Robert bosch gmbh (20240300807). MICROMECHANICAL COMPONENT simplified abstract
Contents
MICROMECHANICAL COMPONENT
Organization Name
Inventor(s)
Jan Stiedl of Pliezhausen (DE)
MICROMECHANICAL COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240300807 titled 'MICROMECHANICAL COMPONENT
The abstract describes a micromechanical component with a printed circuit board, an ASIC chip, a MEMS chip, and an adapter chip arranged in a specific configuration.
- The ASIC chip and MEMS chip are parallel to the main extension plane of the printed circuit board.
- The ASIC chip is positioned above the printed circuit board and electrically contacted to it via bonding wires.
- The MEMS chip is placed above the ASIC chip.
- An adapter chip is located between the ASIC chip and the MEMS chip, partially covering the bonding region in the z-direction.
- The method for producing this micromechanical component is also outlined.
Potential Applications: - This technology can be used in various microelectromechanical systems (MEMS) applications. - It can be applied in sensors, actuators, and other devices requiring precise mechanical and electrical components.
Problems Solved: - Provides a compact and efficient arrangement of ASIC and MEMS chips in a micromechanical component. - Ensures proper electrical contact between the chips and the printed circuit board.
Benefits: - Improved performance and reliability of micromechanical components. - Enhanced integration of ASIC and MEMS chips in a small form factor.
Commercial Applications: - This technology can be utilized in the development of advanced sensors, medical devices, and communication systems. - It has potential applications in industries such as automotive, aerospace, and consumer electronics.
Questions about the Technology: 1. How does the adapter chip contribute to the overall functionality of the micromechanical component? 2. What are the advantages of arranging the ASIC and MEMS chips in a parallel configuration?
Frequently Updated Research: - Stay updated on advancements in micromechanical component design and integration techniques. - Monitor developments in MEMS technology and its applications in various industries.
Original Abstract Submitted
a micromechanical component having a printed circuit board with a main extension plane, having an asic chip and a mems chip, which are arranged parallel to the main extension plane, wherein the asic chip is arranged above the printed circuit board, and the mems chip is arranged above the asic chip, wherein the asic chip is electrically contacted to the printed circuit board in a bonding region by bonding wires. an adapter chip is arranged between the asic chip and the mems chip, which adapter chip at least partially covers the bonding region in a z-direction perpendicular to the main extension plane. a method for producing a micromechanical component is also described.
