SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
Patent Applications by SAMSUNG ELECTRO-MECHANICS CO., LTD. on June 27th, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.: 37 patent applications
SAMSUNG ELECTRO-MECHANICS CO., LTD. has applied for patents in the areas of H01G4/30 (8), G02B13/00 (7), H04N23/68 (4), H01G4/232 (4), H01G4/12 (4) G02B13/0045 (4), H01G4/2325 (3), H01G4/30 (3), H04N23/687 (2), H01F27/292 (2)
With keywords such as: lens, disposed, layer, surface, including, portion, direction, optical, body, and unit in patent application abstracts.
Patent Applications by SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s): Jin Woo YI of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sung Jun LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Tae Kyung LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sung Sun KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Young Kyo JUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B1/11
CPC Code(s): G02B1/11
Abstract: a lens includes a lens unit; an anti-reflective (ar) coating layer, disposed on one surface of the lens unit, including a first coating layer and a second coating layer alternately stacked one or more times, wherein a refractive index of the first coating layer is different from a refractive index of the second coating layer; and an intermediate layer, disposed between the lens unit and the ar coating layer, is formed of a same material as the first coating layer or the second coating layer. the intermediate layer is disposed on the lens unit by chemical vapor deposition (cvd).
20240210650.LENS MODULE_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Yeo Ok JEON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Se Yeon HWANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Seok Hwan KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B7/02
CPC Code(s): G02B7/021
Abstract: a lens module is provided. the lens module includes a plurality of lenses disposed along an optical axis, a lens barrel configured to accommodate the plurality of lenses, and a fixing member configured to fix at least one of the plurality of lenses to the lens barrel. the lens barrel includes a through-hole which accommodates a portion of the fixing member, a first end of the fixing member protrudes outwardly of the through-hole, and a diameter of the first end of the fixing member is greater than a diameter of the through-hole.
20240210653.OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Kil Soo SHIN of Suwon-si (KR) for samsung electro-mechanics co., ltd., Yong Joo JO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Il Yong PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyo Jin HWANG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B9/60, G02B3/04, G02B7/38, G02B13/18
CPC Code(s): G02B9/60
Abstract: an optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens sequentially disposed in ascending numerical order along an optical axis from an object-side surface of the first lens toward an imaging plane of the optical imaging system, wherein the conditional expression 11≤ttl/img_ht is satisfied, where ttl is a distance along the optical axis from the object-side surface of the first lens to the imaging plane, and img_ht is one-half of a diagonal length of the imaging plane.
20240210655.OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Yong Joo JO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Young Suk KANG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B9/34, H04N23/57, H04N25/53
CPC Code(s): G02B13/004
Abstract: an optical imaging system is provided. the optical imaging system has a first lens, a second lens, a third lens, and a fourth lens disposed in order from an object-side to an image-side. the optical imaging system satisfies the following conditional expressions: f no. ≤1.5, 0.5<epd/ttl <0.7, where epd is an entrance pupil diameter, and ttl is a distance from an object-side surface of the first lens to an imaging plane.
20240210657.OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Jong Pil KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B9/64
CPC Code(s): G02B13/0045
Abstract: an optical imaging system is provided. the optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, a ninth lens, and a tenth lens, sequentially disposed from an object side to an imaging side. the first lens may have positive refractive power, the second lens may have positive refractive power, and two of the third to fifth lenses may have positive refractive power.
20240210658.OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Dong Hyuk JANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sang Hyun JANG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B9/64
CPC Code(s): G02B13/0045
Abstract: an optical imaging system is provided. the optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, a ninth lens, and a tenth lens sequentially disposed from an object side to an imaging side. in the optical imaging system, a lens has positive refractive power. for example, in the optical imaging system, the third lens has positive refractive power. the optical imaging system satisfies the following conditional expressions: ttl/(2*imght)<0.66 and 0.5 mm<smt3456<1.5 mm. in the conditional expressions, ttl is a distance from an object-side surface of the first lens to an image plane, imght is a height of the image plane, and smt3456 is a sum of thicknesses of the third lens to the sixth lens.
20240210659.LENS MODULE_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Jin Hwa JUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B9/62, G02B13/18
CPC Code(s): G02B13/0045
Abstract: a lens module includes a first lens, an object-side surface thereof being convex; a second lens, both surfaces thereof being convex; a third lens, both surfaces thereof being concave; a fourth lens having positive refractive power, both surfaces thereof being convex; a fifth lens, an object-side surface thereof being concave; and a sixth lens, an object-side surface thereof being convex. the first to sixth lenses are sequentially disposed in numerical order from the first lens to the sixth lens from an object side of the lens module toward an image side of the lens module.
20240210660.OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Tae Youn LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jae Hyun BAIK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Yong Joo JO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Phil Ho JUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B9/62
CPC Code(s): G02B13/0045
Abstract: an optical imaging system includes a first lens having an image-side surface that is concave; a second lens having a refractive power; a third lens having an object-side surface that is convex; a fourth lens having an image-side surface that is concave; a fifth lens having a refractive power; and a sixth lens having a refractive power and an image-side surface having an inflection point, wherein the first lens through the sixth lens are sequentially disposed in numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system, and the optical imaging system satisfies tl/(2y)≤1.01 and 1.2≤tan �, where tl is a distance from an object-side surface of the first lens to the imaging plane, 2y is a diagonal length of the imaging plane, and � is half a field of view of the optical imaging system.
Inventor(s): So Mi YANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jin Se KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B5/00, G02B5/08, G02F1/1335
CPC Code(s): G02B13/0065
Abstract: a reflective member includes an incident surface configured to receive incident light; a reflective surface configured to receive the incident light from the incident surface and reflect the incident light; an emission surface configured to receive the reflected light from the reflective surface and emit the reflected light; and a light blocking portion disposed on at least one edge of either one or both of the incident surface and the emission surface, wherein an end of the light blocking portion includes a plurality of convex portions and a plurality of concave portions.
20240210667.ZOOM OPTICAL SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Tae Youn LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jung Hui KO of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B15/14, G02B5/00, G02B5/20, G02B13/00, G02B13/02, G02B27/00
CPC Code(s): G02B15/143507
Abstract: a zoom optical system includes a first lens group, a position of which with respect to an imaging plane is adjustable, and including first and second lenses. the zoom optical system also includes a second lens group of which a position with respect to the imaging plane is adjustable and includes third to fifth lenses. the zoom optical system further includes a third lens group including a sixth lens. an object-side surface of the first lens is convex.
20240210719.CAMERA MODULE_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Iksun LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jaekyung KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hwanjun KANG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B27/64, G03B5/00
CPC Code(s): G02B27/646
Abstract: a camera module is provided. the camera module includes a housing having an internal space; a folded module including a reflective member configured to change a path of light incident from the outside, and a movable holder on which the reflective member is mounted, the movable holder being disposed in the internal space and movably supported on an inner wall of the housing; a lens module including a lens barrel having a plurality of lenses aligned in an optical axis direction so that light reflected by the reflective member passes through the plurality of lenses; ois driving magnets mounted on the movable holder; and ois centering magnets provided adjacent to each other at a predetermined distance in a direction that intersects the ois driving magnets, and disposed to apply magnetic forces to each other.
Inventor(s): Young Hwan KWON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Su Kyeong KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Soo Cheol LIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Young Bok YOON of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G03B5/04
CPC Code(s): G03B5/04
Abstract: a camera module includes a carrier provided in a housing; a guide member disposed in the carrier, and configured to compensate for shaking in a perpendicular direction to an optical axis direction; a stopper configured to cover an upper portion of the carrier to accommodate the guide member; and a damper member, disposed in the stopper, comprising either one or both of an eleventh damper member opposing the guide member in a first direction perpendicular to the optical axis direction, and a twenty first damper member opposing the guide member in a second direction perpendicular to the optical axis direction and the first direction. the damper member directly opposes the guide member.
Inventor(s): Jaewoo JUN of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G03B5/06, G03B5/02, G03B5/04, H04N23/68
CPC Code(s): G03B5/06
Abstract: an actuator includes: a base; first, second, and third moving frames stacked on the base; an image sensor mounted on the first moving frame; a first sensor driving portion including first frame driving members and first shape memory alloy wires disposed outside an edge of the first moving frame to drive the first moving frame in a first direction perpendicular to the optical axis; a second sensor driving portion including second frame driving members and second shape memory alloy wires disposed outside an edge of the second moving frame to drive the second moving frame in a second direction perpendicular to the first direction; and a third sensor driving portion including third frame driving members and third shape memory alloy wires disposed outside an edge of the third moving frame to rotatably drive the third moving frame based on the optical axis.
20240210792.CAMERA ACTUATOR_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Ju Ho KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Donghoon LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sanghyun JI of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dooseub SHIN of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dohwan KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G03B13/36, G02B7/02
CPC Code(s): G03B13/36
Abstract: a camera actuator includes a lens module including a plurality of lenses, a carrier accommodating the lens module, a guiding unit disposed between the lens module and the carrier, a housing accommodating the carrier, a first actuator disposed between the lens module and the guiding unit, including a first portion attached to the guiding unit, and moving the lens module along a first direction perpendicular to an optical axis of the plurality of lenses, and a second actuator disposed between the guiding unit and the carrier, including a second portion attached to the guiding unit, and moving the lens module along a second direction perpendicular to the optical axis.
20240212917.COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Boum Seock KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/28, H01F27/32
CPC Code(s): H01F27/2823
Abstract: a coil component includes a support member, a coil unit including at least one of first and second coil patterns disposed on one surface and the other surface of the support member and respectively including a plurality of turns, and a body in which the support member and the coil unit are embedded, wherein at least one of an innermost turn and an outermost turn of the plurality of turns has a protrusion that protrudes in a direction away from the innermost turn and the outermost turn.
20240212918.COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Jin Young Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Ki Young Yoo of Suwon-si (KR) for samsung electro-mechanics co., ltd., Boum Seock Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/28, H01F27/29
CPC Code(s): H01F27/2828
Abstract: a coil component includes: a body; a coil buried in the body; an external electrode disposed on one surface of the body; and a lead-out portion connecting an end of the coil to the external electrode, wherein the lead-out portion and the end of the coil form an interface.
20240212922.COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Jong Pil LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Seok Hwan AHN of Suwon-si (KR) for samsung electro-mechanics co., ltd., No Il PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., A Reum KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/29, H01F17/00, H01F27/30
CPC Code(s): H01F27/292
Abstract: a coil component includes: a body including a core, and a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, wherein first and second recesses are formed on the third surface and the fourth surface, respectively; the coil being disposed inside the body, and including first and second withdrawal portions extending to at least one of the first or second recess; and a first external electrode disposed on the fifth surface of the body, extending to the first and second recesses, and connected to the first withdrawal portion; and a second external electrode disposed on the fifth surface of the body, extending to the first and second recesses, and connected to the second withdrawal portion.
20240212923.COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Soon Kwang Kwon of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dong Hwan Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd., Boum Seock Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jung Wook Seo of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/29, H01F27/32
CPC Code(s): H01F27/292
Abstract: the coil component according to an aspect of the present disclosure includes: a body having one surface and the other surface opposing each other, and a plurality of side surfaces connecting one side to the other side; a coil buried in the body and having an end exposed to the side surface of the body; an external electrode including a connection portion disposed on the side surface of the body and connected to the end of the coil, and an extension portion extending from the connection portion to one surface of the body; and a groove formed in one surface of the body and having a bottom surface, substantially parallel to one surface of the body, and an internal wall connecting the bottom surface to one surface of the body, wherein the extension portion extends along the internal wall and the bottom surface of the groove.
Inventor(s): Won Hee YOO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Young Hoon SONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyun Woo KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/012, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer electronic component includes a body including two or more unit electrode stacks, each unit electrode stack including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, wherein the two or more unit electrode stacks are arranged in a line in the first direction, a width of internal electrodes disposed in an upper portion of each unit electrode stack in the first direction among the internal electrodes and a width of internal electrodes disposed in a lower portion of each unit electrode stack in the first direction among the internal electrodes are smaller than a width of the internal electrodes disposed in a central portion in the first direction.
Inventor(s): Sung Yong Kang of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/12, C04B35/468, H01G4/248, H01G4/30
CPC Code(s): H01G4/1227
Abstract: a multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a ba/ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a ba/ti molar ratio of the capacitance forming portion, wherein the number of moles of mg based on 100 moles of ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of sn based on 100 moles of ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.
Inventor(s): Hiroki OKADA of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jong Rock LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jun Il KANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hee Jung JUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chung Yeol LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Cheong KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/224, H01G4/252, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer electronic component according to an example embodiment of the present disclosure may include a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer between the internal electrodes, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the body; and a first inorganic material, including at least one inorganic material among sulfur (s) and fluorine (f), disposed in at least a portion between the body and the external electrodes.
Inventor(s): Hee Jung Jung of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jun II Kang of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jong Rock Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chung Yeol Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd., Cheong Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jin Hyung Lim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hiroki Okada of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body and including an electrode plating layer disposed to at least partially contact the internal electrodes, and a plating layer disposed on the electrode plating layer. the electrode plating layer may include a plurality of first crystal grains having a major axis of 0.2 �m or more, and the plurality of first crystal grains may have an average ratio of a major diameter to a minor axis to 1:1 to 3:1.
Inventor(s): Kyung Sik KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Seung In BAIK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jong Hwan LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Min Young CHOI of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/248, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces in the first direction, third and fourth surfaces in a second direction, and fifth and sixth surfaces in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. side margin portions includes batio, zn, and zr, an amount of zn and an amount of zr in the side margin portions are 0.5 mol or more and 1.0 mol or less, relative to 100 mol of ti included in the side margin portions. the amount of zn and the amount of zr in the side margin portions are different from an amount of zn and an amount of zr in the dielectric layer.
20240212939.COMPOSITE ELECTRONIC COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Kyung Moon JUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Seong Hwan PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dong Hyeon LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/30, H01G4/012, H01G4/12, H01G4/248
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and first and second external electrodes respectively disposed on the third and fourth surfaces, and a ceramic chip including a ceramic substrate and first and second terminal electrodes disposed on the ceramic substrate and respectively connected to the first and second external electrodes, the ceramic chip disposed on the first surface of the body. the ceramic substrate includes mgsio.
Inventor(s): Ho In JUN of Suwon-si (KR) for samsung electro-mechanics co., ltd., Byung Jun JEON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Yong Won SEO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chae Min PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyung Duk YUN of Suwon-si (KR) for samsung electro-mechanics co., ltd., A Ra CHO of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/12
CPC Code(s): H01G4/30
Abstract: a multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 �m�5 �m region selected from a cross-section of the first base plating layer in the first and second directions includes three or more ni grains having a grain size of 4 �m or greater.
Inventor(s): Chan Hee NAM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Oh Hun GWON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jae Hyun PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Kwan Yeol PAEK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chang Geon LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hae Suk CHUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/30, H01G4/012, H01G4/12, H01G4/232
CPC Code(s): H01G4/30
Abstract: a multilayer electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains having a perovskite-based composition represented by abo, the a includes a first element including at least one of bi, na, k, sr, and ca, and the b includes a second element including ti, wherein at least one of the plurality of dielectric grains has a core-shell structure, and a content of the first element included in the core portion is twice or more than a content of the first element included in the shell portion, and wherein the core portion includes a first core portion on an internal side and a second core portion covering at least a portion of the first core portion, and the second core portion includes zr.
Inventor(s): Sang-min Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01L23/00, H01L21/48, H01L23/498
CPC Code(s): H01L24/26
Abstract: a circuit board according to an embodiment includes: a first insulating layer that does not include a reinforcing material; a conductive pad that protrudes above a surface of the first insulating layer; a dam that protrudes from the surface of the first insulating layer and is disposed outside a region where the conductive pad is disposed on a plane; and a second insulating layer that is disposed below the first insulating layer and includes a reinforcing material. a height of the dam based on the surface of the first insulating layer is higher than a height of the conductive pad.
20240213509.SOLID OXIDE CELL STACK_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Sung Han KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jong Ho CHUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jung Ho SHIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jae Hyuk JANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Bon Seok KOO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hong Ryul LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01M8/1233, H01M8/0273, H01M8/04007, H01M8/2432, H01M8/2484
CPC Code(s): H01M8/1233
Abstract: a solid oxide cell stack includes a first end plate having a flow path, a solid oxide cell disposed on the first end plate, and a second end plate including a lower region disposed on the solid oxide cell and having a first through-hole, and an upper region disposed on the lower region and having a second through-hole. in the second end plate, an inner sidewall of the upper region forming the second through-hole is inclined such that a width of the second through-hole increases in an upward direction.
Inventor(s): Youngwong JANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jeonghoon KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Shinichi IIZUKA of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jongok HA of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyejin LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H03F1/52, H02H7/00, H03F3/21
CPC Code(s): H03F1/523
Abstract: an overcurrent protection circuit includes a variable voltage source configured to generate a first voltage which that in response to a variable current; an amplifier comprising a first input terminal to which the first voltage is applied; and a limit current source connected to a second input terminal of the amplifier and configured to generate a limit current corresponding to the first voltage.
20240213934.POWER AMPLIFIER_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Youngwong JANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jeonghoon KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Shinichi IIZUKA of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyejin LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jongok HA of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H03F3/21, H03F1/02, H03F1/52
CPC Code(s): H03F3/21
Abstract: a power amplifier includes: a power transistor to receive a power voltage; a first transistor including a first terminal to provide a bias current to the power transistor; and an overpower protection circuit to generate a first current corresponding to the power voltage and to provide the first current to a second terminal of the first transistor. the overpower protection circuit includes: a limiting current source to provide a limiting current to the second terminal of the first transistor; and a sink current generating circuit including a second transistor that includes a control terminal to which a voltage corresponding to the power voltage is applied and a first terminal connected to the second terminal of the first transistor, and to sink a second current from the limiting current.
Inventor(s): Jong Woo HONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Kyung Hun LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H04N23/68, H04N23/54
CPC Code(s): H04N23/685
Abstract: an actuator for optical image stabilization includes a fixed frame having an internal space, a movable frame disposed in the fixed frame and configured to be movable relative to the fixed frame, a first driving unit configured to apply a driving force to the movable frame, and a sensor substrate including a moving portion coupled to the movable frame, wherein an image sensor is disposed on the sensor substrate, the first driving unit includes a first sub-driving unit including a first magnet disposed on the fixed frame and a first coil disposed to face the first magnet, and a second sub-driving unit including a second magnet disposed on the fixed frame and a second coil disposed to face the second magnet, and a portion of the first magnet overlaps a portion of the second magnet in a direction perpendicular to an imaging surface of the image sensor.
Inventor(s): Kyung Hun LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jong Ho LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H04N23/68, H04N23/54
CPC Code(s): H04N23/687
Abstract: an actuator for optical image stabilization includes a fixed frame having an internal space, a movable frame accommodated in the fixed frame and movable relative to the fixed frame, a first driving unit including a plurality of coils disposed on one of the fixed frame and the movable frame and a plurality of magnets disposed on the other, and a sensor substrate including a moving portion coupled to the movable frame, wherein a wiring pattern is disposed inside one of the fixed frame and the movable frame, and the plurality of coils and the sensor substrate are electrically connected by the wiring pattern.
20240214683.CAMERA MODULE_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Ju Ho KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Donghoon LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sanghyun JI of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dooseub SHIN of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dohwan KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H04N23/68, G03B3/10, G03B13/34, H04N23/54, H04N23/55, H04N23/57
CPC Code(s): H04N23/687
Abstract: a camera module includes a lens module including a plurality of lenses, a carrier accommodating the lens module, a guiding unit disposed between the lens module and the carrier, a housing accommodating the carrier, a first actuator disposed between the lens module and the guiding unit, including a first portion disposed on the guiding unit, and moving the lens module along a first direction perpendicular to an optical axis of the plurality of lenses, and a second actuator disposed between the guiding unit and the carrier, including a second portion disposed under the guiding unit, and moving the lens module along a second direction perpendicular to the optical axis.
20240215157.PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Ki Ran PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyun Woo KWON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Tae Hong MIN of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sang Hyun HAN of Suwon-si (KR) for samsung electro-mechanics co., ltd., Guh Hwan LIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Yo Han SONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dong Keun LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Kyeong Yub JUNG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Eun Gyu JEONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Yu Mi KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/02, H05K3/10, H05K3/42
CPC Code(s): H05K1/0298
Abstract: a printed circuit board includes: a first insulating layer; a via pad disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a via hole exposing at least a portion of an upper surface of the via pad; a conductor pattern disposed on the exposed upper surface of the via pad; and a via including a first metal layer covering at least a portion of each of a wall surface of the via hole, the exposed upper surface of the via pad, and the conductor pattern, and a second metal layer disposed on the first metal layer and disposed in at least a portion of the via hole.
Inventor(s): Mi Jeong JEON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyun Seok YANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Tae Hee YOO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chan Jin PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/03, H05K3/00, H05K3/40
CPC Code(s): H05K1/0306
Abstract: a printed circuit board includes a first insulating layer, a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof, and a second metal layer disposed on the first metal layer. a method of manufacturing a printed circuit board includes forming a first metal layer on a first insulating layer, forming a second metal layer on a portion of the first metal layer, oxidizing another portion of the first metal layer to form a first oxidation region, and removing at least a portion of the first oxidation region.
Inventor(s): Sang-min Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd., Youngil Cho of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/03, H05K1/11, H05K3/00, H05K3/10
CPC Code(s): H05K1/0353
Abstract: a circuit board according to an embodiment includes: a first insulating layer that does not include a reinforcing material; a conductive pad that protrudes above a surface of the first insulating layer, and a second insulating layer that is disposed below the first insulating layer and includes a reinforcing material. a corner of the conductive pad has a curved shape.
20240215165.PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Myong Keun Jung of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyun Woo Kwon of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/11, H05K1/02, H05K3/46
CPC Code(s): H05K1/115
Abstract: a printed circuit board includes: a first board unit including a first insulating layer having a first via hole, a first wiring layer disposed on or in the first insulating layer, and a first via including a first metal layer substantially filling the first via hole; and a second board unit including a second insulating layer having a second via hole, a second wiring layer disposed on or in the second insulating layer, and a second via including a second metal layer substantially filling the second via hole. the second board unit is disposed on the first board unit, the second wiring layer has a higher wiring density than that of the first wiring layer, and the second metal layer has a plating structure different from that of the first metal layer.
SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- G02B1/11
- CPC G02B1/11
- Samsung electro-mechanics co., ltd.
- G02B7/02
- CPC G02B7/021
- G02B9/60
- G02B3/04
- G02B7/38
- G02B13/18
- CPC G02B9/60
- G02B13/00
- G02B9/34
- H04N23/57
- H04N25/53
- CPC G02B13/004
- G02B9/64
- CPC G02B13/0045
- G02B9/62
- G02B5/00
- G02B5/08
- G02F1/1335
- CPC G02B13/0065
- G02B15/14
- G02B5/20
- G02B13/02
- G02B27/00
- CPC G02B15/143507
- G02B27/64
- G03B5/00
- CPC G02B27/646
- G03B5/04
- CPC G03B5/04
- G03B5/06
- G03B5/02
- H04N23/68
- CPC G03B5/06
- G03B13/36
- CPC G03B13/36
- H01F27/28
- H01F27/32
- CPC H01F27/2823
- H01F27/29
- CPC H01F27/2828
- H01F17/00
- H01F27/30
- CPC H01F27/292
- H01G4/012
- H01G4/30
- CPC H01G4/012
- H01G4/12
- C04B35/468
- H01G4/248
- CPC H01G4/1227
- H01G4/232
- H01G4/224
- H01G4/252
- CPC H01G4/2325
- CPC H01G4/30
- H01G4/008
- H01L23/00
- H01L21/48
- H01L23/498
- CPC H01L24/26
- H01M8/1233
- H01M8/0273
- H01M8/04007
- H01M8/2432
- H01M8/2484
- CPC H01M8/1233
- H03F1/52
- H02H7/00
- H03F3/21
- CPC H03F1/523
- H03F1/02
- CPC H03F3/21
- H04N23/54
- CPC H04N23/685
- CPC H04N23/687
- G03B3/10
- G03B13/34
- H04N23/55
- H05K1/02
- H05K3/10
- H05K3/42
- CPC H05K1/0298
- H05K1/03
- H05K3/00
- H05K3/40
- CPC H05K1/0306
- H05K1/11
- CPC H05K1/0353
- H05K3/46
- CPC H05K1/115
