Rohm co., ltd. (20240282675). POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD
Organization Name
Inventor(s)
Toshio Hanada of Kyoto-shi (JP)
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282675 titled 'POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD
The power module semiconductor device includes an insulating substrate, a first pattern disposed on the insulating substrate, a semiconductor chip disposed on the first pattern, power terminals, signal terminals electrically connected to the semiconductor chip, and a resin layer covering the semiconductor chip and the insulating substrate. The signal terminal is extended vertically with respect to the main surface of the insulating substrate.
- Insulating substrate
- First pattern
- Semiconductor chip
- Power terminal and signal terminal
- Resin layer
Potential Applications: - Power electronics - Automotive industry - Renewable energy systems
Problems Solved: - Efficient power distribution - Improved signal transmission - Enhanced reliability and durability
Benefits: - Higher performance - Increased efficiency - Enhanced safety
Commercial Applications: Title: "Advanced Power Module for Enhanced Performance in Various Industries" This technology can be used in electric vehicles, solar power systems, and industrial machinery, among other applications. The market implications include improved energy efficiency and reduced maintenance costs.
Questions about the technology: 1. How does the vertical extension of the signal terminal improve performance? - The vertical orientation of the signal terminal allows for better signal transmission and reduced interference.
2. What are the key advantages of using a resin layer in covering the semiconductor chip? - The resin layer provides protection against environmental factors and mechanical stress, enhancing the device's reliability and longevity.
Original Abstract Submitted
the power module semiconductor device () includes: an insulating substrate (); a first pattern () (d) disposed on the insulating substrate (); a semiconductor chip (q) disposed on the first pattern; a power terminal (st, dt) and a signal terminal (cs, g, ss) electrically connected to the semiconductor chip; and a resin layer () configured to cover the semiconductor chip and the insulating substrate. the signal terminal is disposed so as to be extended in a vertical direction with respect to a main surface of the insulating substrate.
