Robert bosch gmbh (20240347417). DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME simplified abstract
Contents
DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME
Organization Name
Inventor(s)
Andreas Burghardt of Stuttgart (DE)
DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347417 titled 'DEVICE COMPRISING A CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME
Simplified Explanation: The patent application describes a device with a ceramic substrate, brazing layers, and copper layers on each side. The copper layers have trenches for heat dissipation.
Key Features and Innovation:
- Device with ceramic substrate, brazing layers, and copper layers
- Trenches in copper layers for heat dissipation
- Conductive connection to a heat sink
Potential Applications: This technology could be used in electronic devices, power systems, and other applications requiring efficient heat dissipation.
Problems Solved: This technology addresses the challenge of heat management in electronic devices and systems.
Benefits:
- Improved heat dissipation
- Enhanced performance and reliability of electronic devices
- Efficient cooling system
Commercial Applications: Title: Advanced Heat Dissipation Technology for Electronic Devices This technology could be utilized in smartphones, laptops, servers, and other electronic devices to improve their performance and longevity.
Prior Art: Readers can explore prior patents related to heat dissipation technologies in electronic devices to understand the evolution of this field.
Frequently Updated Research: Researchers are continuously working on enhancing heat dissipation technologies for electronic devices to meet the increasing demands of high-performance systems.
Questions about Heat Dissipation Technology: 1. How does this technology compare to traditional heat dissipation methods?
- This technology offers improved heat dissipation efficiency compared to traditional methods by utilizing trenches in copper layers for enhanced cooling.
2. What are the potential environmental impacts of implementing this technology in electronic devices?
- Implementing this technology can lead to more energy-efficient devices, reducing overall energy consumption and environmental impact.
Original Abstract Submitted
a device including a ceramic substrate having a first side and an opposite second side. a first brazing layer is arranged on the first side in regions and a first copper layer is arranged on the first brazing layer. a second brazing layer is arranged on the second side and a second copper layer is arranged on the second brazing layer. the first copper layer has first trenches which extend from a surface of the first copper layer to the first side. the second copper layer has second trenches which extend from a surface of the second copper layer to at least one surface of the second brazing layer. the second copper layer can be conductively connected to a heat sink. the first trenches have first trench bottoms and the second trenches have second trench bottoms, wherein the first trench bottoms are wider than the second trench bottoms.
