Qualcomm incorporated (20250070034). INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE
Contents
INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE
Organization Name
Inventor(s)
Kuiwon Kang of San Diego CA (US)
Hong Bok We of San Diego CA (US)
Michelle Yejin Kim of Carlsbad CA (US)
INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE
This abstract first appeared for US patent application 20250070034 titled 'INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE
Original Abstract Submitted
a device includes a substrate including first conductors connecting contacts on a first side of the substrate to contacts on a second side of the substrate. the first conductors include metal lines arranged in metal layers separated from one another by dielectric layers and conductive vias interconnecting the metal lines. the substrate also includes second conductors connecting contacts on the first side of the substrate to contacts on the first side of the substrate to define conductive paths between a first die and a second die. the second conductors include metal lines arranged in metal layers that are separated from one another by dielectric layers and conductive vias interconnecting the metal lines of the second conductors. at least one metal layer of the second conductors is devoid of the metal lines of the first conductors.
