Qualcomm incorporated (20240203866). INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract
INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS
Organization Name
Inventor(s)
John Jianhong Zhu of San Diego CA (US)
Junjing Bao of San Diego CA (US)
Giridhar Nallapati of San Diego CA (US)
INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203866 titled 'INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS
Simplified Explanation: This patent application describes integrated circuits (ICs) that utilize directly coupled metal lines between vertically adjacent interconnect layers to reduce coupling resistance, without the need for an intermediate via layer.
- Metal lines in vertically adjacent interconnect layers are directly coupled to each other.
- Capacitors and inductors are integrated into the ICs.
- The technology eliminates the need for an intermediate vertical interconnect access layer with vias.
- The innovation aims to improve the performance and efficiency of ICs.
Potential Applications:
- Semiconductor industry for advanced ICs.
- Electronics manufacturing for high-performance devices.
- Telecommunications for improved signal processing.
Problems Solved:
- Reduced coupling resistance in ICs.
- Enhanced performance and efficiency of integrated circuits.
- Simplified fabrication processes.
Benefits:
- Improved signal integrity.
- Higher circuit density.
- Enhanced overall performance of electronic devices.
Commercial Applications: Advanced IC manufacturing for various industries such as telecommunications, consumer electronics, and automotive.
Prior Art: Readers can explore prior patents related to integrated circuits, metal lines, and interconnect technologies to understand the background of this innovation.
Frequently Updated Research: Researchers are continually exploring new methods to enhance the performance and efficiency of integrated circuits through innovative interconnect technologies.
Questions about Integrated Circuits with Directly Coupled Metal Lines: 1. How does the use of directly coupled metal lines improve the efficiency of integrated circuits? 2. What are the potential challenges in implementing this technology on a large scale?
2. Another relevant generic question, with a detailed answer: How does the integration of capacitors and inductors into ICs impact their overall functionality and performance?
Original Abstract Submitted
integrated circuits (ics), including capacitors and inductors, employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related fabrication methods. by directly coupled, it is meant that there is not an intermediate vertical interconnect access (via) layer with a via(s) interconnecting the metal lines in vertically-adjacent interconnect layers. an overlying and underlying metal line in respective and vertically-adjacent overlying and underlying interconnect layers are directly coupled to each other without the need for an intermediate via layer.
