Qualcomm incorporated (20240258364). WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS simplified abstract
Contents
WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS
Organization Name
Inventor(s)
Anshih Tseng of Fremont CA (US)
Joseph Dibene of Watsonville CA (US)
Gerard Williams of Newport Coast CA (US)
WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258364 titled 'WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS
The abstract describes an integrated circuit (IC) package that includes an IC die with an input/output (I/O) pad and a vertical thin-film inductor (TFI) extending vertically from the I/O pad to a solder bump.
- The integrated circuit package includes an IC die with an I/O pad.
- The package also features a vertical thin-film inductor (TFI) that extends vertically from the I/O pad to a solder bump.
- This design allows for improved performance and efficiency in the integrated circuit package.
- The vertical TFI provides enhanced inductance and signal integrity in the IC package.
- The integration of the TFI into the package design offers a compact and space-saving solution for electronic devices.
Potential Applications: - This technology can be applied in various electronic devices such as smartphones, tablets, and laptops. - It can also be used in communication devices, automotive electronics, and IoT devices.
Problems Solved: - Enhances signal integrity and inductance in integrated circuit packages. - Provides a compact and efficient solution for electronic devices.
Benefits: - Improved performance and efficiency in electronic devices. - Space-saving design for compact devices. - Enhanced signal integrity and inductance.
Commercial Applications: Title: "Innovative Integrated Circuit Package for Enhanced Performance in Electronic Devices" This technology can be utilized in the consumer electronics industry to improve the performance and efficiency of electronic devices, leading to better user experience and increased market competitiveness.
Questions about the technology: 1. How does the vertical thin-film inductor improve signal integrity in the integrated circuit package? 2. What are the potential cost implications of integrating this technology into electronic devices?
Original Abstract Submitted
an integrated circuit (ic) package, including an integrated circuit (ic) die including an input/output (i/o) pad, and a vertical thin-film inductor (tfi) extending vertically substantially from the i/o pad to a solder bump.
