Qualcomm incorporated (20240258363). INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL simplified abstract
Contents
INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL
Organization Name
Inventor(s)
Jui-Yi Chiu of Taichung City (TW)
Jonghae Kim of San Diego CA (US)
INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258363 titled 'INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL
The patent application describes a device with a die substrate, interconnects, magnetic layer, and dielectric layer. The interconnects include plate interconnects and via interconnects that function as an inductor, surrounded by a magnetic layer.
- The device includes a die substrate, interconnects, magnetic layer, and dielectric layer.
- The interconnects consist of plate interconnects and via interconnects.
- The plate interconnects, via interconnects, and magnetic layer form an inductor.
- The magnetic layer surrounds part of the via interconnects.
Potential Applications: - This technology could be used in electronic devices requiring inductors. - It may find applications in power electronics, telecommunications, and consumer electronics.
Problems Solved: - Provides a compact solution for integrating inductors into electronic devices. - Offers improved efficiency and performance compared to traditional inductors.
Benefits: - Saves space and reduces complexity in electronic device design. - Enhances the functionality and reliability of electronic systems.
Commercial Applications: Title: Innovative Inductor Integration Technology for Electronic Devices This technology can be utilized in various industries such as telecommunications, automotive, and IoT devices. It offers a competitive advantage by improving the efficiency and performance of electronic systems.
Questions about Inductor Integration Technology: 1. How does this technology improve the efficiency of electronic devices? This technology enhances efficiency by providing a compact and integrated solution for inductors, reducing energy losses and improving overall performance.
2. What are the potential cost savings associated with using this technology? By integrating inductors into the device design, manufacturers can save on space, materials, and assembly costs, leading to overall cost savings in production.
Original Abstract Submitted
a device comprising a die substrate, a plurality of interconnects located over the die substrate, at least one magnetic layer, and at least one dielectric layer located over the die substrate. the plurality of interconnects comprise a first plurality of plate interconnects, a second plurality of plate interconnects, and a plurality of via interconnects coupled to the first plurality of plate interconnects and the second plurality of plate interconnects. the first plurality of plate interconnects, the plurality of via interconnects, and the second plurality of plate interconnects are configured to operate as an inductor. the at least one magnetic layer surrounds at least part of the plurality of via interconnects.
