SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on February 15th, 2024
SAMSUNG ELECTRONICS CO., LTD.: 178 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H10B80/00 (21), H01L23/00 (21), H01L25/065 (16), H01L24/16 (14), H01L25/0657 (12)
With keywords such as: device, semiconductor, including, based, information, signal, configured, data, substrate, and layer in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Eunkyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Kiho Bae of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Boumyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Boun Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/005, G05D11/13
Abstract: a chemical mechanical polishing apparatus includes: supply pipes to which a slurry stock solution and a diluent are supplied; flow rate control units, respectively disposed on the supply pipes to control flow rates of the slurry stock solution and the diluent; a mixer connected to the flow rate control units and configured to mix the slurry stock solution and the diluent, supplied from the supply pipes, to prepare a slurry; a slurry storage unit connected to the mixer and configured to store the slurry prepared in the mixer; a slurry supply unit configured to draw out the slurry stored in the slurry storage unit and to supply the slurry to a polishing pad; and a control unit configured to control the flow rate control units to control a mixing ratio of the slurry stock solution and the diluent and a flow rate of the slurry to the polishing pad.
Inventor(s): Jongkeun Yi of Suwon-si (KR) for samsung electronics co., ltd., Jehun Kim of Suwon-si (KR) for samsung electronics co., ltd., Suhyoung Cho of Suwon-si (KR) for samsung electronics co., ltd., Jiwon Chun of Suwon-si (KR) for samsung electronics co., ltd., Junyul Hur of Suwon-si (KR) for samsung electronics co., ltd., Jaedong Hwang of Seoul (KR) for samsung electronics co., ltd., Daesoo Park of Seoul (KR) for samsung electronics co., ltd., Jaehyung Park of Seoul (KR) for samsung electronics co., ltd., Seungjoon Chung of Seoul (KR) for samsung electronics co., ltd., Yongxun Jin of Seoul (KR) for samsung electronics co., ltd., Jaehoon Choi of Seoul (KR) for samsung electronics co., ltd., Seokhwan Hong of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): C02F9/00, C02F1/52
Abstract: an apparatus for treating waste water including: a first flocculation tank to which a first flocculant is provided to produce a first flocculated material in which fluorine in waste water introduced from a waste water storage part is coagulated; a second flocculation tank to which a second flocculant and carbon dioxide are provided to produce a second flocculated material in which the first flocculated material and residual fluorine in first outflow water introduced from the first flocculation tank are flocculated; a third flocculation tank to which a third flocculant is provided to produce a third flocculated material in which the first flocculated material and the second flocculated material in second outflow water introduced from the second flocculation tank are flocculated; a first sedimentation tank in which third outflow water introduced from the third flocculation tank is solid-liquid separated into first sludge containing the third flocculated material and first supernatant water; a nitrification tank in which alkalinity is provided by a carbonate supplied from the carbon dioxide, and ammoniacal nitrogen in the first supernatant water introduced from the first sedimentation tank is oxidized by nitrifying microorganisms; and a second sedimentation tank in which fourth outflow water introduced from the nitrification tank is solid-liquid separated into second sludge and second supernatant water.
Inventor(s): Youngjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Dongpil SEO of Suwon-si (KR) for samsung electronics co., ltd., Kanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaebok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/10
Abstract: a filter apparatus positionable outside a washing machine and connectable to a drain device of the washing machine, the filter apparatus including a filter case configured so that, with the filter apparatus connected to the drain device, water from the drain device is flowable through the filter case; a filter detachably mountable inside the filter case; a filtering flow path inside the filter case so that water passes through the filter while the filter is mounted inside the filter case; a bypass flow path inside the filter case so that water bypasses the filter; at least one sensor to obtain information about the filter; an opening and closing device to open and close the bypass flow path to guide water flowing into the filter case to the filtering flow path or the bypass flow path; and a controller to control the opening and closing device based on the obtained information.
Inventor(s): Kanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongpil SEO of Suwon-si (KR) for samsung electronics co., ltd., Jaebok LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/10, B01D35/02, B01D35/143, B01D29/23, B01D29/60, B01D29/64
Abstract: a filter apparatus positionable outside a washing machine and connectable to a drain device of the washing machine, the filter apparatus including a filter case including a case inlet a case outlet; a filter detachably installable inside the filter case, the filter through which water flowing from the case inlet to the case outlet passes; a sensor to detect water entered into the filter apparatus from the drain device and to produce a corresponding signal; and a filter cleaning device to clean the filter in accordance with the signal produced by the sensor.
20240052547.FILTER APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaebok LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongpil SEO of Suwon-si (KR) for samsung electronics co., ltd., Kanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/10, B01D35/143, D06F34/05
Abstract: a filter apparatus positionable outside a washing machine and connectable to a drain device of the washing machine. the filter apparatus includes a housing; a filter case in the housing and including an inlet and an outlet that are configured so that, with the filter apparatus positioned outside the washing machine and connected to the drain device, water from the drain device is flowable through the inlet into the filter case, and water in the filter case is flowable through the outlet out of the filter case; a filter detachably installable in the filter case so that water flowing through the inlet is flowable through the filter, and then to the outlet; and circuitry between the housing and the filter case and including a controller configured to control the filter apparatus, and a communicator configured to transmit information obtained by the filter apparatus to at least one of the washing machine or a user device.
Inventor(s): Dongpil SEO of Suwon-si (KR) for samsung electronics co., ltd., Youngjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Kanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaebok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/10, D06F39/08, B01D29/35, B01D35/30, D06F33/43, B01D29/64, B01D35/147, B01D29/96
Abstract: a filter apparatus positionable outside a washing machine and connectable to a drain device of the washing machine, the filter apparatus including a filter case including a case inlet configured so that, with the filter apparatus connected to the drain device, water from the drain device is flowable through the case inlet into the filter case, and a case outlet configured so that, with the filter apparatus connected to the drain device, water in the filter case is flowable through the case outlet out of the filter case; a filter detachably mountable inside the filter case so that water flowing through the case inlet is flowable through a surface of the filter to filter foreign substances from the water, and then to the case outlet; a filter cleaning device configured to clean the surface of the filter; and a controller configured to control the filter cleaning device.
20240053004.SCRUBBING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Inho Won of Suwon-si (KR) for samsung electronics co., ltd., Juhyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F23G7/06
Abstract: a scrubbing apparatus includes a reactor including an interior space, a burner disposed in the interior space of the reactor and configured to burn waste gas, a water tower connected to the reactor and configure to remove harmful substances from combusted gas, a discharge pipe connected to an upper end of the water tower, through which a fluid discharged from the water tower is configured to flow, and a heat exchanger surrounding the discharge pipe and configure to remove moisture from an inside of the discharge pipe. the heat exchanger includes a heat exchanger body including a cooling passage through which a cooling fluid performing heat exchange with gas flowing through the discharge pipe is configured to flow, a heat sink disposed between the heat exchanger body and the discharge pipe, and an insulator surrounding at least a portion of an external surface of the heat exchanger body.
20240053069.ACCUMULATOR FOR COMPRESSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Soodol PARK of Suwon-si (KR) for samsung electronics co., ltd., Munseong KWON of Suwon-si (KR) for samsung electronics co., ltd., Joonhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyolim HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25B43/00, B01D46/00, F15B1/04
Abstract: an accumulator for a compressor on a horizontal-type compressor is provided. the accumulator includes a body provided on one side of a horizontal-type compressor so as to be perpendicular to a center line of the horizontal-type compressor, a stand pipe protruding into the body from a lower surface of the body, a suction opening provided on a side surface of the body, a baffle which is provided above the stand pipe inside the body and includes a plurality of baffle holes, and a screen provided above the baffle.
20240053081.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minseob YOOK of Suwon-si (KR) for samsung electronics co., ltd., Kwanyeol Lee of Suwon-si (KR) for samsung electronics co., ltd., Jin Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25C1/24
Abstract: provided is a refrigerator. the refrigerator includes an outer case forming an exterior of the refrigerator; an inner case provided in the outer case and defining a storage compartment, the inner case including a first inner wall and a second inner wall opposing the first inner wall; and an ice maker mounted in the inner case and to make ice, the ice maker including an ice maker case, wherein the ice maker case includes: a first ice maker case wall supported by the first inner wall; a second ice maker case wall supported by the second inner wall; and an elastic protrusion provided on the first ice maker case wall, the elastic protrusion being configured to interfere with the first inner wall and to be elastically deformable in a direction in which the elastic protrusion is pressed by the first inner wall.
20240053085.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kihyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokjun SON of Suwon-si (KR) for samsung electronics co., ltd., Ilsung BAE of Suwon-si (KR) for samsung electronics co., ltd., Byungkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Sungi HONG of Suwon-si (KR) for samsung electronics co., ltd., Bongjun KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D17/06
Abstract: a refrigerator includes: a main body; a storage compartment provided in the main body; and an air duct provided in the storage compartment and configured to discharge air into the storage compartment, wherein the air duct may include: a front panel having an assembly groove formed at upper portion of a front surface of the front panel; an air flow path part provided at a rear surface of the front panel; an air duct cover including an upper portion inserted into the assembly groove and a lower portion attached to the front panel; and a fixing member configured to detachably attach the air duct to the front panel.
20240053087.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chomin LEE of Suwon-si (KR) for samsung electronics co., ltd., Seangwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaejin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeonghun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Wooyeol YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02
Abstract: a refrigerator includes: a main body including a storage compartment; a door rotatably coupled to the main body and configured to open and close the storage compartment; and a door opening device provided in the main body and including a drive motor, the door opening device being configured to open the door, wherein the door includes: a door front member forming a front surface of the door; a door side member forming a side surface of the door and having an opening; a side cap coupled to an inner surface of the door side member and including a handle that is recessed and a switch mounting space; and a switch module mounted in the switch mounting space through the opening and configured to receive an input for operating the door opening device.
Inventor(s): Chomin LEE of Suwon-si (KR) for samsung electronics co., ltd., Seangwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaejin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hojune JEON of Suwon-si (KR) for samsung electronics co., ltd., Donghyun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Jeonghun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Wooyeol YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02, E05F15/60
Abstract: a control method of a refrigerator includes: in response to receiving a user input, driving a motor in a forward direction until a first push rod reaches a maximum forward position from a neutral position; performing at least one of stopping the motor or driving the motor in a reverse direction at a first reference driving speed before a predetermined waiting time elapses from when the first push rod reaches the maximum forward position; driving the motor in the reverse direction at a second reference driving speed until the first push rod returns to the neutral position after the predetermined waiting time elapses from when the first push rod reaches the maximum forward position; and changing the predetermined waiting time in response to receiving a user input while the motor is driven in the forward direction until the first push rod reaches the maximum forward position from the neutral position.
20240053090.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Woochul CHO of Suwon-si (KR) for samsung electronics co., ltd., Byungsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhong YU of Suwon-si (KR) for samsung electronics co., ltd., Wanhyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Minseok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/04, F25D23/06, F25D17/06
Abstract: provided is a refrigerator. the refrigerator includes a body including an opening formed in a front surface, a door rotatably coupled to the body and configured to open and close the opening of the body, a refrigerator compartment provided in a first inner space of the body, and a freezer compartment case provided with a freezer compartment to insert into or withdraw from a second inner space of the body that is disposed under the first inner space, and configured to slide in a forward-backward direction between an insertion position at which the freezer compartment case is inserted into the second inner space and closes the freezer compartment and a withdrawal position at which the freezer compartment case is withdrawn from the second inner space and opens the freezer compartment, and a front of the freezer compartment case is covered by the door at the insertion position in a state in which the door closes the opening of the body.
20240053092.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yeongjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyoungsun PARK of Suwon-si (KR) for samsung electronics co., ltd., Huido PARK of Suwon-si (KR) for samsung electronics co., ltd., Minseob YOOK of Suwon-si (KR) for samsung electronics co., ltd., Jisick HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/12, F25C5/18
Abstract: a refrigerator includes: an outer case forming an exterior of the refrigerator; an inner case provided in the outer case and including a first inner wall and a second inner wall opposite to the first inner wall; and an ice maker mounted on the inner case and configured to produce ice, the ice maker including an ice making case and an ice making cover covering an upper side of the ice making case, wherein the ice making case is supported by the first inner wall and the second inner wall, and the ice making cover is detachably coupled to the ice making case and configured to support an item on an upper side of the ice making cover.
20240053093.REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungjun CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyekyoung AN of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun SON of Suwon-si (KR) for samsung electronics co., ltd., Sangmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jin JEONG of Suwon-si (KR) for samsung electronics co., ltd., Yangyeol GU of Suwon-si (KR) for samsung electronics co., ltd., Yongman SEO of Suwon-si (KR) for samsung electronics co., ltd., Woochul CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/12, F25C5/20, F25D23/02
Abstract: disclosed herein is a refrigerator. the refrigerator includes a body provided to form a storage compartment, a door rotatably mounted on the body, a dispenser provided in the door, an ice maker located in the storage compartment, a dispenser hose provided to be connectable to the dispenser, an ice maker hose provided to be connectable to the ice maker, and a hose guide located inside the door to accommodate the dispenser hose and the ice maker hose.
Inventor(s): Seongkwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Minho Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyungsun Ryu of Suwon-si (KR) for samsung electronics co., ltd., Cheolmin Park of Suwon-si (KR) for samsung electronics co., ltd., Jaemoo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R27/08, G01R35/00, G01R31/28
Abstract: an apparatus for testing an image sensor includes a load resistor, a first switch configured to be electrically connected to a first signal line of a device under test and a first end of the load resistor, a second switch configured to be electrically connected to a second signal line of the device under test and a second end of the load resistor, a first parametric measuring unit electrically connected to the first switch, and a second parametric measuring unit electrically connected to the second switch. at least one of the first parametric measuring unit and the second parametric unit is configured to correct an error of the load resistor during a testing operation of an output voltage of the device under test.
Inventor(s): Gibong LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungok Yu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/28
Abstract: a wafer test system includes: a first heat source unit including a first refrigerant having a first temperature range; a second heat source unit including a second refrigerant having a second temperature range; a wafer chuck to support a wafer, which: a heating member to heat the wafer, and a channel to circulate the first refrigerant and the second refrigerant; a first supply line connected to the first heat source unit, the first supply line to circulate and supply the first refrigerant to the channel; a second supply line connected to the second heat source unit, the second supply line to circulate and supply the second refrigerant to the channel; and a controller to selectively control supply of the first refrigerant and the second refrigerant based on a target temperature for testing the wafer on the wafer chuck.
Inventor(s): Sungdo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jong-Sok KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Young Rae CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/35, G01S13/536, G01S13/931, G01S13/58
Abstract: a radar signal processing method includes: extracting a first chirp sequence signal of a first carrier frequency and a second chirp sequence signal of a second carrier frequency from a radar signal received through an array antenna in a radar sensor; generating a first range-doppler map by performing frequency conversion on the first chirp sequence signal; detecting a first target cell corresponding to a first target in the first range-doppler map; determining a first ambiguous doppler velocity of the first target based on first frequency information of the first target cell; determining a first range of an unambiguously measurable doppler velocity through the first chirp sequence signal; estimating second ambiguous doppler velocities based on the first ambiguous doppler velocity and the first range; and determining a doppler velocity of the first target by performing partial frequency conversion on the second chirp sequence signal based on the second ambiguous doppler velocities.
Inventor(s): Saifeng Ni of Santa Clara CA (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Priyabrata Parida of Garland TX (US) for samsung electronics co., ltd., Anum Ali of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S13/62, G06F3/01, G01S7/28
Abstract: a method includes obtaining a stream of radar data into a sliding input data window composed of recent radar frames from the stream. each radar frame within the data window includes features selected from a predefined feature set and at least one of time-velocity data or time angle data. the method includes, for each radar frame within the data window, receiving a binary prediction indicating whether the radar frame includes a gesture end. the method includes in response to the binary prediction indicating that the radar frame includes the gesture end, triggering an early stop (es) checker to determine whether an es condition is satisfied. determining whether the es condition is satisfied comprises determining whether a noise frames condition and a valid activity condition are satisfied. the method includes in response to a determination that the es condition is satisfied, triggering a gesture classifier to predict a gesture type.
Inventor(s): Sungdo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byung Kwan KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/931, G01S7/04, G01S13/72, G01S13/89
Abstract: a radio detection and ranging (radar) signal processing device obtains radar data by compensating for a change in a carrier frequency of a sensed radar signal, and outputs a radar image map based on the obtained radar data. the radar signal processing method includes obtaining a beat frequency signal based on a radar transmission signal generated based on a frequency modulation model and a radar reflection signal obtained from the radar transmission signal being reflected from an object, and generating radar data by compensating the beat frequency signal for a carrier frequency change by the frequency modulation model.
Inventor(s): Raul H. ETKIN of Sunnyvale CA (US) for samsung electronics co., ltd.
IPC Code(s): G01S19/29, H04B17/318
Abstract: a system and a method are disclosed for handling outages in a global navigation satellite system receiver. in some embodiments, the method includes: determining that a measure of combined signal level is less than a threshold, the measure of combined signal level being a measure of a signal level on a first channel of a global navigation satellite system receiver and measure of a signal level on a second channel of the global navigation satellite system receiver; and opening a tracking loop on a third channel of the global navigation satellite system receiver.
Inventor(s): Hyunmo YANG of Suwon-si (KR) for samsung electronics co., ltd., Gyeongbeom Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonggyu Park of Suwon-si (KR) for samsung electronics co., ltd., Sungkwang Yang of Suwon-si (KR) for samsung electronics co., ltd., Junwhon Uhm of Suwon-si (KR) for samsung electronics co., ltd., Geonho Yoon of Suwon-si (KR) for samsung electronics co., ltd., Gisoo Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B7/12
Abstract: a wearable electronic device includes an adjustment structure configured to adjust a distance between a first lens and a second lens. a user may wear the wearable electronic device and adjust an inter-lense distance so that there is a good match with the positions of their own eyes. the adjustment structure may include a lever, a first adjustment gear configured to be engaged with a first gear in a first position of the lever, a second adjustment gear configured to be engaged with the first gear and a second gear in a second position of the lever, and a third adjustment gear configured to be engaged with the second gear in a third position of the lever. the user may move the lever in or out to engage a different gear and then rotate the lever to adjust the inter-lense distance.
Inventor(s): Dongyoung Song of Suwon-si (KR) for samsung electronics co., ltd., Seungwan Jeon of Suwon-si (KR) for samsung electronics co., ltd., Kichrl Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03B43/00
Abstract: methods of adjusting an image sensor may be provided. a test image of a test chart including an evaluation area may be obtained using the image sensor. the evaluation area may have a shape of a circle, wherein the evaluation area includes first through nth unit areas arranged in a rotational direction around the circle, and wherein each of the first through nth unit areas has a different level of brightness. a signal-to-noise ratio (snr) may be calculated for each of the first through nunit areas based on the test image of the test chart. a setting of the image sensor may be adjusted based on calculating the signal-to-noise ratio for each of the first through nunit areas.
20240053764.ROBOT AND CONTROLLING METHOD THEREOF_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seungbeom HAN of Suwon-si (KR) for samsung electronics co., ltd., Jinwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Keunchan OH of Suwon-si (KR) for samsung electronics co., ltd., Aron BAIK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/02
Abstract: a robot includes: at least one memory storing first map data corresponding to a first region of a specific space; a distance sensor configured to acquire distance data while the robot travels in the specific space; and at least one processor operatively connected to the at least one memory and the distance sensor. the at least one processor is configured to: based on second map data acquired based on the distance data, compare the first map data and the second map data and generate a comparison result, and based on identifying, based on the comparison result, that an error does not exist in the second map data and that the second map data comprises information on a second region, update the first map data with the second map data.
Inventor(s): Hyung-Min Lee of Seoul (KR) for samsung electronics co., ltd., Hyunjun Park of Seoul (KR) for samsung electronics co., ltd., Woojoong Jung of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G05F1/575, G05F1/565, G05F3/24
Abstract: a low dropout (ldo) regulator includes: one or more power transistors configured to dispose between an input node and an output node, wherein the input node is a node to which an input voltage is applied and the output node is a node from which an output voltage is output; a voltage comparing unit configured to generate a comparative signal based on a difference between the output voltage and a first reference voltage; a digital control unit configured to generate a control signal for gating of the one or more power transistors in response to the comparative signal; and a gate driving unit configured to output a gating signal for the one or more power transistors in response to the control signal, wherein the gating signal is corresponding to one of the input voltage and a negative of the input voltage.
Inventor(s): Sejin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwan JEONG of Suwon-si (KR) for samsung electronics co., ltd., Wanju SIN of Suwon-si (KR) for samsung electronics co., ltd., Jinwook LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G02B1/18, G02B1/04, G02B1/12, G06F1/18
Abstract: disclosed is an electronic device which includes a housing having a protective layer formed thereon. the electronic device according to embodiments of the present invention may include a housing which covers at least a part of the outer surface. the housing includes a transparent substrate, a multilayer structure formed on the surface of the transparent substrate and including multiple layers which are stacked such that the respective adjacent layers have different refractive indexes and an aluminum oxide layer formed on the multilayer structure. the transparent substrate may include a glass material.
Inventor(s): Jongkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Giyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
Abstract: an electronic device includes a display including a first area, a second area, and a folding area that is between the first area and the second area, a first housing supporting the first area, a second housing supporting the second area, and a hinge assembly foldably connecting the first housing and the second housing to be foldable with respect to each other between a folded state in which the first area and the second area face each other, and unfolded state in which the first area and the second area do not face each other, where the hinge assembly includes a hinge bracket including two fixed cams and two first rail structures, the hinge bracket defining two hinge axes and two hinge structures each rotatably connected to a respective one of the two first rail structures.
20240053803.FOLDABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sinyoung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
Abstract: an electronic device may include a hinge structure and a housing connected to the hinge structure. the hinge structure may include a shaft member and an arm structure connected to the shaft member and the housing such that the housing is rotatable. a guide hole, which extends in a direction substantially perpendicular to the rotation axis of the housing, may be formed in the housing. the arm structure may include a protruding portion accommodated in the guide hole. the protruding portion may slidably move inside the guide hole in accordance with the rotation of the housing. another embodiment identified through the specification is possible.
Inventor(s): Gyehyung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/26
Abstract: provided are an integrated circuit capable of classifying a workload of a core based on monitored data and performing a dynamic voltage and frequency scaling (dvfs) operation based on the classified workload, and an operating method of the integrated circuit. the integrated circuit includes at least one core, a shared buffer which receives a request from the at least one core, access an external memory according to the request, and receive a response from the external memory, a monitor which monitors the shared buffer to obtain a buffer capacity of the shared buffer and a response waiting time, and a dvfs controller configured to classify a workload of the at least one core.
Inventor(s): Youngrog KIM of Suwon-si (KR) for samsung electronics co., ltd., Moonjeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonkyu SUNG of Suwon-si (KR) for samsung electronics co., ltd., Taeyang SONG of Suwon-si (KR) for samsung electronics co., ltd., Jonghyuck YOO of Suwon-si (KR) for samsung electronics co., ltd., Changhan LEE of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunju HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0484, G06F3/04815
Abstract: various embodiments of the disclosure relate to a device and method for communicating using an avatar in a virtual space. to that end, an electronic device may display a first avatar corresponding to a user of the electronic device in a virtual space, display a first graphic user interface (gui) resource including at least one device capable of establishing connection with the electronic device and, based on receiving an input on the first gui resource, display a device icon corresponding to the input device in a matching position of the first avatar.
Inventor(s): Wonseb Jeong of Suwon-si (KR) for samsung electronics co., ltd., Yang Seok Ki of San Jose CA (US) for samsung electronics co., ltd., Jungmin Seo of Seongnam-si (KR) for samsung electronics co., ltd., Beomkyu Shin of Seongnam-si (KR) for samsung electronics co., ltd., Sangoak Woo of Anyang-si (KR) for samsung electronics co., ltd., Younggeon Yoo of Seoul (KR) for samsung electronics co., ltd., Chanho Yoon of Seoul (KR) for samsung electronics co., ltd., Myungjune Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/0802
Abstract: a storage device includes a nonvolatile memory device and a storage controller. the storage controller includes a multi-protocol host interface circuit that receives a first-type request including a first logical address from an external host and transmits/receives data corresponding to the first-type request with the external host by a block unit. additionally, the multi-protocol host interface circuit receives a second-type request including a first physical address from the external host and transmits/receives data corresponding to the second-type request with the external host by a unit smaller than the block unit. a mapping cache manager manages an address translation table cache, sends an address translation request including the first physical address to the external host, and receives a response including mapping information corresponding to the first physical address from the external host.
Inventor(s): Hyung-Dal KWON of Suwon-si (KR) for samsung electronics co., ltd., Seongbeom KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/50
Abstract: an apparatus with computing system control includes: a receiver configured to receive an operation mode for controlling a plurality of components constituting a computing system; and a processor configured to: determine a parameter for controlling the plurality of components based on the operation mode, a time limit for processing an operation of the plurality of components, and an operation time of the plurality of components; distribute a workload for the plurality of components based on the parameter; and process the operation based on the distributed workload.
Inventor(s): Mehran ELYASI of St. Paul MN (US) for samsung electronics co., ltd., Zongwang LI of Dublin CA (US) for samsung electronics co., ltd., Rekha PITCHUMANI of Oak Hill VA (US) for samsung electronics co., ltd., Tong ZHANG of Mountain View CA (US) for samsung electronics co., ltd., Heekwon PARK of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F17/16, G06F9/30
Abstract: a system and method for inference using an embedding table. in some embodiments, the method includes forming a culled index vector including a first index, and requesting a weight vector corresponding to the first index. the first index may be a first element of a first index vector, the first index being culled within the culled index vector.
Inventor(s): Jaeyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Sachin Pundkar of Bengaluru (IN) for samsung electronics co., ltd., Somraj Mani of Bengaluru (IN) for samsung electronics co., ltd., Surendra Singh of Bengaluru (IN) for samsung electronics co., ltd., Tushar Vrind of Bengaluru (IN) for samsung electronics co., ltd., Venkata Raju Indukuri of Bengaluru (IN) for samsung electronics co., ltd., Danby Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/64
Abstract: a canary update method according to some embodiments is disclosed. the canary update method includes executing, by a processor configured to process tasks including the canary, computer program instructions to perform operations including extracting, by a processor, a first value from an array including n values, setting the canary to the first value, determining that the canary is updated based on a canary flag value of a first task, extracting, when determined that the canary is updated, a second value from the array, and updating the canary of the first task to the second value. the processor is configured to access a memory through a mapping circuit, and the mapping circuit includes mapping information between a physical memory region in the memory corresponding to the first task and a virtual memory region associated with the mapping circuit.
Inventor(s): SUBIN KIM of SUWON-SI (KR) for samsung electronics co., ltd., JUNSU JEON of SUWON-SI (KR) for samsung electronics co., ltd., JAEHYUN KANG of SUWON-SI (KR) for samsung electronics co., ltd., BYUNGMOO KIM of SUWON-SI (KR) for samsung electronics co., ltd., JOONGWON JEON of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/398, G06F30/392, G06F30/394
Abstract: a method of manufacturing a semiconductor device includes designing a semiconductor device layout using a design rule manual (drm), in which design rules are recorded, and performing failure evaluation of a failure including at least one gate structure failure of a semiconductor device manufactured using the designed semiconductor device layout. the method further includes updating the drm by updating the design rules recorded in the drm, based on a result of the failure evaluation, redesigning the semiconductor device layout using the updated drm, and manufacturing the semiconductor device using the redesigned semiconductor device layout.
Inventor(s): Suhel Jaber of San Jose CA (US) for samsung electronics co., ltd., Brendon Christopher Beachy Eby of Chicago IL (US) for samsung electronics co., ltd., Sai Ajay Modukuri of San Francisco CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/08, G06N3/048, G06N3/0455
Abstract: a method includes obtaining an input containing multiple tokens. the method also includes processing the input using a machine learning model. processing the input includes performing attention over both (i) multiple dimensions of the tokens contained in the input and (ii) multiple dimensions of embedding vectors used to represent the tokens contained in the input so that different dimensions of each of at least some of the tokens are weighted differently. in addition, the method includes generating an output embedding vector for a query token of the multiple tokens based on the attention.
Inventor(s): Mete OZAY of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): G06N20/00
Abstract: broadly speaking, embodiments of the present techniques provide a method and system for providing personal machine learning, ml, models. in particular, the present application provides a system for developing a training personal and personalised models to improve user experience.
Inventor(s): Sanghun PARK of Suwon-si (KR) for samsung electronics co., ltd., Wonkyun KIM of Sunwon-si (KR) for samsung electronics co., ltd., Hyesu YEOM of Sunwon-si (KR) for samsung electronics co., ltd., Seongmin JOE of Sunwon-si (KR) for samsung electronics co., ltd., Hyunwoo CHUN of Sunwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06Q30/0251
Abstract: an electronic device includes a communicator; at least one memory storing information associated with a neural network model for predicting a target device for each time zone from a plurality of time zones for an advertising content; and at least one processor configured to: acquire, from a plurality of external devices, data corresponding to a use history of a user; acquire, based on the data corresponding to the use history, a plurality of feature values corresponding to a respective external device from the plurality of external devices by allocation of each feature value of the plurality of feature values to a respective time zone from the plurality of time zones, input the plurality of feature values into the neural network model, and acquire score information for a plurality of probabilities that the plurality of external devices are related to a label by allocation of each probability of the plurality of probabilities to a respective time zone from the plurality of time zones, identify, based on the score information, a plurality of target devices for providing the advertising content for each of the plurality of time zones, and control the communicator to transmit information on the advertising content to the plurality of target devices.
Inventor(s): Jongseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Pilkyu Park of Suwon-si (KR) for samsung electronics co., ltd., Kwangpyo Choi of Suwon-si (KR) for samsung electronics co., ltd., Jaehwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngo Park of Suwon-si (KR) for samsung electronics co., ltd., Chaeeun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06V10/77, G06V10/56, G06T7/00
Abstract: an electronic apparatus includes: a display; and a processor configured to: obtain a first image, identify an application used to obtain the first image, select neural network setting information corresponding to the identified application from among a plurality of pieces of neural network setting information, obtain a second image by artificial intelligence (ai)-upscaling the first image by using an upscaling neural network to which the selected neural network setting information is applied, and output the obtained second image via the display.
Inventor(s): Geonseok SEO of Suwon-si (KR) for samsung electronics co., ltd., Sehwan KI of Seoul (KR) for samsung electronics co., ltd., Jae Seok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Insoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyong Euk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T5/50
Abstract: a processor-implemented method includes: obtaining a plurality of image frames acquired for a scene within a predetermined time; determining loss values respectively corresponding to the plurality of image frames; determining a reference frame among the plurality of image frames based on the loss values; and generating a final image of the scene based on the reference frame.
Inventor(s): Biplab Ch Das of Bengaluru (IN) for samsung electronics co., ltd., Kiran Nanjunda Iyer of Bengaluru (IN) for samsung electronics co., ltd., Shouvik Das of Bengaluru (IN) for samsung electronics co., ltd., Himadri Sekhar Bandyopadhyay of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T7/10, G06V10/25, G06V10/56
Abstract: in a method of encoding of temporal information for stable video instance segmentation and video object detection, a neural network analyzes an input frame of a video to output a prediction template. the prediction template includes either segmentation masks of objects in the input frame or bounding boxes surrounding objects in the input frame. the prediction template is then colour coded by a template generator. the colour coded template, along with a frame subsequent to the input frame, is supplied to a template encoder such that temporal information from the input frame is encoded into the output of the temporal encoder.
Inventor(s): Kinam KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaehyoung YOO of Suwon-si (KR) for samsung electronics co., ltd., Junsang YU of Suwon-si (KR) for samsung electronics co., ltd., Sangwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyong Euk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T1/20, G06V10/82
Abstract: a neural network-based image processing method and apparatus are provided. a method includes receiving input image data comprising original image data, when a current image processing mode is an independent processing mode, generating first intermediate image data by executing a main neural network based on the original image data and by not executing an auxiliary neural network based on the original image data, when the current image processing mode is in a cooperative processing mode, generating second intermediate image data by determining an auxiliary parameter by executing the auxiliary neural network based on the original image data and by executing the main neural network based on the original image data and based on the auxiliary parameter, and generating output image data by operating an image signal processing (isp) block based the first intermediate image data or the second intermediate image data according to the current image processing mode.
Inventor(s): Hyunjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Minseoung WOO of Suwon-si (KR) for samsung electronics co., ltd., Kyunghwa KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunho KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T11/00, G06T3/40
Abstract: an electronic device according to various embodiments may include a display, a sensor configured to detect a distance from an actual item in a space, a camera configured to capture an image of a foreground, a memory configured to store a plurality of instructions, and a processor, wherein the plurality of instructions, when executed by the processor, cause the electronic device to analyze a first space using the camera and the sensor, store information of the first space and information related to a configuration of an object placed by a user in the first space, analyze a second space using the camera and the sensor, relocate the configuration of the object, based on information of the analyzed second space, and display the object having been relocated. various other embodiments are possible.
Inventor(s): Seokhwan Jang of Suwon-si (KR) for samsung electronics co., ltd., Nahyup KANG of Suwon-si (KR) for samsung electronics co., ltd., Jiyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyewon MOON of Suwon-si (KR) for samsung electronics co., ltd., Donghoon SAGONG of Suwon-si (KR) for samsung electronics co., ltd., Minjung SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T15/08, G06N3/08, G06T15/06
Abstract: disclosed are a method and device for representing rendered scenes. a data processing method of training a neural network model includes obtaining spatial information of sampling data, obtaining one or more volume-rendering parameters by inputting the spatial information of the sampling data to the neural network model, obtaining a regularization term based on a distribution of the volume-rendering parameters, performing volume rendering based on the volume-rendering parameters, and training the neural network model to minimize a loss function determined based on the regularization term and based on a difference between a ground truth image and an image that is estimated according to the volume rendering.
Inventor(s): Jinman KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06V10/141
Abstract: according to various embodiments, an augmented reality device may comprise: at least one camera, a communication circuit, a display, and at least one processor, wherein the at least one processor is configured to: acquire, through the at least one camera, a first image including a pattern of light emitted from an electronic device; receive information on the pattern from the electronic device through the communication circuit; identify at least one of the tilt and position of a display area of the electronic device based on the first image and information on the pattern; and display a virtual object on the display based on at least one of the tilt and position of the display area of the electronic device.
Inventor(s): Jakub Hoschiowics of Warszawa (PL) for samsung electronics co., ltd., Adrian Wisniewski of Warszawa (PL) for samsung electronics co., ltd.
IPC Code(s): G06V20/40, G06F40/40, G06F40/284
Abstract: disclosed is a display apparatus. the display apparatus includes a display; and one or more processors configured to, based on a user input being received while a video is provided through the display, obtain at least one passage by inputting information on the user input and the video to a first encoder, obtain a text by using a part of a plurality of tokens included in the at least one passage by inputting the video, the information on the user input, and the at least one passage into a neural network model, and output the obtained text.
Inventor(s): Woojae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V40/13, G06F3/041, G06F3/044, G06K19/07
Abstract: a fingerprint sensor package includes a first substrate including a core insulating layer including first and second surfaces opposing each other and having a through-hole penetrating through the first surface and the second surface, a first bonding pad along a circumference of the through-hole on the first or second surface, and an external connection pad on an edge of the second surface, a second substrate having a third surface including a sensing region and a peripheral region surrounding the sensing region, and a fourth surface opposing the third surface, the second substrate including a second bonding pad along an edge of the third or fourth surface and bonded to the first bonding pad, and covering the through-hole, a controller chip on the fourth surface, and a molded layer on the second surface of the core insulating layer, covering the controller chip, and spaced apart from the external connection pad.
Inventor(s): Sungjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Seungjun JEONG of Suwon-si (KR) for samsung electronics co., ltd., Junghyun YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/3275
Abstract: a display apparatus for reducing a booting time includes: a display panel including a plurality of pixels; a timing controller configured to drive the display panel; and a at least one controller configured to control the timing controller to perform a sensing process for sensing electrical characteristics of the plurality of pixels based on power-on of the display panel, wherein the at least one controller is further configured to determine whether to perform the sensing process or skip the sensing process based on a power-off period of the display panel before the display panel is powered on.
Inventor(s): Doyoung KIM of Suwon (KR) for samsung electronics co., ltd., Junghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/34
Abstract: provided is a display apparatus including: a display panel, a backlight unit configured to output light, a backlight driver configured to drive the backlight unit by identifying a dimming section of the backlight unit corresponding to a variable refresh rate of an image, based on reception of a sync signal, a memory storing at least one instruction, and at least one processor configured to execute the at least one instruction. the display apparatus is configured to identify a first output frequency of a sync signal that varies based on the variable refresh rate of the image, output the sync signal to the backlight driver in a second output frequency that is a higher frequency than the first output frequency, based on predetermined information, and drive the backlight unit corresponding to the variable refresh rate of the image, based on receiving the sync signal in the second output frequency.
Inventor(s): Doyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Battushig GANBOLD of Suwon-si (KR) for samsung electronics co., ltd., Seungik KIM of Suwon-si (KR) for samsung electronics co., ltd., Heehyo YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/36, G09G3/34, G06F3/14
Abstract: a display apparatus includes: an external input port which is connectable with an external apparatus; a power supply; a display; and at least one processor configured to: obtain first power consumed in the display based on brightness information of the display, determine second power suppliable to the external input port based on the first power consumed and supply power of the power supply, receive information about third power that is configured to supply power to an external apparatus connected to the external input port from the external apparatus, determine fourth power supplied to the external input port based on the second power and the information about the third power, determine an over current protection (ocp) value based on the fourth power, and stop power supply to the external apparatus based on a current value supplied to the external input port exceeding the ocp value.
Inventor(s): Cindy Sushen Tseng of Santa Clara CA (US) for samsung electronics co., ltd., Srinivasa Rao Ponakala of Sunnyvale CA (US) for samsung electronics co., ltd., Myungjong Kim of Milpitas CA (US) for samsung electronics co., ltd., Taeyeon Ki of Milpitas CA (US) for samsung electronics co., ltd., Vijendra Raj Apsingekar of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/08, G10L25/51
Abstract: a method includes obtaining an audio input and a location associated with an electronic device. the method also includes generating an audio embedding associated with the audio input. the method further includes determining a first difference between the audio embedding associated with the audio input and an audio embedding associated with a known user. the method also includes determining a second difference between the location associated with the electronic device and a known location associated with the known user. the method further includes generating, using a false trigger mitigation (ftm) system, a probability of the audio input including a false trigger for automatic speech recognition based on the audio input, the first difference, and the second difference. in addition, the method includes determining whether to perform automatic speech recognition based on the probability.
Inventor(s): Younsoo Cheon of Suwon-si (KR) for samsung electronics co., ltd., Jihwa Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyungduk Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/04, G11C11/56
Abstract: a storage device including a non-volatile memory for storing data, a temperature sensor having resistance that changes according to temperature of the temperature sensor, and a temperature measurement circuit including a plurality of transistors, which are turned on or off based on a current of the temperature sensor and have different threshold voltages from one another. the temperature management circuit may be configured to apply a current to the temperature sensor and generate information indicating the temperature of the temperature sensor or indicating damage to the temperature sensor based on an output current obtained from the plurality of transistors.
Inventor(s): Yongsung Cho of Suwon-si (KR) for samsung electronics co., ltd., Inho Kang of Suwon-si (KR) for samsung electronics co., ltd., Insu Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehue Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/24, G11C11/56, G11C16/04, G11C16/26, H01L25/065, H01L23/00, H10B80/00
Abstract: a memory device includes a memory cell array including a plurality of memory cells, and a page buffer circuit including a plurality of page buffer units respectively connected to the plurality of memory cells via a plurality of bit lines, and a plurality of cache latches respectively corresponding to the plurality of page buffer units. each of the plurality of page buffer units includes a pass transistor that is connected to a corresponding sensing node and is driven according to a pass control signal, and the memory device is configured such that in a data sensing period, a sensing node of a selected page buffer unit among the plurality of page buffer units is actively connected to a sensing node of an unselected page buffer unit among the plurality of page buffer units.
Inventor(s): Taekjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Meehyun Lim of Suwon-si (KR) for samsung electronics co., ltd., Sungyeol Kim of Suwon-si (KR) for samsung electronics co., ltd., Junbum Park of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung Yoon of Suwon-si (KR) for samsung electronics co., ltd., Jinyeong Yun of Suwon-si (KR) for samsung electronics co., ltd., Jungchul Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungyong Lim of Suwon-si (KR) for samsung electronics co., ltd., Sunghwi Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/67, H01L21/683
Abstract: a semiconductor equipment monitoring apparatus including a wafer-type sensor inside a process chamber and configured to sense a plasma state inside the process chamber; a light detector and analyzer configured to detect and analyze light sensed by the wafer-type sensor; and a light coupler between the wafer-type sensor and the light detector and analyzer and configured to transmit the light sensed by the wafer-type sensor to the light detector and analyzer. the wafer-type sensor includes a plurality of sensors each comprising a passive element.
20240055286.MODULE TRAY FOR SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taegeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/673
Abstract: a module tray for a semiconductor device includes a case and an insert block. the case includes a base plate, first and second sidewalls extending from opposite sides of the base plate in a vertical direction to define an accommodation space, and first and second fastening grooves respectively formed in inner surfaces of the first and second sidewalls. the first and second fastening grooves have upper ends opened to upper surfaces of the first and second sidewalls, respectively. the insert block has a substrate accommodating space for accommodating a semiconductor substrate. the insert block is detachably inserted into the first and second fastening grooves of the case. the insert block has first and second fastening joints extending in the vertical direction such that the first and second fastening joint are respectively inserted through the upper ends of the first and second fastening grooves.
Inventor(s): Sun Woo KIM of Suwon-si (KR) for samsung electronics co., ltd., Min Hyung KANG of Suwon-si (KR) for samsung electronics co., ltd., Min Seob KIM of Suwon-si (KR) for samsung electronics co., ltd., Chan Geun AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L21/8234
Abstract: a fabricating method for a test element group is provided. the fabricating method for a test element group includes fabricating test areas generated in a scribe lane area, wherein fabricating of the test areas includes forming a plurality of fins protruding in a first direction on a substrate, covering at least some of the plurality of fins with a masking material, and performing selective epitaxial growth by injecting a gas onto the plurality of fins. the gas is not injected onto the at least some of the plurality of fins that are covered with the masking material, such that the epitaxial growth does not occur on the fins covered with the masking material.
Inventor(s): Sojeong HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/18, H01L23/31, H01L23/29
Abstract: a semiconductor package includes a package substrate, a first semiconductor chip and a second semiconductor chip on the package substrate in adjacent, spaced-apart relationship, a first molding member on the package substrate and covering the first semiconductor chip and the second semiconductor chip, and a second molding member on the first molding member. the first molding member includes a first molding portion on the first semiconductor chip and a second molding portion between the first and second semiconductor chips. a ratio per unit volume of filler material included in the first molding portion is greater than a ratio per unit volume of filler material included in the second molding portion.
20240055330.SEMICONDUCTOR DEVICE PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Younghwan PARK of Seongnam-si (KR) for samsung electronics co., ltd., Jongseob KIM of Seoul (KR) for samsung electronics co., ltd., Jaejoon OH of Seongnam-si (KR) for samsung electronics co., ltd., Soogine CHONG of Seoul (KR) for samsung electronics co., ltd., Sunkyu HWANG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/495, H01L21/48
Abstract: a semiconductor device package includes a lead frame, a semiconductor device including a first face connected to the lead frame, a second face that faces the first face, a gate pad, a drain pad, and a source pad, the gate pad exposed on the second face of the semiconductor, the drain pad exposed on the second face of the second face, and the source pad exposed on the second face, a gate clip connected to the gate pad, a drain clip connected to the drain pad, a source clip connected to the source pad, the source clip connected to the lead frame, and a molding that seals the lead frame, the semiconductor device, the source clip, the drain clip, and the gate clip.
20240055335.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangwook PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Yoonseok SEO of Suwon-si (KR) for samsung electronics co., ltd., Sangnam JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/538, H01L23/00, H10B80/00
Abstract: provided is a semiconductor package including a base substrate, and a first package and a second package mounted apart from each other on an upper surface of the base substrate in a horizontal direction, wherein the second package includes, on each surface thereof, connection pads corresponding to a package ball map including cells, arranged in a plurality of rows and a plurality of columns, each of which has one signal arranged therein, wherein the package ball map includes a first signal, or a data signal, arranged in at least some cells among the cells of the package ball map, and a second signal, or a command or address signal, and the first signal is arranged apart from the second signal.
Inventor(s): Hwan Young CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seok Hyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jung Min KO of Suwon-si (KR) for samsung electronics co., ltd., Seok Geun AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31, H01L23/00, H01L23/535
Abstract: a semiconductor package includes a first semiconductor chip having a first top surface and an opposite first bottom surface, first pads on the first top surface, each having a first width and a first height, second pads on the first top surface further outward from a center of the first semiconductor chip, each having a second width less than the first width and a second height greater than the first height. the semiconductor package further includes a second semiconductor chip having a second bottom surface which faces the first top surface and an opposite second top surface, third pads on the second bottom surface which are connected to the first pads, and fourth pads on the second bottom surface which are connected to the second pads. the second bottom surface is convex.
20240055338.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byungho KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngchan KO of Suwon-si (KR) for samsung electronics co., ltd., Gyeongho KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongkoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Myungdo CHO of Suwon-si (KR) for samsung electronics co., ltd., Sangseok HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31, H01L23/00
Abstract: a fan-out semiconductor package includes a wiring substrate including a first fan-in region, a fan-out region surrounding the first fan-in region, and a second fan-in region, a first fan-in chip structure, a second fan-in chip structure, a first redistribution structure including first redistribution elements disposed on a bottom surface of the wiring substrate, and a second redistribution structure disposed on a top surface of the wiring substrate, and a chip wiring structure formed on a top surface of the second chip, and the second redistribution structure includes a second redistribution layer extending to the first fan-in region and the fan-out region, a plurality of second redistribution vias integrally formed with the second redistribution layer and extending downward, and a seed layer surrounding the second redistribution layer and bottom surfaces of the plurality of second redistribution vias.
20240055339.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hwanjoo Park of Suwon-si (KR) for samsung electronics co., ltd., Sunggu Kang of Suwon-si (KR) for samsung electronics co., ltd., Jaechoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Taehwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungho Mun of Suwon-si (KR) for samsung electronics co., ltd., Jonggyu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/367, H01L25/065
Abstract: a semiconductor package includes a first redistribution structure, a first semiconductor package on the first redistribution structure, the first semiconductor package including a first semiconductor chip which includes a first device layer and a first semiconductor substrate including a through electrode, a second semiconductor chip which is on the first semiconductor chip and includes a second device layer and a second semiconductor substrate, and a molding member surrounding the first semiconductor chip, a second redistribution structure on an upper surface of the molding member, and a second semiconductor package on the second redistribution structure, the second semiconductor package including a third semiconductor chip, wherein the second semiconductor chip is apart from the second semiconductor package in a horizontal direction, and an upper surface of the second semiconductor chip is higher than the upper surface of the molding member.
Inventor(s): Kwangok Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31
Abstract: an electronic package includes a redistribution wiring layer having redistribution wiring with a redistribution pad, and a bonding pad on the redistribution pad of the redistribution wiring. the bonding pad includes first, second, and third plating patterns. the first plating pattern is on the redistribution pad, and the first plating pattern includes a first material. moreover, the first plating pattern has an inclined sidewall so that a diameter of the first plating patter decreases with increasing distance from the redistribution pad so that a first diameter of the first plating pattern adjacent the redistribution pad is greater than a second diameter of the first plating pattern spaced apart from the redistribution pad. the second plating pattern is on the first plating pattern, and the second plating pattern includes a second material different than the first material. the third plating pattern is on the second plating pattern, and the third plating pattern includes a third material different than the second material. moreover, the second and third plating patterns have a same diameter that is no greater than the second diameter of the first plating pattern.
Inventor(s): Jongyoun KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H05K1/11, H05K1/18
Abstract: provided is a connection structure for a semiconductor package which includes: a first passivation layer having an opening; a first conductive pattern that penetrates the first passivation layer and protrudes upwardly from the first passivation layer; a second passivation layer on the first passivation layer and covering the first conductive pattern; a second conductive pattern on the second passivation layer and electrically connected to the first conductive pattern; a third passivation layer on the second passivation layer and covering the second conductive pattern; and an external terminal in the opening and electrically connected to the first conductive pattern, wherein the first conductive pattern is thicker than the second conductive pattern.
20240055362.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yonghwan Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/538, H01L25/10
Abstract: a semiconductor package includes a redistribution structure including a first redistribution layer, a semiconductor chip on the redistribution structure and having a contact pad electrically connected to the first redistribution layer, a vertical connection conductor on the redistribution structure and electrically connected to the first redistribution layer, a molding portion disposed on the redistribution structure, a second redistribution layer disposed on the molding portion, connected to the vertical connection conductor, and having a plurality of first pads, each of the plurality of first pads having an alignment hole, a plurality of second pads respectively disposed on the plurality of first pads and having a side portion covering an inner sidewall of the alignment hole, the alignment hole having an inner space surrounded by the side portion, and a protective insulating layer covering the second redistribution layer, and having a plurality of contact openings respectively exposing the plurality of second pads.
20240055364.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon Kang of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/31, H01L23/538, H01L25/065, H01L23/00
Abstract: a semiconductor package includes a first semiconductor chip; an encapsulant covering at least a portion of the first semiconductor chip; insulating layers provided on the encapsulant, each of the insulating layers being transparent or translucent; and wiring layers provided on the encapsulant, the wiring layers being partially covered by the insulating layers, wherein an outermost insulating layer of the insulating layers comprises a first region and a second region, a color of the first region is different from a color of the second region, the second region surrounds the first region, and at least one marking pattern comprising at least one step portion is provided in the first region of the outermost insulating layer.
Inventor(s): Ae-Nee Jang of Suwon-si (KR) for samsung electronics co., ltd., Jihoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungduk Baek of Suwon-si (KR) for samsung electronics co., ltd., Hyuekjae Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H10B80/00
Abstract: a semiconductor device includes a substrate and a lower die on the substrate. the lower die includes a first semiconductor substrate having a first device region and a first edge region therein, a first semiconductor element on the first device region, a first pad on the first device region and on the first semiconductor element, and a first interconnection structure connecting the first semiconductor element to the first pad. the first interconnection structure includes a first signal pattern on the first device region and connected to the first semiconductor element, a second signal pattern on the first device region and directly connected to the first pad, and a first dummy pattern at the same level as the second signal pattern and disposed on the first edge region. an upper die is provided, which is bonded to the lower die such that the first pad of the lower die is in contact with a second pad of the upper die.
20240055373.SEMICONDUCTOR PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Tae-Ho Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H01L23/48, H01L23/538, H10B80/00
Abstract: provided is a semiconductor package. the semiconductor package may comprise a first die, a second die on the first die, and connection terminals, the first die comprises: a first silicon substrate that has a lower side and an upper side opposite to the lower side, first through vias, first chip pads, and a first dummy pattern on the upper side of the first silicon substrate, the first dummy pattern having a grid shape from a plan view and at least partially surrounding each of the first chip pads, the second die comprises: a second silicon substrate that has a lower side and an upper side opposite to the lower side, and second through vias, wherein the connection terminals and the first chip pads are in contact with each other and are electrically connected, respectively, and wherein the first dummy pattern includes a metal film or a polymer film.
Inventor(s): Yongho KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoon AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/768, H01L25/18, H01L25/065, H01L21/02
Abstract: a semiconductor chip and a semiconductor package, the semiconductor chip includes a semiconductor substrate; a through electrode penetrating the semiconductor substrate; a bonding pad including a first conductive pad connected to the through electrode, and a second conductive pad on a central portion of the first conductive pad, an outer portion of the first conductive pad protruding outwardly relative to a sidewall of the second conductive pad; and a pad insulating layer on the semiconductor substrate and surrounding a sidewall of the first conductive pad and the sidewall of the second conductive pad.
Inventor(s): HASEOB SEONG of SUWON-SI (KR) for samsung electronics co., ltd., AENEE JANG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H10B80/00, H01L25/065
Abstract: a semiconductor package includes; a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. the first semiconductor chip includes; a first substrate, a first bonding pad on a first surface of the first substrate, and a first passivation layer on the first surface of the first substrate exposing at least a portion of the first bonding pad. the second semiconductor chip includes; a second substrate, a second insulation layer on a front surface of the second substrate, a second bonding pad on the second insulation layer, a first alignment key pattern on the second insulation layer, and a second passivation layer on the second insulation layer, covering at least a portion of the first alignment key pattern, and exposing at least a portion of the second bonding pad, wherein the first bonding pad and the second bonding pad are directly bonded, and the first passivation layer and the second passivation layer are directly bonded.
Inventor(s): Changbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Cheonan Lee of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H10B43/35, H10B41/35
Abstract: a semiconductor device includes: a first structure including a first substrate and a peripheral circuit disposed on the first substrate; and a second structure including a common source plate and a cell stack disposed on the common source plate and including a plurality of gate electrodes and channel structures, wherein the cell stack includes a plurality of cell blocks including a plurality of main blocks and at least one dummy block disposed at one side of the plurality of main blocks, wherein the common source plate includes a main common source line region and a dummy common source line region, wherein the main common source line region overlaps the plurality of main blocks, and the dummy common source line region is separated from the main common source line region and overlaps the at least one dummy block by being electrically isolated from the at least one dummy block.
20240055394.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): DAEHO LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/03, H01L23/00, H01L23/31, H01L23/538, H01L25/00, H01L21/56
Abstract: a semiconductor package includes a package substrate, a first chip structure mounted on the package substrate, a first semiconductor chip mounted on the first chip structure, and a first molding layer that surrounds the first chip structure and the first semiconductor chip on the package substrate. the first chip structure includes a second semiconductor chip, a second molding layer on a lateral surface of the second semiconductor chip, a first redistribution layer on the second semiconductor chip and the second molding layer, and a first through electrode on a side of the second semiconductor chip and connected to the first redistribution layer.
Inventor(s): Manho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungmin SEO of Suwon-si (KR) for samsung electronics co., ltd., Kwangseob SHIN of Suwon-si (KR) for samsung electronics co., ltd., Woosin CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junghwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H10B80/00
Abstract: a buffer chip is wire-bonded to memory dies. a semiconductor package includes a semiconductor die stack, a first set of wire bonds connected to a first set of semiconductor dies, a second set of wire bonds connected to a second set of semiconductor dies, and the buffer chip. the second set of semiconductor dies are on the first set of semiconductor dies. the buffer chip includes a first set of die bond pads being close to the semiconductor die stack, and a second set of die bond pads being distant from the semiconductor die stack. the second set of wire bonds extends to the first set of die bond pads of the buffer chip, and the first set of wire bonds extends to the second set of die bond pads of the buffer chip.
20240055398.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Choong Bin Yim of Suwon-si (KR) for samsung electronics co., ltd., Ji-Yong Park of Suwon-si (KR) for samsung electronics co., ltd., Jin-Woo Park of Suwon-si (KR) for samsung electronics co., ltd., Jong Bo Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H10B80/00, H01L23/31, H01L23/498, H01L23/00
Abstract: a semiconductor package includes a first substrate, a memory semiconductor package on a first surface of the first substrate, an adhesive layer between the first surface of the first substrate and the memory semiconductor package, a wire extending from an upper surface of the memory semiconductor package and connected to the first substrate, a logic semiconductor chip on the first surface of the first substrate, a first connection terminal between the first surface of the first substrate and the logic semiconductor chip, and a molding layer, wherein a first height of the memory semiconductor package is smaller than a second height of the logic semiconductor chip, and wherein an uppermost surface of the molding layer and the upper surface of the logic semiconductor chip are coplanar.
20240055403.SEMICONDUCTOR PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changeun Joo of Suwon-si (KR) for samsung electronics co., ltd., Ohguk Kwon of Suwon-si (KR) for samsung electronics co., ltd., Sunjae Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/538, H01L23/31, H01L23/48, H01L23/00
Abstract: a semiconductor package may include a first redistribution substrate, a second redistribution substrate on the first redistribution substrate, a chip stack between the first redistribution substrate and the second redistribution substrate, a first molding layer on the chip stack, and a through electrode extending into the first molding layer and electrically connecting the first redistribution substrate to the second redistribution substrate. the chip stack may include a first semiconductor chip on the first redistribution substrate, the first semiconductor chip including a through via that extends therein, a chip structure including a second semiconductor chip and a second molding layer, the second semiconductor chip being on the first semiconductor chip and electrically connected to the through via, and a third semiconductor chip between the chip structure and the second redistribution substrate, and a side surface of the first semiconductor chip may be coplanar with a side surface of the chip structure.
20240055405.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joo-Young OH of Suwon-si (KR) for samsung electronics co., ltd., Hwan Pil PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L21/56, H01L23/00, H10B80/00
Abstract: a semiconductor package includes a substrate, a first chip stack on the substrate and including a first semiconductor chip, an underfill pattern on a first side of the first chip stack, and a second chip stack on the first chip stack and including a second semiconductor chip. the second chip stack is stacked so as to be offset to the first chip stack. the first chip stack includes a first adhesive layer under the first semiconductor chip and a first chip protection structure on the first semiconductor chip. the second chip stack includes a second adhesive layer under the second semiconductor chip and a second chip protection structure on the second semiconductor chip. an extension portion of the second adhesive layer is on one side of the first chip protection structure, and the underfill pattern extends from the first side of the first chip stack to the extension portion.
Inventor(s): Yeongseon Kim of Suwon-si (KR) for samsung electronics co., ltd., Dohyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Juhyeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyoeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Seonkyung Seo of Suwon-si (KR) for samsung electronics co., ltd., Chajea Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L25/10, H01L23/31, H01L23/00
Abstract: a semiconductor package includes a first semiconductor chip including a first semiconductor device, a second semiconductor chip including a second semiconductor device, and a bonding structure between the first and second semiconductor chips, the bonding structure including a first bonding pad, a first bonding insulating layer, a second bonding pad in contact with the first bonding pad, and a second bonding insulating layer in contact with the first bonding insulating layer. the first bonding pad may include a first pad metal layer and a first conductive barrier layer surrounding the first pad metal layer, and the first conductive barrier layer may include a horizontal extension portion extending on an edge of an upper surface of the first pad metal layer.
20240055413.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gunho CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/538, H01L23/498, H01L23/31
Abstract: a semiconductor package includes a first semiconductor chip, a chip stack on the first semiconductor chip, and a mold layer enclosing the chip stack, on the first semiconductor chip. the chip stack includes second semiconductor chips vertically stacked on the first semiconductor chip, a third semiconductor chip on the second semiconductor chips, and non-conductive layers filling spaces between adjacent ones of the second semiconductor chips. the mold layer fills spaces between the first semiconductor chip and the chip stack, which are spaced apart from each other by a first distance, and between the uppermost one of the second semiconductor chips and the third semiconductor chip, which are spaced apart from each other by a second distance. the second semiconductor chips are spaced apart from each other by a third distance that is smaller than the first distance and the second distance.
Inventor(s): Jinwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Unbyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Chungsun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/31, H01L23/538, H01L23/498, H01L23/00, H01L25/00
Abstract: a semiconductor package includes a first redistribution wiring layer, a first semiconductor device on an upper surface of the first redistribution wiring layer, a first sealing member on the first semiconductor device, a second redistribution wiring layer on the first sealing member such that a peripheral region of a lower surface of the second redistribution wiring layer is free of the first sealing member, at least one second semiconductor device on an upper surface of the second redistribution wiring layer, and a plurality of bonding wirings electrically connecting first redistribution connection pads on a lower surface of the first redistribution wiring layer and second redistribution connection pads on the peripheral region of the lower surface of the second redistribution wiring layer.
Inventor(s): Jun Yun KWEON of Suwon-Si (KR) for samsung electronics co., ltd., Yeong Beom KO of Suwon-Si (KR) for samsung electronics co., ltd., Woo Ju KIM of Suwon-Si (KR) for samsung electronics co., ltd., Jung Seok RYU of Suwon-Si (KR) for samsung electronics co., ltd., Hwa Young LEE of Suwon-Si (KR) for samsung electronics co., ltd., Hyun Su HWANG of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/00, H01L25/065, H01L23/00, H01L23/538, H01L23/31
Abstract: a method for manufacturing semiconductor device includes preparing a semiconductor wafer including a first semiconductor substrate and a first through silicon via; removing a trim region of the first semiconductor substrate along an edge portion of the semiconductor wafer to form a remaining edge region; attaching the semiconductor wafer to a carrier substrate, wherein the remaining edge region is in contact with the carrier substrate; forming an edge protection layer along the remaining edge region; exposing the first through silicon via by removing a predetermined depth of the first semiconductor substrate; forming a second final passivation layer to expose the upper surface of the first through silicon via; forming a plurality of first upper connection pads on the second final passivation layer; and dicing the semiconductor wafer into a plurality of first semiconductor chips.
20240055425.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyungju RYU of Suwon-si (KR) for samsung electronics co., ltd., Sangjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Yigwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Changmin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L29/775, H01L29/423, H01L29/06
Abstract: a semiconductor device is provided, the semiconductor device including; a substrate; a first fin structure extending on the substrate in a first direction, and having a first fin portion having a first width and a second fin portion having a second width; a second fin structure extending on the substrate in the first direction, and having the second width; first gate lines disposed on the first fin portion and the second fin structure, and extending in a second direction; second gate lines disposed on the second fin portion and the second fin structure, and extending in the second direction; a third gate line disposed on the second fin structure, and extending in the second direction between the first and second gate lines; and a device isolation pattern connected to an end portion of the third gate, and extending between the first and second fin portions.
20240055427.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin KIM of Suwon-si (KR) for samsung electronics co., ltd., Namjae Kim of Suwon-si (KR) for samsung electronics co., ltd., Subin Kim of Suwon-si (KR) for samsung electronics co., ltd., Byungmoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Joongwon Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L21/8234, H01L23/528
Abstract: a semiconductor device including: a substrate including a pmos region, an n-well tap forming region, and a boundary region; pmos field effect transistors on the pmos region; an n-well tap region doped with n-type impurities in the n-well tap forming region; a first metal pattern connected to at least one impurity region of the pmos field effect transistors, wherein the first metal pattern extends so that an end of the first metal pattern is positioned on the boundary region; a second metal pattern electrically connected to the n-well tap region, wherein the second metal pattern extends so that an end of the second metal pattern is positioned on the boundary region; a first contact plug on the first metal pattern; a second contact plug on the second metal pattern; and an upper wiring on the first and second contact plugs.
[[20240055428.SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Hyun-Kwan YU of Suwon-si (KR) for samsung electronics co., ltd., Sunyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hayoung JEON of Suwon-si (KR) for samsung electronics co., ltd., Hwiseok JUN of Suwon-si (KR) for samsung electronics co., ltd., Ji Hoon CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L29/06, H01L29/08, H01L29/10, H01L29/423, H01L29/775, H01L21/8238, H01L29/66
Abstract: a semiconductor device comprises a substrate including nmosfet and pmosfet regions, first and second channel patterns on the nmosfet and pmosfet regions, respectively, and each including respective semiconductor patterns spaced apart from and vertically stacked on each other, first and second source/drain patterns on the nmosfet and nmosfet regions and connected to the first and second channel patterns, respectively, and a gate electrode on the first and second channel patterns. the gate electrode includes a first inner electrode between neighboring semiconductor patterns of the first channel pattern, and a second inner electrode between neighboring semiconductor patterns of the second channel pattern. a top surface of the first inner electrode is more convex than a top surface of the second inner electrode.
Inventor(s): Minjae JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jisu YU of Suwon-si (KR) for samsung electronics co., ltd., Geonwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Jungho DO of Suwon-si (KR) for samsung electronics co., ltd., Hyeongyu YOU of Suwon-si (KR) for samsung electronics co., ltd., Jaehee CHO of Suwon-so (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L23/528, G06F30/392
Abstract: an integrated circuit includes a first cell disposed in a first row and a second row, which are adjacent to each other and extend in a first direction, and including a plurality of first threshold voltage devices and at least one second cell disposed adjacent to the first cell in at least one of the first row and the second row and including at least one second threshold voltage device, wherein the plurality of first threshold voltage devices include at least one first device configured to perform a first function in the first row and at least one second device configured to perform a second function, which is different from the first function, in the second row.
Inventor(s): Joong Gun Oh of Hwaseong-si (KR) for samsung electronics co., ltd., Sung Il Park of Suwon-si (KR) for samsung electronics co., ltd., Jae Hyun Park of Hwaseong-si (KR) for samsung electronics co., ltd., Hyung Suk Lee of Suwon-si (KR) for samsung electronics co., ltd., Eun Sil Park of Hwaseong-si (KR) for samsung electronics co., ltd., Yun Il Lee of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L29/66, H01L29/78, H01L29/06, H01L29/08, H01L21/8238, H01L21/308, H01L29/423, H01L21/768
Abstract: a semiconductor device includes a fin type pattern extending in a first direction on a substrate, a first gate electrode extending in a second direction intersecting the first direction on the fin type pattern, a source/drain region on a side wall of the first gate electrode and in the fin type pattern, a separation structure extending in the first direction on the substrate, the separation structure including a first trench and being spaced apart from the fin type pattern and separating the first gate electrode, an interlayer insulating layer on a side wall of the separation structure and covering the source/drain region, the interlayer insulating layer including a second trench having a lower surface lower than a lower surface of the first trench, and a contact connected to the source/drain region and filling the first trench and the second trench.
Inventor(s): Junghun Kim of Suwon-si (KR) for samsung electronics co., ltd., Chulsoo Choi of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon Park of Suwon-si (KR) for samsung electronics co., ltd., Yunki Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B3/08
Abstract: an image sensor is provided. the image sensor includes: a photodetector with a plurality of photodetection cells; an interlayer device provided on the photodetector; and a color separation lens layer including a plurality of nano-posts disposed on the interlayer device and spaced apart from each other, the plurality of nano-posts focusing light of different spectra to at least two of the plurality of photodetection cells. each of the plurality of nano-posts includes a first refractive layer having a first refractive index and a cylindrical shape, and a second refractive layer having a second refractive index and surrounding bottom and side surfaces of the first refractive layer, and the second refractive index is higher than the first refractive index.
Inventor(s): Munhwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyungho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor includes a color unit pixel comprising sub-pixels arranged in an m�n matrix on a substrate, and a pixel isolation structure isolating the sub-pixels from each other in the color unit pixel. the pixel isolation structure includes an outer isolation film surrounding the color unit pixel, at least one inner isolation film including a portion between two sub-pixels, which are adjacent to each other, among the sub-pixels, a doped isolation liner covering opposite sidewalls of the at least one inner isolation film, and at least one doped isolation pillar contacting at least two sub-pixels selected from the sub-pixels. the at least one doped isolation pillar and the at least one inner isolation film are arranged to define a size of a partial region of each of the sub-pixels.
20240055469.NON-VOLATILE MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chang-Bum KIM of Suwon-si (KR) for samsung electronics co., ltd., Cheon An LEE of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, H01L23/00, H01L25/065
Abstract: the present disclosure relates to a semiconductor device, and more particularly, relates to a non-volatile memory device having a three-dimensional structure. the non-volatile memory device according to an embodiment of the present disclosure includes a first chip having a peripheral circuit therein and a second chip that is stacked on the first chip and that includes memory blocks. the second chip includes a common source line that has a plate shape and extends in first and second directions, first and second dummy common source lines disposed at a same height level as the common source line, an upper insulating layer that covers the common source line and the first and second dummy common source lines, and first and second dummy contact plugs extending in a third direction and that are electrically connected to the first and second dummy common source lines, respectively, and used as electrodes of a vertical capacitor.
20240055482.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seok Hyeon YOON of Suwon-si (KR) for samsung electronics co., ltd., Kyo-Wook LEE of Suwon-si (KR) for samsung electronics co., ltd., Seung Hun LEE of Suwon-si (KR) for samsung electronics co., ltd., Seung Han PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/092, H01L29/786, H01L23/48, H01L29/66, H01L29/775, H01L29/423, H01L29/417
Abstract: a semiconductor device including: first and second cell regions; a substrate including first and second surfaces; first to third active patterns extending in a first horizontal direction in the first cell region, the first to third active patterns spaced apart from each other in a second horizontal direction; a fourth active pattern extending in the first horizontal direction in the second cell region, the fourth active pattern is aligned with the second active pattern in the first horizontal direction; an active cut separating the second and fourth active patterns; a source/drain region on the second active pattern; a buried rail extending in the first horizontal direction on the second surface of the substrate, the first buried rail overlaps each of the second and fourth active patterns in a vertical direction; and a source/drain contact penetrating the substrate and second active pattern and connecting the source/drain region to the buried rail.
Inventor(s): Ji Young KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Dong-Sik LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Joon-Sung LIM of Seongnam-si (KR) for samsung electronics co., ltd., Bum Kyu KANG of Suwon-si (KR) for samsung electronics co., ltd., Ho Jun SEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/10, H10B43/27
Abstract: a semiconductor device includes a substrate, a first stack structure on the substrate and includes a plurality of first gate electrodes, a second stack structure on the first stack structure and includes a plurality of second gate electrodes, a channel hole including a first lower channel hole that extends through a lower portion of the first stack structure, a first upper channel hole connected to the first lower channel hole, and a second channel hole connected to the first upper channel hole, and a channel structure in the channel hole. a side wall of the first lower channel hole has a first inclination relative to the first direction, a side wall of the first upper channel hole has a second inclination relative to the first direction, and a side wall of the second channel hole has a third inclination relative to the first direction.
20240055493.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangcheol Na of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Minchan Gwak of Suwon-si (KR) for samsung electronics co., ltd., Gukhee Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongick Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/48, H01L29/786, H01L29/775, H01L29/06, H01L29/423, H01L29/49
Abstract: a semiconductor device includes a substrate having a fin-type active pattern, source/drain regions on the fin-type active pattern, an interlayer insulating layer on the isolation insulating layer, and on the source/drain region, a contact structure electrically connected to the source/drain regions, a buried conductive structure electrically connected to the contact structure and buried in the interlayer insulating layer, and a power delivery structure that penetrates the substrate, and is in contact with a bottom surface of the buried conductive structure. the buried conductive structure includes a first contact plug, and a first conductive barrier on a side surface of the first contact plug and spaced apart from a bottom surface of the first contact plug. the power delivery structure includes a second contact plug in direct contact with the bottom surface of the first contact plug.
Inventor(s): Chan-Wook BAIK of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L31/108, H01L31/0232
Abstract: a photodiode according to an embodiment includes a semiconductor substrate, a schottky junction structure layer disposed on the semiconductor substrate and including a first layer including a conductive material and a semiconductor layer, and a pinning layer disposed adjacent to the schottky junction structure layer and fixing potentials of the semiconductor substrate and the first layer.
Inventor(s): Chaeup YOO of Suwon-si (KR) for samsung electronics co., ltd., Mincheol SEO of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Huiwon CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H05K7/14, H05K5/02, H04M1/02
Abstract: an electronic device includes: a display provided on a front surface of the electronic device; a frame which forms a side of the electronic device and may include an inner wall facing an internal space of the electronic device, wherein at least a portion of the frame may include a conductive material; a printed circuit board inside the frame and on which a communication circuit is provided; a radio frequency (rf) connection member which is electrically connected to the printed circuit board and may include at least one portion extending along the inner wall of the frame; a contact ring electrically connected to the rf connection member along the inner wall of the frame; a screw hole formed in the inner wall of the frame to form a predetermined angle with respect to an extending direction of the printed circuit board; and a first bolt coupled to the screw hole through the contact ring.
Inventor(s): Seungtae KO of Suwon-si (KR) for samsung electronics co., ltd., Daehyeon KIM of Pohang-si (KR) for samsung electronics co., ltd., Jungyub LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonbin HONG of Pohang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q15/00, H01Q9/16
Abstract: an electronic device includes a memory, a frequency selective surface (fss) including a plurality of cells, and at least one processor. each cell of the plurality of cells includes a liquid crystal layer. the at least one processor is configured to receive a signal from another electronic device based on the fss. the at least one processor is configured to determine refraction information for each cell of the plurality of cells of the fss based on a difference between first pattern information for the other electronic device and second pattern information for the received signal. the at least one processor is configured to perform a reconfiguration for the fss based on refraction information for each cell of the plurality of cells of the fss. the at least one processor is configured to obtain a reconstruction signal from the other electronic device based on the reconfigured fss.
Inventor(s): Changmin HAN of Suwon-si (KR) for samsung electronics co., ltd., Gwanhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeongjun KWON of Suwon-si (KR) for samsung electronics co., ltd., Minjae SHIN of Suwon-si (KR) for samsung electronics co., ltd., Huijun SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01R31/06, H01R13/66, G06F13/40
Abstract: an interface apparatus is disclosed. the interface apparatus includes a substrate configured to perform interfacing of a signal between an electronic device and a display device, the substrate includes a first connector configured to connect with the electronic device, a second connector configured to with the display device, and a power connector configured to receive power, and the substrate is configured to provide power received through the power connector to the electronic device through the first connector.
Inventor(s): Beomwoo GU of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaeseok PARK of Suwon-si (KR) for samsung electronics co., ltd., Kangho BYUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/12, H03H7/38, H03H7/01
Abstract: an electronic device for wirelessly transmitting power may include a first resonator including a first coil, a second resonator including a second coil having a different size from the first coil, an impedance matching circuit including at least one capacitor connected through a switch, and a controller. the controller may be configured to identify which one of a first electronic device not mounted on the electronic device and a second electronic device mounted on the electronic device power is to be transmitted to. the controller may be configured to, when power is to be transmitted to the first electronic device, transmit power through the first resonator by opening the switch. the controller may be configured to, when power is to be transmitted to the second electronic device, transmit power through the second resonator by closing the switch.
Inventor(s): Yongsun Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jinook Jung of Suwon-si (KR) for samsung electronics co., ltd., Junghwan Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03L7/093, H03L7/099, H03L7/081
Abstract: a digital phase-locked loop (pll) includes: (i) a digitally controlled oscillator (dco) configured to generate an oscillation signal having a frequency that is adjustable in response to a frequency control signal, (ii) a divider configured to generate a feedback signal in response to dividing a frequency of the oscillation signal, (iii) a time-to-digital converter (tdc) configured to detect a phase difference between a reference signal and the feedback signal, and generate an error signal having a value that is a function of the phase difference, and (iv) a digital loop filter configured to generate the frequency control signal in response to the error signal and the oscillation signal.
20240056088.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joo-Han KIM of Suwon-si (KR) for samsung electronics co., ltd., Beom Kon KIM of Suwon-si (KR) for samsung electronics co., ltd., Woo Wan WANG of Suwon-si (KR) for samsung electronics co., ltd., Dong Hyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jung Su HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/06
Abstract: a semiconductor device includes a first adc configured to sample an input signal based on a first clock signal, quantize the input signal with a first gain, and output a plurality of first output signals, and a second adc configured to sample the input signal based on a second clock signal obtained by delaying the first clock signal, quantize the input signal with a second gain, and output a plurality of second output signals. the device includes a gain mismatch estimator configured to calculate first and second values which are averages of absolute values of the first output signals and the second output signals, and calculate first and second gain correction values using the first and second values. a gain mismatch compensator is configured to output a plurality of corrected first output signals and corrected second output signals, according to the first and second gain correction values.
20240056116.ELECTRONIC DEVICE COMPRISING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Woosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Sewoong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeonghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyuho LEE of Suwon-si (KR) for samsung electronics co., ltd., Donguk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Inyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/3827, H04R1/06, H04R1/10
Abstract: a wearable electronic device is provided. the wearable electronic device includes a housing, a conductive patch, a printed circuit board (pcb) disposed in the housing, a wireless communication circuit disposed on the pcb and a first touch sensing circuit, wherein the housing may comprise a first housing facing away from the body wearing the electronic device, and a second housing facing toward the body. the wireless communication circuit supplies power to a first point spaced apart from an edge of the conductive patch by a specific distance or more and receive a radio frequency (rf) signal of a first frequency band, and the first touch sensing circuit senses a touch input with respect to the conductive patch.
Inventor(s): Yeqing Hu of Allen TX (US) for samsung electronics co., ltd., Xiaowen Tian of Raleigh NC (US) for samsung electronics co., ltd., Yang Li of Plano TX (US) for samsung electronics co., ltd., Tiexing Wang of Plano TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04L25/02
Abstract: a method includes identifying acf information by: obtaining channel information including multiple channels of expected operation scenarios; and based on the channel information for each of the channels, determining mmse channel estimation (ce) weights expressed in a form of acfs and an snr, and covariance matrices. the method includes clustering the mmse ce weights into k clusters. a center acf weight of each of the k clusters represents a codeword. the method includes determining a distance metric based on a cluster distance after a re-clustering. the method includes, in response to a determination that cluster distances before and after the clustering differ from each other by a non-negligibly, iteratively re-clustering the acf information thereby updating the center acf weights and cluster distances. the method includes generating the codebook to include an index k of each of the k clusters and the center acf weight of each of the k clusters.
Inventor(s): R A Nadisanka Perera Rupasinghe of Allen TX (US) for samsung electronics co., ltd., Tiexing Wang of Plano TX (US) for samsung electronics co., ltd., Yang Li of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B17/336, H04B17/373
Abstract: methods and apparatuses for throughput prediction. a base station includes a transceiver configured to receive a set of input metrics and a processor operably coupled to the transceiver. the processor is configured to calculate, based on the set of input metrics, a transmit antenna selection (tas) throughput prediction and further configured to generate, based on the tas throughput prediction, a predicted tas throughput result.
Inventor(s): Sandy Saab of Plano TX (US) for samsung electronics co., ltd., Jorge Luis Gomez Ponce of Los Angeles CA (US) for samsung electronics co., ltd., Shadi Abu-Surra of Plano TX (US) for samsung electronics co., ltd., Gang Xu of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0426
Abstract: configuration of a line of sight, multiple input, multiple output circular antenna array involves setting an integer number of antenna arrays up to a number of antenna ports for the circular antenna array and a maximum radius for any antenna ring within the circular antenna array. a capacity is determined for each of a plurality of different combinations of each of: an integer number of antenna rings up to a predetermined maximum number of antenna rings, a number of the antenna arrays for each of the number of antenna rings, and angular offsets for that antenna arrays on each of the antenna rings. the determined capacities for the plurality of different combinations are compared.
Inventor(s): Yongjun AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/14
Abstract: an electronic device includes: a plurality of antennas; a first radio-frequency front-end (rffe) including a third switch and multiple switches (a first switch and a second switch); a second rffe; a radio-frequency integrated circuit (rfic) connected to the first rffe and the second rffe; and a processor. the first rffe receives a sounding reference signal (srs) from the second rffe. the processor is configured to: determine whether to transmit the srs simultaneously with a signal generated in the first rffe by using one antenna; and based on a determination to simultaneously transmit the srs and the signal, adjust the third switch and the multiple switches to simultaneously transmit the srs and the signal by using the one antenna.
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00, H04W24/10, H04W52/54
Abstract: methods and apparatuses for measurement enhancement with network operation states in a wireless communication system. a method for a user equipment (ue) to report channel state information (csi) includes receiving first information related to transmissions, from a base station (bs), of first reference signals (rss) associated with respective first operation states on a first cell, second information related to computing first csi reports from respective receptions of the first rss on the first cell, and the first rss based on the first information. the first rss include channel state information reference signals (csi-rs) or synchronization signals. the method further includes determining, based on the second information, the first csi reports corresponding to the respective receptions of the first rss on the first cell and transmitting a channel with the first csi reports.
Inventor(s): Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Younsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00
Abstract: a method performed by a ue in a wireless communication system includes receiving configuration information on a csi report including information on a codebook subset restriction, the codebook subset restriction being configured to each trp of a plurality of trps performing coherent joint transmission or to a subset of the plurality of trps based on the information, measuring csi based on at least one csi-rs resource, and transmitting the csi based on the codebook subset restriction.
Inventor(s): Jaemoon CHA of Suwon-si (KR) for samsung electronics co., ltd., Minhwan JEON of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Yeonjoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/08, H04B7/06
Abstract: according to an embodiment, an electronic device may comprise: at least one communication processor, an rf circuitry connected to the at least one communication processor, and a plurality of antennas connected to the rf circuitry. the at least one communication processor may be configured to, based on identifying a folding state of the electronic device being an open state, control the rf circuitry to provide a first rf signal corresponding to a first frequency band to a first antenna among the plurality of antennas. the at least one communication processor may be configured to, based on identifying the folding state of the electronic device being a closed state, identify whether the electronic device is gripped. the at least one communication processor may be configured to control the rf circuitry to provide a second rf signal corresponding to the first frequency band to a second antenna different from the first antenna among the plurality of antennas, based on identifying that the electronic device is gripped.
Inventor(s): Hanyeoreum Bae of Suwon-si (KR) for samsung electronics co., ltd., Myoungsoo Jung of Suwon-si (KR) for samsung electronics co., ltd., Jie Zhang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B10/50, G02B6/293
Abstract: an electronic system for transmitting and receiving internal data through an optical channel. the electronic system may include a light emitter configured to generate a first optical signal, a first device configured to receive the first optical signal and including a transmitter configured to output a second optical signal representing a transmission value based on the first optical signal, a second device including a first receiver configured to receive the second optical signal from the first device and output a third optical signal by adjusting a light intensity of the second optical signal, and configured to read the transmission value based on the light intensity of the second optical signal, and a third device including a second receiver configured to receive the third optical signal from the second device, and configured to read the transmission value based on a light intensity of the third optical signal.
Inventor(s): Junyung YI of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngbum KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Seongmok LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyoungmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B17/318, H04L5/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system includes receiving, from a base station, configuration information associated with at least one first reference signal (rs), receiving, from the base station, reconfiguration information associated with at least one second rs, and identifying a pathloss-rs (pl-rs) for measuring a downlink pathloss based on the configuration information and the reconfiguration information, wherein a first transmission density of the at least one first rs is greater than a second transmission density of the at least one second rs.
Inventor(s): Yi WANG of Beijing (CN) for samsung electronics co., ltd., Yingyang LI of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L1/1812, H04L1/1829, H04W72/0446, H04W74/00
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure discloses a method and an apparatus for transmitting an uplink signal, and the method comprises: receiving downlink control information; and performing transmitting of the uplink signal according to the downlink control information and/or a time-domain attribute of a physical resource of the uplink signal. with the present disclosure, a flexibility of a system can be improved and a transmission efficiency can be increased.
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B7/06
Abstract: methods and apparatuses for measurement configurations for reporting in multi-transmit-receive point (trp) communication systems. a method for operating a user equipment (ue) includes receiving first information for a first set of frequency subbands for fsbm and receiving second information related to a csi resource setting. the csi resource setting includes a first csi resource set and a second csi resource set. the method further includes identifying, based on the first and second information, a first subset of frequency subbands from the first set of frequency subbands for the first csi resource set and a second subset of frequency subbands from the first set of frequency subbands for the second csi resource set. the method further includes determining, based on the identification, one or more first rs resources from the first csi resource set and one or more second rs resources from the second csi resource set for fsbr.
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04L5/00
Abstract: apparatuses and methods for srs enhancement for interference randomization in wireless networks. a method performed by a user equipment (ue) includes receiving a configuration about a sounding reference signal (srs) resource. the configuration includes information about a cyclic shift offset�{0,1, . . . , n−1} and a transmission-comb offset�{0,1, . . . , k−1}. nis a maximum number of cyclic shifts and kis a transmission comb number. the srs resource is associated with a plurality of antenna ports. the method further includes determining, based on a first pseudo-random sequence, the cyclic shift offset for each of the plurality of antenna ports; determining, based on a second pseudo-random sequence, the transmission-comb offset for each of the plurality of antenna ports; and transmitting, based on the cyclic shift offset and the transmission-comb offset, the srs resource.
Inventor(s): Karthik Muralidhar of Bangalore (IN) for samsung electronics co., ltd., Youngrok Jang of Gyeonggi-do (KR) for samsung electronics co., ltd., Diwakar Sharma of Bangalore (IN) for samsung electronics co., ltd., Santanu Mondal of Bangalore (IN) for samsung electronics co., ltd., Dattaraj Dileep Raut Mulgaonkar of Bangalore (IN) for samsung electronics co., ltd., Satya Kumar Vankayala of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04L5/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method is provided for handling srs resource allocation in multi-trp in wireless networks by a bs or a trp unit. the method includes configuring cs allocation to at least one port of a ue. the cs allocation uses values from a sub-set of a plurality of allowable cs values. further, the method includes receiving a srs using the allocated cs. in an embodiment, per—port cs allocation provides flexibility of using the cs resources efficiently to minimize inter-trp interference. the method can be used to allocate cs and srs resources efficiently.
Inventor(s): Sunghwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jookwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Yangwook Kim of Suwon-si (KR) for samsung electronics co., ltd., Jihea Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F1/16, G09G3/00
Abstract: disclosed are an electronic device including a flexible display, and an operation method thereof. the electronic device may include a battery for power supply, a display unit, and at least one processor. the display unit may include at least one flexible display. as a state of the electronic device switches from a first state to a second state, a screen display area among a display area of the display unit may change from a first area to a second area. in the first state, a first indicator relating to a battery residual capacity identified according to the size of the first area may be displayed through the first area. in the second state, a second indicator relating to a battery residual capacity identified according to the size of the second area may be displayed through the second area.
Inventor(s): Youngsub KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungho PARK of Suwon-si (KR) for samsung electronics co., ltd., Kwanghyun BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jungyub LEE of Suwon-si (KR) for samsung electronics co., ltd., Juneseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Dohyuk HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H05K1/14, H05K1/02
Abstract: in various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. the first substrate includes a plurality of first layers. the second substrate includes a plurality of second layers. the radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. the plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. at least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.
Inventor(s): Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd., Elena ALSHINA of Seoul (KR) for samsung electronics co., ltd., Alexander ALSHIN of Seoul (KR) for samsung electronics co., ltd., Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/615, H04N19/105, H04N19/109, H04N19/117, H04N19/176, H04N19/423
Abstract: provided is a video decoding method including: determining an inter prediction mode of a current block when the current block is inter-predicted; determining at least one reference sample location to be referred to by the current block, based on the inter prediction mode of the current block; determining filter information to be applied to at least one reconstructed reference sample corresponding to the at least one reference sample location, based on the inter prediction mode of the current block; performing filtering on the at least one reconstructed reference sample, based on the filter information; and decoding the current block by using prediction samples generated via the filtering.
Inventor(s): Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd., Elena Alshina of Seoul (KR) for samsung electronics co., ltd., Alexander Alshin of Seoul (KR) for samsung electronics co., ltd., Anish Tamse of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/615, H04N19/105, H04N19/109, H04N19/117, H04N19/176, H04N19/423
Abstract: provided is a video decoding method including: determining an inter prediction mode of a current block when the current block is inter-predicted; determining at least one reference sample location to be referred to by the current block, based on the inter prediction mode of the current block; determining filter information to be applied to at least one reconstructed reference sample corresponding to the at least one reference sample location, based on the inter prediction mode of the current block; performing filtering on the at least one reconstructed reference sample, based on the filter information; and decoding the current block by using prediction samples generated via the filtering.
Inventor(s): Ki-Man LEE of Suwon-si (KR) for samsung electronics co., ltd., Mi-Sun KIM of Seoul (KR) for samsung electronics co., ltd., Sang-Hun KIM of Yongin-si (KR) for samsung electronics co., ltd., Hyun-Joong KIM of Suwon-si (KR) for samsung electronics co., ltd., Mi-Ra SEO of Yongin-si (KR) for samsung electronics co., ltd., Woo-Cheol JUNG of Seoul (KR) for samsung electronics co., ltd., Yong-Gu LEE of Guri-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/439, H04N21/4788, H04N21/4363, H04N21/61, H04N21/81, H04L65/00, H04L65/1083, H04L65/401, H04L65/1089, G06F3/16, H04N21/41
Abstract: a method for communicating data by an electronic device is provided. the method includes transmitting a signal including audio/video (a/v) data to a first external electronic device through a first communication module, while connected with the first external electronic device, generating data or a signal unrelated to the a/v data or receiving the data or signal unrelated to the a/v data from an external electronic device other than the first external electronic device, and providing an audio or a video through a display or an embedded sound device based on at least a portion of the data or the signal unrelated to the a/v data or transmitting the at least a portion of the data or the signal unrelated to the a/v data to a second external electronic device through a second communication module.
Inventor(s): Youngchan WOO of Suwon-si (KR) for samsung electronics co., ltd., Sungyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Boram LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunduk CHO of Suwon-si (KR) for samsung electronics co., ltd., Sunah KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/443, H04N21/442
Abstract: disclosed are a low-power control method in a service area in which electronic devices including a first electronic device and one or more second electronic devices are registered, the low-power control method including: determining an effective device located in the service area from among the second electronic devices in response to reception of an operation signal of the first electronic device outputting a content over a first display; obtaining interest information including an interest level toward the effective device; and activating a low-power setting for the first electronic device based on the interest information.
Inventor(s): Sang-soo Lee of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/4627, H04N21/258, H04N21/254, H04N21/436, H04N21/482, H04N21/488, G06F13/38
Abstract: an electronic apparatus is provided, and includes a communicator and a processor. the communicator communicates with external devices, including a first external device and a second external device different from the first external device, for controlling operation of the electronic apparatus. the processor, based on a media signal corresponding to a content being received, processes the media signal for playing the content, based on a first control signal being received from the first external device while the media signal is processed, performs an operation corresponding to the received first control signal, based on authentication information being received from the second external device while the media signal is processed, transmits information corresponding to the content to the second external device, and based on a second control signal being received from the first external device or the second external device, performs an operation corresponding to the received second control signal.
Inventor(s): Jungpa SEO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/55, G02B13/00, H04N23/54
Abstract: an electronic device and a camera assembly are disclosed. the electronic device may include the camera assembly, which in turn may include a lens assembly having at least four lenses, an image sensor, and at least one reflective member that refracts or reflects incident light at least twice, wherein at least one surface of an object-side surface and an image-side surface of a first lens from an object side among the at least four lenses is formed as an aspherical surface, wherein the object-side surface and the image-side surface are formed to be convex, wherein various conditional equations stipulation relationships between back focal length (bfl), effective focal length (efl) and field-of-view (fov) are satisfied.
Inventor(s): Jongwoon JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Deukkyu OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangtaek WOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Gisoo Lee of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/63, H04N5/262, H04N23/51, H04N23/62
Abstract: a foldable electronic device may include: a foldable housing foldable along at least one axis; a first display disposed on a first surface of the foldable housing; a second display disposed on a second surface of the foldable housing; a first camera; a second camera; at least one sensor; a memory; and a processor. the processor may be configured to: provide a first preview to the first display by using the first camera in a folded state; receive a region configuration input for the first preview through the first display; after the reception of the region configuration input, sense unfolding of the foldable electronic device by using the at least one sensor; and provide a second preview corresponding to the region configuration input through the second display by using the second camera in an unfolded state. in addition, various other embodiments can be understood through the specification.
Inventor(s): Kyungdong YANG of Suwon-si (KR) for samsung electronics co., ltd., Soonae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/695, G06T7/70, G06V10/25, H04N23/61, G02B7/18
Abstract: an electronic device disclosed herein includes: a display, a memory, a processor, and a camera, the camera includes a lens unit including a lens, a prism rotatable in a first direction or a second direction, a driving unit including at least one coil configured to move the prism, a magnetic body coupled to the prism, a sensor unit including a sensor configured to detect a first amount of rotation of the prism in the first direction or a second amount of rotation thereof in the second direction, and an image sensor configured to generate an electrical signal using light passing through the lens unit and the prism, wherein the processor is configured to: determine a first region of interest (roi) for execution of a specified function using the camera, determine the first amount of rotation or the second amount of rotation using a sensing value of the sensor unit, and determine a second region of interest by correcting the first region of interest of the camera using the first amount of rotation or the second amount of rotation.
Inventor(s): Juyeon JIN of Suwon-si (KR) for samsung electronics co., ltd., Gupil CHEONG of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Bokun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/10
Abstract: an electronic device is provided. the electronic device includes a display module, a communication module for exchanging data with an external device, and at least one processor which is connected to the display module and the communication module and which controls the electronic device, wherein the at least one processor is configured to receive information about a first audio source device through the communication module, output the received information about the first audio source device through a display of the display module, receive a first audio broadcast stream transmitted by the first audio source device if the first audio source device is selected by a user, and transmit, to an audio output device, a first audio signal of the first audio broadcast stream through a wireless link established with the audio output device through the communication module, and the first audio signal can be output through the audio output device.
Inventor(s): Vijendra Raj Apsingekar of San Jose CA (US) for samsung electronics co., ltd., Akash Sahoo of San Jose CA (US) for samsung electronics co., ltd., Anil S. Yadav of San Jose CA (US) for samsung electronics co., ltd., Sivakumar Balasubramanian of Sunnyvale CA (US) for samsung electronics co., ltd.
IPC Code(s): H04S7/00, H04S3/00, G06F3/16, G10L19/008
Abstract: a method includes obtaining video content and associated substantially mono audio content. the method also includes determining at least one of a position or a motion trajectory of each of one or more objects detected in the video content and classifying each of the one or more objects into one of multiple object classes. the method further includes separating audio streams within the audio content based on the video content. each of the audio streams is associated with one of multiple audio sources. the method also includes classifying each of the audio sources into one of the object classes. in addition, the method includes, for each audio source classified into the same object class as one of the one or more objects, distributing the audio stream associated with that audio source into multiple audio channels based on at least one of the position or the motion trajectory of that object.
Inventor(s): Jubyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangchul YUN of Suwon-si (KR) for samsung electronics co., ltd., Gyujin LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonkyoung JANG of Suwon-si (KR) for samsung electronics co., ltd., Junwan CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/029, H04L51/222
Abstract: disclosed are methods and electronic devices configured to transmit, at a first period, a first-type advertisement (adv) packet to a first external electronic device using the wireless communication circuit; determine that the electronic device is missing based on location information of the electronic device if a first response signal for the first-type adv packet is not received from the first external electronic device; in response to determining that the electronic device is missing, transmit, at a second period, a second-type adv packet to a nearby external electronic device using the wireless communication circuit; receive a second response signal for the second-type adv packet from a second external electronic device; and transmit, to the second external electronic device, a signal including information of the electronic device based on reception of the second response signal.
Inventor(s): Jeonghyeon YUN of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoong KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyeongjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Moohyun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Chaeyoung YUN of Suwon-si (KR) for samsung electronics co., ltd., Kanghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Gyubeom LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/00, H04W76/10
Abstract: an electronic device is provided. the electronic device includes a communication module and at least one processor. the at least one processor may be configured to acquire identification information of a controlled device by performing a nearby device scan, request confirm data of the controlled device corresponding to the identification information from the server, perform a first registration procedure including operations for registering the controlled device in the server in case that the confirm data is not received from the server, and perform a second registration procedure including the remaining operations except for at least one operation for obtaining the confirm data from among operations included in the first registration procedure in case that the confirm data is received from the server.
Inventor(s): Mallikarjuna HAMPALI of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W8/18
Abstract: a server, for managing an incoming call in an embedded subscriber identity module (esim) network, is configured to receive a first msisdn number of a first esim profile among a plurality of esim profiles in an electronic device from a mobile network operator (mno) to obtain an operating status associated with a first esim profile. the server is also configured to determine that the operating status associated with the first esim profile is inactive in response to receiving the first mobile station integrated services digital networks (msisdn) number. the server is further configured to transmit a second msisdn number associated with a second esim profile among the plurality of esim profiles whose operating status is active to the mno in response to determining at the operating status associated with the esim profile is inactive.
Inventor(s): Liang Hu of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun Bae of San Diego CA (US) for samsung electronics co., ltd., Mohammed Karmoose of San Diego CA (US) for samsung electronics co., ltd., Hsien-Ping Lin of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W8/24, H04W56/00, H04W72/0453, H04W74/08, H04W72/23
Abstract: a system and method for providing early indication by a reduced capability new radio (nr) user equipment (ue). in some embodiments the reduced capability ue informs the network, by its use of a combination of preamble, random access channel occasion (ro), and initial bandwidth part (bwp), that it is a reduced capability ue. in some embodiments, the reduced capability ue transmits payload data in a message a message. in some embodiments, the reduced capability ue receives, from the network, a set of candidate uplink resources, and transmits a message 3 message within a subset of the set of candidate uplink resources.
Inventor(s): Hakkwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Buseop JUNG of Suwon-si (KR) for samsung electronics co., ltd., Beomjip KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyejung BANG of Suwon-si (KR) for samsung electronics co., ltd., Dooho LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunkey LEE of Suwon-si (KR) for samsung electronics co., ltd., Soonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonjun JANG of Suwon-si (KR) for samsung electronics co., ltd., Namju CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/06
Abstract: an electronic device is provided. the electronic device includes a communication circuit and at least one processor, wherein the at least one processor can be configured to acquire identification information about an external electronic device from same, transmit, to a server by means of the communication circuit, an authentication information request message including the identification information about the external electronic device, receive, from the server by means of the communication circuit, authentication information required for authenticating the external electronic device so that the external electronic device is registered in a cloud, and transmit, to the external electronic device by means of the communication circuit, a message including the authentication information required for authenticating the external electronic device.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04W76/28, H04W24/02
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). the present disclosure provides method and apparatus for rlm and bfd measurements in next generation wireless communication system.
Inventor(s): Jungshin PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongyeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04L41/14, H04W36/00
Abstract: a method and an apparatus for collecting and analyzing session performance data in a wireless communication system are provided. the method includes receiving a first request message for requesting network performance analytics from a policy control function (pcf), transmitting a second request message for requesting data collection for the network performance analytics to at least one network function (nf) of a first network related to session performance of a user equipment (ue), receiving a first notification message including session performance data of the first network and an indicator indicating that the ue moves to a second network from the at least one network function, and transmitting, to the pcf, a second notification message including a performance analytics result of the session performance data.
Inventor(s): Weili CUI of Beijing (CN) for samsung electronics co., ltd., Meifang JING of Beijing (CN) for samsung electronics co., ltd., Ying LI of Beijing (CN) for samsung electronics co., ltd., Hui CHEN of Beijing (CN) for samsung electronics co., ltd., Jiajia WANG of Beijing (CN) for samsung electronics co., ltd., Fang XIE of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W16/28
Abstract: embodiments of the disclosure provide a method performed by a base station, a base station and a computer readable storage medium. the method includes: instructing a user equipment (ue) to perform a beam measurement at a first beam level; determining, based on at least one of information on transmission capacity, mobility information and traffic information of the ue, whether to instruct the ue to perform a beam measurement at a second beam level; and receiving beam measurement results of the ue and performing beam scheduling, and wherein, a scheduled beam includes a beam at the first beam level or a beam at the second beam level; and serving cells of the base station are covered by each of the beam levels, and beams at different beam levels have different attributes. part of the the implementation process of the scheme can be achieved by artificial intelligence. the disclosure saves measurement overhead while ensuring communication quality, and achieves the effects of improving cell throughput and user experience.
Inventor(s): Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., He WANG of Beijing (CN) for samsung electronics co., ltd., Songhui SHEN of Beijing (CN) for samsung electronics co., ltd., Liying ZHOU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/10
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a user equipment (ue), a base station and a method performed by the same in a wireless communication system are provided. the method includes determining a first reference signal set for measurement, performing measurement to obtain one or more measurement results based on the determined first reference signal set, and performing reporting based on the one or more measurement results. the first reference signal set is generated based on a first artificial intelligence (ai) model, or the one or more measurement results are generated based on a second ai model. the present disclosure can reduce resource overhead and power consumption of the ue.
Inventor(s): Jungshin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongeun SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W24/10
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a first network data collection and analysis function (nwdaf) entity in a mobile communication system is provided. the method comprises transmitting, to a network entity for collecting management information, a first request message for collection of first management information for a network function (nf) entity, receiving, from the network entity, the first management information for the nf entity and identifying a result of an analysis for the nf entity based on the first management information for the nf entity.
Inventor(s): Jaehyeon BAE of Suwon-si (KR) for samsung electronics co., ltd., Youngkyo BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W28/10, H04W28/24
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment of the disclosure, a policy control function (pcf) entity in a wireless communication system comprises a transceiver and at least one processor. the at least one processor is configured to update a service-related policy based on a service transmission delay time (delay budget adjustment) per service flow, wherein the service transmission delay time per service flow is transmitted to a tethered device, schedule a quality-of-service (qos) based on the service-related policy, and transmit, to a session management function (smf) entity, a first message including the per-service flow service transmission delay time per service flow, the updated service-related policy, and a qos requirement based on the scheduled qos.
Inventor(s): Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Taeyong KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02
Abstract: an electronic device according to an embodiment of the present disclosure includes: at least one wireless communication module configured to transmit and receive a wireless signal; at least one processor operatively connected to the wireless communication module; and a memory electrically connected to the processor and including instructions executable by the processor. when the instructions are executed by the processor, the processor may be configured to: receive at least one beacon signal including restricted target wake time (r-twt) service period (sp) information of each link included in multiple links; determine at least one link from among the multiple links based on the beacon signal; and transmit and receive data based on the at least one link. other embodiments, in addition to the foregoing embodiment, are also applicable.
Inventor(s): Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02
Abstract: a method and device for stably supporting the detnet in a wireless communication system are provided. a method performed by a network entity supporting deterministic networking (detnet) in a wireless communication system is provided, the method comprises receiving, from a detnet controller of a deterministic network, configuration information including requirements in the deterministic network; identifying, based on the configuration information, a protocol data unit (pdu) session of associated with an internet protocol (ip) address of a user equipment (ue): and transmitting, to a policy control function (pcf), quality of service (qos) parameters obtained based on the requirements in the configuration information, the qos parameters being used for a policy update to be applied for the pdu session.
Inventor(s): Madhan Raj KANAGARATHINAM of Bangalore (IN) for samsung electronics co., ltd., Irlanki SANDEEP of Bangalore (IN) for samsung electronics co., ltd., Kavin Kumar THANGADORAI of Bangalore (IN) for samsung electronics co., ltd., Srihari KUNCHA of Bangalore (IN) for samsung electronics co., ltd., Dronamraju Siva SABAREESH of Bangalore (IN) for samsung electronics co., ltd., Srihari SRIRAM of Bangalore (IN) for samsung electronics co., ltd., Sukhdeep SINGH of Bangalore (IN) for samsung electronics co., ltd., Sri Vinod PALACHARLA of Bangalore (IN) for samsung electronics co., ltd., Jayendra Reddy KOVVURI of Bangalore (IN) for samsung electronics co., ltd., Mohan Rao GOLI of Bangalore (IN) for samsung electronics co., ltd., Sunghee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02
Abstract: embodiments herein provide a method for managing quality of service (qos) of applications in a wireless network. detecting a plurality of data traffic of plurality of applications based on current activities of a user equipment (ue), hardware components of ue, a plurality traffic parameter, a qos report received from an access point (ap) associated with ue in a wireless network. detecting an enhanced distributed channel access (edca) function based on plurality of data traffic. the edca function includes current mapping between access category of each data structure and traffic category of plurality of data traffic based on association. classifying plurality of data traffic of the plurality of applications into priority data traffic category and non-priority data traffic category based on current mapping of the edca function. modifying current mapping of edca function based on priority data traffic category, non-priority data traffic category, and access category of each data structure of plurality of data structures.
Inventor(s): Hyesung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jicheol LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/22, H04L67/141
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a first session management function (smf) entity includes receiving, from a second smf entity, a request message for a protocol data unit (pdu) session associated with a home routed (hr) local session, receiving, from a unified data management (udm) entity, information on an aggregated maximum bit rate (ambr) for the hr local session, receiving, from a policy control function (pcf) entity, an authorized ambr of the hr local session generated based on the information on the ambr, and transmitting, to the second smf, a response message including the authorized ambr.
Inventor(s): Nishant . of Bangalore (IN) for samsung electronics co., ltd., Sidhant Jain of Bangalore (IN) for samsung electronics co., ltd., Gokul K of Bangalore (CN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Mohammad Umair of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08
Abstract: a method and/or system for initiating one of a plurality of cell transition activities for a ue supporting multicast and broadcast services (mbs). the technique may include identifying, by the ue, one or more candidate cells available for one of the plurality of cell transition activities for the ue. the technique may include identifying, by the ue, at least one candidate cell among the one or more candidate cells that support mbs. the technique may include initiating, by the ue, one of the plurality of cell transition activities for the ue using the at least one candidate cell.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Chadi KHIRALLAH of Staines (GB) for samsung electronics co., ltd., David Gutierrez ESTEVEZ of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W76/20
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. one or more network entities, such as a network function, a user equipment of a 3gpp communication network which use one or more expected cp to up switch parameters which are one or more new parameters to inform the network about a cp to up switch. an expected cp to up switch parameter may be used to inform the network about an expected time of the cp to up switch. the one or more expected cp to up switch parameters may be exposed. an af may provide the one or more expected cp to up switch parameters to the network. an ai/ml af may provide the one or more expected cp to up switch parameters as part of ai/ml assisted parameters.
Inventor(s): Vivek MURUGAIYAN of Bangalore (IN) for samsung electronics co., ltd., Amit Anandrao DANGE of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Anoop Perumudi VEEDU of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W76/27, H04W36/36, H04W36/00
Abstract: an example method performed by a user equipment (ue) supporting a multi-universal subscriber identity module (musim), the method comprises connecting a first sim of the ue with a primary cell. the method comprises receiving a radio resource control (rrc) reconfiguration message of the primary cell including information on candidate cells for a conditional handover, a conditional primary secondary (ps) cell addition, or a conditional ps cell change. the method comprises identifying that a rrc reconfiguration message of each of the candidate cells comprises at least one of leave assistance information or gap assistance information. the method comprises performing prioritizing at least one candidate cell of the candidate cells that supports musim assistance information, in response to identifying that the rrc reconfiguration message comprises at least one of the leave assistance information or the gap assistance information.
[[20240056924.METHOD AND APPARAUTS FOR HANDLING TRANSMISSION-RECEPTION POINTS IN COMMUNICATION SYSTEM_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Arvind RAMAMURTHY of Bangalore (IN) for samsung electronics co., ltd., Neha SHARMA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04B7/024
Abstract: a method for handling transmission-reception points (trps) by a user equipment (ue) in a communication system including multiple trps, comprising: receiving a plurality of trp signals from a plurality of trps in the communication system; determining a set of trps from the plurality of trps based on a plurality of network parameters; clustering the set of trps into at least one cluster based on at least one characteristic related to the plurality of trp signals; selecting a cluster for path switching from the at least one cluster; determining whether the selected cluster comprises a trp better than a current trp used by the ue; switching to the better trp from the current trp based on determining that the selected cluster comprises the trp better than the current trp; and transmitting a trp switch message to at least one network apparatus.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/28, H04W36/18, H04W36/08
Abstract: the present disclosure relates to: a communication technique for convergence of iot technology and a 5th generation (5g) or a pre-5g communication system for supporting a higher data transmission rate than a 4th generation (4g) communication system such as long term evolution (lte); and a system therefor. the present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, and the like) on the basis of 5g communication technology and iot-related technology. according to various embodiments of the present disclosure, a method and a device for preventing potential errors that may occur when performing a daps handover can be provided.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/36
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in wireless communication system, the method comprising: receiving, from a source master node (s-mn), a measurement configuration including a first condition for a conditional handover (cho) and a second condition for a conditional primary secondary cell group cell (pscell) change (cpc); and in case that the first condition and the second condition are met, performing the cho to a target master node (t-mn) and the cpc to a target secondary node (t-sn).
Inventor(s): Milos TESANOVIC of Staines (GB) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W40/22, H04W40/12
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a routing method in a wireless communication system comprising a network, a destination remote user equipment (ue), and at least one intermediate ue, the method comprising: selecting at least one path of a plurality of paths for communicating data between the network and destination remote ue; wherein at least one of the plurality of paths is an indirect path that includes the at least one intermediate ue; and wherein the at least one intermediate ue comprises at least one of a further remote ue and a relay ue.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Chadi KHIRALLAH of Staines (GB) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/04, H04W60/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W48/08, H04W72/11, H04W72/23, H04W72/12
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method includes receiving configuration information of a first ssb by a ue and receiving, based on the configuration information, the first ssb for use in synchronization and/or measurement. the first ssb comprises fewer signals than a second ssb. in other words, the first ssb is simpler than the second ssb, so the first ssb is more energy-saving than the second ssb, so that the purpose of saving power on the base station side can be achieved.
Inventor(s): Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W8/06, H04W24/04
Abstract: in a scenario, wherein the ue is registered for disaster roaming services with the vplmn, in a disaster scenario, the ue can periodically attempt to obtain service on an allowable plmn. the ue can make a first attempt to obtain service on the allowable plmn, after a t1 duration and at most a t duration on selecting the vplmn.
Inventor(s): Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W8/06, H04W24/04
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate.
Inventor(s): Seunghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Hyewon YANG of Suwon-si (KR) for samsung electronics co., ltd., Jaewon LEE of Suwon-si (KR) for samsung electronics co., ltd., Junyung YI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W76/28
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system includes receiving, by a wake up receiver (wur) of the ue, information on wake-up from a base station (bs), triggering activation or inactivation of a main radio of the ue, based on the information on wake-up, and receiving, by the main radio of the ue, a downlink signal from the bs, when the activation of the main radio of the ue is triggered.
Inventor(s): Aris Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04L5/00, H04W72/23, H04W72/0446, H04W72/0453
Abstract: a method of a user equipment (ue) for controlling a signal comprises receiving configuration information for enabling or disabling a signal transmission, receiving a first physical downlink control channel (pdcch) conveying a first downlink control information (dci) format, decoding the first dci format, determining whether the first dci format is correctly decoded; and transmitting the signal or suspending a transmission of the signal according to the configuration information when the first dci format is not correctly decoded.
Inventor(s): Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/14, H04W52/24
Abstract: methods and apparatuses for transmit power control (tpc) for uplink (ul) signals. a method includes receiving first information for a set of operation states for a set of cells and second information for a set of values for a power control parameter. the method further includes determining a first power for a transmission of a first physical uplink control channel (pucch) based on the first pucch including first information bits that indicate a first operation state from the set of operation states for a first cell from the set of cells and a first value from the set of values for the power control parameter. the method further includes transmitting the first pucch with the first power.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. embodiments herein disclose a method for grouping of paging for multiple ues in a paging occasion in a wireless network () by an amf entity (). the method includes determining paging sub-group information to be allocated to a ue () based on characteristics of the ue (). further, the method includes allocating the paging sub-group information to the ue () for paging. further, the method includes sending the allocated paging sub-group information to the ue () and a gnodeb (). the method can be used to provide a paging reduction feature to improve a power consumption performance for the ue () in the wireless network (). the proposed method can be used to reduce a false alarm occurrence for the ue (), so as to provide efficient paging reception approach for the ue (), when the ue () is in an idle mode/inactive mode.
Inventor(s): Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/02, H04W4/40, H04W72/23
Abstract: a method is provided. the method is performed by a user equipment (ue), of performing sidelink communication, and includes obtaining a valid system information block (sib) for sidelink communication, autonomously determining a sidelink resource based on information of a pool of sidelink resources included in the valid sib for sidelink communication, and performing sidelink communication with another ue using the determined sidelink resource.
20240057043.SYSTEMS AND METHODS FOR BEAM PAIRING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yaser Mohamed Mostafa Kamal FOUAD of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd., Liang HU of San Diego CA (US) for samsung electronics co., ltd., Mohamed Mokhtar Gaber Moursi AWADIN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Yuhan ZHOU of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/044, H04W72/30
Abstract: a system and a method are disclosed for beam pairing. in some embodiments, the method includes: accessing, by a first user equipment (ue), configuration data indicating a slot structure including a plurality of resources for transmissions in different directions; and based on the configuration data, transmitting, by the first ue, in a single slot, a first transmission portion using a first resource of the plurality of resources with a first beam direction and a second transmission portion using a second resource of the plurality of resources with a second beam direction, different from the first beam direction.
Inventor(s): Songhui SHEN of Beijing (CN) for samsung electronics co., ltd., He WANG of Beijing (CN) for samsung electronics co., ltd., Liying ZHOU of Beijing (CN) for samsung electronics co., ltd., Yiyan ZHANG of Beijing (CN) for samsung electronics co., ltd., Lei WANG of Beijing (CN) for samsung electronics co., ltd., Chaeman LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/044
Abstract: a method performed by a base station, comprises transmitting a reference signal associated with a first beam in a beambook to a user equipment (ue), wherein the beambook comprises a first beam set including the first beam and a second beam set. the method comprises determining a transmitting beam of the first beam set and the second beam set based on measurement information including received power value of the reference signal received from the ue. the method comprises determining index of the first beam corresponding to the transmitting beam in case that the transmitting beam is a second beam included in the second beam set. the method comprises transmitting beam information including the index to the ue. the first beam is configured to measure the received power value. a signal transmitted using the first beam and a signal transmitted using the second beam are received using a receiving beam of the ue.
Inventor(s): Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/1263, H04W72/25, H04W72/52
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes identifying information on a first sidelink (sl) communication of a first communication scheme and performing resource allocation of a second sl communication of a second communication scheme based on the information on the first sl communication. the first sl communication scheme is different from the second sl communication scheme.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., Miao ZHOU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L5/00, H04W48/12, H04W72/232
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a ue in a wireless communication system, the method comprising: receiving, from a base station, a first search space id for a first cell and a second search space id for a second cell, the first search space id and the second search space id being same; receiving, from the base station on the first cell, first dci for scheduling a pusch for one or more cells including the second cell, wherein at least one of a size of the first dci, blind detection for the first dci, or a cce for the first dci is based on a configuration of the second cell; and transmitting, to the base station, the pusch on the one or more cells based on the first dci.
Inventor(s): Mohamed Mokhtar Gaber Moursi AWADIN of San Diego CA (US) for samsung electronics co., ltd., Hamid SABER of San Diego CA (US) for samsung electronics co., ltd., Yuan-Sheng CHENG of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Mohammed KARMOOSE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04W72/20, H04L1/1812
Abstract: a system and a method are disclosed for using a single dci to schedule multi-pdschs to have multiple pucch occasions for sending harq feedback for the pdschs. a method includes receiving, from a base station, a dci for multiple pdschs, the dci including an indication of at least one pri and at least one timing indicator (k1) for providing multiple pucchs to carry harq feedback for the pdschs; receiving the pdschs from the base station; determining a pri value and a k1 value for each of the multiple pucchs, based on the indication of the at least one pri and the at least one k1; and transmitting, to the base station, at least one pucch among the multiple pucchs including the harq feedback for the pdschs, based on the determined pri and k1 values.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04W4/06
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the present disclosure provides method and apparatus for mbs reception or mbms reception in rrc idle/inactive state.
Inventor(s): Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd., Sangkyu BAEK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/30, H04W4/06
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides an apparatus, a method and a system for mbs multicast reception and small data transmission. a method performed by a terminal includes receiving, from a bs, an rrc release message including information indicating a suspend configuration for an rrc inactive state; identifying whether an sdt procedure is ongoing in the rrc inactive state, in case that there is a configuration by an upper layer for mbs multicast reception; and monitoring a paging channel for paging using a tmgi associated with an mbs session, based on the sdt procedure being not ongoing. the mbs session is associated with a bearer for the mbs multicast reception.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04L1/1867, H04W76/27
Abstract: the disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method and apparatus for handling sidelink communication according to type of handover are provided.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/15
Abstract: methods and apparatuses for choosing the operating mode for multi-link devices in a wireless local area network communications system. a non-access point (ap) multi-link device (mld) includes stations (stas), each sta including a transceiver configured to form a link with a corresponding ap of an ap mld, and a processor operably coupled to the stas. the processor is configured to determine whether to evaluate a set of available modes of operation of the non-ap mld based on a triggering event, obtain a set of parameters for evaluating the set of available modes of operation, evaluate the set of available modes of operation based on the set of parameters, determine whether to change a current operating mode of the non-ap mld based on the evaluation.
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04W16/28, H04W76/20
Abstract: methods and apparatuses for resource association and link recovery for repeaters in a wireless communication system. a method for a network-controlled repeater (ncr) includes receiving first information for time-domain resources and for corresponding beams for an access link and receiving or transmitting radio frequency (rf) signals on the access link using the beams over the corresponding time-domain resources prior to a link failure event. the method further includes determining the link failure event on a control link (c-link) and performing a link recovery procedure on the c-link. the method further includes suspending receiving or transmitting the rf signals on the access link using the beams over the corresponding time-domain resources during the link recovery procedure.
Inventor(s): Zhe Chen of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Bin YU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04W16/28, H04W72/25
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a network-controlled repeater (ncr) in a wireless communication system includes receiving, from a base station, side control information including configuration information for forwarding signals between the base station and user equipment (ue), wherein the configuration information includes information on beam indication for the forwarding to the ue. the method further includes forwarding the signals between the base station and the ue based on the information on the beam indication, in case that a random access procedure triggered by beam failure recovery, for a mobile termination (mt) of the ncr, is completed.
Inventor(s): Donggun KIM of Seoul (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04L69/22, H04L47/34, H04W28/06
Abstract: the disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as a smart home, a smart building, a smart city, a smart car, a connected car, health care, digital education, a smart retail, security and safety services.
Inventor(s): Jeongseok YU of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04W8/24
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure relates to a method performed by a terminal in a wireless communication system, the method comprises transmitting, to a base station, a first message including first information indicating whether a connected mode-discontinuous reception (c-drx) cycle of a non-integer format is supported, receiving, from the base station, a second message including c-drx configuration including information on the c-drx cycle based on the first information and configuring the c-drx cycle based on the information on the c-drx cycle.
20240057320.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyumin KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyong Song of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoung AN of Suwon-si (KR) for samsung electronics co., ltd., Jieun LEE of Suwon-si (KR) for samsung electronics co., ltd., Deoksung Hwang of Suwon-si (KR) for samsung electronics co., ltd., Yejin Kwon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device may include bit line structures extending in one direction on a substrate, insulation structures between the bit line structures and spaced apart from each other, and a landing pad structure in each of openings between the bit line structures and the insulation structures. the landing pad structure may include a first barrier metal pattern filling a portion of the opening, a second barrier metal pattern along a surface profile of the opening on the first barrier metal pattern, and a first metal pattern on the second barrier metal pattern. the second barrier metal pattern may have end portions on the bit line structures adjacent the opening. the first metal pattern may have an upper surface higher than an upper surface of the bit line structure. an uppermost surface of the first barrier metal pattern is lower than a lowermost surface of the first metal pattern.
20240057321.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daejin NAM of Suwon-si (KR) for samsung electronics co., ltd., Boreum LEE of Suwon-si (KR) for samsung electronics co., ltd., Kongsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunguk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device may include a substrate including an active pattern, a conductive filling pattern on an impurity region at an upper portion of the active pattern, a first spacer and a second spacer stacked on a sidewall of the conductive filling pattern in a horizontal direction, and a bit line structure on the conductive filling pattern. the impurity region may include impurities. the horizontal direction may be parallel to an upper surface of the substrate. the first spacer may include an insulating material containing the impurities.
Inventor(s): Hyeon Woo JANG of Suwon-si (KR) for samsung electronics co., ltd., Soo Ho SHIN of Hwaseong-si (KR) for samsung electronics co., ltd., Dong Sik PARK of Suwon-si (KR) for samsung electronics co., ltd., Jong Min LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Ji Hoon CHANG of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: the present disclosure provides a semiconductor memory device with improved element performance and reliability. the semiconductor memory device includes a substrate, a gate electrode extending in a first direction in the substrate, a plurality of buried contacts on the substrate, and a fence in a trench between adjacent ones of the buried contacts. the fence is on the gate electrode. the fence includes a spacer film on side walls of the trench and extending in a second direction intersecting the first direction, and a filling film in the trench and on the spacer film. an upper surface of the spacer film is lower than an upper surface of the filling film with respect to the substrate.
Inventor(s): Ik-Joon Choi of Suwon-si (KR) for samsung electronics co., ltd., Kihyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungchul Park of Suwon-si (KR) for samsung electronics co., ltd., Minjun Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyung Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, G11C11/408
Abstract: a semiconductor memory device includes n physical banks, each of which is configured to be entirely or partially included in one of a first logic bank or a second logic bank and arranged in a row direction, wherein n is an integer that is greater than or equal to 3, and wherein a proportion of a sum of respective widths of the n physical banks in the row direction to a height of the n physical banks in a column direction is a real number multiple that is not a multiple of 2.
Inventor(s): Changhun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeick SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/41, H10B41/27, H10B43/27, H10B43/40, H01L23/522, H01L23/528, G11C16/04, H01L25/065
Abstract: a semiconductor device, and more particularly, to a memory device having a three-dimensional structure are provided. the memory device various example embodiments includes a cell region and a peripheral circuit region that at least partially overlaps the cell region when viewed in plan view. the peripheral circuit region includes a first sub-peripheral circuit region including a substrate and a circuit element on the substrate, and a second sub-peripheral circuit region that is stacked on the first sub-peripheral circuit region in a vertical direction and that includes a sub-poly structure and a circuit element on the sub-poly structure.
Inventor(s): Moorym CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jungtae SUNG of Suwon-si (KR) for samsung electronics co., ltd., Sunil SHIM of Suwon-si (KR) for samsung electronics co., ltd., Yunsun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27, H10B41/35, H10B43/35, H10B80/00
Abstract: a semiconductor memory device includes: a stack including interlayer insulating layers and conductive patterns, which are alternately stacked; a source conductive pattern on the stack; and vertical structures provided to penetrate the stack and connected to the source conductive pattern. each of the vertical structures includes: a vertical channel pattern; a data storage pattern enclosing an outer side surface of the vertical channel pattern; a vertical insulating pillar in the vertical channel pattern; and a vertical conductive pillar disposed between the vertical insulating pillar and the source conductive pattern to connect the vertical channel pattern to the source conductive pattern.
Inventor(s): Kohji Kanamori of SEONGNAM-SI (KR) for samsung electronics co., ltd., Jee Hoon Han of HWASEONG-SI (KR) for samsung electronics co., ltd., Seo-Goo Kang of SEOUL (KR) for samsung electronics co., ltd., Hyo Joon Ryu of HWASEONG-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, G11C8/14, G11C7/18, H10B41/10, H10B41/27, H10B41/40, H10B43/10, H10B43/40
Abstract: a semiconductor memory device includes; a lower stacked structure including lower metallic lines stacked in a first direction on a substrate, an upper stacked structure including a first upper metallic line and a second upper metallic line sequentially stacked on the lower stacked structure, a vertical structure penetrating the upper stacked structure and lower stacked structure and including a channel film, a connection pad disposed on the vertical structure, contacted with the channel film and doped with n-type impurities, a first cutting line cutting the lower metallic lines, the first upper metallic line and the second upper metallic line, a second cutting line spaced apart from the first cutting line in a second direction different from the first direction, and cutting the lower metallic lines, the first upper metallic line and the second upper metallic line, and sub-cutting lines cutting the first upper metallic line and the second upper metallic line between the first cutting line and the second cutting line. the channel film includes an undoped channel region and a doping channel region, and the doping channel region contacts the connection pad and overlaps a part of the second upper metallic line in the second direction.
20240057342.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Woo Bin Song of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/30, H01L29/06, H01L29/78, H01L29/786, H01L29/423
Abstract: a semiconductor device includes a substrate including a first region and a second region, a first gate stack on the first region and including a first gate stacked insulating film and a first gate electrode on the first gate stacked insulating film, and a second gate stack on the second region and including a second gate stacked insulating film and a second gate electrode on the second gate stacked insulating film, wherein a width of the first gate stack is greater than a width of the second gate stack and the second gate stacked insulating film includes a plurality of ferroelectric material films.
Inventor(s): Wooyoung YANG of Suwon-si (KR) for samsung electronics co., ltd., Hyungjun Kim of Seoul (KR) for samsung electronics co., ltd., Hajun Sung of Suwon-si (KR) for samsung electronics co., ltd., Kiyeon Yang of Suwon-si (KR) for samsung electronics co., ltd., Changseung Lee of Suwon-si (KR) for samsung electronics co., ltd., Changyup Park of Suwon-si (KR) for samsung electronics co., ltd., Seung-min Chung of Seoul (KR) for samsung electronics co., ltd., Sangyoon Lee of Seoul (KR) for samsung electronics co., ltd., Inkyu Sohn of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/10, H10N70/20, H10N70/00, H10B63/00
Abstract: a memory element includes a substrate, a first electrode formed on the substrate, a phase-change heterolayer formed on the first electrode and electrically connected to the first electrode, and a second electrode formed on the phase-change heterolayer, wherein the phase-change heterolayer includes one or more confinement material layers and one or more phase-change material layers, and the confinement material layer includes a metal chalcogenide film.
Inventor(s): Joonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Taegon Kim of Suwon-si (KR) for samsung electronics co., ltd., Shinae Jun of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho Choi of Suwon-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si` (KR) for samsung electronics co., ltd., Jiwhan Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K59/38, C09K11/06, C09K11/02, C09K11/88, C09K11/08, H10K85/30
Abstract: a display apparatus including a substrate including at least one blue light-emitting unit, and a color control portion provided on the substrate and configured to control a color of a light generated at the substrate, wherein the color control portion includes a first color control element, wherein the first color control element includes a first quantum dot for a green color conversion, the at least one blue light-emitting unit includes an emission layer, wherein the emission layer includes a host, a first dopant, and a second dopant, and wherein the display apparatus further satisfies conditions as defined herein.
Inventor(s): Hyeong-Ju KIM of Suwon-si (KR) for samsung electronics co., ltd., Chul Joon Heo of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae Park of Suwon-si (KR) for samsung electronics co., ltd., Feifei Fang of Suwon-si (KR) for samsung electronics co., ltd., Hwijoung Seo of Suwon-si (KR) for samsung electronics co., ltd., Hiromasa Shibuya of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung Yun of Suwon-si (KR) for samsung electronics co., ltd., Tae Jin Choi of Suwon-si (KR) for samsung electronics co., ltd., Hyerim Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K59/40, H10K39/00, H10K59/35
Abstract: a sensor-embedded display panel includes a light emitting element on a substrate and including a light emitting layer, and a photosensor on the substrate and including a photosensitive layer extending at least partially in parallel with the light emitting layer along an in-plane direction of the substrate. the light emitting element and the photosensor include separate, respective portions of each of first and second common auxiliary layers each extending continuously as a single piece of material under and on, respectively, each of the light emitting layer and the photosensitive layer. the photosensitive layer may include a light absorbing semiconductor having a homo energy level having a difference of less than about 1.0 ev from a homo energy level of the first common auxiliary layer and a lumo energy level having a difference of less than about 1.0 ev from a lumo energy level of the second common auxiliary layer.
SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD.
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