Rohm co., ltd. (20240282677). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Masaaki Mori of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282677 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a semiconductor element, a first lead with a die pad portion and a first terminal portion, and sealing resin. The first lead's reverse surface is exposed from a second resin surface, and the first terminal portion has three portions extending in different directions.
- The first terminal portion of the first lead extends outward from a resin surface in the x-direction.
- The second portion of the first terminal portion is used for mounting and is located on a side in the z-direction relative to the first portion.
- The third portion of the first terminal portion is interposed between the first and second portions.
- The second portion of the first terminal portion overlaps with the sealing resin in the z-direction.
Potential Applications: - This technology can be used in various semiconductor devices for improved performance and reliability. - It can be applied in electronic components where precise mounting and connectivity are crucial.
Problems Solved: - Provides a secure and reliable connection between the semiconductor element and external components. - Ensures proper mounting and alignment of the semiconductor device.
Benefits: - Enhanced durability and stability of semiconductor devices. - Improved manufacturing processes for electronic components.
Commercial Applications: - This technology can be utilized in the production of consumer electronics, automotive systems, and industrial machinery for efficient and reliable performance.
Questions about the technology: 1. How does the overlapping of the second portion of the first terminal portion with the sealing resin impact the overall stability of the semiconductor device? 2. What are the specific advantages of having the first terminal portion extend outward in the x-direction?
Frequently Updated Research: - Stay updated on advancements in semiconductor packaging techniques and materials to enhance the performance of semiconductor devices.
Original Abstract Submitted
a semiconductor device includes a semiconductor element; a first lead including a die pad portion and a first terminal portion, and a sealing resin. a first lead reverse surface is exposed from a second resin surface. the first terminal portion includes a first portion extending outward from a third resin surface to a first side in an x direction, a second portion located on a first side in a z direction relative to the first portion and used for mounting, and a third portion interposed between the first portion and the second portion. the second portion overlaps with the sealing resin as viewed in the z direction.
