Qualcomm incorporated (20240297129). INTEGRATED DEVICE COMPRISING ELONGATED PADS simplified abstract
Contents
INTEGRATED DEVICE COMPRISING ELONGATED PADS
Organization Name
Inventor(s)
Yangyang Sun of San Diego CA (US)
Amer Christophe Gaetan Cassier of La Jolla CA (US)
INTEGRATED DEVICE COMPRISING ELONGATED PADS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240297129 titled 'INTEGRATED DEVICE COMPRISING ELONGATED PADS
The abstract describes a device with an integrated device that includes a die substrate, an interconnect portion, a plurality of pillar interconnects, and a passivation layer.
- The interconnect portion has a first plurality of pads for input/output signals and a second plurality of pads for power.
- The pillar interconnects are connected to the pads.
- The passivation layer has openings, including at least one over a pad from the first plurality.
Potential Applications: - This technology can be used in semiconductor devices, integrated circuits, and electronic components. - It can be applied in various industries such as telecommunications, consumer electronics, and automotive.
Problems Solved: - Provides efficient electrical paths for input/output signals and power. - Enhances the reliability and performance of integrated devices.
Benefits: - Improved signal transmission and power distribution. - Enhanced durability and longevity of the integrated device.
Commercial Applications: - The technology can be utilized in the development of advanced electronic devices for commercial use. - It has the potential to impact the semiconductor industry and contribute to technological advancements.
Questions about the technology: 1. How does this integrated device improve signal transmission compared to traditional methods? 2. What are the specific advantages of using pillar interconnects in this device design?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor technology and integrated circuit design to understand the evolving landscape of this field.
Original Abstract Submitted
a device comprising an integrated device. the integrated device comprising a die substrate; an interconnect portion coupled to the die substrate, a plurality of pillar interconnects and a passivation layer coupled to the interconnect portion. the interconnect portion includes a first plurality of pads and a second plurality of pads. the first plurality of pads are configured to provide a first plurality of electrical paths for input/output signals. the second plurality of pads are configured to provide a second plurality of electrical paths for power. the plurality of pillar interconnects are coupled to the first plurality of pads and the second plurality of pads. the passivation layer comprises a plurality of openings. the plurality of openings include at least one opening located over a pad from the first plurality of pads.
