Qualcomm incorporated (20240297165). DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION simplified abstract
Contents
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION
Organization Name
Inventor(s)
Changhan Hobie Yun of San Diego CA (US)
Paragkumar Ajaybhai Thadesar of San Diego CA (US)
Sameer Sunil Vadhavkar of San Diego CA (US)
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240297165 titled 'DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION
The abstract describes a device with a redistribution layer (RDL) substrate, a passive component in the RDL substrate, a first die coupled to the RDL substrate through conductive pillars, and a laminate substrate also coupled to the RDL substrate through conductive pillars.
- The device includes a redistribution layer (RDL) substrate.
- A passive component is located in the RDL substrate near the first surface.
- A first die is connected to the RDL substrate through conductive pillars.
- A laminate substrate is attached to the RDL substrate through conductive pillars.
Potential Applications: - This technology could be used in the semiconductor industry for advanced packaging solutions. - It may find applications in electronic devices requiring compact and efficient components.
Problems Solved: - Provides a compact and efficient solution for integrating passive components in semiconductor devices. - Offers a reliable method for connecting dies and substrates in electronic devices.
Benefits: - Improved integration of passive components in semiconductor devices. - Enhanced reliability and performance of electronic devices. - Compact design for space-constrained applications.
Commercial Applications: Title: Advanced Packaging Solutions for Semiconductor Industry This technology could be utilized in the development of advanced packaging solutions for semiconductor devices, catering to the growing demand for compact and efficient electronic components in various industries.
Questions about the technology: 1. How does the integration of passive components in the RDL substrate improve the overall performance of the device? 2. What are the key advantages of using conductive pillars to connect the die and substrate in electronic devices?
Original Abstract Submitted
a device is described, including a redistribution layer (rdl) substrate. the device also includes a passive component in the rdl substrate proximate a first surface of the rdl substrate. the device further includes a first die coupled to a second surface of the rdl substrate, opposite the first surface of the rdl substrate, through at least a first pair of conductive pillars. the device also includes a laminate substrate coupled to the first surface of the rdl substrate through at least a second pair of conductive pillars.
