Qualcomm incorporated (20240203860). PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract
Contents
PACKAGE BUMPS OF A PACKAGE SUBSTRATE
Organization Name
Inventor(s)
PACKAGE BUMPS OF A PACKAGE SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203860 titled 'PACKAGE BUMPS OF A PACKAGE SUBSTRATE
The abstract describes techniques for integrated circuits (ICs) in which an IC package includes a package substrate with a metallization structure, an IC die attached to the upper surface of the package substrate, first package bumps and second package bumps on the lower surface of the package substrate arranged in a diagonal direction.
- Package substrate with metallization structure
- IC die attached to upper surface of package substrate
- First package bumps and second package bumps on lower surface in diagonal arrangement
Potential Applications: - Semiconductor industry - Electronics manufacturing - Consumer electronics
Problems Solved: - Improved connectivity in IC packages - Enhanced performance of integrated circuits
Benefits: - Increased reliability of ICs - Higher efficiency in electronic devices
Commercial Applications: - Production of advanced electronic devices - Integration into various consumer products
Questions about IC package technology: 1. How does the arrangement of package bumps impact the performance of integrated circuits? 2. What are the specific advantages of using a package substrate with a metallization structure?
Frequently Updated Research: - Ongoing studies on optimizing package bump configurations for improved IC performance.
Original Abstract Submitted
disclosed are techniques for integrated circuits (ics). in an aspect, an ic package includes a package substrate having an upper surface, a lower surface, a first side, and a second side perpendicular to the first side. the package substrate includes a metallization structure. the ic package further includes an ic die attached to the upper surface of the package substrate; first package bumps on the lower surface of the package substrate; and second package bumps on the lower surface of the package substrate. the first package bumps are arranged adjacent to one another along a diagonal direction that is diagonal to the package substrate, and the second package bumps are arranged adjacent to one another along the diagonal direction.
