Robert bosch gmbh (20240215170). ELECTRONIC MODULE AND CONTACT ARRANGEMENT simplified abstract
Contents
ELECTRONIC MODULE AND CONTACT ARRANGEMENT
Organization Name
Inventor(s)
Irfan Aydogmus of NUERTINGEN (DE)
ELECTRONIC MODULE AND CONTACT ARRANGEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240215170 titled 'ELECTRONIC MODULE AND CONTACT ARRANGEMENT
The abstract describes an electronic module with a circuit carrier embedded in an encapsulation molding compound. The module includes an outer contact connection on the enclosure, which is electrically connected to the circuit on the circuit carrier. The contact connection is free of the encapsulating compound in the press-fit zone and is accommodated in a cavity of a holding frame made of a plastics material.
- The electronic module has a circuit carrier with an embedded electrical and/or electronic circuit.
- An outer contact connection on the enclosure is electrically connected to the circuit on the circuit carrier.
- The contact connection is free of the encapsulating compound in the press-fit zone.
- The contact connection is accommodated in a cavity of a holding frame made of a plastics material.
- The cavity is formed by a closed wall running around the contact connection.
Potential Applications: - Automotive electronics - Industrial control systems - Consumer electronics
Problems Solved: - Secure electrical connections - Protection of the circuit from environmental factors
Benefits: - Enhanced durability - Improved reliability - Simplified manufacturing process
Commercial Applications: Title: "Advanced Electronic Modules for Enhanced Connectivity" This technology can be used in various industries such as automotive, industrial, and consumer electronics for improved electrical connections and circuit protection.
Questions about the technology: 1. How does the encapsulation molding compound protect the circuit in the electronic module? 2. What are the advantages of using a holding frame made of a plastics material for the contact connection?
Original Abstract Submitted
an electronic module. the electronic module includes a circuit carrier having an electrical and/or electronic circuit. this circuit is completely embedded in an encapsulation molding compound. the electronic module includes an electrically contactable outer contact connection arranged on the enclosure, which has a press-fit zone. the contact connection is electrically connected to the electrical and/or electronic circuit on an upper side of the circuit carrier facing the press-fit zone. in the region of the press-in zone, the contact connection in the enclosure is free of the encapsulating compound. the contact connection is accommodated in a cavity of a holding frame made of a plastics material. the cavity is formed by a closed wall running around the contact connection, which rests on the upper side of the circuit carrier and projects in a direction of the press-fit zone. the wall separates the cavity from the encapsulating compound.
