SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications published on June 13th, 2024
Summary of the patent applications from SAMSUNG ELECTRO-MECHANICS CO., LTD. on June 13th, 2024
- Summary:**
Samsung Electro-Mechanics Co., Ltd. has recently filed patents for advanced printed circuit boards with innovative features. These patents focus on improving connectivity, reliability, and efficiency in electronic devices. The circuit boards include unique structures like multiple metal layers, seed metal layers, and connecting layers with embedded portions. These innovations enhance conductivity, durability, and performance in various applications.
- Key Points of Patents:**
- Circuit board design with insulating, contact, connecting, and wiring layers.
- Unique connecting layer structure with embedded portions and seed metal layers.
- Insulation layer configurations with distinct features like cavities and recessed connection pads.
- Enhanced conductivity and reliability through innovative metal layer designs.
- Notable Applications:**
- Electronics manufacturing industry for producing high-quality circuit boards.
- Consumer electronics market for devices requiring advanced circuitry.
- Telecommunications, automotive, and aerospace industries for improved electronic devices.
Contents
- 1 Patent applications for SAMSUNG ELECTRO-MECHANICS CO., LTD. on June 13th, 2024
- 1.1 OPTICAL IMAGING SYSTEM (18584202)
- 1.2 OPTICAL IMAGING SYSTEM (18319892)
- 1.3 OPTICAL IMAGING SYSTEM (18419882)
- 1.4 OPTICAL IMAGING SYSTEM (18450790)
- 1.5 COIL COMPONENT (18383174)
- 1.6 MULTILAYER ELECTRONIC COMPONENT (18386090)
- 1.7 MULTILAYER CERAMIC CAPACITOR (18383565)
- 1.8 MULTILAYER ELECTRONIC COMPONENT (18132195)
- 1.9 MULTILAYER CERAMIC CAPACITOR (18537482)
- 1.10 MULTILAYER ELECTRONIC COMPONENT (18198533)
- 1.11 ANTENNA AND SUBSTRATE INCLUDING EMBEDDED ANTENNA (18226358)
- 1.12 ACOUSTIC WAVE FILTER (18322233)
- 1.13 POWER SUPPLY SWITCH CIRCUIT AND SWITCH DRIVER CIRCUIT (18310723)
- 1.14 ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON (18213005)
- 1.15 PRINTED CIRCUIT BOARD (18138893)
- 1.16 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF (18199071)
- 1.17 PRINTED CIRCUIT BOARD (18208748)
- 1.18 CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME (18382321)
Patent applications for SAMSUNG ELECTRO-MECHANICS CO., LTD. on June 13th, 2024
OPTICAL IMAGING SYSTEM (18584202)
Main Inventor
Hag Chul KIM
OPTICAL IMAGING SYSTEM (18319892)
Main Inventor
You Jin JEONG
OPTICAL IMAGING SYSTEM (18419882)
Main Inventor
Jae Hyuk HUH
OPTICAL IMAGING SYSTEM (18450790)
Main Inventor
Byung Hyun KIM
COIL COMPONENT (18383174)
Main Inventor
Ye Ji JUNG
MULTILAYER ELECTRONIC COMPONENT (18386090)
Main Inventor
Bum Suk Kang
MULTILAYER CERAMIC CAPACITOR (18383565)
Main Inventor
Hyuk Jin HONG
MULTILAYER ELECTRONIC COMPONENT (18132195)
Main Inventor
Su Yun YUN
MULTILAYER CERAMIC CAPACITOR (18537482)
Main Inventor
Won Su SON
MULTILAYER ELECTRONIC COMPONENT (18198533)
Main Inventor
Ho Sam CHOI
ANTENNA AND SUBSTRATE INCLUDING EMBEDDED ANTENNA (18226358)
Main Inventor
Woo-Jung CHOI
ACOUSTIC WAVE FILTER (18322233)
Main Inventor
Jungwoo SUNG
POWER SUPPLY SWITCH CIRCUIT AND SWITCH DRIVER CIRCUIT (18310723)
Main Inventor
Jeonghoon KIM
ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON (18213005)
Main Inventor
Heung Kil Park
PRINTED CIRCUIT BOARD (18138893)
Main Inventor
Sangik CHO
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF (18199071)
Main Inventor
Kyehwan Lee
PRINTED CIRCUIT BOARD (18208748)
Main Inventor
Youn Gyu Han
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME (18382321)
Main Inventor
Heasung Kim
