Rohm co., ltd. (20240282634). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
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MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
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MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282634 titled 'MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Simplified Explanation:
The patent application describes a method for manufacturing a semiconductor device by preparing a wafer source, forming electrodes, and cutting the wafer to create sealed and unsealed wafers.
- The method involves preparing a wafer source with two main surfaces, forming electrodes on one main surface, and cutting the wafer to separate it into sealed and unsealed wafers.
Key Features and Innovation:
- Preparation of a wafer source with two main surfaces.
- Formation of main surface and terminal electrodes.
- Creation of a sealing insulator to cover the terminal electrode.
- Cutting the wafer to separate it into sealed and unsealed wafers.
Potential Applications:
This technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, sensors, and memory chips.
Problems Solved:
This method streamlines the manufacturing process of semiconductor devices by efficiently preparing and cutting wafers to create sealed and unsealed components.
Benefits:
- Improved efficiency in semiconductor device manufacturing.
- Enhanced precision in wafer cutting and separation.
- Cost-effective production of sealed and unsealed wafers.
Commercial Applications:
The technology can be utilized in the semiconductor industry for mass production of high-quality devices, leading to cost savings and improved product performance.
Prior Art:
Researchers can explore prior patents related to semiconductor device manufacturing methods, wafer cutting techniques, and electrode formation processes to gain insights into existing technologies in this field.
Frequently Updated Research:
Researchers can stay updated on advancements in semiconductor manufacturing techniques, wafer cutting technologies, and electrode materials to enhance the efficiency and performance of semiconductor devices.
Questions about Semiconductor Device Manufacturing:
1. What are the key steps involved in semiconductor device manufacturing?
- Semiconductor device manufacturing involves processes such as wafer preparation, electrode formation, and cutting to create individual components.
2. How does the cutting of wafers impact the performance of semiconductor devices?
- The precision and accuracy of wafer cutting can affect the functionality and reliability of semiconductor devices, making it a critical step in the manufacturing process.
Original Abstract Submitted
a manufacturing method for a semiconductor device includes a step of preparing a wafer source that has a first main surface on one side and a second main surface on the other side, a step of forming a main surface electrode on the first main surface, a step of forming a terminal electrode on the main surface electrode, a step of forming a sealing insulator that covers a periphery of the terminal electrode on the first main surface such as to expose a part of the terminal electrode, and a step of cutting the wafer source in a horizontal direction along the first main surface from an intermediate portion of a thickness range of the wafer source, and separating the wafer source into a sealed wafer on the sealing insulator side and an unsealed wafer on the second surface side.
