Rohm co., ltd. (20240282593). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
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MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
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MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282593 titled 'MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
The manufacturing method for a semiconductor device involves preparing a wafer structure with a main surface electrode, forming a terminal electrode, using a mask member to apply sealant over the terminal electrode, and creating a sealing insulator through thermal curing.
- Wafer structure preparation with main surface electrode
- Formation of terminal electrode on main surface electrode
- Use of mask member to apply sealant over terminal electrode
- Creation of sealing insulator through thermal curing
- Protection and insulation of terminal electrode
Potential Applications: - Semiconductor manufacturing industry - Electronics and technology sector - Research and development in semiconductor devices
Problems Solved: - Ensures protection of terminal electrode - Provides insulation for semiconductor device components - Enhances reliability and durability of semiconductor devices
Benefits: - Improved performance of semiconductor devices - Increased longevity and reliability - Enhanced manufacturing process efficiency
Commercial Applications: Title: Advanced Semiconductor Device Manufacturing Method This technology can be utilized in the production of various semiconductor devices, such as microchips, sensors, and integrated circuits. It can benefit companies in the electronics industry looking to enhance the quality and reliability of their products.
Prior Art: Readers can explore prior research on semiconductor device manufacturing methods, sealant application techniques, and insulator formation processes to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Researchers may find updated studies on semiconductor device manufacturing advancements, sealant materials, and insulator technologies relevant to this method.
Questions about Semiconductor Device Manufacturing Method: 1. How does this method improve the reliability of semiconductor devices? - This method enhances reliability by providing protection and insulation to the terminal electrode, ensuring long-term performance. 2. What are the key differences between traditional semiconductor manufacturing methods and this innovative approach? - This method introduces a novel way of applying sealant and forming a sealing insulator, improving the overall quality and durability of semiconductor devices.
Original Abstract Submitted
a manufacturing method for a semiconductor device includes a step of preparing a wafer structure that includes a wafer having a main surface, and a main surface electrode arranged on the main surface, a step of forming a terminal electrode on the main surface electrode, a step of preparing a mask member that has a frame portion demarcating an opening portion exposing an inner portion of the main surface and configuring to overlap a peripheral edge portion of the main surface, and arranging the mask member on the main surface such that the frame portion overlaps the peripheral edge portion of the main surface, a step of supplying a sealant including a liquid thermosetting resin into the opening portion such as to cover the terminal electrode and a step of forming a sealing insulator by thermally curing the sealant.
