Rigetti & Co, LLC (20240295617). Connecting Quantum Processor Chips in a Modular Quantum Processing Unit simplified abstract
Contents
- 1 Connecting Quantum Processor Chips in a Modular Quantum Processing Unit
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Connecting Quantum Processor Chips in a Modular Quantum Processing Unit - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Quantum Processing Units
- 1.11 Original Abstract Submitted
Connecting Quantum Processor Chips in a Modular Quantum Processing Unit
Organization Name
Inventor(s)
Andrew Joseph Bestwick of Berkeley CA (US)
Benjamin Charles Scharmann of New York NY (US)
Mark Field of Campbell CA (US)
Connecting Quantum Processor Chips in a Modular Quantum Processing Unit - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240295617 titled 'Connecting Quantum Processor Chips in a Modular Quantum Processing Unit
Simplified Explanation
A modular quantum processing unit consists of interconnected quantum processor chips with a cap structure. It may also include a tunable-frequency coupler device, a first quantum processor chip, a second quantum processor chip, and a cap structure.
- Quantum processor chips are connected by a cap structure.
- Tunable-frequency coupler device includes a superconducting quantum interference device (SQUID) loop, a shunt capacitor, and a flux bias control line.
- First quantum processor chip has a first qubit device, SQUID loop, flux bias control line, and a first capacitive coupler device.
- Second quantum processor chip includes a second qubit device.
- Cap structure includes a microwave transmission line capacitively coupled between the tunable-frequency coupler device and the second qubit device.
Key Features and Innovation
- Interconnected quantum processor chips with a cap structure.
- Tunable-frequency coupler device with a SQUID loop and flux bias control line.
- First quantum processor chip with a first qubit device and a capacitive coupler device.
- Second quantum processor chip with a second qubit device.
- Cap structure with a microwave transmission line for coupling.
Potential Applications
This technology can be applied in quantum computing, quantum communication, and advanced data processing systems.
Problems Solved
This technology addresses the challenge of efficiently connecting quantum processor chips in a modular system.
Benefits
- Improved connectivity between quantum processor chips.
- Enhanced performance in quantum processing tasks.
- Scalability and flexibility in quantum computing systems.
Commercial Applications
Potential commercial applications include quantum computers, quantum communication networks, and high-performance computing systems.
Questions about Quantum Processing Units
What are the key components of a modular quantum processing unit?
A modular quantum processing unit typically consists of interconnected quantum processor chips, a tunable-frequency coupler device, and a cap structure.
How does the cap structure enhance the performance of a quantum processing unit?
The cap structure in a quantum processing unit facilitates efficient coupling between quantum processor chips, enabling seamless communication and data processing.
Original Abstract Submitted
in a general aspect, a modular quantum processing unit (qpu) includes quantum processor chips inter-connected by a cap structure. in some cases, a modular quantum processing unit includes a tunable-frequency coupler device, a first quantum processor chip, a second quantum processor chip, and a cap structure. the tunable-frequency coupler device includes a superconducting quantum interference device (squid) loop, a shunt capacitor, and a flux bias control line that controls a magnetic flux through the squid loop. the first quantum processor chip includes a first qubit device, the squid loop, the flux bias control line, and a first capacitive coupler device galvanically connected between the first qubit device and the tunable-frequency coupler device. the second quantum processor chip includes a second qubit device. the cap structure, which includes a microwave transmission line capacitively coupled between the tunable-frequency coupler device and the second qubit device, is bonded to the first and second quantum processor chips.
