Rohm co., ltd. (20240282748). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Tomohira Kikuchi of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282748 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a conductive support member, a control element, an insulating element, a driver element, and a sealing resin. The conductive support member consists of a first lead and a second lead, each with a pad portion. The control element is mounted on the first pad portion, while the insulating element is mounted on the first pad portion and connected to the control element. The driver element is mounted on the second pad portion and connected to the insulating element. The sealing resin covers all components.
- The semiconductor device features a unique layout of the first and second pad portions, with the second pad portion adjacent to the first pad portion in a specific direction.
- The control element and insulating element are strategically placed on the first pad portion for efficient electrical connections.
- The driver element is positioned on the second pad portion for optimal performance and connectivity.
- The sealing resin provides protection and encapsulation for all components, ensuring durability and longevity.
- The design of the semiconductor device enhances functionality and reliability in various applications.
Potential Applications: - Consumer electronics - Automotive systems - Industrial machinery - Telecommunications equipment
Problems Solved: - Improved electrical connections - Enhanced device durability - Efficient component layout
Benefits: - Increased device performance - Extended lifespan - Enhanced reliability
Commercial Applications: The semiconductor device can be utilized in a wide range of commercial products, including smartphones, vehicles, factory automation systems, and communication devices. Its innovative design and reliable performance make it a valuable component in various industries.
Questions about the semiconductor device: 1. How does the unique layout of the pad portions contribute to the overall performance of the semiconductor device? 2. What specific advantages does the sealing resin provide in terms of protecting the components of the device?
Original Abstract Submitted
a semiconductor device includes a conductive support member, a control element, an insulating element, a driver element and a sealing resin. the conductive support member includes a first lead and a second lead. the first lead has a first pad portion. the second lead has a second pad portion. the second pad portion is adjacent to the first pad portion in a first direction perpendicular to a thickness direction of the first pad portion. the control element is mounted on the first pad portion. the insulating element is mounted on the first pad portion and electrically connected to the control element. the driver element is mounted on the second pad portion and electrically connected to the insulating element. the sealing resin covers the first pad portion, the second pad portion, the control element, the insulating element and the driver element. as viewed in the thickness direction, the first pad portion has a first edge adjacent to the second pad portion in the first direction and extending in a second direction perpendicular to the thickness direction and the first direction. the first edge has a first end and a second end opposite in the second direction. as viewed in the thickness direction, the second pad portion has a second edge adjacent to the first edge in the first direction and extending in the second direction. the second edge has a third end and a fourth end opposite in the second direction. one of the third end and the fourth end is located between the first end and the second end in the second direction.
