Qualcomm incorporated (20240321507). THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES simplified abstract
Contents
THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
Organization Name
Inventor(s)
Jui-Yi Chiu of Taichung City (TW)
Jonghae Kim of San Diego CA (US)
THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321507 titled 'THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
The abstract describes a three-dimensional (3D) inductor with two-side bonding wires that enables high inductance for integrated voltage regulators (IVR) and/or external voltage regulators (EVR). The inductance of the 3D inductor can be enhanced with magnetic molding compounds.
- The 3D inductor features two-side bonding wires for improved performance.
- It is designed to achieve high inductance, making it suitable for IVR and EVR applications.
- Magnetic molding compounds can be used to enhance the inductance of the 3D inductor.
- The innovative design of the inductor allows for efficient voltage regulation in various electronic devices.
- The technology offers a compact and efficient solution for inductance requirements in electronic circuits.
Potential Applications: - Integrated voltage regulators (IVR) - External voltage regulators (EVR) - Power management systems - Electronic devices requiring high inductance
Problems Solved: - Achieving high inductance in a compact design - Enhancing voltage regulation efficiency - Meeting inductance requirements in electronic circuits
Benefits: - Improved performance in voltage regulation - Compact design for space-constrained applications - Enhanced efficiency in power management systems
Commercial Applications: Title: Innovative 3D Inductor for High Inductance Applications This technology can be utilized in various commercial applications such as: - Consumer electronics - Automotive electronics - Industrial automation systems
Questions about 3D Inductor Technology: 1. How does the use of magnetic molding compounds enhance the inductance of the 3D inductor? 2. What are the key differences between integrated voltage regulators (IVR) and external voltage regulators (EVR)?
Original Abstract Submitted
disclosed is a three-dimensional (3d) inductor with two-side bonding wires. the 3d inductor enables high inductance to be achieved, e.g., for integrated voltage regulators (ivr) and/or external voltage regulators (evr). the inductance of the 3d inductor can be enhanced with magnetic molding compounds.
