Rohm co., ltd. (20240282690). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Koshun Saito of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282690 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a lead with a terminal, partially covered by a sealing resin. The lead consists of a base and a metal layer covering the base, with the base having a first terminal-extending portion forming the terminal. The first terminal-extending portion extends in a direction crossing the thickness direction, with a first end facing in one direction and a first side wall facing in another direction.
- The lead of the semiconductor device has a unique design with a first terminal-extending portion that extends in a direction crossing the thickness direction.
- The metal layer covering the first end and the first side of the terminal-extending portion is strategically placed to avoid covering the third side.
- The sealing resin partially covers the terminal, providing protection while allowing the terminal to remain exposed in a specific direction.
Potential Applications: - This technology can be used in various semiconductor devices where leads need to be protected while remaining partially exposed. - It can be applied in electronic components, sensors, and other devices where precise lead design is crucial.
Problems Solved: - Provides a solution for protecting leads in semiconductor devices while maintaining functionality. - Ensures the reliability and durability of the device by preventing damage to the terminal.
Benefits: - Enhanced protection for leads in semiconductor devices. - Improved reliability and longevity of electronic components. - Allows for precise design and functionality in various applications.
Commercial Applications: Title: Advanced Lead Design for Semiconductor Devices This technology can be utilized in the manufacturing of electronic components, sensors, and other semiconductor devices. It offers improved protection and reliability, making it valuable in industries such as consumer electronics, automotive, and telecommunications.
Questions about the technology: 1. How does the unique lead design of this semiconductor device improve its performance and reliability? 2. What specific advantages does the metal layer covering the terminal provide in terms of protection and functionality?
Original Abstract Submitted
a semiconductor device includes a lead with a terminal, and a sealing resin partially covering the terminal. the lead includes a base and metal layer covering the base. the base has a first terminal-extending portion forming the terminal. the first terminal-extending portion, exposed from the sealing resin, extends in a first direction crossing the thickness direction. the first terminal-extending portion includes a first end facing in the first direction and a first side wall facing in a second direction crossing the thickness and first directions. the first side wall has, in the first direction, a first side closer to the first end, a second side closer to the sealing resin, and a third side between the first side and the second side. the metal layer, covering the first end, the first side and the second side, is provided at a location avoiding the third side.
