Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract
Contents
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
Organization Name
Inventor(s)
Hong Bok We of San Diego CA (US)
Joan Rey Villarba Buot of Escondido CA (US)
Sang-Jae Lee of San Diego CA (US)
Zhijie Wang of San Diego CA (US)
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321752 titled 'PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
The abstract describes a package that includes a substrate with at least one dielectric layer, a plurality of interconnects, and a first integrated device. The first integrated device is connected to the interconnects through solder interconnects. Additionally, a second integrated device is connected to the interconnects through a second set of solder interconnects.
- The package comprises a substrate with dielectric layers and interconnects, along with two integrated devices connected through solder interconnects.
- The first integrated device is linked to the interconnects via a first set of solder interconnects.
- The second integrated device is connected to the interconnects through a second set of solder interconnects.
Potential Applications: - This technology could be used in electronic devices such as smartphones, tablets, and laptops. - It may find applications in the automotive industry for advanced driver assistance systems (ADAS) and infotainment systems.
Problems Solved: - Provides a reliable and efficient way to integrate multiple devices within a compact package. - Ensures secure connections between the integrated devices and the substrate.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced functionality and compact design. - Cost-effective manufacturing process.
Commercial Applications: Title: Advanced Packaging Technology for Enhanced Device Integration This technology can be utilized in the consumer electronics industry for developing smaller and more powerful devices. It can also benefit the automotive sector by enabling the integration of advanced features in vehicles.
Prior Art: Readers can explore prior patents related to integrated device packaging and solder interconnect technologies to gain a deeper understanding of the advancements in this field.
Frequently Updated Research: Stay updated on the latest developments in integrated device packaging, solder interconnects, and miniaturization technologies to leverage the full potential of this innovation.
Questions about Advanced Packaging Technology for Enhanced Device Integration: 1. How does this technology improve the performance of electronic devices? 2. What are the potential challenges in implementing this advanced packaging technology in different industries?
Original Abstract Submitted
a package comprising a substrate and a second integrated device. the substrate includes at least one dielectric layer, a plurality of interconnects comprising a first plurality of interconnects, and a first integrated device located at least partially in the substrate. the first integrated device is coupled to the first plurality of interconnects through a first plurality of solder interconnects. the second integrated device is coupled to the first plurality of interconnects through a second plurality of solder interconnects.
