Rohm co., ltd. (20240282738). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282738 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a semiconductor device with a terminal electrode that covers a main surface electrode and has a gap portion penetrating the conductor layer in a thickness direction.
- The semiconductor device includes a chip with a main surface.
- A main surface electrode is arranged on the main surface.
- A terminal electrode covers the main surface electrode and has a gap portion penetrating the conductor layer in a thickness direction.
- The terminal electrode is fixed to the same potential as the main surface electrode.
Key Features and Innovation:
- Terminal electrode with a gap portion for improved functionality.
- Conductor layer covering the main surface electrode.
- Fixed to the same potential as the main surface electrode.
Potential Applications:
- Semiconductor industry for electronic devices.
- Integrated circuits.
- Power electronics.
Problems Solved:
- Improved electrical connectivity.
- Enhanced performance of semiconductor devices.
Benefits:
- Increased efficiency.
- Better electrical conductivity.
- Enhanced reliability.
Commercial Applications:
- Semiconductor manufacturing companies.
- Electronics industry for consumer products.
- Research and development in the semiconductor field.
Questions about Semiconductor Devices: 1. How does the terminal electrode improve the performance of the semiconductor device? 2. What are the potential applications of this technology in the electronics industry?
Frequently Updated Research:
Research on improving the design and functionality of semiconductor devices is ongoing, with a focus on enhancing performance and reliability.
By incorporating the terminal electrode with a gap portion, this semiconductor device aims to address issues related to electrical connectivity and performance in electronic devices. The innovation of fixing the terminal electrode to the same potential as the main surface electrode enhances the overall functionality of the semiconductor device. This technology has the potential for various applications in the semiconductor industry, offering benefits such as increased efficiency, better electrical conductivity, and enhanced reliability. Commercially, this innovation can be utilized by semiconductor manufacturing companies, electronics manufacturers, and research institutions in the field. Ongoing research in this area continues to explore ways to further improve semiconductor devices for a wide range of applications.
Original Abstract Submitted
a semiconductor device includes a chip having a main surface, a main surface electrode arranged on the main surface, and a terminal electrode that has a conductor layer covering the main surface electrode and a gap portion penetrating the conductor layer in a thickness direction as viewed in cross section, and that is fixed to a same potential as that of the main surface electrode.
