Qualcomm incorporated (20240203938). INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract
Contents
INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
Organization Name
Inventor(s)
Yeng Kwan Hoo of Unterhaching (DE)
Anna Katharina Krefft of Haar (DE)
INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203938 titled 'INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
Simplified Explanation: The patent application discloses integrated bare die packages and related fabrication methods that allow for the integration of a bare die filter into the package while maintaining an acoustic cavity and conserving package size.
Key Features and Innovation:
- Integration of a bare die filter with a second component in a vertical direction to minimize package size expansion.
- The bare die filter and the second component intersect a common plane in the vertical direction.
- Maintaining the acoustic cavity of the bare die filter while integrating it into the package.
Potential Applications: This technology could be used in the manufacturing of electronic devices where space-saving and acoustic performance are crucial, such as smartphones, tablets, and wearables.
Problems Solved: The technology addresses the challenge of integrating a bare die filter into a package without significantly increasing its size while maintaining the acoustic properties of the filter.
Benefits:
- Space-saving design
- Improved acoustic performance
- Enhanced integration capabilities
Commercial Applications: The technology could be applied in the consumer electronics industry for the production of compact and high-performance devices.
Prior Art: Prior art related to this technology may include research on integrated bare die packages and methods for fabricating acoustic cavities in electronic devices.
Frequently Updated Research: Researchers may be exploring new materials and fabrication techniques to further optimize the integration of bare die filters into packages.
Questions about Integrated Bare Die Packages: 1. How does the integration of a bare die filter with a second component help conserve package size? 2. What are the potential challenges in vertically integrating a bare die filter with another component in a package?
Original Abstract Submitted
integrated bare die packages, and related fabrication methods are disclosed. to provide for the integration of a bare die filter into the bare die package while maintaining an acoustic cavity for the bare die filter and conserving package size, the bare die filter is vertically-integrated with a second component (e.g., another die, a second bare die filter, a passive electrical device(s)). in examples, the bare die filter is vertically-integrated with the second component in a second direction (e.g., vertical direction) orthogonal to the first direction on a first side of a package substrate of the bare die package. the bare die filter and the second component each intersect a common plane in the second direction. in this manner, the expansion in size of the bare die package through the integrated of bare die filter is minimized, while also maintaining the acoustic cavity of the bare die filter.
