SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
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Contents
- 1 SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Filing Activity
- 2 SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications in 2024
- 3 Top 10 Technology Areas
- 4 Emerging Technology Areas
- 5 Top Inventors
- 6 Patent Categories
- 7 Geographical Distribution of Inventors
- 8 Geographical Distribution of US Inventors
SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Filing Activity
SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications in 2024
Top 10 Technology Areas
- H01G4/30 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- Count: 94 patents
- Example: 20240234032. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- G02B13/0045 ({having five or more lenses})
- Count: 57 patents
- Example: 20240231047. OPTICAL IMAGING SYSTEM simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01G4/012 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- Count: 55 patents
- Example: 20240234032. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01G4/1227 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- Count: 35 patents
- Example: 20240234032. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01G4/008 (Fixed capacitors; Processes of their manufacture (electrolytic capacitors)
- Count: 35 patents
- Example: 20240234032. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- G02B9/64 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS)
- Count: 34 patents
- Example: 20240231045. OPTICAL IMAGING SYSTEM simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- H01G4/2325 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric)
- Count: 24 patents
- Example: 20240186069. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H01F27/292 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites)
- Count: 22 patents
- Example: 20240234013. COIL COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H04N23/55 (PICTORIAL COMMUNICATION, e.g. TELEVISION)
- Count: 22 patents
- Example: 20240236461. CAMERA MODULE simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H04N23/54 (PICTORIAL COMMUNICATION, e.g. TELEVISION)
- Count: 20 patents
- Example: 20240231050. OPTICAL SYSTEM simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Emerging Technology Areas
- H05K2201/10734 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240049389. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H05K1/05 (Insulated {conductive substrates, e.g. insulated} metal substrate)
- Count: 1 patents
- Example: 20240049389. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- H05K1/0313 (Use of materials for the substrate)
- Count: 1 patents
- Example: 20240049389. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- G02B1/118 (having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures)
- H05K2201/10204 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/176 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K1/036 (Use of materials for the substrate)
- H05K3/4626 (Manufacturing multilayer circuits)
- H05K2201/10121 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K1/183 (Printed circuits structurally associated with non-printed electric components ({)
Top Inventors
- Yong Joo JO (43 patents)
- Jae Hyuk HUH (22 patents)
- Boum Seock KIM (14 patents)
- Hag Chul KIM (13 patents)
- Phil Ho JUNG (12 patents)
- Jong Ho LEE (12 patents)
- Byeong Cheol MOON (11 patents)
- So Mi YANG (10 patents)
- Byung Hyun KIM (10 patents)
- You Jin JEONG (9 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
SAMSUNG ELECTRO-MECHANICS CO., LTD. Inventor States 2024 - Up to June 2024
Categories:
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- CPC G02B5/208
- CPC G02B7/04
- CPC G02B13/0045
- CPC G02B13/04
- CPC G02B13/18
- CPC H04N23/54
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- CPC G02B15/143105
- CPC G02B13/0035
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- CPC H05K1/0313
- CPC H05K1/05
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- Patent Trends by Company in 2024
