Qualcomm incorporated (20240321730). INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE simplified abstract
Contents
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE
Organization Name
Inventor(s)
Hsiao-Tsung Yen of San Diego CA (US)
Xingyi Hua of San Diego CA (US)
Jeongil Jay Kim of San Diego CA (US)
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321730 titled 'INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE
The integrated device described in the patent application includes a die substrate, a die interconnection portion, and a stacked inductor consisting of a first-shaped inductor and a second-shaped inductor. The inductor is made up of multiple spirals forming a complex shape.
- The device comprises a die substrate, a die interconnection portion, and a stacked inductor with a unique shape.
- The stacked inductor includes multiple spirals that form the first and second-shaped inductors.
- The inductor is located in the die interconnection portion of the device.
Potential Applications: This technology could be used in various electronic devices that require compact and efficient inductors, such as smartphones, tablets, and wearable devices.
Problems Solved: This innovation addresses the need for smaller and more powerful inductors in electronic devices, allowing for better performance in a smaller form factor.
Benefits: The stacked inductor design allows for increased efficiency and performance in electronic devices while saving space and reducing overall size.
Commercial Applications: This technology could have significant implications in the consumer electronics industry, particularly in the development of smaller and more powerful devices.
Frequently Updated Research: Researchers may be exploring ways to further optimize the design of stacked inductors for even better performance in electronic devices.
Questions about Stacked Inductors: 1. How does the unique shape of the stacked inductor contribute to its performance? The complex shape of the stacked inductor allows for increased efficiency and performance in electronic devices.
2. What are the potential challenges in implementing stacked inductors in mass-produced electronic devices? Mass-producing devices with stacked inductors may require specialized manufacturing processes and equipment to ensure consistent quality and performance.
Original Abstract Submitted
an integrated device comprising a die substrate, a die interconnection portion coupled to the die substrate, and a stacked inductor that includes a first -shaped inductor and a second -shaped inductor. the stacked inductor may include a first spiral comprising a first origin and a first tail, a second spiral comprising a second origin and a second tail, a third spiral comprising a third origin and a third tail and a fourth spiral comprising a fourth origin and a fourth tail. the first spiral, the second spiral, the third spiral and the fourth spiral may form the first -shaped inductor and the second -shaped inductor. the stacked inductor may be located in the die interconnection.
