Qualcomm incorporated (20240321861). LOGIC CIRCUITS INCLUDING CIRCUITS OF DIFFERENT HEIGHTS AND RELATED METHOD OF FABRICATION simplified abstract

LOGIC CIRCUITS INCLUDING CIRCUITS OF DIFFERENT HEIGHTS AND RELATED METHOD OF FABRICATION

Organization Name

qualcomm incorporated

Inventor(s)

Haining Yang of San Diego CA (US)

Hyunwoo Park of San Diego CA (US)

Ming-Huei Lin of New Taipei City (TW)

Junjing Bao of San Diego CA (US)

LOGIC CIRCUITS INCLUDING CIRCUITS OF DIFFERENT HEIGHTS AND RELATED METHOD OF FABRICATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321861 titled 'LOGIC CIRCUITS INCLUDING CIRCUITS OF DIFFERENT HEIGHTS AND RELATED METHOD OF FABRICATION

Simplified Explanation:

The logic circuit described in the patent application consists of two circuits, each with specific diffusion regions. The first circuit includes a first and second diffusion region, while the second circuit includes a third and fourth diffusion region. The devices in each circuit are made up of different portions of these diffusion regions, with specific spatial relationships between them.

• The first circuit has devices with portions of the first and second diffusion regions.
• The second circuit has devices with portions of the third and fourth diffusion regions.
• The first diffusion region is positioned between the second diffusion region and the third diffusion region.
• The third diffusion region is located between the first diffusion region and the fourth diffusion region.
• The spatial distances between the diffusion regions are crucial for the functioning of the logic circuit.

Key Features and Innovation:

• Integration of multiple diffusion regions in separate circuits.
• Specific spatial arrangement of diffusion regions for optimal circuit performance.

Potential Applications:

• Integrated circuits
• Semiconductor devices
• Digital logic circuits

Problems Solved:

• Efficient utilization of diffusion regions in logic circuits.
• Improved spatial design for enhanced circuit functionality.

Benefits:

• Enhanced circuit performance.
• Increased efficiency in logic operations.

Commercial Applications:

The technology described in the patent application could have significant implications in the semiconductor industry, particularly in the development of advanced integrated circuits for various electronic devices.

Questions about Logic Circuits:

1. How does the spatial arrangement of diffusion regions impact the performance of the logic circuit? 2. What are the potential challenges in manufacturing logic circuits with multiple diffusion regions?

Original Abstract Submitted

a logic circuit includes a first circuit having a first diffusion region and a second diffusion region and a second circuit having a third diffusion region, and a fourth diffusion region. first devices in the first circuit each include a portion of the first diffusion region and a portion of the second diffusion region. second devices in the second circuit each include portions of the third and fourth diffusion regions. the first diffusion region is between the second diffusion region and the third diffusion region. the third diffusion region is between the first diffusion region and the fourth diffusion region. a second distance from a first side of the fourth diffusion region to a second side of the third diffusion region is less than a first distance from a first side of the first diffusion region to a second side of the second diffusion region.