Qualcomm incorporated (20240266342). COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE simplified abstract
Contents
COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE
Organization Name
Inventor(s)
Renukprasad Hiremath of Hillsboro OR (US)
Hyeokjin Lim of San Diego CA (US)
Foua Vang of Sacramento CA (US)
Manjanaika Chandranaika of Bangalore (IN)
Seung Hyuk Kang of San Diego CA (US)
Venugopal Boynapalli of San Diego CA (US)
COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266342 titled 'COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE
The abstract of the patent application describes a chip with two columns, each containing rails that extend in a first direction. The first column has rails with a first pitch, while the second column has rails with a different second pitch. There is a transition region between the two columns.
- The chip includes two columns with rails of different pitches.
- Transition region between the columns.
- Rails extend in a first direction.
- First pitch in the first column, second pitch in the second column.
- Differentiation in pitch allows for unique functionalities.
Potential Applications: - Semiconductor manufacturing - Integrated circuits - Electronics industry
Problems Solved: - Efficient data transfer - Improved signal processing - Enhanced chip performance
Benefits: - Increased speed and efficiency - Enhanced functionality - Better overall performance
Commercial Applications: Title: "Innovative Chip Design for Enhanced Performance in Electronics" This technology can be utilized in various electronic devices, such as smartphones, computers, and IoT devices, to improve their overall performance and speed.
Questions about the technology: 1. How does the differentiation in pitch between the rails impact the chip's performance?
- The different pitches allow for optimized data transfer and signal processing within the chip.
2. What are the potential challenges in implementing this chip design in commercial electronics?
- Some challenges may include manufacturing complexities and compatibility with existing systems.
Original Abstract Submitted
a chip includes a first column including first rails extending in a first direction, the first rails having a first pitch. the chip also includes a second column including second rails extending in the first direction, the second rails having a second pitch different from the first pitch. the chip also includes a transition region between the first column and the second column.
