Qualcomm incorporated (20240319455). PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE simplified abstract
Contents
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
Organization Name
Inventor(s)
Aniket Patil of San Diego CA (US)
Dongming He of San Diego CA (US)
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319455 titled 'PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
The abstract describes a package containing multiple integrated devices and optical components, all interconnected through solder interconnects and encapsulated within an encapsulation layer.
- Package includes a package substrate, first integrated device, encapsulation layer, post interconnects, metallization portion, second integrated device, optical integrated device, and optical fiber.
- First integrated device is connected to the package substrate via a first plurality of solder interconnects.
- Encapsulation layer partially encapsulates the first integrated device and contains post interconnects.
- Metallization portion is linked to the post interconnects and connects to the second integrated device through a second plurality of solder interconnects.
- Optical integrated device is coupled to the package substrate.
- Optical fiber is attached to the optical integrated device.
Potential Applications: - This technology can be used in optical communication systems, sensors, and other optical devices. - It can also be applied in medical devices, aerospace technology, and telecommunications equipment.
Problems Solved: - Provides a compact and efficient way to integrate multiple devices within a single package. - Ensures reliable interconnections between different components. - Enhances the performance and functionality of optical systems.
Benefits: - Improved reliability and performance of integrated devices. - Simplified manufacturing processes for complex optical systems. - Enables miniaturization of optical components for various applications.
Commercial Applications: - This technology can be utilized in the telecommunications industry for high-speed data transmission. - It can also find applications in medical imaging devices and industrial automation systems.
Questions about the technology: 1. How does the encapsulation layer protect the integrated devices within the package? 2. What are the advantages of using solder interconnects in this integrated device package?
Original Abstract Submitted
a package comprising a package substrate; a first integrated device coupled to the package substrate through a first plurality of solder interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a plurality of post interconnects located in the encapsulation layer; a metallization portion coupled to the plurality of post interconnects; a second integrated device coupled to the metallization portion through a second plurality of solder interconnects; an optical integrated device coupled to the package substrate; and an optical fiber coupled to the optical integrated device.
