Qualcomm incorporated (20240203895). THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract
Contents
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
Organization Name
Inventor(s)
Je-Hsiung Lan of San Diego CA (US)
Jonghae Kim of San Diego CA (US)
Ranadeep Dutta of Del Mar CA (US)
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203895 titled 'THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
The patent application describes multi-die modules consisting of a die, such as a power amplifier, and an adjacent die placed side-by-side on a substrate with a mold compound. The adjacent die, such as a switch or a low noise amplifier, may be double EMI shielded to reduce EMI/noise coupling with the neighboring die. Additionally, a thermally conductive mold compound may be used to enhance heat dissipation from the die and/or the adjacent die.
- Multi-die modules with side-by-side placement of different dies
- EMI shielding of adjacent dies to minimize noise coupling
- Use of thermally conductive mold compound for improved heat transfer
- Enhanced performance and reliability of electronic components
- Potential for compact and efficient electronic devices
- Potential Applications:**
The technology can be applied in various electronic devices such as smartphones, tablets, IoT devices, and other wireless communication systems.
- Problems Solved:**
The technology addresses issues related to EMI interference and heat dissipation in multi-die modules, improving overall performance and reliability.
- Benefits:**
Improved EMI shielding, enhanced heat dissipation, compact design, and increased reliability of electronic devices.
- Commercial Applications:**
The technology can be utilized in the telecommunications, consumer electronics, and automotive industries to develop more efficient and reliable electronic devices.
- Questions about Multi-Die Modules:**
1. How does the use of double EMI shielding benefit the performance of multi-die modules? 2. What are the potential applications of multi-die modules in the consumer electronics market?
- Frequently Updated Research:**
Ongoing research focuses on optimizing the design and materials used in multi-die modules to further enhance performance and reliability.
Original Abstract Submitted
disclosed are examples of multi-die modules that includes a die (e.g., a power amplifier) and an adjacent die placed side-by-side and bonded onto a substrate with a mold compound. the die (e.g., a switch or a low noise amplifier) may be double emi shielded to minimize or even eliminate emi/noise coupling with the adjacent die (e.g., switch, low noise amplifier, etc.). another mold compound, which can be thermally conductive, may be provided to improve transfer of heat away from the die and/or the adjacent die.
