Rohm co., ltd. (20240282656). SEMICONDUCTOR MODULE simplified abstract
Contents
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282656 titled 'SEMICONDUCTOR MODULE
The semiconductor module described in the patent application consists of a housing with a semiconductor device inside, which includes a chip with a main surface, a main surface electrode, a terminal electrode, and a sealing insulator covering the periphery of the terminal electrode.
- The semiconductor module is filled with an insulating gel-like filling agent that contacts the sealing insulator and seals the semiconductor device within the housing space.
- The design allows for a part of the terminal electrode to be exposed while ensuring the overall protection and integrity of the semiconductor device.
- This innovative structure provides a secure and reliable environment for the semiconductor device to function effectively.
- The use of the insulating gel-like filling agent enhances the overall performance and longevity of the semiconductor module.
- By sealing the semiconductor device in the housing space, the module is protected from external elements and potential damage, increasing its durability and efficiency.
Potential Applications: - This technology can be applied in various electronic devices such as smartphones, computers, and automotive systems. - It can also be used in industrial machinery and equipment where reliable semiconductor modules are required.
Problems Solved: - Ensures the protection and longevity of semiconductor devices in various applications. - Provides a secure and reliable environment for semiconductor components to operate effectively.
Benefits: - Increased durability and reliability of semiconductor modules. - Enhanced performance and efficiency of electronic devices. - Cost-effective solution for protecting semiconductor devices in different industries.
Commercial Applications: Title: Advanced Semiconductor Module Technology for Enhanced Device Performance This technology can be utilized in the manufacturing of consumer electronics, automotive systems, industrial machinery, and other electronic devices to improve their overall performance and reliability in the market.
Questions about Semiconductor Module Technology: 1. How does the insulating gel-like filling agent contribute to the protection of the semiconductor device? - The insulating gel-like filling agent ensures that the semiconductor device is securely sealed within the housing space, providing protection from external elements and potential damage.
2. What are the key features of the semiconductor module design that make it innovative? - The design includes a sealing insulator covering the terminal electrode, exposing a part of it while maintaining overall protection, and the use of an insulating gel-like filling agent to seal the semiconductor device effectively.
Original Abstract Submitted
a semiconductor module includes a housing that has a housing space, a semiconductor device that is arranged in the housing space, and that has a chip having a main surface, a main surface electrode arranged on the main surface, a terminal electrode arranged on the main surface electrode, and a sealing insulator covering a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and an insulating gel-like filling agent that is filled in the housing space such as to contact the sealing insulator, and that seals the semiconductor device in the housing space.
