determine a suction pressure based on the detected pressure and an atmospheric pressure, and identify the type of surface using the determined suction pressure, a load of the brush motor, and the stored reference data, and to update the stored reference data based on a predetermined update condition.
Inventor(s): Elijah KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongseok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sunghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Juyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Junwon SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L11/40, A47L11/282
Abstract: a robot cleaner includes a rotation motor; a rotation member that is rotatable by driving of the rotation motor having a first surface, a second surface, and an opening through the rotation member and penetrating the first surface and the second surface; and a floorcloth coupling member disposed on the second surface and having a floorcloth attaching unit insertable into the opening to be detachably coupled to a floorcloth in contact with the first surface. the rotation member and the floorcloth coupling member are configured so that, when the floorcloth attaching unit is inserted into the opening and detachably coupled to the floorcloth, the rotation member rotates in a first state, the floorcloth attaching unit remains coupled to the floorcloth. when the rotation member rotates in a second state, the floorcloth attaching unit exits the opening so that the floorcloth becomes detached from the floorcloth attaching unit.
Inventor(s): Sojeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Woojin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jongwook KWON of Suwon-si (KR) for samsung electronics co., ltd., Johannes BÜSING of Suwon-si (KR) for samsung electronics co., ltd., Jinhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihyeon PAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/00, A47L15/42, A47L15/48
Abstract: a dishwasher including a tub forming a washing chamber; a drying device disposed outside of the tub and including an inlet through which air from the washing chamber is introduceable, a flow channel in which air from the washing chamber introduced through the inlet flows, a fan that is operable to cause air from the washing chamber to be introduced through the inlet to flow in the flow channel, a heater in the flow channel to heat air in the flow channel, an outlet through which air in the flow channel is discharged to the washing chamber, and a temperature sensor between the heater and the outlet; and at least one processor configured to operate the fan based on a start of a drying cycle and to determine an initial operation time point of the heater during the drying cycle based on temperature detected by the temperature sensor.
Inventor(s): Hyunjun JUNG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Hyejung SEO of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Suho LEE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Seongmin JE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/1455, A61B5/026, A61B5/0205
Abstract: an electronic device includes an output device, a biometric sensor including a light-emitting unit for emitting light at a first portion of a subject, and a light-receiving unit for receiving light emitted by the light-emitting unit and a processor operatively connected to the output device and the biometric sensor, wherein the processor can be configured to acquire a perfusion index on the basis of a photoplethysmogram (ppg) signal acquired through the biometric sensor, measure oxygen saturation by using the ppg signal if the perfusion index corresponds to a first criterion, and output, through the output device, guide information instructing an occlusion operation for a second portion, differing from the first portion of the subject, if the perfusion index corresponds to a second criterion.
Inventor(s): Sunggyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Daesung KI of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Jiho JEONG of Suwon-si (KR) for samsung electronics co., ltd., Taeseob LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61G15/02, A61H7/00, A61G15/00
Abstract: a massage apparatus includes a base frame; a first seat frame connected to the base frame to be rotatable with respect to the base frame, and including a seat portion on which a user is to be seated; a second seat frame coupled to the first seat frame to be rotatable with respect to the first seat frame, and including a backrest portion; a first driving unit connected to the base frame and the first seat frame to drive the first seat frame to rotate with respect to the base frame; a massage module accommodated in the second seat frame to perform a massage function; and a control unit configured to, upon an execution command for a massage course being input, control the first driving unit to rotate the first seat frame such that a rear side of the first seat frame is raised thereby raising the seat portion.
20240033168.MASSAGE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jiho JEONG of Suwon-si (KR) for samsung electronics co., ltd., Daesung KI of Suwon-si (KR) for samsung electronics co., ltd., Sunggyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Semin LEE of Suwon-si (KR) for samsung electronics co., ltd., Kunwoo BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61H15/02, A61H15/00
Abstract: provided is a massage apparatus including a base frame, a seat frame coupled to the base frame to form a seating surface on one side, a massage module disposed between the base frame and the seat frame and provided to be movable along the seating surface on a rear side of the seating surface, and an auxiliary massage module formed to pass through the seat frame. the auxiliary massage module may include a rotating member connected to a module mounting portion of the base frame that forms a rotation axis of the auxiliary massage module, a support member formed to extend forward from the rotating member and having a shoulder massage case, and an extension member formed to extend downward from the support member and having an abdominal massage case.
20240033174.MASSAGE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jiho JEONG of Suwon-si (KR) for samsung electronics co., ltd., Daesung KI of Suwon-si (KR) for samsung electronics co., ltd., Taeseob LIM of Suwon-si (KR) for samsung electronics co., ltd., Kunwoo BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61H23/02
Abstract: a massage apparatus including a base frame; a seat frame coupled to the base frame to form a seating surface; and a massage module disposed at a rear of the seating surface to be movable between the base frame and the seat frame, wherein the massage module includes a module base, a side frame coupled to the module base to be rotatable in forward and backward directions, a driving shaft disposed to pass through the side frame and rotate inside of the side frame, a bracket unit connected to the driving shaft and configured to be movable according to rotation of the driving shaft, and a massage ball unit including an electromagnet and a massage ball, the massage ball unit coupled to the bracket unit to advance and retreat based on movement of the bracket unit, and the massage ball being movable by the electromagnet.
Inventor(s): Hyeonseong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A63B5/20
Abstract: a wearable electronic device may include an acceleration sensor and at least one processor, wherein the at least one processor may be configured to obtain acceleration data through the acceleration sensor, identify that a user of the wearable electronic device is performing a jump rope exercise on the basis of at least a part of the acceleration data, identify at least one of a flight time or a ground contact time on the basis of the acceleration data, and output guide information on the jump rope exercise on the basis of at least one of the flight time or the ground contact time. various other embodiments are possible.
Inventor(s): Hongyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehun HYEON of Suwon-si (KR) for samsung electronics co., ltd., Dongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Kiljong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon EOM of Suwon-si (KR) for samsung electronics co., ltd., Kiwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunkook CHO of Suwon-si (KR) for samsung electronics co., ltd., Sukwon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kwanghyung LEE of Seoul (KR) for samsung electronics co., ltd., Myeonghee JEON of Seoul (KR) for samsung electronics co., ltd., Yuchang JEONG of Seoul (KR) for samsung electronics co., ltd., Jiwon HA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00
Abstract: an exercise program determining method and/or system may include obtaining basic exercise information of a user, determining at least one candidate exercise mode from among a plurality of exercise modes based on the basic exercise information, generating a plurality of exercise programs to include at least some of the at least one candidate exercise mode based on a target exercise result for the user, determining a target exercise amount for the user based on the basic exercise information, and determining a target exercise program from among the plurality of exercise programs based on the target exercise amount.
Inventor(s): Dohyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinah KONG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyeon RHO of Suwon-si (KR) for samsung electronics co., ltd., Yongjun LIM of Suwon-si (KR) for samsung electronics co., ltd., Younju JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B60W60/00, B60W40/08
Abstract: an autonomous driving control device according to various embodiments includes a sensor device including a biosensor, and a processor, wherein the processor is configured to control, as a first parameter value, a parameter related to a driving device for controlling a movement of an autonomous vehicle when the autonomous vehicle is driving with at least one autonomous driving function. the processor is also configured to monitor, via the biometric sensor, mental and physical states of an occupant on the basis of biometric information of the occupant located in the autonomous vehicle while the autonomous vehicle is driving with the autonomous driving function and adjust the first parameter value to a second parameter value in response to a change in the mental and physical states of the occupant from a stable state to an unstable state as a result of monitoring the mental and physical states of the occupant.
Inventor(s): Stephan ROCHE of Barcelona (ES) for samsung electronics co., ltd., Aleandro ANTIDORMI of Barcelona (ES) for samsung electronics co., ltd., Onurcan KAYA of Barcelona (ES) for samsung electronics co., ltd., Van Luan NGUYEN of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Taejin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jaewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C01B35/14
Abstract: an amorphous boron nitride compound may include a boron nitride compound, where the boron nitride compound may be amorphous and may be doped with carbon or hydrogen. in the boron nitride compound, a total content of the carbon or the hydrogen may be in a range of about 0.1 at % to about 35 at % of a total atomic content.
20240035159.PRECURSOR SUPPLY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungrim KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Taekjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongju CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/455, C23C16/448
Abstract: a precursor supply system includes a storage tank storing the precursor in a solid state; a transfer pipe connected to the storage tank to transfer the precursor in a solid state; a phase converter connected to the transfer pipe and sublimating the transported solid-state precursor into vapor; a supply pipe connected to the phase converter and transporting a precursor in a vaporous state; and a process chamber disposed adjacently to the phase converter and connected to the supply pipe.
Inventor(s): Jinju KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Cheolhee CHO of Suwon-si (KR) for samsung electronics co., ltd., Youngdeog KOH of Suwon-si (KR) for samsung electronics co., ltd., Kwangjoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C25D11/24, C23F1/20, C25D11/16
Abstract: disclosed is a method of treating a surface of an aluminum material, the method including: degreasing an aluminum material; etching the degreased aluminum material; performing a first desmutting treatment by immersing the etched aluminum material in a 25-35 wt % nitric acid solution at a temperature in a range of 25 to 30� c. for at least 60 seconds; performing a second desmutting treatment by immersing the first desmutting-treated aluminum material in a 5-15 wt % nitric acid solution at a temperature in a range of 25 to 30� c. for a time in a range of 30 seconds to 60 seconds; anodizing the second desmutting-treated aluminum material; coloring the anodized aluminum material; and sealing the colored aluminum material.
20240035220.WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kwang Min CHUN of Suwon-si (KR) for samsung electronics co., ltd., Hwa Shik KIM of Suwon-si (KR) for samsung electronics co., ltd., Min Jea CHOI of Suwon-si (KR) for samsung electronics co., ltd., Nae Young PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/10, D06F39/14, E05D11/00, D06F37/28
Abstract: disclosed is a washing machine having an improved wire connection structure for electrically connecting electrical components. the washing machine includes a cabinet which has a first electrical component, forms an exterior, and has an opening through which laundry is inserted; a door provided with a second electrical component, and configured to open and close the opening; a wire which electrically connects the first electrical component and the second electrical component; and a hinge which has a wire guide portion for coupling the door to the cabinet so as to be rotatable about a rotating axis and for guiding the wire.
20240035221.WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sung-mo LEE of Gunpo-si (KR) for samsung electronics co., ltd., Sang-ho PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyung-up LIM of Seoul (KR) for samsung electronics co., ltd., Seon-woo LEE of Incheon (KR) for samsung electronics co., ltd., So-dam HAN of Suwon-si (KR) for samsung electronics co., ltd., In-hwan KIL of Yongin-si (KR) for samsung electronics co., ltd., Jun-hyun PARK of Osan-si (KR) for samsung electronics co., ltd., Do-yeon KIM of Yongin-si (KR) for samsung electronics co., ltd., Hoon WEE of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/14, D06F37/20, D06F37/02, D06F37/12, D06F37/42, D06F37/24
Abstract: a washing machine is provided. the washing machine includes a water tub configured to be disposed in a cabinet and to store wash water, a rotating tub configured to be rotatably installed in the water tub and to include an opening formed in an upper end portion thereof, and a driver configured to be connected to the rotating tub and to rotate the rotating tub, wherein a deviation preventer configured to prevent wash water in the rotating tub from being deviated to one side during rotation of the rotating tub is formed at an upper end portion of the rotating tub.
Inventor(s): Hyun-woo SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/08, D06F37/04, D06F37/20, F04D13/06, F04D29/08, D06F37/10
Abstract: a pump motor is disclosed. the pump motor includes a case; a socket part disposed in a portion of the case and provided with a terminal part thereinside; and a cover part detachably coupled to the case and configured to open and close the socket part, wherein the socket part includes a moisture blocking member configured to block a gap between the case and the cover part.
20240035227.WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong Young KIM of Seoul (KR) for samsung electronics co., ltd., Adam WISHNEY of Singapore (SG) for samsung electronics co., ltd., Doo Young RYU of Suwon-si (KR) for samsung electronics co., ltd., In Ju LEE of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/14, D06F34/28, D06F37/28, E05D11/00
Abstract: disclosed is a washing machine having a cabinet forming an outer appearance and having an inlet port formed at the front, a tub provided inside the cabinet for storing wash water, a drum provided inside the tub to be rotatable, and a door installed in the cabinet for opening and closing the inlet port. the door is provided with an auxiliary door which can be freely opened and closed during the washing process independently of the door, so that laundry can be added even during the washing process.
Inventor(s): Hyungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehee KIM of Suwon-si (KR) for samsung electronics co., ltd., Chongkun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): E05D3/12, E05D3/18, E05D11/10
Abstract: a hinge structure is provided. the hinge structure includes a fixed structure including a first guide rail and a second guide rail, a center of an arc of the first guide rail is a first axis of rotation parallel to an axial direction and a center of an arc of the second guide rail is a second axis of rotation parallel to the axial direction, a first rotary structure including a first guide portion accommodated in the first guide rail and a first helical groove extending around and along the first axis of rotation, a second rotary structure including a second guide portion accommodated in the second guide rail and a second helical groove extending around and along the second axis of rotation, and a sliding structure including a first guide protrusion accommodated in the first helical groove and a second guide protrusion accommodated in the second helical groove.
20240035670.COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Moonkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Cheoleun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sihwan KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C15/02, F24C15/04, F24C15/34
Abstract: a cooking apparatus may include a main body that includes a cooking room in which an opening is formed, the opening configured so that food may be put in and taken out of the cooking room through the opening, and to contain heat for cooking the food, and a door rotatably coupled to the main body and configured to open or close the opening. the door may include an outer glass that forms a front side of the door and faces outside the cooking room, an inner glass positioned behind the outer glass to face the cooking room, a door duct positioned between the outer glass and the inner glass and configured to guide air flowing between the outer glass and the inner glass to outside of the door, and a blocking member positioned an accommodating space formed between the door duct and the inner glass and configured to prevent heat contained in the cooking room from leaking out from between the inner glass and the door duct.
[[20240035903.WAFER TEMPERATURE SENSOR INCLUDING OPTICAL FIBER, WAFER TEMPERATURE SENSOR SYSTEM, AND METHOD OF MANUFACTURING WAFER TEMPERATURE SENSOR_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Yoshiaki Moriya of Yokohama-shi (JP) for samsung electronics co., ltd., Noriaki Imai of Yokohama-shi (JP) for samsung electronics co., ltd.
IPC Code(s): G01K11/3206
Abstract: a wafer temperature sensor includes a first wafer, a second wafer, and a fiber bragg gratings (fbg)-type optical fiber, wherein the first wafer and the second wafer are bonded to each other, wherein at least one of a bonding surface of the first wafer and a bonding surface of the second wafer comprises a spiral groove, wherein the fbg-type optical fiber is in the spiral groove, and wherein the fbg-type optical fiber comprises a plurality of temperature measurement points in the spiral groove.
Inventor(s): Sunhong JUN of Suwon-si (KR) for samsung electronics co., ltd., Jaeho Kim of Suwon-si (KR) for samsung electronics co., ltd., Younghoon Sohn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/25, G01N21/27
Abstract: a dual resolution spectrometer includes a slit plate comprising a slit receiving light reflected from a measurement target. the slit plate directs the light reflected from the measurement target to a first mirror. the first mirror reflects light from the slit to a diffraction grating. the diffraction grating disperses light from the first mirror according to a wavelength of the light. the diffraction grating directs light in a first wavelength region to a second mirror and directs light in a second wavelength region to a third mirror. the second mirror reflects the light in the first wavelength region to a detector. the third mirror reflects the light in the second wavelength region to the detector. the detector detects the light in the first wavelength region and the light in the second wavelength region with different resolutions from each other.
Inventor(s): Kyutae KIM of Suwon-si (KR) for samsung electronics co., ltd., SungHyun YOON of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon KIM of Daejeon (KR) for samsung electronics co., ltd., Sanguk KWON of Daejeon (KR) for samsung electronics co., ltd., Jeongho AHN of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/392, G01R31/36, G01R31/367, G01R31/374
Abstract: a battery risk assessment device for a battery module including a plurality of battery cells, including a data measurement unit configured to generate sensing data corresponding to the battery module, wherein the sensing data include cell voltage data comprising voltage information about the plurality of battery cells, cell temperature data comprising temperature information about the plurality of battery cells, module voltage data comprising information about a voltage output from the battery module, and module current data comprising information about a current output from the battery module; a deviation calculator configured to: calculate diffusion resistance data of the plurality of battery cells by using a thevenin equivalent circuit of the battery module, and calculate deviation information based on the sensing data and the diffusion resistance data, wherein the deviation information indicates at least one from among a voltage deviation of the plurality of battery cells, a temperature deviation of the plurality of battery cells, and a diffusion resistance deviation of the plurality of battery cells; and a risk assessment unit configured to determine a battery risk state based on the deviation information.
Inventor(s): KYUTAE KIM of Suwon-si (KR) for samsung electronics co., ltd., SungHyun YOON of Suwon-si (KR) for samsung electronics co., ltd., JONGHOON KIM of Daejeon (KR) for samsung electronics co., ltd., SANGUK KWON of Daejeon (KR) for samsung electronics co., ltd., JEONGHO AHN of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/392, G01R31/367
Abstract: a battery life prediction device, including a state data generator configured to receive information about a battery in real time and to generate state-of-health data; a state data storage configured to store the state-of-health data and past state data; and a battery life calculator configured to: generate a health state model based on the past state data, generate state prediction data based on the state-of-health data using the health state model, determine whether to modify the health state model based on the state prediction data and the state-of-health data, and calculate a remaining life of the battery, wherein the generating of the health state model includes generating an initial model including a non-linear function, determining an initial model coefficient using a least squares approximation based on the past state data, and generating the health state model based on the initial model coefficient and the initial model
Inventor(s): Anum Ali of Plano TX (US) for samsung electronics co., ltd., Jianhua Mo of Allen TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S7/40, G01S13/87, G01S13/76
Abstract: a method includes determining whether to activate one or more radar modules of a user equipment (ue) based on whether the ue performs initial access or beam failure recovery. the method also includes, in response to determining that the one or more radar modules are to be activated: activating all of the one or more radar modules in a time sequence, one or multiple radar modules at a time; determining a power backoff for at least one communication module of the ue; and determining a ue uplink (ul) beam, a ue downlink (dl) beam, a base station (bs) ul beam, and a bs dl beam based on the power backoff and a sweeping of beams of the ue. the sweeping occurs for the beams of the ue that have a power backoff that is less than a threshold.
Inventor(s): Jeonggyu JO of Suwon-si (KR) for samsung electronics co., ltd., Jaehwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Incheol BAEK of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S11/14, G06F1/3206, G10L15/28
Abstract: an electronic device, according to various embodiments, includes: an application processor including an audio processing module and a voice recognition module; a mic; a speaker; and a sensor hub. while the audio processing module included in the application processor is in a sleep state, the sensor hub generates an ultrasonic signal and provides the ultrasonic signal to the speaker so that the speaker outputs a first signal including the ultrasonic signal therethrough; receives, from the voice recognition module, a second signal inputted through the mic; and determines whether an object is near the electronic device, at least on the basis of the first signal and the second signal.
Inventor(s): Jisan LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G01S17/89, G01S7/484, G01S7/4865
Abstract: a method of operating a light detection and ranging (lidar) device includes obtaining receiving signals corresponding to reference laser pulses generated from a reference signal; obtaining a main receiving signal having a maximum value among the receiving signals with respect to a time point; correcting a value of a sub-receiving signal included in the receiving signals at the time point based on the maximum value of the main receiving signal; and obtaining a time of flight (tof) of a laser pulse corresponding to the sub-receiving signal based on a correlation between the corrected value of the sub-receiving signal and the reference signal.
Inventor(s): Taehee Lee of Suwon-si (KR) for samsung electronics co., ltd., Donghan Koo of Suwon-si (KR) for samsung electronics co., ltd., Junghoe Kim of Suwon-si (KR) for samsung electronics co., ltd., Kuyoung Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S17/931, G05D1/02, G01S7/481
Abstract: an electronic device includes: a first sensor mounted inside a body of the electronic device; a second sensor configured to sense a posture of the body; an optical device configured to: reflect light output from the first sensor by using a mirror, and output the reflected light to an outside of the electronic device through a transparent region in the electronic device; a processor configured to: obtain information on the posture of the body through the second sensor, obtain information on a tilting angle of the mirror based on the obtained posture of the body and a refractive index of the transparent region, and control the mirror based on the obtained information on the tilting angle.
Inventor(s): Kyookeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyusub KWAK of Suwon-si (KR) for samsung electronics co., ltd., Bonkon KOO of Suwon-si (KR) for samsung electronics co., ltd., Jeonggeun YUN of Suwon-si (KR) for samsung electronics co., ltd., Wonjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Myongjo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jongchul CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B7/28, G02B27/01, G02F1/29
Abstract: an augmented reality (ar) device including a variable focus lens of which a focal length may be changed by adjusting refractive power and adjusting the position of a focus adjustment region of the variable focus lens according to a direction of the user's view. the ar device may obtain an eye vector indicating a direction of the user's view using an eye tracker, adjust a refractive power of a first focus adjustment region of a first variable focus lens to change a focal length for displaying a virtual image, and complementarily adjust a refractive power of a second focus adjustment lens with respect to the adjusted refractive power of the first focus adjustment region.
Inventor(s): Junwhon UHM of Suwon-si (KR) for samsung electronics co., ltd., Seungnyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Minjung PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongmin YOON of Suwon-si (KR) for samsung electronics co., ltd., Jinchoul LEE of Suwon-si (KR) for samsung electronics co., ltd., Nammin JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01, G06T19/00
Abstract: according to an embodiment, a processor of a wearable device is configured to control a display to display a visual object in association with an external object viewable through a display. the processor is configured to identify whether an acoustic signal is output from an external object, in response to receiving the acoustic signal having a first volume while displaying the visual object, through a microphone of the wearable device, based at least on an image obtained by a camera. based on identifying that the acoustic signal is output from the external object, the processor is configured to obtain a second volume corresponding to the visual object, by adjusting the first volume based on a position relationship between the external object and the visual object. the processor is configured to output an audio signal corresponding to the visual object through a speaker of the wearable device based on the obtained second volume.
20240036393.DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yong Wook KIM of Yongin-si (KR) for samsung electronics co., ltd., Soo Kyung KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaeyong LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/13357, G02F1/1335
Abstract: a display device includes a display panel, a backlight unit, and a light conversion sheet between the display panel and the backlight unit. the backlight unit includes a substrate and light-emitting sections arranged on the substrate, one or more light sources are disposed in each of the light-emitting sections, the light conversion sheet includes first partition walls and light conversion sections arranged to correspond to the light-emitting sections, a first partition wall of the first partition walls is disposed between adjacent light conversion sections of the light conversion sections. each of the light conversion sections includes first quantum dots emitting a first light and second quantum dots emitting a second light having a color different from a color of the first light, and the at least one light source provides light of a predetermined wavelength to the light conversion sheet.
Inventor(s): Seungyong SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sungyeol Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyukjun Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1335
Abstract: in some embodiments, a display apparatus includes a liquid crystal panel, and a light apparatus including a substrate including a plurality of dimming blocks that are arranged in a matrix, a power wire configured to supply power to the plurality of dimming blocks, and a plurality of driving devices configured to control a driving current supplied to the plurality of dimming blocks. each dimming block of the plurality of dimming blocks includes a plurality of light sources. a second dimming block of the plurality of dimming blocks is arranged in an (n+1)row adjacent to the nrow. the power wire is arranged between the nrow corresponding to the first dimming block and the (n+1)row. the power wire is coupled to a first light source of the first dimming block and to a second light source of the second dimming block.
Inventor(s): Seunghyun MOON of Suwon-si (KR) for samsung electronics co., ltd., Hakjae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03B21/56, H04N9/31
Abstract: an electronic apparatus includes a projector, an input/output interface, a memory, and a processor that controls the electronic apparatus by executing at least one instruction stored in the memory. the processor obtains screen information of a screen device connected to the electronic apparatus, controls the input/output interface to transmit first operation information corresponding to an unrolling of the screen device in response to receiving a user command to project an image, and controls the projector to project a first image to at least a partial region of a region in which a screen of the screen device is exposed based on the screen information while the screen of the screen device is being unrolled, based on the first operation information.
Inventor(s): MUN JA KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung Hyun Lee of Seongnam-si (KR) for samsung electronics co., ltd., Jae Sun Jung of Seongnam-si (KR) for samsung electronics co., ltd., Byungchul Yoo of Suwon-si (KR) for samsung electronics co., ltd., Byunghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Changyoung Jeong of Suwon-si (KR) for samsung electronics co., ltd., Deok Hyun Kim of Seongnam-si (KR) for samsung electronics co., ltd., Deok Hyun Cho of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/62
Abstract: provided herein are protective membranes for lithography that include a core layer including carbon, an interface layer on the core layer, and a protective layer on the interface layer. the interface layer includes a reactive group bonded to a carbon atom of the core layer and the reactive group includes oxygen or nitrogen. the protective layer includes an element “m”, and the element “m” is bonded to the oxygen or nitrogen of the reactive group.
Inventor(s): Sangjine Park of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Park of Suwon-si (KR) for samsung electronics co., ltd., Kuntack Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/20, H01J37/32
Abstract: provided is a substrate processing apparatus including a processing chamber including a processing space, a substrate support configured to support a substrate in the processing chamber, an exhaust pipe arranged on a bottom wall of the processing chamber, an exhaust device configured to exhaust a fluid in the processing space via the exhaust pipe, a first supply pipe including a first portion inserted into the exhaust pipe and a second portion outside the exhaust pipe, and a fluid supply device configured to supply a fluid in a supercritical state to the processing space via the first supply pipe, wherein a first inlet at an end portion of the first supply pipe and an exhaust opening at an end portion of the exhaust pipe are on a central axis of the processing chamber.
Inventor(s): Han Veen KOH of Suwon-si (KR) for samsung electronics co., ltd., Soo Yong LEE of Suwon-si (KR) for samsung electronics co., ltd., Moo-Joon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Yoon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
Abstract: provided is a lithography model simulation method. the method comprises receiving a first mask image, generating a second mask image by simulating an optical model on the first mask image, generating at least one third mask image by simulating a quenching model on the second mask image, and generating a resist image by performing machine learning on the first mask image, the second mask image, and the third mask image. the generating of the resist image comprises outputting first output data by convolving the first mask image with a first kernel, outputting second output data by convolving the second mask image with a second kernel, outputting third output data by convolving the third mask image with a third kernel, and adding together the first to third output data. each of the first to third kernels is or includes a free-form kernel.
Inventor(s): Hyunju SEO of Suwon-si (KR) for samsung electronics co., ltd., U KANG of Seoul (KR) for samsung electronics co., ltd., Sanghee KIM of Suwon-si (KR) for samsung electronics co., ltd., Inchul HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jongjin KIM of Seoul (KR) for samsung electronics co., ltd., Hoyoung YOON of Seoul (KR) for samsung electronics co., ltd., Jaeri LEE of Seoul (KR) for samsung electronics co., ltd., Hyunsik JEON of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G05B13/02
Abstract: an electronic device is provided. the electronic device includes an interface, a memory, and a processor and configured to provide a control recommendation of an external electronic device using a learning model. the learning model is configured to generate a first output vector by encoding sequential control information about a user using a transformer and summarizing the encoded sequential control information using a query vector, and output a second output vector by encoding the first output vector using a transformer and summarizing the encoded first output vector using time information.
Inventor(s): Baeseok Lim of Suwon-si (KR) for samsung electronics co., ltd., Donghan Koo of Suwon-si (KR) for samsung electronics co., ltd., Woosub Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02
Abstract: a robot includes: a body portion; at least one sensor provided in the body portion; a first wheel and a second wheel provided on opposite sides of the body portion and configured to rotate; a first driver configured to rotate the first wheel and the second wheel with respect to a first rotation axis; a second driver configured to eccentrically rotate the first wheel and the second wheel with respect to a second rotation axis; and at least one processor configured to: control the first driver and the second driver to cause the robot to move along a route by rotating the first wheel and the second wheel, identify, based on sensing data obtained through the at least one sensor, an obstacle for climbing on the route, and based on identifying the obstacle, control the second driver to eccentrically rotate the first wheel and the second wheel with respect to the second rotation axis, and to shift the first wheel and the second wheel in a direction from a first position to a second position to increase a size of a wheel base of the robot.
Inventor(s): Hyomuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Woojeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jewoong Ryu of Suwon-si (KR) for samsung electronics co., ltd., Aron Baik of Suwon-si (KR) for samsung electronics co., ltd., Mideum Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02, G10L15/22
Abstract: provided is a robot device and method of controlling same, wherein the robot device includes: at least one sensor; at least one memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction to: based on the robot device being positioned at a first position, control the robot device in a first mode corresponding to the first position, identify, based on sensing data obtained by the at least one sensor, a first event of picking up the robot device by a user and a second event of placing the robot device, and based on an identification that a position of the robot device is changed from the first position to a second position based on new sensing data obtained by the at least one sensor after the first event and the second event sequentially occur, control the robot device in a second mode corresponding to the second position.
Inventor(s): Dongheon JANG of Suwon-si (KR) for samsung electronics co., ltd., Junghyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Taegyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghwa LEE of Suwon-si (KR) for samsung electronics co., ltd., Seongho HONG of Suwon-si (KR) for samsung electronics co., ltd., Chungsoon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H05K1/18, H04R1/28
Abstract: a wearable electronic device is provided. the wearable device includes a bracket, a printed circuit board that at least partially faces a first surface of the bracket, a sound sensor structure disposed on a second surface of the bracket, a biometric sensor structure that overlaps the first surface of the bracket with respect to a direction that is perpendicular to the printed circuit board, and a damping structure interposed between the biometric sensor structure and the printed circuit board. the damping structure may elastically support the biometric sensor structure and the printed circuit board.
Inventor(s): Hyunseok Nam of Suwon-si (KR) for samsung electronics co., ltd., Seongmun Park of Suwon-si (KR) for samsung electronics co., ltd., Yongsung Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3203
Abstract: an operating method of a power management integrated circuit includes outputting a first enable signal of a first regulator at a high level, determining whether a detection signal of a second regulator has a high level when a second enable signal of the second regulator has a low level, changing set values of the first regulator and the second regulator for a parallel mode when the detection signal has a high level, setting the first regulator and the second regulator to the changed set values, and outputting the second enable signal at a high level.
Inventor(s): Kyung-Min PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/324, G06F1/3206, G06F1/3287, G06F1/3296, G06F1/20
Abstract: a system on chip and semiconductor device including the same are provided. the system on chip comprises a plurality of functional blocks, a frames per second (fps) meter measuring fps based on data processed by the functional blocks, a thermal management unit (tmu) sensing a temperature of each of the functional blocks, a dynamic voltage frequency scaling (dvfs) controller performing dvfs on the functional blocks, and a power management unit (pmu) independently controlling the power of the functional blocks, wherein the dvfs controller checks the fps for the functional blocks when an operating frequency of each of the functional blocks is limited and limits the operating frequency of the at least one of the functional blocks to a threshold value or less using the fps checked by the dvfs controller and the temperature of each of the functional blocks.
Inventor(s): Dong-Hee HAN of Hwaseong-si (KR) for samsung electronics co., ltd., Dae-yeong Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/324, G06F15/78, G06F1/329, G06F1/3206, G06F1/3234
Abstract: in a method of operating a system-on-chip (soc), the soc includes a plurality of processor cores. an operating frequency of the plurality of processor cores is set to a first operating frequency based on permitted power consumption of the soc and an operating status of the plurality of processor cores. the first operating frequency is within a maximum operating frequency of the plurality of processor cores. at least one of the plurality of processor cores performs at least one processing operation based on the first operating frequency. when present power consumption of the soc is determined as exceeding the permitted power consumption, a warning signal is activated, and a first control operation for reducing the present power consumption is performed immediately thereafter.
Inventor(s): Bona LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiho KIM of Suwon-si (KR) for samsung electronics co., ltd., Pilseung YANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungwha HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482
Abstract: an electronic device and a method for a multi-party video call are provided. the electronic device includes a display module, a communication module, and a processor, memory for storing instructions that, when executed by the processor, cause the electronic device to establish communication links with a plurality of users by means of a communication module in order to execute a multi-party video call, display objects representing the plurality of users executing the multi-party video call using a specified first user interface, display one or more selectable options on the first user interface in response to the execution of a specific function during the execution of the multi-party video call, wherein the options are options relating to the specific function, and display the objects, representing the plurality of users, by changing the objects on the basis of a first option selected from among the one or more options by a first user of the electronic device.
Inventor(s): Dong-Goo KANG of Seoul (KR) for samsung electronics co., ltd., Yun-Kyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Yong-Yeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Ji-Yeon KWAK of Seoul (KR) for samsung electronics co., ltd., Yeo-Jun YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482, G06F9/451, G06F3/0487, G06F1/16, H04M1/02, G06F3/04883, G06F3/04886, G11B27/34, G06F3/04817, G06F3/04842, H04M1/72403, H04M1/72469, G06F3/04847, G06F3/0488
Abstract: a user terminal device and a displaying method thereof are provided. the user terminal device includes a display configured to display a first screen on a display which is divided by a folding line into a first area and a second area, the second area being larger than the first area with reference to a folding line and including an exposure area that is exposed while the display is folded along the folding line such that the first area faces the second area, a detector configured to detect, while the first screen is displayed, a first folding interaction of folding the display such that the first area faces the second area and a second folding interaction of folding the display such that a first cover corresponding to the first area faces a second cover corresponding to the second area, and a controller configured to, in response to detecting the first folding interaction, display a second screen related to the first screen on the exposure area, and in response to the second folding interaction being detected, display a third screen related to the first screen on the first area or the second area.
Inventor(s): Seungki HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: disclosed is a memory device, which may include memory banks including a plurality of memory cells, row address repeaters that transfer a row address to the memory banks, and control logic that controls data input/output of the memory banks. the memory banks may be grouped into a plurality of bank groups, and the row address repeaters may be grouped into a plurality of repeater groups respectively corresponding to the plurality of bank groups. the control logic may control the row address repeaters according to activation status of the plurality of bank groups.
Inventor(s): Zhengyu YANG of San Diego CA (US) for samsung electronics co., ltd., Bridget Molly DAVIS of Carlsbad CA (US) for samsung electronics co., ltd., Daniel KIM of San Marcos CA (US) for samsung electronics co., ltd., Jeffrey Chun Hung WONG of Orange CA (US) for samsung electronics co., ltd., Adnan MARUF of Miami FL (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F9/50
Abstract: a method of operating a storage system may include allocating a first partition of a tier of storage resources to a first client, wherein the tier operates at least partially as a storage cache, allocating a second partition of the tier of the storage resources to a second client, monitoring a workload of the first client, monitoring a workload of the second client, and reallocating the first partition of the tier of the storage resources to the first client based on the monitored workload of the first client and the monitored workload of the second client. the method may further include reallocating the second partition of the tier of the storage resources to the second client based on the monitored workload of the first client and the monitored workload of the second client.
Inventor(s): Jung Su KIM of Suwon-si (KR) for samsung electronics co., ltd., Ho Jin EO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/16, H04W4/80, G05B15/02
Abstract: provided are an electronic device, a control method thereof, and a sound output control system of the electronic device, for example, a technique for controlling sound that is output from an electronic device located in the same space as a voice recognition device. the electronic device according to an embodiment of the disclosure includes: a communication device comprising communication circuitry configured to detect a voice recognition device within a specified distance of the electronic device; a storage device comprising a memory configured to store identification information of the detected voice recognition device; and a controller configured to compare, based on the communication device receiving identification information from a server of a voice recognition device that has received a voice command from a user, the received identification information with the identification information stored in the storage device, and to control, based on the controller determining that the received identification information is identical to the stored identification information, the electronic device to stop outputting sound.
Inventor(s): Shinhaeng KANG of Suwon-si (KR) for samsung electronics co., ltd., Seongil O of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F7/48, G06F13/16, G11C7/10
Abstract: a semiconductor memory device includes a plurality of memory bank groups configured to be accessed in parallel; an internal memory bus configured to receive external data from outside the plurality of memory bank groups; and a first computation circuit configured to receive internal data from a first memory bank group of the plurality of memory bank groups during each first period of a plurality of first periods, receive the external data through the internal memory bus during each second period of a plurality of second periods, the second period being shorter than the first period, and perform a processing in memory (pim) arithmetic operation on the internal data and the external data during each second period.
Inventor(s): Jinwoo Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/455, G06F9/54
Abstract: a method of executing an application, performed by an electronic device including a host system and a virtual machine system, includes: obtaining, through the host system, a first execution request for a first guest application installed in the virtual machine system; transmitting, from the host system to the virtual machine system, the first execution request and a generation request for a first virtual display corresponding to the first guest application; outputting a first execution result of the first guest application on the first virtual display that is generated based on the generation request; transmitting, from the virtual machine system to the host system, a first captured image of the first virtual display; and outputting, through the host system, the first captured image on a display of the electronic device.
Inventor(s): Backki KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongwon SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/455, G06F9/54, G06F9/48
Abstract: disclosed are a computing device and an operating method thereof. a method of operating a computing system including a host system and a virtual machine system includes: receiving, by the virtual machine system, a request for executing a virtual machine application, by a cpu scheduler of a virtual machine system, scheduling the virtual machine application for which execution is requested to be primarily executed, providing a result of the scheduling to a kernel, and transmitting a request for confirming a resources preemption right for the virtual machine application to a cpu scheduler of the host system, and by the cpu scheduler of the host system, determining a resources preemption right of the virtual machine application by referring to a host scheduling list, and providing information about the determined resources preemption right to the cpu scheduler of a virtual machine system.
Inventor(s): Sudharshan Rao B of Bengaluru (IN) for samsung electronics co., ltd., Tushar VRIND of Bengaluru (IN) for samsung electronics co., ltd., Venkata Raju INDUKURI of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F9/50
Abstract: various example embodiments relate to methods, devices, and/or systems for executing a plurality of tasks in a computer operating environment. the method comprises monitoring a remaining execution time of a current task executing on the processing circuitry, and performing, by the processing circuitry, pre-emption of the current task based on the remaining execution time of the current task and a desired execution threshold time, the desired execution threshold time being one of a desired value based on one or more configuration parameter of the current task or a dynamic value determined based on information related to ongoing activities in the computer operating environment.
20240037027.METHOD AND DEVICE FOR STORING DATA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Lei Geng of Xi'an hi tech Zone (CN) for samsung electronics co., ltd., Yanlong Yang of Xi'an hi tech Zone (CN) for samsung electronics co., ltd., Yuqi Zhang of Xi'an hi tech Zone (CN) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
Abstract: a method and device for storing data are provided. the method includes: selecting at least one block from a plurality of blocks in a storage device as a evicting block or a target block based on an expected expiration time of each of the plurality of blocks in response to a request for garbage collection, wherein the expected expiration time of each block is obtained based on an expected expiration time of valid data of each block; and performing garbage collection based on the selected at least one block.
20240037041.SYSTEM AND METHOD FOR LBA-BASED RAID_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changho Choi of San Jose CA (US) for samsung electronics co., ltd., Nima Elyasi of State College PA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/10, G06F3/06
Abstract: a system and method for an lba raid storage device. the lba raid storage device includes a plurality of data channels and a plurality of storage components. each of the storage components is connected to one of the plurality of data channels. a storage controller is configured to receive a data and write the data to a raid group made up of at least two storage components of the plurality of storage components that are each connected to a separate data channel.
Inventor(s): Ariel DOUBCHAK of Suwon-si (KR) for samsung electronics co., ltd., Noam LIVNE of Suwon-si (KR) for samsung electronics co., ltd., Amit BERMAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/56, G06F11/14, G06N20/00
Abstract: a storage system, including a host device; and a storage device including a memory and at least one processor configured to implement a storage internal protection (sip) module, wherein the sip module is configured to: obtain, from the host device, a plurality of storage commands corresponding to the memory, filter the plurality of storage commands to obtain a filtered plurality of storage commands, apply information about the filtered plurality of storage commands to a machine-learning ransomware detection algorithm, and based on the machine-learning ransomware detection algorithm indicating that a ransomware operation is detected, provide a notification to the host device.
Inventor(s): WON IK JANG of SUWON-SI (KR) for samsung electronics co., ltd., SANG HOON MYUNG of SUWON-SI, (KR) for samsung electronics co., ltd., JAE MYUNG CHOE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/367, G06N3/08, G06N3/045
Abstract: systems and methods for simulating a semiconductor device, a method among includes; generating meshes associated with a simulated semiconductor device using a semiconductor device simulator, extracting nodes from information associated with the meshes, extracting edges connected between the nodes using information associated with the meshes, generating graph information in relation to the nodes and edges, applying the graph information to a graph neural network (gnn) learning model, and predicting change in the meshes in response to change in state information applied to the simulated semiconductor device using the gnn learning model.
Inventor(s): Hoon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jae Wook LEE of Seoul (KR) for samsung electronics co., ltd., Rihae PARK of Seoul (KR) for samsung electronics co., ltd., Yeonhong PARK of Seoul (KR) for samsung electronics co., ltd., Seung Yul LEE of Seoul (KR) for samsung electronics co., ltd., Hyunseung LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/048, G11C11/54
Abstract: a method and apparatus are provided. the method includes reordering a plurality of filters, then based on a result of the reordering, compressing weights, among a plurality of weights of the plurality of filters, resulting in some of the plurality of weights being uncompressed weights, generating a plurality of operation unit maps by mapping the uncompressed weights to respective operation units according to a predetermined bulk unit, and mapping the plurality of operation unit maps to an array.
Inventor(s): Jihye KIM of Anyang-si (KR) for samsung electronics co., ltd., Seon Min RHEE of Seoul (KR) for samsung electronics co., ltd., Jongseok KIM of Seoul (KR) for samsung electronics co., ltd., Heewon KIM of Seoul (KR) for samsung electronics co., ltd., Seungju HAN of Seoul (KR) for samsung electronics co., ltd., Jaejoon HAN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T5/50, G06V10/40
Abstract: an image processing method includes receiving an input image and a guide image corresponding to the input image, extracting informative features from the input image and the guide image to enhance the input image, selectively obtaining a first feature for the input image from among the informative features, and processing the input image based on the first feature.
Inventor(s): Jaeho JUNG of Suwon-si (KR) for samsung electronics co., ltd., Yeultak SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T7/246, G06T5/00
Abstract: provided is an artificial intelligence (ai) system that mimics functions, such as recognition and determination by human brains, by utilizing a machine learning algorithm, such as deep learning, and applications of the ai system. an image acquisition device is disclosed including a camera configured to acquire a first image, wherein a portion of a main object is hidden from the camera by a sub-object; at least one processor configured to input the first image to a first ai neural network; detect, by the first ai neural network from data corresponding to a plurality of objects included in the first image, first data corresponding to the main object and second data corresponding to the sub-object from the first image by inputting the first image to an ai neural network, remove the sub-object from the first image, and generate, using a second ai neural network, a second image by restoring third data corresponding to at least a portion of the main object hidden by the removed sub-object by using the ai neural network, wherein the third data replaces the second data; and a display configured to display at least one of the first image and the second image.
Inventor(s): Sanguk PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongsoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T5/40
Abstract: according to various embodiments, an electronic device includes at least one camera and at least one processor. the processor is configured to acquire, through the at least one camera, a first video of which the maximum luminance is a first luminance, check a first tone mapping function for converting the first video into a second video of which the maximum luminance is a second luminance that is lower than the first luminance, and check a second tone mapping function for converting the first video into a third video of which the maximum luminance is a third luminance that is lower than the second luminance. the processor is configured to relate, to the first video, first metadata based on the first tone mapping function and second metadata based on the second tone mapping function and store same.
Inventor(s): Inhwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwanghyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Daehyeon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youmin HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06T7/70
Abstract: provided is a display apparatus including a camera, a memory stored with information about an augmented reality (ar) object, a display, and at least one processor connected with the camera. the processor identifies at least one object from an image captured through the camera, identifies a target object from among the at least one object based on information about the ar object, and controls the display to display the ar object based on a position of the target object.
Inventor(s): Eun-sang BAK of Ansan-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09B7/00, G10L15/18, G06F3/16, G10L15/30, G06F16/242, G06F16/332, G06F16/432, G06F40/295
Abstract: a display apparatus and a method for questions and answers includes a display unit includes an input unit configured to receive user's speech voice; a communication unit configured to perform data communication with an answer server; and a processor configured to create and display one or more question sentences using the speech voice in response to the speech voice being a word speech, create a question language corresponding to the question sentence selected from among the displayed one or more question sentences, transmit the created question language to the answer server via the communication unit, and, in response to one or more answer results related to the question language being received from the answer server, display the received one or more answer results. accordingly, the display apparatus may provide an answer result appropriate to a user's question intention although a non-sentence speech is input.
Inventor(s): Byeungwoong HAN of Suwon-si (KR) for samsung electronics co., ltd., Seungeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Woojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Taihoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G06F3/04886
Abstract: according to an embodiment, an electronic device includes: a flexible display, at least one sensor, and a processor; wherein the processor is configured to: control the display to display an object at least partially superimposed on a first user interface displayed on the first display area and the second display area, on a portion of an edge of the first display area; identify that the state of the electronic device is changed from a second state to a first state, while the object is displayed on the portion of the edge of the first display area; display the object the portion of the edge of the second display area extending from the edge of the first display area, in response to identifying that the state of the electronic device is changed from the second state to the first state.
Inventor(s): Changju LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyounghwan KWON of Suwon-si (KR) for samsung electronics co., ltd., Junho HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3225
Abstract: a display system includes a host configured to transfer image data respectively corresponding to a plurality of frames through a main channel, and to transfer a synchronization signal that synchronizes a clock signal of the host with a clock signal of the display driving circuit through an auxiliary channel, a display panel configured to display the image data, and a display driving circuit configured to generate control signals driving the display panel, based on the synchronization signal received through the auxiliary channel. the host is configured to transfer the synchronization signal including a first synchronization signal and a second synchronization signal that is different from the first synchronization signal, to the display driving circuit, through the auxiliary channel.
Inventor(s): Qiuyue MA of Beijing (CN) for samsung electronics co., ltd., Yuxing ZHENG of Beijing (CN) for samsung electronics co., ltd., Hosang SUNG of Suwon-si (KR) for samsung electronics co., ltd., Lizhong WANG of Beijing (CN) for samsung electronics co., ltd., Xiaoyan LOU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G10L15/02, G10L15/10
Abstract: the present disclosure provides methods, devices, and computer-readable mediums for audio signal processing. in some embodiments, a method executed by an electronic device includes obtaining guidance features corresponding to an audio signal to be processed, the guidance features indicating distinguishable features of at least one signal type of at least one signal category. the method further includes extracting, according to the guidance features, target audio features corresponding to the audio signal. the method further includes determining, according to the target audio features, a target signal type of the audio signal from among the at least one signal type of the at least one signal category. the method further includes performing corresponding processing according to the target signal type of the audio signal.
Inventor(s): Nam-yeong KWON of Anyang-si (KR) for samsung electronics co., ltd., Kyung-mi PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/06, H04N21/422, H04N21/439, H04N21/482, G06F3/16, G10L15/02, G10L15/10
Abstract: a display apparatus includes an input unit configured to receive a user command; an output unit configured to output a registration suitability determination result for the user command; and a processor configured to generate phonetic symbols for the user command, analyze the generated phonetic symbols to determine registration suitability for the user command, and control the output unit to output the registration suitability determination result for the user command. therefore, the display apparatus may register a user command which is resistant to misrecognition and guarantees high recognition rate among user commands defined by a user.
20240038288.MEMORY DEVICE REFRESH OPERATIONS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongha Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunki Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungchul Park of Suwon-si (KR) for samsung electronics co., ltd., Ju-Seop Park of Suwon-si (KR) for samsung electronics co., ltd., Dongsu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406
Abstract: in a memory device, a control circuit detects determines an aggressor row address, indicating an aggressor row of a memory cell array, at a random time. the aggressor row address or a value derived from the aggressor row address is stored in a queue. the control circuit controls a refresh operation of one or more victim rows based on the aggressor row address in response to a targeted refresh command.
Inventor(s): Kiheung Kim of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Oh of Suwon-si (KR) for samsung electronics co., ltd., Jongcheol Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyungho Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyongryol Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4078, G11C11/4096, G11C11/4076, G11C11/406
Abstract: a semiconductor memory device includes a memory cell array including a plurality of memory cell rows, a row hammer management circuit and a control logic circuit. the row hammer management circuit stores counted values in count cells of each of the plurality of memory cell rows as count data based on an active command applied to the control logic circuit at a first time point, and performs an internal read-update-write operation to read the count data from the count cells of a target memory cell row from among the plurality of memory cell rows, to update the count data that was read to obtain updated count data, and to write the updated count data in the count cells of the target memory cell row in response to a precharge command applied at a second time point after a first command that is applied to the control logic circuit.
Inventor(s): Youngdo Um of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Oh of Suwon-si (KR) for samsung electronics co., ltd., Hoseok Seol of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4096, H01L25/065, H10B80/00, H01L23/00, G11C11/4076
Abstract: a semiconductor package includes a memory die stack having a clock signal shared by lower and upper bytes. each of a plurality of memory dies constituting the memory die stack of the semiconductor package includes a first clock circuit configured to generate a read clock signal for a lower byte and an upper byte constituting a data width of the memory die, and a plurality of first die bond pads corresponding to the number of ranks of a memory system including the memory die, and each of the plurality of first die bond pads is set for each rank. the first clock circuit is connected to, among the plurality of first die bond pads, a die bond pad corresponding to a rank to which the memory die belongs.
Inventor(s): Jinyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sehwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Ilhan PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngdeok SEO of Suwon-si (KR) for samsung electronics co., ltd., Dongmin SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/16, G11C16/08, G11C16/04, G11C16/26, G11C16/24
Abstract: a memory device may include a memory block and a control circuit. the memory block may include a first sub-block and a second sub-block that are connected between a common source line and a plurality of bit lines and may be vertically stacked. the control circuit may be configured to select any one of the common source line and the plurality of bit lines as a transmission path of an erase voltage based on positions of the first sub-block and the second sub-block, and perform erase operations on the first sub-block and the second sub-block in units of sub-blocks.
Inventor(s): NAMHYUNG KIM of SUWON-SI (KR) for samsung electronics co., ltd., DAEJEONG KIM of SUWON-SI (KR) for samsung electronics co., ltd., DOHAN KIM of SUWON-SI (KR) for samsung electronics co., ltd., DEOKHO SEO of SUWON-SI (KR) for samsung electronics co., ltd., JAEIN SONG of SUWON-SI (KR) for samsung electronics co., ltd., INSU CHOI of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/44, G11C29/12, G11C29/02
Abstract: a memory system including a memory device that receives a plurality of signals including a post package repair (ppr) command from a host, wherein the memory device includes a memory cell array including a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a plurality of redundancy memory cells connected to one or more redundancy word lines and the plurality of bit lines, and anti-fuse memory cells, and a ppr control circuit that transmits to the host whether a ppr operation on a defective memory cell of the memory cell array has passed.
Inventor(s): HYUNGJOON KIM of Suwon-si (KR) for samsung electronics co., ltd., KIYONG KIM of Suwon-si (KR) for samsung electronics co., ltd., YOUNGKWON KIM of Suwon-si (KR) for samsung electronics co., ltd., JAEHYUN KIM of Suwon-si (KR) for samsung electronics co., ltd., YOODONG YANG of Suwon-si (KR) for samsung electronics co., ltd., MINSUCK YOO of Suwon-si (KR) for samsung electronics co., ltd., JONGHYUN LEE of Suwon-si (KR) for samsung electronics co., ltd., ILJUN JEON of Suwon-si (KR) for samsung electronics co., ltd., HEE JONG JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
Abstract: a substrate supporting apparatus includes a heating plate, a radio frequency (rf) electrode in the heating plate, and an rf delivery structure in contact with a bottom surface of the rf electrode. the heating plate includes a first insertion hole, which is recessed into the heating plate from a bottom surface of the heating plate to expose the bottom surface of the rf electrode. the rf delivery structure includes an rf rod, a portion of which is inserted in the first insertion hole, and through which an rf power is supplied to the rf electrode. the rf rod includes a first material, and a relative permeability of the first material is less than 100, a volume resistivity of the first material is smaller than 70 n�m, and a melting point of the first material is higher than 1400� c.
20240038493.SEMICONDUCTOR PROCESSING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junho YOON of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangwuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Chanhoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Edward SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
Abstract: a semiconductor processing apparatus includes an upper electrode and a substrate on a lower electrode disposed inside the process chamber, a first power generator configured to provide a low-frequency signal to the lower electrode, wherein the low-frequency signal varies between a reference voltage and a first voltage at intervals of a first cycle, a second power generator configured to provide a high-frequency signal to the lower electrode, wherein the high-frequency signal has a sinusoidal waveform that oscillates at intervals of a second cycle shorter than the first cycle, and a direct-current (dc) power generator configured to provide a dc bias to the upper electrode. the high-frequency signal is turned off during at least part of a duration for which the low-frequency signal has the first voltage, and the high-frequency signal is turned on and turned off at intervals of a third cycle different from the first and second cycles.
20240038505.PLASMA PROCESSING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donghyeon Na of Suwon-si (KR) for samsung electronics co., ltd., Jaebin Kim of Suwon-si (KR) for samsung electronics co., ltd., Myeongsoo Shin of Suwon-si (KR) for samsung electronics co., ltd., Dongseok Han of Suwon-si (KR) for samsung electronics co., ltd., Kyungsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Namkyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaesung Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungbo Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01J37/20
Abstract: a plasma processing apparatus includes a wafer support fixture in the chamber and configured to support a wafer, an upper electrode in the chamber and spaced apart from the wafter support fixture, a magnet assembly configured to apply a magnetic field into a chamber, the magnet assembly including a plurality of first magnets and a plurality of second magnets arranged in an annular shape, and a horizontal distance from a central axis of the chamber to each of the plurality of first magnets and each of the plurality of second magnets is less than a radius of the wafer.
Inventor(s): Changheon LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Sangki NAM of Seongnam-si (KR) for samsung electronics co., ltd., Taesun SHIN of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/3065, H01L21/67
Abstract: a substrate processing method includes inserting a substrate from an outside into a processing space, supplying a process gas from a gas supply unit to the processing space, producing plasma based on the process gas, performing an etching process for the substrate using ions included in the plasma, and discharging a processed gas produced in the etching process through a discharge part. the discharge part includes a first slit extending through a flange part, and a second slit connected to the first slit while extending through a side wall part connected to the flange part. a vertical length of the first slit is equal to a vertical length of the second slit. a horizontal length of the first slit is about 5 times to about 7 times the vertical length of the first slit.
Inventor(s): YONGIN LEE of SUWON-SI (KR) for samsung electronics co., ltd., DONGGAP SHIN of SUWON-SI (KR) for samsung electronics co., ltd., WOOYOUNG KIM of SUWON-SI (KR) for samsung electronics co., ltd., BUMKI MOON of SUWON-SI (KR) for samsung electronics co., ltd., JIWON MOON of SUWON-SI (KR) for samsung electronics co., ltd., INHWA BAEK of SUWON-SI (KR) for samsung electronics co., ltd., SEUNGDAE SEOK of SUWON-SI (KR) for samsung electronics co., ltd., SIWOONG WOO of SUWON-SI (KR) for samsung electronics co., ltd., SEHOON JANG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/18, H01L21/02, H01L21/67
Abstract: a plasma processing apparatus includes a load lock chamber switchable between an atmospheric pressure state and a vacuum pressure state, and a substrate processing apparatus configured to transfer a substrate to and from the load lock chamber and to perform a plasma process on a surface of the substrate in a plasma chamber under a vacuum atmosphere. the substrate processing apparatus includes a substrate stage disposed within the plasma chamber and configured to support the substrate, a plasma gas supply configured to supply a plasma gas into the plasma chamber, a steam supply configured to supply a water vapor into the plasma chamber, and a plasma generator configured to generate a plasma in the plasma chamber.
Inventor(s): Jakyoung GU of Suwon-si (KR) for samsung electronics co., ltd., Minsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihye SHIM of Suwon-si (KR) for samsung electronics co., ltd., Kyoungok JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/48, H01L25/10, H10B80/00
Abstract: a method of manufacturing a semiconductor package includes forming a plurality of conductive patterns on a substrate, forming a photoresist film over the substrate to cover the plurality of conductive patterns, forming a photoresist pattern from the photoresist film by a photolithography process using a photomask that includes a transparent area, a light-shielding area, and a semi-transparent area transmitting only a portion of light incident thereon, wherein the photoresist pattern includes a via hole, which exposes one conductive pattern, and a recessed portion, which has a lower surface exposing a portion of the photoresist pattern, forming a conductive post in the via hole, and removing the photoresist pattern by using a photoresist stripping composition.
Inventor(s): Woojung PARK of Suwon-si (KR) for samsung electronics co., ltd., Mihyae PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/56, C09D7/20, H01L21/02, C09D7/61, C09D5/16, H01L21/304
Abstract: a coating composition for wafer protection and a method of manufacturing a semiconductor package, the coating composition includes a solvent; about 1 weight percent (wt %) to about 40 wt % of a water-soluble polymer; and about 0.01 wt % to about 30 wt % of a nano light-emitting filler.
Inventor(s): Jun Kyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Hongjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongjae BANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/677, B65G17/20, B66C19/00, F16F15/08, B66C13/04, B66C7/12, B66C9/04
Abstract: a substrate transfer device includes a housing accommodating a carrier for storing a substrate, a carrier lifter moving the carrier in a vertical direction relative to an upper surface of the housing, a vertical stabilization unit connected to a lower part of the carrier lifter and reducing a vertical vibration of the carrier, a rotation stabilization unit connected to a lower part of the vertical stabilization unit and reducing rotation of the carrier, and a carrier holder connected to a lower part of the rotation stabilization unit. the carrier holder holds the carrier. the vertical stabilization unit includes an upper plate connected to the carrier lifter, a lower plate connected to the rotation stabilization unit, and a buffer disposed between the upper plate and the lower plate. the buffer contracts or relaxes to reduce the vertical vibration of the carrier.
Inventor(s): Hyunhaeng Heo of Suwon-si (KR) for samsung electronics co., ltd., SUNGHOON KIM of Suwon-si (KR) for samsung electronics co., ltd., JAEICK SON of Suwon-si (KR) for samsung electronics co., ltd., SEUNGYEON KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H10B80/00
Abstract: a semiconductor chip including a guard ring that surrounds edges of a semiconductor substrate, an internal circuit structure that is formed on the semiconductor substrate and that includes a memory cell array region and a peripheral circuit region, and a crack detection circuit that is located between the guard ring and the internal circuit structure and that detects whether a crack occurs. the semiconductor chip further includes first to fourth chamfer regions having different shapes and sizes depending on the position of a pad or the design arrangement of the internal circuit structure.
20240038634.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JINKYU KIM of SUWON-SI (KR) for samsung electronics co., ltd., YUNSUK NAM of SUWON-SI (KR) for samsung electronics co., ltd., GUKHEE KIM of SUWON-SI (KR) for samsung electronics co., ltd., JUNBEOM PARK of SUWON-SI (KR) for samsung electronics co., ltd., JAEHYUN AHN of SUWON-SI (KR) for samsung electronics co., ltd., DARONG OH of SUWON-SI (KR) for samsung electronics co., ltd., DONGICK LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H10B10/00, H01L29/423, H01L29/06, H01L29/786, H01L29/775, H10B10/10
Abstract: a semiconductor device, includes: a substrate having a first region and a second region; a first device on the substrate, in the first region; a second device on the substrate, in the second region; a front side interconnection structure including a plurality of interconnection layers electrically connected to the first device and the second device, on a front side of the substrate; and a back side buried interconnection structure adjacently to a back side of the substrate opposing the front side. the back side buried interconnection structure includes a back side buried insulating layer in a trench recessed from a back side of the substrate toward the front side of the substrate, and a back side buried conductive layer in the back side buried insulating layer. the back side buried interconnection structure is located in the first region or the second region.
20240038642.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31, H01L23/00, H01L25/10
Abstract: a semiconductor package includes a first redistribution substrate, a semiconductor chip provided on a top surface of the first redistribution substrate, a conductive structure provided on the top surface of the first redistribution substrate and spaced apart from the semiconductor chip, a molding layer provided on the first redistribution substrate and covering a side surface of the semiconductor chip and a side surface of the conductive structure, and a second redistribution substrate on the molding layer and the conductive structure. the conductive structure includes a first conductive structure provided on the first redistribution substrate, and a second conductive structure provided on a top surface of the first conductive structure. the second redistribution substrate includes an insulating layer. at least a portion of a top surface of the second conductive structure directly contacts the insulating layer of the second redistribution substrate.
Inventor(s): Yejin Park of Suwon-si (KR) for samsung electronics co., ltd., Seungyoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongseon Ahn of Suwon-si (KR) for samsung electronics co., ltd., Heesuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang Sim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H10B43/10, H10B43/27, H10B43/35, H10B41/10, H10B41/27, H10B41/35, H10B80/00, H01L25/065
Abstract: a semiconductor device includes a substrate; a conductive layer; and a contact plug connected to the conductive layer. the contact plug includes a first portion; and a second portion, sequentially stacked, wherein a width of an upper surface of the first portion is wider than a width of a lower surface of the second portion. the contact plug includes a barrier layer; a first conductive layer on the barrier layer; and a second conductive layer on the first conductive layer. the second conductive layer comprises voids. the barrier layer, the first conductive layer, and the second conductive layer extend continuously in the first and second portions. the barrier layer has a first thickness, the second conductive layer has a second thickness, equal to or greater than the first thickness, and the first conductive layer has a third thickness, equal to or greater than the second thickness.
Inventor(s): Ahreum LEE of Suwon-si (KR) for samsung electronics co., ltd., Woosung YANG of Suwon-si (KR) for samsung electronics co., ltd., Jimo GU of Suwon-si (KR) for samsung electronics co., ltd., Jaeho KIM of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, G11C16/04, H01L23/522, H10B41/10, H10B41/35, H10B41/27, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B43/40, H10B80/00, H01L25/065
Abstract: a semiconductor device includes a substrate including a memory cell region and a connection region. a memory stack includes a plurality of word lines extending in the memory cell region and the connection region in a horizontal direction that is parallel with an upper surface of the substrate. the plurality of word lines overlaps with each other in a vertical direction. a support is in the connection region and positioned at a side of the memory stack. the support includes a plurality of steps. a plurality of pad parts is on a top surface of the support. a plurality of contact plugs passes through at least some of the plurality of word lines in the vertical direction. the plurality of contact plugs directly contacts the plurality of pad parts for electrical connection therewith.
Inventor(s): Joungeun YOO of Seongnam-si (KR) for samsung electronics co., ltd., Youngjae KANG of Suwon-si (KR) for samsung electronics co., ltd., Duseop YOON of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/532, C22C29/14
Abstract: provided are a wiring material for a semiconductor device, the wiring material including a boride-based compound containing boron and at least one metal selected from elements of groups 2 to 14, a wiring for a semiconductor device including the same, and a semiconductor device including the wiring containing the wiring material.
Inventor(s): Jimin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Joongwon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sungyun WOO of Suwon-si (KR) for samsung electronics co., ltd., Yeonjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Sehyun HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L25/065, H01L25/18, H10B80/00
Abstract: a semiconductor device may include a plurality of chip regions on a substrate, at least one scribe lane surrounding each of the plurality of chip regions on the substrate, a plurality of first align key patterns and a plurality of first test element group patterns included in the plurality of chip regions, and a plurality of second align key patterns and a plurality of second test element group patterns included in the at least one scribe lane.
Inventor(s): Wonkyun KWON of Osan-si (KR) for samsung electronics co., ltd., Chulyong Jang of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/768, H01L23/48, H01L25/065, H01L25/00
Abstract: a semiconductor chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface. an active layer is disposed in a portion of the semiconductor substrate adjacent to the first surface. a through electrode extends in the semiconductor substrate in a vertical direction. the through electrode has a lower surface connected to the active layer and an upper surface positioned at a level lower than a level of the second surface of the semiconductor substrate. a passivation layer is disposed on the second surface of the semiconductor substrate. a bonding pad is arranged on a portion of the passivation layer and the upper surface of the through electrode. the bonding pad has a cross-section with a “t” shape in the vertical direction. the bonding pad is connected to the through electrode.
Inventor(s): KUNSANG PARK of Suwon-si (KR) for samsung electronics co., ltd., HO-JIN LEE of Suwon-si (KR) for samsung electronics co., ltd., SEOKHO KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
Abstract: a semiconductor device may include a lower structure including a first substrate, a first pad on the first substrate, and a first insulating layer enclosing the first pad, and an upper structure including a second substrate, a second pad on the second substrate, and a second insulating layer enclosing the second pad. each of the first and second pads may include a first portion and a second portion on the first portion. the second portion may include the same metallic material as the first portion. the second portion of the first pad may be in contact with the second portion of the second pad, and the first insulating layer may be in contact with the second insulating layer.
20240038717.APPARATUS FOR BONDING WIRE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daewoong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, B23K20/00
Abstract: a wire bonding apparatus includes a bonding stage, a capillary, a clamp provided with the capillary rotatably installed thereon, and a bonding arm. the clamp includes a housing having an internal space, a first member fixedly installed at an upper end of the internal space of the housing and provided with a first gear unit on a lower surface thereof, a second member fixedly installed at a lower end of the internal space of the housing to be spaced apart from the first member, and provided with a second gear unit on an upper surface thereof, a third member, the third member being provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit, . the capillary is fixedly installed on the third member and rotates in conjunction with the third member.
20240038725.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Keumhee Ma of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H10B80/00
Abstract: a semiconductor package includes a first semiconductor chip including a first semiconductor substrate, and a first upper pad arranged on an upper surface of the first semiconductor substrate, a first polymer layer arranged on the upper surface of the first semiconductor substrate, a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip including a second semiconductor substrate and a second lower pad arranged under a lower surface of the second semiconductor substrate, wherein the first polymer layer has a horizontal width in a direction crossing the first polymer layer in a center region of the second semiconductor chip, as a first length, and has a horizontal width in a direction crossing two corner regions of the first polymer layer in corner regions of the second semiconductor chip, as a second length, wherein the second length is greater than the first length.
Inventor(s): Kil Soo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H10B80/00, H01L25/00, H01L21/56
Abstract: a semiconductor package and method of fabricating the same are provided. the semiconductor package includes a first semiconductor chip including first and second surfaces opposite to each other; connection terminals on the first surface of the first semiconductor chip; a first dielectric layer on the second surface of the first semiconductor chip; a second semiconductor chip on the first dielectric layer and including a third surface opposite to the second surface and a fourth surface opposite to the third surface; a second dielectric layer on the third surface of the second semiconductor chip and in contact with the first dielectric layer; a third semiconductor chip on the fourth surface of the second semiconductor chip; and a first adhesive layer between the second semiconductor chip and the third semiconductor chip, the first dielectric layer and the second dielectric layer including no wirings.
20240038728.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Aenee Jang of Suwon-si (KR) for samsung electronics co., ltd., Wonil Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H10B80/00, H01L23/31, H01L23/544, H01L23/00
Abstract: a semiconductor package includes a first semiconductor chip, a plurality of second semiconductor chips stacked on the first semiconductor chip, and having widths narrower than a width of the first semiconductor chip, and a molded layer on an upper surface of the first semiconductor chip. the first semiconductor chip includes first front-surface pads, a first back-surface insulating layer divided into a first region and a second region, first back-surface pads in the first region, dummy pads in the second region, the dummy pads respectively having an upper surface on which a metal oxide film is disposed, and a first through-electrode electrically connecting the first front-surface pads and the first back-surface pads to each other. the plurality of second semiconductor chips respectively includes second front-surface pads, second back-surface pads, and a second through-electrode electrically connecting the second front-surface pads and the second back-surface pads to each other.
Inventor(s): Eunsuk Jung of Hwaseong-si (KR) for samsung electronics co., ltd., Hyoukyung Cho of Seoul (KR) for samsung electronics co., ltd., Jinnam Kim of Anyang-si (KR) for samsung electronics co., ltd., Hyungjun Jeon of Seoul (KR) for samsung electronics co., ltd., Kwangjin Moon of Hwaseong-si (KR) for samsung electronics co., ltd., Hoonjoo Na of Seoul (KR) for samsung electronics co., ltd., Hakseung Lee of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/31, H01L23/00
Abstract: a semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. a backside of a third substrate of the third semiconductor chip may be arranged to face a backside surface of a second substrate of the second semiconductor chip such that the third substrate and a second backside insulation layer provided on the backside surface of the second substrate are bonded directly to each other, or the backside of the third substrate may be arranged to face a front surface of the second substrate such that the third substrate and a second front insulation layer provided on the front surface of the second substrate are bonded directly to each other.
20240038739.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongwon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H10B80/00, H01L23/31, H01L23/498, H01L23/00
Abstract: a semiconductor package includes a first redistribution structure having a first redistribution layer; a first semiconductor chip on the first redistribution structure, and having first lower pads, first upper pads, and first through-electrodes; a second semiconductor chip on the first semiconductor chip, and having second lower pads, second upper pads, and second through-electrodes; a vertical connection conductor on the first redistribution structure, and connected to the first redistribution layer; a molded portion on the first redistribution structure, and surrounding the first second semiconductor chips; a second redistribution structure on the second semiconductor chip and the vertical connection conductor, the second redistribution structure having a second redistribution layer connected to the second upper pads and the vertical connection conductor; and a third semiconductor chip on the second redistribution structure, and having contact pads connected to the second redistribution layer.
20240038740.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyundong Lee of Suwon-si (KR) for samsung electronics co., ltd., Youngmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonseok Oh of Suwon-si (KR) for samsung electronics co., ltd., Sangyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Changbo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/498, H01L23/31, H01L23/00
Abstract: a semiconductor package includes a first wiring structure including a plurality of first redistribution patterns having a plurality of first bottom connection pads and a plurality of first top connection pads and a plurality of first redistribution insulating layers surrounding the plurality of first redistribution patterns, a second wiring structure including a plurality of second redistribution patterns having a plurality of second bottom connection pads and a plurality of second top connection pads and a plurality of second redistribution insulating layers surrounding the plurality of second redistribution patterns, a semiconductor chip interposed between the first wiring structure and the second wiring structure, an encapsulant filling a space between the first wiring structure and the second wiring structure, and a plurality of connection structures passing through the encapsulant and connecting the plurality of first top connection pads to the plurality of second bottom connection pads and arranged around the semiconductor chip.
20240038763.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Keun Hwi CHO of Seoul (KR) for samsung electronics co., ltd., Sangdeok KWON of Seoul (KR) for samsung electronics co., ltd., Dae Sin KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwon KIM of Seongnam-si (KR) for samsung electronics co., ltd., Yonghee PARK of Hwaseong-si (KR) for samsung electronics co., ltd., Hagju CHO of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/118, H01L21/8238, H01L27/02, H01L27/092
Abstract: a semiconductor device includes first and second active patterns respectively on the first and second active regions of a substrate, a gate electrode on the first and second channel patterns, active contacts electrically connected to at least one of the first and second source/drain patterns, a gate contact electrically connected to the gate electrode, a first metal layer on the active and gate contacts and including a first and second power line, and first and second gate cutting patterns below the first and second power lines. the first active pattern may include first channel pattern between a pair of first source/drain patterns. the second active pattern may include a second channel pattern between a pair of second source/drain patterns. the first and second gate cutting patterns may cover the outermost side surfaces of the first and second channel patterns, respectively.
20240038792.STACKED IMAGE SENSORS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongseok Cho of Suwon-si (KR) for samsung electronics co., ltd., Jongeun Park of Suwon-si (KR) for samsung electronics co., ltd., Jeongsoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Gyunha Park of Suwon-si (KR) for samsung electronics co., ltd., Gwideok Ryan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/79, H04N25/77, H04N25/78
Abstract: the stacked image sensor includes a first semiconductor substrate and including a photoelectric conversion region and a floating diffusion area, a first insulating layer under the first semiconductor substrate and including a gate of a transfer transistor, a second semiconductor substrate under the first insulating layer and including first impurities of a first conductivity type, and a second insulating layer under the second semiconductor substrate and including a metal pad of a floating diffusion node and a gate of a source follower transistor, wherein the floating diffusion area and the metal pad of the floating diffusion node are electrically connected through a deep contact that is in the first insulating layer and the second semiconductor substrate. the second semiconductor substrate further includes a well region. at least a portion of deep contact may be in the well region. the well region may surround the deep contact.
Inventor(s): Hyunpil Noh of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor may include; a semiconductor substrate including a first surface and a second surface, and further including a photoelectric conversion region, a buried gate structure disposed in a buried gate trench extending into the semiconductor substrate from the first surface of the semiconductor substrate, a floating diffusion region disposed on one side of the buried gate structure in the semiconductor substrate, a contact pad disposed on the first surface of the semiconductor substrate above the floating diffusion region and including polysilicon, an intermediate layer disposed on the contact pad and including a metal silicide, and a contact disposed on the intermediate layer and extending in a vertical direction perpendicular to the first surface of the semiconductor substrate.
Inventor(s): Sang-Uk KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H01L23/00
Abstract: a semiconductor package includes: a package substrate; a semiconductor chip disposed on the package substrate; a transparent substrate disposed on the semiconductor chip; and an adhesive layer that is disposed between the semiconductor chip and the transparent substrate. the adhesive layer is configured to block light. the transparent substrate includes: a first lower side that faces the semiconductor chip, a second lower side that faces the semiconductor chip and that is disposed above the first lower side, and a first inner side wall that connects the first lower side and the second lower side, and the adhesive layer is in contact with the second lower side and the first inner side wall.
Inventor(s): Hojun Chang of Suwon-si (KR) for samsung electronics co., ltd., Hyochul Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyuk Moon of Suwon-si (KR) for samsung electronics co., ltd., Youngho Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: disclosed is a color filter according to an example embodiment, an image sensor, and an electronic apparatus having the image sensor. the color filter includes a first dielectric layer, a second dielectric layer on the first dielectric layer, and a plurality of metal elements buried in both of the first dielectric layer and the second dielectric layer in lateral contact with each of the first dielectric layer and the second dielectric layer.
20240038809.IMAGE SENSORS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ja Meyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sung In Kim of Suwon-si (KR) for samsung electronics co., ltd., Yeon Soo Ahn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor includes a substrate including a first face and a second face, the second face being opposite the first face in a first direction; a photoelectric conversion area disposed in the substrate; an active area disposed in the substrate and on the photoelectric conversion area; an element isolation pattern extending from the first face of the substrate into the substrate and defining the active area; and a transfer gate electrode including: a first portion extending from the first face of the substrate and extending through the element isolation pattern; and a second portion disposed on the active area, wherein the first portion extends through a bottom face of the element isolation pattern, wherein a vertical level of a bottom face of the first portion is lower than a vertical level of the bottom face of the element isolation pattern.
20240038820.LIGHT-EMITTING DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Joosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongchul SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/15, H01L33/08, H01L33/06, H01L33/32
Abstract: a light-emitting device includes a base semiconductor layer, a three-dimensional (3d) light-emitting structure, and a flat light-emitting structure formed in a flat shape, wherein the flat light-emitting structure generates light having a different wavelength than that of the 3d light-emitting structure. a strain-relieving layer relieving lattice mismatch between the base semiconductor layer and the flat light-emitting structure may be arranged on the base semiconductor layer in an area in which at least the flat light-emitting structure is formed.
Inventor(s): Junhee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Kiho KONG of Suwon-si (KR) for samsung electronics co., ltd., Joosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Younghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinjoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongchul SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/15
Abstract: a light emitting structure includes: a substrate; a first epitaxial structure disposed on the substrate; a second epitaxial structure disposed on the first epitaxial structure; and a third epitaxial structure disposed on the second epitaxial structure. each of the first epitaxial structure, the second epitaxial structure, and the third epitaxial structure comprises, in a sequentially stacked structure, a first semiconductor layer of a first conductivity, a carrier blocking layer, an active layer, and a second semiconductor layer of a second conductivity.
Inventor(s): Jiye BAEK of Suwon-si (KR) for samsung electronics co., ltd., Yi Rang Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/3213, H01L21/285
Abstract: a method for fabricating a semiconductor device includes sequentially stacking a sacrificial layer and a support layer on a substrate, forming bottom electrodes penetrating the sacrificial layer and the support layer to come into contact with the substrate, patterning the support layer to form a support pattern that connects the bottom electrodes to each other, removing the sacrificial layer to expose surfaces of the bottom electrodes, depositing a conductive layer on the exposed surfaces of the bottom electrodes and a surface of the support pattern, and etching the conductive layer. the etching the conductive layer includes selectively removing the conductive layer on the support pattern to expose the surface of the support pattern. the depositing the conductive layer and the etching the conductive layer are alternately performed in a same chamber.
20240038830.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jong-Min LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: the semiconductor device is provided. the semiconductor device comprises a substrate; a plurality of lower electrodes on the substrate and arranged in a honeycomb structure; and a supporter connecting the plurality of lower electrodes to each other, wherein the supporter has a plurality of supporter holes defined therein, wherein each of the plurality of supporter holes exposes at least a portion of each of the plurality of lower electrodes, wherein the supporter includes: a plurality of first extensions extending in a first direction; and a plurality of second extensions extending in a second direction so as to intersect the plurality of first extensions, wherein each of the plurality of first extensions has first and second sidewalls, wherein each of the plurality of second extensions has third and fourth sidewalls, wherein each of the first to fourth sidewalls includes a convex portion and a concave portion.
20240038840.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong-Gwan SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yong Hee PARK of Suwon-si (KR) for samsung electronics co., ltd., Hong Seon YANG of Suwon-si (KR) for samsung electronics co., ltd., Hye In CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Pan Kwi PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/786, H01L29/775, H01L29/423, H01L27/092
Abstract: a semiconductor device includes an active pattern with a first impurity having a first conductivity, first and second nanosheets on the active pattern, a gate electrode on the active pattern and surrounding each of the first and second nanosheets, a lower source/drain region on the active pattern, an uppermost surface of the lower source/drain region being lower than a lower surface of the second nanosheet, and the lower source/drain region being doped with a second impurity having the first conductivity, an upper source/drain region on the lower source/drain region, the upper source/drain region being doped with a third impurity having a second conductivity different from the first conductivity, and a gate insulation layer between the gate electrode and the lower and upper source/drain regions, the gate insulation layer being in contact with each of the lower and upper source/drain regions.
Inventor(s): Gi Gwan PARK of Suwon-Si (KR) for samsung electronics co., ltd., Jung Gun You of Suwon-Si (KR) for samsung electronics co., ltd., Sun Jung Lee of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/423, H01L29/775, H01L29/417
Abstract: there is provided a semiconductor device capable of capable of improving element performance and reliability. a semiconductor device includes a lower conductive pattern disposed on a substrate, an upper conductive pattern disposed on the lower conductive pattern, and a first plug pattern disposed between the lower conductive pattern and the upper conductive pattern and connected to the lower conductive pattern and the upper conductive pattern. the first plug pattern includes a first barrier pattern that defines a first plug recess and a first plug metal pattern that fills the first plug recess, and the first plug metal pattern includes a first molybdenum pattern and a first tungsten pattern disposed on the first molybdenum pattern.
20240038842.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungbin CHUN of Suwon-si (KR) for samsung electronics co., ltd., Gyeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Dahye KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/423, H01L29/775, H01L29/66
Abstract: an integrated circuit (ic) device includes a fin-type active region on a substrate, a pair of nanosheets on the fin-type active region, a gate line surrounding the pair of nanosheets, the gate line including a sub-gate portion between the pair of nanosheets, a source/drain region contacting the pair of nanosheets, and a gate dielectric film between the gate line and the pair of nanosheets and between the gate line and the source/drain region, wherein the source/drain region includes a first blocking layer between the pair of nanosheets, the first blocking layer including an edge barrier enhancing portion facing the sub-gate portion, and a second blocking layer, wherein the first blocking layer includes a portion that intermittently extends in the vertical direction.
20240038843.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Soojin JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sunwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Junbeom PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungmin SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L27/088, H01L29/16, H01L29/78
Abstract: a semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction parallel to an upper surface of the substrate, a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction, channels spaced apart from each other in a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure, a source/drain layer on a portion of the active pattern adjacent the gate structure, the source/drain layer contacting the channels, and a sacrificial pattern on an upper surface of each of opposite edges of the portion of the active pattern in the second direction, the sacrificial pattern contacting a lower portion of a sidewall of the source/drain layer and including silicon-germanium.
[[20240038845.LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL CHANNEL LAYER, METHODS OF MANUFACTURING THE SAME, ELECTRONIC DEVICES INCLUDING 2D CHANNEL LAYER, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Minseok YOO of Suwon-si (KR) for samsung electronics co., ltd., Minsu SEOL of Suwon-si (KR) for samsung electronics co., ltd., Junyoung KWON of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Eun BYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/10, H01L29/778, H01L29/78, H01L29/66, H01L29/417
Abstract: a layer structure including a two-dimensional (2d) channel layer, a method of manufacturing a two-dimensional (2d) channel layer, an electronic device including the layer structure, and an electronic apparatus including the layer structure are disclosed. the layer structure may include a first substrate, a second substrate surrounded by the first substrate, and a 2d channel layer on the second substrate. an interfacial energy of the second substrate may be less than an interfacial energy of the first substrate. the method of manufacturing a 2d channel layer may include forming a second substrate to be surrounded by a first substrate, forming a precursor layer for forming a 2d channel on any one of the first and second substrates, and transforming the precursor layer into a liquid precursor layer. the interfacial energy of the second substrate may be less than the interfacial energy of the first substrate.
Inventor(s): Ho Kyun An of Seoul (KR) for samsung electronics co., ltd., Su Min Cho of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L27/092, H01L29/161, H01L29/40, H01L21/02, H10B12/00
Abstract: a semiconductor device includes a substrate including a first region and a second region, a first silicon-germanium film which is conformally formed inside a surface of the substrate of the first region and defines a first gate trench, a first gate insulating film which extends on the first silicon-germanium film along a profile of the first gate trench and is in physical contact with the first silicon-germanium film, a first metallic gate electrode on the first gate insulating film, a source/drain region formed inside the substrate on both sides of the first metallic gate electrode, a second gate insulating film in the second region and a second metallic gate electrode on the second gate insulating film.
Inventor(s): Bongseok Suh of Seoul (KR) for samsung electronics co., ltd., Daewon Kim of Hwaseong-si (KR) for samsung electronics co., ltd., Beomjin Park of Hwaseong-si (KR) for samsung electronics co., ltd., Sukhyung Park of Seoul (KR) for samsung electronics co., ltd., Sungil Park of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon Shin of Suwon-si (KR) for samsung electronics co., ltd., Bongseob Yang of Suwon-si (KR) for samsung electronics co., ltd., Junggun You of Ansan-si (KR) for samsung electronics co., ltd., Jaeyun Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L29/10, H01L29/423, H01L29/786
Abstract: a semiconductor device includes a first active region defined on a substrate, a first gate electrode across the first active region, a first drain region in the first active region at a position adjacent to the first gate electrode, an undercut region between the first active region and the first gate electrode, and a first gate spacer on a side surface of the first gate electrode and extending into the undercut region.
Inventor(s): Jinseong HEO of Suwon-si (KR) for samsung electronics co., ltd., Sangwook KIM of Seongnam-si (KR) for samsung electronics co., ltd., Yunseong LEE of Osan-si (KR) for samsung electronics co., ltd., Sanghyun JO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L21/28, G11C11/22, H01L29/66
Abstract: a domain switching device includes a channel region, a source region and a drain region connected to the channel region, a gate electrode isolated from contact with the channel region, an anti-ferroelectric layer between the channel region and the gate electrode, a conductive layer between the gate electrode and the anti-ferroelectric layer to contact the anti-ferroelectric layer, and a barrier layer between the anti-ferroelectric layer and the channel region.
Inventor(s): Jinseong HEO of Seoul (KR) for samsung electronics co., ltd., Sangwook KIM of Seongnam-si (KR) for samsung electronics co., ltd., Yunseong LEE of Osan-si (KR) for samsung electronics co., ltd., Sanghyun JO of Seoul (KR) for samsung electronics co., ltd., Hyangsook LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L29/40, H01L29/51
Abstract: provided are an electronic device and a method of manufacturing the same. the electronic device includes a ferroelectric crystallization layer between a substrate and a gate electrode and a crystallization prevention layer between the substrate and the ferroelectric crystallization layer. the ferroelectric crystallization layer is at least partially crystallized and includes a dielectric material having ferroelectricity or anti-ferroelectricity. also, the crystallization prevention layer prevents crystallization in the ferroelectric crystallization layer from being spread toward the substrate.
Inventor(s): Minsu SEOL of Seoul (KR) for samsung electronics co., ltd., Hyeonjin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Minseok YOO of Suwon-si (KR) for samsung electronics co., ltd., Minhyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L29/41, H01L29/417, H01L29/24, H01L29/66, H01L29/45, H01L29/06, H01L21/02, H01L21/8234, H01L29/16
Abstract: provided are two-dimensional material (2d)-based wiring conductive layer contact structures, electronic devices including the same, and methods of manufacturing the electronic devices. a 2d material-based field effect transistor includes a substrate; first to third 2d material layers on the substrate; an insulating layer on the first 2d material layer; a source electrode on the second 2d material layer; a drain electrode on the third 2d material layer; and a gate electrode on the insulating layer. the first 2d material layer is configured to exhibit semiconductor characteristics, and the second and third 2d material layers are metallic 2d material layers. the first 2d material layer may include a first channel layer of a 2d material and a second channel layer of a 2d material. the first 2d material layer may partially overlap the second and third 2d material layers.
Inventor(s): Jusik Kim of Hwaseong-si (KR) for samsung electronics co., ltd., Sewon Kim of Suwon-si (KR) for samsung electronics co., ltd., Victor ROEV of Hwaseong-si (KR) for samsung electronics co., ltd., Myungjin Lee of Seoul (KR) for samsung electronics co., ltd., Saebom Ryu of Suwon-si (KR) for samsung electronics co., ltd., Dongmin Im of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01M4/133, H01M4/134, H01M4/36, H01M4/38, H01M4/587, H01M10/052, H01M10/0562
Abstract: an all-solid secondary battery including: a cathode layer including a cathode active material layer; an anode layer; and a solid electrolyte layer including a solid electrolyte, wherein the solid electrolyte layer is disposed between the cathode layer and the anode layer, wherein the anode layer includes an anode current collector, a first anode active material layer in contact with the solid electrolyte layer, and a second anode active material layer disposed between the anode current collector and the first anode active material layer, wherein the first anode active material layer includes a first carbonaceous anode active material, and the second anode active material layer.
Inventor(s): Wonbin HONG of Pohang-si (KR) for samsung electronics co., ltd., Sumin YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JO of Suwon-si (KR) for samsung electronics co., ltd., Dongkwon CHOI of Pohang-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q3/26, H01Q21/06
Abstract: an example electronic device may include a memory; a processor; a communication circuit; an input/output expander (i/o expander); and an array antenna. the processor may control to store an input/output table in the memory and to radiate an rf signal through the array antenna based on the input/output table.
Inventor(s): Chanju PARK of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk WI of Suwon-si (KR) for samsung electronics co., ltd., Dongjin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Taeksun KWON of Suwon-si (KR) for samsung electronics co., ltd., Jungwoo SEO of Suwon-si (KR) for samsung electronics co., ltd., Junhwa OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q9/04, H01Q1/52, H01Q1/22
Abstract: the disclosure relates to a fifth generation (g) or a sixth generation (g) communication system for supporting a higher data transfer rate. a dual polarization patch antenna structure and an electronic device including same are provided.
Inventor(s): Jiantong Li of McKinney TX (US) for samsung electronics co., ltd., Alireza Foroozesh of Los Angeles CA (US) for samsung electronics co., ltd., Navneet Sharma of Allen TX (US) for samsung electronics co., ltd., Won Suk Choi of McKinney TX (US) for samsung electronics co., ltd., Gang Xu of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H01Q13/20, H01Q21/08
Abstract: an apparatus includes a substrate, first and second transmission lines on the substrate, first antenna elements coupled to a first-first transmission line, and second antenna elements coupled to a first-second transmission line. a first distance between the adjacent first-first and first-second transmission lines is different than a second distance between the first-first transmission line and a second-second transmission line, the second-second transmission line adjacent to the first-first transmission line on an opposite side from the first-second transmission line. at least two antenna elements in the first antenna elements are differently sized.
Inventor(s): Sumin YUN of Suwon-si (KR) for samsung electronics co., ltd., Hosaeng KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Woomin JANG of Suwon-si (KR) for samsung electronics co., ltd., Jehun JONG of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JO of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/06, H01Q1/22
Abstract: an antenna structure is provided. the antenna structure includes a pcb including a first surface and a second surface facing in an opposite direction to the first surface, a conductive patch disposed on the first surface or inside the pcb so as to be adjacent to the first surface rather than the second surface, a first via passing through at least a section of the pcb and connected to the conductive patch and a second via spaced apart from the first via and connected to the conductive patch, a radio frequency integrated circuit (rfic) disposed on the second surface, and a phase shifter disposed on the second surface or the conductive patch and electrically connected to the rfic, or disposed inside the rfic, wherein the conductive patch may be connected to the rfic through the first and may be connected to the phase shifter through the second via.
Inventor(s): Keonwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongil KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M7/06, H02M7/539, H02J50/10, H02J50/40
Abstract: an electronic device includes a rectifier circuit including: a first reception coil; a second reception coil; a first diode connected in a forward direction from a first end of the first reception coil and to a second end of the first reception coil; a second diode connected in a forward direction from a first end of the second reception coil and to a second end of the second reception coil; and a first capacitor, wherein an input end of the first diode is connected to an output end of the second diode through the first capacitor.
Inventor(s): Xinguang Xu of Allen TX (US) for samsung electronics co., ltd., Gang Xu of Allen TX (US) for samsung electronics co., ltd., Won Suk Choi of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F3/21
Abstract: methods and apparatuses for facilitating wide bandwidth power amplification with high efficiency for analog rf signals. a passive load modulated balanced amplifier (lmba) device comprises a balanced power amplifier (bpa) and a directional coupler. the bpa comprises a first power amplifier (pa) configured to amplify a first portion of an input power, a second pa configured to amplify a second portion of the input power, an isolation port, and an output port that outputs the amplified first and second portions of the input power as an output power. the directional coupler is configured to provide a portion of the output power from the output port to the isolation port to modulate a load impedance of the first and second pas.
Inventor(s): Yongjun AN of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd., Jaejin YANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F3/24, H03F3/72, H03F3/195
Abstract: an electronic device includes: at least one antenna; and a power amplifier electrically connected to the at least one antenna. the power amplifier includes: a first amplification circuit; a first transformer; a first switch; a second amplification circuit; a second transformer; a second switch; the power combiner; and the third switch configured to electrically connect at least one of the first switch, the second switch, or an output port of the power combiner with the at least one antenna.
Inventor(s): Youngmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Woojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/401, H04W52/02
Abstract: disclosed is an electronic device including a plurality of antennas, a plurality of radio frequency circuits, a first transceiver, a second transceiver, a switching circuit configured to connect the plurality of radio frequency circuits to the first transceiver or the second transceiver, a processor, and a memory. the electronic device may be configured to switch a receiving path by connecting at least one of a plurality of receiving paths to another transceiver based on reception performance of the plurality of receiving paths.
Inventor(s): Hoda SHAHMOHAMMADIAN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/024, H04W72/23
Abstract: a system and a method are disclosed for communicating with multiple transmission and reception points (multi-trps). according to an embodiment, the method includes receiving transmission configuration indicator (tci) state information specifying an indicated tci state set including one or more activated tci states; receiving an indication of association between the indicated tci state set and one or more trps; and identifying, based on the indication of association, one or more trps of the multi-trps to apply a configuration of the indicated tci state set.
Inventor(s): Euichang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Suha YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method by a terminal in a wireless communication system is provided. the method includes obtaining information about at least one reference signal for beam failure detection; determining whether a beam failure is detected with respect to the at least one reference signal including a first reference signal set, a second reference signal set and a third reference signal set; and in a case that the beam failure is detected with respect to at least one of the first, second, or third reference signal set, transmitting beam failure recovery request information for the at least one reference signal. the first and second reference signal sets correspond to first and second coreset pools, respectively, and the third reference signal set corresponds to a cell associated with the first and second coreset pools.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L1/00, H04L5/00, H04L5/14, H04W72/0446, H04W72/232
Abstract: methods and apparatuses for downlink and uplink transmissions in full-duplex systems. a method for operating a user equipment (ue) for receiving a physical downlink shared channel (pdsch) includes receiving: first information for a first modulation and coding scheme (mcs) table associated with a first frequency-domain subband in a reception bandwidth on a cell, second information for a second mcs table associated with a second frequency-domain subband in the reception bandwidth, and third information for a condition. at least one of the first and second frequency-domain subbands is one of a subband full-duplex (sbfd) downlink (dl) subband, an sbfd flexible subband, or an sbfd uplink (ul) subband. the method further includes determining whether the condition is valid for reception in a slot or symbol and receiving the pdsch in the slot or symbol based on the first mcs table when valid and the second mcs table when not valid.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd., Hoda SHAHMOHAMMADIAN of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/23
Abstract: a system and a method are disclosed for network energy saving. in one embodiment the method includes: receiving, by a user equipment (ue), a channel state information reference signal (csi-rs) transmitted through a first plurality of antenna ports; generating, by the ue, a first channel property indicator for a first subset of the first plurality of antenna ports, based on the csi-rs; and generating, by the ue, a second channel property indicator for a second subset of the first plurality of antenna ports, based on the csi-rs, wherein the second subset is different from the first subset.
Inventor(s): Mohamed Mokhtar Gaber Moursi AWADIN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L5/14
Abstract: a system and a method are disclosed for subband full-duplex. in some embodiments, a method includes: conducting a measurement, by a user equipment (ue), using a csi resource, the csi resource being a channel state information reference signal (csi-rs) or a channel state information interference measurement (csi-im); and performing channel estimation or beam measurement, by the ue, the channel estimation or beam measurement being based on a set of resources of the csi resource, the resources of the set of resources being non-contiguous in a symbol of the csi resource.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0453, H04L1/1607, H04W76/27, H04B7/06, H04W72/23, H04W72/53
Abstract: disclosed are a communication scheme and a system thereof for converging iot technology and a 5g communication system for supporting a high data transmission rate beyond that of a 4g system. the disclosure can be applied to intelligent services (for example, services related to a smart home, smart building, smart city, smart car, connected car, health care, digital education, retail business, security, and safety) based on the 5g communication technology and the iot-related technology. the disclosure discloses a method and an apparatus for efficiently operating a dormant bwp.
Inventor(s): Dongha BAHN of Suwon-si (KR) for samsung electronics co., ltd., Chanjong PARK of Suwon-si (KR) for samsung electronics co., ltd., Junik JANG of Suwon-si (KR) for samsung electronics co., ltd., Jaeil JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/02, H04L25/03
Abstract: an electronic device includes at least one antenna, and a channel estimation and equalization module for processing a reception signal received through the at least one antenna. the channel estimation and equalization module may identify the received signal and a reference signal related to the received signal. the channel estimation and equalization module may also, via deep learning based on the received signal and the reference signal: extract features of the received signal and the reference signal, estimate a channel of the received signal, based on the extracted features, and restore a signal corresponding to the received signal.
Inventor(s): Kisuk KWEON of Suwon-si (KR) for samsung electronics co., ltd., Hyesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L67/148, H04W36/00
Abstract: a method performed by an application function (af) in a wireless communication system is provided. the method includes receiving, from a session management function (smf), a late notification message indicating a change of a data network access identifier (dnai), identifying whether an af change is needed based on the late notification message, and transmitting, to the smf, a response message including information for change to a target af for a target dnai based on a result of identifying that the af change is needed.
Inventor(s): Soonho HWANG of Suwon-si (KR) for samsung electronics co., ltd., Himchan YUN of Suwon-si (KR) for samsung electronics co., ltd., Kookjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hojung NAM of Suwon-si (KR) for samsung electronics co., ltd., Sungkoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Donguk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H01Q1/24
Abstract: a foldable electronic device is provided that includes a hinge module, a first housing coupled to a first side of the hinge module, a first printed circuit board disposed inside the first housing and including a first wireless communication module, a processor, and a first ground or a second ground, and a second housing coupled to a second side of the hinge module, in which the first housing includes a first segmenting portion, a second segmenting portion, a first conductive portion, and a second conductive portion, in which the second housing includes a second wireless communication module, a third segmenting portion, a fourth segmenting portion, a third conductive portion, and a fourth conductive portion, and in which a matching circuit is disposed between the first conductive portion and the first ground, and a first filter circuit is connected to a signal path between the first conductive portion and the matching circuit.
Inventor(s): Garim KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungkwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Hun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
Abstract: an electronic device includes: a housing including an opening and sockets; a tray to be insertable into the sockets or removable from the sockets through the opening; and an actuator to generate power to remove the tray from the sockets. the tray includes: a tray body including a space for inserting an external component into the sockets in a longitudinal direction; a tray head provided at one end of the tray body in the longitudinal direction; and a protrusion provided at another end of the tray body in the longitudinal direction and including an inclined surface provided on one side of the protrusion. when the tray is inserted into the sockets, the actuator presses the inclined surface in a width direction of the tray and removes the tray from the sockets in the longitudinal direction of the tray.
Inventor(s): Jaesung PARK of Suwon-si (KR) for samsung electronics co., ltd., Younghoon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Youngsu MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N5/74, G06T5/00, G06T7/20, G06T7/50, G06V10/60
Abstract: an image output apparatus includes a communication interface comprising a circuit; a first projector; a second projector; a first driver configured to adjust a first projection location of the first projector; a second driver configured to adjust a second projection location of the second projector; and at least one processor configured to: identify context information of an input image received through the communication interface; identify a screen layout from a plurality of screen layouts, based on the context information; control, according to the screen layout, the first driver such that the first projector projects a first image to the first projection location; and control, according to the screen layout, the second driver such that the second projector projects a second image to the second projection location.
Inventor(s): Hyungchul KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31
Abstract: an electronic apparatus includes a sensor including a first sensor configured to detect a distance between the electronic apparatus and a projection plane and a second sensor configured to detect an inclination of the electronic apparatus, a memory, a projecting part, and at least one processor configured to obtain first environment information through the first sensor and the second sensor, control the projecting part to output a projection image to the projection plane based on first setting information corresponding to the first environment information among plurality of setting information stored in the memory, obtain second environment information through the first sensor and the second sensor based on motion of the electronic apparatus being detected through the second sensor, and control the projecting part to output the projection image to the projection plane based on second setting information corresponding to the second environment information.
Inventor(s): Taejun PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangjo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangkwon NA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/2662, H04N19/115, H04N19/117, H04N19/157, H04N19/42, H04N19/82, G06T3/40
Abstract: the disclosure relates to an artificial intelligence (ai) system that uses a machine learning algorithm and an application thereof. a method for controlling an electronic apparatus according to the disclosure includes receiving image data and information associated with a filter set that is applied to an artificial intelligence model for upscaling the image data from an external server; decoding the image data; upscaling the decoded image data using a first artificial intelligence model that is obtained based on the information associated with the filter set; and providing the upscaled image data for output.
Inventor(s): Jae-Sung PARK of Suwon-si (KR) for samsung electronics co., ltd., Byung Seok Min of Suwon-si (KR) for samsung electronics co., ltd., Jong Wook Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/431, G06F3/044, G06F3/14, H04N21/472
Abstract: a display apparatus capable of correcting an image quality change caused by long-term use is provided. the display apparatus includes: a display panel; a communicator configured to communicate with a service apparatus; and a controller configured to control the communicator to transmit operation information including a total operating time of the display apparatus and an operating temperature of the display apparatus, to the service apparatus; receive an image parameter from the service apparatus through the communicator, and based on the received image parameter data; process image data; and transmit the processed image to the display panel. the image parameter may include at least one of a brightness level, a contrast, a sharpness level, and a color density of the display panel.
Inventor(s): Jaesung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Wonjoon DO of Suwon-si (KR) for samsung electronics co., ltd., Woojhon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Valeriy PRUSHINSKIY of Suwon-si (KR) for samsung electronics co., ltd., Kisuk SUNG of Suwon-si (KR) for samsung electronics co., ltd., Kihuk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/57, H04N23/63, H04N23/80
Abstract: a technology for an electronic device to process images is provided. the electronic device identifies status of target pixels included in an area of a display module corresponding to a camera module located underneath the display module when the camera module is operated, obtains display information of the target pixels when the target pixels are on, determines offset information of pixels included in a captured image obtained from the camera module, based on the display information of the target pixels, and corrects the captured image, based on the determined offset information.
Inventor(s): Sungwook YOUN of Suwon-si (KR) for samsung electronics co., ltd., Yanggeun OH of Suwon-si (KR) for samsung electronics co., ltd., Byungjun SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/63, G06T7/70, G06V10/25
Abstract: an electronic device receives a shooting input while displaying a preview image based on at least a portion of images obtained through a camera having a first field-of-view (fov). the electronic device obtains a video of the first fov through the camera, in response to the shooting input. the electronic device identifies a visual object included in the preview image, while obtaining the video. the electronic device displays the preview image, based on a second fov that includes the visual object, and is included in the first fov, in response to an input indicating selection of the visual object. the electronic device obtains meta data indicating reproduction of the video based on the second fov corresponding to the input, among the first fov and the second fov, where the meta data is associated with the video obtained based on the first fov.
Inventor(s): Jaeyeop LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongchan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongmyeong Ban of Suwon-si (KR) for samsung electronics co., ltd., Hyechan Bae of Suwon-si (KR) for samsung electronics co., ltd., Dongnam Byun of Suwon-si (KR) for samsung electronics co., ltd., Seongwo Oh of Suwon-si (KR) for samsung electronics co., ltd., Haedong Yeo of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung Hwang of Jinyoung (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/60, H04N5/262, H04N1/21, H04N23/45, H04N23/62, H04N23/63, H04N23/667, H04N23/951
Abstract: an electronic device and a controlling method of the electronic device are provided. the controlling method of an electronic device according to the disclosure includes the steps of, based on a first user input for or related to acquiring a live view image through a camera including a plurality of lenses different from one another being received, acquiring a plurality of image frames for each of the plurality of lenses and storing the image frames in a first memory, inputting the plurality of image frames for each lens stored in the first memory into a neural network model, by a predetermined time interval, and acquiring score information including composition preference information of each of the input image frames, selecting at least one lens among the plurality of lenses based on the score information, storing image frames acquired through the selected at least one lens in a second memory during the predetermined time interval, and based on a second user input for initiating recording of the live view image being received, storing an image related to the image frames stored in the second memory in a third memory until a time point when a third user input for ending the recording is received.
Inventor(s): Kisuk SUNG of Suwon-si (KR) for samsung electronics co., ltd., Saetek OH of Suwon-si (KR) for samsung electronics co., ltd., Kihuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/60, H04N23/63, H04N23/75, G09G3/20, H04N23/57
Abstract: an electronic device includes: a display; a camera; and a processor is configured to execute the instructions to: based on receiving a request to photograph an image using the camera in a state in which the display is driven, set a priority of the display and the camera; identify a shutter speed included in camera driving information set in the camera and an off-duty time in a duty cycle set in the display; based on the priority of the camera being set higher than the priority of the display and the shutter speed being identified to be longer than the off-duty time, adjust at least one of display driving information of the display or the camera driving information of the camera; and control to photograph an image within an off-duty time that has changed based on the adjusted at least one of the display driving information or the camera driving information.
Inventor(s): Sunmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Minwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaekeun NA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/74, H04N23/72, G09G5/10, H04N23/73, H04N23/57
Abstract: an electronic device including a camera and an operation method of the electronic device are provided. the electronic device includes display circuitry, a camera disposed on a rear surface of the display circuitry, a memory, and at least one processor electrically connected to the display circuitry, the camera, and the memory and being configured to identify camera driving information set for the camera, identify a shutter speed included in the set camera driving information, change set display driving information such that a time of a non-emission interval of the duty cycle of the display circuitry is greater than the shutter speed, and based on the changed display driving information, control a driving of the camera.
Inventor(s): Sookyoung ROH of Suwon-si (KR) for samsung electronics co., ltd., Junho LEE of Suwon-si (KR) for samsung electronics co., ltd., Seokho YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/17, H04N25/704, H04N23/67, H01L27/146, G02B3/00, G02B7/36
Abstract: provided is an image sensor including a pixel array including a plurality of imaging pixels and a plurality of autofocusing pixels, and a lens array including a plurality of micro lenses facing the plurality of imaging pixels, respectively, and one or more super lenses facing the plurality of autofocusing pixels, wherein each imaging pixel of the plurality of imaging pixels includes a first red meta-photodiode configured to selectively absorb light of a red wavelength band, a first green meta-photodiode configured to selectively absorb light of a green wavelength band, and a first blue meta-photodiode configured to selectively absorb light of a blue wavelength band.
Inventor(s): Eun Sub SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/531, H04N25/533, H04N25/77
Abstract: disclosed is an image sensor including a plurality of first pixels arranged in a first row and configured to generate first charges in response to a first exposure and a plurality of second pixels arranged in a second row different from the first row and configured to generate second charges in response to a second exposure. at least one pixel of the plurality of first pixels includes a photo diode, a first floating diffusion, a first transfer transistor, a gate electrode of the first transfer transistor partially overlapping the first floating diffusion area when viewed in a horizontal direction, a second floating diffusion area spaced apart from the first floating diffusion area, one end of the second floating diffusion area being connected to a gate of a drive transistor, and a second transfer transistor that electrically connects the first floating diffusion area to the second floating diffusion area.
Inventor(s): Sanggwon LEE of SUWON-SI (KR) for samsung electronics co., ltd., Hyunyong JUNG of SUWON-SI (KR) for samsung electronics co., ltd., Myunglae CHU of SUWON-SI (KR) for samsung electronics co., ltd., Minwoong SEO of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/77, H04N25/78
Abstract: an image sensor includes a first pixel outputting a first pixel signal, a second pixel outputting a second pixel signal, a ramp signal generator, and a comparator. the first pixel includes first transfer transistor, a first floating diffusion node, and a first gain control transistor. the second pixel includes a second transfer transistor and a second floating diffusion node. the comparator compares the first and second pixel signals. the first pixel operates in an hcg mode to output the first pixel signal as a first hcg pixel signal in a first period and operates in an lcg mode to output the second pixel signal as a first lcg pixel signal in a second period. a reset level of the second floating diffusion node of the second pixel is provided to the comparator through the column line in an interim reset period between the first period and the second period.
Inventor(s): Seongkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Kiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Byounghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Joonrae CHO of Suwon-si (KR) for samsung electronics co., ltd., Youngbae PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/02, H04R1/28, G10K11/162, H04R31/00
Abstract: according to one or more embodiments of the present disclosure, an electronic device may comprise: a housing; a resonance space which is disposed in the housing and in which a sound-absorbing material is accommodated; and a speaker module which is disposed in the housing and includes an acoustic filter opposite to at least a part of the resonance space, wherein the acoustic filter comprises a first plate including a first through-pattern and a second plate including a second through-pattern opposite to a part of the first through-pattern.
Inventor(s): Myeungseon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongkwan Yang of Suwon-si (KR) for samsung electronics co., ltd., Kiwon Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonrae Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/02
Abstract: an electronic device includes: a first housing that is at least a part of an exterior of the electronic device; and a speaker module located in the first housing. the speaker module includes: a first plate includes a first magnetic material; a first magnet disposed on one surface of the first plate; a center pole connected to the first plate and surrounded by the first magnet; a coil structure includes a coil inserted into a gap between the first magnet and the center pole; a diaphragm connected to the coil structure; a second housing includes an opening corresponding to the diaphragm. the first magnet includes: a first surface coupled to the first plate; and a second surface positioned opposite to the first surface, and wherein the second housing is coupled to a first portion of the second surface.
Inventor(s): Hongjin CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Duckey LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/0431, H04W76/10, H04W48/08, H04L9/14, H04L9/30, H04W12/106
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. methods and devices in a wireless communication system are provided. system information is received from a base station. the system information includes information related to a public key of a base station. it is determined whether the public key corresponding to the information related to the public key is stored in the terminal. in case that the public key is stored in the terminal and the system information includes signature information of the base station, a signature of the base station is verified. the base station is connected to or another base station is searched for, based on whether the signature of the base station is verified.
Inventor(s): Hongjin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Duckey LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/06, H04W60/00
Abstract: the disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system for supporting a higher data transmission rate. the disclosure provides a base station authentication method which includes receiving system information from a base station, determining whether the system information includes signature information, in case that the signature information is not included, storing information of whether the signature information is included, obtaining information regarding signing capability for the system information of the base station, and determining whether to continue an attach procedure with the base station, based on at least one of the information of whether the signature information is included and the signing capability for the system information of the base station.
Inventor(s): Seunghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeondeok JANG of Suwon-si (KR) for samsung electronics co., ltd., Suhwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd., Changsung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W24/02
Abstract: the present disclosure relates to a 5g or a 6g communication system for supporting higher data rates beyond a 4g communication system such as lte. the present disclosure provides a method for an ai-based csi report in a 5g or 6g communication system. the method performed by a base station in a wireless communication system include receiving capability information indicating whether the ue supports generation of ai-based csi, receiving information on a change in inference time related to the ai-based csi generation and information on a change in a channel state, based on the capability information, identifying information on a csi report timing, based on the information on the change in the inference time and the change in the channel state, transmitting rrc configuration information including the csi report timing, transmitting a csi-rs, and receiving the csi report based on the csi-rs and the information on the csi report timing.
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04W72/232, H04W72/1273
Abstract: downlink control information (dci) size determination for multi-cell scheduling. a method includes receiving first information for a set of cells, identifying first combinations of cells from the set of cells, and determining a first maximum size among first sizes of a first dci format. the first dci format schedules physical downlink shared channel (pdsch) receptions on a first combination of cells from the first combinations of cells, and the first sizes correspond to the first combinations of cells. the method further includes receiving the first dci format based on the first maximum size.
Inventor(s): Fanhua KONG of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W36/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a first target donor node in a wireless communication system, the method comprising: transmitting, to a source donor node, a first handover request message, receiving, from the source donor node, a first handover response message corresponding to the first handover request message, and performing, a partial migration with a migrating node in case that the first handover response message indicates acknowledge (ack).
Inventor(s): Sungchul PARK of Suwon-si (KR) for samsung electronics co., ltd., Suyoung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04W76/19, H04W36/00, H01Q21/00
Abstract: an example electronic device includes a first antenna module configured to receive a serving beam; a second antenna module configured to measure an intensity of a signal of a neighbor beam; a first temperature sensor configured to measure a temperature corresponding to the first antenna module; a second temperature sensor configured to measure a temperature corresponding to the second antenna module; at least one processor; and a memory operatively connected to the at least one processor, wherein the memory stores instructions which, when executed, cause the least one processor to: determine whether the first antenna module is in an overheated state while performing communication with the first base station through the first antenna module and, based on determining that the first antenna module is in the overheated state, perform handover to the second base station based on channel measurement information regarding the second base station.
Inventor(s): Jungshin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongyeon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/32, H04W36/18, H04W36/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed are a method and an apparatus for allocating a service area for a flyable user equipment (ue) in a wireless communication system and enabling a handover to a base station capable of aviation communication when the ue is moved to provide the ue with a seamless service. a method performed by an access and mobility management function (amf) in a wireless communication system may include receiving, from an unmanned aerial system (uas) service supplier (uss), flight-related information about a ue; determining at least one candidate base station to be used by the ue, based on the flight-related information about the ue; transmitting, to the at least one candidate base station, a request message for requesting aviation communication-related information about the at least one candidate base station; receiving, from the at least one candidate base station, a response message including aviation communication-related information about the at least one candidate base station; and generating a handover list to be used by the ue, based on the flight-related information about the ue and the aviation communication-related information about the at least one candidate base station.
Inventor(s): Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/06, H04W28/02, H04L47/20
Abstract: the disclosure relates to a 5generation (5g) or pre-5g communication system for supporting a higher data rate after a 4generation (4g) communication system such as long term evolution (lte). according to various embodiments, a method for operating a network node in a wireless communication system is provided. the method comprises obtaining slice policy information including a maximum data rate, monitoring a data rate of protocol data unit (pdu) sessions associated with the slice, determining whether a sum of data rates of pdu sessions associated with the slice exceeds the maximum data rate, transmitting, to a second network node, a policy enforcement request message for controlling the sum of data rates of the pdu sessions associated with the slice.
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W48/12, H04W72/232
Abstract: network parameter adaptation in a wireless communication system. a method for a user equipment (ue) includes receiving first information related to operation states on a cell and second information related to a search space set to receive physical downlink control channels (pdcchs). a first operation state from the operation states includes first parameters associated with transmissions of channels or signals on the cell in one or more of a power, spatial, time, or frequency domain. a pdcch from the pdcchs provides a downlink control information (dci) format that indicates one or more of the operation states. the method further includes receiving the pdcch; determining the parameters in the one or more of the power, spatial, time, or frequency domain based on the one or more operation states indicated by the dci format; and receiving the channels or signals on the cell based on the parameters.
Inventor(s): Jong Hoon Park of Namyangju (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W72/1268, H04W74/00, H04W74/08, H04L27/26
Abstract: a method for transmitting a physical layer protocol data unit (ppdu) and a device using the same are provided. the device receives a trigger frame for requesting a transmission of a high efficiency (he) trigger-based (tb) ppdu and transmits the he tb ppdu. a duration of the he tb ppdu is calculated based on a duration of the trigger frame.
Inventor(s): Sun-Heui RYOO of Yongin-si (KR) for samsung electronics co., ltd., Jung-Soo JUNG of Seongnam-si (KR) for samsung electronics co., ltd., Hyun-Jeong KANG of Seoul (KR) for samsung electronics co., ltd., Jong-Hyung KWUN of Seoul (KR) for samsung electronics co., ltd., Sung-Jin LEE of Bucheon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/14, H04W76/27, H04W76/15, H04W52/34, H04W52/36
Abstract: a method and an apparatus for controlling uplink power in a wireless communication system are provided. the method for controlling uplink power of a user equipment (ue) forming a transmission link with a plurality of bss (bss), a power headroom report trigger event by at least one of the plurality of bss is detected. power headroom information of the ue is reported to at least one of the plurality of bss.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W52/52, H04W52/32, H04W52/24
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure provides a method for signal transmission in a communication system is provided. the method is performed by a device for forwarding signals and includes determining a first power amplification gain, and forwarding a received signal based on the first power amplification gain.
Inventor(s): Euichang JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Suyoung PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Suha YOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Sunghyuk SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/20
Abstract: methods and apparatuses are provided in which a base station transmits a synchronization signal (ss) physical broadcast channel (pbch) block (ssb) associated with a master information block (mib) including first configuration information for a first control resource set (coreset) associated with a common search space (css). system information is transmitted. the terminal obtains mib based on the ssb, monitors first control information for scheduling the system information on the css based on a first aggregation level, and receives the system information based on the first control information. a radio resource control (rrc) connection is established with the terminal based on the system information. an rrc message is transmitted to the terminal including second configuration information for a second coreset associated with a ue specific search space (uss), based on the rrc connection. the terminal monitors second control information for the ue on the uss based on a second aggregation level.
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04W72/04
Abstract: methods and apparatuses for monitoring an indication of an operation state on a cell in a wireless communication system. a method for a user equipment (ue) includes receiving first information related to a list of parameters in one or more domains; receiving second information for a search space set for reception of physical downlink control channel (pdcchs); and receiving a pdcch from the pdcchs. the list includes a number of sets of parameters corresponding to a first number of cells. the pdcch provides a downlink control information (dci) format that indicates a number of indexes. an index from the number of indexes is associated with a second number of cells from the first number of cells. the method further includes determining parameters on a cell from the second number of cells based on the index and receiving a channel or signal on the cell based on the parameters.
Inventor(s): Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W74/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method performed by a terminal in a wireless communication system, comprising receiving, from a base station, a configuration message including first configuration information associated with a downlink reception of the terminal and second configuration information associated with an uplink transmission of the terminal and in case that the first configuration information corresponds to a first state of the base station, refraining from receiving the downlink reception and in case that the second configuration information corresponds to the first state of the base station, refraining from transmitting the uplink transmission.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Qi XIONG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W74/04, H04W74/00
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a communication method, a user equipment (ue), a base station, and a storage medium are provided. the method includes receiving, by a ue, information related to physical random access channel (prach) resources, determining available prach resources in an energy saving state and/or non-energy saving state of a base station, and then transmitting a prach to the base station based on the available prach resources and the state of the base station. the method may reduce the amount of prach resources to be monitored by the base station, thereby achieving the purpose of saving power on the base station side.
Inventor(s): Byounghoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W76/20, H04W52/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system includes receiving, from a base station, configuration information related to a network energy saving (nes) mode, receiving, from the base station, a message indicating a performing the nes mode after a random access (ra) is triggered, and identifying whether at least one resource related to the ra and the nes mode overlap based on the configuration information.
Inventor(s): Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyeonu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jeongyong MYOUNG of Suwon-si (KR) for samsung electronics co., ltd., Junghun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08
Abstract: an electronic device is provided. the electronic device includes a first processor, a communication module including a second processor, and a memory, wherein the memory includes instructions for controlling the first processor to control the communication module to perform data transmission to/reception from an access point according to a target wake time (twt) agreement on the basis of a first twt parameter when communicating with an access point, monitor at least one of downlink packets received from the second processor or uplink packets transferred to the second processor, estimate a twt service period (sp) and twt interval of a communication link level having been processed in the second processor, update the first twt parameter with a second twt parameter suitable for quality of service of at least one application or service operated in the first processor on the basis of the estimated twt interval and twt sp, and transfer the second twt parameter to the second processor so as to make a re-agreement on twt with the access point.
Inventor(s): Neha SHARMA of Bangalore (IN) for samsung electronics co., ltd., Arvind RAMAMURTHY of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/10, H04W76/20
Abstract: an example method for selecting a measurement mode by a user equipment (ue) in a communication system including multiple transmission and reception points (trp) scenario includes receiving, from a network entity, system information indicating one or more measurement modes supported by the network entity; selecting a measurement mode among the one or more measurement modes based on one or more ue parameters; transmitting, to the network entity, a radio resource control (rrc) connection request for the selected measurement mode; and receiving, from the network entity in response to the transmitted rrc connection request, a first rrc connection configuration for configuring the ue with the selected measurement mode.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04W76/12, H04W8/00
Abstract: a wireless communication network includes an access point (ap) multi-link device (mld) and a non-ap mld. in an enhanced multi-link multi-radio (emlmr) mode, a non-ap mld may sequentially transmit one or more tdls discovery request frames to an ap mld to discover a tdls peer sta via different emlmr links. the ap mld may transmit an initial frame via an emlmr link to trigger tdls discovery request frame from the non-ap mld.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04W40/24
Abstract: methods and apparatuses for facilitating discovery by a multi-link device (mld) of peer-to-peer (p2p) direct links that overlap with non-simultaneous transmit/receive (nstr) constrained links of the mld without violating nstr constraints. a first non-access point (ap) mld comprises first stations (stas), each comprising a transceiver configured to form a link with a corresponding ap of an ap mld, and a processor. two of the links form an nstr link pair. the processor is configured to generate a first message identifying a first nstr link for establishment of a p2p direct link with a peer sta. the transceiver corresponding to one of the nstr links is configured to transmit the first message to the ap mld. the transceiver corresponding to a second nstr link is configured to wait a predetermined period of time after the first message is transmitted before performing uplink (ul) transmissions to the ap mld.
Inventor(s): Hoda SHAHMOHAMMADIAN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04W72/232, H04W72/11, H04W72/1273
Abstract: a system and a method are disclosed for communicating with multiple transmission and reception points (multi-trps). according to an embodiment, the method includes maintaining a current transmission configuration indicator (tci) state set including one or more activated tci states; receiving tci state information specifying an indicated tci state set including one or more of the activated tci states; and updating the current tci state set based on the indicated tci state set.
Inventor(s): Youngkyo BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/40, H04W4/06
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a base station in wireless communication system, the method comprising: identifying a second temporary mobile group identity (tmgi) which is different from a first tmgi for a broadcast service, and transmitting, to an access and mobility function (amf), information on the second tmgi, and receiving, from the amf, information on a broadcast session allocated by the mb-smf (multicast/broadcast-session management function) based on the information on the second tmgi, receiving, from mb-upf, broadcast data for broadcasting to user equipment (ue).
Inventor(s): Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/50, H04W72/56
Abstract: methods and apparatuses for prioritization handling for epcs operation are disclosed. a method for wireless communication performed by a non-ap device that comprises a sta comprises: forming a first link with a first ap of a first ap mld and a second link with a second ap of a second ap mld; receiving information associated with epcs priority access from the first and second aps, determining whether the sta is undergoing a bss transition from the first ap to the second ap; when the sta is not undergoing the bss transition from the first ap to the second ap, continuing with a current epcs priority access; and when the sta is undergoing the bss transition from the first ap to the second ap, determining a procedure for handling the epcs priority access associated with the bss transition from the first ap to the second ap.
20240040721.DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangkyun IM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
Abstract: a display apparatus includes a display including an upper region, a lower region, and an intermediate region; a first roller around which the upper region of the display is to be rolled; a second roller around which the lower region of the display is to be rolled; a first drum rotatably supporting the first roller; a second drum rotatably supporting the second roller; a main body disposed between the first drum and the second drum in which the intermediate region is disposed on a front surface of the main body; a first link connecting a left end of the first drum and a right end of the second drum and is rotatably connected to the main body; a second link connecting a right end of the first drum and a left end of the second drum and is rotatably connected to the main body; and a driver configured to rotate the first link and the second link in opposite directions, and the first drum includes first roller grooves to which the first roller is rotatably coupled, and the second drum includes second roller grooves to which the second roller is rotatably coupled.
Inventor(s): Yanggyun Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K9/00, H05K5/00
Abstract: an electronic apparatus includes a housing, a display module, an acoustic component which is located inside the housing and includes a magnetic material, and a shielding member located between the display module and the acoustic component. the shielding member includes a first portion which is located adjacent to the acoustic component, and a second portion which is located adjacent to the display module and bends and extends from one side of the first portion.
Inventor(s): Jina Kim of Suwon-si (KR) for samsung electronics co., ltd., Kang-Uk Kim of Suwon-si (KR) for samsung electronics co., ltd., Ho-In Ryu of Suwon-si (KR) for samsung electronics co., ltd., Yunho Song of Suwon-si (KR) for samsung electronics co., ltd., Dalhyeon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a memory device includes a substrate having first and second active patterns adjacent to each other and separated by a trench, the first and second active patterns including a first source/drain region; the second active pattern includes a second source/drain region. the second source/drain region includes first and second sidewall surfaces adjacent the first source/drain region and a connecting surface that connects the first and second sidewall surfaces. the second sidewall surface is set back from the first sidewall surface. an isolation layer is included in the trench and on the first sidewall surface. a bit line includes a contact part connected to the first source/drain region. a contact is coupled to the second source/drain region with a lower spacer between the contact and the contact part of the bit line, a landing pad on the contact, and a data storage element on the landing pad.
20240040772.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungjin YEO of Suwon-si (KR) for samsung electronics co., ltd., Wonseok YOO of Suwon-si (KR) for samsung electronics co., ltd., Jaemin WOO of Suwon-si (KR) for samsung electronics co., ltd., Kyeongock CHONG of Suwon-si (KR) for samsung electronics co., ltd., Myunghun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Yoongi HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device may include a bit line structure, a first spacer, and a second spacer on a substrate. the bit line structure may include a conductive structure and an insulation structure stacked in a vertical direction substantially perpendicular to an upper surface of the substrate. the first spacer and the second spacer may be stacked in a horizontal direction on a sidewall of the bit line structure. the horizontal direction may be substantially parallel to the upper surface of the substrate. the conductive structure may include a nitrogen-containing conductive portion at a lateral portion thereof. the first spacer may contact the nitrogen-containing conductive portion.
20240040774.INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Euna Kim of Suwon-si (KR) for samsung electronics co., ltd., Eunjung Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: an integrated circuit device includes a substrate and a plurality of cell patterns that have a pillar shape, wherein the plurality of cell patterns comprise a plurality of first cell groups that are arranged along a first horizontal direction and each comprise a plurality of first cell patterns arranged in a row along a second horizontal direction, and a plurality of second cell groups that are spaced apart from the plurality of first cell groups, are arranged along the first horizontal direction, and each comprise a plurality of second cell patterns arranged in a row along the second horizontal direction, and wherein respective side surfaces of the plurality of second cell patterns have respective concave portions that are recessed inward along respective side surfaces of the plurality of first cell patterns that are adjacent to respective ones of the plurality of second cell patterns.
Inventor(s): Moorym CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jungtae SUNG of Suwon-si (KR) for samsung electronics co., ltd., Sunil SHIM of Suwon-si (KR) for samsung electronics co., ltd., Yunsun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B43/10, H01L23/528, H10B43/27, H10B41/10, H10B41/35, H10B43/35, H10B41/27, H10B41/40
Abstract: a three-dimensional semiconductor memory device is provided. the memory device includes a substrate, a peripheral circuit structure on the substrate, and a cell array structure on the peripheral circuit structure and including a cell array region and a cell array contact region. the cell array structure includes a stack structure including alternately stacked interlayer insulating layers and gate electrodes, a first source conductive pattern, a second source conductive pattern, and a third source conductive pattern sequentially stacked on the stack structure. the first to third source conductive patterns include different materials from each other. vertical channel structures extending into a lower portion of the first source conductive pattern through the stack structure is included. the first to third source conductive patterns extend from the cell array region to the cell array contact region. the vertical channel structures include vertical semiconductor patterns that contact to the first source conductive pattern.
Inventor(s): Youngshik Yun of Suwon-si (KR) for samsung electronics co., ltd., Dongsik Lee of Suwon-si (KR) for samsung electronics co., ltd., Siwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Sori Lee of Suwon-si (KR) for samsung electronics co., ltd., Bongtae Park of Suwon-si (KR) for samsung electronics co., ltd., Jaejoo Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B43/27, H10B43/35, H10B41/40, H10B41/27, H10B41/35, G11C16/04, H01L23/528, H10B80/00, H01L25/065
Abstract: a semiconductor device includes a peripheral circuit region and a memory cell region. the memory cell region may include a stack structure including gate electrodes and interlayer insulating layers repeatedly and alternately stacked in a vertical direction, and a channel structure penetrating through the stack structure. the gate electrodes may include first gate electrodes, second gate electrodes on the first gate electrodes, and third gate electrodes on the second gate electrodes. each of the first gate electrodes may have a first thickness. each of the second gate electrodes may have a second thickness that is greater than the first thickness. each of the third gate electrodes may have a third thickness that is smaller than the second thickness.
20240040793.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SEJIE TAKAKI of Suwon-Si (KR) for samsung electronics co., ltd., Joonhee Lee of Seongnam-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H01L23/522, H01L23/528, H01L23/535, H01L21/768, H10B41/27, H10B41/41, H10B43/27
Abstract: a semiconductor device includes a peripheral circuit region with a first substrate, circuit devices on the first substrate, and a first wiring structure, a memory cell region with a second substrate that has a first region and a second region, gate electrodes stacked in the first region, channel structures that penetrate the gate electrodes, a first horizontal conductive layer on the second substrate in the first region, an insulating region on the second substrate in the second region, a second horizontal conductive layer on the first horizontal conductive layer and the insulating region, and a second wiring structure, and a third wiring structure that connects the first substrate to the second substrate, and includes an upper via that penetrates the second horizontal conductive layer, the insulating region, and the second substrate, and a lower wiring structure connected to the upper.
Inventor(s): Bong Yong LEE of Suwon-si (KR) for samsung electronics co., ltd., Yong Seok Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H10B51/10, H01L29/66, H01L29/78, H01L23/528
Abstract: a semiconductor device comprises a substrate that extends in first and second directions and includes a cell region and an extension region that extends from the cell region in the first direction, first and second insulating layers alternately stacked on the substrate in a third direction, a conductive line disposed on one sidewall of the second insulating layer in the second direction, a conductive pillar that extends in the third direction and penetrates through the first insulating layer, a semiconductor layer disposed on one sidewall of the conductive pillar and that extends in the third direction, and a ferroelectric layer disposed between the conductive line and the semiconductor layer and that extends in the third direction. the conductive line includes first and second conductive patterns spaced apart from each other in the second direction, and the second insulating layer is disposed between the first and second conductive patterns.
Inventor(s): Hyunmook CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jihong KIM of Suwon-si (KR) for samsung electronics co., ltd., Siyeon CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/30
Abstract: a three-dimensional non-volatile memory device includes horizontal word lines separated from each other in a vertical direction, horizontal ferroelectric layers arranged among the horizontal word lines, the horizontal ferroelectric layers including upper horizontal ferroelectric layers and lower horizontal ferroelectric layers, vertical ferroelectric layers contacting side walls of the horizontal ferroelectric layers and extending in the vertical direction, a semiconductor pillar passing through the horizontal word lines in the vertical direction, and a channel region between the horizontal word lines and the semiconductor pillar, wherein the upper horizontal ferroelectric layers and the lower horizontal ferroelectric layers are separated from each other by an air gap in the vertical direction.
Inventor(s): HYUNSOO CHUNG of Suwon-si (KR) for samsung electronics co., ltd., YOUNG LYONG KIM of Suwon-si (KR) for samsung electronics co., ltd., Inhyo HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L25/00, H01L23/31, H01L23/00
Abstract: a semiconductor package may include a substrate, a chip structure mounted on the substrate, and a first dummy structure attached to the chip structure. the chip structure may include a first semiconductor chip, a second dummy structure disposed at a side of the first semiconductor chip, and a mold layer enclosing the first semiconductor chip and the second dummy structure. a bottom surface of the first semiconductor chip, a bottom surface of the second dummy structure, and a bottom surface of the mold layer may be coplanar with each other.
20240040806.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonsung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jihwang Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Lee of Suwon-si (KR) for samsung electronics co., ltd., Dongwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Wonkyoung Choi of Suwon-si (KR) for samsung electronics co., ltd., Yunseok Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/538, H01L23/31, H01L23/498, H01L23/00, H01L23/36
Abstract: a semiconductor package includes a lower package, an upper package on the lower package, and an inter-package connector between the lower package and the upper package. the lower package includes a first redistribution structure, a first semiconductor chip mounted on a first mounting region of the first redistribution structure, a second semiconductor chip mounted on a second mounting region of the first redistribution structure, a molding layer on the first redistribution structure and in contact with a side wall of the first semiconductor chip and a side wall of the second semiconductor chip, and a conductive post passing through the molding layer and electrically connected to the first semiconductor chip through a first redistribution pattern of the first redistribution structure. the upper package is on the molding layer, vertically overlaps with the second mounting region of the first redistribution structure, and does not cover the first semiconductor chip.
Inventor(s): Sungyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung SEO of Suwon-si (KR) for samsung electronics co., ltd., Hiromasa SHIBUYA of Suwon-si (KR) for samsung electronics co., ltd., Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Tae Jin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Chul Joon HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K39/34, H10K85/30, H10K85/60, H10K85/40
Abstract: a sensor-embedded display panel includes a light emitting element on a substrate and including a light emitting layer, and a photosensor including a photosensitive layer on the substrate and arranged in parallel with the light emitting layer along an in-plane direction of the substrate such that the photosensor and the light emitting layer at least partially overlap in the in-plane direction, wherein the light emitting element and the photosensor further include separate, respective portions of a first common auxiliary layer disposed under each of the light emitting layer and the photosensitive layer and connected to each other to be a single piece of material extending continuously between the light emitting element and the photosensor, and the photosensitive layer includes a first semiconductor represented by chemical formula 1 and a second semiconductor not including any fullerenes and forming a pn junction with the first semiconductor.
Inventor(s): Sangmo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Joonghee WON of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Suwon-si (KR) for samsung electronics co., ltd., Sooghang IHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F5/02, C09K11/06
Abstract: provided are a heterocyclic compound represented by formula 1, an organic light-emitting device including the same, and an electronic apparatus including the organic light-emitting device.
Inventor(s): Sangmo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Joonghee WON of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Suwon-si (KR) for samsung electronics co., ltd., Sooghang IHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F5/02, C09K11/06
Abstract:
Inventor(s): Sangmo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Joonghee WON of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Suwon-si (KR) for samsung electronics co., ltd., Sooghang IHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F5/02, C09K11/06
Abstract: wherein the substituents in formula 1 are as described in the present specification.
SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- A47L9/28
- A47L5/30
- A47L9/04
- A46B13/00
- A46B13/02
- Samsung electronics co., ltd.
- A47L11/40
- A47L11/282
- A47L15/00
- A47L15/42
- A47L15/48
- A61B5/1455
- A61B5/026
- A61B5/0205
- A61G15/02
- A61H7/00
- A61G15/00
- A61H15/02
- A61H15/00
- A61H23/02
- A63B24/00
- A63B5/20
- B60W60/00
- B60W40/08
- C01B35/14
- C23C16/455
- C23C16/448
- C25D11/24
- C23F1/20
- C25D11/16
- D06F37/10
- D06F39/14
- E05D11/00
- D06F37/28
- D06F37/14
- D06F37/20
- D06F37/02
- D06F37/12
- D06F37/42
- D06F37/24
- D06F39/08
- D06F37/04
- F04D13/06
- F04D29/08
- D06F34/28
- E05D3/12
- E05D3/18
- E05D11/10
- F24C15/02
- F24C15/04
- F24C15/34
- G01K11/3206
- G01N21/25
- G01N21/27
- G01R31/392
- G01R31/36
- G01R31/367
- G01R31/374
- G01S7/40
- G01S13/87
- G01S13/76
- G01S11/14
- G06F1/3206
- G10L15/28
- G01S17/89
- G01S7/484
- G01S7/4865
- G01S17/931
- G05D1/02
- G01S7/481
- G02B7/28
- G02B27/01
- G02F1/29
- G06T19/00
- G02F1/13357
- G02F1/1335
- G03B21/56
- H04N9/31
- G03F1/62
- G03F7/20
- H01J37/32
- G03F7/00
- G05B13/02
- G10L15/22
- G06F1/16
- H05K1/18
- H04R1/28
- G06F1/3203
- G06F1/324
- G06F1/3287
- G06F1/3296
- G06F1/20
- G06F15/78
- G06F1/329
- G06F1/3234
- G06F3/0482
- G06F9/451
- G06F3/0487
- H04M1/02
- G06F3/04883
- G06F3/04886
- G11B27/34
- G06F3/04817
- G06F3/04842
- H04M1/72403
- H04M1/72469
- G06F3/04847
- G06F3/0488
- G06F3/06
- G06F9/50
- G06F3/16
- H04W4/80
- G05B15/02
- G06F7/48
- G06F13/16
- G11C7/10
- G06F9/455
- G06F9/54
- G06F9/48
- G06F12/02
- G06F12/10
- G06F21/56
- G06F11/14
- G06N20/00
- G06F30/367
- G06N3/08
- G06N3/045
- G06N3/048
- G11C11/54
- G06T5/00
- G06T5/50
- G06V10/40
- G06T7/246
- G06T5/40
- G06T7/70
- G09B7/00
- G10L15/18
- G10L15/30
- G06F16/242
- G06F16/332
- G06F16/432
- G06F40/295
- G09G3/00
- G09G3/3225
- G10L15/02
- G10L15/10
- G10L15/06
- H04N21/422
- H04N21/439
- H04N21/482
- G11C11/406
- G11C11/4078
- G11C11/4096
- G11C11/4076
- H01L25/065
- H10B80/00
- H01L23/00
- G11C16/16
- G11C16/08
- G11C16/04
- G11C16/26
- G11C16/24
- G11C29/44
- G11C29/12
- G11C29/02
- H01J37/20
- H01L21/3065
- H01L21/67
- H01L21/18
- H01L21/02
- H01L21/48
- H01L25/10
- H01L21/56
- C09D7/20
- C09D7/61
- C09D5/16
- H01L21/304
- H01L21/677
- B65G17/20
- B66C19/00
- F16F15/08
- B66C13/04
- B66C7/12
- B66C9/04
- H01L21/66
- H01L23/48
- H10B10/00
- H01L29/423
- H01L29/06
- H01L29/786
- H01L29/775
- H10B10/10
- H01L23/498
- H01L23/31
- H01L23/528
- H01L23/522
- H10B43/10
- H10B43/27
- H10B43/35
- H10B41/10
- H10B41/27
- H10B41/35
- H10B41/40
- H10B43/40
- H01L23/532
- C22C29/14
- H01L23/544
- H01L25/18
- H01L21/768
- H01L25/00
- B23K20/00
- H01L27/118
- H01L21/8238
- H01L27/02
- H01L27/092
- H01L27/146
- H04N25/79
- H04N25/77
- H04N25/78
- H01L27/15
- H01L33/08
- H01L33/06
- H01L33/32
- H01L21/3213
- H01L21/285
- H10B12/00
- H01L29/417
- H01L29/08
- H01L29/66
- H01L27/088
- H01L29/16
- H01L29/78
- H01L29/10
- H01L29/778
- H01L29/161
- H01L29/40
- H01L21/28
- G11C11/22
- H01L29/51
- H01L29/41
- H01L29/24
- H01L29/45
- H01L21/8234
- H01M4/133
- H01M4/134
- H01M4/36
- H01M4/38
- H01M4/587
- H01M10/052
- H01M10/0562
- H01Q3/26
- H01Q21/06
- H01Q9/04
- H01Q1/52
- H01Q1/22
- H01Q13/20
- H01Q21/08
- H02M7/06
- H02M7/539
- H02J50/10
- H02J50/40
- H03F1/02
- H03F3/21
- H03F3/24
- H03F3/72
- H03F3/195
- H04B1/401
- H04W52/02
- H04B7/024
- H04W72/23
- H04B7/06
- H04L5/00
- H04L1/00
- H04L5/14
- H04W72/0446
- H04W72/232
- H04W72/0453
- H04L1/1607
- H04W76/27
- H04W72/53
- H04L25/02
- H04L25/03
- H04L67/148
- H04W36/00
- H01Q1/24
- H04N5/74
- G06T7/20
- G06T7/50
- G06V10/60
- H04N21/2662
- H04N19/115
- H04N19/117
- H04N19/157
- H04N19/42
- H04N19/82
- G06T3/40
- H04N21/431
- G06F3/044
- G06F3/14
- H04N21/472
- H04N23/57
- H04N23/63
- H04N23/80
- G06V10/25
- H04N23/60
- H04N5/262
- H04N1/21
- H04N23/45
- H04N23/62
- H04N23/667
- H04N23/951
- H04N23/75
- G09G3/20
- H04N23/74
- H04N23/72
- G09G5/10
- H04N23/73
- H04N25/17
- H04N25/704
- H04N23/67
- G02B3/00
- G02B7/36
- H04N25/531
- H04N25/533
- H04R1/02
- G10K11/162
- H04R31/00
- H04W12/0431
- H04W76/10
- H04W48/08
- H04L9/14
- H04L9/30
- H04W12/106
- H04W12/06
- H04W60/00
- H04W24/10
- H04W24/02
- H04W28/06
- H04W72/1273
- H04W36/08
- H04W36/30
- H04W76/19
- H01Q21/00
- H04W36/32
- H04W36/18
- H04W48/06
- H04W28/02
- H04L47/20
- H04W48/12
- H04W72/1268
- H04W74/00
- H04W74/08
- H04L27/26
- H04W52/14
- H04W76/15
- H04W52/34
- H04W52/36
- H04W52/52
- H04W52/32
- H04W52/24
- H04W72/20
- H04W72/04
- H04W74/04
- H04W76/20
- H04W76/12
- H04W8/00
- H04W40/24
- H04W72/11
- H04W76/40
- H04W4/06
- H04W76/50
- H04W72/56
- H05K5/02
- H05K9/00
- H05K5/00
- H01L23/535
- H10B41/41
- H10B51/20
- H10B51/10
- H10B51/30
- H01L23/538
- H01L23/36
- H10K39/34
- H10K85/30
- H10K85/60
- H10K85/40
- C07F5/02
- C09K11/06
