Rohm co., ltd. (20240282676). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Ryotaro Kakizaki of Kyoto-shi (JP)
Yasumasa Kasuya of Kyoto-shi (JP)
Koshun Saito of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282676 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a semiconductor element, a lead, and a sealing resin. The lead includes a die pad and terminal, while the sealing resin has multiple surfaces facing different directions.
- The die pad on the lead has an obverse surface for mounting the semiconductor element and a reverse surface facing the opposite side.
- The sealing resin covers the semiconductor element and part of the die pad, with surfaces facing different directions.
- A portion of the lead reverse surface is exposed from the sealing resin, located on one side in a specific direction.
Potential Applications: - This technology can be used in various electronic devices that require reliable semiconductor components. - It can be applied in automotive electronics, consumer electronics, and industrial equipment.
Problems Solved: - Provides protection and insulation for the semiconductor element and lead connections. - Ensures the stability and longevity of the semiconductor device in different operating conditions.
Benefits: - Enhanced durability and reliability of semiconductor devices. - Improved performance and efficiency in electronic applications. - Cost-effective manufacturing process for producing high-quality semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Electronics Performance This technology can be utilized in the production of advanced electronic devices, catering to industries such as automotive, telecommunications, and IoT. The market implications include improved product quality, increased consumer trust, and potential for market expansion.
Questions about Semiconductor Devices: 1. How does the sealing resin contribute to the protection of the semiconductor element?
The sealing resin acts as a barrier against external factors such as moisture, dust, and mechanical stress, ensuring the longevity and reliability of the semiconductor device.
2. What are the key advantages of using a lead with a die pad in semiconductor devices?
The die pad provides a stable platform for mounting the semiconductor element, facilitating efficient heat dissipation and electrical connections.
Original Abstract Submitted
a semiconductor device includes a semiconductor element, a lead and a sealing resin. the lead includes a die pad and terminal. the die pad includes a lead obverse surface facing a first side in a thickness direction for mounting the semiconductor element, and a lead reverse surface facing a second side in the thickness direction. the sealing resin includes a first resin surface facing the first side in the thickness direction, a second resin surface facing the second side in the thickness direction, and a third resin surface facing a first side in a first direction orthogonal to the thickness direction. the sealing covers resin the semiconductor element and a part of the die pad. the lead reverse surface includes a portion exposed from the second resin surface and located on the first side in the first direction from the third resin surface as viewed in the thickness direction.
