Qualcomm incorporated (20240203871). INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL simplified abstract

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INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL

Organization Name

qualcomm incorporated

Inventor(s)

Hongmei Liao of San Diego CA (US)

Xiaohua Kong of San Diego CA (US)

INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203871 titled 'INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL

The abstract of the patent application describes an integrated circuit (IC) with an IC bump and a tcoil positioned directly below the IC bump. The tcoil is electrically connected to the IC bump through a metallized via hole.

  • The integrated circuit includes an IC bump and a tcoil below it.
  • The tcoil is connected to the IC bump via a metallized via hole.

Potential Applications:

  • This technology could be used in various electronic devices requiring compact and efficient circuitry.
  • It may find applications in communication systems, sensors, and other electronic devices.

Problems Solved:

  • Enables a compact design by integrating the tcoil directly below the IC bump.
  • Provides a reliable electrical connection between the tcoil and the IC bump.

Benefits:

  • Improved space utilization in electronic devices.
  • Enhanced electrical connectivity and performance.
  • Simplified manufacturing processes for integrated circuits.

Commercial Applications:

  • This technology could be valuable in the development of smaller and more efficient electronic devices, potentially impacting industries such as telecommunications, consumer electronics, and IoT.

Questions about the technology: 1. How does the integration of the tcoil directly below the IC bump benefit electronic device design? 2. What are the potential challenges in manufacturing integrated circuits with this technology?


Original Abstract Submitted

an integrated circuit (ic) including an ic bump; and a tcoil situated directly below the ic bump, wherein the tcoil is electrically coupled to the ic bump by way of a metallized via hole.

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