Qualcomm incorporated (20240304503). SPLIT PAD WITH TEST LINE simplified abstract

From WikiPatents
Jump to navigation Jump to search

SPLIT PAD WITH TEST LINE

Organization Name

qualcomm incorporated

Inventor(s)

Aniket Patil of San Diego CA (US)

Hong Bok We of San Diego CA (US)

Brigham Navaja of San Diego CA (US)

SPLIT PAD WITH TEST LINE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240304503 titled 'SPLIT PAD WITH TEST LINE

Simplified Explanation: The patent application describes apparatuses and techniques for fabricating an apparatus with an outer connection layer, including sense split pads and a test line for electrical coupling.

  • The apparatus includes an outer connection layer with an outer substrate and outer metallization layer.
  • The outer metallization layer contains a first set of sense split pads, each with a first and second pad portion.
  • A test line is coupled to the first pad portion, allowing for electrical testing.
  • The first and second pad portions are electrically coupled to the same interconnect.

Key Features and Innovation:

  • Outer connection layer with sense split pads and test line for electrical coupling.
  • First and second pad portions for improved connectivity.
  • Simplified testing process with the test line.

Potential Applications: This technology could be used in semiconductor manufacturing, integrated circuits, and electronic devices requiring precise electrical connections.

Problems Solved: This technology addresses the need for efficient and reliable electrical connections in complex electronic systems.

Benefits:

  • Improved electrical connectivity.
  • Simplified testing procedures.
  • Enhanced reliability in electronic devices.

Commercial Applications: This technology could be valuable in the semiconductor industry for manufacturing high-performance electronic components with precise electrical connections.

Prior Art: Readers interested in prior art related to this technology could explore patents in the field of semiconductor fabrication and integrated circuit design.

Frequently Updated Research: Stay informed about the latest advancements in semiconductor manufacturing and integrated circuit technology to understand the evolving landscape of this field.

Questions about the Technology: 1. What are the potential commercial applications of this technology? 2. How does this innovation improve electrical connectivity in electronic devices?


Original Abstract Submitted

disclosed are apparatuses and techniques for fabricating the apparatuses. in an aspect, an apparatus includes an outer connection layer. the outer connection layer has an outer substrate and an outer metallization layer (ml). the outer ml includes a first set of sense split pads. the first set of sense split pads includes a first pad portion and a second pad portion and a test line. the test line is coupled to the first pad portion. the first pad portion and the second pad portion are electrically coupled to a same interconnect.

Retrieved from "http://wikipatents.org/index.php?title=Qualcomm_incorporated_(20240304503)._SPLIT_PAD_WITH_TEST_LINE_simplified_abstract&oldid=227608"